Display module and display device

Abstract

This disclosure provides a display module and display device, including: a display panel, a heat dissipation functional layer, and a bonding module. The heat dissipation functional layer is located on the non-light-emitting side of the display panel and includes an opening. The bonding module is at least partially located within the opening and bonded to the display panel. The display panel includes a display area. Along the thickness direction of the display module, the opening overlaps with the display area but does not overlap with the edge of the display panel. This reduces the direct impact of external forces on the bonding module, reducing display module failure; it extends the water and oxygen intrusion path, slowing down the corrosion of the bonding module; and it also helps to further reduce the edge width of the cover plate, achieving a narrow bezel.

Description

Technical Field

[0001] This disclosure relates to the field of displays, and more particularly to a display module and a display device. Background Technology

[0002] With the development of science and technology, people have increasingly higher requirements for the screen-to-body ratio of electronic products. In current bonding processes, the bonding area of ​​the display panel is usually bent to the back of the display panel. However, due to the bending radius, the bottom bezel of the display panel cannot be further narrowed. Furthermore, when the display panel vibrates or is impacted, the bending area may be directly subjected to external impact or corroded by water and oxygen, leading to reduced reliability or panel failure.

[0003] Therefore, how to improve the reliability and corrosion resistance of the bonded components while achieving a narrow bezel has become one of the technical problems that urgently need to be solved by those skilled in the art. Summary of the Invention

[0004] To address the aforementioned technical issues, this disclosure provides a display module and display device that improve the reliability and corrosion resistance of the bonding components while achieving a narrow bezel.

[0005] This disclosure provides a display module, including: a display panel, a heat dissipation functional layer, and a bonding module. The heat dissipation functional layer is located on the non-light-emitting side of the display panel and includes an opening. The bonding module is at least partially located in the opening and is bonded to the display panel. The display panel includes a display area, and along the thickness direction of the display module, the opening overlaps with the display area, but the opening does not overlap with the edge of the display panel.

[0006] Based on the same inventive concept, this disclosure provides a display device, including the display module as described above.

[0007] Compared with the prior art, the technical solution provided in this disclosure has the following advantages: This disclosure provides a display module and display device, including: a display panel, a heat dissipation functional layer, and a bonding module. The heat dissipation functional layer is located on the non-light-emitting side of the display panel and includes an opening. The bonding module is at least partially located within the opening and is bonded to the display panel. The display panel includes a display area. Along the thickness direction of the display module, the opening overlaps with the display area but does not overlap with the edge of the display panel. By setting the opening in the heat dissipation functional layer to not overlap with the edge of the display panel, and having the bonding module at least partially located within the opening and bonded to the display panel, this disclosure allows the bonding module, which is at least partially located within the opening in the heat dissipation functional layer, to be positioned relatively far from the edge of the display panel. When the edge of the display module is subjected to external force, the force will not be directly transmitted to the bonding module, reducing display module failure. Furthermore, the bonding area being far from the edge of the display panel also extends the water and oxygen intrusion path, slowing down the corrosion of the bonding module. Meanwhile, since the bonding module, which is at least partially located in the opening, is relatively far from the edge of the display panel, the four edges of the display module have a flat structure, which can meet the requirements of the whole assembly. There is no need to add potting glue to the side of the display module to protect the bending area or bonding area, which is conducive to further reducing the edge width of the cover plate and achieving a narrow bezel. Attached Figure Description

[0008] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0009] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0010] Figure 1 The image shown is a cross-sectional schematic diagram of a display module in related technologies; Figure 2 The image shown is another cross-sectional schematic diagram of a display module in related technologies; Figure 3 The figure shown is a planar schematic diagram of a display module provided in an embodiment of this disclosure; Figure 4 As shown Figure 3 A schematic diagram of a cross-section along the A-A' direction; Figure 5 The diagram shown is another structural schematic of the display module provided in this embodiment of the present disclosure; Figure 6 The diagram shown is another structural schematic of the display module provided in this embodiment of the present disclosure; Figure 7 The diagram shown is another cross-sectional view of the display module provided in this embodiment of the present disclosure; Figure 8 The diagram shown is another structural schematic of the display module provided in this embodiment of the present disclosure; Figure 9 The diagram shown is another structural schematic of the display module provided in this embodiment of the present disclosure; Figure 10 The figure shown is a planar schematic diagram of a heat dissipation functional layer provided in an embodiment of this disclosure; Figure 11 The diagram shown is another structural schematic of the display module provided in this embodiment of the present disclosure; Figure 12 The figure shown is a plan view of a display device provided in an embodiment of this disclosure; Figure 13 As shown Figure 12 A schematic diagram of a cross-section along the B-B' direction; Figure 14 The diagram shown is a process flow chart of a display module provided in an embodiment of this disclosure. Detailed Implementation

[0011] To better understand the above-mentioned objectives, features, and advantages of this disclosure, the solutions disclosed herein will be further described below. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0012] Numerous specific details are set forth in the following description in order to provide a full understanding of this disclosure, but this disclosure may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only some, and not all, of the embodiments of this disclosure.

[0013] Figure 1 The image shown is a cross-sectional schematic diagram of a display module in related technologies. Figure 2 The diagram shown is another cross-sectional view of a display module in related technologies. Please refer to it. Figure 1 The display module 100' includes a display panel 20'. The Pad Bending process bends the driver chip or flexible circuit board to the non-light-emitting side of the display panel 20', thus forming a bending area 30'. Due to the presence of the bending area 30', an adhesive 10' is required for its protection and support. In this solution, the arc apex HD' of the cover plate is relatively wide, which is not conducive to the realization of a narrow bezel. The bending area 30' is located at the edge of the display panel 20'. When the edge is subjected to force, the force may be directly transmitted to the interior of the display panel 20', resulting in a high risk of failure.

[0014] As users increasingly demand narrow bezels in display products, the Pad Bending process is gradually shifting to back-mounting to reduce the width of the cover plate's curved top (HD). Please refer to... Figure 2 Signal conduction can be achieved by bonding the flip-chip film COF' to the conductive terminals on the back of the display panel 20'. This structure eliminates the need for bends, effectively reducing the width of the cover plate's arc apex HD'. However, in the back-bonding scheme, the stress in the bonding area is complex, still requiring a large amount of sealant 10' for protection and support. Furthermore, in related technologies, the bonding area on the back is still located at the edge of the display panel 20', resulting in a complex structure where edge stress may be directly transmitted to the interior of the display panel 20', posing a high risk of failure.

[0015] To address the aforementioned issues, this disclosure provides a display module and display device that improve the reliability and corrosion resistance of the bonding components while achieving a narrow bezel.

