A terahertz harmonic mixer

Abstract

This invention discloses a terahertz harmonic mixing device, comprising: a radio frequency (RF) power divider for splitting one RF input signal into two equal-amplitude, out-of-phase RF output signals; a local oscillator (LO) power divider for splitting one LO input signal into two equal-amplitude, in-phase LO output signals; a first mixing circuit unit connected between the RF power divider and the LO power divider for outputting a first intermediate frequency (IF) signal; and a second mixing circuit unit connected between the RF power divider and the LO power divider for outputting a second IF signal, wherein the second IF signal and the first IF signal are differential signals. The RF power divider feeds the two equal-amplitude, out-of-phase RF signals into the first and second mixing circuit units, and the LO power divider feeds the two equal-amplitude, in-phase LO signals into the first and second mixing circuit units, outputting the first IF signal and the second IF signal. The first IF signal and the second IF signal are differential signals, exhibiting strong anti-interference capability.

Description

Technical Field

[0001] This invention relates to the field of terahertz wave mixing technology, and more specifically, to a terahertz harmonic mixing device. Background Technology

[0002] Terahertz waves have wide applications in fields such as astronomical observation, radar communication, and biomedicine. Terahertz waves refer to electromagnetic waves with frequencies between 0.1 and 10 THz, which lie between microwaves and visible light.

[0003] In related technologies, terahertz harmonic mixers are used to lower the local oscillator frequency, thereby making it easier to obtain higher drive power to achieve frequency changes in terahertz signals. However, the terahertz mixers in these technologies have relatively weak system anti-interference capabilities.

[0004] Therefore, how to improve the anti-interference capability of terahertz frequency band mixers is a problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] In view of this, the purpose of the present invention is to provide a terahertz harmonic mixing device with strong anti-interference capability.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A terahertz harmonic mixer includes:

[0008] A radio frequency power divider is used to split a single radio frequency input signal into two equal-amplitude, inverted radio frequency output signals.

[0009] The local oscillator power divider is used to split one local oscillator input signal into two local oscillator output signals with equal amplitude and in phase.

[0010] The first mixer circuit unit is connected between the radio frequency power divider and the local oscillator power divider, and is used to output the first intermediate frequency signal;

[0011] The second mixer circuit unit is connected between the radio frequency power divider and the local oscillator power divider, and is used to output a second intermediate frequency signal, wherein the second intermediate frequency signal and the first intermediate frequency signal are differential signals.

[0012] Optionally, the number of the first mixing circuit unit and the second mixing circuit unit are equal and both are N, where N=1 or N=2. The first mixing circuit unit and the second mixing circuit unit correspond one-to-one, and the first mixing circuit unit and the second mixing circuit unit are arranged in the same plane and layer. All the first mixing circuit units and all the second mixing circuit units form N layers.

[0013] Optionally, when N=2, the first mixing circuit units of different layers are symmetrically arranged along the transverse center line of the terahertz harmonic mixing device, and the second mixing circuit units of different layers are symmetrically arranged along the transverse center line.

[0014] Optionally, the radio frequency power divider includes N first cavities and N first circuit layers, with one first circuit layer corresponding to one side of a first cavity, and each first circuit layer including a first radio frequency signal output terminal and a second radio frequency signal output terminal.

[0015] The local oscillator power divider includes N second cavities and N second circuit layers. One second circuit layer is correspondingly covered on one side of one second cavity. Each second circuit layer includes a first local oscillator signal output terminal and a second local oscillator signal output terminal.

[0016] A first mixer circuit unit, a second mixer circuit unit, a first circuit layer, and a second circuit layer form a first corresponding layer. The first mixer circuit unit is connected to the first radio frequency signal output terminal and the first local oscillator signal output terminal of the same first corresponding layer, respectively. The second mixer circuit unit is connected to the second radio frequency signal output terminal and the second local oscillator signal output terminal of the same first corresponding layer, respectively.

[0017] Optionally, each of the first cavities includes a first sub-cavity end and a second sub-cavity end, wherein the first sub-cavity end is connected to the first radio frequency signal output end in a one-to-one correspondence, and the second sub-cavity end is connected to the second radio frequency signal output end in a one-to-one correspondence.

