CUBE test equipment supporting multiple vehicles
By designing a multi-station CUBE test equipment, automated adaptation and precise positioning of various carriers are achieved, solving the problem that existing equipment cannot be compatible with multiple carriers, and improving the efficiency and accuracy of semiconductor testing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- BEIJING YUEXIN TECH CO LTD
- Filing Date
- 2026-05-06
- Publication Date
- 2026-07-31
AI Technical Summary
Existing CUBE testing equipment cannot be adapted to multiple carriers at the same time, resulting in frequent changes of tooling fixtures, cumbersome operation, low positioning accuracy, and difficulty in meeting the needs of efficient and high-precision semiconductor mass production.
A multi-station CUBE testing device was designed, integrating a wafer loading module, a waffle box feeder, and a vision positioning and calibration module. It supports automated adaptation to various carriers such as 12-inch wafers and 4-inch waffle trays. Precise positioning and automated control are achieved through vision positioning and optical sensors, improving the adaptability and operational accuracy of the device.
It has achieved automated adaptation to various carriers, improved the adaptability and versatility of the equipment, reduced manual operation costs, improved positioning accuracy and loading/unloading efficiency, and met the production needs of large-scale semiconductor testing.
Smart Images
Figure CN122493924A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor testing equipment technology, specifically to a CUBE testing device that supports multiple carriers. Background Technology
[0002] High-bandwidth memory (HBM) must undergo testing before shipping as individual, semi-customized ultra-high-bandwidth elements (CUBEs). CUBE testing is a critical step in ensuring the reliability of the complex stacked structure of HBM, avoiding cost waste and performance risks caused by post-stack failures. Existing CUBEs... E Testing equipment is mostly single-function and semi-automated, generally adopting a split architecture: it consists of an XYZ three-axis moving platform, a loading mechanism, a sensor acquisition unit, and an industrial control computer. The testing process is completed through manual loading, manual positioning, step-by-step testing, and offline interpretation. In many current semiconductor mass production testing scenarios, traditional solutions are no longer sufficient to meet the demands of efficient, high-precision, and highly consistent mass production.
[0003] As one of the core pieces of equipment for semiconductor chip testing, the adaptability, automation level, and positioning accuracy of its loading and unloading system directly affect the efficiency and accuracy of chip testing. Most existing CUBE testing equipment's loading and unloading systems only support a single carrier type and cannot simultaneously adapt to multiple carriers such as wafers and waffle trays. This necessitates frequent changes of tooling fixtures, making the operation cumbersome and time-consuming. Meanwhile, the positioning and calibration of traditional loading and unloading systems rely on manual operation, resulting in low positioning accuracy and problems such as wafer picking deviation and chip damage. Furthermore, the tray replacement efficiency is low, which cannot meet the production needs of large-scale semiconductor testing. Summary of the Invention
[0004] In view of this, the main objective of the present invention is to provide a multi-station CUBE testing method and system, a testing transport machine, and a carrier, in order to at least partially solve the above-mentioned technical problems.
[0005] To achieve the above objectives, as a first aspect of the present invention, a CUBE testing device supporting multiple carriers is proposed, including a wafer loading module, a waffle box feeder, a vision positioning and calibration module, and a control unit for controlling the coordinated operation of each module. The wafer loading module is adapted for automatic loading and unloading of 12-inch wafers, the waffle box feeder is adapted for automatic transfer and replacement of 4-inch waffle trays, and the vision positioning and calibration module is used for wafer positioning, nozzle calibration, and camera self-calibration, achieving an overall system operating accuracy of ±10µm.
[0006] Preferably, the wafer loading module includes a wafer loading unit, a wafer rotation unit, a wafer ejection device, and an X / Y / Z multi-axis motion system. The wafer ejection device is installed on the X / Y system below the wafer rotation unit. The Z-axis drives the ejection head to perform lifting and lowering movements, and the motion coordinates of the X / Y system are automatically mapped to the control unit.
