Temperature compensation circuit and chip, electronic device and display device

By employing a combination of timing control module, memory, and temperature compensation calculation module in an OLED display, time-division multiplexing temperature compensation for color channels is achieved, solving the problems of increased hardware resource consumption and power consumption, reducing chip area and power consumption, and improving system efficiency.

CN122493779APending Publication Date: 2026-07-31CHIPONE TECHNOLOGY (BEIJING) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
CHIPONE TECHNOLOGY (BEIJING) CO LTD
Filing Date
2026-06-08
Publication Date
2026-07-31

AI Technical Summary

Technical Problem

Existing OLED displays require independent circuitry and memory for each color channel during temperature compensation, leading to increased hardware resource consumption, larger chip area, and higher power consumption. Furthermore, this negatively impacts chip lifespan under high frequency or high load conditions.

Method used

By combining a timing control module, multiple memories, and a temperature compensation calculation module, and by sharing a single temperature compensation calculation module and configuring an independent memory for each color channel, time-division multiplexing of temperature compensation calculation is achieved, reducing circuit redundancy.

Benefits of technology

It significantly reduces chip area and power consumption, improves system efficiency, reduces manufacturing costs, and extends chip lifespan.

✦ Generated by Eureka AI based on patent content.

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Abstract

This disclosure relates to a temperature compensation circuit and chip, electronic device, and display device, comprising: a timing control module, multiple memories, and a temperature compensation calculation module; the timing control module is used to generate timing control signals based on the current ambient temperature, the timing control signals including state control signals and multiple read control signals, the state control signals being used to control a state machine to switch states; the multiple memories are used to store basic temperature compensation data for multiple color channels respectively, and in response to the read control signals, output basic temperature compensation data for different color channels corresponding to the current ambient temperature; the temperature compensation calculation module is used to receive the basic temperature compensation data corresponding to the current ambient temperature, and calculate, in a time-division manner, the target temperature compensation data corresponding to the basic temperature compensation data for different color channels at the current ambient temperature based on the state of the state machine. By using the circuit of the embodiments of this disclosure, circuit redundancy is reduced, and the chip area is significantly reduced.
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Description

Technical Field

[0001] This disclosure relates to the field of displays, and more particularly to a temperature compensation circuit and chip, electronic equipment, and display device. Background Technology

[0002] Organic light-emitting diode (OLED) displays are widely used in various environments, including indoor, outdoor, and extreme climate conditions. The color accuracy of OLEDs largely depends on the light-emitting characteristics of individual sub-pixels (red, green, and blue). As temperature rises or falls, the luminous efficiency, color saturation, and brightness of OLEDs can change. Temperature compensation ensures consistent display performance across different operating environments, thus avoiding color distortion and uneven brightness.

[0003] In the temperature compensation process for the three color channels of RGB (Red, Green, Blue) color mode, each channel (red, green, and blue) requires independent parameter adjustment. Related technologies necessitate configuring independent circuitry and memory for each channel, consuming more hardware resources, significantly increasing chip area, raising manufacturing costs, and requiring more complex packaging designs. Furthermore, due to the parallel processing characteristics of the RGB channels, overall power consumption increases significantly, especially under high frequency or high load conditions, negatively impacting chip lifespan. Summary of the Invention

[0004] In view of this, the present disclosure provides a temperature compensation circuit and chip, electronic device and display device.

[0005] According to one aspect of this disclosure, a temperature compensation circuit is provided, the circuit comprising: a timing control module, multiple memories, and a temperature compensation calculation module; the timing control module is connected to the multiple memories; the multiple memories are connected to the temperature compensation calculation module; wherein: the timing control module is used to generate a timing control signal based on the current ambient temperature, the timing control signal including a state control signal and multiple read control signals, the state control signal being used to control a state machine to perform state switching; the multiple memories are used to store basic temperature compensation data for multiple color channels respectively, and in response to the read control signals, output basic temperature compensation data for different color channels corresponding to the current ambient temperature; the temperature compensation calculation module is used to receive the basic temperature compensation data corresponding to the current ambient temperature, and calculate, in a time-division manner, target temperature compensation data corresponding to the basic temperature compensation data for different color channels at the current ambient temperature according to the state of the state machine.