[0016] Figure 3 The figure shown is a plan view of a display module provided in an embodiment of this disclosure. Figure 4 As shown Figure 3 Please refer to the schematic diagram of a cross-section along the A-A' direction. Figure 3 and Figure 4 This disclosure provides a display module 100, including a display panel 30, a heat dissipation functional layer 40, and a bonding module 50. Optionally, the display panel 30 can be an OLED panel, a Mini-LED panel, a Micro-LED panel, etc., and this disclosure does not limit it to this type. The heat dissipation functional layer 40 is located on the non-light-emitting side of the display panel 30. The heat dissipation functional layer 40 can quickly conduct heat away from the display panel 30, reducing heat accumulation. The heat dissipation functional layer 40 includes an opening 00, and the bonding module 50 is at least partially located within the opening 00 and bonded to the display panel 30. Compared to related technologies that use a PadBending process to bend the driver chip or flexible circuit board to the back of the panel, the back bonding provided in this disclosure does not require a bending portion, thereby reducing the edge width of the cover plate 10 and facilitating the realization of a narrow bezel.

[0017] The display panel 30 includes a display area AA. Along the thickness direction of the display module 100, an opening 00 overlaps with the display area but does not overlap with the edge of the display panel 30. That is, the bonding module 50, at least partially located within the opening 00, does not overlap with the edge of the display panel 30. Compared to related technologies where the bonding component is located at the edge of the panel, when the edge of the display product is subjected to force, the force is easily transmitted to the bonding component located at the edge, leading to display failure. This disclosure, by setting the opening 00 in the heat dissipation functional layer 40 to not overlap with the edge of the display panel 30, allows the opening 00 to be positioned relatively far from the edge of the display panel 30. The bonding module 50 is at least partially located within the opening 00 and bonded to the display panel 30; that is, the bonding module 50 with the opening 00 can be positioned relatively far from the edge of the display panel 30. Since the bonding module 50 is not located at the edge of the display panel 30, when the edge of the display module 100 is subjected to external force, the force will not directly affect the bonding module 50, which is far from the edge of the display panel 30. This reduces the risk of display module 100 failure due to edge forces. Furthermore, since the bonding module 50, which is at least partially located in the opening 00, is relatively far from the edge of the display panel 30, the perimeter of the display module 100 is flat when the bonding module 50 is not located at the edge of the display panel 30. This meets the requirements for overall assembly and eliminates the need for additional potting compound on the sides of the display module 100 to protect the bending or bonding areas. This further reduces the edge width of the cover plate 10, achieving a narrow bezel.

[0018] Thus, along the thickness direction of the display module 100, by setting the opening 00 to overlap with the display area AA and not to overlap with the edge of the display panel 30, the bonding area can be shrunk inward, and the uneven bonding area can be moved into the display area AA, reducing the impact of external forces on the side wall of the display module 100 on the bonding module 50 and reducing display failure; it also helps to improve the structural flatness of the four edges of the display module 100, meet the requirements of the whole machine assembly, and improve the protection of the bonding area by utilizing the subsequent assembly of the whole machine.

[0019] Optionally, the display module 100 also includes a light-shielding layer 11, which is used to shield or hide non-display structures in the display module 100, and can also be used to block light leaking from the edge of the display panel 30 to improve the display effect. The light-shielding layer 11 can also protect the adhesive layer under the cover plate 10, reduce water and oxygen intrusion, or serve as an alignment reference during assembly. Figure 4 This illustration only shows some of the main film layers or structures and does not represent the actual film layers or structures included in the display module 100. This disclosure is not limited thereto.

[0020] Please refer to Figure 4In a display module 100 provided in this disclosure, the display panel 30 includes an electrode portion 31. An opening 00 exposes the electrode portion 31 along the thickness direction of the display panel 30, and the electrode portion 31 is connected to the bonding module 50.

[0021] Specifically, the electrode part 31 is located on the non-light-emitting side of the display panel 30. By providing an opening 00 on the heat dissipation functional layer 40 on the back of the display panel 30, the electrode part 31 can be exposed. The bonding module 50 no longer needs to be arranged on the side or edge of the display panel 30, but is directly connected to the electrode part 31 from the back of the display panel 30. This can significantly reduce the space occupied by the side bezel and reduce the structural bending risk caused by side bonding, which is conducive to improving the screen ratio and overall reliability.

[0022] Compared to related technologies where the driver chip or flexible circuit board is bent to the back of the display screen via a bend on the side, the presence of the bend may lead to signal line extension. In this embodiment, by configuring the bonding module 50, which is at least partially located in the opening 00, to be connected to the electrode portion 31 on the back of the display panel 30, the electrode portion 31 can be directly connected to the bonding module 50 in a direction perpendicular to the plane of the display module 100, without having to go around the side of the display panel 30. This shortens the signal transmission path, reduces voltage drop and delay during signal transmission, and helps improve display uniformity.

[0023] Thus, along the thickness direction of the display panel 30, the opening 00 exposes the electrode part 31, which is connected to the bonding module 50. The electrode part 31 exposed by the opening 00 can be directly bonded to the back of the display panel 30 with the bonding module 50, which can achieve narrow bezels to improve bonding efficiency and also help improve display uniformity.

[0024] Please refer to Figure 4 In a display module 100 provided in this disclosure, the bonding module 50 includes a flip-chip film 51, and the display module 100 also includes a first adhesive layer 41. The flip-chip film 51 is located on the side of the first adhesive layer 41 away from the electrode portion 31. Along a direction parallel to the plane where the display panel 30 is located, one side edge of the first adhesive layer 41 at least partially extends beyond the edge of the flip-chip film 51.

[0025] Specifically, the heat dissipation functional layer 40 is located on the non-light-emitting side of the display panel 30. The heat dissipation functional layer 40 includes an opening 00 that exposes the electrode portion 31 on the back of the display panel 30. At least a portion of the bonding module 50 is located within the opening 00 and is electrically connected to the electrode portion 31. The bonding module 50 includes a flip-chip film 51, that is, the flip-chip film 51, at least a portion of which is located within the opening 00, is electrically connected to the electrode portion 31. The display module 100 also includes a first adhesive layer 41. Along the thickness direction of the display module 100, the first adhesive layer 41 is located between the flip-chip film 51 and the electrode portion 31. One side edge of the first adhesive layer 41 at least partially extends beyond the edge of the flip-chip film 51, that is, one side edge of the first adhesive layer 41 located within the opening 00 at least partially extends beyond the edge of the flip-chip film 51. Here, "one side edge of the first adhesive layer 41" refers to the side closer to the edge of the display panel 30, not the side closer to the center of the display panel 30. For example, the first adhesive layer 41 may be PSA (Pressure Sensitive Adhesive), which includes acrylate, silicone, polyurethane, etc. This disclosure does not limit the type and specific composition of the first adhesive layer 41.

