Multi-beam phased array system based on beam combining chip and beam combining chip
By integrating cross jumpers and summing circuit units into the beamforming chip, the problem of insufficient PCB processing precision was solved, realizing a low-loss, high-performance multi-beam phased array antenna, reducing production costs and design complexity.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- TSINGHUA UNIVERSITY
- Filing Date
- 2026-04-27
- Publication Date
- 2026-07-31
AI Technical Summary
In the existing technology, the PCB of multi-beam phased array antennas has low processing precision, making it difficult to integrate enough cross jumpers in a limited space. This results in high antenna feed loss, affecting reception/transmission performance, and increasing PCB thickness and production cost.
A multi-beam phased array system based on a beamforming chip is adopted, and the cross jumper structure is integrated into the beamforming chip. The front-end chip and the beamforming chip are connected point-to-point. A grounded coplanar waveguide structure and a dual-frequency Wilkinson power combiner are used to reduce the number of PCB wiring layers and improve processing accuracy and signal isolation.
It reduces antenna feed loss, improves receive/transmit performance, reduces PCB thickness, shortens design iteration cycle and production cost, and enhances beam isolation and channel consistency.
Smart Images

Figure CN122496080A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of antenna technology, and in particular to a multi-beam phased array system based on a beamforming chip and the beamforming chip itself. Background Technology
[0002] In recent years, non-terrestrial network communications, represented by satellite communications, have flourished. Among them, satellite communication systems based on low-Earth orbit (LEO) constellations have high application potential due to their advantages such as low latency and low path loss. The core challenge of LEO satellite communications is how to track the relative positions of satellites and ground in real time and build a high-speed tracking and fast-switching satellite-to-ground link. Through phased array technology, the antenna array can achieve fine-tuning of beam pointing, thereby enabling tracking of user terminals and compensation for path loss.
[0003] Among various phased array architectures, fully connected multi-beam phased arrays can generate multiple independent beams without sacrificing aperture efficiency, possessing high communication rates and the ability to simultaneously establish multiple satellite-to-ground connections. Therefore, they are widely used in ground stations and spaceborne platforms for satellite communications. Due to power consumption and cost considerations, current multi-beam phased arrays generally adopt an analog phased array architecture, the core of which is a fully connected beamforming network. The core function of this network is to sum the signals of each channel within each beam while maintaining signal isolation between beams.
[0004] In existing technologies, beamforming networks are implemented on printed circuit boards (PCBs). To achieve multi-beam combining, a large number of cross jumpers and power combiners with isolation resistors need to be integrated into the PCB. The complexity increases rapidly with the number of supported beams in a quadratic relationship. However, due to the limitation of phased arrays operating without grid lobes, the traces on the PCB must be laid out within half-wavelength spacing. But because of the low manufacturing precision of PCBs, it is difficult to integrate enough cross jumpers in a limited space when the number of beams is large.
[0005] To address this issue, related technologies increase the number of synthesized beams that a PCB can support by adding additional RF wiring layers. However, adding extra wiring layers to the PCB increases its overall thickness. A thicker PCB increases dielectric loss and impedance mismatch in the RF signal (beam) transmission path, resulting in higher antenna feed loss and directly degrading receive / transmit performance. Summary of the Invention
[0006] This invention provides a multi-beam phased array system and a beamforming chip based on a beamforming chip, which solves the problem of high antenna feed loss caused by thick PCB in the prior art, and can reduce antenna feed loss, thereby improving reception / transmission performance.
[0007] This invention provides a multi-beam phased array system based on a beamforming chip, comprising: Beamforming chip and multiple front-end chips; Each beam interface of the front-end chip is connected to the input port of the beamforming chip in a point-to-point and non-intersecting manner. The beamforming chip integrates a crossover jumper unit and a summing circuit unit; the crossover jumper unit is used to input signals from two designated input ports into the same summing circuit unit; the summing circuit unit is used to sum the power of the input signals.
[0008] According to the present invention, a multi-beam phased array system based on a beamforming chip is provided, the system further comprising a printed circuit board, wherein the beamforming chip and the front-end chip are connected through the printed circuit board; The portion of the printed circuit board used to connect the beamforming chip and the front-end chip adopts a point-to-point, non-intersecting radio frequency trace structure.
[0009] According to the present invention, in a multi-beam phased array system based on a beamforming chip, at least a portion of the traces in the cross jumper unit adopt a grounded coplanar waveguide structure.
[0010] According to the present invention, in a multi-beam phased array system based on a beamforming chip, the traces of adjacent grounded coplanar waveguide structures share a common ground plane.
[0011] According to the present invention, a multi-beam phased array system based on a beamforming chip is provided, wherein the summing circuit unit includes a dual-frequency Wilkinson power combiner; when a first control signal is input to the control terminal of the dual-frequency Wilkinson power combiner, the dual-frequency Wilkinson power combiner operates in a first frequency band; when a second control signal is input to the control terminal of the dual-frequency Wilkinson power combiner, the dual-frequency Wilkinson power combiner operates in a second frequency band.