[0006] In one possible implementation, the timing control module is further configured to receive the current ambient temperature; the read control signal includes a chip select signal and an address signal, wherein: the chip select signal is configured to select a target memory from the plurality of memories; and the address signal is configured to determine the storage unit in the target memory that stores the base temperature compensation data corresponding to the current ambient temperature.

[0007] In one possible implementation, the color channels include a red channel, a green channel, and a blue channel; the timing control module is used to control the state machine to switch states through the timing control signal, so as to trigger the calculation of target temperature compensation data for the red channel, green channel, and blue channel respectively.

[0008] In one possible implementation, each color channel corresponds to four basic temperature compensation data. The temperature compensation calculation module is used to perform a first operation on the two received basic temperature compensation data in response to the state machine switching to the first state corresponding to the current color channel during the calculation of the target temperature compensation data for the current color channel; and to receive two more basic temperature compensation data during the first operation. In response to the state machine switching to the second state corresponding to the current color channel, a second operation is performed on the two more basic temperature compensation data. In response to the state machine switching to the third state corresponding to the current color channel, a third operation is performed based on the results of the first and second operations to obtain the target temperature compensation data for the current color channel.

[0009] In one possible implementation, the temperature compensation calculation module is used to receive two basic temperature compensation data for the next color channel during the third calculation when the current color channel is not the last color channel.

[0010] In one possible implementation, the temperature compensation calculation module is used to perform interpolation calculations on the results of the first calculation and the results of the second calculation to obtain the target temperature compensation data corresponding to the current color channel.

[0011] According to another aspect of this disclosure, a chip is provided that includes the temperature compensation circuit described above.

[0012] According to one aspect of this disclosure, an electronic device is provided, including the temperature compensation circuit described above.

[0013] According to one aspect of this disclosure, a display device is provided, including a plurality of display units and at least one of the temperature compensation circuits provided in this disclosure.

[0014] In one possible implementation, the display unit includes a display panel, which includes at least one of a liquid crystal display panel, a micro light-emitting diode display panel, a light-emitting diode display panel, a mini light-emitting diode display panel, a quantum dot light-emitting diode display panel, an organic light-emitting diode display panel, a cathode ray tube display panel, a digital light processing display panel, a field emission display panel, a plasma display panel, an electrophoretic display panel, an electrowetting display panel, and a small-pitch display panel.

[0015] According to another aspect of this disclosure, an electronic device is provided, including the display device described above.

[0016] The temperature compensation circuit provided in this embodiment includes a timing control module, multiple memories, and a temperature compensation calculation module. The timing control module is connected to the multiple memories, and the multiple memories are connected to the temperature compensation calculation module. The timing control module generates timing control signals based on the current ambient temperature. These timing control signals include a state control signal and multiple read control signals. The state control signal controls a state machine to switch states. The multiple memories store basic temperature compensation data for multiple color channels and, in response to the read control signals, output basic temperature compensation data for different color channels corresponding to the current ambient temperature. The temperature compensation calculation module receives the basic temperature compensation data corresponding to the current ambient temperature and, based on the state of the state machine, calculates, in a time-division manner, the target temperature compensation data corresponding to the basic temperature compensation data for different color channels at the current ambient temperature. By using the circuit of this embodiment, all color channels share a single temperature compensation calculation module, reducing circuit redundancy and significantly reducing chip area.

[0017] In this embodiment of the disclosure, by configuring an independent memory for each color channel to store the basic compensation data of each channel separately, and by using time-division multiplexing of a single temperature compensation calculation module, multiple color channels can share the same temperature compensation calculation module. This ensures that the basic temperature compensation data of each channel is stored independently and does not interfere with each other, while avoiding setting up a separate temperature compensation calculation module for each channel. This significantly reduces chip area, manufacturing costs, and circuit power consumption. Attached Figure Description

[0018] The accompanying drawings, which are included in and form part of this specification, illustrate exemplary embodiments, features, and aspects of this disclosure together with the specification and serve to explain the principles of this disclosure.

[0019] Figure 1 A block diagram of a temperature compensation circuit according to an embodiment of the present disclosure is shown.

[0020] Figure 2 A schematic diagram of an optical temperature compensation architecture according to an embodiment of the present disclosure is shown.