[0007] Preferably, the wafer rotation unit integrates the functions of stretching wafer foil and adjusting wafer angle. The wafer rotation unit receives the angle signal from the visual positioning calibration module and drives the wafer to rotate to a preset angle so that the chip, row / column and platform X / Y system are parallel.
[0008] Preferably, the wafer loading unit is equipped with replaceable clamping arms that are adapted to wafers of specific sizes and types, enabling bidirectional transfer of wafers between the wafer changing device tray and the wafer conveyor.
[0009] Preferably, the waffle box feeder includes a stackable pallet conveyor, an internal storage box, an external storage box, a linear driver, a Z-axis linear guide rail, and an optical sensor. The positioning accuracy of the Z-axis linear guide rail is ±0.003mm, and the optical sensor monitors the pallet stacking status of the internal and external storage boxes in real time.
[0010] Preferably, the waffle box feeder adopts a bottom-up tray processing method. The linear drive transports the bottom tray of the inner storage box to the front processing position of the feeder and completes the positioning and fixing. The processed tray is returned to the outer storage box and automatically stacked.
[0011] Preferably, each slot of the waffle box feeder can load and handle no less than 30 layers of 4-inch waffle trays, with a tray replacement time of ≤5 seconds, and the tray box is located outside the safety cover.
[0012] Preferably, the visual positioning calibration module includes an upper camera unit, a lower camera device, and a camera calibration unit. The upper camera unit is used for wafer positioning and reference mark reading, the lower camera device is used for X / Y / θ direction calibration of the nozzle, and the camera calibration unit is used for parameter calibration and offset compensation of the camera itself.
[0013] Preferably, the upper camera unit can be selectively mounted on an X-rail at a fixed height or on a Z-axis that can be raised and lowered. The upper camera unit integrates a ring light and a coaxial lighting device. The brightness of each light source is independently adjustable, and the lighting color can be changed to non-white or ultraviolet lighting as needed.
[0014] Preferably, the lower camera device is fixedly mounted on the platform board and has a fixed focusing height. It integrates a ring light / square shadowless light and a coaxial lighting device. The brightness of each light source is independently adjustable, and its field of view, magnification and pixel size can be adapted and optimized according to the process materials.
[0015] Preferably, the camera calibration unit selects and moves the calibration target through the operation panel, and can select precise compensation marker points. When the system is equipped with multiple nozzles, the camera calibration unit can perform X / Y / Theta offset calibration on each nozzle and determine the camera pixel size.
[0016] Preferably, the system is equipped with a vacuum nozzle, which moves according to the positioning signal of the visual positioning calibration module to accurately align with the wafer pick-up point. It works in conjunction with the X / Y / Z multi-axis motion system to complete the picking, transfer and placement of the wafer. The motor of the waffle box feeder adopts closed-loop control of servo motor to ensure the stability and positioning accuracy of the tray transmission.
[0017] Based on the above technical solutions, it can be seen that the multi-station CUBE testing method and system, testing transport machine, and carrier of the present invention have at least one of the following beneficial effects compared with the prior art: (1) The CUBE test loading and unloading system of the present invention is compatible with various carrier types such as 12-inch wafers and waffle trays, eliminating the need for frequent changes of tooling fixtures, greatly improving the adaptability and versatility of the equipment, and reducing manual operation costs; (2) The present invention integrates a visual positioning calibration module. Through the coordinated work of the upper camera, lower camera and camera calibration unit, it realizes precise wafer positioning, precise nozzle calibration and camera self-calibration. The overall system operation accuracy reaches ±10um and the Z-axis linear guide rail positioning accuracy of the waffle box feeder reaches ±0.003mm, which effectively avoids wafer picking deviation and chip damage problems and improves the accuracy of testing. (3) All modules of the present invention adopt automated control, and with the help of the visual software control interface, the one-click triggering of commands such as [Load] and [Unload] is realized. The wafer loading and waffle feeding are fully automated processes, and the waffle tray replacement time is ≤5 seconds, which greatly improves the loading and unloading efficiency and meets the production needs of large-scale semiconductor testing. (4) The waffle box feeder of the present invention is equipped with an optical sensor to monitor the pallet stacking status in real time. The pallet box is set outside the safety cover for easy picking and placing. The wafer loading unit is equipped with replaceable clamping arms to adapt to wafers of different sizes and types, greatly improving the ease of operation and maintainability of the equipment. Attached Figure Description
[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly described below.
