A display module, its manufacturing method, auxiliary connection components, and display device.

Abstract

This application relates to and aims to provide a display module, which includes a display panel, a circuit board, and an electrical connection structure. The display panel includes a bottom insulating layer and multiple pads, the pads being exposed from the bottom insulating layer. The circuit board is fixedly disposed on the side of the bottom insulating layer opposite to the circuit functional layer, and includes multiple pins. The electrical connection structure includes an auxiliary connection structure, multiple first connection segments, and multiple second connection segments. The auxiliary connection structure includes at least one insulating structure and multiple intermediate connection segments spaced apart on the insulating structure. The height difference between one end of the intermediate connection segment corresponding to a pad and the pad is less than 50% of the height difference between the pin and the pad, and the height difference between one end of the intermediate connection segment corresponding to a pin and the pin is less than 30% of the height difference between the pin and the pad, thereby achieving a reliable connection between the pads and the pins.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display module, a method for manufacturing the display module, auxiliary connection components, and a display device. Background Technology

[0002] With the rapid development of flexible OLEDs, people have increasingly higher requirements for screen-to-body ratio, meaning the narrower the bezels, the better. Correspondingly, narrow bezel technology has developed rapidly in recent years. Due to the need for bonding ICs and FPCs or COFs and FPCs, the bottom bezel of the screen is wider than the top, left, and right bezels.

[0003] Currently, the chip portion is bent to the back of the screen to reduce the bottom bezel by bending the screen body (Pad Bending). However, as the bending radius of the screen body continues to decrease, this method has reached its limit in terms of the bezel area occupied. Summary of the Invention

[0004] The purpose of this application is to provide a display module, a method for manufacturing the display module, an auxiliary connection component, and a display device, so as to ensure the performance reliability of the product while reducing the bottom bezel of the screen.

[0005] An embodiment of the first aspect of this application provides a display module, which includes a display panel, a circuit board, and an electrical connection structure.

[0006] The display panel includes a bottom insulating layer, a circuit functional layer located on one side of the bottom insulating layer, and a display functional layer located on the side of the circuit functional layer opposite to the bottom insulating layer. The circuit functional layer includes multiple signal lines and multiple pads. The signal lines are electrically connected to the corresponding pads, and the pads are exposed from the bottom insulating layer.

[0007] The circuit board is fixedly disposed on the side of the bottom insulating layer opposite to the circuit functional layer, and the circuit board includes multiple pins.

[0008] The electrical connection structure includes an auxiliary connection structure, multiple first connection segments, and multiple second connection segments. The auxiliary connection structure is located on the side of the bottom insulating layer away from the circuit functional layer and on the side of the circuit board closer to the pad. The auxiliary connection structure includes at least one insulating structure and multiple intermediate connection segments spaced apart on the insulating structure. The first connection segments connect the corresponding pads and the intermediate connection segments. The second connection segments connect the intermediate connection segments and the pins. The height difference between the end of the intermediate connection segment corresponding to the pad and the pad is less than 50% of the height difference between the pin and the pad. The height difference between the end of the intermediate connection segment corresponding to the pin and the pin is less than 30% of the height difference between the pin and the pad.

[0009] An embodiment of the second aspect of this application provides an auxiliary connection assembly, which includes at least one insulating structure and a plurality of auxiliary conductive structures.

[0010] At least one insulating structure includes a plurality of insulating barriers, said insulating barriers including extended barriers.

[0011] Adjacent auxiliary conductive structures are separated by an insulating barrier. Each auxiliary conductive structure includes an intermediate connecting section and a second connecting section. Adjacent second connecting sections are separated by an extension barrier. The second connecting section and the intermediate connecting section are integral structures. The second connecting section includes a crimping portion protruding from the extension barrier. The insulating barrier is located between the adjacent integral second connecting section and the intermediate connecting section. The extension barrier is located between adjacent extension portions.

[0012] An embodiment of the third aspect of this application provides a method for manufacturing a display module, the method comprising: A display panel and a circuit board are provided, the display panel including a bottom insulating layer and pads, and the circuit board including pins; An auxiliary connection assembly is provided, the auxiliary connection assembly including at least one insulating structure, a plurality of auxiliary conductive structures and a protective structure, the at least one insulating structure including a plurality of insulating barriers disposed between adjacent auxiliary conductive elements, the insulating barriers including an extension barrier, adjacent auxiliary conductive structures being separated by the insulating barriers, each auxiliary conductive structure including an intermediate connection segment and a second connection segment, adjacent second connection segments being separated by the extension barrier, the second connection segment and the intermediate connection segment being an integral structure formed of conductive adhesive, the second connection segment including a crimp portion protruding from the extension barrier, the protective structure at least covering the crimp portion and the portion of the intermediate connection segment near the pad; The auxiliary connection assembly consists of multiple second connection segments formed of conductive adhesive material, which are pressed together with the corresponding pins of multiple pins on the circuit board to form an electrical connection. The portion of the intermediate connecting section formed by the conductive adhesive material near the solder pad is pressed onto the bottom insulating layer, so that the portion of the intermediate connecting section near the solder pad is in contact with the bottom insulating layer; A first connecting segment material is formed, and after the first connecting segment material is cured, it forms an electrical connection pad and the first connecting segment of the intermediate connecting segment.

