Mounting structure, expansion module and host

Abstract

The application relates to the technical field of computer hardware, and discloses a mounting structure, an expansion module and a host computer, wherein the mounting structure comprises a mounting plate assembly and a power supply assembly; the mounting plate assembly comprises a flat plate and a vertical plate connected with each other, one side surface of the flat plate is formed with a mounting position used for mounting a PCIe module; the power supply assembly comprises a main power supply plate and a sub power supply plate electrically connected with each other; the main power supply plate is arranged on the mounting plate assembly and is provided with an electric connection bus; the sub power supply plate is arranged on the vertical plate and is arranged in a staggered mode with the mounting position; the sub power supply plate is used for being electrically connected with a Riser card; the power supply mode of the PCIe module and the Riser card is optimized; and the heat dissipation effect is improved.

Description

Technical Field

[0001] This invention relates to the field of computer hardware technology, and in particular to an installation structure, an expansion module, and a host. Background Technology

[0002] In the hardware architecture of servers, industrial control computers, and embedded high-speed computing devices, the PCIe (Peripheral Component Interconnect Express) bus, as the mainstream high-speed serial expansion bus standard, boasts advantages such as high bandwidth, low latency, point-to-point independent transmission, and multi-channel expansion capabilities. It is the core architecture for enabling data interaction between the system and external functional devices, as well as hardware function expansion. The PCIe standard module is a pluggable hardware unit integrating a PCIe controller, a physical interface with gold fingers, and dedicated functional circuitry. It can be plugged into a PCIe slot to achieve expanded connections and high-speed data transmission between computers or embedded systems and external high-speed devices such as network cards, solid-state drives, accelerator cards, and data acquisition cards. It is a core component for servers to achieve functional expansion, computing power upgrades, and storage expansion.

[0003] Meanwhile, due to the design requirements of compact server chassis and high-density integration, especially the limited installation space and layout of 1U and 2U rack-mount servers, PCIe modules cannot be directly installed vertically. Therefore, existing technologies generally use Riser cards in conjunction with PCIe modules. A Riser card is essentially an adapter board with PCIe slots, primarily used to redirect, extend, and split the PCIe signals output from the motherboard, changing the installation orientation of the PCIe module to fit the limited internal space of the chassis. It can also expand a single motherboard expansion slot into multiple PCIe slots, improving server hardware expansion capabilities and meeting the design requirements of high-density, multi-device integrated servers.

[0004] In current conventional hardware assembly structures, high-power PCIe modules and their corresponding riser cards are powered directly from the motherboard. To meet the power requirements of their high-power loads, a large number of dedicated power cables and power connectors need to be laid out on the motherboard surface. However, the messy arrangement of numerous power cables on the motherboard surface can easily cause congestion of the motherboard surface structure, occupying limited space inside the chassis and blocking the airflow path inside the chassis. This results in blocked internal cooling channels, preventing the timely removal of heat generated by the motherboard, PCIe modules, and various components on the server's rear window. Long-term heat accumulation not only leads to excessively high hardware operating temperatures, reducing equipment stability and causing data transmission stutters, packet loss, and hardware throttling, but also accelerates the aging and wear of circuit boards and electronic components, shortening the overall lifespan of the server. This severely affects the reliability of servers operating at high density for extended periods and fails to meet the heat dissipation requirements of high-end servers and computing equipment for continuous and stable operation. Summary of the Invention

[0005] The main objective of this invention is to provide an installation structure, expansion module, and host, which aims to optimize the power supply method of PCIe modules and Riser cards and improve heat dissipation.

[0006] To achieve the above objectives, the installation structure proposed in this invention includes: Mounting plate assembly, the mounting plate assembly including a connected flat plate and a vertical plate, one side of the flat plate having a mounting position for mounting the PCIe module; and The power supply assembly includes a main power supply board and a sub-power supply board that are electrically connected. The main power supply board is located on the mounting plate assembly and has a power bus. The sub-power supply board is located on the vertical plate and is offset from the mounting position. The sub-power supply board is used to electrically connect with the Riser card.

[0007] In one embodiment, the main power supply board has a power supply socket, and the flat plate has a first clearance hole that is offset from the mounting position; The main power supply board is mounted on the flat plate and is located on the side of the flat plate facing away from the mounting position; The power supply socket protrudes from the first clearance hole to the side of the flat plate facing away from the main power supply board and is used for electrical connection with the PCIe module.

