Method for processing a circuit board and circuit board
By obtaining the residual ink rate on the circuit board surface and forming a groove compensation structure, the problem of packaging substrate warping was solved, the ink volume difference was reduced, the alignment accuracy and welding quality were improved, and the product performance and lifespan were enhanced.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- WUXI GUANGXIN PACKAGING BASE PLATE CO LTD
- Filing Date
- 2026-04-15
- Publication Date
- 2026-07-31
AI Technical Summary
Warping issues that occur during the processing or use of the packaging substrate can lead to decreased alignment accuracy, increased soldering defect rate, and affect product performance and lifespan.
By obtaining the residual ink rate of the first and second surfaces of the circuit board, a preset number of groove compensation structures are calculated and formed. The circuit board surface is then filled and covered with ink, and developed and cured to reduce ink volume differences.
It improves the warpage problem of the packaging substrate, increases alignment accuracy, reduces the welding defect rate, and enhances product performance and lifespan.
Smart Images
Figure CN122496988A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of circuit board processing and manufacturing technology, and in particular to a method for processing circuit boards and a circuit board. Background Technology
[0002] As electronic products evolve towards higher performance and thinner designs, advanced packaging technology has become crucial for improving chip integration and system performance. As the core component that carries the chip and connects to external circuits, the technical requirements for packaging substrates are becoming increasingly stringent.
[0003] Against this backdrop, facing increasingly complex and precise packaging requirements, especially in subsequent processes such as chip mounting and system integration, unintended bending, twisting, or unevenness of the packaging substrate during processing or use—known as substrate warping—directly leads to decreased alignment accuracy, increased soldering defect rates, and may cause interconnect failures or structural damage, severely impacting the performance and lifespan of the final product. Therefore, substrate warping has become a prominent challenge restricting industry yield and reliability. Summary of the Invention
[0004] This application provides a method for processing a circuit board and a circuit board to improve the problem of warpage in the packaging substrate.
[0005] To solve the above-mentioned technical problems, this application provides a method for processing a circuit board and a circuit board, including: obtaining a first residual ink rate of a first surface and a second residual ink rate of a second surface of the circuit board that are relatively disposed therebetween; forming a preset number of groove compensation structures on the first surface or the second surface based on the first residual ink rate and the second residual ink rate; filling the preset number of groove compensation structures with ink and covering the first surface and the second surface of the circuit board; and developing and curing the circuit board after coating with ink.
[0006] The step of obtaining the first residual ink rate of the first surface and the second residual ink rate of the second surface of the circuit board before the step of obtaining the first residual ink rate of the first surface and the second surface of the circuit board is further included: creating circuit patterns on the first surface and the second surface.
[0007] The step of obtaining the first residual ink rate of the first surface and the second residual ink rate of the relatively disposed first surface and second surface of the circuit board includes: obtaining the first area and the first ink coverage area of the first surface of the circuit board; the percentage of the first ink coverage area to the first area is the first residual ink rate; obtaining the second area and the second ink coverage area of the second surface of the circuit board; the percentage of the second ink coverage area to the second area is the second residual ink rate.
[0008] The step of forming a preset number of groove compensation structures on the first surface or the second surface based on the first ink residual rate and the second ink residual rate includes: calculating the preset number of groove compensation structures; and forming the preset number of groove compensation structures on the surface with the lower ink residual rate between the first surface and the second surface.
[0009] The step of calculating the preset number of groove compensation structures includes: calculating the preset number of groove compensation structures using the following formula (1): (1) Where N is the preset number of groove compensation structures, W1 is the first residual ink rate, W2 is the second residual ink rate, M1 is the circuit board area, M2 is the preset area of a single groove compensation structure, H1 is the preset ink thickness, and H2 is the preset depth of the groove compensation structure.
[0010] The step of forming a preset number of groove compensation structures on the surface with a lower residual ink rate between the first surface and the second surface includes: if the first residual ink rate is greater than the second residual ink rate, then forming a preset number of groove compensation structures on the second surface of the circuit board; if the first residual ink rate is less than the second residual ink rate, then forming a preset number of groove compensation structures on the first surface of the circuit board.