[0021] Figure 3 A schematic diagram showing the timing of a temperature compensation circuit according to an embodiment of the present disclosure is provided. Detailed Implementation

[0022] Various exemplary embodiments, features, and aspects of this disclosure will now be described in detail with reference to the accompanying drawings. The same reference numerals in the drawings denote elements that have the same or similar functions. Although various aspects of the embodiments are shown in the drawings, they are not necessarily drawn to scale unless specifically indicated otherwise.

[0023] As used herein, the terms “comprising,” “including,” “having,” or variations thereof are open-ended and include one or more of the stated features, integrals, elements, steps, components, or functions, but do not exclude the presence or addition of one or more other features, integrals, elements, steps, components, functions, or groups thereof.

[0024] When an element is referred to as “connected,” “coupled,” “responding,” or a variation thereof relative to another element, it may be directly connected, coupled, or responding to another element, or there may be an intermediate element present.

[0025] Although the terms first, second, third, etc., may be used herein to describe various elements / operations, these elements / operations should not be limited by these terms. These terms are only used to distinguish one element / operation from another. Therefore, without departing from the teachings of the inventive concept, a first element / operation in some embodiments may be referred to as a second element / operation in other embodiments.

[0026] The term “exemplary” as used herein means “serving as an example, embodiment, or illustration.” Any embodiment illustrated herein as “exemplary” is not necessarily to be construed as superior to or better than other embodiments.

[0027] Furthermore, to better illustrate this disclosure, numerous specific details are set forth in the following detailed description. Those skilled in the art will understand that this disclosure can be practiced without certain specific details. In some instances, methods, means, components, and circuits well known to those skilled in the art have not been described in detail in order to highlight the main points of this disclosure.

[0028] It should be noted that the information (including but not limited to user device information, user personal information, etc.), data (including but not limited to data used for analysis, data stored, data displayed, etc.) and signals involved in this application are all authorized by the user or fully authorized by all parties, and the collection, use and processing of related data must comply with the relevant laws, regulations and standards of the relevant regions.

[0029] Figure 1 A block diagram of a temperature compensation circuit according to an embodiment of the present disclosure is shown. Figure 1 As shown, the temperature compensation circuit 20 includes:

[0030] The system comprises a timing control module 21, multiple memories 22, and a temperature compensation calculation module 23. The timing control module is connected to the multiple memories, and the multiple memories are connected to the temperature compensation calculation module. The timing control module generates timing control signals based on the current ambient temperature. These timing control signals include a state control signal and multiple read control signals. The state control signal controls a state machine 24 to switch states. The multiple memories store basic temperature compensation data for multiple color channels and, in response to the read control signals, output basic temperature compensation data for different color channels corresponding to the current ambient temperature. The temperature compensation calculation module receives the basic temperature compensation data corresponding to the current ambient temperature and, based on the state of the state machine, calculates, in a time-division manner, the target temperature compensation data corresponding to the basic temperature compensation data for different color channels at the current ambient temperature. By using the circuit of this embodiment, all color channels share a single temperature compensation calculation module, reducing circuit redundancy and significantly reducing chip area.

[0031] The memory can be static random-access memory (SRAM). Multiple SRAMs can store the base temperature compensation data for multiple color channels respectively, and each SRAM can store the base temperature compensation data for one color channel.

[0032] A Finite State Machine (FSM) can consist of a state register and combinational logic circuits. It can transition between pre-defined states based on control signals. A timing control module can generate timing control signals to control the state machine to switch states. The timing control module can also include a state machine. In this case, the timing control module can be connected to a temperature compensation calculation module.

[0033] The timing control module can also be used to control the output of corresponding basic temperature compensation data of the multiple memories through multiple read control signals.

[0034] Specifically, the timing control module can generate multiple read control signals based on the current ambient temperature to control multiple memories respectively. Specifically, the timing control signal can generate one read control signal for each memory, meaning each read control signal can control one memory. During temperature compensation, the timing control module can first pull the first read control signal high to control the first memory to output the baseline temperature compensation data for the current ambient temperature. After the baseline temperature compensation data stored in the first memory is read, the first read control signal can be pulled low, and then the second read control signal can be pulled high to continue reading the baseline temperature compensation data stored in the second memory. This process is repeated until the baseline temperature compensation data for all color channels is read.

