A manufacturing process and equipment for producing flexible circuit boards using the FOB process.

Abstract

This application relates to the field of FPC manufacturing technology, and in particular to a manufacturing process and equipment for producing flexible circuit boards using the FOB process. The equipment includes an operating table, the surface of which is provided with a microporous negative pressure adsorption assembly, a moving arm assembly, and a laser windowing assembly. The microporous negative pressure adsorption assembly includes a positioning platform fixedly connected to the upper surface of the operating table. This application achieves uniform negative pressure adsorption over the entire area of ​​the flexible circuit board cover film by combining arrayed adsorption micropores with a negative pressure adsorption tank. This effectively eliminates internal stress in the material, avoids wrinkles and misalignment during processing, and ensures the stability of the laser windowing reference plane. By setting up a negative pressure linkage cylinder, a telescopic air cushion, and peripheral clamping rings, and using the negative pressure generated by a negative pressure pump on the negative pressure adsorption tank as a driving source, the center adsorption and fixation of the cover film and the adaptive edge clamping to prevent warping can be achieved simultaneously, solving problems such as cover film edge warping, windowing position misalignment, and edge burrs in traditional processes.

Description

Technical Field

[0001] This application relates to the field of FPC manufacturing technology, and in particular to a manufacturing process and equipment for producing flexible circuit boards using the FOB process. Background Technology

[0002] FOB process, as the core technology for direct welding and interconnection between FPC and rigid circuit board, can replace traditional BTB connectors, achieving thinner, more reliable, and lower-cost inter-board connections. It is a key link in the current manufacturing of high-density FPC.

[0003] In the FOB process, existing methods for processing window openings in cover films mostly involve mechanical drilling. However, these methods generally have processing defects: First, mechanical drilling is prone to producing burrs and bridge breakage in the cover film, making it unsuitable for ultra-thin cover films with smaller thicknesses. Second, traditional processing equipment lacks edge protection structures for the cover film, which can easily lead to edge warping and local arching during processing, resulting in window opening position deviation, insufficient edge perpendicularity, and low welding yield.

[0004] Therefore, this application provides a manufacturing process and equipment for producing flexible circuit boards using the FOB process. Summary of the Invention

[0005] The purpose of this application is to solve at least one technical problem raised in the background art.

[0006] This application provides a manufacturing equipment for flexible circuit boards made by FOB process, including an operating table, the surface of which is provided with a microporous negative pressure adsorption component, a moving arm component and a laser window opening component;

[0007] The microporous negative pressure adsorption assembly includes a positioning platform fixedly connected to the upper surface of the operating table. A negative pressure adsorption groove is formed on the upper surface of the positioning platform. An alumina ceramic substrate is fixedly connected directly above the negative pressure adsorption groove. A plurality of array adsorption micropores are formed on the surface of the alumina ceramic substrate. The plurality of array adsorption micropores are evenly distributed on the surface of the alumina ceramic substrate in a rectangular dot matrix.

[0008] The upper surface of the positioning platform is provided with a rectangular limiting groove, the position of which corresponds to the negative pressure adsorption groove. The inner wall of the rectangular limiting groove is provided with a peripheral pressing ring that can slide up and down. The peripheral pressing ring can simultaneously press the covering film and prevent the edges from lifting.

[0009] Preferably, four movable lifting rods are fixedly connected to the lower surface of the peripheral pressing ring. The four movable lifting rods are symmetrically distributed at the four corners of the lower surface of the peripheral pressing ring. Four negative pressure linkage cylinders are fixedly embedded inside the positioning platform. The four negative pressure linkage cylinders are symmetrically distributed in a rectangular array around the negative pressure adsorption tank. Linkage air pipes are fixedly embedded on the side of the negative pressure linkage cylinders. The end of the linkage air pipe away from the negative pressure linkage cylinder extends into the interior of the negative pressure adsorption tank.