[0008] In one embodiment, the power supply component further includes a flexible circuit board, which includes a first connecting segment, a turning segment, and a second connecting segment connected in sequence, and the flat plate has a second clearance hole. The flexible circuit board is electrically connected to the main power supply board and the sub-power supply board; The first connection segment is connected to the main power supply board; The second connecting segment passes through the second clearance hole and connects to the sub-power supply board; The first connecting segment and the second connecting segment are offset from each other in the extension direction of the flexible circuit board.

[0009] In one embodiment, the second clearance hole is arranged in a strip shape and extends along the length direction of the second connecting segment.

[0010] In one embodiment, the sub-power supply board has a positioning protrusion, and the flat plate has a positioning hole; the positioning protrusion and the positioning hole are positioned and engaged. The sub-power supply board has a first threaded hole, the vertical plate has a through hole, and the mounting structure also includes a first fastener; the through hole is directly opposite to the first threaded hole, the first fastener passes through the through hole and is threadedly connected to the sub-power supply board.

[0011] In one embodiment, the power supply assembly further includes a board-side connector; The board-side connector is located on the sub-power supply board and is electrically connected to the sub-power supply board. The board-side connector is used to connect with the gold fingers of the Riser card.

[0012] In one embodiment, the mounting structure further includes a reinforcing plate; The reinforcing plate is located on the side of the flat plate facing away from the mounting position, and extends along the parallel arrangement direction of each mounting position.

[0013] In one embodiment, the plate is formed with bent sides and hinge holes; The bent side is located at both ends of the flat plate in the direction in which the mounting positions are arranged side by side, and is located on the same side of the flat plate as the vertical plate; The hinge hole is located on the bent side.

[0014] The present invention also proposes an extension module, which includes: The mounting structure; The PCIe module is installed in the mounting position; and The Riser card connects the PCIe modules and is electrically connected to the sub-power supply board.

[0015] The present invention also proposes a host computer, the host computer comprising: Chassis; Motherboard, which is located in the chassis; The expansion module is mounted on and hinged to the chassis. The power bus and the PCIe module are electrically connected to the motherboard. The expansion module is located above the motherboard, with a heat dissipation gap between it and the motherboard. A fan is mounted on the chassis and positioned facing the heat dissipation gap.

[0016] In the technical solution of this invention, PCIe modules are installed through mounting positions on the tablet, and riser cards are installed in a staggered manner on a sub-power supply board next to the mounting positions. The riser cards can draw power from the sub-power supply board. The overall layout is compact. The riser cards draw power from the main power supply board through the sub-power supply board, while the main power supply board draws power from the motherboard centrally through the power bus. Regardless of how many PCIe modules and corresponding riser cards are set on the tablet, the riser cards can all draw power from the motherboard through the power bus. This avoids the large amount of space occupied by power lines, connecting cables, and power plug components on the motherboard surface caused by multiple riser cards connecting to the motherboard separately, leaving more space for heat dissipation airflow and thus improving the heat dissipation effect. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0018] Figure 1 A schematic diagram of an embodiment of the installation structure provided by the present invention; Figure 2 for Figure 1 A magnified view of a section at point A in the middle; Figure 3 for Figure 1 Schematic diagram of the structural breakdown of the embodiment; Figure 4 for Figure 3 A magnified view of a section at point B in the middle; Figure 5 for Figure 3 A magnified view of a section at point C; Figure 6 for Figure 3 A magnified view of a section at point D; Figure 7 A schematic diagram of the structure of an embodiment of the extension module provided by the present invention; Figure 8 for Figure 7 A magnified view of a section at point E in the middle; Figure 9 for Figure 7 A magnified view of a section at point F in the middle; Figure 10 for Figure 7 Schematic diagram of the structural breakdown of the embodiment; Figure 11 for Figure 10A magnified view of a section at point G in the middle; Figure 12 for Figure 7 Another structural exploded view of the embodiment; Figure 13 for Figure 12 A magnified view of a section at point H.

[0019] Explanation of icon numbers: 1000, Expansion Module; 100, PCIe Module; 101, Second Positioning Protrusion; 102, Power Cable; 104, I / O Sheet; 105, Protrusion Feature; 200, Riser Card; 201, Side Ear Clip; 202, High-Speed ​​Signal Cable; 203, Board Edge Gold Fingers; 300. Installation Structure; 1. Mounting Plate Assembly; 11. Flat Plate; a. Mounting Position; 111. First Clearance Hole; 112. Second Clearance Hole; 113. First Positioning Hole; 114. Bending Side; 115. Hinge Hole; 116. Reinforced Folded Edge; 12. Vertical Plate; 121. Through Hole; 122. Second Positioning Hole; 123. Ventilation Hole; 124. Fitting Hole; 2. Power Supply Assembly; 21. Main Power Supply Board; 211. Power Connection Bus; 212. Power Supply Base; 22. Sub-Power Supply Board; 221. First Positioning Protrusion; 222. First Threaded Hole; 23. Flexible Circuit Board; 231. First Connecting Section; 232. Turning Section; 233. Second Connecting Section; 24. Board Edge Connector; 3. Fasteners; 4. Reinforcing Plate; 41. Connecting Fixing Plate; 42. Groove; 5. Module Fixing Bracket; 51. Positioning Pin.