[0035] The temperature compensation calculation module can receive the basic temperature compensation data of the ambient temperature sequentially output by multiple memories under the action of the corresponding read control signals, and calculate the target temperature compensation data of different color channels under the current ambient temperature based on the state machine state switching and the basic temperature compensation data.

[0036] In one possible implementation, the timing control module is further configured to receive the current ambient temperature; the read control signal includes a chip select signal and an address signal, wherein: the chip select signal is configured to select a target memory from the plurality of memories; and the address signal is configured to determine the storage unit in the target memory that stores the base temperature compensation data corresponding to the current ambient temperature.

[0037] Each read control signal may include a chip select signal and an address signal. The chip select signal is used to select a target memory from a plurality of memories, and the address signal is used to locate a specific memory cell within the target memory that stores the base temperature compensation data. When the chip select signal is active, only the selected memory will respond to the read operation and output the base temperature compensation data corresponding to that address according to the address signal.

[0038] The current ambient temperature determines the storage address of the baseline temperature compensation data to be read in the memory. The timing control module can generate a corresponding address signal based on the received current ambient temperature, and send the read control signal composed of this address signal and the chip select signal to the memory, thereby reading the baseline compensation data that matches the ambient temperature from the memory.

[0039] In this embodiment of the disclosure, different memories are selected sequentially by multiple read control signals, and the basic temperature compensation data stored in each memory is output and sent to the same temperature compensation calculation module for compensation calculation in a time-sharing manner. This ensures that each color channel independently stores compensation parameters while realizing the sharing of computing hardware resources.

[0040] In one possible implementation, the color channels include a red channel, a green channel, and a blue channel; the timing control module is used to control the state machine to switch states through the timing control signal, so as to trigger the calculation of target temperature compensation data for the red channel, green channel, and blue channel respectively.

[0041] In this embodiment, temperature compensation can be performed on three channels of the RGB color mode, namely, the color channels can include a red channel, a green channel, and a blue channel. The timing control module can control the state machine to switch states through timing control signals. The state machine can control the calculation operations of each color channel. That is, when the state of the state machine changes, the temperature compensation calculation module can perform the corresponding calculation.

[0042] The state machine can sequentially enter different states based on timing control signals. The state machine can have an initial waiting state (WAIT) and multiple corresponding states where the temperature compensation calculation module performs its calculations. When the state machine switches from one state to another, the temperature compensation calculation module can perform the corresponding calculations.

[0043] In this embodiment of the disclosure, the temperature compensation calculation operation of each color channel is triggered by different states of the state machine, so that the same temperature compensation calculation module completes the calculation of the target temperature compensation data of the red, green and blue channels in a time-sharing manner, thereby achieving the sharing of computing resources while ensuring the independent compensation accuracy of each channel.

[0044] In one possible implementation, each color channel corresponds to four basic temperature compensation data. The temperature compensation calculation module is used to perform a first operation on the two received basic temperature compensation data in response to the state machine switching to the first state corresponding to the current color channel during the calculation of the target temperature compensation data for the current color channel; and to receive two more basic temperature compensation data during the first operation. In response to the state machine switching to the second state corresponding to the current color channel, a second operation is performed on the two more basic temperature compensation data. In response to the state machine switching to the third state corresponding to the current color channel, a third operation is performed based on the results of the first and second operations to obtain the target temperature compensation data for the current color channel.

[0045] In this embodiment, during the calculation of the temperature compensation value for each color channel, the SRAM read operation and the calculation task can be performed in parallel. Specifically, during the calculation of the temperature compensation value for the first color channel, as described above, the timing control module can first pull the first read control signal to a high level to control the first memory to output basic temperature compensation data. Each color channel can correspond to four basic temperature compensation data. When the temperature compensation calculation module receives two basic temperature compensation data, it can start the first calculation (i.e., the first calculation) without waiting to receive the other two basic temperature compensation data, in response to the state machine switching to the first state corresponding to the first color channel. The state machine can change states according to the timing control signal to enable the temperature compensation calculation module to perform calculations. The state machine can correspond to three states in the calculation of each color channel to trigger each calculation of the temperature compensation calculation module.