[0010] Preferably, the position of the negative pressure linkage cylinder corresponds to that of the movable lifting rod, and a limiting through hole is provided at the top of the negative pressure linkage cylinder. The size of the limiting through hole matches that of the movable lifting rod. The bottom end of the movable lifting rod extends into the interior of the negative pressure linkage cylinder and is fixedly connected to a movable disc. The movable lifting rod is slidably connected to the inner wall of the limiting through hole.

[0011] Preferably, a telescopic air cushion is fixedly connected to the lower surface of the movable disc, the bottom end of the telescopic air cushion is fixedly connected to the inner bottom wall of the negative pressure linkage cylinder, the air inlet end of the linkage air pipe extends into the interior of the telescopic air cushion, and the linkage air pipe connects the telescopic air cushion and the interior of the negative pressure adsorption tank.

[0012] Preferably, the circumferential surface of the movable disc is slidably connected to the inner wall of the negative pressure linkage cylinder, a tension spring is sleeved on the surface of the movable lifting rod, the top end of the tension spring is fixedly connected to the inner top wall of the negative pressure linkage cylinder, and the bottom end of the tension spring is fixedly connected to the upper surface of the movable disc.

[0013] Preferably, the alumina ceramic substrate is tightly fitted and fixedly connected to the inner wall of the negative pressure adsorption tank, and an elastic pressure diaphragm is fixedly connected to the inner wall of the negative pressure adsorption tank. The elastic pressure diaphragm is located directly below the alumina ceramic substrate, and the port of the linkage air pipe is located below the elastic pressure diaphragm.

[0014] Preferably, the surface of the operating table is provided with an installation groove, and a negative pressure pump is fixedly installed on the inner wall of the installation groove. The input end of the negative pressure pump is fixedly connected to a negative pressure suction pipe. The end of the negative pressure suction pipe away from the negative pressure pump extends to the bottom of the negative pressure adsorption tank, and the air inlet end of the negative pressure suction pipe extends into the interior of the negative pressure adsorption tank.

[0015] Preferably, the movable arm assembly includes a first horizontal lead screw rotatably disposed inside the operating table, a first movable block threadedly connected to the surface of the first horizontal lead screw, support arms fixedly connected to the left and right ends of the first movable block, a transverse movable frame fixedly connected to the top ends of the two support arms, a second horizontal lead screw rotatably connected inside the transverse movable frame, a second movable block threadedly connected to the surface of the second horizontal lead screw, movable seats fixedly connected to both ends of the second movable block, a first drive motor embedded in the back of the operating table, the output end of the first drive motor fixedly connected to the rear end of the first horizontal lead screw, a second drive motor fixedly connected to one side of the transverse movable frame, and the output end of the second drive motor fixedly connected to one end of the second horizontal lead screw.

[0016] Preferably, the laser windowing assembly includes a CO2 laser, a coaxial optical path combining module, and a CCD camera, all fixedly mounted on the front of the movable base. The coaxial optical path combining module is a semi-transparent mirror, and the CO2 laser and the coaxial optical path combining module are coaxially distributed vertically. The CCD camera is fixedly mounted on the horizontal back of the coaxial optical path combining module, with the lens of the CCD camera facing the center of the semi-transparent mirror and perpendicular to the optical axis of the CO2 laser at 90°.

[0017] A manufacturing process for flexible circuit boards using FOB technology includes the following steps:

[0018] S1. After the equipment is started, the operator places the flexible circuit board cover film to be processed smoothly on the upper surface of the alumina ceramic substrate. Then, the negative pressure pump is started, and a vacuum operation is performed inside the negative pressure adsorption tank through the negative pressure suction pipe to create a stable negative pressure environment inside the negative pressure adsorption tank.

[0019] S2. Under negative pressure, the airflow generates a uniform adsorption force on the cover film through the array of micropores, causing the cover film to adhere tightly to the surface of the alumina ceramic substrate. At the same time, the negative pressure is synchronously transmitted to the interior of the surrounding negative pressure linkage cylinders through the linkage air pipe, causing the telescopic air cushion to contract under the action of air pressure difference, pulling the movable disc, movable lifting rod, and peripheral pressing ring downwards. The peripheral pressing ring slides smoothly down along the rectangular limiting groove, evenly pressing against the edge area of ​​the cover film.