[0013] An embodiment of the fourth aspect of this application provides a display device, which includes the display module described above; or includes the auxiliary connection component described above; or includes a display module prepared according to the method for preparing the display module described above.

[0014] This embodiment of the application adds an insulating structure and sets the intermediate connecting segment on the insulating structure. The height difference between one end of the intermediate connecting segment and the pad is less than 50% of the height difference between the pin and the pad, and the height difference between one end of the intermediate connecting segment and the pin is less than 30% of the height difference between the pin and the pad. This avoids the large step difference between the pin film layer and the pad on the circuit board caused by the bottom insulating layer, adhesive layer and circuit board constituent layer in related technical solutions, which makes the connection line between the connecting pin and the pad formed by printing and other methods prone to breakage. This allows for a reliable connection between the pad and the pin. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments or exemplary embodiments of this application, the drawings used in the description of the embodiments or exemplary embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 A schematic diagram of the structure of a display module provided in one embodiment of this application; Figure 2 A partial cross-sectional schematic diagram of an auxiliary connection structure in a display module provided for one embodiment of this application; Figure 3 A side view of an auxiliary connection structure in a display module provided according to one embodiment of this application; Figure 4 A corresponding embodiment of this application is provided Figure 3 The auxiliary connection structure shown corresponds to the cross-sectional view at point AA; Figure 5 An auxiliary connection structure provided for one embodiment of this application corresponds to Figure 4 A schematic cross-sectional view of section BB shown; Figure 6 Another auxiliary connection structure provided for one embodiment of this application corresponds to Figure 4 A schematic cross-sectional view of section BB shown; Figure 7 A schematic diagram of another display module provided for one embodiment of this application; Figure 8 A schematic diagram of the structure of another display module provided for one embodiment of this application; Figure 9 A schematic diagram of another display module provided for one embodiment of this application; Figure 10A cross-sectional schematic diagram of an auxiliary connection structure in a display module provided according to one embodiment of this application; Figure 11 A cross-sectional schematic diagram of yet another auxiliary connection structure in a display module provided in one embodiment of this application; Figure 12 A schematic diagram of the structure of another display module provided for one embodiment of this application; Figure 13 A side view schematic diagram of another auxiliary connection structure in a display module provided for one embodiment of this application; Figure 14 A side view schematic diagram of an auxiliary connection component in a display module provided according to one embodiment of this application; Figure 15 A cross-sectional schematic diagram of another auxiliary connection component in a display module provided according to one embodiment of this application; Figure 16 A cross-sectional schematic diagram of another auxiliary connection component in a display module provided according to one embodiment of this application; Figure 17 A schematic diagram of another display module provided for one embodiment of this application; Figure 18 A cross-sectional schematic diagram of another auxiliary connection component in a display module provided according to one embodiment of this application; Figure 19 This is a cross-sectional schematic diagram of another auxiliary connection component in a display module provided according to one embodiment of this application.

[0017] Explanation of reference numerals in the attached figures: Display panel 100, bottom insulating layer 20, bottom insulator layer 21, inclined wall 211, buffer layer 22, circuit function layer 50, circuit insulating layer 51, solder pads 52, vias 53, signal lines 54, display function layer 60, light-emitting function layer 61, light-emitting unit layer 611, anode layer 612, cathode layer 613, first encapsulation layer 62, second encapsulation layer 63, third encapsulation layer 64, polarizer layer 65, optical adhesive layer 66, cover plate layer 67, circuit board 70. Pin 701, adhesive layer 80, electrical connection structure 90, first connecting section 91, second connecting section 92, crimping part 921, auxiliary connecting structure 93, insulating structure 931, inclined surface 9311, insulating barrier 9312, extended barrier 93121, auxiliary groove 9313, intermediate connecting section (auxiliary conductive element) 932, first contact surface 9321, second contact surface 9322, extension part 9323, protective layer 95, first protective part 97, second protective part 98 Detailed Implementation To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0018] It should be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, this does not indicate any order, quantity, or importance, but is merely used to distinguish different components. These terms are used only to distinguish one element from another. For example, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element. Words such as “comprising” or “including” mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, without excluding other elements or objects.

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0020] In a first aspect, some embodiments of this application provide a display module including a display panel 100, a circuit board 70, and an electrical connection structure 90.

[0021] The display panel 100 includes a bottom insulating layer 20, a circuit function layer 50 located on one side of the bottom insulating layer 20, and a display function layer 60 located on the side of the circuit function layer 50 away from the bottom insulating layer 20. The circuit function layer 50 includes multiple signal lines 54 and multiple pads 52. The signal lines 54 are electrically connected to the corresponding pads 52, and the pads 52 are exposed from the bottom insulating layer 20.

[0022] The circuit board 70 is fixedly disposed on the side of the bottom insulating layer 20 away from the circuit functional layer 50, and the circuit board 70 includes multiple pins 701.

