Photovoltaic inverters and photovoltaic systems

Abstract

This application provides a photovoltaic inverter and a photovoltaic system. The photovoltaic inverter includes a housing, a circuit board, heat sink fins, a switching assembly, and PV ports. The circuit board is inverted inside the photovoltaic inverter, dividing the housing chamber into a first sub-chamber and a second sub-chamber to house a first device and a second device, respectively. The second device includes an inverter power assembly fixed to the reverse side of the circuit board. The heat sink fins are located on the side of the base plate opposite to the cover plate, and the inverter power assembly is thermally connected to the heat sink fins through thermally conductive contacts. The switching assembly includes a knob, a connecting rod, and a switch body. The switch body includes a disconnecting unit, the pins of which are rigidly fixed to the reverse side of the circuit board. This application inverts the circuit board inside the photovoltaic inverter, fixing large components to the reverse side of the circuit board, thus balancing heat dissipation and product aesthetics. The switch body is rigidly fixed to the reverse side of the circuit board through pins, reducing the assembly difficulty of the photovoltaic inverter.

Description

[0001] This application is a divisional application. The original application has the application number 202311100717.9 and the original application date is August 29, 2023. The entire contents of the original application are incorporated herein by reference. Technical Field

[0002] This application relates to the field of photovoltaic technology, and in particular to a photovoltaic inverter and a photovoltaic system. Background Technology

[0003] With the continuous development of the new energy industry, photovoltaic power generation systems, which convert solar energy into electrical energy, are widely used in fields such as communications, transportation, and aerospace. As a crucial component of photovoltaic power generation systems, photovoltaic inverters convert the direct current generated by photovoltaic solar panels into 240V, 50Hz alternating current or other types of alternating current to meet the power needs of various devices. However, current photovoltaic inverters have numerous internal wiring connections, making installation cumbersome and prone to wiring faults; furthermore, they are currently bulky and have poor heat dissipation. Summary of the Invention

[0004] This application provides a photovoltaic inverter and photovoltaic system with a reverse-mounted circuit board that can avoid wiring failures, reduce assembly difficulty, improve heat dissipation, and facilitate miniaturization.

[0005] Firstly, this application provides a photovoltaic inverter, including a housing, a circuit board, heat sink fins, a switching assembly, and multiple PV ports. The housing includes a bottom shell and a cover plate, which together form a receiving cavity. The bottom shell includes a base plate disposed opposite to the cover plate. In this implementation, the bottom shell has a recessed structure, and the bottom shell and cover plate together form the receiving cavity. The receiving cavity in the housing protects the circuit board and the switching assembly, first device, and second device fixed to the circuit board. Because the circuit board is fixedly connected to the housing, the switching assembly, first device, and second device are also relatively fixed to the housing. When the external environment applies external force to the photovoltaic inverter, the switching assembly, first device, and second device are less likely to shift relative to the housing due to their fixation, which helps improve the overall structural stability of the photovoltaic inverter and allows the photovoltaic inverter to operate in a stable state.

[0006] The circuit board includes a front side and a back side arranged opposite to each other along a first direction. Metal traces are provided on the circuit board. The front side faces the cover plate, and the back side faces the base plate. The circuit board is fixed within the receiving cavity of the housing, dividing the receiving cavity into a first sub-cavity and a second sub-cavity. In this implementation, the circuit board includes a front side and a back side arranged opposite to each other along the first direction. The front side is the surface directly presented to the user after the cover plate is opened. When the user needs to open the cover plate, the cover plate faces the user, and an indicator light is provided on the cover plate. When the user opens the cover plate, the user can directly see the front side of the circuit board.

[0007] The first sub-cavity is located between the front side of the circuit board and the cover plate, and the second sub-cavity is located between the back side of the circuit board and the base plate. The volume of the first sub-cavity is smaller than the volume of the second sub-cavity to accommodate the first device and the second device, respectively. The heat generated by the second device is greater than the heat generated by the first device, or the length of the second device along the first direction is greater than the length of the first device along the first direction. The first device includes a surface-mount resistor and a surface-mount capacitor fixed to the front side of the circuit board, and the second device includes an inverter power assembly, a bus capacitor, and an inductor fixed to the back side of the circuit board.

[0008] In this implementation, the front side of the circuit board and the cover plate form a first sub-cavity, which is used to house a first device. The back side of the circuit board and the base plate form a second sub-cavity, which is used to house a second device. The volume of the first sub-cavity is smaller than that of the second sub-cavity, which is adapted to the size relationship between the first and second devices. In one embodiment, the first device further includes a diode.

[0009] The heat dissipation fins are located on the side of the base plate away from the cover plate, and the inverter power assembly is provided with a thermally conductive contact portion on the side away from the circuit board. The inverter power assembly is thermally connected to part of the heat dissipation fins through the thermally conductive contact portion, and the bus capacitor and the inductor are located around the thermally conductive contact portion.

[0010] The inverter power module is the main heat-generating component of a photovoltaic inverter, thus requiring temperature rise control. The inverter power module is thermally connected to part of the heat sink fins via a thermally conductive contact portion, which helps shorten the heat transfer path and improve heat dissipation. The bus capacitor and inductor are located around the thermally conductive contact portion, or around the inverter power module. The bus capacitor and inductor can be thermally connected to the heat sink fins via the base plate, and the thermally conductive contact portion can also absorb heat from the bus capacitor and inductor from their peripheral side, further improving heat dissipation. In one embodiment, the thermally conductive contact portion can be part of the base plate or a thermally conductive structure located between the base plate and the inverter power module.

[0011] The switch assembly includes a knob, a connecting rod, and a switch body. The knob and the switch body are located on the outer and inner sides of the housing, respectively. The knob is connected to the switch body via the connecting rod, and the switch body is located within the second sub-cavity. The switch body is connected to the circuit board and includes multiple breaking units arranged in the same direction as the knob and the switch body. Each breaking unit includes a pin, and the pins of each breaking unit are rigidly fixed to the reverse side of the circuit board.

[0012] In this implementation, both the switch body and the second device are located in the second sub-cavity, with the switch body fixed to the reverse side of the circuit board. The pins are rigidly fixed to the reverse side of the circuit board, ensuring the switch body is both fixed and electrically connected. Rigid fixing means the pins cannot rotate or move relative to the circuit board. Typically, fixing the switch body to the reverse side of the circuit board involves first fixing the switch body to the base via a connecting rod, and then connecting the circuit board to the switch body. Since the reverse side of the circuit board faces away from the operator, it is difficult for the operator to directly observe the reverse side, and the second device is already installed on the reverse side. In this application, a rigid connection is used to fix the switch body to the reverse side of the circuit board. For example, the pins can be directly inserted into the reverse side of the circuit board for rigid fixing. Using a rigid connection reduces installation difficulty and decreases the contact resistance and heat generation between the switch body and the circuit board.

[0013] Unlike rigid connections, flexible connections are used. For example, a flexible connection can employ cables, which can rotate or move relative to the circuit board. However, flexibly connecting the switching unit of the switch body to the circuit board via cables results in a messy internal cable arrangement in the photovoltaic inverter. Furthermore, because the cables can move relative to the circuit board, fixing the switch body to the back of the circuit board via cables makes positioning and installation difficult, easily leading to low operating efficiency and poor connections. Additionally, both ends of the cable typically require OT terminals to connect to the back of the circuit board and the switch body respectively, increasing the contact resistance and heat generation of the entire circuit, resulting in a decrease in overall efficiency. During installation, since the switch body is located on the back of the circuit board, one end of the cable must be connected to the switch body before the circuit board is installed and fixed. Then, the other end of the cable must be wound from the back of the circuit board, from the side of the circuit board to the front, before the operator can fix the other end of the cable to the front of the circuit board. Compared to the rigid connection method of this application, this method is more complex and results in a messy cable arrangement.

[0014] In this implementation, the switch body and the second device are fixed together on the back of the circuit board. This is equivalent to concentrating the larger devices or those with a longer length along the first direction on the back of the circuit board. Compared to dispersing the switch body and the second device on the front and back of the circuit board, this implementation can reduce the overall length of the photovoltaic inverter in the first direction, making the photovoltaic inverter smaller and which is beneficial to the overall layout of the photovoltaic system.

[0015] In this embodiment, one end of the PV port is located inside the housing and connected to the circuit board, while the other end of the PV port extends through the housing to the outside of the housing. In this embodiment, the two ends of the PV port are located inside and outside the housing, respectively, and the PV port is used to transmit direct current to the inverter power assembly.

[0016] In this embodiment, the PV port is connected to a portion of the pins of the switch body via metal traces on the circuit board. The pins of the switch body are connected to the bus capacitor via metal traces on the circuit board. The bus capacitor is connected to the inverter power assembly via metal traces on the circuit board. In this implementation, the connection refers to an electrical connection, which can be a direct or indirect fixed connection. Multiple metal traces are present on the circuit board; these traces, also known as wires, can be copper wires and are used to connect the devices on the circuit board. In this embodiment, the PV port and the pins of the switch body, the pins and the bus capacitor, and the bus capacitor and the inverter power assembly are connected via metal traces, reducing or eliminating the use of cables and simplifying installation. In this embodiment, the PV port converts DC power to AC power through these connections, reducing contact resistance and heat generation between devices and improving the efficiency of the photovoltaic inverter.

[0017] In this application, the photovoltaic inverter is configured such that: firstly, the circuit board is inverted and placed inside the photovoltaic inverter, and the second device with a large heat generation or a large volume is placed on the reverse side of the circuit board to improve the heat dissipation effect of the second device; while the first device with a small heat generation or a small volume is placed on the front side of the circuit board, so that the volume of the first sub-cavity between the front side of the circuit board and the cover plate is small, making full use of the internal space of the photovoltaic inverter and facilitating the miniaturization of the photovoltaic inverter.

[0018] Secondly, because the circuit board is inverted within the photovoltaic inverter, to improve heat dissipation and internal space utilization, the inverter power components are thermally connected to the heat sink fins via thermally conductive contacts. This effectively shortens the heat transfer path between the inverter power components and the heat sink fins, thus improving heat dissipation for the inverter power components. The thermally conductive contacts also provide support for the circuit board, enhancing the structural strength and reliability between the internal circuit board and the housing of the photovoltaic inverter.

[0019] Third, both the switch body and the second device of the switch assembly are fixed to the back of the circuit board. During installation, since it is inconvenient for the operator to directly observe the back of the circuit board, this application sets the switch body to be rigidly fixed to the back of the circuit board via pins. Compared with flexible fixing, this application helps to reduce the installation difficulty and eliminates the step of manual fixing. The cable-free connection between the switch body and the circuit board can also reduce the contact resistance and heat generation between the switch body and the circuit board, improve the working efficiency of the photovoltaic inverter, and at the same time, reduce the impact of poor contact between the switch body and the circuit board during processing, transportation, and assembly.

[0020] In one implementation, the inductor in the second device includes at least one of a filter inductor, an inductor in a DC-DC conversion component, and an inductor in an inverter power component. This implementation improves the practicality of photovoltaic inverters.

[0021] In one implementation, the disconnecting unit includes a moving contact and a stationary contact. The end of the pin furthest from the circuit board is fixed to the stationary contact, and the stationary contact is connected to the metal trace of the circuit board through the pin. The knob can control the rotation of the moving contact of the disconnecting unit to open or close the moving contact and the stationary contact.

[0022] In this implementation, the disconnecting unit is electrically connected between the photovoltaic module and the inverter power module via pins. In this implementation, the two ends of the pins are directly fixed to the disconnecting unit and the circuit board, respectively. Compared to cable connections, this avoids increased wiring and assembly / maintenance difficulties. Furthermore, directly connecting and fixing the disconnecting unit and the circuit board via pins reduces the space occupied by internal components of the photovoltaic inverter, thereby reducing the overall size of the photovoltaic inverter. Additionally, directly connecting and fixing the disconnecting unit and the circuit board via pins reduces the resistance between the disconnecting unit and the circuit board, resulting in a shorter current transmission path, improved current transmission efficiency, and ultimately, enhanced performance of the photovoltaic inverter.

[0023] In one implementation, the end of the pin furthest from the circuit board is connected to the stationary contact via a connecting portion. Exemplarily, the end of the pin furthest from the circuit board is soldered to the stationary contact, and the connecting portion is the solder between the pin and the stationary contact. Exemplarily, the connecting portion can be a long strip or a bent metal structure.

[0024] In one implementation, one end of the stationary contact extends to the outside of the breaking unit to form a pin. In this implementation, the pin and the stationary contact are integrally formed, which helps to improve the connection stability between the input pin and the output pin and the stationary contact.

[0025] In one embodiment, the pins include input pins and output pins, and the disconnection unit includes an input disconnection unit and an output disconnection unit, with the input pins and output pins located in the input disconnection unit and the output disconnection unit, respectively. A knob is used to control the continuity between the input pins and between the output pins, and also to control the disconnection between the input pins and between the output pins. This embodiment enables the electrical connection and disconnection between the photovoltaic module and the switch body by controlling the continuity between the input pins and between the output pins via a knob.

[0026] In one embodiment, the switch body includes at least one pair of input pins and at least one pair of output pins, each pair of input pins including two input pins and each pair of output pins including two output pins. The PV port includes a positive connector and a negative connector.

[0027] In the input disconnection unit, one input pin in each input pin pair is used to connect to the positive connector through the metal trace on the circuit board, the two input pins in each input pin pair are connected through the stationary contact and the moving contact in the input disconnection unit, and the other input pin in each input pin pair is used to connect to the bus capacitor through the metal trace on the circuit board.

[0028] In the output disconnection unit, one of the output pins in each pair of output pins is used to connect to the negative connector via a metal trace on the circuit board, the two output pins in each pair of output pins are connected via a stationary contact and a moving contact in the output disconnection unit, and the other output pin in each pair of output pins is used to connect to the inverter power component via a metal trace on the circuit board.

[0029] In this implementation, the inverter power module forms a circuit with the photovoltaic module through input pin pairs and output pin pairs. The input pin pairs are located between the positive terminal of the photovoltaic module and the inverter power module, and the output pin pairs are located between the inverter power module and the negative terminal of the photovoltaic module. Current flows from the positive terminal of the photovoltaic module to the inverter power module, and then from the inverter power module to the negative terminal of the photovoltaic module. In this implementation, the input and output pins are electrically connected to the photovoltaic module and the inverter power module respectively through a circuit board, eliminating the need for cables between the switch body and the photovoltaic module and the inverter power module. This helps save costs, reduce internal space occupancy, and improve the convenience of installation and operation.

[0030] In one implementation, the second device further includes a DC-DC conversion component fixed to the reverse side of the circuit board. The DC-DC conversion component is located between the thermally conductive contact and the reverse side of the circuit board, and is thermally connected to the heat sink fins through the thermally conductive contact. Partial pins of the switch body are connected to the DC-DC conversion component via metal traces on the circuit board, and the DC-DC conversion component is electrically connected to the bus capacitor via the metal traces on the circuit board. In this solution, the DC-DC conversion component transforms the DC power transmitted to the inverter power component, converting the voltage to the DC voltage required by the inverter power component. In one embodiment, the DC-DC conversion component is a DC-DC boost converter. In this solution, the DC-DC conversion component is connected to the metal traces on the circuit board to achieve electrical connection between the DC-DC conversion component, the bus capacitor, and the switch body.

[0031] In one implementation, the input pin of the switch body is connected to the DC-DC conversion component via metal traces on the circuit board.

[0032] In one implementation, the photovoltaic inverter further includes an input-side filter component and an output-side filter component, both of which are connected to the circuit board. The PV port is connected to the input-side filter component via metal traces on the circuit board, and the input-side filter component is connected to a portion of the pins of the switch body via metal traces on the circuit board. The inverter power component is connected to the output-side filter component via metal traces on the circuit board.

[0033] In this scheme, the DC power generated by the photovoltaic modules is input to the input-side filter module through the PV port. The input-side filter module then transmits the DC power to the DC-DC converter module via a switch body. The DC-DC converter module transforms the DC power and then sequentially transmits it to the bus capacitor and the inverter power module. The DC power is then converted to AC power in the inverter power module, which in turn transmits the AC power to the output-side filter module. The input-side and output-side filter modules respectively filter out harmonics in the DC and AC power, reducing heat generation in the inverter power module, avoiding safety hazards, and improving the reliability of the inverter conversion. Furthermore, the input-side and output-side filter modules also improve the electromagnetic compatibility (EMC) performance of the photovoltaic inverter during operation. Electromagnetic compatibility (EMC) refers to the ability of a photovoltaic inverter to operate within its electromagnetic environment without causing unacceptable electromagnetic interference to any equipment in that environment. Therefore, EMC includes two aspects: on the one hand, the electromagnetic disturbance generated by the photovoltaic inverter to the environment during normal operation must not exceed a certain limit; on the other hand, the photovoltaic inverter must have a certain degree of immunity to electromagnetic disturbances in the environment, namely electromagnetic susceptibility (EMS).

[0034] In this solution, the functional components are electrically connected through the metal traces on the circuit board, which not only saves cables and simplifies the structure, but also reduces the impedance between the functional components and improves the power performance of the photovoltaic inverter.

[0035] In one embodiment, the AC power output from the output-side filter assembly can be used to supply the power grid. This embodiment helps to broaden the application range of photovoltaic inverters. In one embodiment, the input-side filter assembly and the output-side filter assembly may include filter capacitors.

[0036] In one implementation, the distance between the thermally conductive contact and the reverse side of the circuit board along the first direction is less than the distance between the base plate and the circuit board along the first direction. The length of the inverter power assembly in the first direction is less than the length of at least one of the bus capacitor, the inductor, and the switching assembly in the first direction.

[0037] In this implementation, in the first direction, the length of the inverter power component is not the longest among the second device and the switching component. Therefore, there is still some free space between the inverter power component and the base plate. Thus, the thermally conductive contact portion can protrude towards the inverter power component along the first direction, eliminating the free space from the photovoltaic inverter. At this time, the distance between the thermally conductive contact portion and the reverse side of the circuit board is less than the distance between the base plate and the reverse side of the circuit board. This solution rationally plans the internal space of the photovoltaic inverter, which is beneficial to improving the internal space utilization rate of the photovoltaic inverter, reducing the volume occupied by the photovoltaic inverter, and facilitating the overall layout. The distance between the base plate and the circuit board along the first direction refers to the maximum distance between the base plate and the circuit board along the first direction.

[0038] In one implementation, the photovoltaic inverter further includes a fan located within the second sub-cavity and connected to the circuit board. In this implementation, placing the fan within the second sub-cavity allows for air cooling of the second device. The combination of the fan and heat sink fins makes it easier to control the temperature of the second device within a suitable operating range. Placing the fan inside the photovoltaic inverter improves the utilization of the internal space.

[0039] In one implementation, the maximum length between the base plate and the reverse side of the circuit board along the first direction is greater than the length between the cover plate and the front side of the circuit board along the first direction, so that the inductor, the bus capacitor and the switch body can be accommodated between the base plate and the reverse side of the circuit board.

[0040] In this implementation, the space between the base plate and the reverse side of the circuit board forms a second sub-cavity for accommodating the second device and the switch body, while the space between the cover plate and the front side of the circuit board forms a first sub-cavity for accommodating the first device. Since the length of the second device and the switch body along the first direction is greater than the length of the first device along the first direction, the volume of the second sub-cavity needs to be larger than the volume of the first sub-cavity. Consequently, the distance between the base plate and the reverse side of the circuit board along the first direction needs to be greater than the distance between the cover plate and the front side of the circuit board along the first direction. This solution provides mounting space for placing the inductor, bus capacitor, and switch body on the reverse side of the circuit board.

[0041] In one implementation, the length of either the surface mount resistor or the surface mount capacitor along the first direction is less than or equal to 5 millimeters, thereby reducing the volume of the first sub-cavity and thus the overall size of the photovoltaic inverter. In this implementation, setting the length of the surface mount resistor and capacitor along the first direction to be small minimizes the space they occupy in the first sub-cavity, facilitating a smaller volume for the first sub-cavity and promoting miniaturization of the photovoltaic inverter.

[0042] In one implementation, the length between the front side of the circuit board and the cover plate along the first direction is less than or equal to 20 mm. In this implementation, the length between the front side of the circuit board and the cover plate along the first direction corresponds to the volume of the first sub-chamber. Setting the volume of the first sub-chamber to be smaller is beneficial for achieving miniaturization of the photovoltaic inverter design.

[0043] In one implementation, the maximum length along the first direction between the reverse side of the circuit board and the base plate is greater than or equal to 10 centimeters, so that the space between the reverse side of the circuit board and the base plate can accommodate the inductor, the bus capacitor, and the switch body. Since the base plates in different positions may not be on the same plane, in this implementation, the length along the first direction between the reverse side of the circuit board and the base plate refers to the maximum length along the first direction between the reverse side of the circuit board and the base plate. Setting this maximum length to be greater than or equal to 10 centimeters provides sufficient space in the second sub-cavity to accommodate the large inductor, bus capacitor, and switch body, which helps reduce installation difficulty.