[0020] S3. After adsorption and pressing are completed, the CCD camera acquires the alignment mark points on the surface of the cover film through the coaxial optical path beam combining module. The system calculates the position compensation value through image processing algorithms. The first drive motor and the second drive motor drive the first horizontal lead screw and the second horizontal lead screw respectively, moving the moving seat and the laser windowing assembly to the designated processing position. The CO2 laser emits light, using infrared laser to perform high-precision windowing processing on the cover film.

[0021] In summary, this application includes at least one of the following beneficial technical effects:

[0022] 1. This invention achieves uniform negative pressure adsorption of the flexible circuit board cover film by combining arrayed adsorption micropores with a negative pressure adsorption tank. This effectively eliminates internal stress in the material, avoids wrinkles and misalignment during processing, ensures the stability of the laser windowing reference plane, and significantly improves processing accuracy. By setting up a negative pressure linkage cylinder, a telescopic air cushion, and peripheral clamping rings, and using the negative pressure generated by the negative pressure pump on the negative pressure adsorption tank as the driving source, the center of the cover film can be simultaneously adsorbed and fixed, and the edges can be self-adaptively clamped to prevent warping. Under the action of negative pressure, the peripheral clamping rings uniformly press against the edge of the cover film, solving problems such as edge warping, windowing position misalignment, and edge burrs in traditional processes. The elastic air pressure diaphragm optimizes the negative pressure distribution, making the adsorption force distribution more balanced. It can be adapted to ultra-thin and conventional cover films, has stronger processing compatibility, shortens the processing time per piece, and greatly improves production efficiency.

[0023] 2. This invention adopts an optical path layout in which the CO2 laser and the coaxial optical path beam combining module are coaxially distributed, and the CCD camera is side-mounted and vertically coupled. This enables visual alignment and simultaneous observation of laser cutting without interfering with laser light output, ensuring high-precision FOB pad opening and meeting the manufacturing requirements of precision electronic equipment for high-density FPC. Attached Figure Description

[0024] Figure 1 This is a front view structural diagram of this application;

[0025] Figure 2 This is a schematic diagram of the rear view structure of this application;

[0026] Figure 3 for Figure 2 Enlarged structural diagram at point A;

[0027] Figure 4 This is a side view structural diagram of this application;

[0028] Figure 5 This is a top view of the positioning platform structure of this application;

[0029] Figure 6 for Figure 5 Enlarged structural diagram at point B;

[0030] Figure 7 This is a side sectional view of the positioning platform in this application;

[0031] Figure 8 This is a side cross-sectional view of the negative pressure adsorption tank in this application;

[0032] Figure 9 for Figure 8 Enlarged structural diagram at point C;

[0033] Figure 10 This is a side sectional view of the negative pressure linkage cylinder of this application.

[0034] Explanation of reference numerals in the attached figures:

[0035] 1. Operating table; 2. Microporous negative pressure adsorption assembly; 3. Moving arm assembly; 4. Laser window opening assembly;

[0036] 201. Positioning platform; 202. Negative pressure adsorption tank; 203. Alumina ceramic substrate; 204. Array adsorption micropores; 205. Rectangular limiting groove; 206. Peripheral clamping ring; 207. Movable lifting rod; 208. Negative pressure linkage cylinder; 209. Linkage air pipe; 210. Movable disc; 211. Telescopic air cushion; 212. Tension spring; 213. Elastic air pressure diaphragm; 214. Negative pressure pump; 215. Negative pressure suction pipe;

[0037] 301. First horizontal lead screw; 302. First moving block; 303. Support arm; 304. Lateral movable frame; 305. Second horizontal lead screw; 306. Second moving block; 307. Moving seat; 308. First drive motor; 309. Second drive motor;

[0038] 401. CO2 laser; 402. Coaxial optical path beam combining module; 403. CCD camera. Detailed Implementation

[0039] The following is in conjunction with the appendix Figure 1 To be continued Figure 10 This application discloses a manufacturing equipment for flexible circuit boards made using the FOB process, which includes an operating table 1. A microporous negative pressure adsorption component 2, a moving arm component 3, and a laser windowing component 4 are sequentially arranged on the upper surface of the operating table 1.