[0026] The first adhesive layer 41 can be used to flatten the surface of the electrode portion 31 and firmly fix the flip-chip film 51 to the back of the display panel 30, reducing the shrinkage or warping of the flip-chip film 51 and providing a flat and stable foundation for the electrical connection between the flip-chip film 51 and the electrode portion 31. One edge of the first adhesive layer 41 extends at least partially beyond the flip-chip film 51. The extended first adhesive layer 41 can wrap around the edge of the flip-chip film 51, forming a physical protective layer to isolate moisture, dust, etc., and reduce solder joint corrosion. When the display module 100 is bent or dropped, the first adhesive layer 41 extending beyond one edge of the flip-chip film 51 can absorb some deformation, reduce stress concentration on the flip-chip film 51 and the electrode portion 31, and reduce the risk of breakage or peeling at the connection. The extended first adhesive layer 41 also provides a certain error margin for lamination alignment, allowing the flip-chip film 51 to still achieve effective alignment and connection with the electrode portion 31 even with slight misalignment.

[0027] Thus, the flip-chip film 51 is located on the side of the first adhesive layer 41 away from the electrode portion 31. Along the direction parallel to the plane where the display panel 30 is located, one edge of the first adhesive layer 41 extends at least partially beyond the edge of the flip-chip film 51. The first adhesive layer 41 provides a flat and stable connection base for the electrical connection between the flip-chip film 51 and the electrode portion 31. The extended first adhesive layer 41 can provide a certain alignment margin, reduce the difficulty of the process, and also protect the side of the flip-chip film 51, reducing the intrusion of water, oxygen, etc.

[0028] Please continue to refer to this. Figure 4In a display module 100 provided in this disclosure, the bonding module 50 includes silver paste 52, which is used to connect the flip-chip film 51 and the electrode part 31; along the thickness direction of the display module 100, the silver paste 52 overlaps with the flip-chip film 51, the first adhesive layer 41 and the electrode part 31.

[0029] Specifically, along a direction parallel to the plane of the display module 100, one edge of the first adhesive layer 41 extends at least partially beyond the flip-chip film 51, and the electrode portion 31 extends at least partially beyond the edge of the first adhesive layer 41. The edges of the electrode portion 31, the first adhesive layer 41, and the flip-chip film 51 form a stepped shape within the opening 00. The silver paste 52 is conductive and connects to both the electrode portion 31 and the flip-chip film 51 along the thickness direction of the display module 100, forming a continuous and stable vertical conductive path. The silver paste 52 overlaps with the electrode portion 31 in the thickness direction of the display module 100, directly covering at least a portion of the surface of the electrode portion 31, which reduces contact resistance and improves the connection stability with the electrode portion 31. The silver paste 52 overlaps with the flip-chip film 51 in the thickness direction of the display module 100, directly covering at least a portion of the surface of the flip-chip film 51 and electrically connecting to the pins on its surface, which reduces open-circuit problems caused by pressure misalignment or pin lifting. Based on the first adhesive layer 41 fixing the electrode part 31 and the flip-chip film 51 into a stepped shape, the silver paste 52 overlaps with the flip-chip film 51, the first adhesive layer 41, and the electrode part 31. The silver paste 52 and the first adhesive layer 41 can work together to form a stable connection structure, ensuring effective conduction between the electrode part 31 and the device in the flip-chip film 51.

[0030] Furthermore, along a direction parallel to the plane where the display module 100 is located, one side edge of the first adhesive layer 41 extends at least partially beyond the edge of the flip-chip film 51. The silver paste 52 and the first adhesive layer 41 together form a sealing structure, which can effectively prevent water, oxygen, etc. from entering the bonding interface, reduce solder joint corrosion, and extend the life of the display module 100.

[0031] Thus, along the thickness direction of the display module 100, the silver paste 52 overlaps with the flip-chip film 51, the first adhesive layer 41, and the electrode part 31. The silver paste 52 electrically connects the devices in the electrode part 31 and the flip-chip film 51, forming a stable connection structure. This ensures effective conduction between the electrode part 31 and the devices in the flip-chip film 51, reducing water and oxygen intrusion while achieving a narrow bezel.

[0032] Please continue to refer to this. Figure 4 In a display module 100 provided in this disclosure, the bonding module 50 further includes ink 53. Along the thickness direction of the display module 100, the ink 53 is located on the surface of the silver paste 52 on the side away from the electrode portion 31, and at least a portion of the ink 53 abuts against the heat dissipation functional layer 40 at the edge of the opening 00.

[0033] Specifically, during the coating process, the surface or edges of the silver paste 52 are prone to burrs, excess adhesive, or exposed silver powder. The ink 53 covers the back and edges of the silver paste 52, which can be used to isolate moisture or acids and alkalis, reduce ion migration, and extend the service life of the silver paste 52. If the ink 53 is too thin, the burrs on the surface of the silver paste 52 may penetrate the ink 53, and the display module 100 may easily break down under high pressure or humid and hot environments, resulting in leakage or short circuit. When the display module 100 is subjected to external impact, the thin ink 53 cannot effectively dissipate the stress, and the stress may be further transferred to the silver paste 52, which may easily cause micro-cracks or broken lines in the silver paste 52. In this embodiment, along the direction parallel to the plane where the display module 100 is located, the edges of the electrode part 31, the first adhesive layer 41, and the flip-chip film 51 are stepped. When the ink 53 is coated, the display module 100 is inverted, and at this time the electrode part 31 is at the bottom of the step, and the liquid ink 53 tends to flow to the lower electrode part 31. In this embodiment, at least a portion of the ink 53 is positioned to abut against the heat dissipation functional layer 40 at the edge of the opening 00. The sidewall of the heat dissipation functional layer 40 at the opening 00 can act as a barrier to prevent the ink 53 from overflowing, and can also increase the effective thickness of the ink 53 to meet process requirements. Optionally, the thickness of the heat dissipation functional layer 40 can be increased, or the thickness of the first adhesive layer 41 can be decreased, to achieve the required ink 53 thickness. The above are merely examples, and this disclosure does not limit the scope of the invention.

[0034] The ink 53, with a certain thickness, possesses a degree of deformation capability, absorbing stress impacts and reducing stress transmission to the silver paste 52, thereby reducing the risk of peeling between the bonding modules 50. When the display module 100 is subjected to bending or vibration, the contact structure between the ink 53 and the heat dissipation functional layer 40 can limit the lateral displacement of the silver paste 52 and the flip-chip film 51, disperse interface stress, reduce the risk of cracking of the silver paste 52 or pin peeling, and improve the long-term reliability of the bonding structure. The ink 53, with a certain thickness, covering the surface of the silver paste 52, can form a dense protective layer, which can isolate moisture and corrosive gases from erosion of the silver paste 52 and solder joints, reduce the increase in contact resistance or open circuit caused by oxidation of the silver paste 52 or corrosion of solder joints, and improve the reliability of the display module 100.

