Zero-stiffness memory cushioning structure

By setting multiple connecting shock-absorbing springs in the buffer structure, uniform stress distribution and buffer space design are achieved, solving the problem of local damage to the shock-absorbing springs and realizing a buffer structure with zero stiffness and rapid recovery.

CN122494957APending Publication Date: 2026-07-31SUZHOU BOTAO NEW MATERIALS TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SUZHOU BOTAO NEW MATERIALS TECHNOLOGY CO LTD
Filing Date
2026-04-24
Publication Date
2026-07-31

AI Technical Summary

Technical Problem

In existing buffer structures, the shock-absorbing springs experience strain concentration when subjected to external impact, leading to localized damage and affecting the buffering effect.

Method used

A zero-stiffness memory buffer structure is designed. By setting multiple shock-absorbing springs in the buffer area, the stress is evenly distributed when it is subjected to force, forming a buffer space and a coincident energy storage cavity, thus achieving a zero-stiffness effect.

Benefits of technology

It extends the service life of the shock-absorbing springs, ensures that the buffer structure recovers quickly under large stress, and maintains a long-lasting buffering effect.

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Abstract

This application relates to the technical field of battery pack components, and in particular to a zero-stiffness memory buffer structure. The zero-stiffness memory buffer structure includes a buffer unit, which comprises a first elastic spacer, a second elastic spacer, and a shock-absorbing spring. A buffer region is formed between the first and second elastic spacers. The shock-absorbing spring is located within the buffer region and has multiple first connecting portions connected to the first elastic spacer and multiple second connecting portions connected to the second elastic spacer. A first buffer space is formed between the shock-absorbing spring and the first elastic spacer, and a second buffer space is formed between the shock-absorbing spring and the second elastic spacer. This application effectively ensures a buffering effect.
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Description

Technical Field

[0001] This application relates to the technical field of battery pack components, and in particular to a zero-stiffness memory buffer structure. Background Technology

[0002] The batteries in a power battery pack are typically arranged in an array, with buffer structures between them. These buffer structures absorb the slight expansion that occurs during charging and discharging, preventing the batteries from squeezing and deforming against each other. Simultaneously, these buffer structures mitigate external bumps, vibrations, and impacts, preventing damage to the internal structure of the power battery pack.

[0003] Currently, reference Figure 9 and Figure 10 A buffer structure includes a first elastic spacer and a second elastic spacer, forming a buffer area between the first elastic spacer and the second elastic spacer. A plurality of vertically arranged shock-absorbing springs are provided in the buffer area, with one end of the shock-absorbing springs connected to the first elastic spacer and the other end connected to the second elastic spacer.

[0004] When the first or second elastic spacer is subjected to an external impact, the damping spring at the corresponding impact position will deform. The damping spring at other positions has limited force to withstand, and the concentration of strain force will cause the damping spring to be damaged and unable to recover; thus, the buffering effect of the buffer structure in the later stage is affected. Summary of the Invention

[0005] To ensure the buffering effect, this application provides a zero-stiffness memory buffer structure.

[0006] This application provides a zero-stiffness memory buffer structure, which adopts the following technical solution: A zero-stiffness memory buffer structure includes a buffer unit, which comprises a first elastic spacer, a second elastic spacer, and a shock-absorbing spring. A buffer region is formed between the first elastic spacer and the second elastic spacer. The shock-absorbing spring is located within the buffer region and has multiple first connecting portions connected to the first elastic spacer and multiple second connecting portions connected to the second elastic spacer. A first buffer space is formed between the shock-absorbing spring and the first elastic spacer, and a second buffer space is formed between the shock-absorbing spring and the second elastic spacer.

[0007] By adopting the above technical solution, the damping spring has multiple first connecting parts connected to the first elastic spacer and multiple second connecting parts connected to the second elastic spacer. When the first or second elastic spacer is impacted, causing the damping spring to move, the damping spring at the impact position will drive the unimpacted part to move, extending the stress range. This makes the overall stress of the damping spring balanced. When the damping elastic deformation reaches a certain level, as the stress increases, the stress enters a slowly increasing plateau region, thus achieving a zero stiffness effect, i.e., a constant stress range.