[0012] According to the present invention, a multi-beam phased array system based on a beamforming chip is provided, wherein the dual-frequency Wilkinson power combiner comprises: Resistor, first equivalent quarter-wavelength transmission line circuit, second equivalent quarter-wavelength transmission line circuit; The first end of the resistor is connected to the input end of the first equivalent quarter-wavelength transmission line circuit, the second end of the resistor is connected to the input end of the second equivalent quarter-wavelength transmission line circuit, and the output end of the first equivalent quarter-wavelength transmission line circuit is connected to the output end of the second equivalent quarter-wavelength transmission line circuit. The control terminal of the first equivalent quarter-wavelength transmission line circuit is connected to the control terminal of the dual-frequency Wilkinson power combiner; when the control terminal of the first equivalent quarter-wavelength transmission line circuit receives a first control signal, the first equivalent quarter-wavelength transmission line circuit operates in the first frequency band; when the control terminal of the first equivalent quarter-wavelength transmission line circuit receives a second control signal, the first equivalent quarter-wavelength transmission line circuit operates in the second frequency band. The control terminal of the second equivalent quarter-wavelength transmission line circuit is connected to the control terminal of the dual-frequency Wilkinson power combiner; when the control terminal of the second equivalent quarter-wavelength transmission line circuit receives a first control signal, the second equivalent quarter-wavelength transmission line circuit operates in the first frequency band; when the control terminal of the second equivalent quarter-wavelength transmission line circuit receives a second control signal, the second equivalent quarter-wavelength transmission line circuit operates in the second frequency band.
[0013] According to the present invention, a multi-beam phased array system based on a beamforming chip is provided, wherein the control terminal of the dual-frequency Wilkinson power combiner includes a first control terminal and a second control terminal, the control terminal of the first equivalent quarter-wavelength transmission line circuit includes a third control terminal and a fourth control terminal, and the control terminal of the second equivalent quarter-wavelength transmission line circuit includes a fifth control terminal and a sixth control terminal; the first control terminal is connected to the third control terminal and the fifth control terminal respectively, and the second control terminal is connected to the fourth control terminal and the sixth control terminal respectively. When a high-level signal is input at the first control terminal and a low-level signal is input at the second control terminal, both the first equivalent quarter-wavelength transmission line circuit and the second equivalent quarter-wavelength transmission line circuit operate in the first frequency band. When a low-level signal is input to the first control terminal and a high-level signal is input to the second control terminal, both the first equivalent quarter-wavelength transmission line circuit and the second equivalent quarter-wavelength transmission line circuit operate in the second frequency band.
[0014] According to the present invention, a multi-beam phased array system based on a beamforming chip is provided, wherein the first equivalent quarter-wavelength transmission line circuit includes: First switch, second switch, third switch, fourth switch, first inductor, second inductor, third inductor, fourth inductor, fifth inductor, first capacitor, second capacitor, third capacitor; The first terminal of the first inductor is connected to the first terminal of the resistor. The second terminal of the first inductor is connected to the first terminal of the second inductor and the first terminal of the first capacitor. The second terminal of the first capacitor is connected to the first terminal of the first switch, and the second terminal of the first switch is grounded. The second terminal of the second inductor is connected to the first terminal of the third inductor and the first terminal of the second capacitor. The second terminal of the second capacitor is connected to the first terminal of the second switch, and the second terminal of the second switch is grounded. The second terminal of the third inductor is connected to the first terminal of the fourth inductor and the first terminal of the third capacitor. The second terminal of the third capacitor is connected to the first terminal of the third switch, and the second terminal of the third switch is grounded. The second end of the fourth inductor is the output end of the first equivalent quarter-wavelength transmission line circuit; the first end of the fifth inductor is connected to the first end of the fourth switch, and the second end of the fifth inductor is connected to the second end of the fourth switch; the control end of the fourth switch is connected to the third control end; the control ends of the first switch, the second switch, and the third switch are all connected to the fourth control end.
[0015] According to the present invention, a multi-beam phased array system based on a beamforming chip is provided. The system includes at least one phased array module, the phased array module including one beamforming chip and four front-end chips. The front-end chip is a four-antenna, four-beam front-end chip. The beamforming chip includes a first combining submodule, a second combining submodule, and a third combining submodule. The first combining submodule, the second combining submodule, and the third combining submodule all include a cross jumper unit and a summing circuit unit. Two of the four front-end chips have their eight beam interfaces connected to the eight input ports of the first synthesis submodule in a point-to-point, non-intersecting manner; the other two of the four front-end chips have their eight beam interfaces connected to the eight input ports of the second synthesis submodule in a point-to-point, non-intersecting manner. The four output ports of the first synthesis submodule and the four output ports of the second synthesis submodule are connected to the eight input ports of the third synthesis submodule in a point-to-point and non-intersecting manner.
[0016] According to the present invention, a multi-beam phased array system based on a beamforming chip is provided. Both the beamforming chip and the front-end chip are fabricated using integrated circuit technology, including a 65nm complementary metal-oxide-semiconductor process and wafer-level chip-scale packaging.
[0017] The present invention also provides a beamforming chip, wherein the beamforming chip integrates a cross jumper unit and a summing circuit unit; the cross jumper unit is used to input signals from two designated input ports into the same summing circuit unit; the summing circuit unit is used to sum the power of the input signals.