[0035] Thus, the ink 53 is located on the surface of the silver paste 52 away from the electrode portion 31, and at least part of the ink 53 abuts against the heat dissipation functional layer 40 at the edge of the opening 00. The sidewall of the heat dissipation functional layer 40 can act as a barrier to reduce ink overflow and increase the effective thickness of the ink 53 to meet process requirements. It also restricts the lateral displacement of the silver paste 52 and the flip-chip film 51, improving the long-term reliability of the bonding structure.

[0036] Figure 5 The diagram shown is another structural schematic of the display module provided in this embodiment. Please refer to it. Figure 5In one optional embodiment provided in this disclosure, the display module 100 includes a protective adhesive 54, which is at least partially located inside the opening 00, and is disposed on the side of the ink 53 facing away from the silver paste 52.

[0037] Specifically, the protective adhesive 54 at least partially fills the interior of the opening 00 and covers the surface of the ink 53, which can limit the displacement or warping of the ink 53 and silver paste 52, reduce delamination or peeling at the interface of each film layer, and strengthen the bonding strength of the bonding structure. The protective adhesive 54 can also form a fully enclosed protection for the silver paste 52, ink 53 and bonding area, effectively blocking water, oxygen or dust from entering the bonding interface, reducing the oxidation of silver paste 52 or pin corrosion, and improving the weather resistance and service life of the display module 100.

[0038] Furthermore, the protective adhesive 54 can reduce the formation of an air insulation layer by filling the opening 00. The protective adhesive 54, ink 53, and silver paste 52 form a continuous heat conduction path, which can help conduct heat outward from the bonding area, improve local heat accumulation, alleviate the impact of high temperature on the bonding module 50, and ensure display stability.

[0039] Thus, by placing the protective adhesive 54 at least partially inside the opening 00 and on the side of the ink 53 facing away from the silver paste 52, the protective adhesive 54 can improve the protection of the bonding area, relieve impact stress, and reduce water and oxygen intrusion, while achieving a narrow bezel. It can also assist in heat transfer in the bonding area, reduce heat accumulation, and improve the stability and reliability of the display module 100.

[0040] Figure 6 The diagram shown is a schematic representation of another structure of the display module provided in this embodiment. Please refer to [the diagram]. Figure 6 In one optional embodiment provided by this disclosure, the cover plate 10 is located on the side of the display panel 30 facing away from the heat dissipation functional layer 40, and the cover plate 10 is bonded to the display panel 30 by optical adhesive 20. Optionally, the cover plate 10 can be a rigid cover plate, such as glass, sapphire, etc., or the cover plate 10 can also be a flexible cover plate, such as polyimide film, polyester film, etc. This disclosure does not limit the type of cover plate 10, and it can be selected according to actual needs. In order to facilitate positioning or reduce bumps to the edge of the display panel 30, the edge of the cover plate 10 extends at least partially beyond the edge of the display panel 30 in a direction parallel to the plane of the display module 100. The display module 100 includes a protective adhesive 54, which covers the sidewalls of the display panel 30 and the heat dissipation functional layer 40. Along the thickness direction of the display module 100, the protective adhesive 54 overlaps with the cover plate 10, and the protective adhesive 54 covers at least a portion of the surface of the cover plate 10 facing the display panel 30.

[0041] Specifically, the protective adhesive 54 forms a sealing barrier on the side of the display module 100, preventing water, oxygen, or corrosive media from intruding from the side gaps of the display module 100 and extending the product's service life. Unlike related technologies where the bonding area is located at the edge of the display panel 30, in the display module 100 provided in this disclosure, the bonding area is recessed into the display area, which can slow down the corrosion of the bonding module 50 by water, oxygen, etc., at the edge of the display module 100. Furthermore, this embodiment further provides the protective adhesive 54 on the sidewalls of the display panel 30 and the heat dissipation functional layer 40. The protective adhesive 54 covers at least a portion of the surface of the cover plate 10 facing the display panel 30, which can further reduce the impact of water and oxygen intrusion from the side of the display module 100 on the bonding area, thus improving the protection of the bonding module 50. This also reduces the selection requirements for the protective adhesive 54, helping to reduce costs and improve economic efficiency.

[0042] The protective adhesive 54 connects the cover plate 10, the display panel 30, and the heat dissipation functional layer 40 into one piece on the side. It can serve as a lateral limit to reduce the offset or misalignment of components during use or assembly. It can also improve the firmness of the connection between the components, reduce the impact and deformation stress caused by drops or collisions, and greatly improve the overall structural stability and resistance to mechanical damage of the module.

[0043] Thus, by covering the sidewalls of the display panel 30 and the heat dissipation functional layer 40 with the protective adhesive 54, and by overlapping the protective adhesive 54 with the cover plate 10 along the thickness direction of the display module 100, and by covering at least part of the surface of the cover plate 10 facing the display panel 30, water and oxygen intrusion can be further reduced by providing the protective adhesive 54 on the side of the display module 100, while mitigating water and oxygen corrosion in the bonding area.

[0044] Please continue to refer to this. Figure 6 In the display module 100 provided in this disclosure, the width L of the protective adhesive 54 along the direction parallel to the plane of the display module 100 is greater than or equal to 0.05 mm and less than or equal to 0.3 mm. Optionally, the width L of the protective adhesive 54 is greater than or equal to 0.1 mm and less than or equal to 0.3 mm, or the width L of the protective adhesive 54 is greater than or equal to 0.15 mm and less than or equal to 0.3 mm, or the width L of the protective adhesive 54 is greater than or equal to 0.2 mm and less than or equal to 0.3 mm, or the width L of the protective adhesive 54 is greater than or equal to 0.05 mm and less than or equal to 0.25 mm, or the width L of the protective adhesive 54 is greater than or equal to 0.05 mm and less than or equal to 0.2 mm, etc., etc., and is not listed here. It is sufficient that the width L of the protective adhesive 54 is within the range of greater than or equal to 0.05 mm and less than or equal to 0.3 mm.

[0045] If the width L of the protective adhesive 54 is less than 0.05mm, the protective adhesive 54 is too thin and has limited protective effect. If the width L of the protective adhesive 54 is greater than 0.3mm, the protective adhesive 54 is too thick and requires a large amount of adhesive, which may increase production costs; it may also cause the protective adhesive 54 to overflow, increasing the difficulty of subsequent cleaning.