[0019] Figure 1 A schematic diagram of the wafer loading module structure of the CUBE testing equipment supporting multiple carriers provided by the present invention; Figure 2 A schematic diagram of the waffle box feeder structure for the CUBE testing equipment supporting multiple carriers provided by the present invention; Figure 3 A schematic diagram of the upper camera structure of the CUBE test device supporting multiple vehicles provided by the present invention; Figure 4 A schematic diagram of the lower camera structure of the CUBE test device supporting multiple vehicles provided by the present invention; Figure 5 A schematic diagram of the camera calibration unit structure of the CUBE test equipment supporting multiple vehicles provided by the present invention; Figure 6 The control interface diagram for wafer loading and unloading is shown in the CUBE testing equipment supporting multiple carriers provided by the present invention. Figure 7 A schematic diagram of the software control interface for the waffle loading and unloading of the CUBE testing equipment supporting multiple carriers provided by the present invention. Figure 8 A schematic diagram of one mode of the CUBE testing equipment supporting multiple carriers provided by the present invention (loading: wafer tray, waffle tray; unloading: waffle tray); Figure 9 A schematic diagram of two modes (loading: wafer tray; unloading: wafer tray) of the CUBE testing equipment supporting multiple carriers provided by the present invention; Figure 10 The diagram shows three modes of the CUBE testing equipment supporting multiple carriers provided by the present invention (loading: wafer tray; unloading: tape tray). Detailed Implementation
[0020] To make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to specific embodiments and accompanying drawings.
[0021] The terminology used in this invention is for the purpose of describing particular embodiments only and is not intended to limit the embodiments of the invention. The singular forms “a,” “the,” and “the” as used in the embodiments of the invention and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.
[0022] like Figures 1-10As shown, the embodiments of the present invention provide a CUBE testing device that supports multiple carriers, including a wafer loading module, a waffle box feeder, a vision positioning calibration module, and a control unit. The control unit adopts a hardware controller and is equipped with a visual touch screen control interface to realize the coordinated control of each module.
[0023] The wafer loading module is adapted for automatic loading and unloading of 12-inch wafers. It includes a wafer loading unit, a wafer rotation unit, a wafer ejection device, and a multi-axis motion system driven by X / Y / Z servo motors. The wafer ejection device is installed on the X / Y system below the wafer rotation unit. The Z-axis drives the ejection head to move up and down to avoid collision with the wafer. The motion coordinates of the X / Y system are automatically mapped to the hardware controller. The wafer rotation unit integrates the functions of stretching wafer foil and adjusting wafer angle. After receiving the angle signal from the visual positioning calibration module, it drives the wafer to rotate so that the chip is parallel to the platform X / Y system. The wafer loading unit is equipped with replaceable clamping arms, which can be replaced according to the wafer size to realize bidirectional transfer of wafers between the tray and the conveyor.
[0024] The waffle box feeder is adapted for the automatic transfer and replacement of 4-inch waffle trays. It includes a stackable tray conveyor, an internal storage box, an external storage box, a linear driver, a Z-axis linear guide, and an optical sensor. The positioning accuracy of the Z-axis linear guide is ±0.003mm. The optical sensor monitors the tray stacking status in real time. The waffle box feeder adopts a bottom-up tray processing method. The linear driver transports the bottom tray of the internal storage box to the processing position. The processed tray is returned to the external storage box and automatically stacked. Each slot can hold 30 layers of waffle trays. The tray replacement time is ≤5 seconds. The tray box is located outside the safety cover. The motor adopts closed-loop control of a servo motor.