[0023] The electrical connection structure 90 includes an auxiliary connection structure 93, a plurality of first connection segments 91, and a plurality of second connection segments 92. The auxiliary connection structure 93 is located on the side of the bottom insulating layer 20 away from the circuit functional layer 50 and on the side of the circuit board 70 near the pad 52. The auxiliary connection structure 93 includes at least one insulating structure 931 and a plurality of intermediate connection segments 932 (located on the insulating structure 931) spaced apart on the insulating structure 931 (and insulated from each other). The first connection segment 91 connects the corresponding pad 52 and the intermediate connection segment 932. The second connection segment 92 connects the intermediate connection segment 932 and the pin 701. The height difference between one end of the intermediate connection segment 932 corresponding to the pad 52 and the pad 52 is less than 50% of the height difference between the pin 701 and the pad 52. The height difference between one end of the intermediate connection segment 932 corresponding to the pin 701 and the pin 701 is less than 30% of the height difference between the pin 701 and the pad 52.

[0024] This application embodiment proposes to add an insulating structure 931 and set an intermediate connecting segment 932 on the insulating structure 931. The height difference between one end of the intermediate connecting segment 932 corresponding to the pad 52 and the pad 52 is less than 50% of the height difference between the pin 701 and the pad 52, and the height difference between one end of the intermediate connecting segment 932 corresponding to the pin 701 and the pin 701 is less than 30% of the height difference between the pin 701 and the pad 52. This can avoid the large step difference (often exceeding 60 micrometers) between the pin 701 film layer and the pad 52 of the circuit board 70 caused by the bottom insulating layer 20, adhesive layer 80 and circuit board 70 constituting layers, which makes the connection line between the connecting pin 701 and the pad 52 formed by printing and other methods prone to breakage. This allows for a reliable connection between the pad 52 and the pin 701.

[0025] It should be noted that the insulating structure 931 can isolate the adhesive layer 80 of the circuit board 70 from the connecting wires (including the first connecting segment 91, the intermediate connecting segment 932, and the second connecting segment 92). The adhesive layer 80 can be an NCF (Non-conductive adhesive film, the material of which may include acrylic PSA and PET materials) adhesive layer 80, and the raw material of the connecting wires may include silver paste.

[0026] Because the insulation structure 931 can isolate the adhesive layer 80 of the circuit board 70 from the connecting wires, it can prevent the material of the connecting wires from reacting with the material of the adhesive layer 80 of the circuit board 70, thus avoiding connection defects in the connecting wires.

[0027] The aforementioned height differences are dimensions perpendicular to the plane of the display panel. Specifically, the height difference between the connection surface (exposed before connection) of the intermediate connection segment 932 corresponding to pad 52 and pad 52 is the distance between the position of the intermediate connection segment 932 near pad 52 and the connection surface of pad 52 in a direction perpendicular to the plane of the display panel. The height difference between pin 701 and pad 52 is the distance between the connection surface (exposed before connection) of pin 701 and the connection surface of pad 52 in a direction perpendicular to the plane of the display panel. The height difference between one end of the intermediate connection segment 932 corresponding to pin 701 and pin 701 is the distance between the position of the intermediate connection segment 932 near pin 701 and the connection surface of pin 701 in a direction perpendicular to the plane of the display panel.

[0028] The height difference between one end of the intermediate connection segment 932 and the pad 52 can be less than 10%, 15%, 20%, 30%, 40%, or 50% of the height difference between the pin 701 and the pad 52; and generally, the smaller this difference is, the better for achieving a reliable connection. Figure 8 In this design, the difference is 0. The height difference between one end of the intermediate connection segment 932 corresponding to pin 701 and pin 701 can be less than 10%, 15%, 20%, or 30% of the height difference between pin 701 and pad 52. Generally, the smaller this difference is, the better for achieving a reliable connection. Figure 1 , Figure 7 and Figure 8 In this case, the difference is 0.

[0029] In related technologies, recessing the edge of the NCF adhesive layer 80 into the circuit board 70 by a certain distance can prevent the adhesive of the NCF adhesive layer 80 from reacting with the silver paste. However, the connection lines formed with silver paste are difficult to mold and are prone to breakage due to stress after molding. If the edge of the NCF adhesive layer 80 extends beyond the circuit board 70 or remains flush with it, the silver paste will react with the adhesive of the NCF adhesive layer 80 and be difficult to cure. When the silver paste comes into contact with NCF, the PSA adhesive modulus on the NCF surface is low, resulting in large thermal deformation, which can easily lead to defects such as cracks in the connection lines.

[0030] It should be noted that the second connecting segment 92 and pin 701 can also be electrically connected by anisotropic conductive adhesive; the circuit board 70 can be a chip on film (COF); the pin 701 of the circuit board 70 can be flush with the edge of the circuit board 70; the circuit board 70 is fixed to the side of the bottom insulating layer 20 away from the circuit functional layer 50 by double-sided adhesive.

[0031] The display panel 100 may include a bottom insulating layer 20 (which may be made of polyimide), a circuit functional layer 50 located on one side of the bottom insulating layer 20 (which may be made of SiOx / a-Si to prevent moisture intrusion), and a display functional layer 60 located on the side of the circuit functional layer 50 opposite to the bottom insulating layer 20. The circuit functional layer 50 includes a circuit insulating layer 51, multiple signal lines 54, and multiple pads 52. The signal lines 54 are electrically connected to the corresponding pads 52 through vias 53. The bottom insulating layer 20 includes a bottom insulator layer 21 and a buffer layer 22 stacked on the bottom insulator layer 21.