[0011] The step of forming a predetermined number of groove compensation structures on the surface with a lower residual ink rate between the first surface and the second surface further includes: forming a predetermined number of groove compensation structures on the surface with a lower residual ink rate between the first surface and the second surface by laser ablation.
[0012] The preset depth of the groove compensation structure is less than the thickness of the circuit board.
[0013] To solve the above-mentioned technical problems, this application provides a circuit board, including: a substrate, the substrate including a first surface and a second surface disposed opposite to each other; a circuit pattern is formed on the first surface and the second surface of the substrate; the first surface and the second surface of the substrate are covered with ink; wherein, a groove compensation structure formed by laser ablation is provided on the first surface or the second surface.
[0014] The groove compensation structure is located on the surface with a lower residual ink rate between the first surface and the second surface.
[0015] The depth of the groove compensation structure is a preset depth, and the area of a single groove compensation structure is a preset area; the preset depth of the groove compensation structure is less than the thickness of the circuit board.
[0016] The beneficial effects of this application are as follows: Unlike existing technologies, the circuit board processing method of this application includes: obtaining a first residual ink rate on a first surface and a second residual ink rate on a second surface of the circuit board that are relatively disposed on each other; forming a predetermined number of groove compensation structures on the first or second surface based on the first and second residual ink rates; filling the groove compensation structures with ink and covering the first and second surfaces of the circuit board; and developing and curing the ink-coated circuit board. Through the above method, this application improves the warpage problem of the packaging substrate by reducing the ink volume difference between the front and back sides of the packaging substrate. Attached Figure Description
[0017] Figure 1 This is a schematic flowchart of an embodiment of the circuit board processing method provided in this application; Figure 2 This is a schematic diagram of one embodiment of the circuit board provided in this application; Figure 3 This is a schematic diagram of another embodiment of the circuit board provided in this application; Figure 4 This is a schematic flowchart of another embodiment of the circuit board processing method provided in this application; Figure 5 This is a schematic diagram of another embodiment of the circuit board provided in this application. Detailed Implementation
[0018] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0019] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to limit the application. The singular forms “a,” “said,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms, unless otherwise clearly indicated above. “Multiple” generally includes at least two, but does not exclude the inclusion of at least one.
[0020] It should be noted that if the embodiments of this application involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.
[0021] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, in the embodiments of this application, the meaning of "and / or" can include both, or it can be either one or both. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.
[0022] Please see Figure 1 , Figure 1 This is a flowchart illustrating an embodiment of the circuit board processing method provided in this application.
[0023] Step S11: Obtain the first residual ink rate of the first surface and the second residual ink rate of the second surface of the circuit board with relative settings.
[0024] A circuit board is a plate-shaped assembly (e.g., a packaging substrate, a printed circuit board, etc.) formed on an insulating substrate through processes such as printing, etching, and patterning.
[0025] In some embodiments, the circuit board includes, but is not limited to, printed circuit boards, packaging substrates, flexible circuit boards, rigid bonding boards, and metal substrates.
[0026] Residual ink rate refers to the percentage of the area covered by ink to the total area of the circuit board, used to quantify the difference in ink distribution between the front and back surfaces of the circuit board. The circuit board has a first surface and a second surface arranged opposite each other; the first residual ink rate of the first surface of the circuit board is the percentage of the ink coverage of the first surface to the area of the first surface, and the second residual ink rate of the second surface of the circuit board is the percentage of the ink coverage of the second surface to the area of the second surface.
[0027] Creating circuit patterns is a core step in PCB manufacturing, defining the circuit connection areas on both sides of the board. This process uses Computer-Aided Manufacturing (CAM) software to generate precise circuit patterns on the PCB surface. Standard CAM design workflows can be employed, generating circuit patterns based on chip pin layout and PCB pad parameters to ensure the circuit coverage area matches actual connection requirements, while considering the ink distribution characteristics of different areas to avoid design deviations. The creation of circuit patterns must strictly match the differences in connection area between the front and back sides, providing reliable input for subsequent calculations (such as ink coverage on both sides of the PCB, surface area of both sides), and involves data conversion, process parameter setting, production process simulation, and manufacturing document output using CAM software.