[0020] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0023] Furthermore, the use of terms such as "first" and "second" in this invention is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this invention.

[0024] This invention proposes an installation structure 300 that adapts to the installation and integration of PCIe modules 100 and Riser cards 200 in servers, industrial control computers, and embedded high-speed computing devices. Figures 1 to 13 This is an embodiment of the present invention.

[0025] In an embodiment of the present invention, reference is made to Figure 1 and Figure 7 The mounting structure 300 includes a mounting plate assembly 1 and a power supply assembly 2. The mounting plate assembly 1 includes a flat plate 11 and a vertical plate 12 connected to each other. At least two mounting positions a are formed on one side of the flat plate 11. The mounting positions a are used to mount the PCIe module 100. The power supply assembly 2 includes a main power supply board 21 and at least one sub-power supply board 22 that are electrically connected. The main power supply board 21 is disposed on the mounting plate assembly 1 and has a power bus 211. The sub-power supply board 22 is disposed on the vertical plate 12 and is located between two adjacent mounting positions a. The sub-power supply board 22 is used to electrically connect to the Riser card 200.

[0026] In the technical solution of this invention, a PCIe module 100 is installed through mounting position a on the tablet 11, and a Riser card 200 is installed on a sub-power supply board 22 between two mounting positions a. The two Riser cards 200 can draw power from one sub-power supply board 22 at the same time. The overall layout is compact. The power consumption of the Riser card 200 is obtained from the main power supply board 21 through the sub-power supply board 22, and the main power supply board 21 draws power from the motherboard centrally through the power bus 211. Regardless of how many PCIe modules 100 and corresponding Riser cards 200 are set on the tablet 11, the Riser cards 200 can all obtain power from the motherboard through the power bus 211. This avoids the occupation of the motherboard surface space by power cables and power plug components caused by multiple Riser cards 200 connecting to the motherboard separately, leaving more space for heat dissipation airflow and thus improving the heat dissipation effect.

[0027] Among them, such as Figure 3 and Figure 6 As shown, the vertical plate 12 is provided with ventilation holes 123 to provide heat dissipation channels between the components of the PCIe module 100.

[0028] In one embodiment, such as Figure 1 and Figure 3 As shown, the main power supply board 21 has a power supply socket 212, and the plate 11 has a first clearance hole 111 that is offset from the mounting position a; the main power supply board 21 is disposed on the plate 11 and is located on the side of the plate 11 facing away from the mounting position a; the power supply socket 212 protrudes from the first clearance hole 111 to the side where the mounting position a is located and is used for electrical connection with the PCIe module 100.

[0029] In this example, the protruding power supply socket 212 can directly achieve a stable electrical connection with the PCIe module mounted in mounting position a. This layout conceals the main power supply board 21 on the back of the flat plate 11, using the first clearance hole 111 to complete the directional penetration installation of the power supply socket 212. This simplifies the PCIe module power supply connection structure, reduces the space occupied by wiring in the front mounting area, and reduces the exposure of the power supply socket 212 and external lines by utilizing the isolation and protection function of the flat plate 11, thereby reducing the risk of short circuits and line wear interference. At the same time, the back-concealed main power supply board 21 design does not obstruct the front heat dissipation airflow, ensuring normal air circulation on the bottom and surrounding areas of the PCIe module. This further optimizes the power supply stability and local heat dissipation conditions of a single module, improves the assembly integration and structural regularity, and reduces the wiring complexity of modular assembly. The distance between each power supply socket 212 and the PCIe module on its adjacent mounting position a is very short, allowing the use of short and uniform-length cables to connect the power supply socket 212 and the PCIe module. The cable routing is smooth and knot-free, effectively simplifying the cable routing operation and greatly improving the internal heat dissipation conditions.

[0030] In summary, this invention integrates the power supply of both the PCIe module 100 and the Riser card 200 into the main power supply board 21 and draws power from the motherboard through the power bus 211 of the main power supply board 21. This eliminates the need for separate power cables and power connectors for the PCIe module 100 and the Riser card 200, leaving more space for heat dissipation and further improving the heat dissipation effect.