[0044] In one implementation, the maximum length along the first direction between the reverse side of the circuit board and the base plate is greater than or equal to 20 centimeters. In this implementation, by setting the length along the first direction between the reverse side of the circuit board and the base plate, the size of the second sub-cavity is reasonably adjusted, so that the second sub-cavity has sufficient space to accommodate large inductors, bus capacitors, and switch bodies, which helps to reduce installation difficulty.

[0045] In one implementation, the plurality of PV ports include a positive connector. The bottom shell includes a first sub-board located between the bottom plate and the cover plate. The positive connector is fixed to the first sub-board, and the arrangement direction of the knob and the switch body is parallel to the first sub-board. One end of the positive connector is located inside the housing and fixed to the reverse side of the circuit board, while the other end of the positive connector extends through the housing to the outside of the housing. The other end of the positive connector is used to connect to the positive terminal of the photovoltaic module. The second device also includes a filter capacitor, which is fixed to the reverse side of the circuit board. The filter capacitor is located around the positive connector and between the switch body and the first sub-board. The filter capacitor is connected between the positive connector and the pin via metal traces on the circuit board.

[0046] In this implementation, the filter capacitor is used to reduce the impedance between the positive connector and the filter capacitor, thereby improving the filtering effect. The pin is part of the switch body. The positive connector is electrically connected to the photovoltaic module, and the filter capacitor is connected between the positive connector and the pin, that is, between the photovoltaic module and the switch body. The photovoltaic module, filter capacitor, and switch body are electrically connected in sequence. If the switch body is electrically connected between the filter capacitor and the positive connector, the DC current output by the photovoltaic module first passes through the switch body and then flows into the filter capacitor. Since the switch body itself has a certain resistance, the filtering effect of the filter capacitor on the DC current will be reduced. Therefore, this implementation method is beneficial to improving the filtering effect of the filter capacitor.

[0047] In this implementation, one end of the positive connector passes through the first sub-board and extends into the inner side of the housing. The orthographic projection of the filter capacitor on the circuit board is located around the orthographic projection of the positive connector on the circuit board. Since the filter capacitor is electrically connected between the positive connector and the switch body, this solution places the filter capacitor close to the positive connector, shortening the distance between the filter capacitor and the positive connector. This allows the current input from the photovoltaic module to be directly transmitted to the filter capacitor, effectively shortening the current input path length of the photovoltaic inverter, resulting in lower impedance and thus improving the filtering effect of the filter capacitor. In addition, this solution can also optimize the device layout of the photovoltaic inverter, which is beneficial to reducing the size of the photovoltaic inverter.

[0048] In one implementation, the plurality of PV ports include a negative connector, one end of which is located inside the housing and fixed to the reverse side of the circuit board, and the other end of which extends through the housing to the outside of the housing, and the other end of which is used to connect to the negative terminal of the photovoltaic module.

[0049] In this implementation, the current flows sequentially from the positive terminal of the photovoltaic module to the positive terminal connector and the inverter power module, where it undergoes an inverter conversion, and then flows sequentially to the negative terminal connector and the negative terminal of the photovoltaic module, forming a circuit.

[0050] In one implementation, the photovoltaic inverter further includes an insulating support member located between the base plate and the circuit board. The insulating support member is fixed to the base plate, and one end of at least one PV port is fixed between the insulating support member and the circuit board. The insulating support member is located within a second sub-cavity, making full use of the space within the second sub-cavity. In this implementation, the insulating support member supports the PV port, resulting in a more stable fixation between the PV port and the circuit board.

[0051] In one implementation, all PV ports are fixed at one end within the bottom housing to the insulating support and the circuit board. For example, screws are used to secure one end of the PV port, the circuit board, and the insulating support to each other.

[0052] In one implementation, the insulating support includes multiple first support portions and multiple second support portions, which are arranged alternately along a third direction parallel to the arrangement direction of the knob and switch body. Along this first direction, the distance between the surface of the first support portion facing away from the base plate and the base plate is greater than the distance between the surface of the second support portion facing away from the base plate and the base plate. One end of a portion of the multiple PV ports is fixed to the surface of the multiple first support portions facing away from the base plate, and one end of another portion of the multiple PV ports is fixed to the surface of the multiple second support portions facing away from the base plate. In this implementation, the first and second support portions have different heights. A portion of the PV ports are fixed between the first support portion and the circuit board, and a portion of the PV ports are fixed between the second support portion and the circuit board, thus dispersing the PV ports and avoiding a concentrated layout that could affect the stability of the electrical connection between the PV ports.

[0053] In this implementation, multiple first support parts and multiple second support parts are arranged alternately along a third direction, so that multiple PV ports are arranged alternately along a third direction, making the PV port arrangement more regular.

[0054] In one implementation, the bottom shell includes a first sub-plate located between a base plate and a cover plate, the first sub-plate being parallel to a third direction. Multiple PV ports include multiple positive connectors and multiple negative connectors, both fixed to the first sub-plate. Along a first direction, the distance between the multiple positive connectors and the base plate is greater than the distance between the multiple negative connectors and the base plate. Along a third direction, the multiple positive connectors and multiple negative connectors are arranged alternately in sequence. Each positive connector includes a positive metal plate at one end within the bottom shell, and each negative connector includes a negative metal plate at one end within the shell. Each positive metal plate is fixed to a first support portion facing away from the base plate and to a circuit board, and each negative metal plate is fixed to a second support portion facing away from the base plate.

[0055] In this implementation, multiple positive connectors are fixed to the first support and multiple negative connectors are fixed to the second support, so that the multiple positive connectors and multiple negative connectors are arranged alternately along the third direction and staggered along the first direction, which reduces the mutual interference of electrical connections between the multiple positive connectors and multiple negative connectors, improves the stability of electrical connections and makes the overall local structure more regular.

[0056] In one implementation, the positive connector includes a positive connector housing, which is fixed to a first sub-board. Both ends of the positive connector housing are located inside and outside a bottom shell, respectively. A positive metal sheet is fixed to one end of the positive connector housing located inside the bottom shell. The distance between the surface of the first support portion facing away from the bottom plate and the bottom plate is greater than the distance between the positive connector housing and the bottom plate. The positive metal sheet includes a bent section and a positive fixing section. The bent section connects the positive fixing section and the positive connector housing, and the positive fixing section is fixed between the surface of the first support portion facing away from the bottom plate and the circuit board.

[0057] In this implementation, since the first support portion also supports the circuit board, a larger length of the first support portion along the first direction is required to maximize the space between the circuit board and the base plate, or in other words, to maximize the space of the second sub-chamber. The first sub-plate is used to fix the positive connector housing. Since the positive connector housing itself has a certain length along the first direction, when the positive connector housing is fixed to the first sub-plate, the positive connector housing is lower than the circuit board along the first direction. In this application, the distances between the positive connector housing and the first support portion and the base plate are unequal. The metal inside the positive connector housing and the positive fixing section are connected by a bent section in the positive metal sheet, fixing the positive fixing section between the first support portion and the circuit board, thus connecting the positive connector to the circuit board. For example, the positive metal sheet is Z-shaped.

[0058] Since the distance between the negative connector and the base plate is shorter than the distance between the positive connector and the base plate, in one implementation, the negative metal piece in the negative connector can be planar. In another implementation, the negative metal piece in the negative connector can also be configured in a "Z" shape.

[0059] In one implementation, the photovoltaic inverter further includes a filter circuit board and a filter capacitor. The filter circuit board is fixed between the base plate and the circuit board along a first direction. The filter circuit board along a second direction is located on the side of the plurality of first support parts away from the first sub-board. The second direction is perpendicular to both the first and third directions. The filter capacitor is fixed on the surface of the filter circuit board facing the circuit board. A plurality of negative connectors are connected to the filter circuit board. The filter capacitor is connected to some pins of the switch body through the filter circuit board and the metal traces on the circuit board.

[0060] In this implementation, the filter capacitor is fixed by a filter circuit board and electrically connected to the circuit board. This allows the filter capacitor to not occupy space on the circuit board and fully utilizes the space of the second sub-chamber. In this implementation, the filter capacitor is an input-side filter component. The filter capacitor is connected to the negative connector via the filter circuit board and to the switch body via the filter circuit board and metal traces on the circuit board. This connection between the negative connector and the pins of the switch body enhances the filtering effect of the filter capacitor.

[0061] In one implementation, the insulating support further includes a third support portion located between the filter circuit board and the circuit board along a first direction. The projection of the third support portion along the first direction overlaps with the projection of the filter circuit board along the first direction. The distance between the third support portion and the first sub-board along a second direction is greater than the distance between each first support portion and the first sub-board. The third support portion is fixed to one of the first support portions. The photovoltaic inverter also includes a first connecting metal sheet. One end of the filter circuit board is connected to the first connecting metal sheet. Multiple negative connectors are connected to the first connecting metal sheet through the filter circuit board. Multiple filter capacitors are connected to the first connecting metal sheet through the filter circuit board. The other end of the first connecting metal sheet is fixed to the surface of the third support portion facing away from the base plate and is fixedly connected to the circuit board.

[0062] In this implementation, multiple negative connectors and multiple filter capacitors are connected to one end of the first connecting metal plate, and the other end of the first connecting metal plate is used to fix it to the circuit board, so that multiple negative connectors and multiple filter capacitors are connected to the circuit board through a connector, which simplifies the structural layout.

[0063] In one implementation, the third support is arranged along a third direction on the side of all the first and second supports away from the second sub-plate, making the arrangement more regular.

[0064] In one implementation, the first connecting metal sheet includes a main connecting section and a main fixing section connected together. The main connecting section connects the filter circuit board and the main fixing section, and the main fixing section is used to connect the circuit board. Along the second direction, the main connecting section is located on the side of the third support part away from the first sub-board, and the main fixing section is fixed between the surface of the third support part away from the base plate and the circuit board. This makes the structural layout more regular.

[0065] In one implementation, the insulating support further includes an external connector pair for supporting connection to the battery pack. The external connector pair is used to connect to the battery pack. The insulating support also includes a fourth support portion, a fifth support portion, and a sixth support portion. The distance between the surface of the sixth support portion facing away from the base plate and the base plate along the first direction is less than the distance between the surfaces of the fourth and fifth support portions facing away from the base plate and the base plate. The sixth support portion is used to fix the negative connector in the external connector pair and is connected between the fifth support portion and the circuit board via a second metal connecting piece. The fourth support portion is used to fix and support the positive connector in the connector pair and connect the positive connector to the circuit board.

[0066] In one embodiment, the first support portion and the second support portion are integrally formed. In another embodiment, the first support portion, the second support portion, and the third support portion are integrally formed. In yet another embodiment, the first support portion, the second support portion, the third support portion, the fourth support portion, the fifth support portion, and the sixth support portion are integrally formed. This improves the structural strength of the insulating support member.

[0067] In one implementation, the negative connector is fixed to the first daughter board. This solution fixes the positive and negative connectors to the same daughter board of the housing, which helps reduce installation difficulty and saves space.

[0068] In one implementation, the bottom shell further includes a second sub-plate located between the bottom plate and the cover plate. The second sub-plate is connected to and intersects with the first sub-plate. One end of the knob passes through the second sub-plate, extends into the inner side of the outer shell, and is fixed relative to the switch body. This solution places the knob and the positive connector on different sub-plates of the outer shell, effectively utilizing the installation space of different sub-plates and avoiding operational errors.

[0069] In one implementation, the second sub-board has mounting holes penetrating its inner and outer surfaces. A sealing component is provided on the outer side of the second sub-board. The switch assembly includes a connecting rod that passes through the sealing component and the mounting holes sequentially and extends into the inner side of the housing. The sealing component seals the gap between the mounting holes and the connecting rod. The sealing component in this solution prevents moisture or impurities from entering the housing through the mounting holes and affecting the performance of the circuit board or electrical components. Since the switch body is fixed to the circuit board, the space between the switch body and the inner surface of the second sub-board is limited, making it inconvenient to install the sealing component on the inner surface of the second sub-board. Therefore, in this implementation, the sealing component is located on the outer side of the second sub-board to facilitate the installation of the knob and the sealing component.

[0070] In one implementation, the filter capacitor, the switch body, and the inductor are arranged sequentially along a second direction, which intersects with the first sub-board. In this implementation, the switch body is located between the filter capacitor and the inductor along the second direction, optimizing the layout of components on the circuit board. The placement of some of the filter capacitor, switch body, and inductor close to the second sub-board facilitates providing installation space for other components in the photovoltaic inverter. In another implementation, the second direction is perpendicular to both the extension direction of the switch body and the first sub-board. This design helps reduce the installation difficulty of the photovoltaic inverter.

[0071] In one implementation, the filter capacitor, the inductor, and the switch body are arranged sequentially along the second direction. In this implementation, the inductor is located between the filter capacitor and the switch body along the second direction, and both the filter capacitor and the inductor are positioned close to the first daughter board. This shortens the distance between the filter capacitor and the inductor and the positive connector, thereby enhancing the filtering effect of the filter capacitor and the inductor on DC current.

[0072] In one implementation, all pins are inserted into the circuit board and rigidly fixed to it. In this implementation, the pins are rigid, and their insertion into the circuit board ensures their rigid fixation. When the knob controls the switch body to open, the switch body controls the inverter power component to disconnect from the photovoltaic module via the pins. When the knob controls the switch body to close, the switch body controls the inverter power component to electrically connect to the photovoltaic module via the pins. In this implementation, the pins are rigidly fixed to the circuit board by insertion, allowing for easier fixing and electrical connection of the switch body to the circuit board, simplifying the photovoltaic inverter assembly process and saving labor costs. Furthermore, it shortens the distance between the switch body and the circuit board where they are fixed for electrical connection, saving space at the connection point and improving the space utilization and power density of the photovoltaic inverter.

[0073] In one implementation, the extension direction of the pins is perpendicular to the reverse side of the circuit board, allowing the pins to be easily inserted into the circuit board. In this implementation, when the pins of the switch body are inserted into the circuit board, since the reverse side of the circuit board is parallel to the surface of the switch body facing the circuit board, the resistance experienced by the pins is small and they are less prone to deformation. Therefore, the stability of the mechanical and electrical connection between the switch body and the circuit board can be improved, which is beneficial to ensuring the normal operation of the photovoltaic inverter.

[0074] In one implementation, the extension direction of all the pins is perpendicular to the surface of the switch body facing the circuit board, allowing the switch body to be stably fixed to the circuit board via the pins. In this implementation, the extension direction of the pins being perpendicular to the surface of the switch body facing the circuit board reduces manufacturing difficulty and facilitates a smoother fixation and electrical connection between the switch body and the circuit board.

[0075] In one implementation, the pins extend perpendicularly to the reverse side of the circuit board, and the angle between the pin extension direction and the switch body's surface facing the circuit board is less than 90°. Specifically, the angle between the reverse side of the circuit board and the switch body's surface facing the circuit board is less than 90°, meaning the reverse side of the circuit board and the switch body's surface facing the circuit board are not parallel. This implementation reduces assembly difficulty, and the pins in this implementation are suitable for situations where the switch body cannot be placed parallel to the bottom housing due to the large number of components inside.

[0076] In one implementation, the angle between the extension direction of the pin and the reverse side of the circuit board is less than 90°, and the extension direction of the pin is perpendicular to the surface of the switch body facing the circuit board. The angle between the reverse side of the circuit board and the surface of the switch body facing the circuit board is less than 90°. In this implementation, the reverse side of the circuit board and the surface of the switch body facing the circuit board are not parallel. This implementation helps reduce assembly difficulty, and the pins in this implementation are suitable for situations where the circuit board cannot be placed parallel to the bottom shell due to factors such as too many components on top of the circuit board or an uneven cover plate.

[0077] In one implementation, the extension direction of the pin is not perpendicular to either the reverse side of the circuit board or the surface of the switch body facing the circuit board, and the reverse side of the circuit board and the surface of the switch body facing the circuit board are parallel. In this implementation, the pin is inserted into the circuit board at an angle. When the pin on the switch body does not correspond to the via in the circuit board, the pin can be tilted away from the height direction, thereby allowing the pin to be inserted into the via of the circuit board, improving the assembly flexibility of the photovoltaic inverter.

[0078] In one implementation, the pin is a metal pin. Metal pins have high strength, are easy to insert into the circuit board, and maintain a fixed connection with the circuit board. For example, the metal pin is a copper pin.

[0079] In one implementation, the circuit board has multiple vias, and the pin passes through and is soldered to the vias, thereby rigidly fixing the pin to the circuit board. In this implementation, the pin passes through and is soldered to the vias, fixing and electrically connecting the pin to the vias, thus fixing and electrically connecting the pin to the circuit board. This implementation effectively reduces the difficulty of inserting the pin into the circuit board by providing vias on the circuit board.

[0080] In one implementation, the circuit board has a pad on its front side, which surrounds the periphery of the via. One end of the pin passes through the via and is soldered to the pad. In this implementation, soldering the pin to the circuit board via the pad fixes the pin to the front side of the circuit board, making it less likely for the switch body to detach from the circuit board, thus improving the connection stability between the switch body and the circuit board.

[0081] In one implementation, the circuit board has multiple sockets on its reverse side, and the pins are all inserted into these sockets to be rigidly fixed to and electrically connected to the circuit board. In this implementation, the circuit board has sockets on its reverse side that match the pins. Inserting the pins into the sockets fixes and electrically connects the pins to the sockets, thereby rigidly fixing and electrically connecting the pins to the circuit board. The pin-socket connection in this implementation is essentially a detachable connection, which helps reduce the difficulty of disassembling and assembling the switch body and the circuit board.

[0082] In one implementation, the switch body includes an operating mechanism and a disconnecting unit. The knob can control the disconnecting unit to open or close via the operating mechanism. The end of the pin furthest from the circuit board is fixed within the disconnecting unit. In this implementation, the knob is fixedly connected to the operating mechanism. Rotating the knob causes the operating mechanism to rotate, thereby switching the disconnecting unit between open and closed states. The disconnecting unit is electrically connected to the circuit board via a pin. The opening and closing of the disconnecting unit corresponds to the opening and closing of the photovoltaic module and the inverter circuit.

[0083] In one implementation, the operating mechanism is a free-trip structure. This implementation helps to improve the safety performance of the photovoltaic inverter.

[0084] In one implementation, the switch body further includes a switch housing, with both the operating mechanism and the disconnecting unit located inside the switch housing, and the switch housing being a plastic component. In this implementation, the pins can be integrally injection molded with the switch housing to form a single structure, improving the structural strength of the input and output pins relative to the switch housing.

[0085] In one implementation, the switch housing includes a housing body and a top cover. The top cover, when closed with the housing body, forms a receiving space. The operating mechanism and the disconnecting unit are located within the receiving space, and the pins are integrally injection molded with the top cover to form a single structure. This implementation facilitates the assembly of the switch assembly. When assembling the switch assembly, the operating mechanism and the disconnecting unit can be installed inside the housing body first, the pins and the top cover can be pre-integrated into a single structure via injection molding, one end of the pins in the single structure can be electrically connected and fixed to the disconnecting unit, and then the top cover can be fixed to the housing body.

[0086] In one implementation, the base plate includes a base plate body and a raised plate, the raised plate being the thermally conductive contact portion. The raised plate protrudes from the base plate body toward the inverter power assembly and is thermally connected to the inverter power assembly. The raised plate and the inverter power assembly at least partially overlap in their orthogonal projections on the reverse side of the circuit board. A portion of the heat dissipation fins are located on the side of the raised plate opposite to the inverter power assembly. The bus capacitor and the inductor are located between the reverse side of the circuit board and the base plate body, with a portion of the heat dissipation fins located on the side of the base plate body opposite to the reverse side of the circuit board.

[0087] In this implementation, the inverter power module is the main heat-generating component of the photovoltaic inverter, thus temperature rise control is required for this component. The heat dissipation fins are located on the side of the raised plate facing away from the inverter power module along the first direction. The main body of the base plate is the portion of the base plate excluding the raised plate. The raised plate in the base plate is closer to the inverter power module than the main body of the base plate, which helps to shorten the heat transfer path and improve heat dissipation. The raised plate is thermally connected to the inverter power module, meaning that heat can be conducted between the raised plate and the inverter power module, thus enabling heat transfer from the inverter power module to the heat dissipation fins. The projections of the raised plate and the inverter power module on the reverse side of the circuit board at least partially overlap, so that the projections of the corresponding portion of the heat dissipation fins on the reverse side of the circuit board also at least partially overlap with the projection of the inverter power module on the reverse side of the circuit board, thereby enabling the heat dissipation fins to effectively dissipate heat from the inverter power module.