[0046] During the first calculation, two other basic temperature compensation data can be read simultaneously. The temperature compensation calculation module can simultaneously receive two other basic temperature compensation data from the first memory. At this time, since all four basic temperature compensation data have been received, the first read control signal can be pulled low, and the state machine can switch states to the second state corresponding to the first color channel. The temperature compensation calculation module can respond to the state machine switching to the second state and perform a second calculation (i.e., the second operation) on the other two basic temperature compensation data.

[0047] After completing the second operation, the results of the first and second operations can be obtained. The state machine can switch states to the third state corresponding to the first color channel. The temperature compensation calculation module can respond to the state machine switching to the third state, perform the third operation (i.e., the third operation) on the results of the first and second operations, and use the result of the third operation as the target temperature compensation data corresponding to the current color channel (the first color channel).

[0048] After completing the third calculation, i.e., after calculating the target temperature compensation data for the first color channel, the calculation of the target temperature compensation data for the second color channel can continue. Specifically, the calculation process can be the same as the process of calculating the temperature compensation value for the first color channel. The timing control module can first pull the second read control signal to a high level to control the second memory to output the basic temperature compensation data. Then, the SRAM read operation and the calculation task can be parallelized simultaneously. The calculation of the target temperature compensation data for subsequent color channels is similar, and this embodiment will not be described in detail here.

[0049] By repeating the above process, the target temperature compensation data for all color channels can be calculated serially. Thus, only one calculation circuit is needed to complete the compensation calculation for multiple color channels in a time-sharing manner, avoiding the increase in chip area and power consumption caused by setting up a separate temperature compensation calculation module for each channel.

[0050] In this embodiment, the first calculation may be an interpolation calculation performed on two basic temperature compensation data points, and the second calculation may be an interpolation calculation performed on two other basic temperature compensation data points. The interpolation calculation may be performed using linear interpolation or other methods, and may be implemented using relevant technologies, which will not be elaborated upon in this embodiment.

[0051] In one possible implementation, the temperature compensation calculation module is used to receive two basic temperature compensation data for the next color channel during the third calculation when the current color channel is not the last color channel.

[0052] Since the current color channel is not the last color channel, meaning there are still color channels to be calculated, SRAM reading and calculation can be performed simultaneously. In the previous section, during the temperature compensation value calculation for the first color channel, when the temperature compensation calculation module responds to the state machine switching to the third state and performs a third calculation on the results of the first and second calculations, the timing control module can pull the second read control signal high. The temperature compensation calculation module can then simultaneously receive the two basic temperature compensation data output from the second memory. After the state machine switches to the first state corresponding to the second color channel (actually the fourth state of the state machine), it can perform the first calculation on the two basic temperature compensation data output from the second memory (actually the fourth calculation).

[0053] Similarly, if the second color channel is not the last color channel to be calculated, the timing control module can pull the third read control signal to a high level during the actual sixth calculation. The temperature compensation calculation module can simultaneously receive the two basic temperature compensation data output by the third memory. The same applies to subsequent color channels. This embodiment of the present disclosure will not be described in detail here.

[0054] When the third operation of the last color channel is completed, the state machine can switch back to WAIT to prepare for the next round of temperature compensation operation.

[0055] In one possible implementation, the temperature compensation calculation module is used to perform interpolation calculations on the results of the first calculation and the results of the second calculation to obtain the target temperature compensation data corresponding to the current color channel.

[0056] In this embodiment of the disclosure, interpolation can be performed on the results of the first calculation and the results of the second calculation. Alternatively, linear interpolation can be used. The result of the interpolation can be used as the target temperature compensation data corresponding to the current color channel.

[0057] For example, Figure 2 A schematic diagram of an optical temperature compensation architecture according to an embodiment of this disclosure is shown. Figure 2 As shown, Figure 2 The OTC in this context refers to Optical Temperature Compensation (OTC). In this embodiment, the current ambient temperature can be sent to the timing control module. The timing control module can generate timing signals, which can be used to control the read control of the state machine and SRAM. The timing control module can send read control signals, including address and chip select, to the three built-in SRAMs (SRAM_A / B / C), thereby causing the SRAMs to send the temperature compensation data of the current ambient temperature to the temperature compensation calculation module. The state machine can change its state according to the timing signals, thereby sequentially activating the temperature compensation calculation module to calculate the actual temperature compensation data of the RGB channels.