[0028] In some embodiments, the circuit board is a packaging substrate, and the step of obtaining the first residual ink rate of the first surface and the second residual ink rate of the relatively disposed first surface and the second surface of the packaging substrate further includes: forming circuit patterns on the first surface and the second surface.
[0029] In one specific embodiment, circuit patterns are created on the first and second surfaces of the circuit board before obtaining the first and second residual ink rates. The area and ink coverage area of the first surface and the area and ink coverage area of the second surface of the circuit board are obtained by CAM software. The percentage of the ink coverage area of the first surface to the area of the first surface is calculated to obtain the first residual ink rate, and the percentage of the ink coverage area of the second surface to the area of the second surface is calculated to obtain the second residual ink rate. This method can efficiently and accurately obtain residual ink rate data and avoid introducing errors.
[0030] Step S12: Based on the first residual ink rate and the second residual ink rate, form a preset number of groove compensation structures on the first surface or the second surface.
[0031] For a better understanding of the groove compensation structure, please refer to further reading. Figure 2 , Figure 2 This is a schematic diagram of one embodiment of the circuit board provided in this application. The circuit board includes: a substrate 1, on which a first surface 2 and a second surface 3 are disposed opposite each other, and a groove compensation structure 4 is formed on the first surface 2.
[0032] Because the circuit connection areas on the first surface 2 and the second surface 3 of the circuit board are different, the ink coverage areas on the first surface 2 and the second surface 3 of the circuit board are inconsistent, that is, the first residual ink rate and the second residual ink rate are inconsistent. For example, the circuit connection area on the first surface 2 of the circuit board is smaller than the circuit connection area on the second surface 3, resulting in the first residual ink rate being lower than the second residual ink rate. During the ink curing process, the ink shrinkage generates internal stress. When the first residual ink rate is lower than the second residual ink rate, the shrinkage stress on the two sides is unbalanced, thereby causing the circuit board to warp.
[0033] Therefore, in order to reduce the ink volume difference between the first surface 2 and the second surface 3 of the circuit board, a predetermined number of groove compensation structures 4 are formed on the first surface 2 or the second surface 3.
[0034] Specifically, a preset number of groove compensation structures 4 are calculated, and a preset number of groove compensation structures 4 are formed on the surface with a lower residual ink rate between the first surface 2 and the second surface 3.
[0035] In some instances, the preset number of groove compensation structures is calculated based on the first residual ink rate, the second residual ink rate, the circuit board area, the preset area of a single groove compensation structure, the preset ink thickness, and the preset depth of the groove compensation structure.
[0036] Furthermore, if the first residual ink rate is greater than the second residual ink rate, the second surface is the surface with the lower residual ink rate between the first surface and the second surface; if the first residual ink rate is less than the second residual ink rate, the first surface is the surface with the lower residual ink rate between the first surface and the second surface.
[0037] In one specific embodiment, the circuit board is a packaging substrate. If the first residual ink rate is greater than the second residual ink rate, a preset number of groove compensation structures are formed on the second surface of the packaging substrate to reduce the ink volume difference between the first and second surfaces of the packaging substrate.
[0038] In another specific embodiment, the circuit board is a packaging substrate. If the first residual ink rate is less than the second residual ink rate, a preset number of groove compensation structures are formed on the first surface of the packaging substrate to reduce the ink volume difference between the first surface and the second surface of the packaging substrate.
[0039] Step S13: Fill the preset number of groove compensation structures with ink and cover the first and second surfaces of the circuit board.