[0088] In this implementation, since the protruding plate protrudes towards the inverter power component relative to the base plate body, the length of some heat dissipation fins on the back side of the protruding plate along the first direction is longer, thereby increasing the heat dissipation area of ​​these heat dissipation fins and improving the heat dissipation effect on the inverter power component.

[0089] In this implementation, in addition to the raised plate, the heat dissipation fins are also distributed on the side of the base plate away from the cover plate. The bus capacitor and inductor in the second device are located between the reverse side of the circuit board and the base plate. Some of the heat dissipation fins are thermally connected to the bus capacitor and inductor, so some of the heat dissipation fins can cool the bus capacitor and inductor, thereby improving the overall cooling effect of the heat dissipation fins.

[0090] In this implementation, the raised plate serves the following functions: First, it shortens the heat transfer path between the inverter power components and the heat sink fins, and also helps to increase the heat dissipation area of ​​the heat sink fins, thus comprehensively improving the heat dissipation effect on the inverter power components. Second, the raised plate can make full use of the internal space of the photovoltaic inverter, increasing power density and reducing the size of the photovoltaic inverter, indirectly improving the utilization rate of the internal space of the photovoltaic inverter and achieving miniaturization design. Third, the raised plate can also provide support for the circuit board, improving the structural strength and reliability between the internal circuit board and the housing of the photovoltaic inverter. Fourth, in actual use scenarios, the base plate is the surface of the photovoltaic inverter facing away from the user. Since the base plate is not in the user's field of vision at this time, even if the base plate has an uneven shape, it will not affect the overall aesthetics of the photovoltaic inverter, ensuring the user experience. If the second device is placed on the front of the circuit board, a raised plate needs to be set in the cover plate to enhance the heat dissipation effect on the inverter power components. In this case, since the cover plate is the surface of the photovoltaic inverter directly facing the user, an uneven cover plate will negatively affect the user's appearance and user experience.

[0091] In one implementation, the projection of the raised plate onto the reverse side of the circuit board completely covers the projection of the inverter power component onto the reverse side of the circuit board. This implementation helps to further improve the heat dissipation effect of the heat sink fins on the inverter power component.

[0092] In one implementation, the heat sink fins are connected to an external cooling system. When the cooling medium transmitted by the external cooling system is introduced into the heat sink fins, the cooling medium can carry away the heat generated by the inverter power components by contacting the protruding plate, thereby reducing the temperature of the photovoltaic inverter under steady-state operation and achieving temperature control of the photovoltaic inverter.

[0093] In one implementation, a portion of the base plate, corresponding to the portion of the circuit board's reverse side where no components are mounted, protrudes towards the circuit board along a first direction. This solution can further reduce the empty space inside the photovoltaic inverter, thereby facilitating the overall layout.

[0094] In one implementation, the first direction is perpendicular to the base plate and is the same as the height direction of the photovoltaic inverter. This implementation helps to reduce the installation difficulty of the switch body and the circuit board, and the circuit board and the casing.

[0095] In one implementation, the second device further includes a DC-DC conversion component fixed to the reverse side of the circuit board, the DC-DC conversion component being located between the protrusion plate and the reverse side of the circuit board, and the protrusion plate and the DC-DC conversion component at least partially overlapping in their orthogonal projections on the reverse side of the circuit board.

[0096] In this implementation, the DC-DC converter is used to transform the DC power transmitted to the inverter power component, converting the voltage into the DC voltage required by the inverter power component. In one implementation, the DC-DC converter is a DC-DC boost converter. The DC-DC converter generates heat when in operation; therefore, a raised plate is provided that at least partially overlaps with the orthogonal projection of the DC-DC converter on the reverse side of the circuit board, so that some heat sink fins are positioned close to the DC-DC converter along a first direction, which is beneficial for enhancing the cooling and heat dissipation of the DC-DC converter by the heat sink fins.

[0097] In one implementation, the orthographic projection of the protruding plate on the reverse side of the circuit board completely covers the orthographic projection of the DC-DC converter on the reverse side of the circuit board. This implementation helps to further improve the heat dissipation effect of the heat sink fins on the DC-DC converter.

[0098] In one implementation, the raised plate includes a first raised sub-plate and a second raised sub-plate, the first raised sub-plate and the second raised sub-plate being spaced apart, the inverter power component being located between the first raised sub-plate and the reverse side of the circuit board, and the DC-DC conversion component being located between the second raised sub-plate and the reverse side of the circuit board.

[0099] In this implementation, the first and second raised sub-plates are spaced apart, and correspondingly, the inverter power component and the DC-DC conversion component are spaced apart. This helps reduce electromagnetic interference between the inverter power component and the DC-DC conversion component, ensuring that their operating efficiency is not affected. The heat dissipation fins corresponding to the first raised sub-plate are used to cool the inverter power component, and the heat dissipation fins corresponding to the second raised sub-plate are used to cool the DC-DC conversion component. The placement of the first and second raised sub-plates within the raised plate enables precise heat dissipation of the heat-generating components, improving heat dissipation efficiency.

[0100] In one implementation, the raised plate is an integral structure, and the inverter power module and the DC-DC conversion module are arranged adjacent to each other. This solution helps reduce the processing cost of the raised plate and simplifies the installation of the inverter power module and the DC-DC conversion module.

[0101] In one implementation, the inverter power assembly includes multiple inverter power devices, and the DC-DC conversion assembly includes multiple DC power devices, with at least one inverter power device located among the multiple DC power devices. In this implementation, the inverter power devices and DC power devices can be flexibly arranged as needed, allowing the inverter power assembly and DC-DC conversion assembly to be suitable for different application scenarios. Furthermore, it eliminates the need to package the inverter power devices and DC power devices into a single unit, reducing operational steps and costs.

[0102] In one implementation, at least one of the DC power devices is located between the plurality of inverter power devices. In this implementation, the inverter power devices and DC power devices can be flexibly arranged as needed, allowing the inverter power assembly and DC-DC conversion assembly to be suitable for different application scenarios. Furthermore, it eliminates the need to package the inverter power devices and DC power devices separately into a single unit, reducing operational steps and costs.

[0103] In one implementation, the inverter power component is an inverter power module, which includes an inverter packaging structure and multiple inverter power devices located within the inverter packaging structure. The DC-DC conversion component is a DC-DC conversion module, which includes a DC-DC packaging structure and multiple DC power devices located within the DC-DC packaging structure. In this implementation, multiple inverter power devices are packaged within the inverter packaging structure, and multiple DC power devices are packaged within the DC-DC packaging structure. This results in high integration of the inverter power component and the DC-DC conversion component, facilitating the overall mounting of multiple inverter power devices onto the reverse side of the circuit board and reducing installation difficulty.

[0104] In one implementation, a heat-conducting medium is provided between the inverter power component and the raised plate. The heat generated by the inverter power component during operation is transferred to a portion of the heat dissipation fins on one side of the raised plate through the heat-conducting medium. This solution enhances heat dissipation.

[0105] In one implementation, the switch body has a positioning part on the surface facing the circuit board, the positioning part is spaced apart from the pin, and the positioning part is used to assist in positioning when fixing the switch body to the circuit board.

[0106] In this implementation, the positioning parts are spaced apart from the pins to avoid interference with the electrical connection. The positioning parts are distributed across the surface of the switch body facing the circuit board, making the auxiliary positioning of the switch body more accurate. This solution incorporates positioning parts into the switch body, making the connection between the switch body and the circuit board more convenient.

[0107] Secondly, this application provides a photovoltaic system, which includes at least one of a photovoltaic module, a photovoltaic optimizer, a combiner box, a box-type transformer, a power sensor, an energy storage system, a grid-connected controller, and an intelligent subarray controller, as well as a photovoltaic inverter as described in any implementation of the first aspect, wherein the input terminal of the photovoltaic inverter is used to be electrically connected to the photovoltaic module, the output terminal of the photovoltaic inverter is used to be connected to the power grid, and the photovoltaic inverter is used to convert the direct current from the photovoltaic module into alternating current and to transmit the alternating current to the power grid.

[0108] In one implementation, the photovoltaic system includes photovoltaic modules, a photovoltaic optimizer, a photovoltaic inverter, an energy storage system, a grid-connected / off-grid controller, and a power sensor. The photovoltaic optimizer is installed on the photovoltaic modules, which convert solar energy into electrical energy. The photovoltaic optimizer improves the power generation efficiency of the photovoltaic modules. The photovoltaic modules are electrically connected to the photovoltaic inverter, transmitting direct current (DC) to the inverter. The photovoltaic inverter is electrically connected to both the energy storage system and the grid-connected / off-grid controller. The photovoltaic inverter has a DC-DC conversion module that converts the DC power generated by the inverter into the voltage required for energy storage in the energy storage system and transmits it to the system for energy storage. The photovoltaic inverter converts the DC power provided by the photovoltaic modules into alternating current (AC) and transmits the AC power to the grid-connected / off-grid controller. The grid-connected / off-grid controller is electrically connected to both the user equipment and the power grid. In practical applications, the grid-connected / off-grid controller has both off-grid and grid-connected states. When the grid-connected controller is in off-grid mode, there is no electrical connection between it and the power grid; the AC power transmitted by the photovoltaic inverter is only supplied to electrical appliances. These appliances include household appliances, such as televisions, refrigerators, and washing machines. When the grid-connected controller is in grid-connected mode, it is electrically connected to the power grid via a power sensor. When the power generated by the photovoltaic modules cannot meet the power demand of the electrical appliances, the power grid can supply power to the photovoltaic system through the grid-connected controller. When the power generated by the photovoltaic modules exceeds the power consumption of the electrical appliances, the grid-connected controller can transmit the excess power back to the grid. The power sensor is used to measure the power flow between the photovoltaic system and the power grid.

[0109] In one implementation, the photovoltaic system includes photovoltaic modules, a photovoltaic optimizer, a combiner box, a photovoltaic inverter, a box-type transformer, an energy storage system, and a smart subarray controller. The photovoltaic optimizer is installed on top of the photovoltaic modules, which convert solar energy into electrical energy; the optimizer improves the power generation efficiency of the photovoltaic modules. The photovoltaic system may contain multiple photovoltaic modules and photovoltaic optimizers. Each photovoltaic module is electrically connected to a photovoltaic inverter. The photovoltaic inverter is connected to the energy storage system to store the direct current (DC) generated by the photovoltaic inverter. The combiner box is an AC combiner box, used to collect and transmit the AC power generated by the multiple photovoltaic inverters to the box-type transformer. The box-type transformer transforms the voltage of the AC power generated by the photovoltaic inverters before transmitting it to the power grid through a distribution room. The smart subarray controller communicates with the combiner box and the box-type transformer to achieve communication control of the photovoltaic system. Attached Figure Description

[0110] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the embodiments of this application will be described below.

[0111] Figure 1 This is a schematic diagram of the structure of a photovoltaic system applied to a household power station according to an embodiment of this application; Figure 2 This is a schematic diagram of the structure of a photovoltaic system applied to an industrial photovoltaic power station according to an embodiment of this application; Figure 3 This is a schematic diagram of the structure of a photovoltaic module and a photovoltaic inverter provided in an embodiment of this application; Figure 4 This is a schematic diagram of the structure of a photovoltaic inverter provided in one embodiment of this application; Figure 5 This is a front view of a photovoltaic inverter provided in one embodiment of this application; Figure 6 This is a front view of a photovoltaic inverter provided in one embodiment of this application, with the cover plate removed; Figure 7 yes Figure 6 The diagram shows an AA cross-sectional view of the photovoltaic inverter. Figure 8 This is a schematic diagram of the structure of a switching assembly provided in an embodiment of this application; Figure 9 This is a schematic diagram of the structure of a segmentation unit provided in an embodiment of this application; Figure 10 This is a schematic diagram of the structure of a switch assembly and circuit board provided in an embodiment of this application; Figure 11 This is a schematic diagram of the structure of a segmentation unit provided in an embodiment of this application; Figure 12 This is a partial structural schematic diagram of a photovoltaic inverter provided in one embodiment of this application; Figure 13 This is a schematic diagram of the structure of a photovoltaic inverter provided in one embodiment of this application; Figure 14 This is a cross-sectional view of a photovoltaic inverter provided in an embodiment of this application; Figure 15 This is a schematic diagram of the structure of the switch body and circuit board provided in one embodiment of this application; Figure 16 This is a schematic diagram of the structure of the switch body and circuit board provided in one embodiment of this application; Figure 17 This is a schematic diagram of the structure of the switch body and circuit board provided in one embodiment of this application; Figure 18 This is a schematic diagram of the structure of the switch body and circuit board provided in one embodiment of this application; Figure 19 This is a schematic diagram of the structure of the switch body and circuit board provided in one embodiment of this application; Figure 20This is a schematic diagram of the structure of the switch body and circuit board provided in one embodiment of this application; Figure 21 This is a schematic diagram of the structure of the switch body and circuit board provided in one embodiment of this application; Figure 22 This is a schematic diagram of the structure of the switch body and circuit board provided in one embodiment of this application; Figure 23 This is a cross-sectional view of a photovoltaic inverter provided in an embodiment of this application; Figure 24 This is a schematic diagram of the electrical connections of a photovoltaic inverter provided in an embodiment of this application; Figure 25 This is a cross-sectional view of a photovoltaic inverter provided in an embodiment of this application; Figure 26 This is a partial structural schematic diagram of a photovoltaic inverter provided in one embodiment of this application; Figure 27 This is a partial structural schematic diagram of a photovoltaic inverter provided in one embodiment of this application; Figure 28 This is a cross-sectional view of a photovoltaic inverter provided in an embodiment of this application; Figure 29 This is a partial structural schematic diagram of a photovoltaic inverter provided in one embodiment of this application; Figure 30 yes Figure 29 The image shown is a partial enlarged view of the photovoltaic inverter. Figure 31 This is a front view of a photovoltaic inverter provided in an embodiment of this application; Figure 32 This is a partial structural schematic diagram of a photovoltaic inverter provided in one embodiment of this application; Figure 33 yes Figure 32 Enlarged view of part M in the image; Figure 34 This is a partial structural schematic diagram of a photovoltaic inverter provided in one embodiment of this application; Figure 35 This is a schematic diagram of the structure of the insulating support and PV port in a photovoltaic inverter provided in one embodiment of this application; Figure 36 This is a schematic diagram of the structure of the insulating support and PV port in a photovoltaic inverter provided in one embodiment of this application; Figure 37 This is a schematic diagram of the structure of the insulating support and filter circuit board portion in a photovoltaic inverter provided in one embodiment of this application; Figure 38 This is a schematic diagram of the structure of the insulating support and filter circuit board portion in a photovoltaic inverter provided in one embodiment of this application; Figure 39This is an exploded view of the insulating support and filter circuit board portion of a photovoltaic inverter provided in one embodiment of this application; Figure 40 This is a partial structural schematic diagram of a photovoltaic inverter provided in one embodiment of this application; Figure 41 This is a top view of a switch body provided in an embodiment of this application. Detailed Implementation

[0112] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0113] In this document, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "multiple" means two or more.

[0114] Furthermore, in this article, directional terms such as "upper" and "lower" are defined relative to the orientation of the structure as shown in the attached drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the structure.

[0115] For ease of understanding, the relevant technical terms and English abbreviations involved in the embodiments of this application will be explained and described below.

[0116] Photovoltaic inverter: An inverter is a converter that transforms direct current into fixed-frequency and fixed-voltage or frequency- and voltage-regulated alternating current. A photovoltaic inverter is an inverter that converts the variable DC voltage generated by solar panels (also known as photovoltaic panels) into AC power at the mains frequency.

[0117] Parallelism: The parallelism defined in this application is not limited to absolute parallelism. This definition of parallelism can be understood as basic parallelism, allowing for situations where the parallelism is not absolute due to factors such as assembly tolerances, design tolerances, and structural flatness.

[0118] Perpendicularity: The perpendicularity defined in this application is not limited to an absolute perpendicular intersection (with an included angle of 90 degrees). It is permissible for non-absolute perpendicular intersections caused by factors such as assembly tolerances, design tolerances, and structural flatness. It is permissible for errors within a small angular range, such as an assembly error range of 80 to 100 degrees, which can all be understood as a perpendicular relationship.

[0119] PV: an abbreviation for photovoltaic, referring to the generation of electricity using solar energy. PV port indicates the port connected to the photovoltaic module.

[0120] OT terminal: also known as a circular cold-pressed terminal, it has a circular head and a cylindrical tail, and its appearance presents an OT shape, hence the name OT terminal in the industry.

[0121] This application provides a photovoltaic inverter, including a housing, a circuit board, heat sink fins, a switching assembly, and multiple PV ports. The housing includes a bottom shell and a cover plate, which together form a receiving chamber. The bottom shell includes a base plate disposed opposite to the cover plate.

[0122] The circuit board includes a front side and a back side disposed opposite to each other along a first direction. Metal traces are provided on the circuit board. The front side faces the cover plate, and the back side faces the base plate. The circuit board is fixed within a receiving cavity of the housing, dividing the receiving cavity into a first sub-cavity and a second sub-cavity. The first sub-cavity is located between the front side of the circuit board and the cover plate, and the second sub-cavity is located between the back side of the circuit board and the base plate. The volume of the first sub-cavity is smaller than the volume of the second sub-cavity to accommodate a first device and a second device, respectively. The heat generated by the second device is greater than that of the first device, or the length of the second device along the first direction is greater than that of the first device along the first direction. The first device includes a surface-mount resistor and a surface-mount capacitor fixed to the front side of the circuit board. The second device includes an inverter power assembly, a bus capacitor, and an inductor fixed to the back side of the circuit board.

[0123] The heat sink fins are located on the side of the base plate away from the cover plate. The inverter power component is provided with a thermally conductive contact part on the side away from the circuit board. The inverter power component is thermally connected to part of the heat sink fins through the thermally conductive contact part. The bus capacitor and inductor are located around the thermally conductive contact part.

[0124] The switch assembly includes a knob, a connecting rod, and a switch body. The knob and switch body are located on the outer and inner sides of the housing, respectively. The knob is connected to the switch body via the connecting rod, and the switch body is located in the second sub-cavity. The switch body is connected to a circuit board and includes multiple breaking units arranged in the same direction as the knob and switch body. Each breaking unit includes a pin, and the pins of each breaking unit are rigidly fixed to the reverse side of the circuit board.

[0125] One end of the PV port is located inside the housing and connected to the circuit board, while the other end of the PV port extends through the housing to the outside of the housing.

[0126] The PV port is connected to some pins of the switch body through the metal traces of the circuit board. Some pins of the switch body are connected to the bus capacitor through the metal traces of the circuit board. The bus capacitor is connected to the inverter power component through the metal traces of the circuit board.

[0127] In the photovoltaic inverter provided in this application embodiment, the circuit board is inverted and placed inside the photovoltaic inverter, and the inverter power components are fixed to the back of the circuit board. This arrangement is beneficial for both heat dissipation and product aesthetics. The switch body is rigidly fixed to the back of the circuit board via pins, eliminating the need for cable connections, which helps avoid wiring faults and reduces the assembly difficulty of the photovoltaic inverter.

[0128] The photovoltaic inverter provided in this application can be applied to photovoltaic systems, and the photovoltaic system containing the photovoltaic inverter of this application can be used in two application scenarios: residential power stations and industrial photovoltaic power stations.

[0129] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of a photovoltaic system 1 applied to a household power station according to an embodiment of this application. In one embodiment, the photovoltaic system 1 includes a photovoltaic module 20, a photovoltaic optimizer 30, a photovoltaic inverter 10, an energy storage system 40, a grid-connected controller 50, and a power sensor 60.

[0130] A photovoltaic optimizer 30 is installed on a photovoltaic module 20, which converts solar energy into electrical energy. The photovoltaic optimizer 30 is used to improve the power generation efficiency of the photovoltaic module 20. Specifically, the photovoltaic optimizer 30 is a DC-input, DC-output module-level power electronic device. By connecting in series with the photovoltaic module 20, it employs predictive current and voltage technology to ensure the module is always in optimal operating condition. Following the working principle of a step-down topology, it addresses the impact of shading, inconsistent orientation, or differences in module electrical specifications on power generation in photovoltaic power plants, achieving maximum module power output and increasing system power generation.

[0131] The photovoltaic module 20 is electrically connected to the photovoltaic inverter 10, and the photovoltaic module 20 transmits direct current to the photovoltaic inverter 10. The photovoltaic inverter 10 is electrically connected to the energy storage system 40 and the grid-connected / off-grid controller 50.