[0032] The display functional layer 60 includes a stacked light-emitting functional layer 61, an encapsulation layer, a polarizer layer 65, an optical adhesive layer 66, and a cover plate layer 67. The light-emitting functional layer 61 includes a light-emitting unit layer 611 with different types of light-emitting units, and an anode layer 612 and a cathode layer 613 located on one side of the light-emitting unit layer 611, respectively. The encapsulation layer may include a first encapsulation layer 62, a third encapsulation layer 64 formed of inorganic layers, and a second encapsulation layer 63 located between the two inorganic encapsulation layers. The first encapsulation layer 62 and the third encapsulation layer 64 can be made of SiNx or SiONx and can be fabricated using chemical vapor deposition (CVD). The second encapsulation layer 63 can be formed using inkjet printing.

[0033] Please refer to Figure 1 , Figure 2 The display module insulation structure 931 provided in some embodiments of this application has an inclined surface 9311 that extends at an angle relative to the display panel 100, and intermediate connecting segments 932 are spaced apart on the inclined surface 9311; the first connecting segment 91, the intermediate connecting segment 932 and the second connecting segment 92 are integral structures made of the same material and connected in sequence.

[0034] The first connecting segment 91, the middle connecting segment 932, and the second connecting segment 92 are integral structures made of the same material and connected sequentially, which can facilitate the simultaneous formation of the three parts at one time, such as by printing.

[0035] Please refer to Figure 3 , Figure 5 , Figure 6 , Figure 10 and Figure 11 In some embodiments of this application, the insulating structure 931 includes an insulating barrier 9312 located between adjacent intermediate connecting sections 932 and on an inclined surface 9311. The adjacent insulating barrier 9312 and the inclined surface 9311 enclose an inclined, extending auxiliary groove 9313 with an opening size larger than the bottom size. The intermediate connecting sections 932 are formed within the auxiliary groove 9313. The auxiliary groove 9313 may include a portion with a triangular cross-section or a portion with a rectangular cross-section.

[0036] When forming (e.g., printing) the intermediate connecting segment 932, the liquid state before molding is not easily flowed to the adjacent intermediate connecting segment 932, which can avoid short circuits between them. This allows for the formation of intermediate connecting segments 932 with larger thicknesses, thus avoiding the problem of easy breakage later.

[0037] Please refer to Figure 1 , Figure 7 , Figure 8 In some embodiments of this application, the display module includes an insulating structure 931 comprising an insulating barrier 9312 located between adjacent intermediate connecting segments 932. An inclined, extending auxiliary groove 9313 is formed between adjacent insulating barriers 9312. The opening of the auxiliary groove 9313 is larger than its bottom. The intermediate connecting segments 932 are formed within the auxiliary grooves 9313. The corresponding first connecting segment 91, intermediate connecting segment 932, and second connecting segment 92 are sequentially connected as an integral structure. It should be noted that the insulating structure 931 can be formed by printing, and can be printed in multiple layers. The material can be insulating adhesive.

[0038] When forming (e.g., printing) the intermediate connecting segment 932, the liquid phase before molding is less likely to extend to the adjacent intermediate connecting segment 932, which can avoid short circuits between them. This allows for the formation of intermediate connecting segments 932 with larger thicknesses, thus avoiding the problem of easy breakage later.

[0039] Please refer to Figure 7 and Figure 8 The NCF adhesive layer 80 can extend beyond the edge of the circuit board 70. In this way, when the insulating structure 931 is formed by printing adhesive or other means, the adhesive will not flow into the bottom of the circuit board 70. The insulating structure 931 has good molding consistency, which is beneficial to the quality of subsequent connection lines.

[0040] The display module provided in some embodiments of this application uses acrylate or SU-8 series photoresist as the material for the insulating structure 931, and silver paste as the raw material for the intermediate connection segment 932. SU-8 is an epoxy resin-based negative photoresist, named for the average of eight epoxy groups per molecule. SU-8 series photoresist has a viscosity of over 10,000 cps and can be formed by UV curing or thermosetting when forming the insulating structure 931. SU-8 series photoresist does not react with silver paste, reliably ensuring the performance of the intermediate connection segment 932.

[0041] Please refer to Figure 1 , Figure 4 , Figures 7-18In some embodiments of this application, the angle between the extension direction of the intermediate connecting segment 932 and the surface where the display panel 100 is located is 30-70°. Specifically, the angle between the extension direction of the intermediate connecting segment 932 and the surface where the display panel 100 is located can be 30°, 35°, 40°, 50°, 60°, etc.

[0042] An angle between 30-70° can be easily formed during manufacturing, avoiding uneven dimensions and potential breakage due to flow during the liquid stage of manufacturing, while also occupying a more reasonable amount of space.

[0043] Please refer to Figure 7 , Figure 8 In some embodiments of this application, the circuit board 70 is fixedly disposed on the side of the bottom insulating layer 20 away from the circuit functional layer 50 by an adhesive layer 80. The end of the adhesive layer 80 extends beyond the circuit board 70, and the insulating structure 931 covers the end of the adhesive layer 80 and at least part of the end of the circuit board 70. An inclined wall 211 is formed on the side of the bottom insulating layer 20 corresponding to the exposed pad 52. The inclination angle of the inclined wall 211 relative to the display panel 100 can be 40°-70°.

