Micro-nano scale imprinting based fpc solder resist layer forming device

Abstract

This invention relates to the field of solder mask forming technology for printed circuit boards (PCBs), specifically disclosing a micro-nano-scale imprinting apparatus for forming FPC solder mask based on integrated circuit manufacturing. The apparatus includes a pillar, a second ring, and a third ring. A forming mechanism arranged in a ring array is disposed between the second and third rings, and the forming mechanism is rotatable around the center point of the pillar. An imprinting mechanism cooperates with the forming mechanism to imprint the FPC solder mask. This invention forms a ring channel between the second and third rings, allowing multiple forming mechanisms to circulate and transfer within the ring channel. It enables the placement, imprinting, and removal of the FPC substrate after imprinting, thereby facilitating cyclic imprinting of the FPC substrate and improving imprinting efficiency. Furthermore, it reduces contact between the FPC substrate and the external environment during transfer and imprinting, thereby reducing contamination of the FPC substrate and improving the imprinting effect.

Description

Technical Field

[0001] This invention relates to the field of solder resist forming technology for printed circuit boards, specifically to an FPC solder resist forming device based on micro-nano-level imprinting in integrated circuit manufacturing. Background Technology

[0002] The solder mask layer of FPC (Flexible Printed Circuit Board) is a key insulating structure that protects flexible circuits and standardizes the soldering process. It has functions such as preventing solder short circuits, protecting circuits, and providing electrical insulation.

[0003] Patent application CN120825884B discloses a micro-nano scale imprinting FPC solder resist layer forming device. It aims to form a multi-layer composite structure in a rigid base by combining a PI thin film layer, a silicone layer, a carbon fiber heating film layer and a micropore array. With the addition of a vacuum adsorption component, the FPC substrate can be adsorbed, flattened and preheated before imprinting, which fundamentally compensates for the deformation of the flexible substrate and provides a stable and flat reference plane for high-precision imprinting.

[0004] Based on existing technologies, the following problems exist: Existing FPC solder mask forming devices require evacuating the gas surrounding the FPC substrate before imprinting to create a vacuum or near-vacuum environment to improve the forming effect. However, after imprinting, the formed FPC substrate needs to be removed and replaced with an unimprinted FPC substrate. During this process, outside air enters the forming device, requiring another vacuum before the next imprint. Furthermore, atmospheric pressure allows outside gas to enter rapidly, slowing down subsequent vacuuming and reducing the efficiency of FPC solder mask imprinting. Referring to the aforementioned application, a cover is placed over the FPC substrate, and a vacuum is created before imprinting. After imprinting, the cover is opened, allowing a large amount of outside gas to rapidly enter the forming device, reducing the efficiency of subsequent vacuuming and hindering continuous imprinting of the FPC substrate, thus reducing forming efficiency. To address these issues, a micro-nano-level imprinting FPC solder mask forming device based on integrated circuit manufacturing is proposed. Summary of the Invention

[0005] To achieve the above objectives, the present invention provides the following technical solution: a micro-nano-level imprinting FPC solder resist layer forming apparatus based on integrated circuit manufacturing, comprising a forming machine body and a top plate fixed on the back of the forming machine body and extending to the top of the forming machine body, and further comprising: The first ring body is fixedly installed on the top of the molding machine body. The top of the first ring body is fixedly provided with a first ring plate. The lower end of the inner wall of the first ring body is fixedly provided with a circular plate, and the circular plate is fixedly connected to the top of the molding machine body. A column is fixedly mounted on the top of a circular plate. A second ring plate is fixedly mounted on the top of the column. The outer diameter of the second ring plate is smaller than the inner diameter of the first ring plate, so that an annular through groove is formed between the second ring plate and the first ring plate. A second ring body is fixedly mounted on the top of the first ring plate. A third ring body is rotatably mounted on the top of the second ring plate. A forming mechanism arranged in an annular array is provided between the second ring body and the third ring body. The forming mechanism can rotate around the center point of the column. The embossing mechanism is located on the top of the top plate. The embossing mechanism works in conjunction with the forming mechanism to emboss and form the solder mask layer of the FPC.

[0006] Furthermore, the inner diameter of the second ring is larger than the outer diameter of the third ring, so that an annular channel for the forming mechanism to rotate is formed between the second and third rings. The first ring plate, the second ring plate, the second ring body, the third ring body, the column, the circular plate, and the first ring body are all coaxially arranged. The first ring plate and the second ring plate are at the same horizontal height, and the second ring body and the third ring body are at the same horizontal height.