[0046] Thus, by setting the width L of the protective adhesive 54 within the range of greater than or equal to 0.05 mm and less than or equal to 0.3 mm along the direction parallel to the plane where the display module 100 is located, the protective effect of the protective adhesive 54 can be guaranteed. This can reduce the weakening of the protective effect caused by insufficient width L, and also reduce the cost increase or overflow of the protective adhesive 54 caused by excessive width L.

[0047] Figure 7 The diagram shown is a cross-sectional view of another display module provided in this embodiment. Please refer to [the diagram]. Figure 7 In one optional embodiment provided in this disclosure, the display module 100 includes a protective adhesive 54, which is located on the side of the bonding module 50 away from the display panel 30, and the protective adhesive 54 fills the opening 00.

[0048] Specifically, the protective adhesive 54 fills the opening 00 and covers the bonding module 50, forming a sealed structure that prevents the intrusion of water, oxygen, or corrosive gases, reducing the failure of components in the bonding module 50 due to oxidation and corrosion, and improving the weather resistance of the bonding module 50. Compared to related technologies where the bonding area is located at the edge of the panel, requiring a large amount of sealant for protection and support, which may increase the width of the top cover's arc, hindering the achievement of a narrow bezel, the display module 100 provided in this disclosure has an inwardly recessed bonding area. This achieves a narrow bezel while reducing the impact of edge stress on the bonding module 50, and also reduces the corrosion of the bonding module 50 by water, oxygen, etc., intruding from the edge. Furthermore, this embodiment further reduces water and oxygen intrusion by filling the opening 00 with the protective adhesive 54 and covering the bonding module 50.

[0049] The protective adhesive 54 fills the opening 00, eliminating internal cavities in the display module 100 and smoothing the recessed area of ​​opening 00, resulting in a flat module surface that facilitates subsequent assembly and bonding processes. Simultaneously, it provides restraint in the bonding area, preventing component displacement and improving assembly accuracy and overall consistency. The protective adhesive 54 also absorbs stress generated by vibration or thermal expansion and contraction, reducing interlayer peeling or pin detachment and strengthening structural robustness. The adhesive has a certain degree of thermal conductivity, dissipating heat generated in the bonding area outwards, alleviating localized heat buildup, and ensuring stable operation of the drive circuit.

[0050] Thus, the protective adhesive 54 is located on the side of the bonding module 50 away from the display panel 30. The protective adhesive 54 fills the opening 00, which can improve the reliability of the bonding area while achieving a narrow bezel, further reduce the intrusion of water, oxygen and other substances, and improve the weather resistance of the bonding module 50.

[0051] It should be noted that the thickness of each component of module 100 shown in the accompanying drawings is for illustrative purposes only and does not represent its actual thickness. Figure 7 The protective adhesive 54 can be filled to be flush with the bottom of the heat dissipation functional layer 40, or it can be not flush with it; this disclosure does not limit this. When the protective adhesive 54 is flush with the bottom of the heat dissipation functional layer 40, the protective adhesive 54 can form an integrated structure with the heat dissipation functional layer 40, which is beneficial to improving the connection strength between the flip-chip film 51 and the display panel 30.

[0052] Please refer to Figures 3 to 7 In the display module 100 provided in this disclosure, the protective adhesive 54 includes at least one of epoxy polymer, polyurethane, polyimide, acrylic acid, and modified organic materials. Optionally, the protective adhesive 54 may include any one of epoxy polymer, polyurethane, polyimide, acrylic acid, and modified organic materials, or any two or three of epoxy polymer, polyurethane, polyimide, acrylic acid, and modified organic materials, etc. This disclosure does not limit this, and the specific design can be set according to actual needs.

[0053] Specifically, the bonding area in the display module 100 is recessed to overlap with the display area AA, but does not overlap with the edge of the display panel 30. Compared to the bonding area located at the edge of the display panel 30 in related technologies, which is more susceptible to water and oxygen intrusion, the bonding area in this disclosure is farther from the edge of the display panel 30. External moisture or oxygen needs to travel a longer path to corrode the bonding module 50, effectively mitigating the intrusion of water and oxygen. Because the distance between the bonding area and the edge of the display panel 30 is greater in this disclosure, the protection level of the protective adhesive 54 does not need to be overly stringent; the protection level requirement can be slightly reduced, increasing the range of selectable types.

[0054] Optionally, the selection of the protective adhesive 54 needs to consider factors such as glass transition temperature and coefficient of thermal expansion, and should be as close as possible to the film material of the polyester film. Epoxy polymers, polyurethanes, polyimides, and acrylic materials all possess good heat resistance and low-temperature resistance, and their coefficients of thermal expansion are highly compatible with those of the display panel 30 and the flip-chip film 51, which can suppress cracking or delamination caused by thermal expansion and contraction, ensuring the long-term stability of the protective structure. This type of protective adhesive 54 has good adhesion and can firmly bond to different interfaces such as glass, metal, and adhesive layers. The integrated protective structure formed after filling the opening 00 can buffer impacts or vibrations, effectively reducing pin detachment or displacement.

[0055] Polyurethane and acrylic materials possess excellent toughness, while epoxy polymers and polyimide materials exhibit outstanding rigidity. Protective adhesive 54 includes one or more of these materials; the combination or selection of multiple materials allows for adjustment of hardness and elasticity as needed. It can both shape and limit movement, and absorb deformation stress, adapting to different structural forms and operating conditions. Viscosity or curing rate can also be adjusted as needed, with flowability suitable for filling openings, fully wetting gaps, eliminating air bubbles, and reducing process defects.

[0056] Optionally, the water vapor transmission rate of the protective adhesive 54 in this disclosure may be less than or equal to 14.08 g•mil / (100in). 2 •day), by placing the bonding area away from the edge of the display panel 30, the bonding module 50 can be slowed down by water and oxygen corrosion. Furthermore, the moisture permeability of the protective adhesive 54 is set to be less than or equal to 14.08 g•mil / (100in). 2 •days) below, can further slow down water and oxygen intrusion and improve the protective effect.

[0057] Thus, by setting the protective adhesive 54 to include at least one of epoxy polymers, polyurethanes, polyimides, acrylics, and modified organics, a variety of different options can be provided to meet different production or usage needs.

[0058] Figure 8 The diagram shown is a schematic representation of another structure of the display module provided in this embodiment. Please refer to [the diagram]. Figure 8 In one optional embodiment provided by this disclosure, the display module 100 further includes a first heat dissipation functional layer 55, which is disposed within the opening 00 and located on the side of the bonding module 50 facing the display panel 30.