[0044] The end of the adhesive layer 80 extends beyond the circuit board 70, which makes the adhesive layer 80 of the circuit board 70 more stable and facilitates the formation of a reliable connection insulation structure 931, thereby reliably supporting the intermediate connection section 932 and the first connection section 91 together with the inclined wall 211.

[0045] Please refer to Figure 1 , Figure 7 , Figure 8 , Figure 9 , Figure 12 and Figure 17 In some embodiments of this application, a portion of the first connecting segment 91 is located on the inclined wall 211; or, a portion of the insulating structure 931 covers the inclined wall 211, and the intermediate connecting segment 932 is located on the insulating structure 931.

[0046] This achieves the connection between the first connecting segment 91 and the intermediate connecting segment 932. Please refer to [reference needed]. Figure 3 and Figure 9 The display module provided in some embodiments of this application includes an auxiliary connection structure 93 comprising a plurality of spaced auxiliary conductive elements, an insulating structure 931 comprising a plurality of insulating barriers 9312 disposed between adjacent auxiliary conductive elements, an auxiliary conductive element constituting an intermediate connection segment 932, a first connection segment 91 overlapping with one end of an auxiliary conductive element, and a second connection segment 92 overlapping with the other end of an auxiliary conductive element.

[0047] Such an auxiliary connection structure 93 can be a pre-prepared device structure. The auxiliary conductive component as an intermediate connection segment 932 has higher performance reliability and can improve manufacturing efficiency.

[0048] Please refer to Figure 10 , Figure 14 , Figure 15 and Figure 18 In some embodiments of this application, an insulating barrier 9312 is provided between adjacent auxiliary conductive components, and the insulating barrier 9312 extends beyond the auxiliary conductive component at the overlap between the first connecting section 91 and the auxiliary conductive component.

[0049] When forming (e.g., printing) the intermediate connecting segment 932, the liquid state before molding is not easily flowed to the adjacent intermediate connecting segment 932, which can avoid short circuits between them. This allows for the formation of intermediate connecting segments 932 with larger thicknesses, thus avoiding the problem of easy breakage later.

[0050] Please refer to Figure 11 In some embodiments of this application, the auxiliary conductive component includes a first contact surface 9321 near the pad 52 and a second contact surface 9322 near the pin 701. The angle between the first contact surface 9321 and the surface where the display panel 100 is located is smaller than the angle between the second contact surface 9322 and the surface where the display panel 100 is located. The first connecting segment 91 overlaps with the first contact surface 9321, and the second connecting segment 92 overlaps with the second contact surface 9322.

[0051] The small angle between the first contact surface 9321 near the pad 52 and the surface where the display panel 100 is located is conducive to the reliable connection between the first connecting section 91 and the first contact surface 9321. The larger angle between the second contact surface 9322 and the surface where the display panel 100 is located is conducive to appropriately reducing the space occupied.

[0052] It should be noted that the material of the auxiliary conductive component may be different from that of the first connecting segment 91, while the material of the second connecting segment 92 may be the same as that of the first connecting segment 91.

[0053] Please refer to Figures 12-18 The display module provided in some embodiments of this application includes an auxiliary connection structure 93 comprising a plurality of spaced auxiliary conductive elements, an insulating structure 931 comprising a plurality of insulating barriers 9312 disposed between adjacent auxiliary conductive elements, an auxiliary conductive element constituting an intermediate connection segment 932, a first connection segment 91 overlapping one end of an auxiliary conductive element, and a second connection segment 92 being an integral structure of the same material as the auxiliary conductive element.

[0054] The second connecting segment 92, the auxiliary conductive component, and the insulating structure 931 can be first prepared using an auxiliary connecting assembly that can be easily manufactured with high efficiency and high quality through injection molding. Then, the second connecting segment 92 of the auxiliary connecting assembly is pressed onto the pin 701 on the circuit board 70. Finally, the first connecting segment 91 connecting the connecting pad 52 and the intermediate connecting segment 932 is formed by printing. This not only results in high overall manufacturing efficiency, but also ensures the reliable quality of the intermediate connecting segment 932 and the second connecting segment 92, and prevents the second connecting segment 92 from breaking.

[0055] Please refer to Figure 16 In some embodiments of this application, the auxiliary conductive component includes a first contact surface 9321 near the pad 52 and a second contact surface 9322 near the pin 701. The angle between the first contact surface 9321 and the surface where the display panel 100 is located is smaller than the angle between the second contact surface 9322 and the surface where the display panel 100 is located. The first connecting segment 91 overlaps with the first contact surface 9321.

[0056] The small angle between the first contact surface 9321 near the pad 52 and the surface where the display panel 100 is located is conducive to the reliable connection between the first connecting section 91 and the first contact surface 9321. The larger angle between the second contact surface 9322 and the surface where the display panel 100 is located is conducive to appropriately reducing the space occupied.

[0057] Please refer to Figure 14 In some embodiments of this application, the insulating structure 931 includes a plurality of insulating sheets separated by corresponding auxiliary conductive elements, the outline shape of the insulating sheets being the same as the outline shape of the auxiliary conductive elements.

[0058] This structure allows for the separate fabrication of auxiliary conductive components and insulating sheets, followed by their assembly, making the fabrication process simple and efficient.