[0040] The microporous negative pressure adsorption assembly 2 is fixedly installed in the center area of ​​the upper surface of the operating table 1, used to position, adsorb, fix, and press the edges of the flexible circuit board cover film. The moving arm assembly 3 is installed across the upper part of the operating table 1, located above the microporous negative pressure adsorption assembly 2, used to drive the laser windowing assembly 4 to complete precise displacement in the X and Y axes, achieving full-area coverage processing. The laser windowing assembly 4 is fixedly installed at the front end of the moving arm assembly 3, vertically corresponding to the microporous negative pressure adsorption assembly 2, used to complete the high-precision laser windowing operation of the cover film required for the FOB process.

[0041] The microporous negative pressure adsorption component 2 includes a positioning platform 201, which is fixedly connected to the center of the upper surface of the operating table 1. It is made of integral aluminum alloy and features light weight, high rigidity, and uniform heat conduction. The positioning platform 201 provides a stable processing reference surface for the cover film.

[0042] The negative pressure adsorption tank 202 is located in the central area of ​​the upper surface of the positioning platform 201. It has a rectangular groove structure and the tank is sealed to ensure a stable and leak-free negative pressure environment. The negative pressure adsorption tank 202 is used to form a closed negative pressure space to provide a continuous and stable negative pressure adsorption force for the array adsorption micropores 204.

[0043] The alumina ceramic substrate 203 is fixedly connected above the negative pressure adsorption tank 202. The substrate is tightly fitted and sealed to the inner wall of the negative pressure adsorption tank 202 to prevent negative pressure leakage. The alumina ceramic substrate 203 has a low coefficient of thermal expansion and minimal deformation at high temperatures, which can effectively avoid processing reference shifts caused by temperature changes.

[0044] The array of micropores 204 are uniformly distributed on the surface of the alumina ceramic substrate 203 in a rectangular dot matrix pattern, with uniform pore size and spacing, enabling uniform adsorption of the cover film over the entire area. The array of micropores 204 are connected to the negative pressure adsorption tank 202, forming a stable adsorption force under negative pressure, eliminating internal stress in the cover film, and avoiding problems such as wrinkles, displacement, and arching during processing, thus significantly improving the stability of the laser windowing reference plane.

[0045] A rectangular limiting groove 205 is formed on the upper surface of the positioning platform 201, corresponding to the negative pressure adsorption groove 202, and distributed around the outer periphery of the negative pressure adsorption groove 202. The rectangular limiting groove 205 provides vertical sliding space and horizontal limiting constraint for the peripheral pressing ring 206, ensuring that the peripheral pressing ring 206 can only move in the vertical direction and does not experience horizontal offset, tilting, or jamming.

[0046] The peripheral clamping ring 206 is installed on the inner wall of the rectangular limiting groove 205 and can slide freely up and down in the vertical direction. The inner ring size of the peripheral clamping ring 206 matches the outer size of the alumina ceramic substrate 203, and there is no interference with the substrate during sliding. The peripheral clamping ring 206 can simultaneously and evenly press the edge of the cover film, realizing the triple functions of edge anti-lifting, edge positioning, and edge sealing, solving problems such as cover film edge lifting, window position misalignment, edge burrs, and insufficient cutting precision in traditional processes.

[0047] There are four movable lifting rods 207, which are fixedly connected to the four corners of the lower surface of the peripheral pressure ring 206, and are symmetrically and evenly distributed. The movable lifting rods 207 are arranged vertically to transmit the negative pressure linkage power below to the peripheral pressure ring 206, ensuring synchronous lifting at the four corners, uniform force distribution, and no tilting or jamming.

[0048] Four negative pressure linkage cylinders 208 are fixedly embedded inside the positioning platform 201, symmetrically distributed in a rectangular array around the negative pressure adsorption tank 202, with their positions corresponding vertically to the movable lifting rods 207. A limiting through hole is formed at the top of each negative pressure linkage cylinder 208, the size of which matches the movable lifting rod 207. The movable lifting rod 207 passes through the limiting through hole and slides against the hole wall, achieving vertical guiding and limiting.