[0007] Furthermore, a cover plate is fixedly provided on the top of the second ring body, and the bottom of the cover plate is rotatably connected to the top of the third ring body. The top of the cover plate is provided with an installation through groove, and there are two installation through grooves, which are symmetrically arranged with respect to the center point of the cover plate. A first electric slide rail is fixedly installed on the top of the first ring plate and inside the second ring body, and a second electric slide rail is fixedly installed on the top of the second ring plate and outside the third ring body. Both the first and second electric slide rails are ring-shaped and are coaxially arranged with the first ring plate.

[0008] Furthermore, the molding mechanism includes: The frame is fitted onto the inner wall of the annular channel, and the side wall of the frame is dynamically sealed to the inner wall of the annular channel. The top of the frame is dynamically sealed to the bottom of the cover plate. The side wall of the frame is arc-shaped to fit against the inner wall of the annular channel. The bottom of the frame is fixedly connected to the sliding ends of the first electric slide rail and the second electric slide rail. The support seat is fitted inside the frame and fits against the inner wall of the frame and the inner wall of the annular channel. The mounting slot is adapted to the shape of the frame and the support seat.

[0009] Furthermore, the molding mechanism also includes: The positioning rod is fixedly installed at the bottom of the inner wall of the frame and near the corner of the frame. The top of the positioning rod is designed to be open. The bottom of the bearing seat is provided with a positioning groove that matches the positioning rod. The side wall of the positioning rod and the inner side wall of the positioning groove are designed to be dynamically sealed. The mounting slot is located on the top of the support and is used to place the FPC substrate and auxiliary layers.

[0010] Furthermore, the molding mechanism also includes: The top rod is detachably installed at the bottom of the bearing seat. The bottom of the top rod extends along the annular channel and the annular through groove to the bottom of the second ring plate. The bottom of the frame is provided with a through hole for fitting the top rod. The limiting slide groove is arranged in a ring array on the side wall of the top rod. The limiting slide groove contains limiting sliders. There are two sets of limiting sliders, one of which is fixedly connected to the inner wall of the frame.

[0011] Furthermore, the molding mechanism also includes: A retaining ring is sleeved on the side wall of the top rod and located at the bottom of the first ring plate and the second ring plate. The inner wall of the retaining ring is fixedly connected to another set of limiting sliders. The inner diameter of the retaining ring is larger than the spacing between the annular through grooves. The top of the retaining ring is sleeved with spaced balls, and the top of the balls contacts the bottom of the first ring plate and the second ring plate. A bottom ring is fixedly sleeved on the lower end of the side wall of the top rod, and a spring is sleeved on the side wall of the top rod between the bottom ring and the retaining ring; The first electric push rod is fixedly installed inside the molding machine body, and the telescopic shaft of the first electric push rod is fixedly equipped with a lifting plate.

[0012] Furthermore, the molding mechanism also includes: The first guide channel is provided at intervals on the inner side wall and the bottom inner wall of the mounting groove, and the bottom inner wall of the mounting groove is provided with a second guide channel. The first conduit is fixed inside the positioning rod. The bottom of the first conduit is fixed with a second conduit. The second conduit and the first conduit are connected to each other. The outer wall of the first conduit is provided with a first valve body.

[0013] Furthermore, the molding mechanism also includes: The third conduit is fixedly installed on the bottom inner wall of the second guide channel and connected to the second conduit located on the inner side of the top of the frame. The outer wall of the third conduit is fixedly provided with a second valve body. The fourth conduit is fixed on the outer wall of the second conduit on the side away from the third conduit. The second conduit is provided with a third valve body and a fourth valve body on the outer walls on both sides of the third conduit. The outer wall of the fourth conduit is provided with a fifth valve body. A rotary joint is fixed at the top center of the second ring plate. One end of the rotary joint is connected to the fourth conduit, and the other end of the rotary joint is fixed with the fifth conduit.

[0014] Furthermore, the top two sides of the molding machine body are respectively provided with a first mechanical claw and a second mechanical claw, which are used to remove the FPC substrate from the mounting slot or place the FPC substrate into the mounting slot, respectively. The imprinting mechanism includes: The second electric push rod is fixedly installed on one side of the top plate located at the top of the molding machine body, and the telescopic shaft of the second electric push rod extends to the bottom of the top plate. The sealing frame is fixedly installed at the bottom of the top plate and sleeved on the outside of the telescopic shaft of the second electric push rod. The bottom of the sealing frame and the top of the cover plate are designed to be sealed, and the bottom opening of the sealing frame can be sleeved on the outside of the mounting through groove. The piezoelectric ceramic displacement device is fixedly installed at the bottom of the telescopic shaft of the second electric push rod, and an imprint head is fixedly installed at the bottom of the telescopic shaft of the piezoelectric ceramic displacement device.