[0018] Each of the second cavities includes a third sub-cavity end and a fourth sub-cavity end. The third sub-cavity end is connected to the first local oscillator signal output end in a one-to-one correspondence, and the fourth sub-cavity end is connected to the second local oscillator signal output end in a one-to-one correspondence.

[0019] A first sub-cavity end, a second sub-cavity end, a third sub-cavity end, and a fourth sub-cavity end form a second corresponding layer. A first transition beam connects the first sub-cavity end and the third sub-cavity end located in the same second corresponding layer. A second transition beam connects the second sub-cavity end and the fourth sub-cavity end located in the same second corresponding layer. A first mixer circuit unit is bonded to the corresponding first transition beam via beam-type leads, and a second mixer circuit unit is bonded to the corresponding second transition beam via beam-type leads.

[0020] Optionally, N=2, two first cavities are stacked, and two first circuit layers are sandwiched between the two first cavities; two second cavities are stacked, and two second circuit layers are sandwiched between the two second cavities.

[0021] Optionally, the two first circuit layers are fixed by a first pin, and the two second circuit layers are fixed by a second pin.

[0022] Optionally, the RF power divider is an RF Y-junction; and / or, the local oscillator power divider is a local oscillator 3dB power divider.

[0023] Optionally, the first mixing circuit unit and the second mixing circuit unit are respectively monolithic integrated mixing circuit units based on anti-parallel Schottky diodes.

[0024] Optionally, the first mixing circuit unit and the second mixing circuit unit respectively adopt a second harmonic mixing circuit.

[0025] The terahertz harmonic mixer provided by this invention has at least the following beneficial effects:

[0026] Two equal-amplitude, out-of-phase radio frequency (RF) signals are generated using an RF power divider, meaning the phase difference between the two RF output signals is 180°. Two equal-amplitude, in-phase local oscillator (LO) signals are generated using a LO power divider. The RF power divider feeds the two equal-amplitude, out-of-phase RF differential signals into a first mixer circuit unit and a second mixer circuit unit. The LO power divider feeds the two equal-amplitude, in-phase LO signals into the first mixer circuit unit and the second mixer circuit unit. The first mixer circuit unit mixes one RF output signal with one LO output signal to output a first intermediate frequency (IF) signal. The second mixer circuit unit mixes the other RF output signal with the other LO output signal to output a second IF signal. This results in the output first and second IF signals being differential signals. Differential signals have strong anti-interference capabilities and low external radiation. Therefore, this terahertz harmonic mixing device improves the system's anti-interference capability. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the terahertz harmonic mixing device provided in a specific embodiment of the present invention;

[0029] Figure 2 for Figure 1 Exploded view;

[0030] Figure 3 This is a schematic diagram of the structure of the first or second mixer circuit unit.

[0031] Figure label:

[0032] 1-RF power divider; 11-First cavity; 111-First sub-cavity end; 112-Second sub-cavity end; 12-First circuit layer; 121-First RF signal output terminal; 122-Second RF signal output terminal; 2-Local oscillator power divider; 21-Second cavity; 211-Third sub-cavity end; 212-Fourth sub-cavity end; 22-Second circuit layer; 221-First local oscillator signal output terminal; 222-Second local oscillator signal output terminal; 3-First mixer circuit unit; 31-First waveguide port; 32-Second waveguide port; 33-Diode; 34-Local oscillator low-pass filter; 35-Intermediate frequency low-pass filter; 36-Intermediate frequency output port; 4-Second mixer circuit unit; 5-First transition beam; 6-Second transition beam. Detailed Implementation

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] The core of this invention is to provide a terahertz harmonic mixing device with strong anti-interference capability.

[0035] Please refer to Figure 1 This invention provides a terahertz harmonic mixing device, including a radio frequency power divider 1, a local oscillator power divider 2, a first mixing circuit unit 3, and a second mixing circuit unit 4. The radio frequency power divider 1 is used to split one radio frequency input signal into two equal-amplitude, out-of-phase radio frequency output signals; the local oscillator power divider 2 is used to split one local oscillator input signal into two equal-amplitude, in-phase local oscillator output signals; the first mixing circuit unit 3 is connected between the radio frequency power divider 1 and the local oscillator power divider 2, and is used to output a first intermediate frequency signal; the second mixing circuit unit 4 is connected between the radio frequency power divider 1 and the local oscillator power divider 2, and is used to output a second intermediate frequency signal, wherein the second intermediate frequency signal and the first intermediate frequency signal are differential signals.