[0049] The linkage air pipe 209 is fixedly embedded in the side of the negative pressure linkage cylinder 208, with one end extending into the interior of the negative pressure linkage cylinder 208 and connecting to the telescopic air cushion 211, and the other end extending into the interior of the negative pressure adsorption tank 202. The linkage air pipe 209 synchronously transmits the negative pressure inside the negative pressure adsorption tank 202 to the telescopic air cushion 211.

[0050] The movable disc 210 is fixedly connected to the bottom end of the movable lifting rod 207 and is located inside the negative pressure linkage cylinder 208. The circumferential surface of the movable disc 210 is slidably connected to the inner wall of the negative pressure linkage cylinder 208 to ensure a stable air pressure difference under negative pressure.

[0051] The telescopic air cushion 211 is fixedly connected to the lower surface of the movable disc 210, and its bottom end is fixedly connected to the inner bottom wall of the negative pressure linkage cylinder 208. Under negative pressure, the telescopic air cushion 211 can contract and deform, pulling the movable disc 210 and the movable lifting rod 207 downward, thereby causing the peripheral pressing ring 206 to press downward against the edge of the covering film; after the negative pressure is released, the telescopic air cushion 211 returns to its deformation and automatically resets in conjunction with the tension spring 212.

[0052] The tension spring 212 is sleeved on the surface of the movable lifting rod 207, with its top end fixedly connected to the inner top wall of the negative pressure linkage cylinder 208 and its bottom end fixedly connected to the upper surface of the movable disc 210. The tension spring 212 provides a reset force to ensure that the peripheral clamping ring 206 quickly and smoothly rises after the negative pressure disappears, without rubbing or scratching the covering film, thus improving the smoothness of material feeding.

[0053] The elastic pressure diaphragm 213 is fixedly connected to the inner wall of the negative pressure adsorption tank 202, located directly below the alumina ceramic substrate 203. The port of the linkage air pipe 209 is located below the elastic pressure diaphragm 213. The elastic pressure diaphragm 213 can optimize the negative pressure distribution efficiency, making the adsorption force distribution more balanced and stable, avoiding excessive local negative pressure that could cause deformation of the cover film, and is compatible with both ultra-thin and conventional cover films, offering greater processing compatibility.

[0054] The negative pressure pump 214 is fixedly installed inside the mounting slot opened on the surface of the operating table 1. The negative pressure suction pipe 215 is fixedly connected to the input end of the negative pressure pump 214, with one end connected to the negative pressure pump 214 and the other end extending directly below the negative pressure adsorption tank 202 and into the tank. The negative pressure pump 214 draws air from the inside of the negative pressure adsorption tank 202 through the negative pressure suction pipe 215 to form a stable negative pressure environment, providing a power source for adsorption and linkage pressing.

[0055] The movable arm assembly 3 includes a first horizontal lead screw 301, a first moving block 302, a support arm 303, a transverse movable frame 304, a second horizontal lead screw 305, a second moving block 306, a moving seat 307, a first drive motor 308, and a second drive motor 309.

[0056] The first horizontal lead screw 301 is rotatably mounted inside the operating table 1 and arranged along the Y-axis. The first moving block 302 is threadedly connected to the surface of the first horizontal lead screw 301 and moves back and forth along the Y-axis as the lead screw rotates.

[0057] There are two support arms 303, which are fixedly connected to the left and right ends of the first moving block 302 respectively and extend upward to support the horizontal movable frame 304. The horizontal movable frame 304 is fixedly connected to the top of the two support arms 303 and spans across the microporous negative pressure adsorption assembly 2 to provide an installation base for movement in the X-axis direction.

[0058] The second horizontal lead screw 305 is rotatably connected inside the transverse movable frame 304, arranged along the X-axis, and perpendicular to the first horizontal lead screw 301. The second moving block 306 is threadedly connected to the surface of the second horizontal lead screw 305 and moves left and right along the X-axis as the lead screw rotates. The moving seat 307 is fixedly connected to both ends of the second moving block 306 and is used to install the laser window opening assembly 4.