[0018] The multi-beam phased array system and beamforming chip based on a beamforming chip provided by this invention integrate the cross-jump structure into the cross-jump unit inside the beamforming chip. This eliminates the need for cross-jumps on the PCB, reducing the number of PCB wiring layers and significantly decreasing PCB thickness. This, in turn, reduces antenna feed loss and improves receive / transmit performance. Furthermore, the high processing precision of integrated circuit technology improves the isolation between beams and the consistency of channels within a beam in the multi-beam phased array. In addition, since the beamforming chip is an integrated circuit product, it is easy to standardize and reuse across different designs, further reducing design iteration cycles and production costs. Attached Figure Description
[0019] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0020] Figure 1 This is a schematic diagram of a multi-beam phased array system based on a beamforming chip provided by the present invention; Figure 2 This is one of the schematic diagrams of the dual-frequency Wilkinson power combiner provided by the present invention; Figure 3 This is the second schematic diagram of the dual-frequency Wilkinson power combiner provided by the present invention; Figure 4 This is the third schematic diagram of the dual-frequency Wilkinson power combiner provided by the present invention; Figure 5 This is a schematic diagram of a phased array module provided by the present invention; Figure 6 This is one of the schematic diagrams of the beamforming chip provided by the present invention; Figure 7 This is one of the schematic diagrams of the cross jumper unit provided by the present invention; Figure 8 This is a second schematic diagram of the cross jumper unit provided by the present invention; Figure 9 This is the second schematic diagram of the beamforming chip provided by the present invention. Detailed Implementation
[0021] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.
[0022] In existing technologies, beamforming networks are implemented in PCBs. Due to the low processing precision of PCBs, it is difficult for PCBs to integrate sufficient cross jumpers within half-wavelength spacing for 4 beams or more in the shorter wavelength millimeter-wave band.
[0023] To address this issue, related technologies involve adding an additional RF wiring layer to the PCB to achieve the desired beamforming function. However, this method has the following drawbacks: (1) In order to maintain beam isolation, each RF routing layer needs to have a ground metal layer (GND) added above and below it. Therefore, even if the GND layer is reused between beams, at least 2N+1 metal layers are needed to complete the basic routing function for an N-beam composite network. The significantly increased number of PCB stack-up layers will lead to increased costs and greatly increase the difficulty of the process.
[0024] (2) Complex PCBs are not standardized products. Each time a new phased array product is developed, it needs to be customized, resulting in a long design iteration cycle and high R&D costs.
[0025] (3) Since the radio frequency signal needs to pass through the entire PCB and connect to the radio frequency front-end chip on the surface layer from the antenna at the bottom of the PCB, a thicker PCB will result in higher antenna feed loss, which will directly degrade the receiving / transmitting performance of the phased array.
[0026] (4) Since the RF traces are located inside the PCB, high-precision surface mount resistors cannot be used. Only buried resistors, which are costly and have poor precision, can be used, resulting in poor beamforming effect.
[0027] (5) The PCB is manufactured by lamination layer by layer, which cannot guarantee the high consistency of dielectric layer thickness and dielectric constant in large-scale production. This results in inconsistent amplitude and phase between beams, making it difficult to provide multiple independent beams with the same performance.
[0028] (6) The thickness of the PCB can be increased to a limited extent, and the number of beams that can be supported is also limited.
[0029] To address at least one of the aforementioned problems, this invention provides a multi-beam phased array system based on a beamforming chip and a beamforming chip, which are described below in conjunction with... Figures 1 to 9 Please provide a detailed explanation.
[0030] Figure 1 This is a schematic diagram of a multi-beam phased array system based on a beamforming chip provided by the present invention, such as... Figure 1 As shown, it includes: A beamforming chip 10 and multiple front-end chips 11; each beam interface of the front-end chip 10 is connected to the input port of the beamforming chip 10 in a point-to-point, non-intersecting manner; such as Figure 9 As shown, the beamforming chip 10 integrates a cross jumper unit 101 and a summing circuit unit 102; the cross jumper unit 101 is used to input signals from two designated input ports into the same summing circuit unit; the summing circuit unit 102 is used to sum the power of the input signals.
[0031] The front-end chip 11 is a component used to implement radio frequency transceiver functions. The front-end chip 11 can integrate functional modules such as antenna, power amplifier, low-noise amplifier, phase shifter, attenuator, and switch. The beamforming chip 10 integrates a cross-jump unit 101. The cross-jump unit 101 adopts a cross-jump structure, that is, the cross-jump structure is integrated into the beamforming chip 10. Therefore, there is no need to use cross-jumps between the front-end chip 11 and the beamforming chip 10. The beam interfaces of the front-end chip 11 and the input ports of the beamforming chip 10 can be connected in a point-to-point and non-crossing manner.
[0032] In one example, the front-end chip 11 and / or the beamforming chip 10 can employ flip-chip packaging technology, allowing direct connection between the front-end chip 11 and the beamforming chip 10. In another example, the front-end chip 11 and the beamforming chip 10 can be connected via a PCB. The multi-beam phased array system based on the beamforming chip further includes a printed circuit board, through which the beamforming chip 10 and the front-end chip 11 are connected. The portion of the printed circuit board used to connect the beamforming chip and the front-end chip employs a point-to-point, non-intersecting RF trace structure.
[0033] To reduce crosstalk between different beam traces, in one possible implementation, at least a portion of the traces in the crossover jumper unit 101 employ a grounded coplanar waveguide (GCPW) structure. The grounded coplanar waveguide structure has ground planes (grounding wires) on both sides of the central conductor strip, which effectively prevents crosstalk from the beam signal of the central conductor strip to adjacent conductors. Furthermore, to save wiring space, in one example, traces of adjacent grounded coplanar waveguide structures can share a grounding wire.
[0034] The summing circuit unit 102 is used to sum the beam power. The summing circuit unit 102 can be any power combiner, such as a Gysel power combiner, a hybrid bridge, a ring bridge, a spatial power combiner, etc. In one possible implementation, the summing circuit module includes a Wilkinson power combiner based on lumped parameters. The lumped parameters of the Wilkinson power combiner satisfy the beam wavelength requirements.