[0132] In one embodiment, the photovoltaic inverter 10 has a DC-DC conversion module. The DC-DC conversion module of the photovoltaic inverter 10 can be used to convert the DC power generated by the photovoltaic inverter into the voltage required for energy storage in the energy storage system 40, and transmit it to the energy storage system 40 for energy storage.

[0133] In one embodiment, the photovoltaic inverter 10 converts the direct current (DC) power provided by the photovoltaic module 20 into alternating current (AC) power and transmits the AC power to the grid-connected / off-grid controller 50. The grid-connected / off-grid controller 50 is electrically connected to the electrical device 2 on one hand and to the power grid 3 on the other. In practical applications, the grid-connected / off-grid controller 50 has both off-grid and grid-connected states.

[0134] When the grid-connected controller 50 is in an off-grid state, there is no electrical connection between the grid-connected controller 50 and the power grid 3, and the AC power transmitted by the photovoltaic inverter 10 is only supplied to the electrical appliances 2. The electrical appliances 2 include household appliances, such as televisions, refrigerators, and washing machines.

[0135] When the grid-connected controller 50 is in grid-connected mode, it is electrically connected to the power grid 3 via the power sensor 60. When the electrical energy generated by the photovoltaic module 20 cannot meet the power demand of the electrical equipment 2, the power grid 3 can supply electrical energy to the photovoltaic system 1 through the grid-connected controller 50. When the power generation of the photovoltaic module 20 exceeds the power consumption of the electrical equipment 2, the grid-connected controller 50 can transmit the excess power to the power grid 3. The power sensor 60 is used to measure the power flow between the photovoltaic system 1 and the power grid 3; for example, the power sensor 60 can be an electricity meter.

[0136] Please see Figure 2 , Figure 2 This is a schematic diagram of the structure of a photovoltaic system 1 applied to an industrial photovoltaic power station, provided in one embodiment of this application. In one embodiment, the photovoltaic system 1 includes a photovoltaic module 20, a photovoltaic optimizer 30, a combiner box 70, a photovoltaic inverter 10, a box-type transformer 80, an energy storage system 40, and an intelligent subarray controller 90.

[0137] The photovoltaic optimizer 30 is installed on the photovoltaic module 20, which is used to convert light energy into electrical energy, and the photovoltaic optimizer 30 is used to improve the power generation efficiency of the photovoltaic module 20.

[0138] In some embodiments, the photovoltaic system 1 may include a plurality of photovoltaic modules 20 and a photovoltaic optimizer 30. Each of the plurality of photovoltaic modules 20 is electrically connected to a photovoltaic inverter 10.

[0139] In one embodiment, the photovoltaic inverter 10 is connected to the energy storage system 40 to store the direct current generated by the photovoltaic inverter 10. In another embodiment, a DC combiner box is provided between the plurality of photovoltaic inverters 10 and the energy storage system 40. Figure 2 (Not shown in the image) is used to combine the DC power generated by multiple photovoltaic inverters 10 and transmit it to the energy storage system 40 for storage. It is understood that a DC conversion function module capable of converting the DC power generated by the photovoltaic modules 20 into DC power that can be stored in the energy storage system 40 can be provided in the photovoltaic inverter 10.

[0140] in, Figure 2The combiner box 70 shown is an AC combiner box, used to collect and transmit the AC power generated by multiple photovoltaic inverters 10 to the box-type transformer 80. The box-type transformer 80 is used to transform the voltage of the AC power generated by the photovoltaic inverters 10, and then transmit it to the power grid 3 through the distribution room 4. The intelligent subarray controller 90 has signal transmission (e.g., ...) with at least one of the combiner box 70, the box-type transformer 80, the photovoltaic inverters 10, and the environmental monitoring instrument (not shown in the figure). Figure 2 (As shown by the dashed line in the middle), the intelligent subarray controller 90 is used to realize communication control of the photovoltaic system 1.

[0141] It should be noted that, Figure 1 and Figure 2 This illustration only shows the application scenarios of photovoltaic system 1 in household power stations and industrial photovoltaic power stations, and does not represent the structure, size and positional relationship of the internal components of photovoltaic system 1. Those skilled in the art can make adjustments according to actual needs.

[0142] In one embodiment, the photovoltaic system 1 includes at least one of the following: photovoltaic module 20, photovoltaic optimizer 30, combiner box 70, box-type transformer 80, power sensor 60, energy storage system 40, grid-connected / off-grid controller 50, and intelligent subarray controller 90, as well as photovoltaic inverter 10. Users can combine at least one of the following components with the photovoltaic inverter 10 as needed: photovoltaic module 20, photovoltaic optimizer 30, combiner box 70, box-type transformer 80, power sensor 60, energy storage system 40, grid-connected / off-grid controller 50, and intelligent subarray controller 90.

[0143] For example, the photovoltaic module 20 and the photovoltaic inverter 10 can be combined as a whole and then used in conjunction with any of the aforementioned devices. Please refer to [link to relevant documentation]. Figure 3 , Figure 3 This is a schematic diagram of the structure of a photovoltaic module 20 and a photovoltaic inverter 10 provided in one embodiment of the present application. In one embodiment, the photovoltaic module 20 includes at least one photovoltaic panel 21, which is connected to the photovoltaic inverter 10. In another embodiment, the photovoltaic module 20 includes multiple photovoltaic panels 21 connected in series. The DC power from the multiple photovoltaic panels 21 is collected and connected to the photovoltaic inverter 10 through the series connection.

[0144] For example, the energy storage system 40 and the photovoltaic inverter 10 are combined as a whole photovoltaic system and used in conjunction with any of the above devices.

[0145] In one embodiment, the photovoltaic inverter 10 includes a housing, a circuit board, and a switching assembly. Figure 1 and Figure 2(Not shown in the diagram) The switching assembly is used to control the connection and disconnection between the photovoltaic inverter 10 and the photovoltaic module 20. In scenarios such as replacing or repairing the photovoltaic inverter 10, the switching assembly is needed to control the disconnection and electrical connection between the photovoltaic module 20 and the photovoltaic inverter 10 to prevent damage to the equipment due to short circuits. The photovoltaic inverter 10 fixes the switching assembly 300 to the housing 100. If the switching assembly 300 is connected to the circuit board 200 (…), Figure 1 The electrical connection between the components (not shown in the diagram) and the circuit board is achieved through cables, resulting in numerous internal wiring connections in the photovoltaic inverter 10, making installation cumbersome and prone to wiring faults. Furthermore, if large or heat-generating components are fixed to the front of the circuit board, their heat dissipation is poor, affecting the efficiency of the photovoltaic inverter 10.

[0146] In this application, the photovoltaic inverter 10 has the circuit board flipped inside the housing, and large-volume components or components with high heat generation, such as inverter power components, capacitors and inductors, and switching components, are rigidly fixed to the back of the circuit board. This reduces internal wiring, facilitates the installation and maintenance of the photovoltaic inverter 10, improves the safety performance of the photovoltaic inverter 10, and enhances heat dissipation.

[0147] The photovoltaic inverter 10 provided in the embodiments of this application will be described in detail below.

[0148] Please see Figures 4 to 7 , Figure 4 This is a schematic diagram of the structure of a photovoltaic inverter 10 provided in one embodiment of this application. Figure 5 This is a front view of a photovoltaic inverter 10 provided in one embodiment of this application. Figure 6 This is a front view of a photovoltaic inverter 10 provided in one embodiment of this application, excluding the cover plate. Figure 7 for Figure 6 The photovoltaic inverter 10 shown is a partial cross-sectional view along AA. In one embodiment, the photovoltaic inverter 10 includes a housing 100, a circuit board 200, heat sink fins 600, a switching assembly 300, and a plurality of PV ports 501 (in combination with...). Figure 4 and Figure 7 As shown), the outer casing 100 includes a bottom casing 110 and a cover plate 120 (as shown). Figure 4 and Figure 5 As shown), the bottom shell 110 and the cover plate 120 enclose the receiving chamber S (as shown). Figure 7 As shown), the bottom shell 110 includes a bottom plate 111 disposed opposite to the cover plate 120 (as shown). Figure 4 (As shown).

[0149] In this embodiment, the bottom shell 110 has a groove-shaped structure, and the bottom shell 110 and the cover plate 120 form a receiving chamber S (e.g., Figure 7As shown), the receiving chamber S in the housing 100 is used to protect the circuit board 200 and the switch assembly 300, the first device 700 and the second device 800 fixed to the circuit board 200 (as shown). Figure 7 As shown, since the circuit board 200 is fixedly connected to the housing 100, the switch assembly 300, the first device 700, and the second device 800 are also relatively fixed to the housing 100. When the external environment applies external force to the photovoltaic inverter 10, the switch assembly 300, the first device 700, and the second device 800 are not easily displaced relative to the housing 100 because they are fixed to the housing 100. This helps to improve the overall structural stability of the photovoltaic inverter 10 and allows the photovoltaic inverter 10 to operate in a stable state.

[0150] Please continue reading. Figure 6 and Figure 7 The circuit board 200 includes a front side 220 and a back side 230 disposed opposite to each other along a first direction X, and metal traces 201 are provided on the circuit board 200. Figure 6 The location shown in 201 is only used to indicate that there is a metal trace 201 on the circuit board 200, and does not represent the actual location of the metal trace 201. It should be understood that in this application, the metal trace 201 of the circuit board 200 can be wired according to the functional devices in the photovoltaic inverter 10 to realize the function of the photovoltaic inverter 10.

[0151] Among them, the front side of the circuit board 220 faces the cover plate 120 (e.g. Figure 7 As shown), the reverse side 230 of the circuit board faces the base plate 111. The circuit board 200 is fixed in the receiving chamber S of the housing 100, dividing the receiving chamber S into a first sub-chamber S1 and a second sub-chamber S2. The first sub-chamber S1 is located between the front side 220 of the circuit board and the cover plate 120, and the second sub-chamber S2 is located between the reverse side 230 of the circuit board and the base plate 111. The volume of the first sub-chamber S1 is smaller than the volume of the second sub-chamber S2, to respectively accommodate the first device 700 and the second device 800. The heat generated by the second device 800 is greater than the heat generated by the first device 700, or the length of the second device 800 along the first direction X is greater than the length of the first device 700 along the first direction X. The first device 700 includes a surface mount resistor 710 and a surface mount capacitor 720 (e.g., ...) fixed to the front side 220 of the circuit board. Figure 6 As shown), the second device 800 includes an inverter power assembly 810, a bus capacitor 820, and an inductor 830 (as shown) fixed to the reverse side 230 of the circuit board. Figure 7 (As shown).

[0152] In this embodiment, the circuit board 200 includes a front surface 220 and a back surface 230 disposed opposite to each other along a first direction X. The front surface 220 is the surface of the circuit board 200 directly presented to the user after the user opens the cover 120. Figure 5 and Figure 6 As shown, in Figure 5 The diagram shows the installation of the photovoltaic inverter 10. When the user needs to open the cover 120, the cover 120 faces the user. Indicator lights are located on the cover 120. Figure 5 The central section, shaped like a runway. The diagram presented to the user when the cover 120 is shown below. Figure 6 As shown, the front of the circuit board 220 faces the user.

[0153] In this embodiment, the front side 220 of the circuit board and the cover plate 120 form a first sub-cavity S1 (e.g., Figure 7 As shown, a first sub-cavity S1 is used to house a first device 700, and the reverse side of the circuit board 230 and the base plate 111 form a second sub-cavity S2, which is used to house a second device 800. The volume of the first sub-cavity S1 is smaller than that of the second sub-cavity S2, which is adapted to the size relationship between the volumes of the first device 700 and the second device 800. In one embodiment, the first device 700 further includes a diode.

[0154] In one embodiment, the surface-mount resistor 710 of the first device 700 is used to limit the current in the circuit and suppress circuit interference and noise, while the surface-mount capacitor 720 is used to store charge. The inverter power assembly 810 in the second device 800 is used to convert direct current to alternating current. In one embodiment, the bus capacitor 820 serves to store and smooth the direct current voltage. In one embodiment, the inductor 830 is used for at least one of filtering, direct current conversion, and power conversion. In one embodiment, the inductor 830 in the second device 800 includes at least one of a filter inductor, an inductor in a direct current conversion assembly, and an inductor in the inverter power assembly 810.

[0155] Please continue reading. Figure 7 In this embodiment, the heat dissipation fins 600 are located on the side of the base plate 111 away from the cover plate 120, and the inverter power assembly 810 is provided with a thermally conductive contact portion 202 on the side away from the circuit board 200. The inverter power assembly 810 is thermally connected to part of the heat dissipation fins 600 through the thermally conductive contact portion 202. The bus capacitor 820 and the inductor 830 are located around the thermally conductive contact portion 202.

[0156] The inverter power component 810 is the main heat-generating device in the photovoltaic inverter 10, therefore temperature rise control is required for this component. The inverter power component 810 is thermally connected to a portion of the heat sink fins 600 via a thermally conductive contact portion 202, which helps shorten the heat transfer path and improve heat dissipation. The bus capacitor 820 and inductor 830 are located around the thermally conductive contact portion 202, or around the inverter power component 810. The bus capacitor 820 and inductor 830 can be thermally connected to the heat sink fins 600 via the base plate 111, and the thermally conductive contact portion 202 can also absorb heat from the bus capacitor 820 and inductor 830 from its peripheral side, thereby improving heat dissipation. In one embodiment, the thermally conductive contact portion 202 may be a part of the base plate 111 or a thermally conductive structure located between the base plate 111 and the inverter power component 810.

[0157] In one embodiment, the heat sink 600 is connected to an external cooling system. When the cooling medium transmitted by the external cooling system is introduced into the heat sink 600, the cooling medium can remove the heat generated by the inverter power component 810 through the heat sink 600 and the thermally conductive contact part 202, thereby reducing the temperature of the photovoltaic inverter 10 under steady-state operation and realizing temperature control of the photovoltaic inverter 10.

[0158] Please refer to the following: Figure 7 and Figure 8 , Figure 8 This is a schematic diagram of the structure of a switch assembly 300 provided in an embodiment of this application. The switch assembly 300 includes a knob 310, a connecting rod 330, and a switch body 320. The knob 310 and the switch body 320 are located on the outer and inner sides of the housing 100, respectively (e.g., ...). Figure 7 As shown), knob 310 is connected to switch body 320 via connecting rod 330 (as shown). Figure 7 As shown), the switch body 320 is located in the second sub-chamber S2 (as shown). Figure 7 (As shown). The switch body 320 is connected to the circuit board 200, and the switch body 320 includes multiple breaking units 325 (such as...). Figure 8 As shown), the arrangement direction of the multiple disconnection units 325 is the same as that of the knob 310 and the switch body 320. Each disconnection unit 325 includes a pin 301, and the pin 301 of each disconnection unit 325 is rigidly fixed to the reverse side 230 of the circuit board (in conjunction with...). Figure 7 and Figure 8 (As shown).

[0159] In this embodiment, both the switch body 320 and the second device 800 are located in the second sub-chamber S2, and the switch body 320 is fixed to the reverse side 230 of the circuit board. The pin 301 is rigidly fixed to the reverse side 230 of the circuit board, ensuring that the switch body 320 and the reverse side 230 of the circuit board are fixed and electrically connected. Rigid fixing means that the pin 301 cannot rotate or move relative to the circuit board 200. Generally, when fixing the switch body 320 to the reverse side 230 of the circuit board, the switch body 320 is first fixed to the bottom shell 110 via the connecting rod 330, and then the circuit board 200 is connected to the switch body 320. Since the reverse side 230 of the circuit board is the surface of the circuit board 200 facing away from the operator, it is inconvenient for the operator to directly observe the reverse side 230 of the circuit board, and the second device 800 is already installed on the reverse side 230 of the circuit board. In this application, a rigid connection is used to fix the switch body 320 to the back side 230 of the circuit board. For example, the pin 301 can be directly inserted into the back side 230 of the circuit board to rigidly fix it to the back side 230 of the circuit board. Using a rigid connection can reduce the installation difficulty and reduce the contact resistance and heat generation between the switch body 320 and the circuit board 200.

[0160] In one embodiment, during the assembly of the photovoltaic inverter 10, the switch body 320 is first inserted into the back side 230 of the circuit board through the pins and fixed to the circuit board 230. The circuit board 230 and the switch body 320 are placed inside the bottom shell 110 at the same time, with the back side 230 of the circuit board containing the switch body 320 facing the bottom plate 111. Then, the connecting rod 330 in the switch assembly 300 is inserted into the switch body 320 through the bottom shell 110 from the outside of the bottom shell 110, so that the connecting rod 330 is fixed to the moving contact inside the switch body 320, so that the connecting rod 330 can drive the moving contact inside the switch body 320 to rotate. Then, the knob 310 is installed at the end of the connecting rod 330 located on the outside of the bottom shell 110. Alternatively, in one embodiment, after the circuit board 230 and the switch body 320 are placed inside the bottom shell 110, the knob 310 and one end of the connecting rod 330 are fixed in advance, and then the other end of the connecting rod 330 is inserted through the bottom shell 100 into the switch body 320 and fixed to the moving contact inside the switch body 320.

[0161] In one embodiment, the switch body 320 has a protrusion (not shown) on the side facing the knob 310. The projections of the switch body 320 and the protrusion in the first direction X are both located within the base plate 111, allowing the switch body 320, the protrusion, and the circuit board 230 to be smoothly placed inside the base shell 110 during the assembly of the photovoltaic inverter 10. The knob 310 has a connecting cylinder (not shown) on the side facing the switch body 320. When the knob 310 is assembled on the outside of the base shell 110, the connecting cylinder passes through the base shell 110 and directly interlocks with the protrusion, fixing the protrusion inside the connecting cylinder. This allows the knob 310 to drive the moving contact within the switch body 320 to rotate when rotated. It should be noted that the structural form of the protrusion and the connecting cylinder is not limited, as long as it allows the connecting cylinder to be fixed to the protrusion when the knob 310 is aligned with the switch body 320, thus enabling the knob 310 to drive the moving contact within the switch body 320.

[0162] Unlike rigid connections, flexible connections are used. For example, a flexible connection can be achieved using cables, which can rotate or move relative to the circuit board 200. If the disconnecting unit 325 of the switch body 320 is flexibly connected to the circuit board 200 via a cable, the internal wiring of the photovoltaic inverter 10 will become messy. Furthermore, since the cable can move relative to the circuit board 200, fixing the switch body 320 to the reverse side 230 of the circuit board via the cable will be difficult to position and install, easily leading to low operating efficiency and poor connections. Moreover, both ends of the cable typically require OT terminals to connect to the reverse side 230 of the circuit board and the switch body 320 respectively, increasing the contact resistance and heat generation of the entire circuit, resulting in a decrease in overall efficiency.

[0163] In this embodiment, the switch body 320 and the second device 800 are fixed together on the back side 230 of the circuit board. This is equivalent to concentrating the larger devices or those with a larger length along the first direction X on the back side 230 of the circuit board. Compared with dispersing the switch body 320 and the second device 800 on the front side 220 and the back side 230 of the circuit board, this embodiment can reduce the overall length of the photovoltaic inverter 10 in the first direction X, making the photovoltaic inverter 10 smaller and which is beneficial to the overall layout of the photovoltaic system.

[0164] In one embodiment, the first direction X is perpendicular to the base plate 111, and the first direction X is the same as the height direction of the photovoltaic inverter 10. This embodiment helps to reduce the installation difficulty of the switch body 320 and the circuit board 200, and the circuit board 200 and the housing 100.

[0165] One end of the PV port 501 is located inside the housing 100 and connected to the circuit board 200 (not shown), while the other end of the PV port 501 extends through the housing 100 to the outside of the housing 100 (in conjunction with...). Figure 4and Figure 6 (As shown).

[0166] In this embodiment, the two ends of the PV port 501 are located inside the housing 100 and outside the housing 100, respectively. The PV port 501 is used to transmit DC power to the inverter power component 810.

[0167] In this embodiment, the PV port 501 is connected to a portion of the pins 301 of the switch body 320 via the metal traces 201 of the circuit board 200 (e.g., ...). Figure 6 As shown, some pins 301 of the switch body 320 are connected to the bus capacitor 820 via metal traces 201 on the circuit board 200. The bus capacitor 820 is connected to the inverter power assembly 810 via metal traces 201 on the circuit board 200. In this embodiment, the connection refers to an electrical connection, which can be a direct or indirect fixed connection from a structural perspective. The circuit board 200 has multiple metal traces 201, which can also be called wires and can be copper wires, used to connect devices on the circuit board 200.

[0168] For example, the PV port 501 and some pins 301 of the switch body 320 are located at different positions on the circuit board 200 and need to be electrically connected through the metal traces 201 of the circuit board 200. The PV port 501 is directly and fixedly connected to one end of one of the metal traces 201 on the circuit board 200, and some pins 301 of the switch body 320 are directly and fixedly connected to the other end of the metal trace 201, thereby achieving an electrical connection between the PV port 501 and some pins 301 of the switch body 320.

