Circuit board and contact arrangement
By adjusting the position of the contact group, the differential signal contacts and general signal contacts are arranged in a virtual parallelogram or trapezoid, which solves the problem of insufficient signal transmission quality and achieves better signal isolation and transmission effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- VIA TECH INC
- Filing Date
- 2026-05-28
- Publication Date
- 2026-07-31
AI Technical Summary
In existing technologies, signal transmission quality is insufficient in the arrangement of contacts in the semiconductor packaging field, especially in the connection of pad arrays, ball arrays and pin arrays, making it difficult to effectively improve signal transmission quality.
By adjusting the arrangement of contacts, especially the position of contact groups, differential signal contacts and general signal contacts can form a virtual parallelogram or trapezoidal arrangement, and grounding contacts can be shared among contact groups to improve signal isolation.
It improved signal transmission quality, with eye height and eye width increasing by 33% and 52% respectively, thus improving signal transmission performance.
Smart Images
Figure CN122496983A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a contact arrangement, and more particularly to a contact arrangement and a circuit board employing the aforementioned contact arrangement. Background Technology
[0002] In the semiconductor packaging field, Land Grid Array (LGA), Ball Grid Array (BGA), and Pin Grid Array (PGA) are common types used to connect package substrates to printed circuit boards (PCBs). LGA utilizes multiple planar pads on the bottom of the package substrate to directly engage with multiple planar pads on the PCB or to press against multiple pins on the PCB's connector. BGA uses an array of solder balls as the connection medium; the solder balls can be melted through a reflow process to firmly bond the package substrate to the PCB. PGA uses multiple pins on the bottom of the package substrate to insert into a connector on the PCB to complete the circuit connection. Summary of the Invention
[0003] This invention provides a circuit board with a specific contact arrangement to improve signal transmission quality.
[0004] This invention provides a contact arrangement to improve signal transmission quality.
[0005] The circuit board of the present invention has a connection surface, a contact area located on the connection surface, and a contact arrangement arranged in the contact area. The contact arrangement includes a plurality of contacts. These contacts are arranged in an array in the contact area. A plurality of these contacts form a plurality of contact groups, at least one of these contact groups including a pair of first differential signal contacts, a pair of second differential signal contacts, and eight general signal contacts. The pair of first differential signal contacts, the pair of second differential signal contacts, and the eight general signal contacts are arranged in a first horizontal row, a second horizontal row, and a third horizontal row arranged side by side to form an imaginary parallelogram. The contacts in the first horizontal row are, in sequence, a first general signal contact and a second general signal contact, one of the pair of first differential signal contacts, and a third general signal contact. The contacts in the second row are, in order, the fourth general signal contact, the other of the first differential signal contact pair, one of the second differential signal contacts pair, and the fifth general signal contact. The contacts in the third row are, in order, the sixth general signal contact, the other of the second differential signal contact pair, and the seventh and eighth general signal contacts.
[0006] The contact arrangement of the present invention includes a plurality of contacts. These contacts are arranged in an array in a contact region. A plurality of these contacts form a plurality of contact groups, at least one of these contact groups including a pair of first differential signal contacts, a pair of second differential signal contacts, and eight general signal contacts. The pair of first differential signal contacts, the pair of second differential signal contacts, and the eight general signal contacts are arranged in a first horizontal row, a second horizontal row, and a third horizontal row arranged side-by-side to form an imaginary parallelogram. The contacts in the first horizontal row are, in sequence, a first general signal contact, a second general signal contact, one of the pair of first differential signal contacts, and a third general signal contact. The contacts in the second horizontal row are, in sequence, a fourth general signal contact, the other of the pair of first differential signal contacts, one of the pair of second differential signal contacts, and a fifth general signal contact. The contacts in the third row are, in order, the sixth general signal contact, the other of the pair of second differential signal contacts, and the seventh and eighth general signal contacts.
