Chip on film, display module and electronic device

Abstract

This disclosure provides a flip-chip film, a display module, and an electronic device, belonging to the field of display technology. The flip-chip film includes a flexible substrate and a plurality of first bonding pads disposed on the flexible substrate. The flip-chip film is divided into a working area and a bonding area disposed on at least one side of the working area, with the first bonding pads disposed within the bonding area. Each first bonding pad includes a first end and a second end disposed opposite to each other along its extending direction, the second end being closer to the working area than the first end. The distance between the second end of at least two adjacent first bonding pads and the working area is greater than the distance between the first end of the other first bonding pad and the working area.

Description

Technical Field

[0001] This disclosure belongs to the field of display technology, specifically relating to a flip-chip film, a display module, and an electronic device. Background Technology

[0002] In the display field, chip-on-film (COF) is a technology that directly packages a driver chip onto a flexible circuit board. After bonding the COF film to the display substrate, the driver chip can provide drive signals to the display substrate and drive it to display. Typically, for large-size display substrates, multiple COF films are needed to meet the electrical signal requirements. However, for large-size display substrates, to achieve high resolution, the pad density inside both the display substrate and the COF film increases exponentially. Under these conditions, the COF film and the display substrate are susceptible to water and oxygen corrosion during long-term use, leading to corrosion between the pads and causing dark line defects.

[0003] Furthermore, with the increase in pad density, the bonding accuracy requirements for the flip-chip film and the display substrate become more stringent. Any deviation in bonding can easily lead to abnormal signal transmission and affect the display effect. Moreover, existing flip-chip films lack sufficient flexibility and adaptability to cope with complex and ever-changing display needs, making it difficult to meet the diverse performance requirements of display modules in different scenarios. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art, and to provide a flip-chip film, a display module and an electronic device.

[0005] In some embodiments, the flip-chip film includes a flexible substrate and a plurality of first bonding pads disposed on the flexible substrate; the flip-chip film is divided into a working area and a bonding area disposed on at least one side of the working area, and the first bonding pads are disposed within the bonding area; wherein,

[0006] The first connection pad includes a first end and a second end disposed opposite to each other along its extension direction, the second end being closer to the working area than the first end; the distance between the second end of at least two adjacent first connection pads and the working area is greater than the distance between the first end of the other first connection pad and the working area.

[0007] In some embodiments, the plurality of first connection pads are divided into a plurality of first connection pad groups; each first connection pad group includes N first connection pads arranged sequentially, where N is an integer greater than or equal to 2;

[0008] For a first connection pad group, the distance between the second end of each first connection pad and the working area decreases monotonically; and the distance between the second end of the j-th first connection pad and the working area is greater than the distance between the first end of the (j+1)-th first connection pad and the working area; j is an integer from 1 to N-1, including endpoint values.

[0009] In some embodiments, the plurality of first connection pads are divided into a plurality of first connection pad groups; each first connection pad group includes N first connection pads arranged sequentially, where N is an integer greater than or equal to 2;

[0010] For a first connection pad group, the distance between the second end of each first connection pad and the working area increases monotonically; and the distance between the second end of the i-th first connection pad and the working area is greater than the distance between the first end of the (i-1)-th first connection pad and the working area; i is an integer from 2 to N, including endpoint values.

[0011] In some embodiments, the flip-chip film includes a plurality of conductive structures spaced apart, and an insulating layer covering at least a portion of the conductive structures, wherein the portion of the conductive structure not covered by the insulating layer is used as the first connection pad.

[0012] The distance between two adjacent conductive structures is 25μm~30μm.

[0013] This application also provides a display module, including at least one flip-chip film as described in the above embodiments; wherein, the display module further includes a display substrate bonded to at least one of the flip-chip films;

[0014] The display substrate includes a substrate and a plurality of second connection pads disposed on the substrate; one of the first connection pads is electrically connected to one of the second connection pads.

[0015] In some embodiments, the substrate is divided into a display area and a peripheral area disposed on at least one side of the display area, wherein the second connection pad is disposed within the peripheral area; wherein,

[0016] The second connection pad includes a third end and a fourth end disposed opposite to each other along its extension direction, the fourth end being closer to the display area than the third end; the distance between the fourth end of at least two adjacent second connection pads and the display area is greater than the distance between the third end of the other and the display area.