[0036] In other words, the terahertz harmonic mixing device provided in this embodiment of the invention uses an RF power divider 1 to generate two equal-amplitude, out-of-phase RF signals, i.e., the phase difference between the two RF output signals is 180°, and uses a local oscillator power divider 2 to generate two equal-amplitude, in-phase local oscillator signals. The RF power divider 1 feeds the two equal-amplitude, out-of-phase RF differential signals into the first mixing circuit unit 3 and the second mixing circuit unit 4. The local oscillator power divider 2 feeds the two equal-amplitude, in-phase local oscillator signals into the first mixing circuit unit 3 and the second mixing circuit unit 4. The first mixing circuit unit 3 mixes one of the RF output signals with one of the local oscillator output signals to output a first intermediate frequency (IF) signal. The second mixing circuit unit 4 mixes the other RF output signal with the other local oscillator output signal to output a second IF signal. This makes the output first IF signal and second IF signal differential signals. Differential signals have strong anti-interference capabilities and low external radiation. Therefore, this terahertz harmonic mixing device improves the system's anti-interference capability.

[0037] Furthermore, such as Figure 1 and Figure 2 As shown, in some embodiments, the number of first mixing circuit units 3 and second mixing circuit units 4 are equal and both are N, where N=1 or 2. The first mixing circuit units 3 and second mixing circuit units 4 correspond one-to-one, and the first mixing circuit units 3 and second mixing circuit units 4 are coplanar and arranged on the same layer. All first mixing circuit units 3 and all second mixing circuit units 4 form N layers.

[0038] It is understandable that when N=1, a first mixer circuit unit 3 and a second mixer circuit unit 4 are set up in the same plane and layer to form a mixer unit, which outputs two differential intermediate frequency signals; when N=2, two mixer units are formed to output four intermediate frequency signals, and the intermediate frequency signals output by the first mixer circuit unit 3 and the second mixer circuit unit 4 in the same layer are differential.

[0039] In other words, this embodiment can output different multiple intermediate frequency (IF) signals by setting different values ​​for N. The more N values ​​there are, the greater the power capacity. Therefore, this scheme can improve the power capacity of the terahertz harmonic mixer. Furthermore, this embodiment uses a stacked structure to form multi-layer mixer circuit units, making the structure compact and reducing the size of the mixer circuit. That is, this embodiment can simultaneously output multiple layers of IF signals without significantly increasing the size of the terahertz harmonic mixer. Moreover, the structures of different mixer unit layers can be identical to avoid increasing design complexity and ensure multi-layer, multi-channel IF signal output without increasing design difficulty.

[0040] Furthermore, in some embodiments, when N=2, the first mixing circuit units 3 of different layers are symmetrically arranged along the transverse center line of the terahertz harmonic mixing device, and the second mixing circuit units 4 of different layers are symmetrically arranged along the transverse center line of the terahertz harmonic mixing device. That is, when N=2, the first mixing circuit units 3 of different layers are stacked vertically, and the second mixing circuit units 4 of different layers are stacked vertically.

[0041] In other words, in this embodiment, all the first mixing circuit units 3 of different layers are stacked along the direction perpendicular to the plane where the first mixing circuit unit 3 is located, and all the second mixing circuit units 4 of different layers are stacked along the direction perpendicular to the plane where the second mixing circuit unit 4 is located. This helps to ensure the symmetry of the structure and the uniformity of the structure of each layer, reduces the design difficulty, and makes the structure more compact.

[0042] Furthermore, such as Figure 2 As shown, in some embodiments, the radio frequency power divider 1 includes N first cavities 11 and N first circuit layers 12, with one first circuit layer 12 correspondingly covering one side of a first cavity 11. Each first circuit layer 12 includes a first radio frequency signal output terminal 121 and a second radio frequency signal output terminal 122. The local oscillator power divider 2 includes N second cavities 21 and N second circuit layers 22, with one second circuit layer 22 correspondingly covering one side of a second cavity 21. Each second circuit layer 22 includes a first local oscillator signal output terminal 221. The first mixing circuit unit 3, the second mixing circuit unit 4, the first circuit layer 12 and the second circuit layer 22 form a first corresponding layer. The first mixing circuit unit 3 is connected to the first radio frequency signal output terminal 121 and the first local oscillator signal output terminal 221 of the same first corresponding layer, respectively. The second mixing circuit unit 4 is connected to the second radio frequency signal output terminal 122 and the second local oscillator signal output terminal 222 of the same first corresponding layer, respectively.