[0007] Based on the above, in this invention, by adjusting the pad positions of two adjacent contact groups in the contact arrangement, the signal transmission quality of these contact groups can be improved. Attached Figure Description
[0008] Figures 1A to 1C The package types of LGA, BGA and PGA are shown respectively.
[0009] Figure 2 This is one embodiment of the contact arrangement of the present invention.
[0010] Figure 3 yes Figure 2 A magnified view of a portion of region E showing the arrangement of its contact points.
[0011] Figure 4 yes Figure 2 A partially enlarged view of a contact arrangement in another embodiment of the contact arrangement of region E.
[0012] Figure 5 yes Figure 2 A partially enlarged view of a contact arrangement in another embodiment of the contact arrangement of region E.
[0013] Figure 6 yes Figure 2 A partially enlarged view of one embodiment of the contact arrangement of region E'.
[0014] Figure 7 yes Figure 2 A partially enlarged view of a contact arrangement in another embodiment of the E' region of the contact arrangement.
[0015] Figure 8 yes Figure 2 A partially enlarged view of a contact arrangement in another embodiment of the contact arrangement of region E.
[0016] Figure 9 yes Figure 2 A partially enlarged view of a contact arrangement in another embodiment of the contact arrangement of region E.
[0017] Figure 10 yes Figure 2 A partially enlarged view of a contact arrangement in another embodiment of the E' region of the contact arrangement.
[0018] Figure 11 yes Figure 2 A partially enlarged view of a contact arrangement in another embodiment of the E' region of the contact arrangement.
[0019] [Symbol Explanation]
[0020] 10: Electronic Assembly
[0021] 11: Chip
[0022] 11a: Active side
[0023] 11b: Chip pad
[0024] 12: Packaging substrate
[0025] 12a: First substrate connection surface
[0026] 12b: First substrate pad
[0027] 12c: Second substrate connection surface
[0028] 12d: Second substrate pad
[0029] 13: Printed Circuit Board
[0030] 13a: Circuit board connection surface
[0031] 13b: Circuit board pads
[0032] 14: Conductive bumps
[0033] 15: Conductive sphere
[0034] 16: Conductive pins
[0035] 17: Socket Connector
[0036] 100: Node Arrangement
[0037] 100a: Contact
[0038] 110: Contact Group
[0039] 111a, 111b: First differential signal contacts
[0040] 112a, 112b: Second differential signal contacts
[0041] 113: General signal contact
[0042] 114: Grounding contact
[0043] 115S: General signal contact
[0044] 115G: Grounding contact
[0045] 116S: General signal contact
[0046] 116G: Grounding contact
[0047] 117S: General signal contact
[0048] 117G: Grounding Contact
[0049] 118S: General signal contact
[0050] 119G: Grounding contact
[0051] A1~A7: Double arrows
[0052] C1~C12: Straight line
[0053] L: oblique line
[0054] R0~R4: Horizontal row
[0055] SD1: Side
[0056] SD2: Side
[0057] T: Contact area
[0058] T1: First contact area
[0059] T2: Second contact area Detailed Implementation
[0060] Please refer to Figure 1AThe diagram illustrates an electronic assembly 10 using an LGA package, comprising a chip 11, a package substrate 12, and a printed circuit board 13. The chip 11 is mounted on the package substrate 12. The package substrate 12 has a first substrate connection surface 12a and a plurality of first substrate pads 12b. These first substrate pads 12b are located on the first substrate connection surface 12a. The printed circuit board 13 has a circuit board connection surface 13a and a plurality of circuit board pads 13b. These circuit board pads 13b are located on the circuit board connection surface 13a. The first substrate pads 12b are directly bonded to the circuit board pads 13b. When the chip 11 is mounted on the package substrate 12 using flip-chip bonding, the electronic assembly 10 may have a plurality of conductive bumps 14. The chip 11 may have an active surface 11a and a plurality of chip pads 11b. The package substrate 12 may have a second substrate connection surface 12c and a plurality of second substrate pads 12d. The second substrate connection surface 12c is opposite to the first substrate connection surface 12a. These second substrate pads 12d are located on the second substrate connection surface 12c. These conductive bumps 14 are located between these second substrate pads 12d and these chip pads 11b, respectively.