[0059] Specifically, after the opening 00 is provided on the heat dissipation functional layer 40, since the opening 00 penetrates the heat dissipation functional layer 40, the bonding module 50 within the opening 00 may not be able to dissipate heat in time. In this embodiment, a first heat dissipation functional layer 55 is provided inside the opening 00 between the bonding module 50 and the display module 100. The first heat dissipation functional layer 55 is adjacent to the heat-generating electrode part 31, silver paste 52 and flip-chip film 51, which can quickly dissipate the heat generated by the driving operation, reduce the accumulation of heat in the bonding area, and reduce the aging of conductive materials or the increase in contact resistance caused by high temperature. The timely heat dissipation of the bonding area within the opening 00 by the first heat dissipation functional layer 55 can also balance the temperature distribution in the opening 00 area, reduce the temperature difference between different components, alleviate the interface stress caused by uneven heating and cooling, thermal expansion and contraction, effectively reduce interlayer cracking or electrode detachment, and improve the reliability of the bonding area.

[0060] The first heat dissipation functional layer 55 is built into the opening 00, eliminating the need to add heat dissipation components outside the opening 00 or outside the display module 100. This does not increase the thickness of the display module 100, and does not occupy the frame and assembly space. It adapts to the design requirements of the display module 100 to be thinner and narrower with a narrower bezel, resulting in a more compact structure.

[0061] Thus, by placing the first heat dissipation functional layer 55 inside the opening 00, and with the first heat dissipation functional layer 55 located on the side of the bonding module 50 facing the display panel 30, the heat dissipation capacity of the bonding area can be effectively improved, heat accumulation can be reduced, and the design requirements of the display module 100 for thinness and narrow bezels can also be met.

[0062] Figure 9 The diagram shown is a schematic representation of another structure of the display module provided in this embodiment. Please refer to [the diagram]. Figure 9 In one optional embodiment provided in this disclosure, the display module 100 further includes an electromagnetic shielding layer 56, which is disposed within the opening 00 and located on the side of the bonding module 50 facing the display panel 30. Optionally, only the electromagnetic shielding layer 56 may be provided on the side of the bonding module 50 facing the display panel 30; alternatively, both the electromagnetic shielding layer 56 and the first heat dissipation functional layer 55 may be provided on the side of the bonding module 50 facing the display panel 30. Figure 9 The example shown is only an illustration of setting an electromagnetic shielding layer 56 between the binding module 50 and the display panel 30; this disclosure does not limit this.

[0063] Specifically, the devices on the flip-chip film 51 generate high-frequency signals during operation. An electromagnetic shielding layer 56 is disposed within the opening 00 along the thickness direction of the display module 100, located between the flip-chip film 51 and the electrode portion 31 of the display panel 30. This reduces interference from the high-frequency signals on the flip-chip film 51 to the display signals, improving signal integrity and transmission stability. The electromagnetic shielding layer 56 is integrated into the opening 00 of the heat dissipation functional layer 40, eliminating the need to occupy space outside the opening 00, which is beneficial for the design trend of a thinner and lighter display module 100 with narrower bezels.

[0064] Thus, by placing the electromagnetic shielding layer 56 inside the opening 00, and with the electromagnetic shielding layer 56 located on the side of the bonding module 50 facing the display panel 30, the interference of high-frequency signals on the flip-chip film 51 on the display signal can be reduced, thereby improving signal integrity and transmission stability. It does not require occupying space outside the opening 00, which is beneficial for the thinner and lighter design of the display module 100 and the narrow bezel design.

[0065] Similarly, Figure 8 and Figure 9 In some embodiments, a protective adhesive 54 may also be provided to further reduce water and oxygen intrusion. Optionally, the protective adhesive 54 may be as follows: Figure 5The image shows only the side of ink 53 facing away from silver paste 52; or, as shown... Figure 6 As shown, the protective adhesive 54 can cover the sidewalls of the display panel 30 and the heat dissipation functional layer 40, and overlap with at least a portion of the surface of the cover plate 10 facing the display panel 30; or, as shown... Figure 7 As shown, the protective adhesive 54 can fill the opening 00, and the protective adhesive 54 can be flush with or not flush with the bottom of the heat dissipation functional layer 40. Figure 8 and Figure 9 The illustration is based solely on the example of display module 100 excluding protective adhesive 54, and this disclosure does not limit this aspect.

[0066] Figure 10 The diagram shown is a planar schematic of a heat dissipation functional layer provided in an embodiment of this disclosure. Please refer to it. Figures 3 to 10 In a display module 100 provided in this disclosure, along the thickness direction of the display module 100, the width H1 of the opening 00 is greater than or equal to 1 mm and less than or equal to 5 mm, and the length L1 of the opening 00 is greater than or equal to 30 mm and less than or equal to 65 mm. Optionally, the width H1 of the opening 00 is greater than or equal to 2 mm and less than or equal to 5 mm, and the length L1 of the opening 00 is greater than or equal to 35 mm and less than or equal to 60 mm; or, the width H1 of the opening 00 is greater than or equal to 3 mm and less than or equal to 5 mm, and the length L1 of the opening 00 is greater than or equal to 40 mm and less than or equal to 55 mm; or, the width H1 of the opening 00 is greater than or equal to 4 mm and less than or equal to 5 mm, and the length L1 of the opening 00 is greater than or equal to 45 mm and less than or equal to 50 mm, etc., and so on. The size of the opening 00 can be adjusted according to the actual size of the display panel 30, and this disclosure does not limit the specific size of the opening 00.

[0067] If the width H1 of opening 00 is greater than 5mm and the length L1 of opening 00 is greater than 65mm, the size of opening 00 is too large, and the cut-out area within the heat dissipation functional layer 40 is large, which may lead to a decrease in heat dissipation effect and heat accumulation within the display module 100. Furthermore, the presence of a large cavity within opening 00 results in poor overall sealing and an inability to effectively prevent the intrusion of water, oxygen, etc. If the width H1 of opening 00 is less than 1mm and the length L1 of opening 00 is less than 30mm, the size of opening 00 is too small, and the cut-out area within the heat dissipation functional layer 40 is small. This may prevent the complete exposure of the electrode portion 31, leading to ineffective connection or poor connection reliability between the flip-chip film 51 and the electrode portion 31. A smaller opening 00 also increases alignment difficulty and reduces production yield.

[0068] Therefore, by setting the width H1 of the opening 00 to be greater than or equal to 1 mm and less than or equal to 5 mm, and the length L1 of the opening 00 to be greater than or equal to 30 mm and less than or equal to 65 mm along the thickness direction of the display module 100, sufficient bonding space can be provided for the bonding module 50 while ensuring the heat dissipation effect of the heat dissipation functional layer 40, thereby improving the bonding reliability. It can also reduce the cavity inside the opening 00 and improve the overall sealing performance.