[0059] The first drive motor 308 is embedded in the back of the operating table 1, and its output end is fixedly connected to the rear end of the first horizontal lead screw 301, driving the first horizontal lead screw 301 to rotate and realize Y-axis positioning.

[0060] The second drive motor 309 is fixedly installed on one side of the transverse movable frame 304, and its output end is fixedly connected to one end of the second horizontal lead screw 305, driving the second horizontal lead screw 305 to rotate and achieve positioning in the X-axis direction. The two drive systems work together to achieve rapid and precise movement of the laser windowing assembly 4 at any position within the processing plane.

[0061] The laser windowing assembly 4 includes a CO2 laser 401, a coaxial optical path beam combining module 402, and a CCD camera 403. The CO2 laser 401 is fixedly installed on the front of the movable base 307 and uses 10.6μm infrared laser output. It can utilize the characteristics of strong absorption of laser by the medium and high reflection by copper to open the cover film by high temperature vaporization, automatically stop drilling at the copper layer, and not damage the underlying circuit.

[0062] The coaxial optical path beam combining module 402 is a semi-transparent and semi-reflective mirror, fixedly installed directly below the CO2 laser 401, and distributed vertically and coaxially with the CO2 laser 401. The semi-transparent and semi-reflective mirror allows the laser to penetrate vertically downwards, while reflecting the reflected light from the workpiece surface to the CCD camera 403, realizing simultaneous visual and laser observation.

[0063] The CCD camera 403 is fixedly mounted on the horizontal back of the coaxial optical path beam combiner module 402, with its lens facing the center of the semi-transparent mirror and perpendicular to the optical axis of the CO2 laser 401 at a 90° angle. This optical path layout avoids direct laser damage to the camera, while simultaneously enabling visual alignment and laser cutting observation at the same point. It offers high repeatability and ensures high-precision FOB pad opening quality, meeting the manufacturing requirements of high-density FPCs for high-end products such as 5G communications, optical modules, and automotive electronics.

[0064] A manufacturing process for flexible circuit boards using FOB technology includes the following steps:

[0065] S1. After the equipment is started, the operator places the flexible circuit board cover film to be processed smoothly on the upper surface of the alumina ceramic substrate 203. Then the negative pressure pump 214 is started, and the negative pressure suction pipe 215 is used to evacuate the inside of the negative pressure adsorption tank 202, so that a negative pressure environment is formed inside the negative pressure adsorption tank 202.

[0066] S2. Under negative pressure, the airflow through the array of micropores 204 generates a uniform adsorption force on the cover film, causing the cover film to adhere tightly to the surface of the alumina ceramic substrate 203, eliminating internal stress in the material, preventing wrinkles, shifts, and arching, and ensuring the stability of the laser windowing reference plane height. Simultaneously, the negative pressure is transmitted synchronously through the linkage air pipe 209 to the interior of the surrounding negative pressure linkage cylinders 208, causing the telescopic air cushion 211 to contract under the pressure difference, pulling the movable disc 210, the movable lifting rod 207, and the peripheral pressing ring 206 downwards. The peripheral pressing ring 206 slides smoothly down along the rectangular limiting groove 205, evenly pressing against the edge area of ​​the cover film to achieve edge pressing and anti-warping. The elastic air pressure diaphragm 213 assists in stabilizing the pressure under negative pressure, making the adsorption force distribution more even and suitable for ultra-thin cover film processing.

[0067] S3. After adsorption and pressing are completed, the CCD camera 403 acquires the alignment Mark points on the surface of the cover film through the coaxial optical path beam combining module 402, and the system calculates the position compensation value through image processing algorithms. The first drive motor 308 and the second drive motor 309 drive the first horizontal lead screw 301 and the second horizontal lead screw 305 to rotate, thereby moving the moving seat 307 and the laser windowing assembly 4 to the designated processing position. The CO2 laser 401 emits light, using 10.6μm infrared laser to perform high-precision windowing processing on the cover film.