[0061] Please refer to Figure 1B The diagram illustrates an electronic assembly 10 using a BGA package, comprising a chip 11, a package substrate 12, a printed circuit board 13, and a plurality of conductive balls 15. The chip 11 is mounted on the package substrate 12. Furthermore, the package substrate 12 has a first substrate connection surface 12a and a plurality of first substrate pads 12b. These first substrate pads 12b are located on the first substrate connection surface 12a. The printed circuit board 13 has a circuit board connection surface 13a and a plurality of circuit board pads 13b. These circuit board pads 13b are located on the circuit board connection surface 13a. The conductive balls 15 are respectively located between these first substrate pads 12b and these circuit board pads 13b. When the chip 11 is mounted on the package substrate 12 using flip-chip bonding, the electronic assembly 10 may have a plurality of conductive bumps 14. The chip 11 may have an active surface 11a and a plurality of chip pads 11b. The package substrate 12 may have a second substrate connection surface 12c and a plurality of second substrate pads 12d. The second substrate connection surface 12c is opposite to the first substrate connection surface 12a. The second substrate pads 12d are located on the second substrate connection surface 12c. The conductive bumps 14 are located between the second substrate pads 12d and the chip pads 11b, respectively, to mount the chip 11 on the package substrate 12.
[0062] Please refer to Figure 1CThe illustration depicts an electronic assembly 10 employing a PGA package, comprising a chip 11, a package substrate 12, a printed circuit board 13, a plurality of conductive pins 16, and a receptacle connector 17. The chip 11 is mounted on the package substrate 12. Furthermore, the package substrate 12 has a first substrate connection surface 12a and a plurality of first substrate pads 12b. These first substrate pads 12b are located on the first substrate connection surface 12a. The printed circuit board 13 has a circuit board connection surface 13a and a plurality of circuit board pads 13b. These circuit board pads 13b are located on the circuit board connection surface 13a. The conductive pins 16 are respectively connected to these first substrate pads 12b. The receptacle connector 17 is mounted on the circuit board connection surface 13a and electrically connected to these circuit board pads 13b, allowing the conductive pins 16 to be inserted thereon. When the chip 11 is mounted on the package substrate 12 using a flip-chip bonding method, the electronic assembly 10 may have a plurality of conductive bumps 14. Chip 11 may have an active surface 11a and a plurality of chip pads 11b. Package substrate 12 may have a second substrate connection surface 12c and a plurality of second substrate pads 12d. The second substrate connection surface 12c is opposite to the first substrate connection surface 12a. The second substrate pads 12d are located on the second substrate connection surface 12c. Conductive bumps 14 are respectively located between the second substrate pads 12d and the chip pads 11b to mount the chip 11 onto the package substrate 12.
[0063] Please refer to Figure 2 In this embodiment, the contact arrangement 100 includes a plurality of contacts 100a, which are arranged in a surface array in a contact region T. These contacts can be Figures 1A to 1C The chip pads 11b of chip 11, the conductive bumps 14, the second substrate pads 12d of package substrate 12, the first substrate pads 12b of package substrate 12, the conductive balls 15, the conductive pins 16, or the circuit board pads 13b of printed circuit board 13. The contact area T is, for example, Figures 1A to 1C The first contact area T1 or the second contact area T2. Furthermore, the contact arrangement 100 can be applied to circuit boards, such as... Figures 1A to 1C The packaging substrate 12 or printed circuit board 13.