[0015] This invention provides a micro / nano-scale imprinting apparatus for forming FPC solder resist layers based on integrated circuit manufacturing. Compared with the prior art, it has the following advantages: 1. This invention forms an annular channel between the second and third ring bodies, allowing multiple molding mechanisms to circulate and transfer within the annular channel. This enables the placement, imprinting, and removal of the FPC substrate after imprinting, facilitating cyclic imprinting of the FPC substrate and improving imprinting efficiency. Furthermore, it reduces contact between the FPC substrate and the external environment during transfer and imprinting, thereby reducing contamination of the FPC substrate and improving the imprinting effect.

[0016] 2. This invention reduces the contact between external air and the FPC substrate by extracting the gas from the carrier, placing the FPC substrate in an environment with less or no external air, thereby further reducing the impact of external gas on the molding of the FPC substrate. By allowing the carrier to enter the sealing frame through the opening at the bottom of the sealing frame, the FPC substrate is not in contact with the external environment, thereby further reducing external environmental pollution. In addition, during subsequent vacuuming, there is less outside air around the FPC substrate, improving the efficiency of vacuuming and thus improving the efficiency of FPC substrate imprinting.

[0017] 3. The present invention creates a negative pressure between the positioning rod and the positioning groove by allowing suction to enter the first conduit along the second conduit, thereby facilitating the stable transfer of the FPC substrate. The rotation of the third ring facilitates the connection of the fourth conduit to the fifth conduit via a rotary joint, enabling the use of multiple molding mechanisms for air extraction and thus facilitating cyclic printing. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the overall side view structure of the present invention; Figure 3 This is a schematic diagram of the embossing mechanism, cover plate, and mounting groove structure of the present invention; Figure 4 This is a longitudinal sectional view of the circular plate, the first ring body, the first ring plate, the second ring body, and the cover plate of the present invention. Figure 5This is a schematic diagram of the longitudinal cross-sectional structure of the column and the third ring of the present invention; Figure 6 This is a schematic diagram of the cover plate, forming mechanism, second ring, third ring, and annular channel structure of the present invention; Figure 7 This is a longitudinal sectional view of the column, first ring plate, second ring plate, first ring body, second ring body, third ring body and circular plate of the present invention; Figure 8 This is a schematic diagram of the bottom structure of the first electric slide rail, the second electric slide rail, the forming mechanism, the fifth guide tube, and the rotary joint of the present invention. Figure 9 This is a schematic diagram of the molding mechanism structure of the present invention; Figure 10 This is a longitudinal sectional view of the support and frame structure of the present invention; Figure 11 This is a schematic diagram of the longitudinal cross-sectional structure of the positioning rod of the present invention; Figure 12 This is a longitudinal sectional view of the retaining ring and frame structure of the present invention; Figure 13 This is a schematic diagram of the first guide channel, the second guide channel, and the third guide tube structure of the present invention; Figure 14 This is a schematic diagram of the imprinting mechanism of the present invention.

[0019] The reference numerals in the above figures are as follows: 1. Molding body; 2. First ring body; 3. First mechanical claw; 4. Top plate; 5. Imprinting mechanism; 6. First ring plate; 7. Second ring body; 8. Second mechanical claw; 9. Cover plate; 10. Mounting slot; 11. Molding mechanism; 12. Third ring body; 13. Circular plate; 14. Column; 15. First electric slide rail; 16. Second electric slide rail; 17. First electric push rod; 18. Lifting plate; 19. Rotary joint; 20. Fifth guide tube; 21. Annular channel; 22. Second ring plate; 23. Annular slot; 51. Second electric actuator; 52. Sealing frame; 53. Imprint head; 54. Piezoelectric ceramic displacement device; 111. Frame; 112. Bearing seat; 113. First guide channel; 114. Mounting groove; 115. Fourth guide tube; 116. Retaining ring; 117. Top rod; 118. Bottom ring; 119. FPC substrate; 1191. Auxiliary layer; 1192. Positioning rod; 1193. First guide tube; 1194. Second guide tube; 1195. Third guide tube; 1196. Limiting groove; 1197. Ball bearing; 1198. Second guide channel. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] Example 1, please refer to Figures 1-7 A micro-nano-scale imprinting FPC solder resist layer forming apparatus based on integrated circuit manufacturing includes a forming body 1 and a top plate 4 fixedly disposed on the back of the forming body 1 and extending to the top of the forming body 1, and further includes: The first ring body 2 is fixedly disposed on the top of the molding machine body 1. The top of the first ring body 2 is fixedly provided with a first ring plate 6. The lower end of the inner wall of the first ring body 2 is fixedly provided with a circular plate 13, and the circular plate 13 is fixedly connected to the top of the molding machine body 1. A column 14 is fixedly mounted on the top of a circular plate 13. A second ring plate 22 is fixedly mounted on the top of the column 14. The outer diameter of the second ring plate 22 is smaller than the inner diameter of the first ring plate 6, so that an annular through groove 23 is formed between the second ring plate 22 and the first ring plate 6. A second ring body 7 is fixedly mounted on the top of the first ring plate 6. A third ring body 12 is rotatably mounted on the top of the second ring plate 22. A forming mechanism 11 arranged in an annular array is provided between the second ring body 7 and the third ring body 12. The forming mechanism 11 can rotate around the center point of the column 14. The embossing mechanism 5 is located on the top of the top plate 4. The embossing mechanism 5 cooperates with the forming mechanism 11 to emboss and form the FPC solder resist layer.