[0031] In one embodiment, such as Figure 3 , Figure 4 and Figure 5 As shown, the power supply assembly 2 also includes a flexible circuit board 23, which includes a first connecting segment 231, a turning segment 232, and a second connecting segment 233 connected in sequence. The flat plate 11 has a second clearance hole 112. The flexible circuit board 23 is electrically connected to the main power supply board 21 and the sub-power supply board 22. The first connecting segment 231 is connected to the main power supply board 21. The second connecting segment 233 passes through the second clearance hole 112 and is connected to the sub-power supply board 22. The first connecting segment 231 and the second connecting segment 233 are offset in the extension direction of the flexible circuit board 23.

[0032] In this example, the first connecting segment 231 is attached to the main power supply board 21, and the second connecting segment 233 passes vertically through the second clearance hole 112 of the plate 11 and is attached to the sub-power supply board 22 at the vertical plate 12. The first connecting segment 231 and the second connecting segment 233 are staggered along the extension direction of the circuit board. The width of the second clearance hole 112 is greater than the width of the second connecting segment 233 and the sub-power supply board 22, so that the sub-power supply board 22 can pass through easily, which facilitates the assembly process. This solution utilizes the flexible circuit board 23's bendable, thin, and highly efficient welding characteristics to adapt to the space constraints in the thickness direction of the mounting plate assembly 1, replacing multiple cables to complete the electrical connection between the main power supply board 21 and the sub-power supply board 22, avoiding the difficulties of welding, assembling, and routing multiple cables, and effectively reducing the local stacking thickness. At the same time, the flexible wiring method fits more closely to the bottom surface of the plate 11, with no redundant line protrusions, ensuring smooth airflow and improving the shock resistance and structural adaptability of the electrical connection.

[0033] In one embodiment, such as Figure 1 and Figure 3 As shown, the second clearance hole 112 is strip-shaped and extends along the length of the second connecting section 233.

[0034] In this example, the strip-shaped second clearance hole 112 provides more space for the sub-power supply board 22 to pass through the second clearance hole 112 from bottom to top, and the second clearance hole 112 extends to the area where the first connection section 231 is located, but is offset from the first connection section 231. This part of the second clearance hole 112 allows the high-speed signal cable 202 of the Riser card 200 to pass through, so that the high-speed signal cable 202 of the Riser card can pass directly downward through the second clearance hole 112 from the side where the mounting position a is located, and realize the signal connection with the motherboard.

[0035] In one embodiment, such as Figure 5 and Figure 6 As shown, the sub-power supply board 22 has a first positioning protrusion 221, and the flat plate 11 has a first positioning hole 113; the first positioning protrusion 221 and the first positioning hole 113 are positioned and engaged; in addition, the sub-power supply board 22 has a first threaded hole 222, the vertical plate 12 has a through hole 121, and the mounting structure 300 also includes a first fastener 3; the through hole 121 is directly opposite to the first threaded hole 222, the first fastener 3 passes through the through hole 121, and is threadedly connected to the sub-power supply board 22.

[0036] In this example, the sub-power supply board 22 is pre-assembled and aligned by the interlocking positioning of the protrusions and holes. At the same time, a threaded locking structure is added, with a first threaded hole 222 set in the sub-power supply board 22 and a corresponding through hole 121 opened in the vertical plate 12. The first fastener 3 passes through the through hole 121 and is threadedly locked to the threaded hole. The dual fixing method of mechanical positioning and threaded fastening is adopted. The positioning structure enables the sub-power supply board 22 to be quickly and accurately aligned and installed, reducing assembly misalignment deviation. The fastener 3 locks and improves the structural robustness for long-term use, effectively resisting the external impact caused by server operation vibration and equipment plugging and unplugging operations, preventing the sub-power supply board 22 from loosening, shifting, or failing to make contact, and ensuring the continuous stability of the power supply connection of the Riser card 200. The standardized hole positions and fastener 3 structure can also simplify the assembly process, facilitate mass production and later disassembly, maintenance, and parts replacement, and improve the mechanical strength and environmental adaptability of the overall installation structure 300. It should be noted that the first threaded hole 222 on the sub-power supply board 22 is formed by a nut, which is a surface mount nut and is installed on the sub-power supply board 22 by welding.

[0037] In one embodiment, such as Figure 5 As shown, the power supply assembly 2 also includes a board-side connector 24; the board-side connector 24 is disposed on the sub-power supply board 22 and electrically connected to the sub-power supply board 22, and the board-side connector 24 is used to connect to the gold fingers of the Riser card 200.