[0043] In other words, in this embodiment, a first mixing circuit unit 3, a second mixing circuit unit 4, a first circuit layer 12, and a second circuit layer 22 form a first corresponding layer. The first mixing circuit unit 3, the second mixing circuit unit 4, the first circuit layer 12, and the second circuit layer 22 of the same first corresponding layer are arranged coplanarly, which is beneficial for the first mixing circuit unit 3 of the same first corresponding layer to be connected to the first circuit layer 12 and the second circuit layer 22 respectively, and for the second mixing circuit unit 4 of the same first corresponding layer to be connected to the first circuit layer 12 and the second circuit layer 22 respectively. At the same time, each first circuit layer 12 is divided into a first radio frequency signal output terminal 121 and a second radio frequency signal output terminal 122, which is beneficial for the independent output of two equal-amplitude and inverse radio frequency output signals. Each second circuit layer 22 is divided into a first local oscillator signal output terminal 221 and a second local oscillator signal output terminal 222, which is beneficial for the independent output of two equal-amplitude and in-phase local oscillator output signals.

[0044] Furthermore, such as Figure 2 As shown, in some embodiments, each first cavity 11 includes a first sub-cavity end 111 and a second sub-cavity end 112, with the first sub-cavity end 111 connected to a first radio frequency signal output end 121 and the second sub-cavity end 112 connected to a second radio frequency signal output end 122; each second cavity 21 includes a third sub-cavity end 211 and a fourth sub-cavity end 212, with the third sub-cavity end 211 connected to a first local oscillator signal output end 221 and the fourth sub-cavity end 212 connected to a second local oscillator signal output end 222; one first sub-cavity... A second corresponding layer is formed by a body end 111, a second sub-cavity end 112, a third sub-cavity end 211, and a fourth sub-cavity end 212. A first transition beam 5 is connected between the first sub-cavity end 111 and the third sub-cavity end 211 located in the same second corresponding layer. A second transition beam 6 is connected between the second sub-cavity end 112 and the fourth sub-cavity end 212 located in the same second corresponding layer. A first mixer circuit unit 3 is bonded to the corresponding first transition beam 5 through beam-type leads. A second mixer circuit unit 4 is bonded to the corresponding second transition beam 6 through beam-type leads.

[0045] It is understood that in this embodiment, the shape of the first cavity 11 is the same as the shape of the first circuit layer 12, and the shape of the second cavity 21 is the same as the shape of the second circuit layer 22. Moreover, in this embodiment, by setting a first transition beam 5, the first sub-cavity end 111 and the third sub-cavity end 211 located in the same second corresponding layer are connected together. By setting a second transition beam 6, the second sub-cavity end 112 and the fourth sub-cavity end 212 located in the same second corresponding layer are connected together. The first mixing circuit unit 3 is connected to the corresponding first transition beam 5 by beam-type wire bonding, and the second mixing circuit unit 4 is connected to the corresponding second transition beam 6 by beam-type wire bonding. This improves the structural connection strength and structural integrity, which is beneficial to ensuring structural stability.

[0046] It should be noted that the specific value of N is not limited in the above embodiments. N can be equal to 1, 2 or other positive integers.

[0047] like Figure 2 As shown, in some embodiments, N=2, two first cavities 11 are stacked, and two first circuit layers 12 are sandwiched between the two first cavities 11; two second cavities 21 are stacked, and two second circuit layers 22 are sandwiched between the two second cavities 21.

[0048] In other words, in this embodiment, the RF power divider 1 includes two first cavities 11 and two first circuit layers 12, and the local oscillator power divider 2 includes two second cavities 21 and two second circuit layers 22. The number of first mixing circuit units 3 and second mixing circuit units 4 are both two, forming two mixing circuit layers, outputting a total of four intermediate frequency signals. Furthermore, in this embodiment, the two first circuit layers 12 are sandwiched between the two first cavities 11, and the two second circuit layers 22 are sandwiched between the two second cavities 21, making the first circuit layers 12 and 22 centrally located. This arrangement helps protect the first circuit layers 12 and 22, while also resulting in a simple and compact structure.