[0017] In some embodiments, the width of the second connection pad is greater than the width of the first connection pad; the first connection pad includes a first side and a second side disposed opposite to each other along a direction perpendicular to its extension.

[0018] For the first connection pad and the second connection pad of the electrical connection, the orthographic projection of the second connection pad on the substrate covers at least a portion of the orthographic projection of the first side and the second side of the first connection pad on the substrate.

[0019] In some embodiments, the length of the first connection pad is greater than the length of the second connection pad; the second connection pad includes a fifth side and a sixth side disposed opposite to each other along its extending direction;

[0020] For the first and second connection pads of the electrical connection, the orthographic projection of the first connection pad on the substrate covers at least a portion of the orthographic projection of the fifth and sixth sides of the second connection pad on the substrate.

[0021] In some embodiments, the display module further includes an anisotropic conductive film for electrically connecting the first connection pad and the second connection pad.

[0022] This application also provides an electronic device, including a display module as described in the above embodiments. Attached Figure Description

[0023] Figure 1 This is a top view of a flip-chip thin film provided in this application.

[0024] Figure 2 This is a schematic diagram of the structure of a first connecting pad provided in this application.

[0025] Figure 3 This is a schematic diagram of the arrangement of a first connecting pad provided in this application.

[0026] Figure 4 This is a schematic diagram of another arrangement of the first connection pads provided in this application.

[0027] Figure 5 This is a schematic diagram of another arrangement of the first connection pads provided in this application.

[0028] Figure 6 This is a schematic diagram of another arrangement of the first connection pads provided in this application.

[0029] Figure 7 This is a top view of a display substrate provided in this application.

[0030] Figure 8This is a schematic diagram of the structure of a second connecting pad provided in this application.

[0031] Figure 9 This is a diagram showing the bonding connection between the flip-chip film and the display substrate provided in this application.

[0032] Figure 10 A schematic diagram of the structure for bonding the first connection pad and the second connection pad provided in this application.

[0033] In the attached figures, the reference numerals are as follows: 100, flip-chip film; 200, display substrate; Q1, working area; Q2, bonding area; Q3, display area; Q4, peripheral area; 11, flexible substrate; 12, first bonding pad; 13, driver chip; 120, first bonding pad group; 21, substrate; 22, second bonding pad; W1, first end; W2, second end; W3, third end; W4, fourth end; S1, first side; S2, second side; S3, third side; S4, fourth side; S5, fifth side; S6, sixth side; S7, seventh side; S8, eighth side. Detailed Implementation

[0034] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0035] Unless otherwise defined, the technical or scientific terms used in this application shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms “a,” “an,” “an,” “the,” and similar words used in this application do not indicate quantity limitation and may indicate singular or plural. The terms “comprising,” “including,” “having,” and any variations thereof used in this application are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or device that includes a series of steps or modules (units) is not limited to the listed steps or units, but may also include steps or units not listed, or may include other steps or units inherent to these processes, methods, products, or devices. The terms “connected,” “linked,” “coupled,” and similar words used in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. “Multiple” used in this application refers to two or more. “And / or” describes the relationship between related objects, indicating that three relationships may exist; for example, “A and / or B” can represent: A alone, A and B simultaneously, and B alone. The character " / " generally indicates that the preceding and following objects are in an "or" relationship. The terms "first," "second," and "third" used in this application are merely to distinguish similar objects and do not represent a specific ordering of objects. "Above," "below," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0036] As used herein, “parallel” and “perpendicular” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°.

[0037] This document describes exemplary embodiments with reference to sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Therefore, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. Thus, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0038] To facilitate understanding, before introducing the specific solutions of this application, we will first introduce some technical terms involved in this application.

[0039] Chip-on-film (COF) is a packaging process that integrates integrated circuits or driver chips onto a flexible substrate (e.g., polyimide). After electrically connecting the COF film to the display substrate, the flexibility of the substrate allows the integrated circuits or driver chips to be folded to the backlight side of the display substrate, reducing space occupation and increasing integration density, thus achieving narrow bezels and thinner display modules.