[0025] The visual positioning calibration module includes an upper camera unit, a lower camera device, and a camera calibration unit. The upper camera unit is mounted on a height-adjustable Z-axis and integrates a ring light and a coaxial lighting device with independently adjustable brightness. It is used for wafer positioning and reference mark reading. The lower camera device is fixed on the platform board and integrates a square shadowless light and a coaxial lighting device. It is used for nozzle X / Y / θ direction calibration. Its field of view and magnification are optimized according to the testing process. The camera calibration unit selects the calibration target through the operation panel and can perform X / Y / Theta offset calibration on 6 nozzles respectively to determine the camera pixel size. The brightness of each individual light source is adjustable. The default color of the camera illumination is white, but other colors can be provided if needed. The field of view, magnification, and pixel size depend on the specific application and need to be optimized according to the manufacturing process and materials.
[0026] The control unit configures the control logic for the wafer loading process and the waffle feeding process, and is equipped with a visual software control interface that can trigger the [Load] and [Unload] commands with one click.
[0027] The wafer loading process includes three steps: loading preparation, visual positioning, and chip pickup. In the loading preparation stage, the operator places the wafer carrier into the wafer loading unit, and the control unit starts the wafer pulling program after receiving the [Load] command. In the visual positioning stage, the upper camera unit captures the wafer image and calculates the center coordinates and angle offset. When the offset exceeds the limit, the wafer rotation unit is triggered to perform angle correction. In the chip pickup stage, the nozzle moves above the chip according to the visual data, and after the Z-axis descends to the preset height, the chip is vacuum-adsorbed. After pickup, the Z-axis is reset and the chip is transferred to the test position.
[0028] The waffle feeding process includes three steps: tray loading, chip ejection, and empty tray recycling. In the tray loading stage, the waffle tray is placed into the feeder's tray slot. After receiving the [Load] command, the control unit adjusts the tray to the working height via the Z-axis linear guide. In the chip ejection stage, a pneumatic device ejects the chip from the tray to the suction position. After the suction nozzle completes the pickup, the tray automatically retracts. In the empty tray recycling stage, after the test is completed, the control unit receives the [Unload] command, moves the empty tray to an external storage box, and automatically stacks full trays.
[0029] The overall system accuracy in this embodiment is ±10µm, and its working process is as follows: When using a 12-inch wafer carrier, the wafer loading process is as follows: the operator places the wafer carrier into the wafer loading unit, clicks "Load" on the touchscreen, and the hardware controller starts the pull program. The upper camera captures an image of the wafer, calculates the center coordinates and angular offset. If an offset exists, the wafer rotation unit is triggered to correct the angle. The suction nozzle moves above the wafer based on visual data, the Z-axis descends to a preset height, the vacuum nozzle picks up the chip, and after the Z-axis resets, the chip is transferred to the testing position. When using a 4-inch waffle tray carrier, the waffle feeding process is as follows: the operator places the waffle tray into the feeder tray slot, clicks "Load" on the touchscreen, and the controller starts the transfer program. The Z-axis linear guide adjusts the tray to the working height, the pneumatic device pushes the chip to the suction position, the suction nozzle picks up the chip, and the tray retracts. After the test is completed, the operator clicks "Unload" on the touchscreen, and the controller moves the empty tray to an external storage box, achieving automatic stacking of full trays.
[0030] The CUBE test loading and unloading system in this embodiment is compatible with various carriers, has a high degree of automation and positioning accuracy, effectively improves the efficiency and accuracy of CUBE testing, and is suitable for large-scale semiconductor chip test production lines.
[0031] like Figure 8 As shown, this mode is designed specifically for CUBE sorting tests. The input carrier is a 12-inch wafer tray, and the output carrier is a 4-inch waffle tray. It is suitable for intermediate storage or sorting tests after CUBE is separated from the wafer.