Claims

1. A manufacturing apparatus for flexible circuit boards produced by FOB process, comprising an operating table (1), characterized in that, The surface of the operating table (1) is provided with a microporous negative pressure adsorption component (2), a moving arm component (3) and a laser window opening component (4). The microporous negative pressure adsorption component (2) includes a positioning platform (201) fixedly connected to the upper surface of the operating table (1). A negative pressure adsorption groove (202) is opened on the upper surface of the positioning platform (201). An alumina ceramic substrate (203) is fixedly connected directly above the negative pressure adsorption groove (202). A plurality of array adsorption micropores (204) are opened on the surface of the alumina ceramic substrate (203). The plurality of array adsorption micropores (204) are evenly distributed in a rectangular dot matrix on the surface of the alumina ceramic substrate (203). The upper surface of the positioning platform (201) is provided with a rectangular limiting groove (205), the position of which corresponds to the negative pressure adsorption groove (202). The inner wall of the rectangular limiting groove (205) is provided with a peripheral pressing ring (206) that can slide up and down. The peripheral pressing ring (206) can simultaneously press the covering film and prevent edge lifting.

2. The manufacturing equipment for producing flexible circuit boards using the FOB process according to claim 1, characterized in that, Four movable lifting rods (207) are fixedly connected to the lower surface of the peripheral pressing ring (206). The four movable lifting rods (207) are symmetrically distributed at the four corners of the lower surface of the peripheral pressing ring (206). Four negative pressure linkage cylinders (208) are fixedly embedded inside the positioning platform (201). The four negative pressure linkage cylinders (208) are symmetrically distributed in a rectangular array around the negative pressure adsorption tank (202). Linkage air pipes (209) are fixedly embedded on the side of the negative pressure linkage cylinders (208). The end of the linkage air pipe (209) away from the negative pressure linkage cylinder (208) extends into the interior of the negative pressure adsorption tank (202).

3. The manufacturing equipment for producing flexible circuit boards using the FOB process according to claim 2, characterized in that, The position of the negative pressure linkage cylinder (208) corresponds to that of the movable lifting rod (207), and a limit through hole is provided at the top of the negative pressure linkage cylinder (208). The size of the limit through hole matches that of the movable lifting rod (207). The bottom end of the movable lifting rod (207) extends into the interior of the negative pressure linkage cylinder (208) and is fixedly connected to a movable disc (210). The movable lifting rod (207) is slidably connected to the inner wall of the limit through hole.

4. The manufacturing equipment for producing flexible circuit boards using the FOB process according to claim 3, characterized in that, The lower surface of the movable disc (210) is fixedly connected to a telescopic air cushion (211). The bottom end of the telescopic air cushion (211) is fixedly connected to the inner bottom wall of the negative pressure linkage cylinder (208). The air inlet end of the linkage air pipe (209) extends into the interior of the telescopic air cushion (211). The linkage air pipe (209) connects the telescopic air cushion (211) and the interior of the negative pressure adsorption tank (202).

5. The manufacturing equipment for producing flexible circuit boards using the FOB process according to claim 4, characterized in that, The circumferential surface of the movable disc (210) is slidably connected to the inner wall of the negative pressure linkage cylinder (208). The surface of the movable lifting rod (207) is fitted with a tension spring (212). The top end of the tension spring (212) is fixedly connected to the inner top wall of the negative pressure linkage cylinder (208), and the bottom end of the tension spring (212) is fixedly connected to the upper surface of the movable disc (210).

6. The manufacturing equipment for producing flexible circuit boards using the FOB process according to claim 5, characterized in that, The alumina ceramic substrate (203) is tightly fitted and fixedly connected to the inner wall of the negative pressure adsorption tank (202) around its perimeter. An elastic air pressure diaphragm (213) is fixedly connected to the inner wall of the negative pressure adsorption tank (202). The elastic air pressure diaphragm (213) is located directly below the alumina ceramic substrate (203), and the port of the linkage air pipe (209) is located below the elastic air pressure diaphragm (213).