[0040] In one specific embodiment, the depth of the groove compensation structure is a preset value, the area of a single groove compensation structure is a preset area, and the ink thickness is a preset thickness. The groove compensation structure is filled with ink of the preset thickness, and the first and second surfaces of the circuit board are also covered with ink of the preset thickness. For example, the preset depth of the groove compensation structure is 0.03 mm, the preset area of a single groove compensation structure is 0.1 square millimeters, the preset number of groove compensation structures is 100, and the preset ink thickness is 0.015 mm. The 100 groove compensation structures are covered with 0.015 mm of ink, and the non-circuit connection areas of the first and second surfaces of the circuit board are also covered.
[0041] Step S14: Develop and cure the circuit board after it has been coated with ink.
[0042] To better understand the structure of a circuit board after development and curing, please refer to further reading. Figure 3 And combine when necessary Figure 2 , Figure 3 This is a schematic diagram of another embodiment of the circuit board provided in this application.
[0043] Specifically, developing a circuit board after it has been coated with ink involves using a chemical solution (usually weakly alkaline) to selectively dissolve and remove the unexposed ink on the board, exposing the copper surfaces that need to be etched away, while the circuitry areas that need to be retained are protected by the exposed ink, thus forming a clear circuit pattern. Curing refers to heating the ink pattern retained after development to completely harden the ink.
[0044] In one specific embodiment, the ink-coated packaging substrate is developed using a developer (such as 1.0% - 1.2% sodium carbonate) to selectively dissolve and remove the unexposed ink portions on the packaging substrate. The developed packaging substrate is then heated and cured to completely harden the ink. After the ink filling the predetermined number of groove compensation structures formed on the first or second surface of the packaging substrate cures, a balance in ink volume between the first and second surfaces is achieved, thereby improving the warpage problem of the packaging substrate.
[0045] Through the above steps, the circuit board processing method of this embodiment includes: obtaining a first residual ink rate on a first surface and a second residual ink rate on a second surface of the circuit board that are relatively disposed therebetween; forming a predetermined number of groove compensation structures on the first surface or the second surface based on the first and second residual ink rates; filling the groove compensation structures with ink and covering the first and second surfaces of the circuit board; and developing and curing the circuit board after ink coating. Through the above method, this application improves the warpage problem of the packaging substrate by reducing the ink volume difference between the front and back sides of the packaging substrate.
[0046] Please see Figure 4 , Figure 4 This is a schematic flowchart of another embodiment of the circuit board processing method provided in this application.
[0047] Step S21: Create circuit patterns on the first and second surfaces of the circuit board.
[0048] Please refer to further information. Figure 5 , Figure 5 This is a schematic diagram of another embodiment of the circuit board provided in this application.
[0049] Circuit patterns refer to conductive circuit patterns formed on the first and second surfaces of a circuit board through a graphic process, used to define circuit connection areas.
[0050] In some embodiments, photolithography can be used to create circuit patterns on the first and second surfaces of the circuit board.
[0051] In some embodiments, an etcher can be used to create circuit patterns on the first and second surfaces of the circuit board.
[0052] In some embodiments, circuit patterns on the first and second surfaces of the packaging substrate can be fabricated based on CAM design data, and then the circuit patterns on the first and second surfaces of the packaging substrate can be fabricated through pattern transfer processes (such as dry film / wet film, exposure, development, etching).
[0053] In some embodiments, the circuit board is a packaging substrate, with a first surface of the packaging substrate being the front side and a second surface being the back side. Circuit patterns are fabricated on the first and second surfaces of the circuit board based on CAM design data. By analyzing the CAM design data of the packaging substrate, data such as the ink coverage of the front and back surfaces of the circuit board, the area of the front and back surfaces of the circuit board, the area of the packaging substrate, the preset area of a single groove compensation structure, the preset ink thickness, and the preset depth of a single groove compensation structure can be obtained.
[0054] Step S22: Obtain the first area and the first ink coverage area of the first surface of the circuit board, and calculate the first residual ink rate.
[0055] Specifically, the circuit board has a first surface and a second surface arranged opposite to each other. The first area refers to the total area of the first surface, the first ink coverage area refers to the area of the actual area covered by ink on the surface, and the first residual ink rate is the percentage ratio of the first ink coverage area to the first area.