[0040] Connecting pads: These are conductive contacts set on the display substrate and the flip-chip film. A typical conductive contact consists of a base material with excellent conductivity (usually copper), a transition layer (usually nickel) that encases the base material and increases wear resistance, and a surface layer (usually gold) that encases the transition layer and increases hardness and corrosion resistance. Because of its gold plating, it appears golden, hence the name "gold fingers."

[0041] Gold finger corrosion: To reduce costs, the outermost surface layer of the gold fingers is made relatively thin and has poor density. Corrosive substances in the environment (such as sulfur-containing or chlorine-containing substances) can easily penetrate the surface layer and react chemically with the nickel and copper in the inner layer to produce compounds. These compounds penetrate the pores of the surface layer, cover the surface of the gold fingers, and expand to both sides, causing physical contact between adjacent gold fingers and establishing an electrical connection. This can lead to a short circuit and affect the display.

[0042] Bonding connection: refers to the process of electrically connecting the bonding pads on the flip-chip film to the corresponding bonding pads on the display substrate through a certain process (such as thermoforming), so that the integrated circuit and driver chip can provide driving signals to the display substrate and drive the display substrate to perform normal display.

[0043] The technical solution of this application will now be described in detail with reference to the accompanying drawings.

[0044] Figure 1 This is a top view of a flip-chip thin film provided in this application. Figure 2 This is a schematic diagram of the structure of the first connection pad, as shown below. Figure 1-2As shown, the flip-chip film 100 includes a flexible substrate 11, a driver chip 13 disposed on the flexible substrate 11, a plurality of first connection pads 12, and connection traces extending from each pin of the driver chip 13 to the first connection pads 12. The flip-chip film 100 is divided into a working area Q1 and a bonding area Q2 disposed on at least one side of the working area Q1. The driver chip 13 is disposed in the working area Q1, and each of the first connection pads 12 is disposed in the bonding area Q2. To facilitate connection and improve wiring aesthetics, the extension direction of the first connection pads 12 is approximately from the working area Q1 to the bonding area Q2. Each first connection pad 12 includes a first end W1 and a second end W2 disposed opposite each other along its extension direction, with the second end W2 being closer to the working area Q1 than the first end W1. Here, the first end W1 and the second end W2 refer to the two end regions of the first connection pad 12 along its extension direction. The first connecting pad 12 includes a first side S1 and a second side S2 disposed opposite to each other along a direction perpendicular to its extension, and a third side S3 and a fourth side S4 connecting the first side S1 and the second side S2. The fourth side S4 is closer to the working area Q1 than the third side S3. That is, the first end W1 includes the third side S3, a portion of the first side S1, and a portion of the second side S2, and the second end W2 includes the fourth side S4, a portion of the first side S1, and the second side S2. The distance between the first end W1 and the working area Q1 refers to the distance between the third side S3 and the boundary line between the working area Q1 and the bonding area Q2, and the distance between the second end W2 and the working area Q1 refers to the distance between the fourth side S4 and the boundary line between the working area Q1 and the bonding area Q2.

[0045] In this configuration, among the plurality of first connection pads 12, the distance between the second end W2 of at least two adjacent first connection pads 12 and the working area Q1 is greater than the distance between the first end W1 of the other and the working area Q1. That is, these two adjacent first connection pads 12 are completely staggered in their extension direction. Therefore, even if one first connection pad 12 corrodes, it will not affect the adjacent pads, effectively avoiding short circuits caused by pad corrosion and improving the reliability and stability of the flip-chip film 100. Furthermore, this staggered arrangement also increases the creepage distance between the pads, effectively preventing electrical faults caused by water and oxygen erosion even under harsh environmental conditions, ensuring a long lifespan and high-quality display for the display module.

[0046] In some specific embodiments, such as Figure 3As shown, multiple first connection pads 12 are divided into multiple first connection pad groups 120. Each first connection pad group 120 includes N first connection pads 12 arranged sequentially, where N is an integer greater than or equal to 2. Within a first connection pad group 120, the distance between the second end W2 of each first connection pad 12 and the working area Q1 decreases monotonically along a first direction. It should be noted that the flip-chip film 100 includes multiple conductive structures arranged at intervals, and at least a portion of the conductive structures is covered with an insulating layer. Thus, the exposed conductive structure portions not covered by the insulating layer serve as first connection pads 12, while the conductive structure portions covered with the insulating layer can be used as signal lines for transmitting signals from the first connection pads 12. Therefore, the first direction mentioned above essentially refers to the arrangement direction of the conductive structures, and the first direction is approximately perpendicular to the extension direction of the first connection pads 12. For example, the distance d0 between two adjacent conductive structures ranges from 25 μm to 30 μm.