[0169] In some embodiments, a via is included at one end of the metal trace 201, and the PV port 501 can be fixedly connected to one end of the metal trace 201 by inserting a screw or pin into the via.

[0170] In one embodiment, the bus capacitor 820 or the inverter power component 810 and one end of the metal trace 201 can be fixedly connected at intervals by soldering.

[0171] In some implementations, functional devices may be provided between the PV port 501 and some pins 301 of the switch body 320 as needed, and the PV port 501 and the functional devices, or the functional devices and the pins 301, may be electrically connected by metal traces 201.

[0172] In this embodiment, the PV port 501 and the pins 301 of the switch body 320, the pins 301 and the bus capacitor 820, and the bus capacitor 820 and the inverter power component 810 are connected by metal traces 201, reducing or eliminating the use of cables and simplifying installation. In this embodiment, the PV port 501 converts DC power to AC power through these connections, reducing contact resistance and heat generation between components and improving the operating efficiency of the photovoltaic inverter 10.

[0173] In this embodiment of the application, by setting up the photovoltaic inverter 10: First, the circuit board 200 is flipped up and placed in the photovoltaic inverter 10, and the second device 800 with a large heat generation or a large volume is placed on the back side 230 of the circuit board to improve the heat dissipation effect of the second device 800; while the first device 700 with a small heat generation or a small volume is placed on the front side 220 of the circuit board, so that the volume of the first sub-cavity S1 between the front side 220 of the circuit board and the cover plate 120 is small, making full use of the internal space of the photovoltaic inverter 10, which is conducive to the miniaturization of the photovoltaic inverter 10.

[0174] Secondly, since the circuit board 200 is inverted within the photovoltaic inverter 10, to improve heat dissipation and internal space utilization, the inverter power component 810 is thermally connected to the heat sink fins 600 via a thermally conductive contact portion 202. This effectively shortens the heat transfer path between the inverter power component 810 and the heat sink fins 600, thus improving heat dissipation for the inverter power component 810. The thermally conductive contact portion 202 also provides support for the circuit board 200, enhancing the structural strength and reliability between the circuit board 200 and the casing 100 within the photovoltaic inverter 10.

[0175] Third, both the switch body 320 and the second device 800 of the switch assembly 300 are fixed to the reverse side 230 of the circuit board. During installation, since it is inconvenient for the operator to directly observe the reverse side 230 of the circuit board, this application sets the switch body 320 to be rigidly fixed to the reverse side 230 of the circuit board via pins 301. Compared with flexible fixing, this application helps to reduce the installation difficulty and eliminates the step of manual fixing. The cable-free connection between the switch body 320 and the circuit board 200 can also reduce the contact resistance and heat generation between the switch body 320 and the circuit board 200, improve the working efficiency of the photovoltaic inverter 10, and at the same time, reduce the impact of poor contact between the switch body 320 and the circuit board 200 during processing, transportation and assembly.

[0176] Please see Figure 9 , Figure 9This is a schematic diagram of the structure of the disconnecting unit 325 provided in one embodiment of the present application. In one embodiment, the disconnecting unit 325 includes a moving contact 3251 and a stationary contact 3252. The end of the pin 301 away from the circuit board is fixed to the stationary contact 3252. The stationary contact 3252 is connected to the metal trace of the circuit board through the pin 301. The knob can control the rotation of the moving contact 3251 of the disconnecting unit 325 to realize the opening or closing of the moving contact 3251 and the stationary contact 3252.

[0177] In this embodiment, the disconnecting unit 325 is electrically connected between the photovoltaic module 20 and the inverter power module 810 via pin 301. In this embodiment, the two ends of pin 301 are directly fixed to the disconnecting unit 325 and the circuit board, respectively. Compared to using cable connections, this avoids increased assembly and maintenance difficulty due to numerous wiring connections. Furthermore, directly connecting and fixing the disconnecting unit 325 and the circuit board via pin 301 reduces the space occupied by internal components of the photovoltaic inverter 10, thereby reducing the overall size of the photovoltaic inverter 10. Additionally, directly connecting and fixing the metal traces of the disconnecting unit 325 and the circuit board via pin 301 reduces the resistance between the disconnecting unit 325 and the circuit board, resulting in a shorter current transmission path from the disconnecting unit 325 to the circuit board, improving current transmission efficiency, and thus enhancing the operating performance of the photovoltaic inverter 10.

[0178] In one embodiment, the end of pin 301 furthest from the circuit board is connected to stationary contact 3252 via a connecting portion (not shown). Exemplarily, the connecting portion is solder, and pin 301 and stationary contact 3252 are fixed together by soldering. Exemplarily, the connecting portion may be a metal rod or a metal sheet.

[0179] In one embodiment, one end of the stationary contact 3252 extends to the outside of the disconnecting unit 325 to form a pin 301. In this embodiment, the pin 301 and the stationary contact 3252 are integrally formed, which helps to improve the connection stability between the pin 301 and the stationary contact 3252.

[0180] Please continue reading. Figure 8 , Figure 9 and Figure 10 , Figure 10 This is a schematic diagram of the structure of a switch assembly 300 and a circuit board 200 provided in one embodiment of this application. In one embodiment, the switch body 320 includes a plurality of breaking units 325 (such as...). Figure 8 and Figure 10 As shown), each breaking unit 325 includes a moving contact 3251 and two stationary contacts 3252 (as shown). Figure 9 As shown), the moving contact 3251 rotates, causing its two ends to contact or disconnect from the two stationary contacts 3252 respectively, thereby achieving the closing and opening of the moving contact 3251 and the stationary contacts 3252.

[0181] Please refer to the following: Figures 8 to 11 , Figure 11 This is a schematic diagram of the structure of the interruption unit 325 provided in one embodiment of the present application. In one embodiment, the pin 301 includes an input pin pair 3211 and an output pin pair 3221 (see reference). Figure 9 and Figure 11 ), where the input pin pair 3211 includes two input pins 321 (e.g. Figure 9 As shown), the output pin pair 3221 includes two output pins 322. The ends of the two input pins 321 of the input pin pair 3211 furthest from the circuit board are electrically connected to and fixed to the two stationary contacts 3252 of the disconnecting unit 325 (as shown). Figure 9 (as shown) Figure 9 The interruption unit 325 shown is an input interruption unit. The ends of the two input pins 321 furthest from the circuit board are respectively soldered and fixed to two stationary contacts 3252. In this embodiment, both ends of each input pin 321 of the input pin pair 3211 are directly fixed to the interruption unit 325 and the circuit board respectively (see reference). Figure 9 and Figure 10 Compared to cable connections, this method avoids the increased assembly and maintenance complexity caused by numerous wiring connections. Furthermore, directly connecting and fixing the disconnect unit 325 to the circuit board via input pin 321 reduces the space occupied by internal components of the photovoltaic inverter 10, thereby reducing the overall size of the inverter 10. Additionally, directly connecting and fixing the disconnect unit 325 to the circuit board via input pin 321 reduces the resistance between the disconnect unit 325 and the circuit board, resulting in a shorter current transmission path and improved current transmission efficiency, thus enhancing the performance of the photovoltaic inverter 10.

[0182] In one embodiment, one end of the stationary contact 3252 extends to the outside of the disconnecting unit 325 to form an input pin 321 and an output pin 322. In this embodiment, either the input pin 321 or the output pin 322 is integrally formed with the stationary contact 3252, which helps to improve the connection stability between the input pin 321 and the output pin 322 and the stationary contact 3252.

[0183] Please continue reading. Figure 11 In one embodiment, the disconnecting unit 325 is an output disconnecting unit. The two output pins 322 of a pair of output pins 3221, at the ends furthest from the circuit board, are electrically connected to and fixed to the two stationary contacts 3252 of the disconnecting unit 325. The disconnecting unit 325 is electrically connected between the negative terminal of the photovoltaic module and the negative terminal of the inverter power module through the output pins 3221.

[0184] In one embodiment, the number of input pin pairs 3211 is 3, the number of output pin pairs 3221 is 1, and correspondingly, the number of input interruption units is 3 and the number of output interruption units is 1.

[0185] It should be noted that, Figure 9 and Figure 11 The diagram only schematically illustrates the connection relationship between the stationary contact 3252 and the pin 301, and does not represent the specific structure, size, or positional relationship between the stationary contact 3252 and the moving contact 3251.

[0186] Please refer to the following: Figure 8 and Figure 12 , Figure 12 This is a partial structural diagram of a photovoltaic inverter 10 provided in one embodiment of this application. In one implementation, pin 301 includes an input pin 321 and an output pin 322 (e.g., ...). Figure 8 and Figure 12 As shown), the interruption unit 325 includes an input interruption unit and an output interruption unit. The input pin 321 and the output pin 322 are located in the input interruption unit and the output interruption unit, respectively (as shown). Figure 8 , Figure 9 and Figure 11 (As shown). Knob 310 is used to control the connection between input pins 321 and the connection between output pins 322, and also to control the disconnection between input pins 321 and the disconnection between output pins 322. This embodiment can control the connection and disconnection between input pins 321 and output pins 322 through knob 310, thereby realizing the electrical connection and disconnection between photovoltaic module 20 and switch body 320.

[0187] Please refer to the following: Figure 12 and Figure 13 , Figure 13 This is a schematic diagram of the structure of a photovoltaic inverter 10 provided in one embodiment of this application. In one implementation, the switch body 320 includes at least one pair of input pins 3211 and at least one pair of output pins 3221 (e.g., ...). Figure 12 As shown), each pair of input pins 3211 includes two input pins 321, and each pair of output pins 322 includes two output pins 322. The PV port 501 includes a positive connector 510 and a negative connector 520 (as shown). Figure 13 (As shown).

[0188] In the input interruption unit, one of the input pins 321 in each pair of input pins 3211 is used to connect to the positive connector 510 via a metal trace on the circuit board 200 (in combination). Figure 12 and Figure 13As shown), two input pins 321 in each input pin pair 3211 are connected through the stationary contact 3252 and the moving contact 3251 in the input disconnection unit, and the other input pin 321 in each input pin pair 3211 is used to connect to the bus capacitor 820 through the metal trace on the circuit board 200 (in conjunction with...). Figure 6 and Figure 12 (As shown).

[0189] In the output disconnect unit, one of the output pins 322 in each pair of output pins 3221 is used to connect to the negative connector 520 via a metal trace on the circuit board 200 (in combination). Figure 12 and Figure 13 As shown), two output pins 322 in each output pin pair 3221 are connected via stationary contact 3252 and moving contact 3251 in the output disconnect unit. The other output pin 322 in each output pin pair 3221 is used to connect to the inverter power component 810 via a metal trace on the circuit board 200 (in conjunction with...). Figure 6 and Figure 12 (As shown).

[0190] In this embodiment, the inverter power component 810 forms a circuit with the photovoltaic module 20 through input pin pair 3211 and output pin pair 3221. Input pin pair 3211 is located between the positive terminal of the photovoltaic module 20 and the inverter power component 810, and output pin pair 3221 is located between the inverter power component 810 and the negative terminal of the photovoltaic module 20. Current flows from the positive terminal of the photovoltaic module 20 to the inverter power component 810, and then from the inverter power component 810 to the negative terminal of the photovoltaic module 20. In this embodiment, the input pin 321 and the output pin 322 are electrically connected to the photovoltaic module 20 and the inverter power component 810 respectively through metal traces on the circuit board 200. This eliminates the need for cables between the switch body 320 and the photovoltaic module 20 and the inverter power component 810, which helps to save costs, reduce internal space occupancy, and improve the convenience of installation and operation.

[0191] Please continue reading. Figure 12 and Figure 13 In one embodiment, the photovoltaic inverter 10 includes a plurality of connector pairs 500 fixed to the base housing 110 (e.g., ...). Figure 12 and Figure 13 As shown), each connector pair 500 includes a positive connector 510 and a negative connector 520 (as shown). Figure 13 As shown), one end of the positive connector 510 is connected to the positive terminal of the photovoltaic module 20 (not shown in the figure), and the other end of the positive connector 510 is fixed to the circuit board 200 and electrically connected to the circuit board 200 (as shown in the figure). Figure 12As shown), one end of the negative connector 520 is connected to the negative terminal of the photovoltaic module 20 (not shown in the figure), and the other end of the negative connector 520 is fixed to the circuit board 200 and electrically connected to the circuit board 200 (as shown in the figure). Figure 12 As shown). One of the input pins 321 in each pair of input pins 3211 is electrically connected to the other end of the positive connector 510 via the circuit board 200 (as shown). Figure 13 As shown), and then electrically connected to the positive terminal of the photovoltaic module 20. One of the output pins 322 in each pair of output pins 3221 is used to electrically connect to the other end of the negative connector 520 via the circuit board 200 (as shown). Figure 13 As shown in the figure, it is then electrically connected to the negative electrode of the photovoltaic module 20.

[0192] In one embodiment, the number of input pin pairs 3211 is 3, and the number of connector pairs 500 is 3 pairs, the same as the number of input pin pairs 3211. The positive connectors 510 of each of the 3 connector pairs 500 are electrically connected to one input pin 321 of each of the 3 input pin pairs 3211, and the negative connectors 520 of each of the 3 connector pairs 500 are all electrically connected to one output pin 322 of each of the output pin pairs 3221. In other embodiments, the number of connector pairs 500 can be determined based on the number of input pin pairs 3211, and is not limited thereto.

[0193] In one embodiment, the bottom housing 110 is also provided with a connector pair that is electrically connected to the battery pack (not shown in the figure), such as... Figure 13 As shown, PV port 501 includes three pairs of connectors 500, wherein the three pairs of connectors 500 are used for electrical connection with photovoltaic modules, and the photovoltaic inverter also includes one pair of connectors 500 for electrical connection with battery packs.

[0194] Please see Figure 14 , Figure 14 This is a cross-sectional view of a photovoltaic inverter 10 provided in one embodiment of this application. In one embodiment, pins 301 are all inserted into and rigidly fixed to the circuit board 200. Specifically, input pins 321 and output pins 322 are both inserted into and rigidly fixed to the circuit board 200. In this embodiment, input pins 321 and output pins 322 are rigid; for example, input pins 321 and output pins 322 are metal pins, which are inserted into the circuit board 200 to rigidly fix the input pins 321 and output pins 322 to the circuit board 200. When the knob 310 is used to control the switch body 320 to open, the switch body 320 controls the inverter power component 810 to disconnect from the photovoltaic module through the input pins 321 and output pins 322. When the knob 310 is used to control the switch body 320 to close, the switch body 320 controls the inverter power component 810 to be electrically connected to the photovoltaic module through the input pins 321 and output pins 322.

[0195] In this embodiment, the input pin 321 and the output pin 322 are rigidly fixed to the circuit board 200 by inserting them into the circuit board 200. This allows the switch body 320 to be more easily fixed and electrically connected to the circuit board 200, simplifying the assembly process of the photovoltaic inverter 10 and saving labor costs. Furthermore, it shortens the distance between the switch body 320 and the circuit board 200 at the fixed electrical connection point, saving space at the connection point and improving the space utilization and power density of the photovoltaic inverter 10.

[0196] In one embodiment, during the process of installing the switch body 320 onto the back side 230 of the circuit board, it is generally necessary to first fix the switch body 320 onto the base shell 110 via the connecting rod 330, and then connect the circuit board 200 to the switch body 320. Since the back side 230 of the circuit board is the surface of the circuit board 200 facing away from the operator, it is not convenient for the operator to directly observe the back side 230 of the circuit board, and the second device 800 is already installed on the back side 230 of the circuit board. In this embodiment, the pins 301 can be directly inserted into the back side 230 of the circuit board and rigidly fixed thereto, which can reduce the installation difficulty. In this embodiment, it is only necessary to pre-align the positions of the pins 301 of the switch body 320 and the circuit board 200 by setting the dimensions, and then the circuit board 200 and the pins 301 can be directly inserted and fixed.

[0197] Compared to the cable connection method, which involves connecting one end of the cable to the switch body 320 before installing and fixing the circuit board 200, and then winding the other end of the cable from the back of the circuit board 230 to the side of the circuit board 200 and finally to the front of the circuit board 220 before the operator can securely connect the other end of the cable to the front of the circuit board 220, the current method is more complex and results in messy cable routing compared to the rigid connection method of this application. Therefore, the method of inserting the switch body 320 into the back of the circuit board 230 via pin 301 is more convenient and saves labor costs.

[0198] Please see Figure 15 , Figure 15This is a schematic diagram of the structure of the switch body 320 and the circuit board 200 provided in one embodiment of this application. In one embodiment, the extension direction of the pins 301 is perpendicular to the reverse side 230 of the circuit board. In a specific embodiment, the extension directions of the input pins 321 and the output pins 322 are both perpendicular to the reverse side 230 of the circuit board, so that the input pins 321 and the output pins 322 can be more easily inserted into the circuit board 200. Furthermore, the extension directions of the input pins 321 and the output pins 322 are perpendicular to the surface of the switch body 320 facing the circuit board 200, so that the switch body 320 and the circuit board 200 can be better fixedly connected by the input pins 321 and the output pins 322.

[0199] In this embodiment, the reverse side 230 of the circuit board is the surface of the circuit board 200 facing the switch body 320 along the first direction X. When the input pin 321 and output pin 322 of the switch body 320 are inserted into the circuit board 200, since the surface of the circuit board 200 facing the switch body 320 is parallel to the surface of the switch body 320 facing the circuit board 200, the resistance experienced by the input pin 321 and output pin 322 is small and they are not easily deformed. Therefore, the stability of the mechanical and electrical connection between the switch body 320 and the circuit board 200 can be improved, which is beneficial to ensuring the normal operation of the photovoltaic inverter 10.

[0200] It should be noted that the perpendicularity defined in the embodiments of this application is not limited to an absolute perpendicular intersection (with an included angle of 90 degrees). It is permissible for non-absolute perpendicular intersections caused by factors such as assembly tolerances, design tolerances, and structural flatness. It is permissible for errors within a small angle range, such as an assembly error range of 80 to 100 degrees, which can all be understood as a perpendicular relationship.

[0201] Please see Figure 16 , Figure 16 This is a schematic diagram of the structure of the switch body 320 and the circuit board 200 provided in one embodiment of this application. In one embodiment, the extending directions of the input pin 321 and the output pin 322 are perpendicular to either the reverse side 230 of the circuit board or the surface of the switch body 320 facing the circuit board 200. In this embodiment, the extending directions of the input pin 321 and the output pin 322 are perpendicular to either the reverse side 230 of the circuit board or the surface of the switch body 320 facing the circuit board 200. This reduces the difficulty of processing and facilitates a smoother fixing and electrical connection between the switch body 320 and the circuit board 200.

[0202] like Figure 16As shown, the extension directions of input pin 321 and output pin 322 are perpendicular to the surface of circuit board 200 facing switch body 320, and the angle between the extension directions of input pin 321 and output pin 322 and the surface of switch body 320 facing circuit board 200 is less than 90°. Specifically, the angle between the surface of circuit board 200 facing switch body 320 and the surface of switch body 320 facing circuit board 200 is less than 90°, meaning the surface of circuit board 200 facing switch body 320 and the surface of switch body 320 facing circuit board 200 are not parallel. In this embodiment, this helps reduce assembly difficulty. When there are too many components in the bottom case 110, making it impossible for the switch body 320 to be placed parallel in the bottom case 110, a method can be used... Figure 16 The embodiment shown electrically connects the switch body 320 to the circuit board 200.

[0203] Please see Figure 17 , Figure 17 This is a schematic diagram of the structure of the switch body 320 and the circuit board 200 provided in one embodiment of this application. The angle between the extension directions of the input pin 321 and the output pin 322 and the reverse side 230 of the circuit board is less than 90°, and the extension directions of the input pin 321 and the output pin 322 are perpendicular to the surface of the switch body 320 facing the circuit board 200. The angle between the reverse side 230 of the circuit board and the surface of the switch body 320 facing the circuit board 200 is less than 90°. In this embodiment, the surface of the circuit board 200 facing the switch body 320 and the surface of the switch body 320 facing the circuit board 200 are not parallel. In this embodiment, it is beneficial to reduce assembly difficulty. When there are too many components on the circuit board 200 or the cover plate is uneven, making it impossible for the circuit board 200 to be placed parallel in the bottom shell 110, a method can be used... Figure 17 The embodiment shown electrically connects the switch body 320 to the circuit board 200.