[0059] Please refer to Figure 15 , Figure 16 and Figure 18 In some embodiments of this application, the insulating structure 931 includes an insulating base and a plurality of insulating barriers 9312 located between adjacent auxiliary conductive members. The insulating base and the plurality of insulating barriers 9312 enclose a plurality of auxiliary grooves. The auxiliary conductive members and the second connecting segment 92 are made of conductive adhesive and are formed in the auxiliary grooves. The insulating barrier 9312 corresponding to the overlapping position of the first connecting segment 91 and the auxiliary conductive member extends beyond the auxiliary conductive member.

[0060] This structure not only facilitates the manufacturing of auxiliary conductive components and the second connecting segment 92, but also allows for easy direct electrical connection between the second connecting segment 92 and the pin 701 through crimping (applying pressure) when connecting the pad 52 and the pin 701. It also allows for easy attachment of part of the intermediate connecting segment 932 to the bottom insulating layer 20 through extrusion, which is beneficial for a reliable connection between the first connecting segment 91 and the intermediate connecting segment 932 and prevents the first connecting segment 91 from breaking.

[0061] Please refer to Figure 17 and Figure 18 In some embodiments of this application, the auxiliary conductive element extends from the position of the pad 52 to form an extension 9323, and the insulating barrier 9312 includes an extension barrier 93121 located between adjacent extensions 9323.

[0062] This structure can compensate for the problem that the gap between the auxiliary conductive component and the bottom insulating layer 20 is left after the second connecting segment 92 is connected to the pin 701 due to manufacturing errors, which makes the first connecting segment 91 prone to breakage. It is more conducive to the reliable connection between the first connecting segment 91 and the intermediate connecting segment 932.

[0063] Please refer to Figure 1 , Figure 7 , Figure 8 , Figure 9 , Figure 12 and Figure 16 The display module provided in some embodiments of this application also includes a protective layer 95 that covers at least the first connection segment 91.

[0064] The protective layer 95 can be formed of a waterproof adhesive material, and the protective layer 95 can provide reliable protection for parts such as the first connecting section 91.

[0065] Secondly, some embodiments of this application provide an auxiliary connection component that can be used in the aforementioned partial display module. Please refer to [reference needed]. Figure 13 and Figure 18 The auxiliary connection assembly includes at least one insulating structure 931 and multiple auxiliary conductive structures. The at least one insulating structure 931 includes multiple insulating barriers 9312 disposed between adjacent auxiliary conductive elements. Each insulating barrier 9312 includes an extension barrier 93121. Adjacent auxiliary conductive structures are separated by the insulating barriers 9312. Each auxiliary conductive structure includes an intermediate connecting segment 932 and a second connecting segment 92. Adjacent second connecting segments 92 are separated by the extension barriers 93121. The second connecting segment 92 and the intermediate connecting segment 932 are integrally formed. The second connecting segment 92 includes a crimping portion 921 protruding from the insulating barrier 9312. The insulating barriers 9312 are disposed between the adjacent integrally formed second connecting segments 92 and the intermediate connecting segment 932, and the extension barriers 93121 are located between adjacent extensions.

[0066] This independent auxiliary connection component structure is advantageous for manufacturing and subsequent use through efficient and high-quality methods such as injection molding, which helps reduce product costs.

[0067] The second connecting section 92 and the intermediate connecting section 932 can be an integral structure formed of conductive adhesive material.

[0068] Please continue to refer to this. Figure 18 In some embodiments, the portion of the crimped portion 921 and the intermediate connecting section 932 near the pad 52 is covered with a protective structure.

[0069] The protective structure may include a first protective part 97 and a second protective part 98, and the crimping part 921 and the intermediate connecting section 932 may be completely covered by the protected structure.

[0070] Thirdly, some embodiments of this application provide a method for manufacturing a display module, the method comprising: A display panel 100 and a circuit board 70 are provided. The display panel 100 includes a bottom insulating layer 20 and pads 52, and the circuit board 70 includes pins 701. An auxiliary connection assembly is provided, comprising at least one insulating structure 931, a plurality of auxiliary conductive structures, and a protective structure. The at least one insulating structure 931 includes a plurality of insulating barriers 9312 disposed between adjacent auxiliary conductive elements. The insulating barriers 9312 include an extension barrier 93121. Adjacent auxiliary conductive structures are separated by the insulating barriers 9312. Each auxiliary conductive structure includes an intermediate connection segment 932 and a second connection segment 92. Adjacent second connection segments 92 are separated by the extension barrier 93121. The second connection segment 92 and the intermediate connection segment 932 are an integral structure formed of conductive adhesive. The second connection segment 92 includes a crimp portion 921 protruding from the extension barrier. The protective structure at least covers the crimp portion 921 and the portion of the intermediate connection segment 932 near the pad 52. The protective structure is removed, and the crimping portions 921 of the multiple second connecting segments 92 formed of conductive adhesive material of the auxiliary connecting component are crimped together with the corresponding pins 701 of the multiple pins 701 of the circuit board 70 to form an electrical connection. During the crimping process, the crimping portions 921 will deform. The portion of the intermediate connecting section 932 formed by the conductive adhesive material near the pad 52 is pressed onto the bottom insulating layer 20, so that the portion of the intermediate connecting section 932 near the pad 52 is in contact with the bottom insulating layer 20. The first connecting segment 91 material is formed, and after the first connecting segment 91 material is cured, it forms the first connecting segment 91 with the electrical connection pad 52 and the intermediate connecting segment 932.