[0069] Please continue to refer to this. Figure 4 In the display module 100 provided in this disclosure, the distance between the opening 00 and the edge of the nearest display panel 30 is L, where L is greater than or equal to 2mm and less than or equal to 5mm. Optionally, L may be greater than or equal to 2.5mm and less than or equal to 4.5mm, or L may be greater than or equal to 3mm and less than or equal to 4mm, or L may be greater than or equal to 3.5mm and less than or equal to 4mm, etc., etc., which are not listed here. It is sufficient that the distance L between the opening 00 and the edge of the nearest display panel 30 is within the range of greater than or equal to 2mm and less than or equal to 5mm.

[0070] If L is less than 2mm, the distance L between the opening 00 and the edge of the nearest display panel 30 is too small. The opening 00 is almost located at the edge of the display panel 30, and the bonding module 50, which is at least partially located within the opening 00, is also almost located at the edge of the display panel 30. The structure of the bonding module 50 is complex and easily deformed or broken under lateral stress impact, reducing bonding reliability. If the distance L between the opening 00 and the edge of the nearest display panel 30 is too small, the water and oxygen intrusion path is shortened, and the corrosion resistance of the bonding module 50 is poor. If the distance L between the opening 00 and the edge of the display panel 30 is small, the structure at the bottom edge of the display module 100 is uneven, which cannot meet the overall assembly requirements and may require additional potting. If L is greater than 5mm, the distance L between the opening 00 and the edge of the nearest display panel 30 is too large. The bonding area is shifted towards the center of the display panel 30, which may affect the overall clearance and increase the lateral dimension of the non-display area in the display panel 30. The bonding module 50 is the main heat source. After the opening 00 is far away from the edge of the panel, the heat needs to take a longer path to be conducted to the heat dissipation structure on the side of the display panel 30, which reduces the heat dissipation efficiency and shortens the service life of the device.

[0071] Thus, the distance L between the opening 00 and the edge of the nearest display panel 30 is within the range of 2mm or more and 5mm or less, which allows the binding area to be set within a reasonable range, making the display module 100 have a flat structure around it and meeting the assembly requirements of the whole machine.

[0072] Figure 11The diagram shown is a schematic representation of another structure of the display module provided in this embodiment. Please refer to [the diagram]. Figure 11 In a display module 100 provided in this disclosure, the heat dissipation functional layer 40 includes a metal layer 44, a foam layer 43 and a second adhesive layer 42. The foam layer 43 is located between the second adhesive layer 42 and the metal layer 44, and the second adhesive layer 42 is located on the side of the foam layer 43 facing the display panel 30.

[0073] Specifically, the second adhesive layer 42 serves as an adhesive medium, bonding the display panel 30 and the foam layer 43 together to firmly integrate the components of the heat dissipation layer 40 and the display panel 30, reducing issues such as interlayer slippage or edge lifting, and adapting to long-term operating conditions. The foam layer 43 possesses elasticity and deformation capability, absorbing mechanical impacts from vibrations or collisions, while buffering the internal stress generated by thermal expansion and contraction of the display panel 30 and the metal layer 44, significantly improving the fatigue resistance and deformation resistance of the display module 100. The metal layer 44 has a high thermal conductivity, allowing for rapid collection and diffusion of heat generated by the display panel 30; the foam layer 43 and the second adhesive layer 42 have good thermal conductivity, creating a continuous heat conduction path between the display panel 30 and the metal layer 44, enabling heat transfer layer by layer, effectively reducing local temperature rise in the bonding area, and minimizing aging of conductive materials and circuit failures caused by high temperatures.

[0074] Optionally, the heat dissipation functional layer 40 in this disclosure is preferably made of a waterproof material with low water absorption, such as epoxy, polyurethane, silicone gel, or related modified materials. This disclosure does not limit the material of the heat dissipation functional layer 40, as long as it meets the performance requirements of waterproofing and low water absorption. For example, the water vapor transmission rate of the heat dissipation functional layer 40 is less than or equal to 14.08 g•mil / (100in). 2 •day); Optionally, the water vapor permeability of the heat dissipation functional layer 40 is less than or equal to 13 g•mil / (100in 2 •day), or less than or equal to 12g•mil / (100in 2 •day), or less than or equal to 11g•mil / (100in 2 •day)……etc., the above are just examples, and this disclosure does not limit them.

[0075] The heat dissipation functional layer 40 includes a metal layer 44, a foam layer 43, and a second adhesive layer 42. Correspondingly, the metal layer 44, the foam layer 43, and the second adhesive layer 42 are preferably made of waterproof and low water absorption materials. This can reduce the intrusion of water and oxygen into the devices in the display module 100 from the side wall or bottom of the heat dissipation functional layer 40 while meeting the heat dissipation function, thereby improving the corrosion resistance.

[0076] Figure 12 The figure shown is a plan view of a display device provided in an embodiment of this disclosure. Please refer to it. Figure 12 This disclosure provides a display device 200, including the display module 100 as described above. The display device 200 provided in this disclosure can be any electronic device with display functionality, such as a touch screen, mobile phone, tablet computer, laptop computer, e-reader, or television. The display device 200 provided in this disclosure has the beneficial effects of the display module 100 provided in this disclosure. For details, please refer to the specific descriptions of the display module 100 in the above embodiments; these will not be repeated here.

[0077] Understandable Figure 12 The shape of the display device 200 is illustrated using only a right-angled rectangle structure as an example. In some other embodiments of this disclosure, the display device 200 may also be circular, elliptical or any other feasible shape, and this disclosure does not specifically limit it in this regard.

[0078] Figure 13 As shown Figure 12 Please refer to the schematic diagram of a cross-section along the B-B' direction. Figure 12 and Figure 13 In one optional embodiment provided by this disclosure, the display device 200 includes a middle frame 70 and a third adhesive layer 60. The middle frame 70 includes a receiving cavity, and the display module 100 is bonded to the receiving cavity by the third adhesive layer 60. Along the thickness direction of the display device 200, the third adhesive layer 60 does not overlap with the opening 00.

[0079] Specifically, the third adhesive layer 60 does not overlap with the opening 00. That is, the area in the heat dissipation functional layer 40 that is bonded to the third adhesive layer 60 does not have an opening 00, making it relatively flat. This meets the assembly requirements of the entire unit and the bonding requirements of the third adhesive layer 60, improving assembly yield. The mechanical stress generated during the assembly of the mid-frame 70 or during a drop of the entire unit will be transmitted to the display module 100 through the third adhesive layer 60. The staggered arrangement of the third adhesive layer 60 and the opening 00 can prevent external forces from directly acting on precision bonding parts such as the flip-chip film 51 or the electrode part 31, effectively improving the long-term reliability of the bonding module 50. The bonding area in the opening 00 has a higher operating temperature and greater deformation. By avoiding this area, the third adhesive layer 60 can reduce thermal deformation and improve the overall bonding strength.