[0204] Please see Figure 18 , Figure 18 This is a schematic diagram of the structure of the switch body 320 and the circuit board 200 provided in one embodiment of this application. In one embodiment, the extending directions of the input pin 321 and the output pin 322 are not perpendicular to either the reverse side 230 of the circuit board or the surface of the switch body 320 facing the circuit board 200, and the reverse side 230 of the circuit board and the surface of the switch body 320 facing the circuit board 200 are parallel. In this embodiment, the input pin 321 and the output pin 322 are inserted into the circuit board 200 at an angle. When the input pin 321 and the output pin 322 on the switch body 320 do not correspond to the vias in the circuit board 200, the input pin 321 and the output pin 322 can be tilted away from the height direction, thereby allowing the input pin 321 and the output pin 322 to be inserted into the vias in the circuit board 200. Figures 16 to 18The illustrated implementation enables the photovoltaic inverter 10 to be adapted to various assembly scenarios, thereby improving the assembly flexibility of the photovoltaic inverter 10.

[0205] Please see Figure 19 , Figure 19 This is a schematic diagram of the structure of a switch body 320 and a circuit board 200 provided in one embodiment of this application. In one embodiment, the circuit board 200 has a plurality of vias 210. A pin 301 passes through and is soldered to the via 210, thereby rigidly fixing the pin 301 to the circuit board 200 and connecting it to the metal traces of the circuit board 200. The via 210, also called a metallized via, is formed by forming metal on the sidewall of a through-hole in the circuit board 200. The via 210 enables electrical connection between the circuit board 200 and external devices. In this embodiment, the pin 301 passes through and is soldered to the via 210, fixing and electrically connecting the pin 301 to the via 210, thereby fixing and electrically connecting the pin 301 to the circuit board 200. In one embodiment, the via 210 can be a via at one end of a metal trace, meaning one end of the metal trace includes the via 210.

[0206] In one embodiment, the surface of the circuit board 200 facing away from the switch body 320 is provided with a pad 323, the pad 323 surrounding the periphery of the via 210, and one end of the pin 301 passing through the via 210 is soldered to the pad 323 (e.g., Figure 19 As shown), pad 323 can improve the connection stability between pin 301 and circuit board 200.

[0207] In this embodiment, pins 301 pass through the reverse side 230 and the front side 220 of the circuit board 200 in sequence, and pads 323 are located on the front side 220 of the circuit board. By soldering pads 323 onto the circuit board 200, pins 301 are fixed to the front side 220 of the circuit board, making it difficult for the switch body 320 to fall off the circuit board 200, which helps to improve the connection stability between the switch body 320 and the circuit board 200.

[0208] In one embodiment, the circuit board 200 and the switch body 320 are crimped together by a pin 301. One end of the exemplary pin 301, passing through the through hole 210, is fixed to the circuit board 200 by a screw, thereby pressing and fixing the circuit board 200 and the switch body 320 together.

[0209] Please see Figure 20 , Figure 20 This is a schematic diagram of the structure of the switch body 320 and the circuit board 200 provided in one embodiment of this application. In some embodiments, one end of the pin 301 inserted into the via 210 is soldered into the via 210. For example, one end of the pin 301 inserted into the via 210 can be soldered into the via 210 by wave soldering.

[0210] Please see Figure 21 , Figure 21 This is a schematic diagram of the structure of the switch body 320 and the circuit board 200 provided in one embodiment of this application. In some embodiments, the end of the pin 301 away from the switch body 320 is soldered to the end of the via 210 facing the reverse side 230 of the circuit board. In one embodiment, the end of the pin 301 away from the switch body 320 is soldered to a pad 323 located on the reverse side 230 of the circuit board. Exemplarily, the end of the pin 301 can be soldered to the reverse side 230 of the circuit board by wave soldering.

[0211] Please see Figure 22 , Figure 22 This is a schematic diagram of the structure of the switch body 320 and the circuit board 200 provided in one embodiment of this application. In one embodiment, the reverse side 230 of the circuit board is provided with a plurality of sockets 240, and the pins 301 are all inserted into the sockets 240 and rigidly fixed to the circuit board 200 and electrically connected to the circuit board 200. In this embodiment, the circuit board 200 is provided with sockets 240 that match the pins 301. Inserting the pins 301 into the sockets 240 fixes the pins 301 to the sockets 240 and makes them electrically connected, thereby making the pins 301 rigidly fixed to the circuit board 200 and electrically connected.

[0212] For example, the socket 240 includes two opposing springs with a spring force that pulls the pins closer to each other. When the pin 301 is inserted into the two springs, it is fixed by the two springs and electrically connected to them.

[0213] For example, in order to increase the contact area between the pin and the spring, the pin 301 can be set as a flat metal sheet, thereby increasing the contact area between the pin 301 and the spring, and improving the connection stability and electrical connection stability.

[0214] In other embodiments, pin 301 may be configured to match the shape of socket 240. For example, pin 301 may be configured as cylindrical or rectangular.

[0215] Please continue reading. Figure 10 In one embodiment, the switch body 320 includes an operating mechanism 324 and a disconnection unit 325. The knob 310 can control the disconnection unit 325 to open or close through the operating mechanism 324. The input pin 321 and the output pin 322 are fixed at the ends away from the circuit board 200 within the disconnection unit 325.

[0216] In this embodiment, the knob 310 is fixedly connected to the operating mechanism 324. Rotating the knob 310 drives the operating mechanism 324 to rotate, thereby switching the disconnecting unit 325 between open and closed states. The disconnecting unit 325 is electrically connected to the circuit board 200 through pin 301. The opening and closing of the disconnecting unit 325 corresponds to the opening and closing of the photovoltaic module 20 and the inverter power module 810.

[0217] In one embodiment, the operating mechanism 324 is a free-trip structure. This embodiment is beneficial for improving the safety performance of the photovoltaic inverter 10.

[0218] Please continue reading. Figure 10 In one embodiment, the switch body 320 further includes a switch housing 326, and the operating mechanism 324 and the disconnecting unit 325 are both located inside the switch housing 326. In one embodiment, the switch housing 326 is a plastic part, and the input pin 321 and the output pin 322 can be integrally injection molded with the switch housing 326 to form an integral structure, thereby improving the structural strength of the input pin 321 and the output pin 322 and the switch housing 326.

[0219] Please continue reading. Figure 10 In one embodiment, the switch housing 326 includes a housing body 3261 and a top cover 3262. The top cover 3262, when closed with the housing body 3261, forms a receiving space, within which the operating mechanism 324 and the disconnecting unit 325 are located. In one embodiment, the input pin 321 and the output pin 322 can be integrally injection molded with the top cover 3262, which facilitates the assembly of the switch assembly 300. When assembling the switch assembly 300, the operating mechanism 324 and the disconnecting unit 325 can be installed inside the housing body 3261 first. The input pin 321 and the output pin 322 can be pre-integrated with the top cover 3262, forming an integral structure. One end of the input pin 321 and the output pin 322 in the integral structure is electrically connected and fixed to the disconnecting unit 325. Finally, the top cover 3262 is fixed to the housing body 3261.

[0220] Please see Figure 23 , Figure 23This is a cross-sectional view of a photovoltaic inverter 10 provided in one embodiment of this application. In one embodiment, the second device 800 further includes a DC-DC conversion component 840, which is fixed to the reverse side 230 of the circuit board. The DC-DC conversion component 840 is located between the thermally conductive contact 202 and the reverse side 230 of the circuit board, and is thermally connected to the heat sink fins 600 through the thermally conductive contact 202. Some pins 301 of the switch body 320 are connected to the DC-DC conversion component 840 through metal traces on the circuit board 200, and the DC-DC conversion component 840 is electrically connected to the bus capacitor through metal traces on the circuit board 200. In this embodiment, the DC-DC conversion component 840 is used to transform the DC power transmitted to the inverter power component 810, converting the voltage into the DC voltage required by the inverter power component 810. In one embodiment, the DC-DC conversion component 840 is a DC-DC boost component. In this embodiment, the DC-DC converter 840 is connected to the metal traces of the circuit board 200 to realize the electrical connection between the DC-DC converter 840 and the bus capacitor and the switch body 320.

[0221] Please see Figure 24 , Figure 24 This is a schematic diagram of the electrical connections of a photovoltaic inverter 10 provided in one embodiment of this application. In one embodiment, the photovoltaic inverter further includes an input-side filter component 1000 and an output-side filter component 1100. Both the input-side filter component 1000 and the output-side filter component 1100 are connected to a circuit board. The PV port 501 is connected to the input-side filter component 1000 through metal traces on the circuit board. The input-side filter component 1000 is connected to some pins of the switch body 320 through metal traces on the circuit board. The switch body 320 is connected to the DC-DC converter component 840 through metal traces on the circuit board. The DC-DC converter component 840 is connected to the bus capacitor 820 through metal traces on the circuit board. The bus capacitor 820 is connected to the inverter power component 810 through metal traces on the circuit board. The inverter power component 810 is connected to the output-side filter component 1100 through metal traces on the circuit board.

[0222] In this embodiment, the direct current (DC) generated by the photovoltaic module is input to the input-side filter component 1000 through the PV port 501. The input-side filter component 1000 then transmits the DC to the DC-DC converter component 840 via the switch body 320. The DC-DC converter component 840 transforms the DC and then sequentially transmits it to the bus capacitor 820 and the inverter power component 810. The DC is converted to alternating current (AC) in the inverter power component 810, which then transmits the AC to the output-side filter component 1100. The input-side filter component 1000 and the output-side filter component 1100 filter out harmonics in the DC and AC power, respectively, reducing heat generation in the inverter power component 810, avoiding safety hazards, and improving the reliability of the inverter conversion. Furthermore, the input-side filter component 1000 and the output-side filter component 1100 also improve the electromagnetic compatibility of the photovoltaic inverter during operation. Electromagnetic compatibility (EMC) refers to the ability of a photovoltaic (PV) inverter to operate within its electromagnetic environment without causing unacceptable electromagnetic interference to any equipment in that environment. Therefore, EMC includes two aspects: firstly, the electromagnetic interference generated by the PV inverter during normal operation must not exceed certain limits; secondly, the PV inverter must have a certain degree of immunity to electromagnetic interference present in its environment, i.e., electromagnetic susceptibility (EMS).

[0223] In this embodiment, the functional components are electrically connected through the metal traces on the circuit board, which not only saves cables and simplifies the structure, but also reduces the impedance between the functional components and improves the power performance of the photovoltaic inverter.

[0224] In one embodiment, the alternating current output from the output-side filter assembly 1100 can be used to supply the power grid. This embodiment helps to broaden the application range of photovoltaic inverters. In one embodiment, the input-side filter assembly 1000 and the output-side filter assembly 1100 may include a filter capacitor 850.

[0225] Please continue reading. Figure 7In one embodiment, the base plate 111 includes a base plate body 1111 and a raised plate 1112. The raised plate 1112 is a thermally conductive contact portion 202. The raised plate 1112 protrudes from the base plate body 1111 toward the inverter power assembly 810 and is thermally connected to the inverter power assembly 810. The raised plate 1112 and the inverter power assembly 810 at least partially overlap in their orthogonal projections on the reverse side 230 of the circuit board. A portion of the heat dissipation fins 600 are located on the side of the raised plate 1112 away from the inverter power assembly 810. The bus capacitor 820 and the inductor 830 are located between the reverse side 230 of the circuit board and the base plate body 1111. A portion of the heat dissipation fins 600 are located on the side of the base plate body 1111 away from the reverse side 230 of the circuit board.

[0226] The heat dissipation fins 600 are located on the side of the raised plate 1112 facing away from the inverter power component 810 along the first direction X. The base plate body 1111 is the part of the base plate 111 excluding the raised plate 1112. The raised plate 1112 in the base plate 111 is closer to the inverter power component 810 than the base plate body 1111, which helps to shorten the heat transfer path and improve the heat dissipation effect. The raised plate 1112 is thermally connected to the inverter power component 810, that is, heat can be conducted between the raised plate 1112 and the inverter power component 810. Therefore, the raised plate 1112 can realize the heat transfer from the inverter power component 810 to the heat dissipation fins 600. The protruding plate 1112 and the inverter power component 810 at least partially overlap on the reverse side 230 of the circuit board, so that the projection of the heat dissipation fins 600 corresponding to the protruding plate 1112 on the reverse side 230 of the circuit board also at least partially overlaps with the projection of the inverter power component 810 on the reverse side 230 of the circuit board, thereby enabling the heat dissipation fins 600 to effectively dissipate heat from the inverter power component 810.

[0227] In this embodiment, since the protruding plate 1112 protrudes towards the inverter power assembly 810 relative to the base plate body 1111, the length of the heat dissipation fins 600 located on the back side of the protruding plate 1112 along the first direction X is longer, thereby increasing the heat dissipation area of ​​the heat dissipation fins 600 and improving the heat dissipation effect on the inverter power assembly 810.

[0228] In one embodiment, in addition to the raised plate 1112, heat dissipation fins 600 are also distributed on the side of the base plate body 1111 opposite to the cover plate 120, wherein the bus capacitor 820 and inductor 830 in the second device 800 are located between the reverse side 230 of the circuit board and the base plate body 1111. In one embodiment, some of the heat dissipation fins 600 are thermally connected to the bus capacitor 820 and inductor 830, so some of the heat dissipation fins 600 can cool the bus capacitor 820 and inductor 830, thereby comprehensively improving the cooling effect of the heat dissipation fins 600. For example, the bus capacitor 820 and inductor 830 are thermally connected to the base plate body 1111 through a thermally conductive medium 1113.

[0229] In one embodiment, the projection of the protruding plate 1112 onto the reverse side 230 of the circuit board completely covers the projection of the inverter power assembly 810 onto the reverse side 230 of the circuit board. This embodiment is beneficial for further improving the heat dissipation effect of the heat sink 600 on the inverter power assembly 810.

[0230] In this embodiment, the raised plate 1112 firstly shortens the heat transfer path between the inverter power component 810 and the heat sink fins 600, and also helps to increase the heat dissipation area of ​​the heat sink fins 600, thereby comprehensively improving the heat dissipation effect of the inverter power component 810. Secondly, the raised plate 1112 can also make full use of the internal space of the photovoltaic inverter 10, improve the high power density, and also help to reduce the volume of the photovoltaic inverter 10, indirectly improving the utilization rate of the internal space of the photovoltaic inverter 10, realizing miniaturized design, and optimizing the overall layout. Thirdly, the raised plate 1112 can also provide support for the circuit board 200, improving the structural strength and reliability between the internal circuit board 200 and the outer casing 100 of the photovoltaic inverter 10. Fourthly, in actual use scenarios, the base plate 111 is the surface of the photovoltaic inverter 10 facing away from the user. Since the base plate 111 is not in the user's field of vision at this time, even if the base plate 111 has an uneven shape, it will not affect the overall aesthetics of the photovoltaic inverter 10, ensuring the user's user experience. If the second device 800 is placed on the front 220 of the circuit board, a raised plate 1112 needs to be set in the cover plate 120 to enhance the heat dissipation effect of the inverter power component 810. At this time, since the cover plate 120 is the surface of the photovoltaic inverter 10 directly facing the user, the unevenness of the cover plate 120 will have a negative impact on the user's appearance and user experience.

[0231] It should be noted that, Figure 6 The first device 700 shown is only used to indicate that the first device 700 is located on the front side 220 of the circuit board, and does not represent the number or actual distribution of the first device 700. The specific location can be set as needed. Figure 6 The inverter power component 810 shown is used to indicate the connection relationship with pin 301 and does not imply that the inverter power component 810 is located on the front side 220 of the circuit board. It should be noted that... Figure 7 The internal components of the photovoltaic inverter 10 are shown only schematically and do not represent its specific structure or dimensions, for example... Figure 7 The actual distribution position and size of 810 / 820 and 830 in the second device 800 on the reverse side 230 of the circuit board are not limited to... Figure 7 As shown, Figure 7 The image is only used to show the relative positional relationship of the inverter power component 810 between the raised plates 1112, and the relative positional relationship between the bus capacitor 820, the inductor 830 and the reverse side of the circuit board 230 and the base plate 1111.

[0232] Please continue reading. Figure 23 In one embodiment, the second device 800 further includes a DC-DC conversion component 840, which is fixed to the reverse side 230 of the circuit board. The DC-DC conversion component 840 is located between the protrusion 1112 and the reverse side 230 of the circuit board, and the projections of the protrusion 1112 and the DC-DC conversion component 840 on the reverse side 230 of the circuit board at least partially overlap.

[0233] In this embodiment, the DC-DC converter 840 generates heat when it is in operation. Therefore, the protrusion plate 1112 is arranged to overlap at least partially with the orthogonal projection of the DC-DC converter 840 on the reverse side 230 of the circuit board, so that some of the heat dissipation fins 600 are arranged close to the DC-DC converter 840 along the first direction X, which is beneficial to enhance the cooling effect of the heat dissipation fins 600 on the DC-DC converter 840.

[0234] In one embodiment, the projection of the protruding plate 1112 onto the reverse side 230 of the circuit board completely covers the projection of the DC-DC converter 840 onto the reverse side 230 of the circuit board. This embodiment is beneficial for further improving the heat dissipation effect of the heat sink 600 on the DC-DC converter 840.

[0235] Please see Figure 25 , Figure 25 This is a cross-sectional view of a photovoltaic inverter 10 provided in an embodiment of this application. In one embodiment, the raised plate 1112 includes a first raised sub-plate 1112a and a second raised sub-plate 1112b, which are spaced apart. The inverter power component 810 is located between the first raised sub-plate 1112a and the reverse side 230 of the circuit board, and the DC-DC conversion component 840 is located between the second raised sub-plate 1112b and the reverse side 230 of the circuit board.

[0236] In this embodiment, the first raised sub-plate 1112a and the second raised sub-plate 1112b are spaced apart, and correspondingly, the inverter power component 810 and the DC-DC conversion component 840 are spaced apart. This helps to reduce electromagnetic interference between the inverter power component 810 and the DC-DC conversion component 840, ensuring that their operating efficiency is not affected. The heat dissipation fins 600 corresponding to the first raised sub-plate 1112a are used to cool the inverter power component 810, and the heat dissipation fins 600 corresponding to the second raised sub-plate 1112b are used to cool the DC-DC conversion component 840. By setting the first raised sub-plate 1112a and the second raised sub-plate 1112b in the raised plate 1112, precise heat dissipation of heat-generating devices can be achieved, improving heat dissipation efficiency.

[0237] Please continue reading. Figure 23In one embodiment, the protruding plate 1112 is an integral structure, and the inverter power component 810 and the DC-DC conversion component 840 are arranged adjacent to each other. This solution helps to reduce the processing cost of the protruding plate 1112 and reduce the installation difficulty of the inverter power component 810 and the DC-DC conversion component 840.

[0238] Please see Figure 26 , Figure 26 This is a partial structural diagram of a photovoltaic inverter 10 provided in one embodiment of this application. In one embodiment, the inverter power component 810 includes multiple inverter power devices 811, and the DC-DC conversion component 840 includes multiple DC power devices 841, with at least one inverter power device 811 located among the multiple DC power devices 841. The inverter power devices 811 and DC power devices 841 refer to power electronic devices capable of power conversion, including but not limited to insulated-gate bipolar transistors (IGBTs), silicon carbide power transistors, silicon transistors, metal-oxide-semiconductor field-effect transistors (MOS), and diodes. In this embodiment, the inverter power devices 811 are used to implement AC-DC conversion, and the DC power devices 841 are used to implement DC voltage boosting. In this embodiment, the inverter power devices 811 and DC power devices 841 can be flexibly arranged as needed, allowing the inverter power component 810 and DC-DC conversion component 840 to be applicable to different application scenarios and saving material costs.

[0239] In one embodiment, at least one DC power device 841 is located among a plurality of inverter power devices 811. In this embodiment, the inverter power devices 811 and DC power devices 841 can be flexibly arranged as needed, so that the inverter power assembly 810 and the DC-DC conversion assembly 840 can be applied to different application scenarios, saving material costs.

[0240] Please see Figure 27 , Figure 27This is a partial structural diagram of a photovoltaic inverter 10 provided in one embodiment of this application. In one embodiment, the inverter power component 810 is an inverter power module 812, which includes an inverter packaging structure 813 and a plurality of inverter power devices 811 located within the inverter packaging structure 813. The DC-DC conversion component 840 is a DC-DC conversion module 842, which includes a DC packaging structure 843 and a plurality of DC power devices 841 located within the DC packaging structure 843. In this embodiment, the plurality of inverter power devices 811 are packaged within the inverter packaging structure 813, and the plurality of DC power devices 841 are packaged within the DC packaging structure 843. This results in a high degree of integration between the inverter power component 810 and the DC-DC conversion component 840, facilitating the overall mounting of the plurality of inverter power devices 811 onto the reverse side 230 of the circuit board and reducing installation difficulty.