[0049] It should be noted that the structures of different first cavities 11 can be the same or different, and the structures of different second cavities 21 can be the same or different, as long as it is conducive to the transmission of radio frequency signals and local oscillator signals.

[0050] In addition, in some embodiments, the two first circuit layers 12 are fixed by first pins, and the two second circuit layers 22 are fixed by second pins.

[0051] In other words, in this embodiment, after the two first circuit layers 12 are stacked, they are fixedly connected by the first pin, and after the two second circuit layers 22 are stacked, they are fixedly connected by the second pin. This helps to limit the mutual positioning of the two first circuit layers 12 and the two second circuit layers 22, thereby improving the stability and reliability of the structure.

[0052] It should be noted that the above embodiments do not limit the specific shape and type of the RF power divider 1 and the local oscillator power divider 2.

[0053] In some embodiments, the RF power divider 1 is an RF Y-junction; and / or, the local oscillator power divider 2 is a local oscillator 3dB power divider.

[0054] In some embodiments, the first mixer circuit unit 3 and the second mixer circuit unit 4 are respectively monolithic integrated mixer circuit units based on reverse parallel Schottky diodes.

[0055] In other words, this embodiment uses a monolithically integrated mixer circuit unit, which reduces losses compared to using discrete diodes 33 flip-chip mounted on the substrate. Furthermore, the use of reverse-parallel Schottky diodes is suitable for handling terahertz frequencies and for designing subharmonic or second-harmonic mixers.

[0056] Furthermore, in some embodiments, the first mixer circuit unit 3 and the second mixer circuit unit 4 can be formed using gallium arsenide monolithic integrated circuits or quartz heterojunction integrated circuits, respectively.

[0057] In addition, in some embodiments, the first mixing circuit unit 3 and the second mixing circuit unit 4 respectively employ second harmonic mixing circuits.

[0058] In other words, in this embodiment, the first mixing circuit unit 3 and the second mixing circuit unit 4 respectively use the second harmonic of the local oscillator signal to complete the frequency conversion. Only a local oscillator signal with a frequency half that of the required signal needs to be generated, which reduces the technical requirements of the local oscillator source and the system cost.

[0059] Of course, in other embodiments, the first mixer circuit unit 3 and the second mixer circuit unit 4 may also use other harmonic orders.

[0060] It should be noted that the specific structures of the first mixing circuit unit 3 and the second mixing circuit unit 4 are not limited in the above embodiments, as long as they can achieve the mixing of radio frequency signals and local oscillator signals. In some embodiments, the physical structures of each first mixing circuit unit 3 and each second mixing circuit unit 4 are the same. Figure 3As shown, exemplarily, the first mixer circuit unit 3 or the second mixer circuit unit 4 includes a first waveguide port 31, a second waveguide port 32, a diode 33, a local oscillator low-pass filter 34, an intermediate frequency low-pass filter 35, and an intermediate frequency output port 36. The first waveguide port 31 is used to receive radio frequency signals, and the second waveguide port 32 is used to input local oscillator signals. The specific connection methods of the first waveguide port 31, the second waveguide port 32, the diode 33, the local oscillator low-pass filter 34, the intermediate frequency low-pass filter 35, and the intermediate frequency output port 36 can be referred to related technologies, and will not be repeated here.

[0061] It should also be noted that, in this specification, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0062] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0063] The terahertz harmonic mixing device provided by this invention has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this invention. It should be noted that those skilled in the art can make various improvements and modifications to this invention without departing from its principles, and these improvements and modifications also fall within the protection scope of this invention.

Claims

1. A terahertz harmonic mixer, characterized in that, include: The radio frequency power divider (1) is used to split one radio frequency input signal into two equal-amplitude and inverted radio frequency output signals. The local oscillator power divider (2) is used to divide one local oscillator input signal into two local oscillator output signals with equal amplitude and in phase. The first mixer circuit unit (3) is connected between the radio frequency power divider (1) and the local oscillator power divider (2) and is used to output the first intermediate frequency signal; The second mixer circuit unit (4) is connected between the radio frequency power divider (1) and the local oscillator power divider (2) and is used to output a second intermediate frequency signal. The second intermediate frequency signal and the first intermediate frequency signal are differential signals.