[0047] Continue to refer to Figure 3 For the N first connection pads 12 in the first connection pad group 120, the distance between the second end W2 of the j-th first connection pad 12 and the working area Q1 is greater than the distance between the first end W1 of the (j+1)-th first connection pad 12 and the working area Q1. Here, j is an integer from 1 to N-1, including endpoint values. That is, the N first connection pads 12 in the first connection pad group 120 are staggered sequentially. At this time, for two adjacent first connection pad groups 120 (for ease of explanation, one is referred to as the first first connection pad group 120, and the other as the second first connection pad group 120), the two ends of the first first connection pad 12 in the first first connection pad group 120 and the two ends of the first first connection pad 12 in the second first connection pad group 120 are basically on a straight line in the first direction. However, since the distance between them is N×d0, they do not affect each other, effectively reducing the risk of short circuits between pads. Similarly, for the other two first connection pads 12 in the two first connection pad groups 120 that are basically on a straight line, the distance between them is also N×d0, which can effectively avoid mutual influence and reduce the risk of short circuit.

[0048] In other examples, such as Figure 4As shown, the distance between the second ends W2 of N first connection pads 12 in the first connection pad group 120 and the working area Q1 increases monotonically along the first direction, and the distance between the second end W2 of the i-th first connection pad 12 and the working area Q1 is greater than the distance between the first end W1 of the (i-1)-th first connection pad 12 and the working area Q1. Here, i is an integer between 2 and N, including endpoint values. Similarly, for two adjacent first connection pad groups 120, the distance between two corresponding connection pads (correspondence means that the line connecting them is approximately parallel to the first direction) is also N×d0, thus effectively reducing short-circuit problems caused by corrosion.

[0049] In some specific examples, N can take the value 2, 3, or 4. When N=2, such as... Figure 3-4 As shown, if the distance between the second end W2 of two first connection pads 12 in a first connection pad group 120 and the working area Q1 increases monotonically along the first direction, then for all first connection pads 12, each odd-numbered first connection pad 12 is basically on the same straight line, each even-numbered first connection pad 12 is basically on the same straight line, and the distance between the second end W2 of the even-numbered first connection pad 12 and the working area Q1 is greater than the distance between the first end W1 of the odd-numbered first connection pad 12 and the working area Q1. Conversely, if the distance between the second end W2 of two first connection pads 12 in a first connection pad group 120 and the working area Q1 decreases monotonically along the first direction, then for all first connection pads 12, each odd-numbered first connection pad 12 is basically on the same straight line, each even-numbered first connection pad 12 is basically on the same straight line, and the distance between the second end W2 of the odd-numbered first connection pad 12 and the working area Q1 is greater than the distance between the first end W1 of the even-numbered first connection pad 12 and the working area Q1.

[0050] At this time, the distances in the first direction between the first and third first connection pads 12, the distances in the first direction between the second and fourth first connection pads 12, the distances in the first direction between the third and fifth first connection pads, and the distances in the first direction between the fourth and sixth first connection pads are all 2×d0, i.e., 50μm~60μm.