[0064] Please refer to Figure 2 and Figure 3 , Figure 3 yes Figure 2A partial enlarged view of area E of the contact arrangement. In this embodiment, multiple contacts of contact arrangement 100 form multiple contact groups 110. Each of these contact groups 110 includes a pair of first differential signal contacts 111a and 111b, a pair of second differential signal contacts 112a and 112b, and eight general signal contacts 113. These 12 signal contacts serve as one byte of a DDR memory channel. The first differential signal contacts 111a and 111b are, for example, labeled D1+ and D1-, and the second differential signal contacts 112a and 112b are, for example, labeled D2+ and D2. The first differential signal contacts 111a and 111b, and the second differential signal contacts 112a and 112b can be clock differential signals or data strobe signals. Furthermore, the positions of the first differential signal contacts D1+ and D1-, and the second differential signal contacts D2+ and D2- in the diagram are merely examples and are not intended to limit this embodiment. Additionally, the eight general signal contacts 113, for example labeled S, can be non-differential general signals such as data signals, control signals, and address signals. Multiple bytes can exist within the same memory channel, i.e., multiple contact groups 110 are arranged adjacently. Each of these contact groups 110 also includes a pair of first differential signal contacts 111a and 111b, a pair of second differential signal contacts 112a and 112b, and eight general signal contacts 113. Adjacent contact groups 110 share a ground contact.
[0065] exist Figure 3 In this embodiment, the pair of first differential signal contacts 111a and 111b are arranged sequentially in a straight line C3 on one side SD1 perpendicular to the contact area T. The pair of second differential signal contacts 112a and 112b are arranged sequentially in another straight line C4 perpendicular to the side SD1 of the contact area T. The straight line C3 containing the pair of first differential signal contacts 111a and 111b is parallel to the straight line C4 containing the pair of second differential signal contacts 112a and 112b, and one of the pair of first differential signal contacts 111a and 111b is adjacent to (parallel to) one of the pair of second differential signal contacts 112a and 112b. The eight general signal contacts 113 are divided into two groups and arranged equally on opposite sides of the pair of first differential signal contacts 111a and 111b and the pair of second differential signal contacts 112a and 112b. Specifically, the first differential signal contacts 111a and 111b, the second differential signal contacts 112a and 112b, and these eight general signal contacts 113 can form a 3x4 array (i.e., horizontal rows R1~R3 and vertical rows C2~C5) arranged on the side SD1 of the contact area T. Figure 3In the diagram, the horizontal rows R1~R4 are parallel to the X-axis, while the vertical rows C1~C6 are parallel to the Y-axis. The horizontal row R1 is adjacent to the side SD1, and the vertical row C1 is adjacent to the side SD2. The extension directions of the side SD1 and the side SD2 are not parallel to each other.
[0066] exist Figure 3 In the same contact group 110 of the contact arrangement 100 of the embodiment, the contact group 110 may further include twelve ground contacts 114, which are arranged outside the pair of first differential signal contacts 111a, 111b, the pair of second differential signal contacts 112a, 112b, and the eight general signal contacts 113. Alternatively, the twelve ground contacts 114 are arranged on three sides of the 3x4 array, with the fourth side of the 3x4 array adjacent to side SD1. The pair of first differential signal contacts 111a, 111b, the pair of second differential signal contacts 112a, 112b, the eight general signal contacts 113, and the twelve ground contacts 114 can form a 4x6 array (i.e., horizontal rows R1~R4 and vertical rows C1~C6) arranged on side SD1 of the contact region T. When there are multiple contact groups 110, these contact groups 110 are arranged on one side SD1 of the contact area T, and two adjacent contact groups 110 share four of the twelve grounding contacts 114. These four shared grounding contacts 114 are arranged in a straight line, for example, in a straight line C6.
[0067] It is worth noting that the 3x4 array only has three side grounding contacts 114, while the adjacent horizontal row R1 has no horizontal grounding contacts to provide isolation. Furthermore, with Figure 3 Taking byte B2 as an example, the general signal contact 115S, located at the intersection of horizontal row R3 and vertical row C7, and the general signal contact 116S, located at the intersection of horizontal row R1 and vertical row C10, are not surrounded by differential signal contacts. Although they have ground contact G for isolation, compared to other general signal contacts 113 which are surrounded by differential signal contacts for isolation, general signal contacts 115 and 116 lack differential signal contacts for isolation, thus affecting signal quality. Therefore, this embodiment proposes... Figure 4 The arrangement.