2. The terahertz harmonic mixer according to claim 1, characterized in that, The number of the first mixing circuit unit (3) and the second mixing circuit unit (4) are equal and both are N, N=1 or N=2. The first mixing circuit unit (3) and the second mixing circuit unit (4) correspond one-to-one. Correspondingly, the first mixing circuit unit (3) and the second mixing circuit unit (4) are coplanar and on the same layer. All the first mixing circuit units (3) and all the second mixing circuit units (4) form N layers.

3. The terahertz harmonic mixer according to claim 2, characterized in that, When N=2, the first mixing circuit unit (3) of different layers is symmetrically arranged along the transverse center line of the terahertz harmonic mixing device, and the second mixing circuit unit (4) of different layers is symmetrically arranged along the transverse center line.

4. The terahertz harmonic mixer according to claim 2, characterized in that, The radio frequency power divider (1) includes N first cavities (11) and N first circuit layers (12). One first circuit layer (12) is correspondingly covered on one side of one first cavity (11). Each first circuit layer (12) includes a first radio frequency signal output terminal (121) and a second radio frequency signal output terminal (122). The local oscillator power divider (2) includes N second cavities (21) and N second circuit layers (22). One second circuit layer (22) is correspondingly covered on one side of one second cavity (21). Each second circuit layer (22) includes a first local oscillator signal output terminal (221) and a second local oscillator signal output terminal (222). A first mixer circuit unit (3), a second mixer circuit unit (4), a first circuit layer (12), and a second circuit layer (22) form a first corresponding layer. The first mixer circuit unit (3) is connected to the first radio frequency signal output terminal (121) and the first local oscillator signal output terminal (221) of the same first corresponding layer, respectively. The second mixer circuit unit (4) is connected to the second radio frequency signal output terminal (122) and the second local oscillator signal output terminal (222) of the same first corresponding layer, respectively.

5. The terahertz harmonic mixer according to claim 4, characterized in that, Each of the first cavities (11) includes a first sub-cavity end (111) and a second sub-cavity end (112). The first sub-cavity end (111) is connected to the first radio frequency signal output end (121) in a one-to-one correspondence, and the second sub-cavity end (112) is connected to the second radio frequency signal output end (122) in a one-to-one correspondence. Each of the second cavities (21) includes a third sub-cavity end (211) and a fourth sub-cavity end (212). The third sub-cavity end (211) is connected to the first local oscillator signal output end (221) in a one-to-one correspondence, and the fourth sub-cavity end (212) is connected to the second local oscillator signal output end (222) in a one-to-one correspondence. A first sub-cavity end (111), a second sub-cavity end (112), a third sub-cavity end (211), and a fourth sub-cavity end (212) form a second corresponding layer. A first transition beam (5) is connected between the first sub-cavity end (111) and the third sub-cavity end (211) located in the same second corresponding layer. A second transition beam (6) is connected between the second sub-cavity end (112) and the fourth sub-cavity end (212) located in the same second corresponding layer. A first mixer circuit unit (3) is bonded to the corresponding first transition beam (5) by beam wire bonding. A second mixer circuit unit (4) is bonded to the corresponding second transition beam (6) by beam wire bonding.

6. The terahertz harmonic mixer according to claim 5, characterized in that, N=2, two first cavities (11) are stacked, and two first circuit layers (12) are sandwiched between the two first cavities (11); two second cavities (21) are stacked, and two second circuit layers (22) are sandwiched between the two second cavities (21).

7. The terahertz harmonic mixing device according to claim 6, characterized in that, The two first circuit layers (12) are fixed by the first pin, and the two second circuit layers (22) are fixed by the second pin.

8. The terahertz harmonic mixing device according to any one of claims 1-7, characterized in that, The radio frequency power divider (1) is a radio frequency Y-junction; and / or, the local oscillator power divider (2) is a local oscillator 3dB power divider.

9. The terahertz harmonic mixing device according to any one of claims 1-7, characterized in that, The first mixer circuit unit (3) and the second mixer circuit unit (4) are monolithic integrated mixer circuit units based on reverse parallel Schottky diodes, respectively.

10. The terahertz harmonic mixing device according to any one of claims 1-7, characterized in that, The first mixing circuit unit (3) and the second mixing circuit unit (4) respectively adopt second harmonic mixing circuits.

Images