[0051] When N=3, if the distance between the second end W2 of three first connection pads 12 in a first connection pad group 120 and the working area Q1 increases monotonically along the first direction, then for all first connection pads 12 (assuming there are 3M first connection pads 12 in total, where M is a positive integer), each of the 3a-2 (a is an integer from 1 to M, including endpoint values) first connection pads 12 is basically on the same straight line, each of the 3a-1 first connection pads 12 is basically on the same straight line, each of the 3a first connection pads 12 is basically on the same straight line, and the distance between the second end W2 of the 3a-1 first connection pad 12 and the working area Q1 is greater than the distance between the first end W1 of the 3a-2 first connection pad 12 and the working area Q1, and the distance between the second end W2 of the 3a first connection pad 12 and the working area Q1 is greater than the distance between the first end W1 of the 3a-1 first connection pad 12 and the working area Q1. Conversely, if the distance between the second ends W2 of the three first connection pads 12 in a first connection pad group 120 and the working area Q1 decreases monotonically along the first direction, such as... Figure 5 As shown, for all the first connection pads 12 (assuming there are 3M first connection pads 12 in total, where M is a positive integer), each of the 3a-2 (a is an integer from 1 to M, including endpoint values) first connection pads 12 is basically on the same straight line, each of the 3a-1 first connection pads 12 is basically on the same straight line, each of the 3a first connection pads 12 is basically on the same straight line, and the distance between the second end W2 of the 3a-2 first connection pad 12 and the working area Q1 is greater than the distance between the first end W1 of the 3a-1 first connection pad 12 and the working area Q1, and the distance between the second end W2 of the 3a-1 first connection pad 12 and the working area Q1 is greater than the distance between the first end W1 of the 3a first connection pad 12 and the working area Q1.

[0052] At this time, the distances in the first direction between the first and fourth first connection pads 12, the distances in the first direction between the second and fifth first connection pads 12, the distances in the first direction between the third and sixth connection pads, and the distances in the first direction between the fourth and seventh connection pads are all 3×d0, i.e., 75μm~90μm.

[0053] When N=4, if the distance between the second ends W2 of the four first connection pads 12 in a first connection pad group 120 and the working area Q1 increases monotonically along the first direction, then for all the first connection pads 12 (assuming there are 4P first connection pads 12 in total, where P is a positive integer), the 4b-3 (b is an integer from 1 to P, including endpoint values) first connection pads 12 are basically on the same straight line, the 4b-2 first connection pads 12 are basically on the same straight line, the 4b-1 first connection pads 12 are basically on the same straight line, and the 4b first connection pads 12 are basically on the same straight line. In a straight line, the distance between the second end W2 of the 4b-2nd first connecting pad 12 and the working area Q1 is greater than the distance between the first end W1 of the 4b-3rd first connecting pad 12 and the working area Q1, the distance between the second end W2 of the 4b-1th first connecting pad 12 and the working area Q1 is greater than the distance between the first end W1 of the 4b-2nd first connecting pad 12 and the working area Q1, and the distance between the second end W2 of the 4bth first connecting pad 12 and the working area Q1 is greater than the distance between the first end W1 of the 4b-1th first connecting pad 12 and the working area Q1. Conversely, refer to... Figure 6 If the distance between the second end W2 of four first connection pads 12 in a first connection pad group 120 and the working area Q1 decreases monotonically along the first direction, then for all first connection pads 12 (assuming there are 4P first connection pads 12 in total, where P is a positive integer), each of the 4b-3 (b is an integer from 1 to P, including endpoint values) first connection pads 12 is basically on the same straight line, each of the 4b-2 first connection pads 12 is basically on the same straight line, each of the 4b-1 first connection pads 12 is basically on the same straight line, and each of the 4b first connection pads 12 is basically on the same straight line. Furthermore, the distance between the second end W2 of the 4b-3rd first connecting pad 12 and the working area Q1 is greater than the distance between the first end W1 of the 4b-2nd first connecting pad 12 and the working area Q1, the distance between the second end W2 of the 4b-2nd first connecting pad 12 and the working area Q1 is greater than the distance between the first end W1 of the 4b-1st first connecting pad 12 and the working area Q1, and the distance between the second end W2 of the 4b-1st first connecting pad 12 and the working area Q1 is greater than the distance between the first end W1 of the 4bth first connecting pad 12 and the working area Q1.

[0054] At this time, the distances in the first direction between the first first connection pad 12 and the fifth first connection pad 12, the distances in the first direction between the second first connection pad 12 and the sixth connection pad, the distances in the first direction between the third connection pad and the seventh connection pad, and the distances in the first direction between the fourth connection pad and the eighth connection pad are all 4×d0, i.e., 100μm~120μm.

[0055] In some examples, for two first connection pads 12 that are adjacent and staggered, the distance between the second end W2 of one pad and the working area Q1 is defined as the first distance, and the distance between the first end W1 of the other pad and the working area Q1 is defined as the second distance. The first distance is greater than the second distance, and the difference between the first distance and the second distance can be in the range of 0~5μm, excluding the left endpoint value and including the right endpoint value.