[0008] Optionally, the shock-absorbing spring is wavy.

[0009] Optionally, the distance between two adjacent first connecting parts and the distance between two adjacent second connecting parts on the shock-absorbing spring are both between 4mm and 30mm.

[0010] Optionally, two shock-absorbing springs are provided, one of the first connecting portions of the other shock-absorbing spring is provided between two adjacent first connecting portions of the first connecting portion of the first shock-absorbing spring; the first buffer area between the first shock-absorbing spring and the first elastic spacer of the one shock-absorbing spring and the second buffer area between the second shock-absorbing spring and the second elastic spacer of the other shock-absorbing spring form a coincident energy storage cavity.

[0011] By adopting the above technical solution, the overlapping energy storage cavity formed by the first buffer area and the second buffer area can store elastic energy. When the stress disappears, the stored elastic energy can be dynamically released, allowing the shock-absorbing spring to recover quickly.

[0012] Optionally, multiple buffer units are stacked together, and the first elastic spacer in the buffer unit is either the first elastic spacer or the second elastic spacer in an adjacent buffer unit.

[0013] By adopting the above technical solutions, multiple superpositions can meet different stress requirements.

[0014] Optionally, the wave crest of the damping spring in the buffer unit corresponds to the wave crest of the damping spring in the adjacent buffer unit.

[0015] Optionally, the peaks of the damping springs in the buffer unit correspond to the troughs of the damping springs in the adjacent buffer unit.

[0016] Optionally, the buffer unit formed by the first elastic spacer, the second elastic spacer, and the shock-absorbing spring is integrally molded, and the material of the buffer unit is one of PP, modified PP and PE, or modified PE.

[0017] In summary, this application includes at least the following beneficial technical effects: The damping spring has multiple first connecting parts connected to the first elastic spacer and multiple second connecting parts connected to the second elastic spacer. When the first or second elastic spacer is impacted, causing the damping spring to move, the damping spring at the impact position will drive the unimpacted part to move, extending the stress range. This makes the overall stress on the damping spring balanced. Because of the balanced stress, the damping spring is not easily damaged when subjected to large stress, thus recovering quickly and having zero stiffness. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the zero-stiffness memory buffer structure in Embodiment 1 of this application; Figure 2 This is a diagram showing the experimental data for stress and strain in a single buffer unit in Embodiment 1 of this application; Figure 3 This is a schematic diagram of the structure of two shock-absorbing springs in one state of the two buffer units in Embodiment 1 of this application; Figure 4 This is a diagram showing the experimental data correspondence between stress and strain of the two shock-absorbing springs in the two buffer units of Embodiment 1 of this application under one state; Figure 5 This is a schematic diagram of another state of the two shock-absorbing springs in the two buffer units of Embodiment 1 of this application; Figure 6 This is a diagram showing the experimental data corresponding to the stress and strain of the two shock-absorbing springs in the two buffer units of Embodiment 1 of this application under another state. Figure 7 This is a schematic diagram of the zero-stiffness memory buffer structure in Embodiment 2 of this application; Figure 8 This is a diagram showing the experimental data for stress and strain in a single buffer unit in Embodiment 2 of this application; Figure 9 This is a schematic diagram of a buffer structure in the prior art; Figure 10 This is a graph showing the correspondence between experimental data on stress and strain in existing technologies.

[0019] Reference numerals in the attached drawings: 1. First elastic spacer; 2. Second elastic spacer; 3. Shock-absorbing spring; 4. First buffer space; 5. Second buffer space; 6. Overlapping energy storage cavity; 7. First buffer cavity; 8. Second buffer cavity. Detailed Implementation

[0020] The following is in conjunction with the appendix Figure 1-8 This application will be described in further detail.