[0035] Both the beamforming chip 10 and the front-end chip 11 are fabricated using integrated circuit technology. In one example, the integrated circuit technology includes a 65nm complementary metal-oxide-semiconductor (CMOS) process and wafer-level chip-scale packaging (WLCSP).
[0036] In this embodiment of the invention, the cross-jump structure is integrated into the cross-jump unit inside the beamforming chip, eliminating the need for cross-jumps on the PCB. This reduces the number of PCB wiring layers and significantly decreases the PCB thickness, thereby reducing antenna feed loss and improving receive / transmit performance. The chip is fabricated using integrated circuit technology, which offers far higher processing precision and integration than printed circuit boards. It allows for the placement of multiple cross-jump structures within a half-wavelength pitch, solving the problem of insufficient space for cross-jump placement in existing technologies and increasing the number of beams supported during beamforming. Furthermore, the high processing precision of integrated circuit technology improves the isolation between beams and the consistency of channels within a beam in a multi-beam phased array. In addition, since the beamforming chip is an integrated circuit product, it is easily standardized and reused across different designs, further reducing design iteration cycles and production costs.
[0037] exist Figure 1 Based on the illustrated embodiment, in one possible implementation, the summing circuit unit 102 includes a dual-frequency Wilkinson power combiner. The dual-frequency Wilkinson power combiner supports two operating frequency bands. When a first control signal is input to the control terminal of the dual-frequency Wilkinson power combiner, the combiner operates in the first frequency band; when a second control signal is input to the control terminal of the dual-frequency Wilkinson power combiner, the combiner operates in the second frequency band.
[0038] In one example, such as Figure 2As shown, the dual-frequency Wilkinson power combiner includes: a resistor 1021, a first equivalent quarter-wavelength transmission line circuit 1022, and a second equivalent quarter-wavelength transmission line circuit 1023; the first end of the resistor 1021 is connected to the input end of the first equivalent quarter-wavelength transmission line circuit 1022, the second end of the resistor 1021 is connected to the input end of the second equivalent quarter-wavelength transmission line circuit 1023, and the output end of the first equivalent quarter-wavelength transmission line circuit 1022 is connected to the output end of the second equivalent quarter-wavelength transmission line circuit 1022.
[0039] The control terminal of the first equivalent quarter-wavelength transmission line circuit 1022 is connected to the control terminal of the dual-frequency Wilkinson power combiner; when the control terminal of the first equivalent quarter-wavelength transmission line circuit 1022 receives a first control signal, the first equivalent quarter-wavelength transmission line circuit 1022 operates in the first frequency band; when the control terminal of the first equivalent quarter-wavelength transmission line circuit 1022 receives a second control signal, the first equivalent quarter-wavelength transmission line circuit 1022 operates in the second frequency band.
[0040] The control terminal of the second equivalent quarter-wavelength transmission line circuit 1023 is connected to the control terminal of the dual-frequency Wilkinson power combiner. When the control terminal of the second equivalent quarter-wavelength transmission line circuit 1023 receives a first control signal, the second equivalent quarter-wavelength transmission line circuit 1023 operates in the first frequency band. When the control terminal of the second equivalent quarter-wavelength transmission line circuit 1023 receives a second control signal, the second equivalent quarter-wavelength transmission line circuit 1023 operates in the second frequency band.
[0041] In this embodiment of the invention, a dual-frequency Wilkinson power combiner can support beamforming in two frequency bands, thereby increasing the applicability of beamforming.
[0042] The first equivalent quarter-wavelength transmission line circuit 1022 and the second equivalent quarter-wavelength transmission line circuit 1023 can be controlled by a control signal. Figure 2 Based on the illustrated embodiments, in one possible implementation, see [link to relevant documentation]. Figure 3 The first equivalent quarter-wavelength transmission line circuit 1022 includes: First switch M1, second switch M2, third switch M3, fourth switch M4, first inductor L1, second inductor L2, third inductor L3, fourth inductor L4, fifth inductor L5, first capacitor C1, second capacitor C2, third capacitor C3.
[0043] The first terminal of the first inductor L1 is connected to the first terminal of the resistor 1021. The second terminal of the first inductor L1 is connected to the first terminal of the second inductor L2 and the first terminal of the first capacitor C1. The second terminal of the first capacitor C1 is connected to the first terminal of the first switch M1. The second terminal of the first switch M2 is grounded. The second terminal of the second inductor L2 is connected to the first terminal of the third inductor L3 and the first terminal of the second capacitor C2. The second terminal of the second capacitor C2 is connected to the first terminal of the second switch M2. The second terminal of the second switch M2 is grounded. The second terminal of the third inductor L3 is connected to the first terminal of the fourth inductor L4 and the first terminal of the third capacitor C3. The second terminal of the third capacitor C3 is connected to the first terminal of the third switch M3. The second terminal of the third switch M3 is grounded.
[0044] The second end of the fourth inductor L4 is the output terminal of the first equivalent quarter-wavelength transmission line circuit 1022; the first end of the fifth inductor L5 is connected to the first end of the fourth switch M4, and the second end of the fifth inductor L5 is connected to the second end of the fourth switch M4; the control terminals of the first switch M1, the second switch M2, the third switch M3, and the fourth switch M4 are all connected to the control terminal of the first equivalent quarter-wavelength transmission line circuit 1022, and the first switch M1, the second switch M2, and the third switch M3 are transistors of the same polarity, while the first switch M1 and the fourth switch M4 are transistors of different polarities.