[0068] Please refer to Figure 4 ,by Figure 3 Taking byte B2 as an example, in Figure 4 In the middle, Figure 3 The general signal contact 115S, located at the intersection of horizontal row R3 and vertical row C7, and the ground contact 115G, located at the intersection of horizontal row R1 and vertical row C6, are interchanged. Figure 4 As shown by the double arrow A1 in the diagram. Furthermore, in Figure 4 In the middle, Figure 3The general signal contact 116S, located at the intersection of horizontal row R1 and vertical row C10, and the ground contact 116G, located at the intersection of horizontal row R3 and vertical row C11, are interchanged. Figure 4 As shown by the double arrow A2. For byte B1 that has one side adjacent to SD2, only the position of one general signal contact that is not adjacent to SD2 is adjusted. Figure 3 The general signal contact 117S, located at the intersection of horizontal row R1 and vertical row C5, and the ground contact 117G, located at the intersection of horizontal row R3 and vertical row C6, are interchanged. Figure 4 As shown by the double arrow A3. The above arrangement ensures that every general signal has isolation differential signal contacts and ground contacts to provide isolation. Although only one side of byte B1 can be swapped, compared to Figure 3 The position of the intermediate signal contact has not been adjusted. Figure 4 The transmission quality of byte B1 can still be improved. In addition, the aforementioned grounding contacts 115G, 116G, and 117G used to exchange positions are all part of the grounding contacts shared by adjacent two bytes.
[0069] by Figure 4 Taking byte B2 as an example, the contacts arranged in the X direction on row R1 are two general signal contacts 113, one of the first differential signal contacts 111a and 111b, and one general signal contact 113; the contacts on row R2 are one general signal contact 113, the other of the first differential signal contacts 111a and 111b, one of the second differential signal contacts 112a and 112b, and one general signal contact 113; the contacts on row R3 are one general signal contact 113, the other of the second differential signal contacts 112a and 112b, and two general signal contacts 113. The contacts on the three rows R1~R3 are arranged to form a 3x4 imaginary parallelogram, and the contacts on each row are shifted one unit in the X direction (i.e., the distance between two adjacent contacts), without completely overlapping. In other words, the aforementioned byte is arranged in a fictitious parallelogram to ensure good isolation and transmission quality for each general signal. In other embodiments, the contacts on each row of byte B2 may be shifted one unit in the opposite direction of the X direction (i.e., the distance between two adjacent contacts), without completely overlapping. Furthermore, for byte B1, since only one side of the general signal is adjusted, the contacts on rows R1~R3 can be arranged in a fictitious trapezoid, with each row also not completely overlapping.
[0070] Please refer to Figure 4 ,exist Figure 4In the same contact group 110 of the contact arrangement 100 of the embodiment, the contact group 110 may further include twelve ground contacts 114, which are arranged outside the pair of first differential signal contacts 111a, 111b, the pair of second differential signal contacts 112a, 112b, and the eight general signal contacts 113. Taking byte B2 as an example, these twelve ground contacts 114 are arranged on three sides of a 3x4 parallelogram, while the fourth side of the 3x4 parallelogram is adjacent to side SD1 and no ground contact 114 is configured. When there are multiple contact groups 110, these contact groups 110 are arranged adjacently on side SD1 of the contact area T, and two adjacent contact groups 110 will share three of the twelve ground contacts 114. These four shared ground contacts 114 are arranged in a diagonal straight line L. Furthermore, for byte B1, the fourteen grounding contacts 114 are arranged on three sides of the trapezoid, while the fourth side of the trapezoid, which is adjacent to side SD1, is not configured with grounding contacts 114.