[0058] For example, when the color channel is an RGB color channel, Figure 3 A schematic diagram showing the timing of a temperature compensation circuit according to an embodiment of the present disclosure is provided. Figure 3 As shown, i_dclk is the master clock, sram_a_rd is the read control signal for channel R (when this signal is high), and sram_b_rd is the read control signal for channel G (when this signal is high), which reads the basic temperature compensation data from memory a. sram_c_rd is the read control signal for channel B (when this signal is high), which reads the basic temperature compensation data from memory c. ofs_tmp0_dbv0, ofs_tmp1_dbv0, ofs_tmp0_dbv1, and ofs_tmp1_dbv1 are temperature compensation offset parameters, i.e., basic temperature compensation data. div_en is the enable signal, div_cal_cnt is the calculation counter representing the calculation stage, div_cnt is the counting control signal used to synchronize the calculation cycle, and div_fsm is the finite state machine.

[0059] Since each color channel can be calculated three times, meaning the state machine needs to perform three state transitions, the state machine can have ten states (including the initial state WAIT). The states of the state machine can be defined as follows:

[0060] WAIT, R_CAL01, R_CAL23, R_CAL_INTP, G_CAL01, G_CAL23, G_CAL_INTP, B_CAL01, B_CAL23, B_CAL_INTP. and Figure 3 The corresponding div_fsm.

[0061] Therefore, the process of serial calculation of RGB channels using time-division multiplexing technology in this embodiment can be as follows:

[0062] When sram_a_rd is high, the R channel compensation data is read. That is, two basic compensation data can be read from SRAM_A first. At this time, the state machine jumps from WAIT to R_CAL01 so that the temperature compensation calculation module can perform the first calculation. During this period, R00_0 and R10_0 are output, div_cal_cnt goes from 0 to 1, and div_cnt goes through three counts.

[0063] While the first operation is in progress, two more basic compensation data can be read from SRAM_A. At this time, sram_a_rd can be pulled low, and the state machine will jump from R_CAL01 to R_CAL23 to perform the second operation. At this time, R01_0 and R11_0 will be output.

[0064] After the second operation is completed, the results of the first and second operations are used as input for the third operation. The state machine transitions from R_CAL23 to R_CAL_INTP to begin the third operation. During the third operation, div_cnt counts four times, meaning the calculation must wait for one count before starting. Simultaneously with the third operation, sram_b_rd is pulled high, and two basic compensation data are read from SRAM_B to prepare for the subsequent fourth operation. Once the third operation is complete, the state machine transitions from R_CAL_INTP to G_CAL01 to begin the fourth operation.

[0065] During the fourth operation, two basic compensation data are read from SRAM_B to prepare for the fifth operation. At this time, sram_b_rd is pulled low, and the state machine jumps from G_CAL01 to G_CAL23.

[0066] After completing the fourth and fifth operations, the results are used as input for the sixth operation. The state machine jumps from G_CAL23 to G_CAL_INTP to perform the sixth operation. At the same time, sram_c_rd is pulled high, and two basic compensation data are read from SRAM_C to support the seventh operation. After the sixth operation is completed, the state machine jumps from G_CAL_INTP to B_CAL01.

[0067] During the seventh operation, two more basic compensation data are read from SRAM_C as input for the eighth operation. At this time, sram_c_rd is pulled low, and the state machine jumps from B_CAL01 to B_CAL23.

[0068] After the eighth calculation is completed, the results of the seventh and eighth calculations are used as the input for the ninth calculation. The state machine jumps from B_CAL23 to B_CAL_INTP to perform the ninth calculation. After the ninth calculation is completed, the state machine jumps from B_CAL_INTP to WAIT. Through the above steps, one round of temperature compensation calculation is completed.