[0056] Based on the same inventive concept, this application also provides a display module, which includes the flip-chip film 100 in the above embodiments and a display substrate 200 bonded to the flip-chip film 100.

[0057] The display substrate 200 includes a substrate 21 and a plurality of second connection pads 22 disposed on the substrate 21, wherein each second connection pad 22 is electrically connected to a first connection pad 12. For example... Figure 7 As shown, the display substrate 200 is divided into a display area Q3 and a peripheral area Q4 surrounding the display area Q3. The display area Q3 is provided with a plurality of pixel units, and the peripheral area Q4 is provided with a plurality of second connection pads. The display substrate 200 also includes a plurality of signal traces extending from the pixel units of the display area Q3 to the second connection pads. The signal traces are used to transmit electrical signals from the second connection pads to the pixel units to drive the pixel units to emit light.

[0058] Among them, such as Figure 8 As shown, the second connection pad includes a third end W3 and a fourth end W4 disposed opposite to each other along its extension direction, with the fourth end W4 being closer to the display area Q3 than the third end W3. Here, the third end W3 and the fourth end W4 refer to the two end regions of the second connection pad along its extension direction. The second connection pad includes a fifth side S5 and a sixth side S6 disposed opposite to each other perpendicular to its extension direction, and a seventh side S7 and an eighth side S8 connecting the fifth side S5 and the sixth side S6, with the eighth side S8 being closer to the display area Q3 than the seventh side S7. That is, the third end W3 includes the seventh side S7, a portion of the fifth side S5, and a portion of the sixth side S6, and the fourth end W4 includes the eighth side S8, a portion of the fifth side S5, and a portion of the sixth side S6. The distance between the third end W3 and the display area Q3 refers to the distance between the seventh side S7 and the boundary line between the display area Q3 and the peripheral area Q4, and the distance between the fourth end W4 and the display area Q3 refers to the distance between the eighth side S8 and the boundary line between the display area Q3 and the peripheral area Q4.

[0059] In some examples, such as Figure 7As shown, the distance between the fourth end W4 of at least two adjacent second connection pads 22 and the display area Q3 is greater than the distance between the third end W3 of the other and the display area Q3. In other words, these two adjacent second connection pads 22 are staggered, which effectively reduces the adverse effects caused by signal interference or short circuits between adjacent second connection pads 22.

[0060] In some examples, such as Figure 10 As shown, both the first connection pad 12 and the second connection pad 22 are rectangular. Of course, depending on actual needs, the connection pads can also be wavy, zigzag, or other irregular shapes, as long as the electrical connection requirements are met. For the corresponding first connection pad 12 and second connection pad 22, continue to refer to... Figure 10 The length of the first connecting pad 12 is greater than the length of the second connecting pad 22, and the width of the second connecting pad 22 is less than the width of the first connecting pad 12. Furthermore, to increase connection stability and reduce resistance at the connection point, the orthographic projection of the second connecting pad 22 on the substrate covers at least a portion of the orthographic projections of the first side S1 and the second side S2 of the first connecting pad 12 on the substrate. Also, the orthographic projection of the first connecting pad 12 on the substrate covers at least a portion of the orthographic projections of the seventh side S7 and the eighth side S8 of the second connecting pad 22 on the substrate.

[0061] In some examples, such as Figure 9 As shown, the display module also includes an anisotropic conductive film 3 disposed between the display substrate 200 and the flip-chip film 100. The anisotropic conductive film is a conductive adhesive film that conducts electricity only in the vertical direction (z-direction) and is insulating in the horizontal direction (xoy plane). Therefore, by stacking the display substrate 200 and the flip-chip film 100 along the z-direction and bonding them together with the anisotropic conductive film, electrical connection between the first connecting pad 12 and the second connecting pad 22 can be achieved, while ensuring insulation between adjacent first connecting pads 12 and adjacent second connecting pads 22.

[0062] In some specific examples, the anisotropic conductive film includes an insulating resin (e.g., epoxy resin) and conductive particles doped in the insulating resin. After the anisotropic conductive film is placed between the display substrate 200 and the flip-chip film 100, a thermoforming head can be used to align the adhesive film between the first connecting pad 12 and the second connecting pad 22, while applying high temperature and high pressure to melt the insulating resin and squeeze the conductive particles between the first connecting pad 12 and the second connecting pad, forming a stable electrical connection.