[0071] Furthermore, computer simulations using DDR memory mode revealed that, compared to Figure 3 Compared to the contact arrangement 100 in the embodiment, since Figure 4 Most general signal contacts S have a ground contact G and a differential signal contact D for isolation, so Figure 4 The contact arrangement 100 of the embodiment has better signal transmission quality. In eye height (EH (mV)), it increases from 63mV to 84mV, an increase of approximately 33%, while in eye width (EW (ps)), it increases from 27.0ps to 41.1ps, an increase of approximately 52%.
[0072] Compared to Figure 3 This embodiment further proposes as follows: Figure 5 The arrangement method. Please refer to... Figure 5 ,by Figure 3 Taking byte B2 as an example, in Figure 5 In the middle, Figure 3 The general signal contact 115S, located at the intersection of horizontal R3 and vertical C7, and the ground contact 115G, located at the intersection of horizontal R3 and vertical C6, are interchanged. Figure 5 The double arrow A4 is shown in the diagram. Furthermore, in... Figure 5 In the middle, Figure 3 The general signal contact 118S, located at the intersection of horizontal row R3 and vertical row C12, and the ground contact 116G, located at the intersection of horizontal row R3 and vertical row C11, are interchanged. Figure 5 As shown by the double arrow A5. Figure 5 In the middle, Figure 3 The general signal contact 116S, located at the intersection of horizontal row R1 and vertical row C10, and the ground contact 119G, located at the intersection of horizontal row R1 and vertical row C11, are interchanged. Figure 5As shown by the double arrow A7. For byte B1 that has one side adjacent to SD2, only the position of a general signal contact that is not adjacent to SD2 is adjusted. Figure 3 The general signal contact 117S, located at the intersection of horizontal row R1 and vertical row C5, and the ground contact 115G, located at the intersection of horizontal row R1 and vertical row C6, are interchanged. Figure 5 As shown by the double arrow A6. The above arrangement ensures that every general signal has isolation differential signal contacts and ground contacts to provide isolation. Although only one side of byte B1 can be swapped, compared to Figure 3 Transmission quality can still be improved. In addition, the aforementioned grounding contacts 115G, 116G, and 117G used to exchange positions are all part of the grounding contacts shared by adjacent two bytes.
[0073] by Figure 5 Taking byte B2 as an example, the contacts arranged in the X direction on row R1 are two general signal contacts 113, one of the first differential signal contacts 111a and 111b, and one general signal contact 113. The contacts on row R2 are one general signal contact 113, the other of the first differential signal contacts 111a and 111b, one of the second differential signal contacts 112a and 112b, and one general signal contact 113. The contacts on row R3 are one general signal contact 113, the other of the second differential signal contacts 112a and 112b, and two general signal contacts 113. The contacts on the three rows R1 to R3 are arranged into a 3x4 imaginary parallelogram, and the contacts on each row are shifted one unit in the X direction (i.e., the distance between two adjacent contacts), without completely overlapping. In other words, the aforementioned byte is arranged in a fictitious parallelogram to ensure good isolation and transmission quality for each general signal. In other embodiments, the contacts on each row of byte B2 may be shifted one unit in the opposite direction of the X direction (i.e., the distance between two adjacent contacts), without completely overlapping. Furthermore, for byte B1, since only one side of the general signal is adjusted, the contacts on rows R1~R3 can be arranged in a fictitious trapezoid, with each row also not completely overlapping.
[0074] Please refer to Figure 5 ,exist Figure 5In the same contact group 110 of the contact arrangement 100 of the embodiment, the contact group 110 may further include twelve ground contacts 114, which are arranged outside the pair of first differential signal contacts 111a, 111b, the pair of second differential signal contacts 112a, 112b, and the eight general signal contacts 113. Taking byte B2 as an example, these twelve ground contacts 114 are arranged on three sides of a 3x4 parallelogram, while the fourth side of the 3x4 parallelogram is adjacent to side SD1 and no ground contact 114 is configured. When there are multiple contact groups 110, these contact groups 110 are arranged adjacently on side SD1 of the contact area T, and two adjacent contact groups 110 will share three of the twelve ground contacts 114. These four shared ground contacts 114 are arranged in a diagonal straight line L. Furthermore, for byte B1, the fourteen grounding contacts 114 are arranged on three sides of the trapezoid, while the fourth side of the trapezoid, which is adjacent to side SD1, is not configured with grounding contacts 114.