[0038] In this example, the board-side connector 24 directly plugs into the gold fingers of the Riser card 200, eliminating the need for traditional connection methods such as soldering cable adapters and terminal connections. The board-side direct plug-in structure simplifies the assembly process of the Riser card 200 and the sub-power supply board 22, enabling tool-free quick assembly and disassembly. At the same time, the plugging of the board-side connector 24 into the gold fingers also serves to fix the Riser card, further simplifying the structure.

[0039] In one embodiment, such as Figure 3 and Figure 4 As shown, the mounting structure 300 also includes a reinforcing plate 4; the reinforcing plate 4 is located on the side of the flat plate 11 facing away from the mounting position a, and extends along the parallel arrangement direction of each mounting position a.

[0040] In this example, the integrated plate structure of the reinforcing plate 4 strengthens the weak areas of the tablet 11, offsetting the stress generated by the assembly of multiple PCIe modules, Riser card 200, and power supply component 2. It also compensates for the decrease in structural strength of the tablet 11 caused by the second recessed hole 112, improving the tablet 11's tendency to deform, bend, and warp under long-term load. This enhances the structural rigidity and load-bearing capacity of the overall mounting plate assembly 1, avoids structural deformation caused by hardware weight and external forces during insertion and removal, and prevents potential problems such as electrical connection misalignment and poor gold finger contact caused by deformation. The integrated elongated reinforcing plate 4 only slightly increases the local thickness of the tablet 11 in the overall structure. This layout does not obstruct the rear heat dissipation airflow, maintaining smooth airflow above the motherboard. Therefore, this example strengthens the mechanical structure while having minimal impact on the original heat dissipation method, meeting the high-load installation requirements of multiple densely integrated modules, and improving the long-term structural stability of the expansion structure.

[0041] The flat plate 11 and the reinforcing plate 4 can be riveted together with rivets after the holes are made.

[0042] In one embodiment, such as Figure 4 As shown, the reinforcing plate 4 also has connecting and fixing plates 41 on both sides. The connecting and fixing plates 41 have holes and are tapped. They are connected and fixed to the corresponding structure of the chassis through the holes by fasteners 3.

[0043] It should be noted that the fastener 3 mentioned above can be screws, countersunk screws, rivets, or other parts used for locking between computer hardware structures. Its specifications can be selected according to the specific structure and are a conventional technical choice. It also includes fasteners 3 used between other structures not mentioned in this case, which will not be elaborated further.

[0044] In one embodiment, such as Figure 3 As shown, the reinforcing plate 4 is located between the main power supply plate 21 and the flat plate 11.

[0045] In this example, on the one hand, the reinforcing plate 4 can serve as an intermediate load-bearing pad, evenly bearing and dispersing the assembly clamping force of the main power supply board 21 and the overall module load, avoiding problems such as board surface denting, circuit damage, and solder joint stress cracking caused by single-point pressure on the main power supply board 21, and providing full-area rigid support for the back of the tablet 11; on the other hand, the three-layer stacked structure of the tablet 11, reinforcing plate 4, and main power supply board 21 further increases the overall strength of the mounting structure 300; placing the reinforcing plate 4 between the main power supply board 21 and the tablet 11 provides better assemblability and maintainability; furthermore, the sandwich storage method integrates the structural layout, without requiring additional external space on the back of the mounting plate, and without protruding structures obstructing the heat dissipation airflow of the chassis, which can improve the airflow obstruction and airflow turbulence problems caused by the external placement of the reinforcing plate 4 in the prior art, ensuring the air convection efficiency of the heat dissipation gap above the motherboard, taking into account multiple effects such as structural reinforcement, protection of the power supply component 2, and heat dissipation optimization, resulting in higher overall integration, a neat and compact layout, and adaptability to the high-density integration and long-term heat dissipation design requirements of servers.

[0046] The main power supply board 21 and the plate 11 can be locked together using countersunk screws. These countersunk screws pass through the reinforcing plate 4, enhancing the connection strength between the reinforcing plate 4 and the plate 11. Since the reinforcing plate 4 is located between the main power supply board 21 and the plate 11, to avoid interfering with the main power supply board 21 supplying power to the modules mounted on the plate 11, as follows... Figure 3 The reinforcing plate 4 is also designed with a through groove 42 to prevent the power supply socket 212 from passing through.

[0047] In one embodiment, such as Figure 1 and Figure 3 As shown, the plate 11 has a bent side 114 and a hinge hole 115; the bent side 114 is located at both ends of the plate 11 in the direction in which each mounting position a is arranged side by side, and is located on the same side of the plate 11 as the vertical plate 12; the hinge hole 115 is provided on the bent side 114.