[0021] This application discloses a zero-stiffness memory buffer structure. Example 1

[0022] refer to Figure 1 A zero-stiffness memory buffer structure includes buffer units, each buffer unit comprising an elastic spacer 1 and a second elastic spacer 2, forming a buffer region between the first elastic spacer 1 and the second elastic spacer 2. A damping spring 3 is disposed within the buffer region. The damping spring 3 is regularly wavy, with a portion integrally formed with the first elastic spacer 1 and another portion integrally formed with the second elastic spacer 2. The portion connecting the damping spring 3 to the first elastic spacer 1 is a first connecting portion, and the portion connecting the damping spring 3 to the second elastic spacer 2 is a second connecting portion. Multiple first and second connecting portions are provided. Because the damping spring 3 is wavy, it can be understood that the distance between two adjacent first connecting portions is the same as the distance between two adjacent second connecting portions. The distance between two adjacent first connecting portions and the distance between two adjacent second connecting portions in the damping spring 3 are between 4mm and 30mm. In this application, the thicknesses of the first elastic spacer 1, the second elastic spacer 2, and the shock-absorbing spring 3 are all between 0.2mm and 1.4mm, and the first elastic spacer 1 and the second elastic spacer 2 have the same thickness. The thickness of the shock-absorbing spring 3 is not greater than the thickness of the first elastic spacer 1. In this embodiment, the thickness of the shock-absorbing spring 3 is preferably 0.5mm, and the thicknesses of the first elastic spacer 1 and the second elastic spacer 2 are preferably 1mm.

[0023] refer to Figure 1 and Figure 2 Because of the presence of multiple first connecting parts, multiple identical first buffer spaces 4 are formed between the shock-absorbing spring 3 and the first elastic spacer 1, and the shock-absorbing spring 3 and the first elastic spacer 1 between two adjacent first connecting parts form a first buffer space 4; because of the presence of multiple second connecting parts, multiple identical second buffer spaces 5 are formed between the shock-absorbing spring 3 and the first elastic spacer 1, and the shock-absorbing spring 3 and the second elastic spacer 2 between two adjacent second connecting parts form a second buffer space 5; a first buffer space 4 is located between two adjacent second buffer spaces 5.

[0024] refer to Figure 3 When multiple buffer units exist, adjacent buffer units are stacked together. In this embodiment, two buffer units are used as an example. The lower buffer unit is the first buffer unit, and the upper buffer unit is the second buffer unit. The first elastic spacer 1 in the first buffer unit is the second elastic spacer 2 in the second buffer unit, that is, the first elastic spacer 1 in the first buffer unit and the second elastic spacer 2 in the second buffer unit are the same part. The first connecting part on the shock-absorbing spring 3 in the first buffer unit is integrally formed with the second elastic spacer 2 in the second buffer unit.

[0025] refer to Figure 3 and Figure 4 The wave crest of the damping spring 3 in the first buffer unit corresponds to the wave crest of the damping spring 3 in the second buffer unit. That is, in Figure 3 In the orthographic projection, the peak position of the damping spring 3 in the first buffer unit coincides with the peak position of the damping spring 3 in the second buffer unit.

[0026] refer to Figure 5 and Figure 6 The peak of the shock-absorbing spring 3 in the first buffer unit corresponds to the trough of the shock-absorbing spring 3 in the second buffer unit. That is, in Figure 5 In the orthographic projection, the peak position of the damping spring 3 in the first buffer unit coincides with the trough position of the damping spring 3 in the second buffer unit. That is, in Figure 3 In the first buffer unit, the second connecting part of the shock-absorbing spring 3 and the first connecting part of the shock-absorbing spring 3 in the second buffer unit abut against the two sides of the second elastic spacer 2 at the same position in the first buffer unit. The first connecting part of the shock-absorbing spring 3 in the second buffer unit will support the second connecting part of the shock-absorbing spring 3 in the first buffer unit. In this way, the two buffer units stacked together will have a greater supporting force.

[0027] In this embodiment, the material of the buffer unit used alone or multiple buffer units used together is the same: PP, modified PP and PE, or modified PE. Modified PP and modified PE are both PP and PE with increased toughness. When modified PP and PE are used, the proportion of PE is no more than 10%. In this embodiment, the proportion of PE is preferably 5%. Example 2

[0028] refer to Figure 7 The difference from Embodiment 1 is that two damping springs 3 are provided within the buffer area of ​​a single buffer unit. The two damping springs 3 have identical structures, and the connection point between each damping spring 3 and the first elastic spacer 1 remains the first connecting portion, as does the connection point between each damping spring 3 and the second elastic spacer 2. The two damping springs 3 are divided into a first damping spring 3 and a second damping spring 3. The first connecting portions of the first damping spring 3 and the second damping spring 3 are staggered. This means that a first connecting portion of the second damping spring 3 exists on the first elastic spacer 1 between two adjacent first connecting portions of the first damping spring 3. Furthermore, the first connecting portion of the second damping spring 3 is located at the center of two adjacent first connecting portions of the first damping spring 3.