[0069] In this embodiment, parallel computation of the RGB three channels can be effectively converted into a serial circuit, thus enabling time-division multiplexing of the circuit and achieving the same effect without relying on parallel computation. In addition to ensuring high-efficiency temperature compensation performance, it further effectively reduces the required hardware resources, thereby reducing chip area and power consumption. This embodiment can employ a shared computing circuit and multiple SRAM memories to achieve temperature compensation of the gamma curves of the RGB three channels, specifically including:

[0070] 1. Timing Control Module: Used to generate timing control signals, which control the state transitions of the state machine and SRAM read operations. It mainly includes the following:

[0071] Timing signal generation: The control module generates a timing signal div_cnt to control the state machine to switch states and activate the calculation of the three channels R, G, and B in turn. Based on the state machine and timing signal, time-division multiplexing is realized, and the compensation data of the three SRAMs R / G / B are read in turn and serial calculation is performed simultaneously.

[0072] State Machine: The built-in state machine is responsible for controlling the calculation operations of the corresponding channel. The 10 states of the state machine are: WAIT, R_CAL01, R_CAL23, R_CAL_INTP, G_CAL01, G_CAL23, G_CAL_INTP, B_CAL01, B_CAL23, and B_CAL_INTP.

[0073] SRAM Read: Based on the current state machine value and timing signals, the three SRAMs are read sequentially.

[0074] 2. Internal SRAM: As a storage function, it stores temperature compensation data for the red, green and blue channels respectively.

[0075] 3. Shared circuit unit: namely the temperature compensation calculation unit, which is responsible for the serial calculation of the RGB channels and supports the execution of specific calculation tasks through the instructions of the control module.

[0076] The shared circuit unit may include a temperature compensation calculation module.

[0077] In this embodiment, time-division multiplexing technology is used to perform temperature compensation for the three RGB channels. By designing a timing control circuit, the temperature compensation data stored in SRAM_A / B / C (R / G / B) is read sequentially, and a set of computing circuits is used to perform serial calculations on the RGB channels, effectively reducing the number of required hardware components, improving system efficiency, and reducing costs.

[0078] In this embodiment, the temperature compensation data for each sub-pixel channel is stored in three SRAMs. This storage structure allows for fast access and retrieval of the temperature compensation data, ensuring rapid compensation calculations within each cycle, thereby improving the system's response speed and real-time performance.

[0079] The embodiments disclosed herein are not only applicable to current OLED displays, but can also be extended to future display technologies, including quantum dot displays, micro light-emitting diodes (MicroLEDs), etc. This broad applicability provides possibilities for further technological development.

[0080] In this embodiment, a single computing circuit and three SRAM memories are used, avoiding the design of requiring independent circuitry for each pixel channel in traditional solutions. Compared to related technologies, the chip area is reduced by approximately 33%. This provides greater flexibility in OLED display design, allowing more functions to be integrated in a smaller space, meeting the miniaturization and thinness requirements of modern portable devices.

[0081] In this embodiment, based on the design concept of optimized circuitry, the parallel computing of three channels (three sets of circuits) is effectively optimized into serial computing (one set of circuits), realizing time-division multiplexing of computing circuits. The sharing of computing resources significantly reduces the power consumption of the circuit. The overall power consumption is reduced by approximately 20%, which enables OLED displays to significantly extend battery life during prolonged use. This is especially important in mobile and wearable devices, where reduced power consumption is crucial for improving user experience.

[0082] In this embodiment, based on serial computation of the RGB channels, the original three sets of computation circuits are optimized into a single shared computation unit, enabling time-division multiplexing. All channels share the same hardware computing resources, reducing circuit redundancy and significantly reducing chip area. Furthermore, by serializing the computation tasks, time-division multiplexing technology can activate only one channel's computation circuit at a time, thereby effectively reducing static and dynamic power consumption.

[0083] The temperature compensation circuit provided in this embodiment includes a timing control module, multiple memories, and a temperature compensation calculation module. The timing control module is connected to the multiple memories, and the multiple memories are connected to the temperature compensation calculation module. The timing control module generates timing control signals based on the current ambient temperature. These timing control signals include a state control signal and multiple read control signals. The state control signal controls a state machine to switch states. The multiple memories store basic temperature compensation data for multiple color channels and, in response to the read control signals, output basic temperature compensation data for different color channels corresponding to the current ambient temperature. The temperature compensation calculation module receives the basic temperature compensation data corresponding to the current ambient temperature and, based on the state of the state machine, calculates, in a time-division manner, the target temperature compensation data corresponding to the basic temperature compensation data for different color channels at the current ambient temperature. By using the circuit of this embodiment, all color channels share a single temperature compensation calculation module, reducing circuit redundancy and significantly reducing chip area.