[0241] It should be noted that, Figure 26 and Figure 27 The arrangement of the inverter power component 810 and the DC-DC conversion component 840 is only schematically shown and does not represent the specific structure, size and positional relationship of the inverter power component 810 and the DC-DC conversion component 840. Those skilled in the art can make adjustments according to actual needs.

[0242] Please continue reading. Figure 23 In one embodiment, a thermally conductive medium 1113 is provided between the inverter power component 810 and the raised plate 1112. The heat generated by the inverter power component 810 during operation is transferred to a portion of the heat dissipation fins 600 on one side of the raised plate 1112 through the thermally conductive medium 1113. This solution enhances heat dissipation. In some embodiments, for example, the thermally conductive medium 1113 can also be other thermally conductive materials such as thermal grease, thermally conductive silicone pads, and thermally conductive gel. These thermally conductive media 1113 do not require bonding or fixing the raised plate 1112 and the inverter power component 810, avoiding damage to the inverter power component 810 and the raised plate 1112 due to the inability to disassemble during maintenance. In some embodiments, to enhance the reliability of the photovoltaic inverter 10, a thermally conductive medium 1113 with adhesive properties can also be used between the raised plate 1112 and the inverter power component 810. For example, the thermally conductive medium 1113 is a thermally conductive adhesive.

[0243] In one embodiment, a thermally conductive medium 1113 (not shown in the figure) is provided between the DC-DC converter 840 and the raised plate 1112. The heat generated by the DC-DC converter 840 during operation is transferred to a portion of the heat dissipation fins 600 on one side of the raised plate 1112 via the thermally conductive medium 1113. This design enhances heat dissipation. In some embodiments, for example, the thermally conductive medium 1113 may also be other thermally conductive materials such as thermal grease, thermally conductive silicone pads, and thermally conductive gel.

[0244] Please refer to Figure 28 , Figure 28 which is a cross-sectional view of the photovoltaic inverter 10 provided by an embodiment of the present application. In one implementation, the distance between the heat-conducting contact portion 202 and the back side 230 of the circuit board along the first direction X is less than the distance between the bottom plate 111 and the circuit board 200 along the first direction X. The length of the inverter power component 810 in the first direction X is less than the length of at least one of the bus capacitor 820, the inductor 830, and the switch component 300 in the first direction X. In this embodiment, the heat-conducting contact portion 202 is the raised plate 1112. Among them, the distance between the raised plate 1112 and the back side 230 of the circuit board along the first direction X is less than the distance between the bottom plate main body 1111 and the circuit board 200 along the first direction X.

[0245] In this implementation, the first direction X is the direction in which the bottom plate 111 and the circuit board 200 are stacked. The distance between the raised plate 1112 and the back side 230 of the circuit board along the first direction X is H1, and the distance between the bottom plate main body 1111 and the circuit board 200 along the first direction X is H2. H1 < H2, and the raised plate 1112 is closer to the back side 230 of the circuit board than the bottom plate main body 1111 along the first direction X. The length of the inverter power component 810 in the first direction X is H3, and the lengths of the bus capacitor 820, the inductor 830, and the switch component 300 in the first direction X are H4, H5, and H6 respectively. At least one of the following relationships is satisfied between H3 and H4, H5, and H6: H3 < H, H3 < H5, H1 < H6. Since the length occupied by the inverter power component 810 in the first direction X is small, there is still some free space between the inverter power component 810 and the bottom plate 111. Therefore, the raised plate 1112 in the bottom plate 111 can be set to protrude towards the inverter power component 810 along the first direction X to exclude the free space from the photovoltaic inverter 10. At this time, the distance between the raised plate 1112 and the back side 230 of the circuit board is less than the distance between the bottom plate main body 1111 and the back side 230 of the circuit board. This solution reasonably plans the internal space of the photovoltaic inverter 10, which is beneficial to improving the space utilization rate inside the photovoltaic inverter 10, reducing the volume occupied by the photovoltaic inverter 10, and is beneficial to the overall layout.

[0246] In Figure 28 the shown implementation, the bottom plate main body 1111 is a horizontal plate. In some implementations, due to the different values of H4, H, and H6, in order to make full use of the internal space of the photovoltaic inverter 10, the bottom plate main body 1111 is a plate with uneven surfaces, as shown in Figure 7 . Among them, the distance H2 between the bottom plate main body 1111 and the circuit board 200 along the first direction X refers to the maximum distance between the bottom plate main body 1111 and the circuit board 200 along the first direction X.

[0247] Please continue to refer to Figure 28In one embodiment, the photovoltaic inverter 10 further includes a fan 900, which is located within the second sub-chamber S2 and connected to the circuit board 200. In this embodiment, placing the fan 900 within the second sub-chamber S2 allows the fan 900 to provide air cooling for the second device 800. The fan 900, combined with heat sink fins, makes it easier to control the temperature of the second device 800 within a suitable operating range. Placing the fan 900 inside the photovoltaic inverter 10 improves the utilization rate of the internal space. Figure 28 The fan 900 in the image is only used to show that the fan 900 is located in the second sub-chamber S2, and does not represent the specific location of the fan 900 in the second sub-chamber S2. The specific location can be set according to the component layout of the second sub-chamber S2.

[0248] Please continue reading. Figure 7 In one embodiment, the maximum length along the first direction X between the base plate 111 and the reverse side 230 of the circuit board is greater than the length along the first direction X between the cover plate 120 and the front side 220 of the circuit board. In another embodiment, the maximum length along the first direction X between the base plate body 1111 and the reverse side 230 of the circuit board is greater than the length along the first direction X between the cover plate 120 and the front side 220 of the circuit board, so that the inductor 830, the bus capacitor 820, and the switch body 320 can be accommodated between the base plate body 1111 and the reverse side 230 of the circuit board. In this embodiment, since the base plate body 1111 is the part other than the protruding plate 1112, which protrudes towards the circuit board 200, the maximum length along the first direction X between the base plate 111 and the reverse side 230 of the circuit board is equal to the maximum length along the first direction X between the base plate body 1111 and the reverse side 230 of the circuit board.

[0249] In this embodiment, the space between the base plate 111 and the reverse side 230 of the circuit board forms a second sub-cavity S2 for accommodating the second device 800 and the switch body 320, while the space between the cover plate 120 and the front side 220 of the circuit board forms a first sub-cavity S1 for accommodating the first device 700. Since the volume of the second device 800 and the switch body 320 along the first direction X is greater than the volume of the first device 700 along the first direction X, the volume of the second sub-cavity S2 needs to be correspondingly larger than the volume of the first sub-cavity S1. Consequently, the distance between the base plate 1111 and the reverse side 230 of the circuit board along the first direction X needs to be greater than the distance between the cover plate 120 and the front side 220 of the circuit board along the first direction X. This solution provides mounting space for the inductor 830, the bus capacitor 820, and the switch body 320 to be mounted on the reverse side 230 of the circuit board.

[0250] In one embodiment, the length of either the chip resistor 710 or the chip capacitor 720 along the first direction X is less than or equal to 5 millimeters, so that the volume of the first sub-chamber S1 is smaller, thereby reducing the overall volume of the photovoltaic inverter 10. In this embodiment, setting the length of the chip resistor 710 and the chip capacitor 720 along the first direction X to be small makes the space occupied by the chip resistor 710 and the chip capacitor 720 in the first sub-chamber S1 smaller, which facilitates setting the volume of the first sub-chamber S1 to be smaller, which is beneficial to realizing the miniaturization design of the photovoltaic inverter 10.

[0251] In one embodiment, the length along the first direction X between the front side 220 of the circuit board and the cover plate 120 is less than or equal to 20 mm. In this embodiment, the length along the first direction X between the front side 220 of the circuit board and the cover plate 120 corresponds to the volume of the first sub-chamber S1. Setting the volume of the first sub-chamber S1 to be smaller is beneficial to realizing the miniaturization design of the photovoltaic inverter 10.

[0252] In one embodiment, the maximum length along the first direction X between the circuit board reverse side 230 and the base plate 111 is greater than or equal to 10 cm. In a specific embodiment, the length along the first direction X between the circuit board reverse side 230 and the base plate body 1111 is greater than or equal to 10 cm, so that the circuit board reverse side 230 and the base plate body 1111 can accommodate the inductor 830, the bus capacitor 820, and the switch body 320. In this embodiment, since the base plate body 1111 in different positions may not be on the same plane, the length along the first direction X between the circuit board reverse side 230 and the base plate body 1111 refers to the maximum length along the first direction X between the circuit board reverse side 230 and the base plate body 1111. Setting this maximum length to be greater than or equal to 10 cm ensures that the second sub-cavity S2 has sufficient space to accommodate the relatively large inductor 830, bus capacitor 820, and switch body 320, which helps to reduce installation difficulty.

[0253] In one embodiment, the length along the first direction X between the reverse side 230 of the circuit board and the base plate body 1111 is greater than or equal to 20 centimeters. In this embodiment, by setting the length along the first direction X between the reverse side 230 of the circuit board and the base plate body 1111, the size of the second sub-cavity S2 is reasonably adjusted, so that the second sub-cavity S2 has enough space to accommodate the large inductor 830, bus capacitor 820 and switch body 320, which helps to reduce the installation difficulty.

[0254] Please see Figure 29 and Figure 30 , Figure 29 This is a partial structural schematic diagram of a photovoltaic inverter 10 provided in one embodiment of this application. Figure 30 for Figure 29 The enlarged view of the photovoltaic inverter 10 shown illustrates that, in one embodiment, multiple PV ports 501 include a positive connector 510 (e.g., Figure 29 As shown), one end of the positive connector 510 is located inside the housing 100 and fixed to the reverse side of the circuit board (as shown). Figure 30 As shown), the other end of the positive connector 510 extends through the housing 100 to the outside of the housing 100 (as shown). Figure 29 As shown), the other end of the positive connector 510 is used for electrical connection to the positive terminal PV+ of the photovoltaic module 20. The second device 800 also includes a filter capacitor 850, which is electrically connected between the positive connector 510 and the input pin 321 via a metal trace 201 on the circuit board 200 (as shown). Figure 30 As shown in the figure, this reduces the impedance between the positive connector 510 and the filter capacitor 850, thereby improving the filtering effect.

[0255] In this embodiment, the inductor 830 and the filter capacitor 850 form a resonant circuit. By filtering out harmonics in the direct current, the heat generated by the inverter power component 810 is reduced, safety hazards are avoided, and the reliability of the inverter conversion is improved. In this embodiment, the resonant circuit formed by the inductor 830 and the filter capacitor 850 is an input-side filter circuit. In one embodiment, an output-side filter circuit is provided on the output side of the inverter power component 810.

[0256] In this embodiment, the positive connector 510 is electrically connected to the photovoltaic module 20, and pin 301 is part of the switch body 320. This design sets the filter capacitor 850 electrically connected between the positive connector 510 and the input pin 321, which is equivalent to setting the photovoltaic module 20, filter capacitor 850, and switch body 320 to be electrically connected sequentially. If the switch body 320 is electrically connected between the filter capacitor 850 and the positive connector 510, the DC power output from the photovoltaic module 20 first passes through the switch body 320 and then flows into the filter capacitor 850. Since the switch body 320 itself has a certain resistance, the filtering effect of the filter capacitor 850 on the DC power will be reduced. Therefore, this embodiment is beneficial for improving the filtering effect of the filter capacitor 850.

[0257] In this embodiment, the number of positive connectors 510 is the same as the number of input pin pairs 3211.

[0258] In one embodiment, the filter capacitor 850 can be disposed on either the front surface 220 or the back surface 230 of the circuit board. When the filter capacitor 850 is disposed on the back surface 230 of the circuit board, the internal space of the second sub-chamber S2 can be fully utilized.

[0259] Please continue reading. Figure 29 and Figure 30In one embodiment, the plurality of PV ports 501 further include a negative connector 520 (e.g., Figure 29 As shown), one end of the negative connector 520 is located inside the housing 100 and fixed to the reverse side of the circuit board (as shown). Figure 30 As shown), the other end of the negative connector 520 extends through the housing 100 to the outside of the housing 100 (as shown). Figure 29 As shown), the other end of the negative connector 520 is used for electrical connection to the negative PV- of the photovoltaic module 20.

[0260] In this embodiment, the output pin pair 3221 is located between the negative terminal of the inverter power component 810 and the negative terminal PV- of the photovoltaic module 20. Current flows sequentially from the positive terminal PV+ of the photovoltaic module 20 to the positive connector 510, the input pin pair 3211, and the positive terminal of the inverter power component 810, where it undergoes inversion conversion. Then, current flows sequentially from the negative terminal of the inverter power component 810 to the output pin pair 3221, the negative connector 520, and the negative terminal of the photovoltaic module 20, forming a loop.

[0261] In this embodiment, the number of negative connectors 520 is the same as the number of output pin pairs 3221.

[0262] In one embodiment, the positions of the positive connector 510 and the negative connector 520 can be interchanged, correspondingly the positions of the positive electrode PV+ and the negative electrode PV- of the photovoltaic module 20 are interchanged, but not limited to... Figure 30 The aforementioned positional relationship is sufficient to achieve a positive PV+ electrical connection between the positive connector 510 and the photovoltaic module 20, and a negative PV- electrical connection between the negative connector 520 and the photovoltaic module 20.

[0263] In one embodiment, the positive connector 510 and / or the negative connector 520 are detachably connected to the circuit board 200. For example, one end of the positive connector 510 can be fixedly connected to the circuit board 200 using screws; when disassembly is required, the screws can be removed to separate the positive connector 510 and the circuit board 200. For example, when the negative connector 520 is far from the circuit board 200, it can be detachably connected to the circuit board 200 using a connecting component.

[0264] Please see Figure 32 and Figure 33 , Figure 32 This is a partial structural diagram of a photovoltaic inverter provided in one embodiment of this application. Figure 33 for Figure 32 The enlarged view of part M in the figure shows that, in one embodiment, the photovoltaic inverter 10 further includes an insulating support 1200, which is located between the base plate 111 and the circuit board 200. Figure 32 and Figure 33 The circuit board is omitted in this embodiment. An insulating support 1200 is fixed to the base plate 111, and one end of at least one PV port 501 is fixed between the insulating support 1200 and the circuit board 200. The insulating support 1200 is located within the second sub-chamber S2, making full use of the space in the second sub-chamber S2. In this embodiment, the insulating support 1200 supports the PV port 501, making the fixation between the PV port 501 and the circuit board 200 more stable. In one embodiment, the insulating support 1200 is made of a non-conductive material to avoid affecting the electrical connection between the PV port 501 and the circuit board 200. In one embodiment, the insulating support 1200 can be fixed to the base plate 111 by screws or adhesive.

[0265] In one embodiment, one end of all PV ports 501 located inside the base housing 110 is fixed between the insulating support 1200 and the circuit board 200. For example, screws are used to fix one end of the PV port 501, the circuit board 200, and the insulating support 1200 together.

[0266] Please refer to the following: Figure 34 and Figure 35 , Figure 34 This is a partial structural diagram of a photovoltaic inverter provided in one embodiment of this application. Figure 35 This is a schematic diagram of the structure of the insulating support and PV ports in a photovoltaic inverter according to an embodiment of this application. In one embodiment, the insulating support 1200 includes a plurality of first support portions 1210 and a plurality of second support portions 1220. The plurality of first support portions 1210 and the plurality of second support portions 1220 are arranged alternately along a third direction Z, which is parallel to the arrangement direction of the knob 310 and the switch body 320. Along the first direction X, the distance between the surface of the first support portion 1210 away from the base plate 111 and the base plate 111 is greater than the distance between the surface of the second support portion 1220 away from the base plate 111 and the base plate 111. One end of a portion of the plurality of PV ports 501 is fixed to the surface of the plurality of first support portions 1210 away from the base plate 111, and one end of another portion of the plurality of PV ports 501 is fixed to the surface of the plurality of second support portions 1220 away from the base plate 111. In this embodiment, the first support portion 1210 and the second support portion 1220 have different heights. A portion of the PV ports 501 are fixed between the first support portion 1210 and the circuit board 200, and a portion of the PV ports 501 are fixed between the second support portion 1220 and the circuit board 200. This disperses the arrangement of the PV ports 501 and avoids the impact of concentrated layout on the stability of the electrical connection between the PV ports 501.

[0267] In this embodiment, a plurality of first support portions 1210 and a plurality of second support portions 1220 are arranged alternately along the third direction Z, so that a plurality of PV ports 501 are arranged alternately along the third direction Z, making the arrangement of PV ports 501 more regular.

[0268] Please see Figure 31 , Figure 31 This is a front view of a photovoltaic inverter provided in an embodiment of this application. In one embodiment, the bottom shell 110 includes a first sub-plate 113 located between the bottom plate 111 and the cover plate 120, the first sub-plate 113 being parallel to the third direction Z; a plurality of PV ports 501 include a plurality of positive connectors 510 and a plurality of negative connectors 520, the plurality of positive connectors 510 and the plurality of negative connectors 520 being fixed to the first sub-plate 113, the distance between the plurality of positive connectors 510 and the bottom plate 111 along the first direction X being greater than the distance between the plurality of negative connectors 520 and the bottom plate 111, and the plurality of positive connectors 510 and the plurality of negative connectors 520 being arranged alternately in sequence along the third direction Z.

[0269] Please combine Figure 35 and Figure 36 , Figure 36 This is a schematic diagram of the structure of the insulating support and PV port in a photovoltaic inverter provided in an embodiment of this application. In one embodiment, one end of each positive connector 510 located inside the bottom shell 110 includes a positive metal sheet 511, and one end of each negative connector 520 located inside the shell includes a negative metal sheet 521. Each positive metal sheet 511 is fixed to a first support portion 1210 on the surface away from the bottom plate 111 and is fixed to the circuit board 200. Each negative metal sheet 521 is fixed to a second support portion 1220 on the surface away from the bottom plate 111.

[0270] In this embodiment, multiple positive connectors 510 are fixed to the first support portion 1210, and multiple negative connectors 520 are fixed to the second support portion 1220, so that the multiple positive connectors 510 and multiple negative connectors 520 are arranged alternately along the third direction Z and staggered along the first direction X, which reduces the mutual interference of electrical connections between the multiple positive connectors 510 and the multiple negative connectors 520, improves the stability of electrical connections and makes the overall local area more regular.

[0271] In this embodiment, the positive connector 510 is fixed between the first support portion 1210 and the circuit board 200 by a positive metal piece 511 located inside the bottom shell 110. For example, the first support portion 1210, the positive connector 510, and the circuit board 200 all have corresponding screw holes. Screws are used to fix the first support portion 1210, the positive connector 510, and the circuit board 200 relative to each other along a first direction X, wherein the screw nuts are located on the side of the circuit board 200 opposite to the first support portion 1210.

[0272] In this embodiment, the negative connector 520 is fixed to the second support portion 1220 by the negative metal piece 521 located on the bottom shell 110. For example, both the second support portion 1220 and the negative connector 520 have corresponding screw holes. The second support portion 1220 and the negative connector 520 are fixed relative to each other along the first direction X by screws, wherein the screw nut is located in the second sub-chamber S2 and on the surface of the negative metal piece 521 facing away from the second support portion 1220.

[0273] In one embodiment, the positive connector 510 includes a positive connector housing 512 (e.g., Figure 36 As shown, the positive connector housing 512 is fixed to the first sub-board 113, and both ends of the positive connector housing 512 are located inside and outside the bottom shell 110, respectively. The positive metal sheet 511 is fixed to one end of the positive connector housing 512 located inside the bottom shell 110. The distance between the surface of the first support part 1210 away from the bottom plate 111 and the bottom plate 111 is greater than the distance between the positive connector housing 512 and the bottom plate 111. The positive metal sheet 511 includes a bent section 5111 and a positive fixing section 5112. The bent section 5111 is connected between the positive fixing section 5112 and the positive connector housing 512. The positive fixing section 5112 is fixed between the surface of the first support part 1210 away from the bottom plate 111 and the circuit board 200.

[0274] In this embodiment, since the first support portion 1210 is also used to support the circuit board 200, in order to make the space between the circuit board 200 and the base plate 111 larger, or in other words, to make the space of the second sub-chamber S2 larger, the length of the first support portion 1210 along the first direction X needs to be set to be larger. However, the first sub-plate 113 is used to fix the positive connector housing 512. Since the positive connector housing 512 itself has a certain length along the first direction X, when the positive connector housing 512 is fixed to the first sub-plate 113, the positive connector housing 512 is lower than the circuit board 200 along the first direction X. In this application, the distance between the positive connector housing 512 and the first support portion 1210 and the base plate 111 is not equal. The metal inside the positive connector housing 512 and the positive fixing section 5112 are connected by the bent section in the positive metal sheet 511, and the positive fixing section 5112 is fixed between the first support portion 1210 and the circuit board 200, and the positive connector 510 is connected to the circuit board 200. For example, the positive electrode metal sheet 511 is Z-shaped.