[0056] In a specific example, the circuit board is a packaging substrate with a front and a back side arranged opposite to each other. The total area of the front side is 100 square millimeters, and the ink coverage area of the front side is 30 square millimeters. The calculated percentage ratio of the ink coverage link to the total area is 30%, that is, the first residual ink rate is 30%.
[0057] Step S23: Obtain the second area and the second ink coverage area of the second surface of the circuit board, and calculate the second residual ink rate.
[0058] Specifically, the circuit board has a first surface and a second surface arranged opposite to each other. The second area refers to the total area of the second surface, the second ink coverage area refers to the area of the ink-covered region on the surface, and the second residual ink rate is the percentage ratio of the second ink coverage area to the second area.
[0059] In a specific example, the circuit board is a packaging substrate with a front and a back side arranged opposite to each other. The total area of the back side is 100 square millimeters, and the ink coverage area of the back side is 50 square millimeters. The calculated percentage ratio of ink coverage to the total area is 70%, that is, the second residual ink rate is 50%.
[0060] Step S24: Calculate the preset number of groove compensation structures using formula (1).
[0061] The preset number of the groove compensation structure is calculated using the following formula (1): (1) Where N is the preset number of groove compensation structures, W1 is the first residual ink rate, W2 is the second residual ink rate, M1 is the circuit board area, M2 is the preset area of a single groove compensation structure, H1 is the preset ink thickness, and H2 is the preset depth of a single groove compensation structure.
[0062] In some embodiments, the preset area of a single groove compensation structure can be 0.1 square millimeters, 0.15 square millimeters, 0.3 square millimeters, etc., the preset depth of a single groove compensation structure can be 0.01 millimeters, 0.015 millimeters, 0.03 millimeters, 0.04 millimeters, etc., and the preset ink thickness can be 0.015 millimeters, 0.02 millimeters, 0.025 millimeters, etc. The preset area, preset depth, and preset ink thickness of a single groove compensation structure can be adjusted according to the actual circuit board requirements, and the specific values are not limited here.
[0063] In one specific embodiment, the circuit board is a packaging substrate, which has a front and a back side arranged opposite to each other. Circuit patterns are fabricated on the front and back sides of the packaging substrate based on CAM design data. By analyzing the CAM design data of the packaging substrate, the area of the packaging substrate, the preset area of a single groove compensation structure, the preset ink thickness, and the preset depth of a single groove compensation structure are obtained. A first residual ink rate is obtained through step 22, and a second residual ink rate is obtained through step 23. For example, if the area of the packaging substrate is 100 square millimeters, the first residual ink rate is 30%, the second residual ink rate is 50%, the preset area of a single groove compensation structure is 0.1 square millimeters, the preset ink thickness is 0.015 millimeters, the preset depth of a single groove compensation structure is 0.03 millimeters, and the preset number of groove compensation structures N = |30%-50%|×100×0.015 / (0.03×0.1) = 100, the preset number of groove compensation structures is calculated to be 100.
[0064] Step S25: Form a predetermined number of groove compensation structures on the surface with lower residual ink rate between the first surface and the second surface.
[0065] For a better understanding of the groove compensation structure, please refer to further reading. Figure 2 , Figure 2 This is a schematic diagram of one embodiment of the circuit board provided in this application. The circuit board includes: a substrate 1, a first surface 2 and a second surface 3 disposed opposite to each other on the substrate 1, and a groove compensation structure 4 formed on the first surface 2.
[0066] Specifically, if the first residual ink rate is greater than the second residual ink rate, a preset number of groove compensation structures 4 are formed on the second surface 2 of the circuit board; if the first residual ink rate is less than the second residual ink rate, a preset number of groove compensation structures 4 are formed on the first surface 2 of the circuit board. By forming groove compensation structures 4 on the surface with a lower residual ink rate, the ink will flow into the groove compensation structures 4 during subsequent ink filling, thereby reducing the ink volume difference between the relatively disposed first surface 2 and second surface 3 of the circuit board and preventing the circuit board from warping during curing.