[0048] In this example, by setting bent sides 114 and hinge holes 115 on both ends of the plate 11, the mounting structure 300 can be rotated and connected to the chassis by relying on the hinge holes 115, which facilitates the wiring between the modules and the motherboard. The wiring mainly includes the routing of the power bus 211 and the high-speed signal cable 202 of the Riser card. The other end of the power bus 211 is almost always located under the motherboard facing the plate 11, and the high-speed signal cable 202 of the Riser card often passes through the unobstructed part of the second recess hole 112 to the position under the motherboard facing the plate 11, lifting and rotating the whole structure to facilitate the wiring operation. On the other hand, the optimal position of the bent side 114 is the end of the plate 11 away from the vertical plate 12. In this way, when installing the PCIe module 100, the power supply component 2 and the Riser card 200, it is only necessary to lift the side of the plate 11 away from the bent side 114 to achieve convenient installation of each module and component. Since the hinge hole 115 is located at the end, although the other end moves downward during the rotation of the plate 11, it will not interfere with the motherboard or the like.

[0049] In one embodiment, such as Figure 7 , Figure 8 as well as Figure 11 As shown, the mounting structure 300 also includes a module fixing bracket 5, the vertical plate 12 has a second positioning hole 122, and the PCIe module 100 has a second positioning protrusion 101; the second positioning protrusion 101 cooperates with the second positioning hole 122; the module fixing bracket 5 connects the PCIe module 100 and the plate 11 respectively.

[0050] In this example, during the assembly stage, the second positioning protrusion 101 and the second positioning hole 122 are engaged and positioned to achieve precise positioning and pre-fixation of the PCIe module on the side near the vertical plate 12, limiting the left and right offset and rotational displacement of the module, and completing rapid alignment and installation. Then, the module fixing bracket 5 is used to fix and connect the PCIe module and the plate 11 with threaded fasteners, forming a fixed structure in which the vertical plate 12 and the module fixing bracket 5 are combined and positioned at one end and locked at the other end. This eliminates the limitations of single-position assembly and can effectively resist multi-directional loads caused by server operation vibration, fan resonance, insertion and removal forces and transportation bumps. It also prevents problems such as PCIe module loosening, skewing, poor contact of gold fingers, signal disconnection or module loosening, ensuring the long-term stability of high-speed signal transmission and power supply circuit. The structure is compact and does not occupy the heat dissipation gap of adjacent devices. It has high assembly and alignment accuracy and is convenient for disassembly and maintenance, significantly improving the overall structural shock resistance and hardware assembly reliability in high-density multi-module integration scenarios. When a PCIe module is installed in mounting position a, two adjacent PCIe modules 100 are inverted (the top and bottom are flipped), resulting in different mounting structures for the two adjacent PCIe modules 100. Therefore, the module mounting bracket 5 has two shapes to accommodate the different end structures of the PCIe modules 100. Although the two types of module mounting brackets 5 have different shapes, the structures used to achieve positioning and fastening functions are the same.

[0051] In one embodiment, such as Figure 1 and Figure 3 As shown, the plate 11 also has a reinforced folded edge 116; the reinforced folded edge 116 is located at the end of the plate 11 away from the vertical plate 12 and is bent away from the mounting position a.

[0052] In this example, a reinforced folded edge 116 is integrally set at the suspended end of the plate 11 away from the vertical plate 12. The reinforced folded edge 116 extends continuously along the edge of the plate and is bent in the direction away from the PCIe module mounting position a. By utilizing the mechanical reinforcement characteristics of the bent section, the bending, torsion and deformation resistance of the plate 11 are effectively improved. The load stress generated by the stacking of multiple PCIe modules and power supply components 2 is dispersed, which makes up for the lack of strength of the unsupported structure at the far end. This avoids warping, bending and deformation of the plate 11 under long-term load, and prevents failures such as mounting position a offset, abnormal component fit and electrical connection failure caused by plate deformation. The integral bending shape does not require additional reinforcement accessories, which simplifies the structure and assembly process. At the same time, the folded edge is arranged in the direction away from the mounting position a, which will not interfere with the PCIe module assembly and the surrounding airflow, and reduces the impact on the original heat dissipation channel inside the chassis. Under the premise of lightweight design, the durability and load-bearing performance of the overall mounting structure 300 are upgraded.