[0275] Since the distance between the negative connector 520 and the base plate 111 is shorter than the distance between the positive connector 510 and the base plate 111, in one embodiment, the negative metal piece 521 in the negative connector 520 can be planar. In another embodiment, the negative metal piece 521 in the negative connector 520 can also be arranged in a "Z" shape.

[0276] Please continue reading. Figure 30 In one embodiment, the bottom shell 110 includes a first sub-plate 113 located between the bottom plate 111 and the cover plate 120. The positive connector 510 is fixed to the first sub-plate 113. The arrangement direction of the knob 310 and the switch body 320 is parallel to the first sub-plate 113. The filter capacitor 850 is located around the positive connector 510 and between the switch body 320 and the first sub-plate 113, making the connection line between the filter capacitor 850 and the positive connector 510 shorter, and the photovoltaic inverter 10 has a more compact structure and smaller size.

[0277] In this embodiment, one end of the positive connector 510 passes through the first sub-board 113 and extends into the inner side of the housing 100. The orthographic projection of the filter capacitor 850 on the circuit board 200 is located around the orthographic projection of the positive connector 510 on the circuit board 200. Since the filter capacitor 850 is electrically connected between the positive connector 510 and the switch body 320, this solution places the filter capacitor 850 close to the positive connector 510, shortening the distance between the filter capacitor 850 and the positive connector 510. This allows the current input from the photovoltaic module 20 to be directly transmitted to the filter capacitor 850, effectively shortening the current input path length of the photovoltaic inverter 10, resulting in lower impedance and thus improving the filtering effect of the filter capacitor 850. In addition, this solution can also optimize the device layout of the photovoltaic inverter 10, which is beneficial to reducing the size of the photovoltaic inverter 10.

[0278] It should be noted that when the photovoltaic inverter 10 is not installed, the base plate 111 of the photovoltaic inverter 10 can be placed facing the ground, with the cover plate 120 of the housing 100 located above the base plate 111. When the photovoltaic inverter 10 is installed on-site in a photovoltaic system, the first sub-plate 113 of the housing 100 can be placed facing the ground, with the sub-plate opposite to the first sub-plate 113 located above the first sub-plate 113. In some embodiments, the installation direction of the photovoltaic inverter 10 can be set according to the site environment and functional requirements.

[0279] Please combine Figure 37 , Figure 38 and Figure 39 , Figure 37 This is a schematic diagram of the structure of the insulating support and filter circuit board portion in a photovoltaic inverter according to an embodiment of this application. Figure 38This is a schematic diagram of the structure of the insulating support and filter circuit board portion in a photovoltaic inverter according to an embodiment of this application. Figure 39 This is an exploded view of the insulating support and filter circuit board portion of a photovoltaic inverter provided in one embodiment of this application. In one embodiment, the photovoltaic inverter 10 further includes a filter circuit board 1300 and a filter capacitor 850. The filter circuit board 1300 is fixed between the base plate 111 and the circuit board 200 along a first direction X. The filter circuit board 1300 is located on the side of the plurality of first support portions 1210 away from the first sub-board 113 along a second direction Y. The second direction Y is perpendicular to both the first direction X and the third direction Z. The filter capacitor 850 is fixed to the surface of the filter circuit board 1300 facing the circuit board 200. A plurality of negative connectors 520 are connected to the filter circuit board 1300. The filter capacitor 850 is connected to a portion of the pins 301 of the switch body 320 through metal traces on the filter circuit board 1300 and the circuit board 200.

[0280] In this embodiment, the filter capacitor 850 is fixed by the filter circuit board 1300 and electrically connected to the circuit board 200 via the filter circuit board 1300. This ensures that the filter capacitor 850 does not occupy space on the circuit board 200 and fully utilizes the space of the second sub-chamber S2. In this embodiment, the filter capacitor 850 belongs to the input-side filter component 1000. The filter capacitor 850 is connected to the negative connector 520 via the filter circuit board 1300 and to the switch body 320 via metal traces on the filter circuit board 1300 and the circuit board 200. This connection places the filter capacitor 850 between the negative connector 520 and the pin 301 of the switch body 320, improving the filtering effect of the filter capacitor 850.

[0281] Please continue to combine Figure 38 and Figure 39In one embodiment, the insulating support 1200 further includes a third support portion 1230, which is located between the filter circuit board 1300 and the circuit board 200 along the first direction X. The projection of the third support portion 1230 along the first direction X overlaps with the projection of the filter circuit board 1300 along the first direction X. The distance between the third support portion 1230 and the first sub-board 113 along the second direction Y is greater than the distance between each first support portion 1210 and the first sub-board 113. The third support portion 1230 is fixed to one of the first support portions 1210. The photovoltaic inverter 10 also includes a first connecting metal piece 1400, a filter circuit board 1300 connected to one end of the first connecting metal piece 1400, a plurality of negative connectors 520 connected to the first connecting metal piece 1400 through the filter circuit board 1300, a plurality of filter capacitors 850 connected to the first connecting metal piece 1400 through the filter circuit board 1300, and the other end of the first connecting metal piece 1400 fixed to the surface of the third support part 1230 away from the base plate 111 and fixedly connected to the circuit board 200.

[0282] In this embodiment, one end of the first connecting metal piece 1400 is connected to multiple negative connectors 520 and multiple filter capacitors 850, and the other end of the first connecting metal piece 1400 is used to fix it to the circuit board 200, so that multiple negative connectors 520 and multiple filter capacitors 850 are connected to the circuit board 200 through a connector, thereby simplifying the structural layout.

[0283] In one embodiment, the third support portion 1230 is arranged along the third direction Z on the side of all the first support portions 1210 and the second support portion 1220 away from the second sub-plate 114, making the arrangement more regular.

[0284] In one embodiment, the first connecting metal piece 1400 includes a main connecting section 1410 and a main fixing section 1420 connected together. The main connecting section 1410 is connected between the filter circuit board 1300 and the main fixing section 1420, and the main fixing section 1420 is used to connect the circuit board 200. Along the second direction Y, the main connecting section 1410 is located on the side of the third support portion 1230 opposite to the first sub-board 113, and the main fixing section 1420 is fixed between the surface of the third support portion 1230 opposite to the base plate 111 and the circuit board 200. This makes the structural layout more regular.

[0285] In one embodiment, the insulating support 1200 further includes an external connector pair 1500 for supporting connection to the battery pack, such as... Figure 31 As shown, the external connector 1500 is used to connect the battery pack, and the insulating support 1200 also includes a fourth support portion 1240, a fifth support portion 1250, and a sixth support portion 1260 (as shown). Figure 37 and Figure 38As shown), the distance between the surface of the sixth support portion 1260 facing away from the base plate 111 and the base plate 111 along the first direction X is less than the distance between the surfaces of the fourth support portion 1240 and the fifth support portion 1250 facing away from the base plate 111 and the base plate 111. The sixth support portion 1260 is used to fix the negative connector in the external connector pair 1500 (such as...). Figure 34 As shown), it is connected between the fifth support 1250 and the circuit board 200 by a second metal connecting piece 1600. The fourth support 1240 is used to fix the positive connector in the support connector pair and connect the positive connector 0 to the circuit board 200.

[0286] In one embodiment, the first support portion 1210 and the second support portion 1220 are integrally formed. In one embodiment, the first support portion 1210, the second support portion 1220, and the third support portion 1230 are integrally formed. In another embodiment, the first support portion 1210, the second support portion 1220, the third support portion 1230, the fourth support portion 1240, the fifth support portion 1250, and the sixth support portion 1260 are integrally formed. This improves the structural strength of the insulating support member 1200.

[0287] Please continue reading. Figure 30 In one embodiment, the bottom shell 110 further includes a second sub-plate 114 located between the bottom plate 111 and the cover plate 120. The second sub-plate 114 is connected to and intersects with the first sub-plate 113. One end of the knob 310 passes through the second sub-plate 114 and extends into the inner side of the outer shell 100, and is fixed relative to the switch body 320. This solution places the knob 310 and the positive connector 510 on different sub-plates of the outer shell 100, effectively utilizing the installation space of different sub-plates and avoiding operational errors.

[0288] Please refer to the following: Figure 7 and Figure 40 , Figure 40 This is a partial structural schematic diagram of a photovoltaic inverter 10 provided in one embodiment of the present application. In one embodiment, the second sub-board 114 is provided with mounting holes penetrating the inner and outer surfaces of the second sub-board 114. Figure 40 (not shown in the image), a sealing component 311 is provided on the outer side of the second sub-plate 114 (e.g., Figure 2 and Figure 40 As shown), knob 310 includes connecting rod 330 (as shown). Figure 40As shown, the connecting rod 330 passes sequentially through the sealing component 311 and the mounting hole to extend into the inner side of the housing 100. The sealing component 311 is used to seal the gap between the mounting hole and the connecting rod 330, preventing moisture or impurities from entering the interior of the housing 100 through the mounting hole and affecting the performance of the circuit board 200 or electrical components. For example, the sealing component 311 can be a sealing gasket, or it can include a sealing base and a sealing rubber sheet, with the sealing base pressing the sealing rubber sheet against the outer surface of the second sub-board 114 using screws. Since the switch body 320 is fixed to the circuit board 200, the space between the switch body 320 and the inner surface of the second sub-board 114 is limited, making it inconvenient to install the sealing component 311 on the inner surface of the second sub-board 114. In this embodiment, the sealing component 311 is located on the outer side of the second sub-board 114 to facilitate the installation of the knob 310 and the sealing component 311. In some embodiments, when there is sufficient space between the switch body 320 and the second sub-board 114, the sealing component 311 can also be installed on the inner side of the second sub-board 114.

[0289] In one embodiment, three pairs of input pins 3211 and one pair of output pins 3221 are arranged sequentially, with their arrangement direction parallel to the extension direction of the switch body 320. The output pins 3221 are positioned further away from the housing 100 than the input pins 3211. In other embodiments, the positions of the input pins 3211 and the output pins 3221 can be interchanged.

[0290] In one embodiment, in the input pin pair 3211, one input pin 321 electrically connected to the photovoltaic module 20 is denoted as 321a (e.g., ...). Figure 30 As shown in the diagram, an input pin 321 electrically connected to the inverter circuit is designated as 321b. Input pin 321a is positioned closer to the first daughterboard 113 than input pin 321b, which reduces the distance between input pin 321a and the positive electrode PV+ of the photovoltaic module 20, making the photovoltaic inverter structure more compact.

[0291] In one embodiment, in the output pin pair 3221, one output pin 322 electrically connected to the photovoltaic module 20 is denoted as 322a (e.g., ...). Figure 30 As shown in the diagram, an output pin 322, which is electrically connected to the inverter circuit, is designated as 322b. Output pin 321a is positioned closer to the first sub-board 113 than output pin 321b, which reduces the distance between output pin 322a and the negative electrode PV- of the photovoltaic module 20, resulting in a more compact photovoltaic inverter structure.

[0292] In one embodiment, the positions of input pins 321a and 321b in input pin pair 3211 can be interchanged. Similarly, the positions of output pins 321a and 321b in output pin pair 3221 can be interchanged to adapt to various scenarios.

[0293] Please continue reading. Figure 30 In one embodiment, the negative connector 520 is fixed to the first sub-board 113. This solution fixes the positive connector 510 and the negative connector 520 to the same sub-board of the housing 100, which helps to reduce installation difficulty and save space.

[0294] Please refer to the following: Figure 23 and Figure 29 In one embodiment, the filter capacitor 850, the switch assembly 300, and the inductor 830 are arranged sequentially along a second direction Y. The second direction Y intersects with both the extension direction of the switch body 320 and the first sub-board 113 (e.g., Figure 29 (As shown). In this embodiment, in the second direction Y, the switch assembly 300 is located between the filter capacitor 850 and the inductor 830, thus optimizing the layout of components on the circuit board 200. The placement of some of the filter capacitor 850, switch assembly 300, and inductor 830 close to the second sub-board 114 facilitates providing installation space for other components in the photovoltaic inverter 10. In one embodiment, the second direction Y is perpendicular to both the extension direction of the switch body 320 and the first sub-board 113. This design helps reduce the installation difficulty of the photovoltaic inverter 10.

[0295] In another embodiment, the filter capacitor 850, inductor 830, and switching assembly 300 are arranged sequentially along the second direction Y. In this embodiment, in the second direction Y, the inductor 830 is located between the filter capacitor 850 and the switching assembly 300. Both the filter capacitor 850 and the inductor 830 are positioned close to the first sub-board 113, which shortens the resonant circuit composed of the filter capacitor 850 and the inductor 830 from its proximity to the positive connector 510, thereby enhancing the filtering effect of the resonant circuit on DC current.

[0296] Please see Figure 41 , Figure 41 This is a top view of a switch body 320 provided in an embodiment of this application. In one embodiment, the switch body 320 has a positioning part 327 on the surface facing the circuit board. The positioning part 327 is spaced apart from the pin 301. The positioning part 327 is used to assist in positioning when fixing the switch body 320 to the circuit board.

[0297] In this embodiment, the positioning parts 327 and the pins 301 are arranged at intervals to avoid interference with the electrical connection. The positioning parts 327 are distributed on the surface of the switch body 320 facing the circuit board, making the auxiliary positioning of the switch body 320 by the positioning parts 327 more accurate. This solution provides positioning parts 327 on the switch body 320, making the connection operation between the switch body 320 and the circuit board 200 more convenient.

[0298] exist Figure 41 In the illustrated embodiment, the switch body 320 includes three positioning portions 327, and the three positioning portions 327 are respectively located near both ends of the surface of the switch body 320 facing the circuit board along the extension direction of the switch body 320. In other embodiments, the number of positioning portions 327 can be any other positive integer, and the positions of the multiple positioning portions 327 can be arbitrarily selected. Those skilled in the art can adjust them according to actual needs. This application does not specifically limit the number and distribution of the positioning portions 327.

[0299] The photovoltaic inverter and photovoltaic system provided in the embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and embodiments of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in specific embodiments and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A photovoltaic inverter, characterized in that, include: The outer casing includes a bottom shell and a cover plate, the bottom shell and the cover plate forming a receiving cavity, the bottom shell including a base plate disposed opposite to the cover plate; The circuit board includes a front side and a back side of the circuit board arranged opposite to each other along a first direction. The circuit board has metal traces. The front side of the circuit board faces the cover plate, and the back side of the circuit board faces the base plate. Surface mount resistors and surface mount capacitors are fixed on the front side of the circuit board, and inverter power components, bus capacitors and inductors are fixed on the back side of the circuit board. Heat dissipation fins are located on the side of the base plate away from the cover plate, and the inverter power assembly is thermally connected to a portion of the heat dissipation fins. A switch assembly includes a knob, a connecting rod, and a switch body. The knob and the switch body are located on the outer and inner sides of the housing, respectively. The knob is connected to the switch body via the connecting rod. The switch body is electrically connected to the circuit board. The switch body has a protrusion on the side facing the knob, and a connecting cylinder on the side facing the switch body. The connecting cylinder passes through the bottom shell and is inserted into the protrusion, so that the knob can drive the moving contact inside the switch body to rotate when it is rotated. Multiple PV ports, one end of which is located inside the housing and connected to the circuit board, and the other end of which extends through the housing to the outside of the housing.

2. The photovoltaic inverter of claim 1, wherein, The circuit board is fixed in the receiving cavity of the housing and divides the receiving cavity into a first sub-cavity and a second sub-cavity, wherein the first sub-cavity is located between the front side of the circuit board and the cover plate, and the second sub-cavity is located between the back side of the circuit board and the bottom plate, and the volume of the first sub-cavity is smaller than the volume of the second sub-cavity.

3. The photovoltaic inverter according to claim 1 or 2, characterized in that The inverter power component has a thermally conductive contact portion on the side away from the circuit board. The inverter power component is thermally connected to a portion of the heat sink fins through the thermally conductive contact portion. The bus capacitor and the inductor are located around the thermally conductive contact portion.

4. The photovoltaic inverter according to any of claims 1 to 3, characterized in that The switching assembly includes a breaking unit and pins. The breaking unit includes a moving contact and a stationary contact. The stationary contact is connected to the circuit board via the pins. The knob can control the rotation of the moving contact of the disconnecting unit to open or close the moving contact and the stationary contact.

5. The photovoltaic inverter of claim 4, wherein, The pins include input pins and output pins, and the disconnection unit includes an input disconnection unit and an output disconnection unit. The input pins and the output pins are located in the input disconnection unit and the output disconnection unit, respectively. The knob is used to control the conduction between the input pins and the conduction between the output pins; it is also used to control the disconnection between the input pins and the disconnection between the output pins.

6. The photovoltaic inverter of claim 5, wherein, The switch body includes at least one pair of input pins and at least one pair of output pins, each pair of input pins includes two input pins, and each pair of output pins includes two output pins; The PV port includes a positive connector and a negative connector; In the input disconnection unit, one input pin in each input pin pair is connected to the positive connector via a metal trace on the circuit board, two input pins in each input pin pair are connected via a stationary contact and a moving contact in the input disconnection unit, and the other input pin in each input pin pair is connected to the bus capacitor via a metal trace on the circuit board. In the output disconnection unit, one of the output pins in each pair of output pins is connected to the negative connector via a metal trace on the circuit board, the two output pins in each pair of output pins are connected via a stationary contact and a moving contact in the output disconnection unit, and the other output pin in each pair of output pins is connected to the inverter power component via a metal trace on the circuit board.

7. The photovoltaic inverter according to any of claims 1 to 6, characterized in that A DC-DC converter is fixed on the reverse side of the circuit board, and the DC-DC converter is thermally connected to the heat sink fins. Some pins of the switch body are connected to the DC-DC conversion component, and the DC-DC conversion component is electrically connected to the bus capacitor through the metal traces of the circuit board.

8. The photovoltaic inverter according to any of claims 1 to 7, characterized in that The photovoltaic inverter also includes an input-side filter component and an output-side filter component, both of which are connected to the circuit board; The PV port is connected to the input-side filter component via metal traces on the circuit board, and the input-side filter component is connected to a portion of the pins of the switch body; The inverter power component is connected to the output-side filter component via metal traces on the circuit board.

9. The photovoltaic inverter of claim 3, wherein, The base plate includes a base plate body and a raised plate. The raised plate is the thermally conductive contact portion. The raised plate protrudes from the base plate body toward the inverter power component and is thermally connected to the inverter power component. The raised plate and the orthographic projection of the inverter power component on the reverse side of the circuit board at least partially overlap. The raised plate and the orthographic projection of the DC-DC conversion component on the reverse side of the circuit board at least partially overlap. The bus capacitor and the inductor are located between the reverse side of the circuit board and the base plate body. Some of the heat dissipation fins are located on the side of the base plate body away from the reverse side of the circuit board.

10. The photovoltaic inverter according to any of claims 1 to 9, characterized in that The plurality of PV ports include a positive connector, the bottom shell includes a first sub-board located between the bottom plate and the cover plate, the positive connector is fixed to the first sub-board, the arrangement direction of the knob and the switch body is parallel to the first sub-board, and one end of the positive connector is located inside the outer shell and fixed to the reverse side of the circuit board; The photovoltaic inverter also includes a filter capacitor, which is fixed on the back of the circuit board. The filter capacitor is located around the positive connector and between the switch body and the first sub-board. The filter capacitor is connected between the positive connector and the pin through metal traces on the circuit board.

11. The photovoltaic inverter according to any of claims 1 to 10, characterized in that The photovoltaic inverter also includes an insulating support member located between the base plate and the circuit board. The insulating support member is fixed to the base plate, and one end of at least one of the PV ports is fixed between the insulating support member and the circuit board.

12. The photovoltaic inverter according to any of claims 1-11, characterized by The inverter power assembly includes multiple inverter power devices, and the DC-DC conversion assembly includes multiple DC power devices. At least one inverter power device is located among the multiple DC power devices, or at least one DC power device is located among the multiple inverter power devices; or The inverter power component is an inverter power module, which includes an inverter packaging structure and multiple inverter power devices located within the inverter packaging structure. The DC-DC conversion component is a DC-DC conversion module, which includes a DC packaging structure and multiple DC power devices located within the DC packaging structure.

13. A photovoltaic system characterized by, Includes at least one of the following: photovoltaic modules, photovoltaic optimizers, combiner boxes, box-type transformers, power sensors, energy storage systems, grid-connected / off-grid controllers, and intelligent subarray controllers. And a photovoltaic inverter as described in any one of claims 1-12, wherein the input terminal of the photovoltaic inverter is used for electrical connection with a photovoltaic module, the output terminal of the photovoltaic inverter is used for connection with a power grid, and the photovoltaic inverter is used for converting direct current from the photovoltaic module into alternating current and transmitting the alternating current to the power grid.

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