[0045] In one example, the first switch M1, the second switch M2, and the third switch M3 are P-type transistors, and the fourth switch M4 is an N-type transistor. In another example, the first switch M1, the second switch M2, and the third switch M3 are N-type transistors, and the fourth switch M4 is a P-type transistor. Taking the example where the first switch M1, the second switch M2, and the third switch M3 are all P-type transistors and the fourth switch M4 is an N-type transistor, then when a low-level signal is input to the control terminal of the first equivalent quarter-wavelength transmission line circuit 1022, the fourth switch M4 is closed, and the first switch M1, the second switch M2, and the third switch M3 are open, and the first equivalent quarter-wavelength transmission line circuit 1022 operates in the first frequency band. When a high-level signal is input to the control terminal of the first equivalent quarter-wavelength transmission line circuit 1022, the fourth switch M4 is open, and the first switch M1, the second switch M2, and the third switch M3 are closed, and the first equivalent quarter-wavelength transmission line circuit 1022 operates in the second frequency band.
[0046] For transmission line circuits implemented using either the classical or lumped parameter form, the design formula is as follows: Characteristic impedance Electrical length ; in, and These are the total inductance and total capacitance of the transmission line circuit, respectively. This is the operating angular frequency. To achieve a 70.7 ohm quarter-transmission line, the following needs to be ensured: By combining inductors and capacitors, it is possible to achieve... and Regulation, thereby achieving the goal of ensuring While maintaining the frequency at around 70.7 ohms, the operating frequency of the transmission line circuit is switched.
[0047] In this embodiment of the invention, the 70.7Ω quarter-wavelength transmission line in a traditional Wilkinson power combiner is replaced with a third-order LC network for lumped parameter equivalence, thereby reducing layout area consumption and insertion loss. Simultaneously, switched capacitors and switched inductors are integrated. Adjustment via switches allows for both high-frequency and low-frequency modes, both exhibiting a constant 70.7Ω and an equivalent quarter-wavelength electrical length at the center frequency, ensuring isolation and port matching. Using switches to control the on / off switching of capacitors and inductors in the first equivalent quarter-wavelength transmission line circuit 1022 allows for adjustment of the total inductance and capacitance, enabling the first equivalent quarter-wavelength transmission line circuit 1022 to operate in different frequency bands, increasing its operating range. Utilizing a compact area, near-ideal power combining functionality is achieved with low loss.
[0048] The first equivalent quarter-wavelength transmission line circuit 1022 and the second equivalent quarter-wavelength transmission line circuit 1023 can be controlled by two control signals. Figure 2 Based on the illustrated embodiment, in one possible implementation, the control terminals of the dual-frequency Wilkinson power combiner include a first control terminal and a second control terminal; the control terminals of the first equivalent quarter-wavelength transmission line circuit 1022 include a third control terminal and a fourth control terminal; and the control terminals of the second equivalent quarter-wavelength transmission line circuit 1023 include a fifth control terminal and a sixth control terminal. The first control terminal is connected to the third and fifth control terminals respectively, and the second control terminal is connected to the fourth and sixth control terminals respectively. When a high-level signal is input to the first control terminal and a low-level signal is input to the second control terminal, both the first equivalent quarter-wavelength transmission line circuit 1022 and the second equivalent quarter-wavelength transmission line circuit 1023 operate in the first frequency band; when a low-level signal is input to the first control terminal and a high-level signal is input to the second control terminal, both the first equivalent quarter-wavelength transmission line circuit 1022 and the second equivalent quarter-wavelength transmission line circuit 1023 operate in the second frequency band.
[0049] See Figure 4The first equivalent quarter-wavelength transmission line circuit 1022 includes: First switch M1, second switch M2, third switch M3, fourth switch M4, first inductor L1, second inductor L2, third inductor L3, fourth inductor L4, fifth inductor L5, first capacitor C1, second capacitor C2, third capacitor C3.
[0050] The first terminal of the first inductor L1 is connected to the first terminal of the resistor 1021. The second terminal of the first inductor L1 is connected to the first terminal of the second inductor L2 and the first terminal of the first capacitor C1. The second terminal of the first capacitor C1 is connected to the first terminal of the first switch M1. The second terminal of the first switch M2 is grounded. The second terminal of the second inductor L2 is connected to the first terminal of the third inductor L3 and the first terminal of the second capacitor C2. The second terminal of the second capacitor C2 is connected to the first terminal of the second switch M2. The second terminal of the second switch M2 is grounded. The second terminal of the third inductor L3 is connected to the first terminal of the fourth inductor L4 and the first terminal of the third capacitor C3. The second terminal of the third capacitor C3 is connected to the first terminal of the third switch M3. The second terminal of the third switch M3 is grounded.
[0051] The second end of the fourth inductor L4 is the output end of the first equivalent quarter-wavelength transmission line circuit 1022; the first end of the fifth inductor L5 is connected to the first end of the fourth switch M4, and the second end of the fifth inductor L5 is connected to the second end of the fourth switch M4; the control end of the fourth switch M4 is connected to the third control end; the control ends of the first switch M1, the second switch M2, and the third switch M3 are all connected to the fourth control end.
[0052] The first switch M1, the second switch M2, the third switch M3, and the fourth switch M4 are all transistors of the same polarity; they can all be P-type transistors or all be N-type transistors. In one example, if all four switches are P-type transistors, then when a high-level signal is input to the first control terminal and a low-level signal is input to the second control terminal, the fourth switch M4 is closed, and the first, second, and third switches M1, M2, and M3 are open, and the first equivalent quarter-wavelength transmission line circuit 1022 operates in the first frequency band. When a low-level signal is input to the first control terminal and a high-level signal is input to the second control terminal, the fourth switch M4 is open, and the first, second, and third switches M1, M2, and M3 are closed, and the first equivalent quarter-wavelength transmission line circuit 1022 operates in the second frequency band.