[0053] In one embodiment, such as Figure 1 , Figure 3 as well as Figure 8As shown, the reinforced folded edge 116 has an opening, and the module fixing bracket 5 has an extension portion that covers part of the reinforced folded edge 116 and is provided with a positioning pin 51. The positioning pin 51 is positioned and engaged with the opening on the reinforced folded edge 116 to determine the relative position of the module fixing bracket 5, the PCIe module 100, and the plate 11, thus facilitating other subsequent connection and fixing measures.

[0054] The reinforcing plate 4, main power supply plate 21, bent side 114, and module fixing bracket 5 are all located at the same end of the plate 11. That is, when the mounting structure 300 rotates relative to the chassis via the hinge hole 115 of the bent side 114, all of the above structures are close to or located on the axis of rotation. The main purpose of arranging the axis of rotation in this way is: Firstly, during rotation, avoid causing structural interference to other components inside the chassis.

[0055] Secondly, since the connection points of the two ends of the power bus 211 and / or the high-speed signal line of the Riser card passing through the second recess hole are close to the shaft, the distance change during rotation is small, and shorter cables can be used to reduce cable tangling and knotting, effectively reducing the obstruction of the heat dissipation airflow.

[0056] The present invention also proposes an extension module 1000. Figures 7 to 11 In one embodiment, the expansion module 1000 includes a mounting structure 300, a PCIe module 100, and a Riser card 200. The PCIe module 100 is installed in the mounting position a, and the Riser card 200 is connected to the PCIe module 100 and electrically connected to the sub-power supply board 22. Each PCIe module 100 is independently matched and fixed in the corresponding mounting position a of the tablet 11. The Riser card 200 slot is positioned adjacent to the PCIe module 100's gold fingers and electrically connects to the sub-power supply board 22 at that location. The integrated expansion module 1000 can be assembled in batches as standardized independent components and disassembled as a whole, reducing the difficulty of assembling the entire server. Simultaneously, unified power supply and structural layout ensure the synchronous and stable operation of multiple devices, improving the integration and compatibility of high-speed peripheral expansion for the server.

[0057] Among them, such as Figure 9 , Figure 12 and Figure 13As shown, the circuit board of the Riser card 200 has edge gold fingers 203, which are electrically connected to the edge connector 24 of the sub-power supply board 22 to provide power to the Riser card 200. Simultaneously, the cooperation between the edge connector 24 and the edge gold fingers 203 also serves to secure the Riser card. Furthermore, the PCIe slot has side latches 201, which secure the Riser card 200 to the PCIe module. This indirectly fixes the Riser card's position using the PCIe module. Combined with the aforementioned securing effect of the edge connector 24, the Riser card is securely fixed, greatly simplifying the Riser card support and fixing structure.

[0058] In one embodiment, such as Figure 7 As shown, the tablet 11 has four mounting slots a, and the expansion module 1000 includes four PCIe modules 100 and four Riser cards 200. Each PCIe module 100 is located in one mounting slot a, and the four Riser cards 200 are located in pairs between two adjacent PCIe modules 100.

[0059] Before the PCIe module 100 is installed into the mounting structure 300, the I / O shield 104 also needs to be installed, such as Figure 7 , Figure 10 and Figure 11 As shown, the IO baffle 104 is located at the end of the PCIe module 100 facing the vertical plate 12, and as... Figure 10 As shown, the IO baffle 104 also has a protrusion 105, and the vertical plate 12 has a fitting hole 124 for positioning with the protrusion 105. The protrusion 105 and the fitting hole 124 form a limiting fit. The second positioning hole 122 and the second positioning protrusion 101, the protrusion 105 and the fitting hole 124, are two sets of positioning structures on the same side of the PCIe module, jointly positioning the PCIe module and the vertical plate 12. Together with the module fixing bracket 5, they form a double positioning structure at both ends of the PCIe module 100, ensuring the secure installation of the PCIe module 100. In this example, the second positioning protrusion 101 is disposed on the IO baffle 104.