7. The manufacturing equipment for producing flexible circuit boards using the FOB process according to claim 6, characterized in that, The surface of the operating table (1) is provided with an installation groove, and a negative pressure pump (214) is fixedly installed on the inner wall of the installation groove. The input end of the negative pressure pump (214) is fixedly connected to a negative pressure suction pipe (215). The end of the negative pressure suction pipe (215) away from the negative pressure pump (214) extends to the bottom of the negative pressure adsorption tank (202), and the air inlet end of the negative pressure suction pipe (215) extends into the interior of the negative pressure adsorption tank (202).

8. The manufacturing equipment for producing flexible circuit boards using the FOB process according to claim 1, characterized in that, The movable arm assembly (3) includes a first horizontal lead screw (301) rotatably disposed inside the operating table (1), a first movable block (302) threadedly connected to the surface of the first horizontal lead screw (301), support arms (303) fixedly connected to the left and right ends of the first movable block (302), a transverse movable frame (304) fixedly connected to the top ends of the two support arms (303), a second horizontal lead screw (305) rotatably connected inside the transverse movable frame (304), a second movable block (306) threadedly connected to the surface of the second horizontal lead screw (305), and movable seats (307) fixedly connected to both ends of the second movable block (306). A first drive motor (308) is embedded and installed on the back of the operating table (1), the output end of the first drive motor (308) is fixedly connected to the rear end of the first horizontal lead screw (301), a second drive motor (309) is fixedly fixed to one side of the transverse movable frame (304), and the output end of the second drive motor (309) is fixedly connected to one end of the second horizontal lead screw (305).

9. The manufacturing equipment for producing flexible circuit boards using the FOB process according to claim 8, characterized in that, The laser window opening assembly (4) includes a CO2 laser (401), a coaxial optical path beam combining module (402), and a CCD camera (403) fixedly installed on the front of the movable base (307). The coaxial optical path beam combining module (402) is a semi-transparent and semi-reflective mirror, and the CO2 laser (401) and the coaxial optical path beam combining module (402) are coaxially distributed vertically. The CCD camera (403) is fixedly installed on the horizontal back of the coaxial optical path beam combining module (402). The lens of the CCD camera (403) faces the center of the semi-transparent and semi-reflective mirror and is perpendicular to the optical axis of the CO2 laser (401) at 90°.

10. A manufacturing process for flexible circuit boards fabricated using the FOB process, comprising the manufacturing equipment for fabricating flexible circuit boards using the FOB process as described in any one of claims 1-9, characterized in that, Includes the following steps: S1. After the equipment is started, the operator places the flexible circuit board cover film to be processed smoothly on the upper surface of the alumina ceramic substrate (203). Then the negative pressure pump (214) is started, and the negative pressure suction pipe (215) is used to perform a vacuum operation inside the negative pressure adsorption tank (202) to form a stable negative pressure environment inside the negative pressure adsorption tank (202). S2. Under negative pressure, the airflow generates a uniform adsorption force on the cover film through the array of adsorption micropores (204), causing the cover film to adhere tightly to the surface of the alumina ceramic substrate (203). At the same time, the negative pressure is synchronously transmitted to the inside of the surrounding negative pressure linkage cylinders (208) through the linkage air pipe (209), causing the telescopic air cushion (211) to contract under the action of air pressure difference, pulling the movable disc (210), the movable lifting rod (207), and the peripheral pressing ring (206) downward. The peripheral pressing ring (206) slides smoothly down along the rectangular limiting groove (205) and is evenly pressed against the edge area of ​​the cover film. S3. After adsorption and pressing are completed, the CCD camera (403) collects the alignment Mark points on the surface of the cover film through the coaxial optical path beam combining module (402), and the system calculates the position compensation value through image processing algorithm. The first drive motor (308) and the second drive motor (309) drive the first horizontal lead screw (301) and the second horizontal lead screw (305) to rotate, thereby moving the moving seat (307) and the laser window opening assembly (4) to the designated processing position. The CO2 laser (401) emits light and uses infrared laser to perform high-precision window opening processing on the cover film.

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