[0053] In this embodiment of the invention, the 70.7Ω quarter-wavelength transmission line in a traditional Wilkinson power combiner is replaced with a third-order LC network for lumped parameter equivalence, thereby reducing layout area consumption and insertion loss. Simultaneously, switched capacitors and switched inductors are integrated. Adjustment via switches allows for both high-frequency and low-frequency modes, both exhibiting a constant 70.7Ω and an equivalent quarter-wavelength electrical length at the center frequency, ensuring isolation and port matching. Using switches to control the on / off switching of capacitors and inductors in the first equivalent quarter-wavelength transmission line circuit 1022 allows for adjustment of the total inductance and capacitance, enabling the first equivalent quarter-wavelength transmission line circuit 1022 to operate in different frequency bands, increasing its operating range. Utilizing a compact area, near-ideal power combining functionality is achieved with low loss.
[0054] It is understood that the polarities of the first switch M1, the second switch M2, the third switch M3 and the fourth switch M4 in the above embodiments are merely examples, and other possible combinations of polarities may be adopted according to the technical concept of the present invention, all of which are within the protection scope of this application.
[0055] It is understood that the specific circuit diagram of the second equivalent quarter-wavelength transmission line circuit 1023 is the same as or similar to that of the first equivalent quarter-wavelength transmission line circuit 1022. For relevant details, please refer to the first equivalent quarter-wavelength transmission line circuit 1022. It will not be repeated here.
[0056] In one possible implementation, see Figure 5 The multi-beam phased array system based on a beamforming chip includes at least one phased array module 20. Each phased array module 20 includes a beamforming chip 10 and four front-end chips 11. Each front-end chip 11 is a four-antenna, four-beam front-end chip, simultaneously supporting the transmission and reception of four beams. The beamforming chip 10 supports beamforming from sixteen to four beams.
[0057] Taking a receiver array as an example, the four beam interfaces (output pins) of the four receiver front-end chips output four sets of four-beam RF signals, which are transmitted to the beamforming chip 10 on the PCB via point-to-point, non-intersecting traces. These sixteen RF signals are then summed within each beam by the beamforming chip 10 to synthesize four beam output signals. For example... Figure 6As shown, the beamforming chip 10 includes a first beamforming submodule 21, a second beamforming submodule 22, and a third beamforming submodule 23; each of the first beamforming submodule 21, the second beamforming submodule 22, and the third beamforming submodule 23 includes a cross jumper unit 101 and a summing circuit unit 102; the eight beam interfaces of two of the four front-end chips 11 are connected to the eight input ports of the first beamforming submodule 22 in a point-to-point, non-crossing manner; the eight beam interfaces of the other two of the four front-end chips 11 are connected to the eight input ports of the second beamforming submodule 22 in a point-to-point, non-crossing manner; the four output ports of the first beamforming submodule 21 and the four output ports of the second beamforming submodule 22 are connected to the eight input ports of the third beamforming submodule 23 in a point-to-point, non-crossing manner.
[0058] Each phased array module 20 can continue to use a 16-channel to 4-channel beamforming chip 10 for beam combining, realizing a two-dimensional scalable complete phased array system. It can be understood that since the proposed beamforming chip 10 is bidirectional, the corresponding transmit / receive phased array can be realized simply by replacing the front end with a transmit / receive front end.
[0059] In one example, the crossover patch cord unit 101 may include layers M1 to M9 and an AP layer, and be arranged in a stacked manner in the order of layer M1 to M9 and then to AP layer. Its wiring method can be as follows: Figure 7 and Figure 8 As shown in the diagram, A1, A2, A3, A4, B1, B2, B3, and B4 represent different beams. The routing in this invention employs a grounded coplanar waveguide structure. The center conductor strip S and ground plane G of the grounded coplanar waveguide structure are composed of M9 layers, and the ground plane G is grounded through grounding wires composed of M1 to M8. At all routing intersections, the routing is connected to the AP layer and M8 layer via vias, and isolated in the middle by M9 layers, thus achieving high isolation at the intersections. In one example, by adding a top metal cover plate, this grounded coplanar waveguide can be modified into a stripline. Furthermore, this invention merges the ground planes of adjacent grounded coplanar waveguides, thereby achieving a dense routing arrangement while ensuring necessary grounding shielding.
[0060] The beamforming chip provided by the present invention is described below. The beamforming chip described below can be referred to in correspondence with the beamforming chip in the multi-beam phased array system based on the beamforming chip described above.
[0061] See Figure 9 , Figure 9This is a schematic diagram of a beamforming chip provided in an embodiment of the present invention. The beamforming chip 10 integrates a cross jumper unit 101 and a summing circuit unit 102. The cross jumper unit 101 is used to input signals from two designated input ports into the same summing circuit unit 102. The summing circuit unit 102 is used to sum the power of the input signals.
[0062] In one possible implementation, at least a portion of the traces in the crossover jumper unit 101 employ a grounded coplanar waveguide structure.
[0063] In one possible implementation, the traces of adjacent grounded coplanar waveguide structures share a common ground plane.
[0064] In one possible implementation, the summing circuit unit 102 includes a dual-frequency Wilkinson power combiner; when a first control signal is input to the control terminal of the dual-frequency Wilkinson power combiner, the dual-frequency Wilkinson power combiner operates in a first frequency band; when a second control signal is input to the control terminal of the dual-frequency Wilkinson power combiner, the dual-frequency Wilkinson power combiner operates in a second frequency band.