[0075] Please refer to Figure 6 and Figure 7 Compared to Figure 4 and Figure 5 In the embodiments, Figure 6 and Figure 7 In the contact arrangement 100 of the embodiment, these contact groups 110 can be along Figure 2 The other side SD2 of the contact area T (e.g., area E' on the left side of contact area T) is used for arrangement. Similarly, for these bytes, the contacts adjacent to side SD2 (ground contacts, general signal contacts, differential signal contacts) do not have a ground contact 114 configured between them and side SD2, so they still need to be... Figure 4 and Figure 5 The implementation adjusts the positions of the general signal contact and the ground signal contact.
[0076] Please refer to Figure 8 and Figure 9 Compared to Figure 4 and Figure 5 Implementation examples, Figure 8 and Figure 9 In the contact arrangement 100 of the embodiment, several of these ground contacts 114 are further arranged in a horizontal row R0 within the same contact group 110. In other words, these ground contacts 114 are arranged around the pair of first differential signal contacts 111a, 111b, the pair of second differential signal contacts 112a, 112b, and the eight general signal contacts 113, thereby providing better isolation for the general signal contacts 113.
[0077] Please refer to Figure 10 and Figure 11 Compared to Figure 8 and Figure 9 In the embodiments, Figure 10 and Figure 11 In the contact arrangement 100 of the embodiment, these contact groups 110 can be along Figure 2 The other side SD2 of the contact area T (e.g., the left side of the contact area T) is arranged to provide better isolation for the general signal contact 113.
[0078] In summary, in this invention, the signal transmission quality of these contact groups can be improved by adjusting the pad positions of two adjacent contact groups in the contact arrangement.
Claims
1. A circuit board having a connection surface, a contact area located on the connection surface, and a contact arrangement arranged in the contact area, wherein the contact arrangement includes: Multiple contacts are arranged in a surface array in the contact area. Multiple contacts form multiple contact groups. At least one contact group includes a pair of first differential signal contacts, a pair of second differential signal contacts, and eight general signal contacts. The pair of first differential signal contacts, the pair of second differential signal contacts, and the eight general signal contacts are arranged in a first, second, and third horizontal row, forming an imaginary parallelogram. The contacts in the first horizontal row are, in sequence, the first general signal contact and the second general signal contact, one of the first differential signal contacts, and the third general signal contact. The contacts in the second horizontal row are, in sequence, the fourth general signal contact, the other of the first differential signal contacts, one of the second differential signal contacts, and the fifth general signal contact. The contacts in the third horizontal row are, in sequence, the sixth general signal contact, the other of the second differential signal contacts, and the seventh and eighth general signal contacts.
2. The circuit board of claim 1, wherein the contact area includes a first side and a second side, the first extending direction of the first side is not parallel to the second extending direction of the second side, the first row of the at least one contact group is adjacent to the first side, and there are no other contact configurations between the first row and the first side.
3. The circuit board of claim 2, wherein the contacts on each of the rows are shifted one unit in the first extending direction so that each of the rows does not completely overlap.
4. The circuit board as claimed in claim 2, wherein the at least one contact group further includes a plurality of grounding contacts, the grounding contacts being arranged outside the pair of first differential signal contacts, the pair of second differential signal contacts and the eight general signal contacts.
5. The circuit board of claim 2, wherein when the at least one contact group is located on the first side and the second side of the contact area, the first general signal contact of the first horizontal row is configured on the other side of the sixth general signal contact of the third horizontal row, such that the pair of first differential signal contacts, the pair of second differential signal contacts and the eight general signal contacts are arranged in an imaginary trapezoid.