[0067] In a specific embodiment, the circuit board is a packaging substrate, and the packaging substrate has a first surface 2 and a second surface 3 disposed opposite to each other. The first residual ink rate of the first surface 2 is 40%, and the second residual ink rate of the second surface 2 is 70%. Then, a preset number of groove compensation structures 4 calculated in step S24 are formed on the first surface 2 of the packaging substrate.
[0068] In another specific embodiment, the circuit board is a packaging substrate, and the packaging substrate has a first surface and a second surface disposed opposite to each other. The first residual ink rate of the first surface is 60%, and the second residual ink rate of the second surface is 55%. Then, a preset number of groove compensation structures calculated in step S24 are formed on the second surface of the packaging substrate.
[0069] In some embodiments, a groove compensation structure can be formed on the surface with a lower residual ink rate between the first and second surfaces by laser ablation. The preset depth of a single groove compensation structure can be 0.01 mm, 0.015 mm, 0.02 mm, 0.023 mm, 0.03 mm, 0.04 mm, etc., and the preset area of a single groove compensation structure can be 0.1 square millimeter, 0.2 square millimeter, 0.25 square millimeter, etc. The preset depth and preset area of a single groove compensation structure can be adjusted according to the actual circuit board requirements, and the specific values are not limited here.
[0070] In some embodiments, the cross-section of the groove compensation structure includes, but is not limited to, shapes such as circles, ellipses, rectangles, and polygons.
[0071] Step S26: Fill a preset number of groove compensation structures with ink and cover the first and second surfaces of the circuit board.
[0072] This step is the same as step S13; please refer to the details. Figure 1 And related textual descriptions, which will not be repeated here.
[0073] Step S27: Develop and cure the printed circuit board after it has been coated with ink.
[0074] This step is the same as step S14; please refer to [link / reference] for details. Figure 1 , Figure 3 And related textual descriptions, which will not be repeated here.
[0075] Through the above steps, this application creates circuit patterns on the first and second surfaces of the circuit board; obtains the first area and the first ink coverage area of the first surface of the circuit board, and calculates the first residual ink rate; obtains the second area and the second ink coverage area of the second surface of the circuit board, and calculates the second residual ink rate; calculates the preset number of groove compensation structures using formula (1); forms the preset number of groove compensation structures on the surface with the lower residual ink rate between the first and second surfaces; fills the preset number of groove compensation structures with ink and covers the first and second surfaces of the circuit board; and then develops and cures the ink-coated circuit board. Through the above method, this application reduces the ink volume difference between the front and back sides of the packaging substrate, thereby improving the warpage problem of the packaging substrate.
[0076] Based on the same inventive concept, this application also proposes a circuit board, please refer to... Figure 2 and Figure 3 , Figure 2 This is a schematic diagram of one embodiment of the circuit board provided in this application. Figure 3 This is a schematic diagram of another embodiment of the circuit board provided in this application. The circuit board includes: a substrate 1, with a first surface 2 and a second surface 3 disposed opposite to each other on the substrate 1. A circuit pattern is formed on the first surface 2 and the second surface 3 of the substrate 1, and the first surface 2 and the second surface 3 of the substrate 1 are covered with ink; wherein, a groove compensation structure 4 formed by laser ablation is provided on the first surface 2 or the second surface 3. The non-circuit connection areas of the first surface 2 and the second surface 3 of the circuit board, as well as the groove compensation structure 4 provided on the first surface 2 or the second surface 3, are covered with ink.
[0077] The groove compensation structure 4 is disposed on the surface with a lower residual ink rate between the first surface 2 and the second surface 3.
[0078] The groove compensation structure 4 has a preset depth and a preset area; the preset depth of the groove compensation structure 4 is less than the thickness of the circuit board.
[0079] The above solution reduces the ink volume difference between the two opposing surfaces of the circuit board by using a groove compensation structure formed by laser ablation on the side with lower residual ink rate in the first and second surfaces of the circuit board substrate, thereby improving the circuit board warping problem.