[0060] The expansion module 1000 includes an installation structure 300. The specific structure of the installation structure 300 is as described in the above embodiments. Since the expansion module 1000 adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0061] The present invention also proposes a host computer, which includes a chassis, a motherboard, an expansion module 1000, and a fan. The motherboard is disposed in the chassis, the expansion module 1000 is disposed in the chassis and hinged to the chassis, the power bus 211 and the PCIe module 100 are electrically connected to the motherboard, the expansion module 1000 is located above the motherboard and there is a heat dissipation gap between the expansion module 1000 and the motherboard, and the fan is disposed in the chassis and facing the heat dissipation gap. The power bus 211 of the expansion module 1000 and the PCIe module 100 are connected to the motherboard for power and signal respectively. The internal fans of the chassis are oriented towards the heat dissipation gap between the motherboard and the expansion module 1000, forming a directional forced convection cooling airflow. The hinged expansion module 1000 can be rotated at a certain angle for easy maintenance of the motherboard below. The layered layout separates the heat sources of the motherboard and the expansion module 1000. The reserved heat dissipation gap reduces heat accumulation caused by hardware stacking. With the forced airflow of the directional fans, the exchange of hot and cold air in the gap is accelerated, and the heat of the motherboard and the expansion module 1000 is quickly removed. The centralized power supply layout reduces motherboard wiring obstruction, reduces airflow resistance, and improves heat dissipation. The layered isolation structure also reduces electromagnetic interference between the motherboard and the motherboard. It comprehensively improves the heat dissipation efficiency, operational stability and service life of the whole machine under high density and long-term high load conditions, and is perfectly adapted to the design and use requirements of rack servers and computing power hosts. In addition to the aforementioned hinge, the expansion module 1000 is also provided with a detachable threaded connection structure for installation within the chassis, so as to securely lock the expansion module 1000 inside the chassis in its normal use state after installation.

[0062] The host includes an expansion module 1000. The specific structure of the expansion module 1000 is as described in the above embodiments. Since this host adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0063] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. An installation structure for installing a PCIe module and a riser card, characterized in that, The mounting structure includes: Mounting plate assembly, the mounting plate assembly including a connected flat plate and a vertical plate, one side of the flat plate having a mounting position for mounting the PCIe module; and The power supply assembly includes a main power supply board and a sub-power supply board that are electrically connected. The main power supply board is disposed on the mounting plate assembly and has a power bus. The sub-power supply board is disposed on the vertical plate and is offset from the mounting position. The sub-power supply board is used to be electrically connected to the Riser card. The main power supply board has a power supply socket, and the flat plate has a first clearance hole that is offset from the mounting position. The main power supply board is mounted on the flat plate and is located on the side of the flat plate facing away from the mounting position; The power supply socket protrudes from the first clearance hole to the side of the flat plate facing away from the main power supply board and is used for electrical connection with the PCIe module.

2. The installation structure as described in claim 1, characterized in that, The power supply component also includes a flexible circuit board, which includes a first connecting segment, a turning segment and a second connecting segment connected in sequence, and the plate has a second clearance hole. The flexible circuit board is electrically connected to the main power supply board and the sub-power supply board; The first connection segment is connected to the main power supply board; The second connecting segment passes through the second clearance hole and connects to the sub-power supply board; The first connecting segment and the second connecting segment are offset from each other in the extension direction of the flexible circuit board.

3. The installation structure as described in claim 2, characterized in that, The second clearance hole is strip-shaped and extends along the length of the second connecting segment.

4. The mounting structure as described in any one of claims 1 to 3, characterized in that, The sub-power supply board has a first positioning protrusion, and the flat plate has a first positioning hole; the first positioning protrusion and the first positioning hole are positioned and engaged. The sub-power supply board has a first threaded hole, the vertical plate has a through hole, and the mounting structure also includes a first fastener; the through hole is directly opposite to the first threaded hole, the first fastener passes through the through hole and is threadedly connected to the sub-power supply board.

5. The mounting structure as described in any one of claims 1 to 3, characterized in that, The power supply assembly also includes a board-side connector; The board-side connector is located on the sub-power supply board and is electrically connected to the sub-power supply board. The board-side connector is used to connect with the gold fingers of the Riser card.

6. The mounting structure as described in any one of claims 1 to 3, characterized in that, The mounting structure also includes a reinforcing plate; The reinforcing plate is located on the side of the flat plate facing away from the mounting position, and extends along the parallel arrangement direction of each mounting position.

7. The mounting structure as described in any one of claims 1 to 3, characterized in that, The plate has bent sides and hinge holes; The bent side is located at both ends of the flat plate in the direction in which the mounting positions are arranged side by side, and is located on the same side of the flat plate as the vertical plate; The hinge hole is located on the bent side.

8. An expansion module, characterized in that, The extension module includes: The mounting structure as described in any one of claims 1 to 7; The PCIe module is installed in the mounting position; and The Riser card is connected to the PCIe module and electrically connected to the sub-power supply board.

9. A host computer, characterized in that, The host includes: Chassis; Motherboard, which is located in the chassis; The expansion module as described in claim 8, wherein the expansion module is disposed in the chassis and hinged to the chassis, the power bus and the PCIe module are electrically connected to the motherboard, the expansion module is located above the motherboard, and a heat dissipation gap exists between the expansion module and the motherboard; and A fan is mounted on the chassis and positioned facing the heat dissipation gap.

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