6. The circuit board of claim 2, wherein the contacts are arranged parallel to the first extension direction.
7. The circuit board of claim 2, wherein the contacts are arranged parallel to the second extension direction.
8. The circuit board of claim 1, wherein the contact area includes a first side and a second side, the first extension direction of the first side is not parallel to the second extension direction of the second side, the at least one contact group further includes a fourth horizontal row, the fourth horizontal row including a plurality of grounding contacts, the grounding contacts being arranged between the first horizontal row and the first side.
9. The circuit board as claimed in claim 1, wherein the pair of first differential signal contacts, the pair of second differential signal contacts, and the eight general signal contacts constitute a byte of a memory channel.
10. The circuit board of claim 1, wherein the circuit board is a packaging substrate, the connection surface is a first substrate connection surface, the contact area is a first contact area, and is adapted to be mounted to a printed circuit board via the contact arrangement of the first contact area of the first substrate connection surface.
11. The circuit board of claim 10, wherein the circuit board further has a second substrate connection surface relative to the first substrate connection surface, and is adapted to mount a chip via the second substrate connection surface.
12. The circuit board of claim 1, wherein the circuit board is a printed circuit board, the connection surface is a circuit board connection surface, the contact area is a first contact area, and the contact arrangement of the first contact area of the circuit board connection surface is adapted to be electrically connected to each other by direct bonding with a plurality of first substrate pads of the packaging substrate.
13. A contact arrangement, comprising: Multiple contacts are arranged in a surface array in a contact area, wherein multiple contacts form multiple contact groups, and at least one of the contact groups includes a pair of first differential signal contacts, a pair of second differential signal contacts, and eight general signal contacts. The pair of first differential signal contacts, the pair of second differential signal contacts, and the eight general signal contacts are arranged in a first, second, and third horizontal row, arranged side-by-side, forming an imaginary parallelogram. The contacts in the first horizontal row are, in sequence, the first general signal contact and the second general signal contact, one of the first differential signal contacts, and the third general signal contact. The contacts in the second horizontal row are, in sequence, the fourth general signal contact, the other of the first differential signal contacts, one of the second differential signal contacts, and the fifth general signal contact. The contacts in the third horizontal row are, in sequence, the sixth general signal contact, the other of the second differential signal contacts, and the seventh and eighth general signal contacts.
14. The contact arrangement of claim 13, wherein the contact area includes a first side and a second side, the first extension direction of the first side is not parallel to the second extension direction of the second side, the first row of the at least one contact group is adjacent to the first side, and there are no other contact configurations between the first row and the first side.
15. The contact arrangement of claim 14, wherein the contacts on each of the rows are shifted one unit in the first extending direction such that each of the rows does not completely overlap.
16. The contact arrangement of claim 14, wherein the at least one contact group further includes a plurality of grounding contacts arranged outside the pair of first differential signal contacts, the pair of second differential signal contacts, and the eight general signal contacts.
17. The contact arrangement of claim 14, wherein when the at least one contact group is located on the first side and the second side of the contact area, the first general signal contact of the first row is arranged on the other side of the sixth general signal contact of the third row, such that the pair of first differential signal contacts, the pair of second differential signal contacts and the eight general signal contacts are arranged in an imaginary trapezoid.
18. The contact arrangement of claim 14, wherein the contact arrangement is configured parallel to the first extension direction and the contact arrangement is configured parallel to the second extension direction.
19. The contact arrangement of claim 13, wherein the contact area includes a first side and a second side, the first extension direction of the first side is not parallel to the second extension direction of the second side, the at least one contact group further includes a fourth horizontal row, the fourth horizontal row including a plurality of grounding contacts, the grounding contacts being arranged between the first horizontal row and the first side.
20. The contact arrangement as described in claim 13, wherein the pair of first differential signal contacts, the pair of second differential signal contacts, and the eight general signal contacts constitute a byte of a memory channel.