[0032] Input and Testing Process: The wafer tray is loaded via the wafer loading module (loading mode supports docking with overhead cranes / AGVs / manual operation). After receiving the Load command, the control unit starts the wafer retrieval program. The upper camera unit of the vision positioning calibration module captures the wafer image and calculates the cube center coordinates and angular offset. If an offset exists, the wafer rotation unit automatically corrects the angle to make the cube rows and columns parallel to the platform's X / Y system. The suction nozzle moves above the test material based on the visual data, descends along the Z-axis to a preset height, and then vacuum-adsorbs the test cube. These cubes are then picked up sequentially and transferred to the testing station to complete the electrical testing.
[0033] Meanwhile, this mode also supports waffle tray loading. The waffle tray is placed into the feeder tray slot. After receiving the [Load] command, the control unit adjusts the tray to the working height through the Z-axis linear guide rail. The pneumatic device pushes the cube from the tray to the adsorption position. After the nozzle completes the pickup, the tray automatically retracts. The cubes are picked up in sequence and transferred to the test station to complete the electrical test.
[0034] Output Process: Tested cubes are transferred from the nozzle to the waffle tray feeder. The placement order can follow a pre-set program, such as placing cubes sequentially according to wafer coordinates, or placing cubes into different waffle trays based on test results. The waffle tray feeder uses a bottom-up processing method. A linear driver transports the bottom waffle tray from the internal storage bin to the processing position. Optical sensors monitor the tray stacking status in real time to ensure positioning accuracy. After the cube is placed in the tray groove, the tray automatically returns to the external storage bin for stacking. Empty trays are recycled via the Unload command after testing, with a tray replacement time of ≤5 seconds. This mode achieves seamless connection from wafer to waffle tray, eliminating the need for tooling changes and significantly improving sorting efficiency.
[0035] like Figure 9 As shown, this mode is used for wafer-level testing. Both the input and output carriers are 12-inch wafers. It supports full-wafer testing in the CUBE dicing state and is suitable for mass production testing scenarios.
[0036] Input and Testing Process: As above, after the wafer loading module loads the wafer, the vision positioning module identifies the chip position, and the nozzle picks up the chip and places it at the testing station to complete the electrical test. Test data is uploaded to the control unit in real time, and the software interface displays the pass / fail status of each chip.
[0037] Output process: After the test is completed, the CUBE is returned to its original coordinate position on the wafer tray, and the corresponding test wafer image is output according to the test results recorded by the software, so that it can directly enter the next mass production process.
[0038] like Figure 10 As shown, this mode is adapted for CUBE testing and tape production. The input carrier is a 12-inch wafer, and the output carrier is a tape reel, which is used for automated tape production and storage after CUBE testing is completed.
[0039] Input and Testing Process: As above, after the wafer loading module loads the wafer, the vision positioning module identifies the chip position, and the nozzle picks up the chip to the testing station to complete the electrical test. The tape loading module works synchronously—the tape reel consists of a spool and a carrier tape. The carrier tape has positioning holes and chip grooves. The equipment uses a tension control system and traction rollers to ensure smooth release of the carrier tape.
[0040] Output process: Qualified cubes are transferred from the nozzle to the carrier tape groove on the reel. The lower camera device calibrates the alignment accuracy between the nozzle and the groove, and the traction roller moves the carrier tape to the next groove according to the testing rhythm; unqualified cubes are rejected and sent to the waste box. When the carrier tape is exhausted, the control unit alarms through the visual interface, and the operator replaces the reel. This mode is directly compatible with packaging plant standards, simplifying the process from testing to packaging and improving production line continuity.
[0041] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A CUBE testing device supporting multiple carriers, including a wafer loading module, a waffle cassette feeder, a vision positioning and calibration module, and a control unit for coordinating the operation of each module, characterized in that: The wafer loading module is adapted for automatic loading and unloading of 12-inch wafers, integrating a multi-axis motion system and replaceable clamping arms; the waffle box feeder is adapted for automatic transfer and replacement of 4-inch waffle trays, adopting a stacked tray design and optical sensor monitoring; the vision positioning calibration module realizes wafer positioning, nozzle calibration and camera self-calibration through an upper camera unit, a lower camera device and a camera calibration unit, and achieves an overall system operating accuracy of ±10µm through real-time signal interaction between the vision positioning calibration module and the control unit.