[0029] refer to Figure 7 and Figure 8Because the first connecting portions on the two first damping springs 3 are staggered, the first buffer space 4 formed by the first damping spring 3 and the first elastic spacer 1 overlaps with the second buffer space 5 formed by the second damping spring 3 and the second elastic spacer 2. The overlapping position is the overlapping energy storage cavity 6. Thus, both the first buffer space 4 formed by the first damping spring 3 and the first elastic spacer 1 and the first buffer space 4 formed by the second damping spring 3 and the first elastic spacer 1 contain one overlapping energy storage cavity 6 and two first buffer cavities 7, with the overlapping energy storage cavity 6 located between the two first buffer cavities 7. Similarly, both the second buffer space 5 formed by the first damping spring 3 and the second elastic spacer 2 and the second buffer space 5 formed by the second damping spring 3 and the second elastic spacer 2 contain one overlapping energy storage cavity 6 and two second buffer cavities 8, with the overlapping energy storage cavity 6 located between the two second buffer cavities 8. One first buffer cavity 7 corresponds to one second buffer cavity 8.

[0030] In this implementation, multiple buffer units can also be stacked.

[0031] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A zero-stiffness memory buffer structure, characterized in that, It includes a buffer unit, which includes a first elastic spacer (1), a second elastic spacer (2), and a shock-absorbing spring (3). A buffer area is formed between the first elastic spacer (1) and the second elastic spacer (2); The shock-absorbing spring (3) is located in the buffer area. The shock-absorbing spring (3) is provided with a plurality of first connecting parts that are connected to the first elastic spacer (1). The shock-absorbing spring (3) is provided with a plurality of second connecting parts that are connected to the second elastic spacer (2). A first buffer space (4) is formed between the shock-absorbing spring (3) and the first elastic spacer (1), and a second buffer space (5) is formed between the shock-absorbing spring (3) and the second elastic spacer (2).

2. The zero-stiffness memory buffer structure according to claim 1, characterized in that, The shock-absorbing spring (3) is wavy.

3. The zero-stiffness memory buffer structure according to claim 2, characterized in that, The distance between two adjacent first connecting parts and the distance between two adjacent second connecting parts on the shock-absorbing spring (3) are both between 4 mm and 30 mm.

4. The zero-stiffness memory buffer structure according to claim 2, characterized in that, Two shock-absorbing springs (3) are provided, and the first connecting parts of the two shock-absorbing springs (3) are staggered. The first buffer area between one of the shock-absorbing springs (3) and the first elastic spacer (1) and the second buffer area between the other shock-absorbing spring (3) and the second elastic spacer (2) form a coincident energy storage cavity (6).

5. A zero-stiffness memory buffer structure according to claim 2, characterized in that, The buffer units are stacked in multiple layers, and the first elastic spacer (1) in the buffer unit is either the first elastic spacer (1) or the second elastic spacer (2) in the adjacent buffer unit.

6. The zero-stiffness memory buffer structure according to claim 5, characterized in that, The wave crest of the shock-absorbing sheet (3) in the buffer unit corresponds to the wave crest of the shock-absorbing sheet (3) in the adjacent buffer unit.

7. A zero-stiffness memory buffer structure according to claim 5, characterized in that, The peak of the shock-absorbing sheet (3) in the buffer unit corresponds to the trough of the shock-absorbing sheet (3) in the adjacent buffer unit.

8. The zero-stiffness memory buffer structure according to claim 1, characterized in that, The buffer unit formed by the first elastic spacer (1), the second elastic spacer (2) and the shock-absorbing elastic sheet (3) is integrally formed, and the material of the buffer unit is PP, modified PP and PE, or modified PE.