[0071] The auxiliary connection component can be fabricated first using efficient and high-quality methods such as injection molding. Then, the second connection segment 92 of the auxiliary connection component is press-fitted to the pin 701 on the circuit board 70. Finally, the first connection segment 91 connecting the connection pad 52 and the intermediate connection segment 932 is formed by printing. This not only ensures high overall fabrication efficiency but also guarantees reliable quality for both the intermediate connection segment 932 and the second connection segment 92, preventing breakage of the second connection segment 92. Furthermore, the electrical connection between the second connection segment 92 and the pin 701 on the circuit board 70 is achieved by deforming the press-fit portion 921 protruding from the extended retaining wall, thus improving connection reliability.

[0072] The portion of the intermediate connecting section 932 formed by conductive adhesive material near the pad 52 can be deformed by extrusion and attached to the bottom insulating layer 20, which can further realize the reliable electrical connection between the first connecting section 91 and the intermediate connecting section 932 and the pad 52.

[0073] To improve processing efficiency, "pressing the portion of the intermediate connecting section 932 formed by conductive adhesive material near the pad 52 onto the bottom insulating layer 20, so that the portion of the intermediate connecting section 932 near the pad 52 is in contact with the bottom insulating layer 20" can be performed using a fixture capable of simultaneously pressing the portion of the intermediate connecting section 932 formed by conductive adhesive material near the pad 52 onto the bottom insulating layer 20, and "pressing the multiple second connecting sections 92 of the auxiliary connecting assembly formed by conductive adhesive material together with the corresponding pins 701 of the multiple pins 701 of the circuit board 70 to form an electrical connection" can be performed using a fixture capable of simultaneously pressing the portion of the second connecting section 92 and the portion of the intermediate connecting section 932 formed by conductive adhesive material near the pad 52.

[0074] It should be noted that the connecting lines (or parts thereof) can be formed by printing with silver paste, and the silver paste can be cured using near-infrared, ultraviolet or green laser after printing; the printing can be carried out using the high-resolution micro-nano printing method EHD (Electrohydrodynamic).

[0075] Fourthly, some embodiments of this application provide a display device, which includes the display module described above, or the auxiliary connection component described above, or a display module prepared according to the method described above for preparing the display module.

[0076] When using the terms “including,” “having,” and “comprising” as described herein, another component may be added unless explicitly qualifying terms such as “only,” “consisting of,” etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having a quantity of one.

[0077] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0078] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display module, characterized by include: The display panel includes a bottom insulating layer, a circuit functional layer located on one side of the bottom insulating layer, and a display functional layer located on the side of the circuit functional layer opposite to the bottom insulating layer. The circuit functional layer includes multiple signal lines and multiple pads. The signal lines are electrically connected to the corresponding pads, and the pads are exposed from the bottom insulating layer. A circuit board is fixedly disposed on the side of the bottom insulating layer opposite to the circuit functional layer, and the circuit board includes multiple pins; as well as An electrical connection structure includes an auxiliary connection structure, a plurality of first connection segments, and a plurality of second connection segments. The auxiliary connection structure is located on the side of the bottom insulating layer away from the circuit functional layer and on the side of the circuit board closer to the pad. The auxiliary connection structure includes at least one insulating structure and a plurality of intermediate connection segments spaced apart on the insulating structure. The first connection segments connect the corresponding pads and the intermediate connection segments. The second connection segments connect the intermediate connection segments and the pins. The height difference between the end of the intermediate connection segment corresponding to the pad and the pad is less than 50% of the height difference between the pin and the pad. The height difference between the end of the intermediate connection segment corresponding to the pin and the pin is less than 30% of the height difference between the pin and the pad.

2. The display module of claim 1, wherein, The insulating structure has an inclined surface that extends at an angle relative to the display panel, and the intermediate connecting segments are spaced apart on the inclined surface; the first connecting segment, the intermediate connecting segment and the second connecting segment are integral structures made of the same material and connected in sequence. Preferably, the insulating structure includes an insulating retaining wall located between adjacent intermediate connecting sections and on the inclined surface, the adjacent insulating retaining walls and the inclined surface enclosing an inclined extending auxiliary groove with an opening size larger than the bottom size, and the intermediate connecting section is formed in the auxiliary groove.

3. The display module of claim 1, wherein the display module is configured to be mounted on a display stand. The insulation structure includes an insulating barrier wall located between adjacent intermediate connecting sections, and an inclined auxiliary groove is formed between adjacent insulating barrier walls. The size of the opening of the auxiliary groove is larger than the size of the bottom. The intermediate connecting section is formed in the auxiliary groove, and the corresponding first connecting section, intermediate connecting section and second connecting section are integral structures connected in sequence.