2. The CUBE testing equipment supporting multiple vehicles according to claim 1, characterized in that, The wafer loading module includes a wafer loading unit, a wafer rotation unit, a wafer ejection device, and an X / Y / Z multi-axis motion system. The wafer ejection device is installed on the X / Y system below the wafer rotation unit. The Z-axis drives the ejection head to move up and down, and the motion coordinates of the X / Y system are automatically mapped to the control unit.
3. The CUBE testing equipment supporting multiple vehicles according to claim 2, characterized in that, The wafer rotation unit integrates the functions of stretching wafer foil and adjusting wafer angle. The wafer rotation unit receives the angle signal from the visual positioning calibration module and drives the wafer to rotate to a preset angle so that the chip, row / column and platform X / Y system are parallel.
4. The CUBE testing equipment supporting multiple vehicles according to claim 2, characterized in that, The wafer loading unit is equipped with replaceable clamping arms that are adapted to wafers of specific sizes and types, enabling bidirectional transfer of wafers between the wafer changing device tray and the wafer conveyor.
5. The CUBE testing equipment supporting multiple vehicles according to claim 1, characterized in that, The waffle box feeder includes a stackable pallet conveyor, an internal storage box, an external storage box, a linear driver, a Z-axis linear guide rail, and an optical sensor. The positioning accuracy of the Z-axis linear guide rail is ±0.003mm, and the optical sensor monitors the pallet stacking status of the internal and external storage boxes in real time.
6. The CUBE testing equipment supporting multiple vehicles according to claim 5, characterized in that, The waffle box feeder adopts a bottom-up tray processing method. The linear drive transports the bottom tray of the internal storage box to the front processing position of the feeder and completes the positioning and fixing. The processed tray is returned to the external storage box and automatically stacked.
7. The CUBE testing equipment supporting multiple vehicles according to claim 5, characterized in that, Each slot of the waffle box feeder can load and handle no less than 30 layers of 4-inch waffle trays, with a tray replacement time of ≤5 seconds, and the tray box is located outside the safety cover.
8. The CUBE testing equipment supporting multiple vehicles according to claim 1, characterized in that, The visual positioning calibration module includes an upper camera unit, a lower camera device, and a camera calibration unit. The upper camera unit is used for wafer positioning and reference mark reading, the lower camera device is used for X / Y / θ direction calibration of the nozzle, and the camera calibration unit is used for parameter calibration and offset compensation of the camera itself.
9. The CUBE testing equipment supporting multiple vehicles according to claim 8, characterized in that, The upper camera unit can be selectively mounted on a fixed-height X-rail or a height-adjustable Z-axis. The upper camera unit integrates a ring light and a coaxial lighting device. The brightness of each light source is independently adjustable, and the lighting color can be changed to non-white or ultraviolet lighting as needed.
10. The CUBE testing equipment supporting multiple vehicles according to claim 8, characterized in that, The lower camera device is fixedly mounted on the platform board and has a fixed focusing height. It integrates a ring light / square shadowless light and a coaxial lighting device. The brightness of each light source is independently adjustable, and its field of view, magnification and pixel size can be adapted and optimized according to the process materials.
11. The CUBE testing equipment supporting multiple vehicles according to claim 8, characterized in that, The camera calibration unit selects and moves the calibration target through the operation panel, and can select precise compensation marker points. When the system is equipped with multiple nozzles, the camera calibration unit can perform X / Y / Theta offset calibration on each nozzle and determine the camera pixel size.
12. The CUBE testing equipment supporting multiple vehicles according to claim 1, characterized in that, The system is equipped with a vacuum nozzle, which moves according to the positioning signal of the visual positioning calibration module to accurately align with the wafer pick-up point. It works in conjunction with the X / Y / Z multi-axis motion system to complete the picking, transfer and placement of the wafer. The motor of the waffle box feeder adopts closed-loop control of servo motor to ensure the stability and positioning accuracy of the tray transmission.