[0080] In the several embodiments provided in this application, it should be understood that the disclosed methods and apparatus can be implemented in other ways. For example, the apparatus implementations described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection of devices or units may be electrical, mechanical, or other forms.
[0081] The above are merely embodiments of this application and do not limit the scope of this patent application. Any equivalent structural or procedural changes made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.
Claims
1. A method of processing a wiring board, characterized by, The processing method includes: The first residual ink rate of the first surface and the second residual ink rate of the second surface of the circuit board are obtained by means of the relative arrangement of the first surface and the second surface. Based on the first residual ink rate and the second residual ink rate, a predetermined number of groove compensation structures are formed on the first surface or the second surface. The predetermined number of groove compensation structures are filled with ink, and the first and second surfaces of the circuit board are covered. The circuit board coated with ink is then developed and cured.
2. The method for processing a circuit board according to claim 1, characterized in that, The step of obtaining the first residual ink rate of the first surface and the second residual ink rate of the second surface of the circuit board, which are relatively disposed on the circuit board, includes the following: Create circuit patterns on the first surface and the second surface.
3. The method for processing a circuit board according to claim 1, characterized in that, The step of obtaining the first residual ink rate of the first surface and the second residual ink rate of the second surface of the circuit board, which are relatively disposed on the circuit board, includes: Obtain the first area and the first ink coverage area of the first surface of the circuit board; The percentage of the area covered by the first ink to the first area is the first residual ink rate; Obtain the second area and the second ink coverage area of the second surface of the circuit board; The percentage of the area covered by the second ink to the second area is the second residual ink rate.
4. The method for processing a circuit board according to claim 1, characterized in that, The step of forming a predetermined number of groove compensation structures on the first surface or the second surface based on the first ink residual rate and the second ink residual rate includes: Calculate the preset number of the groove compensation structures; The predetermined number of groove compensation structures are formed on the surface with a lower residual ink rate between the first surface and the second surface.
5. The method for processing a circuit board according to claim 4, characterized in that, The step of calculating the preset number of groove compensation structures includes: The preset number of the groove compensation structure is calculated using the following formula (1): （1） Where N is the preset number of groove compensation structures, W1 is the first residual ink rate, W2 is the second residual ink rate, M1 is the circuit board area, M2 is the preset area of a single groove compensation structure, H1 is the preset ink thickness, and H2 is the preset depth of a single groove compensation structure.
6. The method for processing a circuit board according to claim 4, characterized in that, The step of forming a predetermined number of groove compensation structures on the surface with a lower residual ink rate between the first surface and the second surface includes: If the first residual ink rate is greater than the second residual ink rate, then the preset number of groove compensation structures are formed on the second surface of the circuit board. If the first residual ink rate is less than the second residual ink rate, then the preset number of groove compensation structures are formed on the first surface of the circuit board.
7. The method for processing a circuit board according to claim 4, characterized in that, The step of forming a predetermined number of groove compensation structures on the surface with a lower residual ink rate between the first surface and the second surface further includes: The predetermined number of groove compensation structures are formed on the surface with a lower residual ink rate between the first surface and the second surface by laser ablation.
8. The method for processing a circuit board according to claim 1, characterized in that, The preset depth of the groove compensation structure is less than the thickness of the circuit board.
9. A circuit board, characterized in that, The circuit board is manufactured by the processing method of any one of claims 1 to 8, and the circuit board comprises: A substrate, the substrate including a first surface and a second surface disposed opposite to each other; Circuit patterns are formed on the first and second surfaces of the substrate; The first and second surfaces of the substrate are covered with ink; The first surface or the second surface is provided with a groove compensation structure formed by laser ablation.
10. The circuit board according to claim 9, characterized in that, The groove compensation structure is disposed on the surface with a lower residual ink rate between the first surface and the second surface.
11. The circuit board according to claim 9, characterized in that, The depth of the groove compensation structure is a preset depth, and the area of a single groove compensation structure is a preset area; wherein, the preset depth of the groove compensation structure is less than the thickness of the circuit board.