4. The display module of claim 2 or 3, wherein, The insulating structure is made of epoxy resin-based negative photoresist, and the intermediate connecting section is made of silver paste. Preferably, the circuit board is fixedly disposed on the side of the bottom insulating layer away from the circuit functional layer by an adhesive layer, the end of the adhesive layer extends beyond the circuit board, the insulating structure covers the end of the adhesive layer and at least part of the end of the circuit board, and the bottom insulating layer has an inclined wall formed corresponding to the side of the exposed pad; Preferably, a portion of the first connecting segment is located on the inclined wall; or, a portion of the insulating structure covers the inclined wall, and the intermediate connecting segment is located on the insulating structure.

5. The display module of claim 1, wherein the display module is configured to be mounted on a display stand. The auxiliary connection structure includes a plurality of spaced-apart auxiliary conductive elements, and the insulation structure includes a plurality of insulating barriers disposed between adjacent auxiliary conductive elements. The auxiliary conductive elements constitute the intermediate connection segment. The first connection segment overlaps with one end of the auxiliary conductive element, and the second connection segment overlaps with the other end of the auxiliary conductive element. Preferably, an insulating barrier is provided between adjacent auxiliary conductive components, and the insulating barrier extends beyond the auxiliary conductive component at the overlap between the first connecting section and the auxiliary conductive component; Preferably, the auxiliary conductive component includes a first contact surface near the pad and a second contact surface near the pin, wherein the angle between the first contact surface and the surface where the display panel is located is smaller than the angle between the second contact surface and the surface where the display panel is located, the first connecting segment overlaps with the first contact surface, and the second connecting segment overlaps with the second contact surface.

6. The display module of claim 1, wherein, The auxiliary connection structure includes a plurality of spaced-apart auxiliary conductive elements, and the insulating structure includes a plurality of insulating baffles disposed between adjacent auxiliary conductive elements. The auxiliary conductive elements constitute the intermediate connection segment. The first connection segment overlaps with one end of the auxiliary conductive element, and the second connection segment and the auxiliary conductive element are integral structures made of the same material. Preferably, the auxiliary conductive component includes a first contact surface near the pad and a second contact surface near the pin, the angle between the first contact surface and the surface where the display panel is located is smaller than the angle between the second contact surface and the surface where the display panel is located, and the first connecting segment overlaps with the first contact surface; Preferably, the insulating structure includes a plurality of insulating sheets separated by corresponding auxiliary conductive elements, wherein the outline shape of the insulating sheets is the same as the outline shape of the auxiliary conductive elements; Preferably, the insulating structure includes an insulating base and a plurality of insulating barriers located between adjacent auxiliary conductive components. The insulating base and the plurality of insulating barriers enclose a plurality of auxiliary grooves. The auxiliary conductive components and the second connecting section are made of conductive adhesive and are formed in the auxiliary grooves. The insulating barriers corresponding to the overlapping positions of the first connecting section and the auxiliary conductive component extend beyond the auxiliary conductive component. Preferably, the auxiliary conductive element extends into an extension corresponding to the position of the pad, and the insulating barrier includes an extension barrier located between adjacent extensions.

7. The display module of claim 5 or 6, wherein the display module is configured to be mounted on a display device. It also includes a protective layer that covers at least the first connection segment.

8. An auxiliary connection assembly, characterized by include: At least one insulating structure, the at least one insulating structure including an insulating barrier, the insulating barrier including an extended barrier; Multiple auxiliary conductive structures are provided, with adjacent auxiliary conductive structures separated by insulating barriers. Each auxiliary conductive structure includes an auxiliary conductive element and a second connecting segment. The auxiliary conductive element includes an extension portion. Adjacent second connecting segments are separated by the extension barriers. The second connecting segments and the auxiliary conductive element are integrally formed. The second connecting segments include a crimping portion protruding from the extension barriers. The insulating barriers are located between the adjacent integrally formed second connecting segments and the auxiliary conductive element, and the extension barriers are located between adjacent extension portions.

9. A method for manufacturing a display module, characterized by, include: A display panel and a circuit board are provided, the display panel including a bottom insulating layer and pads, and the circuit board including pins; An auxiliary connection assembly is provided, the auxiliary connection assembly including at least one insulating structure, a plurality of auxiliary conductive structures and a protective structure, the at least one insulating structure including a plurality of insulating barriers disposed between adjacent auxiliary conductive elements, the insulating barriers including an extension barrier, adjacent auxiliary conductive structures being separated by the insulating barriers, each auxiliary conductive structure including an intermediate connection segment and a second connection segment, adjacent second connection segments being separated by the extension barrier, the second connection segment and the intermediate connection segment being an integral structure formed of conductive adhesive, the second connection segment including a crimp portion protruding from the extension barrier, the protective structure at least covering the crimp portion and the portion of the intermediate connection segment near the pad; The auxiliary connection assembly consists of multiple second connection segments formed of conductive adhesive material, which are pressed together with the corresponding pins of multiple pins on the circuit board to form an electrical connection. The portion of the intermediate connecting section formed by the conductive adhesive material near the solder pad is pressed onto the bottom insulating layer, so that the portion of the intermediate connecting section near the solder pad is in contact with the bottom insulating layer; A first connecting segment material is formed, and after the first connecting segment material is cured, a first connecting segment is formed that electrically connects the pad and the intermediate connecting segment.

10. A display device, characterized by comprising: It includes the display module as described in any one of claims 1-7; or the auxiliary connection component as described in claim 8; or the display module prepared according to the method for preparing the display module as described in claim 9.

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