[0084] In the embodiments disclosed herein, adjustments can be made to meet different display application requirements, making it suitable for various types of OLED displays, including mobile phones, televisions, automotive displays, etc. This flexibility enables the technology to be widely applied in future display technologies.

[0085] This disclosure also provides a chip including the temperature compensation circuit described above.

[0086] This disclosure also provides an electronic device including the temperature compensation circuit described above.

[0087] This disclosure also provides a display device, including a plurality of display units and at least one of the temperature compensation circuits described above.

[0088] The term “exemplary” as used herein means “serving as an example, embodiment, or illustration.” Any embodiment illustrated herein as “exemplary” is not necessarily to be construed as superior to or better than other embodiments.

[0089] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present disclosure. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of an instruction containing one or more executable instructions for implementing a specified logical function. In some alternative implementations, the functions marked in the blocks may occur in a different order than those shown in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, may be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.

[0090] The various embodiments of this disclosure have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or technical improvements to the embodiments in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A temperature compensation circuit, characterized in that, The circuit includes: a timing control module, multiple memories, and a temperature compensation calculation module; the timing control module is connected to the multiple memories; the multiple memories are connected to the temperature compensation calculation module; wherein: The timing control module is used to generate timing control signals based on the current ambient temperature. The timing control signals include state control signals and multiple read control signals. The state control signals are used to control the state machine to switch states. The plurality of memories are used to store the basic temperature compensation data of the plurality of color channels respectively, and in response to the read control signal, output the basic temperature compensation data of the different color channels corresponding to the current ambient temperature. The temperature compensation calculation module is used to receive the basic temperature compensation data corresponding to the current ambient temperature, and calculate the target temperature compensation data corresponding to the basic temperature compensation data of different color channels under the current ambient temperature in a time-division manner according to the state of the state machine.

2. The circuit according to claim 1, characterized in that, The timing control module is also used to receive the current ambient temperature; The read control signal includes a chip select signal and an address signal, wherein: The chip select signal is used to select a target memory from the plurality of memories; The address signal is used to determine the storage unit in the target memory that stores the base temperature compensation data corresponding to the current ambient temperature.

3. The circuit according to claim 1, characterized in that, The color channels include a red channel, a green channel, and a blue channel; The timing control module is used to control the state machine to switch states through the timing control signal, so as to trigger the calculation of target temperature compensation data for the red channel, green channel and blue channel respectively.

4. The circuit according to claim 1, characterized in that, Each color channel corresponds to four basic temperature compensation data; The temperature compensation calculation module is used to perform a first operation on the two received basic temperature compensation data in response to the state machine switching to the first state corresponding to the current color channel during the calculation of the target temperature compensation data corresponding to the current color channel, and to receive two other basic temperature compensation data during the first operation. In response to the state machine switching to the second state corresponding to the current color channel, a second operation is performed on the other two basic temperature compensation data. In response to the state machine switching to the third state corresponding to the current color channel, a third operation is performed based on the results of the first operation and the second operation to obtain the target temperature compensation data corresponding to the current color channel.

5. The circuit according to claim 4, characterized in that, The temperature compensation calculation module is used to receive two basic temperature compensation data for the next color channel during the third calculation when the current color channel is not the last color channel.

6. The circuit according to claim 4, characterized in that, The temperature compensation calculation module is used to perform interpolation calculations on the results of the first calculation and the results of the second calculation to obtain the target temperature compensation data corresponding to the current color channel.

7. A chip, characterized in that, Includes the circuits described in claims 1 to 6.

8. A display device, characterized in that, It includes multiple display units and at least one chip according to claim 7.

9. The display device according to claim 8, characterized in that, The display unit includes a display panel, which includes at least one of the following: liquid crystal display panel, micro light-emitting diode display panel, light-emitting diode display panel, mini light-emitting diode display panel, quantum dot light-emitting diode display panel, organic light-emitting diode display panel, cathode ray tube display panel, digital light processing display panel, field emission display panel, plasma display panel, electrophoretic display panel, electrowetting display panel, and small-pitch display panel.

10. An electronic device comprising the display device according to claim 8 or 9.