[0065] In one possible implementation, the dual-frequency Wilkinson power combiner includes: Resistor, first equivalent quarter-wavelength transmission line circuit, second equivalent quarter-wavelength transmission line circuit; The first end of the resistor is connected to the input end of the first equivalent quarter-wavelength transmission line circuit, the second end of the resistor is connected to the input end of the second equivalent quarter-wavelength transmission line circuit, and the output end of the first equivalent quarter-wavelength transmission line circuit is connected to the output end of the second equivalent quarter-wavelength transmission line circuit. The control terminal of the first equivalent quarter-wavelength transmission line circuit is connected to the control terminal of the dual-frequency Wilkinson power combiner; when the control terminal of the first equivalent quarter-wavelength transmission line circuit receives a first control signal, the first equivalent quarter-wavelength transmission line circuit operates in the first frequency band; when the control terminal of the first equivalent quarter-wavelength transmission line circuit receives a second control signal, the first equivalent quarter-wavelength transmission line circuit operates in the second frequency band. The control terminal of the second equivalent quarter-wavelength transmission line circuit is connected to the control terminal of the dual-frequency Wilkinson power combiner; when the control terminal of the second equivalent quarter-wavelength transmission line circuit receives a first control signal, the second equivalent quarter-wavelength transmission line circuit operates in the first frequency band; when the control terminal of the second equivalent quarter-wavelength transmission line circuit receives a second control signal, the second equivalent quarter-wavelength transmission line circuit operates in the second frequency band.
[0066] In one possible implementation, the control terminal of the dual-frequency Wilkinson power combiner includes a first control terminal and a second control terminal; the control terminal of the first equivalent quarter-wavelength transmission line circuit includes a third control terminal and a fourth control terminal; and the control terminal of the second equivalent quarter-wavelength transmission line circuit includes a fifth control terminal and a sixth control terminal. The first control terminal is connected to the third control terminal and the fifth control terminal, respectively, and the second control terminal is connected to the fourth control terminal and the sixth control terminal, respectively. When a high-level signal is input at the first control terminal and a low-level signal is input at the second control terminal, both the first equivalent quarter-wavelength transmission line circuit and the second equivalent quarter-wavelength transmission line circuit operate in the first frequency band. When a low-level signal is input to the first control terminal and a high-level signal is input to the second control terminal, both the first equivalent quarter-wavelength transmission line circuit and the second equivalent quarter-wavelength transmission line circuit operate in the second frequency band.
[0067] In one possible implementation, the first equivalent quarter-wavelength transmission line circuit includes: First switch, second switch, third switch, fourth switch, first inductor, second inductor, third inductor, fourth inductor, fifth inductor, first capacitor, second capacitor, third capacitor; The first terminal of the first inductor is connected to the first terminal of the resistor. The second terminal of the first inductor is connected to the first terminal of the second inductor and the first terminal of the first capacitor. The second terminal of the first capacitor is connected to the first terminal of the first switch, and the second terminal of the first switch is grounded. The second terminal of the second inductor is connected to the first terminal of the third inductor and the first terminal of the second capacitor. The second terminal of the second capacitor is connected to the first terminal of the second switch, and the second terminal of the second switch is grounded. The second terminal of the third inductor is connected to the first terminal of the fourth inductor and the first terminal of the third capacitor. The second terminal of the third capacitor is connected to the first terminal of the third switch, and the second terminal of the third switch is grounded. The second end of the fourth inductor is the output end of the first equivalent quarter-wavelength transmission line circuit; the first end of the fifth inductor is connected to the first end of the fourth switch, and the second end of the fifth inductor is connected to the second end of the fourth switch; the control end of the fourth switch is connected to the third control end; the control ends of the first switch, the second switch, and the third switch are all connected to the fourth control end.
[0068] In one possible implementation, the beamforming chip 10 includes a first beamforming submodule, a second beamforming submodule, and a third beamforming submodule; the first beamforming submodule, the second beamforming submodule, and the third beamforming submodule all include a cross jumper unit and a summing circuit unit; The eight input ports of the first synthesis submodule are connected to the eight beam interfaces of the two front-end chips in a point-to-point and non-intersecting manner; the eight input ports of the second synthesis submodule are connected to the eight beam interfaces of the other two front-end chips in a point-to-point and non-intersecting manner. The four output ports of the first synthesis submodule and the four output ports of the second synthesis submodule are connected to the eight input ports of the third synthesis submodule in a point-to-point and non-intersecting manner.
[0069] In one possible implementation, the beamforming chip 10 is fabricated using integrated circuit technology, including a 65nm complementary metal-oxide-semiconductor process and wafer-level chip-scale packaging.
[0070] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims
1. A multi-beam phased array system based on a beamforming chip, characterized in that, include: Beamforming chip and multiple front-end chips; Each beam interface of the front-end chip is connected to the input port of the beamforming chip in a point-to-point and non-intersecting manner. The beamforming chip integrates a cross jumper unit and a summing circuit unit; the cross jumper unit is used to input signals from two designated input ports into the same summing circuit unit; The summing circuit unit is used to sum the power of the input signal.
2. The system according to claim 1, characterized in that, The system also includes a printed circuit board, through which the beamforming chip and the front-end chip are connected; The portion of the printed circuit board used to connect the beamforming chip and the front-end chip adopts a point-to-point, non-intersecting radio frequency trace structure.
3. The system according to claim 1, characterized in that, At least some of the traces in the cross jumper unit adopt a grounded coplanar waveguide structure, and the traces of adjacent grounded coplanar waveguide structures share a ground plane.