[0063] Based on the same inventive concept, this application also provides an electronic device that includes the display module described in any of the above embodiments. This electronic device may include, for example, various terminal products with display functions such as mobile phones, tablets, laptops, smartwatches, televisions, and automotive displays. In these electronic devices, due to the use of the aforementioned display module, the unique connection pad design between the flip-chip film 100 and the display substrate 200, along with the application of anisotropic conductive film, effectively reduces the risk of short circuits between pads, improves connection stability, reduces resistance at the connection point, and thus enhances the performance of the display module, providing users with a clearer, more stable, and higher-quality display effect, and enhancing the user's visual experience when using the electronic device.

[0064] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A flip-chip film, comprising a flexible substrate and a plurality of first bonding pads disposed on the flexible substrate; the flip-chip film is divided into a working area and a bonding area disposed on at least one side of the working area, wherein the first bonding pads are disposed within the bonding area; wherein, The first connection pad includes a first end and a second end disposed opposite to each other along its extension direction, the second end being closer to the working area than the first end; the distance between the second end of at least two adjacent first connection pads and the working area is greater than the distance between the first end of the other first connection pad and the working area.

2. The flip-chip film according to claim 1, wherein, The plurality of first connection pads are divided into a plurality of first connection pad groups; each first connection pad group includes N first connection pads arranged sequentially, where N is an integer greater than or equal to 2; For a first connection pad group, the distance between the second end of each first connection pad and the working area decreases monotonically; and the distance between the second end of the j-th first connection pad and the working area is greater than the distance between the first end of the (j+1)-th first connection pad and the working area; j is an integer from 1 to N-1, including endpoint values.

3. The flip-chip film according to claim 1, wherein, The plurality of first connection pads are divided into a plurality of first connection pad groups; each first connection pad group includes N first connection pads arranged sequentially, where N is an integer greater than or equal to 2; For a first connection pad group, the distance between the second end of each first connection pad and the working area increases monotonically; and the distance between the second end of the i-th first connection pad and the working area is greater than the distance between the first end of the (i-1)-th first connection pad and the working area; i is an integer from 2 to N, including endpoint values.

4. The flip-chip film according to claim 1, wherein, The flip-chip film includes a plurality of conductive structures spaced apart, and an insulating layer covering at least a portion of the conductive structures, wherein the portion of the conductive structure not covered by the insulating layer is used as the first connection pad. The distance between two adjacent conductive structures is 25μm~30μm.

5. A display module comprising at least one flip-chip thin film as described in any one of claims 1-4; wherein, The display module further includes a display substrate bonded to at least one of the flip-chip films; The display substrate includes a substrate and a plurality of second connection pads disposed on the substrate; one of the first connection pads is electrically connected to one of the second connection pads.

6. The display module according to claim 5, wherein, The substrate is divided into a display area and a peripheral area disposed on at least one side of the display area, wherein the second connection pad is disposed within the peripheral area; wherein, The second connection pad includes a third end and a fourth end disposed opposite to each other along its extension direction, the fourth end being closer to the display area than the third end; the distance between the fourth end of at least two adjacent second connection pads and the display area is greater than the distance between the third end of the other and the display area.

7. The display module according to claim 5, wherein, The width of the second connection pad is greater than the width of the first connection pad; the first connection pad includes a first side and a second side disposed opposite to each other along a direction perpendicular to its extension. For the first connection pad and the second connection pad of the electrical connection, the orthographic projection of the second connection pad on the substrate covers at least a portion of the orthographic projection of the first side and the second side of the first connection pad on the substrate.

8. The display module according to claim 5, wherein, The length of the first connecting pad is greater than the length of the second connecting pad; the second connecting pad includes a fifth side and a sixth side disposed opposite to each other along its extending direction; For the first and second connection pads of the electrical connection, the orthographic projection of the first connection pad on the substrate covers at least a portion of the orthographic projection of the fifth and sixth sides of the second connection pad on the substrate.

9. The display module according to claim 5, wherein, The display module also includes an anisotropic conductive film for the first and second connection pads for electrical connection.

10. An electronic device comprising a display module as claimed in any one of claims 5-9.

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