[0080] Thus, along the thickness direction of the display device, the third adhesive layer 60 does not overlap with the opening 00, which can meet the bonding requirements of the whole assembly and the third adhesive layer 60, and improve the assembly yield; it can also reduce the transmission of external stress to the bonding area and improve the long-term reliability of the display module 100.

[0081] Figure 14 The diagram shown is a process flow chart of a display module provided in an embodiment of this disclosure. Please refer to it. Figures 3 to 14This disclosure also provides a method for manufacturing a display module 100, which is used to manufacture the display module 100 as described above, including: S1, making an opening 00 in the heat dissipation functional layer 40; S2, attaching the heat dissipation functional layer 40 after the opening 00 to the non-light-emitting surface of the display panel 30, with the opening 00 overlapping the display area of ​​the display panel 30 along the thickness direction of the display panel 30; S3, laser ablation of the display panel 30 exposed by the opening 00 to expose the electrode portion 31; S4, attaching a flip-chip film 51 to the electrode portion 31, and applying silver paste 52 to connect the terminals of the electrode portion 31 and the terminals of the flip-chip film 51; S5, applying ink 53 to the silver paste 52, and sintering the ink 53 using laser or intense pulsed light. Furthermore, a protective adhesive 54 can be applied to the side of the ink 53 facing away from the silver paste 52, or a protective adhesive 54 can be applied to the side of the flip-chip film 51 facing away from the display panel 30 to fill the opening 00, or a protective adhesive 54 can be applied to the sidewalls of the display panel 30 and the heat dissipation functional layer 40. The protective adhesive 54 overlaps with the cover plate 10 in the thickness direction of the display panel 30 and covers at least part of the cover plate 10. It should be noted that the protective adhesive 54 at the above different locations can be simultaneously provided in the same display module 100, or provided at any two of the above three locations. This disclosure does not limit this. When protective adhesive 54 is provided on the sidewalls of the display panel 30, inside the opening 00, and on the side of the ink 53 facing away from the silver paste 52, the resistance of the display module 100 to water and oxygen intrusion can be further improved. Since the display module 100 no longer has a bending area, and the binding module 50, which is at least partially located in the opening 00, is far from the edge of the display panel 30, the width of the protective adhesive 54 on the side wall of the display panel 30 can be set relatively small while extending the water and oxygen intrusion path, which can reduce the change in the arc top width and is conducive to the realization of a narrow bezel.

[0082] The above description is merely a specific embodiment of this disclosure, enabling those skilled in the art to understand or implement it. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not to be limited to the embodiments described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display module, characterized by include: The display panel, the heat dissipation functional layer, and the bonding module are provided. The heat dissipation functional layer is located on the non-light-emitting side of the display panel and includes an opening. The bonding module is at least partially located in the opening and is bonded to the display panel. The display panel includes a display area, and along the thickness direction of the display module, the opening overlaps with the display area, but the opening does not overlap with the edge of the display panel.

2. The display module of claim 1, wherein, The display panel includes an electrode portion, and the opening exposes the electrode portion along the thickness direction of the display panel. The electrode portion is connected to the bonding module.

3. The display module of claim 2, wherein the display module is configured to be mounted to a display module mounting surface of a display module mounting structure. The bonding module includes a flip-chip film, and the display module further includes a first adhesive layer. The flip-chip film is located on the side of the first adhesive layer away from the electrode portion. Along a direction parallel to the plane where the display panel is located, one edge of the first adhesive layer at least partially extends beyond the edge of the flip-chip film.

4. The display module as described in claim 3, characterized in that, The bonding module includes silver paste, which is used to connect the flip-chip film and the electrode portion; Along the thickness direction of the display module, the silver paste overlaps with the flip-chip film, the first adhesive layer, and the electrode portion.

5. The display module as described in claim 4, characterized in that, The bonding module also includes ink, which is located on the surface of the silver paste on the side opposite to the electrode portion, and at least a portion of the ink abuts against the heat dissipation functional layer at the edge of the opening.

6. The display module as described in claim 5, characterized in that, The display module includes a protective adhesive, which is at least partially located inside the opening and is disposed on the side of the ink facing away from the silver paste.

7. The display module as described in claim 1, characterized in that, The display module includes a cover plate, which is located on the side of the display panel away from the heat dissipation functional layer. The display module includes a protective adhesive that covers the sidewalls of the display panel and the heat dissipation functional layer. Along the thickness direction of the display module, the protective adhesive overlaps with the cover plate, and the protective adhesive covers at least a portion of the surface of the cover plate facing the display panel.

8. The display module as described in claim 7, characterized in that, Along a direction parallel to the plane where the display module is located, the width of the protective adhesive is greater than or equal to 0.05 mm and less than or equal to 0.3 mm.

9. The display module as described in claim 1, characterized in that, The display module includes a protective adhesive located on the side of the bonding module opposite to the display panel, and the protective adhesive fills the opening.

10. The display module as described in any one of claims 7-9, characterized in that, The protective adhesive includes at least one of epoxy polymer, polyurethane, polyimide, acrylic acid, and modified organic compounds.

11. The display module as described in claim 1, characterized in that, The display module further includes a first heat dissipation layer, which is disposed within the opening and located on the side of the bonding module facing the display panel.

12. The display module as described in claim 1, characterized in that, The display module further includes an electromagnetic shielding layer disposed within the opening, and the electromagnetic shielding layer is located on the side of the bonding module facing the display panel.

13. The display module as described in claim 1, characterized in that, Along the thickness direction of the display module, the width of the opening is greater than or equal to 1 mm and less than or equal to 5 mm, and the length of the opening is greater than or equal to 30 mm and less than or equal to 65 mm.

14. The display module as described in claim 1, characterized in that, The distance between the opening and the edge of the nearest side of the display panel is L, where L is greater than or equal to 2 mm and less than or equal to 5 mm.

15. The display module as described in claim 1, characterized in that, The heat dissipation functional layer includes a metal layer, a foam layer, and a second adhesive layer. The foam layer is located between the second adhesive layer and the metal layer, and the second adhesive layer is located on the side of the foam layer facing the display panel.

16. A display device, characterized in that, Includes the display module as described in any one of claims 1-15.

17. The display device as claimed in claim 16, characterized in that, The display device includes a middle frame and a third adhesive layer. The middle frame includes a receiving cavity, and the display module is bonded to the receiving cavity by the third adhesive layer. Along the thickness direction of the display device, the third adhesive layer does not overlap with the opening.

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