4. The system according to claim 1, characterized in that, The summing circuit unit includes a dual-frequency Wilkinson power combiner; when a first control signal is input to the control terminal of the dual-frequency Wilkinson power combiner, the dual-frequency Wilkinson power combiner operates in a first frequency band; when a second control signal is input to the control terminal of the dual-frequency Wilkinson power combiner, the dual-frequency Wilkinson power combiner operates in a second frequency band.
5. The system according to claim 4, characterized in that, The dual-frequency Wilkinson power combiner includes: Resistor, first equivalent quarter-wavelength transmission line circuit, second equivalent quarter-wavelength transmission line circuit; The first end of the resistor is connected to the input end of the first equivalent quarter-wavelength transmission line circuit, the second end of the resistor is connected to the input end of the second equivalent quarter-wavelength transmission line circuit, and the output end of the first equivalent quarter-wavelength transmission line circuit is connected to the output end of the second equivalent quarter-wavelength transmission line circuit. The control terminal of the first equivalent quarter-wavelength transmission line circuit is connected to the control terminal of the dual-frequency Wilkinson power combiner; when the control terminal of the first equivalent quarter-wavelength transmission line circuit receives a first control signal, the first equivalent quarter-wavelength transmission line circuit operates in the first frequency band; when the control terminal of the first equivalent quarter-wavelength transmission line circuit receives a second control signal, the first equivalent quarter-wavelength transmission line circuit operates in the second frequency band. The control terminal of the second equivalent quarter-wavelength transmission line circuit is connected to the control terminal of the dual-frequency Wilkinson power combiner; when the control terminal of the second equivalent quarter-wavelength transmission line circuit receives a first control signal, the second equivalent quarter-wavelength transmission line circuit operates in the first frequency band; when the control terminal of the second equivalent quarter-wavelength transmission line circuit receives a second control signal, the second equivalent quarter-wavelength transmission line circuit operates in the second frequency band.
6. The system according to claim 5, characterized in that, The control terminals of the dual-frequency Wilkinson power combiner include a first control terminal and a second control terminal; the control terminals of the first equivalent quarter-wavelength transmission line circuit include a third control terminal and a fourth control terminal; and the control terminals of the second equivalent quarter-wavelength transmission line circuit include a fifth control terminal and a sixth control terminal. The first control terminal is connected to the third control terminal and the fifth control terminal, respectively, and the second control terminal is connected to the fourth control terminal and the sixth control terminal, respectively. When a high-level signal is input at the first control terminal and a low-level signal is input at the second control terminal, both the first equivalent quarter-wavelength transmission line circuit and the second equivalent quarter-wavelength transmission line circuit operate in the first frequency band. When a low-level signal is input to the first control terminal and a high-level signal is input to the second control terminal, both the first equivalent quarter-wavelength transmission line circuit and the second equivalent quarter-wavelength transmission line circuit operate in the second frequency band.
7. The system according to claim 6, characterized in that, The first equivalent quarter-wavelength transmission line circuit includes: First switch, second switch, third switch, fourth switch, first inductor, second inductor, third inductor, fourth inductor, fifth inductor, first capacitor, second capacitor, third capacitor; The first terminal of the first inductor is connected to the first terminal of the resistor. The second terminal of the first inductor is connected to the first terminal of the second inductor and the first terminal of the first capacitor. The second terminal of the first capacitor is connected to the first terminal of the first switch, and the second terminal of the first switch is grounded. The second terminal of the second inductor is connected to the first terminal of the third inductor and the first terminal of the second capacitor. The second terminal of the second capacitor is connected to the first terminal of the second switch, and the second terminal of the second switch is grounded. The second terminal of the third inductor is connected to the first terminal of the fourth inductor and the first terminal of the third capacitor. The second terminal of the third capacitor is connected to the first terminal of the third switch, and the second terminal of the third switch is grounded. The second end of the fourth inductor is the output end of the first equivalent quarter-wavelength transmission line circuit; the first end of the fifth inductor is connected to the first end of the fourth switch, and the second end of the fifth inductor is connected to the second end of the fourth switch; the control end of the fourth switch is connected to the third control end; the control ends of the first switch, the second switch, and the third switch are all connected to the fourth control end.
8. The system according to claim 1, characterized in that, The system includes at least one phased array module, which includes one beamforming chip and four front-end chips. The front-end chip is a four-antenna, four-beam front-end chip. The beamforming chip includes a first combining submodule, a second combining submodule, and a third combining submodule. The first combining submodule, the second combining submodule, and the third combining submodule all include a cross jumper unit and a summing circuit unit. Two of the four front-end chips have their eight beam interfaces connected to the eight input ports of the first synthesis submodule in a point-to-point, non-intersecting manner; the other two of the four front-end chips have their eight beam interfaces connected to the eight input ports of the second synthesis submodule in a point-to-point, non-intersecting manner. The four output ports of the first synthesis submodule and the four output ports of the second synthesis submodule are connected to the eight input ports of the third synthesis submodule in a point-to-point and non-intersecting manner.
9. The system according to claim 1, characterized in that, Both the beamforming chip and the front-end chip are fabricated using integrated circuit technology, which includes a 65nm complementary metal-oxide-semiconductor process and wafer-level chip-scale packaging.
10. A beamforming chip, characterized in that, The beamforming chip integrates a cross jumper unit and a summing circuit unit. The crossover jumper unit is used to input signals from two designated input ports into the same summing circuit unit; The summing circuit unit is used to sum the power of the input signal.