[0022] In practice, the FPC substrate 119 to be imprinted is placed in the mounting groove 114 by the second mechanical claw 8. Then, an external suction pipe is connected through the fifth conduit 20 to generate negative pressure between the positioning rod 1192 and the positioning groove, so that the bearing seat 112 is stably installed in the frame 111, thereby improving the stability of the FPC substrate 119 in the subsequent transfer process.

[0023] After the FPC substrate 119 is installed, the frame 111 and the FPC substrate 119 are transferred to the bottom of the imprinting mechanism 5 via the first electric slide rail 15 and the second electric slide rail 16. During the transfer process, since the side wall and bottom of the frame 111 are dynamically sealed with the inner side wall of the annular channel 21 and the bottom of the cover plate 9, respectively, the entry of external dust into the frame 111 during the transfer of the FPC substrate 119 is reduced.

[0024] After the FPC substrate 119 is transferred to the bottom of the imprinting mechanism 5, the lifting plate 18 is moved upward by the first electric push rod 17. At this time, the negative pressure limit between the positioning rod 1192 and the positioning groove is released by the first valve body. In the subsequent process of moving the bottom ring 118 and the top rod 117 upward, the carrier seat 112 can be moved upward along the mounting through groove 10. When the carrier seat 112 moves upward, it enters the sealing frame 52 through the bottom opening of the sealing frame 52, so that the FPC substrate 119 moves to the bottom of the imprinting head 53. Then, the imprinting head 53 is driven downward by the second electric push rod 51 and the piezoelectric ceramic displacement device 54 to imprint the ink on the surface of the FPC substrate 119. During this process, the FPC substrate 119 is transferred from the carrier seat 112 to the sealing frame 52, and the sealing frame 52 and the top of the cover plate 9 are sealed, thereby reducing the contact between the FPC substrate 119 and the external environment, thereby reducing the contamination of the FPC substrate 119 and improving the stability of the molding. Furthermore, before the imprinting, the gas in the frame 111 and the mounting groove 114 is extracted through the fifth conduit 20, so that the FPC substrate 119 is imprinted under vacuum, thereby improving the molding effect.

[0025] After one stamping cycle is completed, the first electric push rod 17 resets. Under the action of the spring, the support seat 112 moves downward into the frame 111 to re-enter the annular channel 21. Then, the first electric slide rail 15 and the second electric slide rail 16 drive the formed FPC substrate 119 to rotate, thereby transferring the unformed FPC substrate 119 to the bottom of the stamping head 53 for the next forming. As the first electric slide rail 15 and the second electric slide rail 16 drive the support seat 112 to rotate, and cooperate with the first mechanical claw 3 and the second mechanical claw 8, the FPC substrate 119 is repeatedly stamped, reducing the contact between the FPC substrate 119 and the external environment, thereby reducing the contamination of the FPC substrate 119 and improving the forming effect.

[0026] The auxiliary layer 1191 includes a rigid plate, a carbon fiber heating film layer, and a silicone layer arranged from bottom to top. The rigid plate is used to stably support the carbon fiber heating film layer, the silicone layer, and the FPC substrate 119 to ensure the stability of the imprinting. The carbon fiber heating film layer and the silicone layer serve heating and buffering functions, respectively, which are existing technologies and will not be described in detail here.

[0027] The inner diameter of the second ring body 7 is larger than the outer diameter of the third ring body 12, so that an annular channel 21 for the forming mechanism 11 to rotate is formed between the second ring body 7 and the third ring body 12. The first ring plate 6, the second ring plate 22, the second ring body 7, the third ring body 12, the column 14, the circular plate 13, and the first ring body 2 are all coaxially arranged. The first ring plate 6 and the second ring plate 22 are at the same horizontal height, and the second ring body 7 and the third ring body 12 are at the same horizontal height.

[0028] The top of the second ring body 7 is fixedly provided with a cover plate 9, the bottom of the cover plate 9 is rotatably connected to the top of the third ring body 12, and the top of the cover plate 9 is provided with an installation through groove 10. There are two installation through grooves 10, which are symmetrically arranged with respect to the center point of the cover plate 9. A first electric slide rail 15 is fixedly installed on the top of the first ring plate 6 and inside the second ring body 7. A second electric slide rail 16 is fixedly installed on the top of the second ring plate 22 and outside the third ring body 12. Both the first electric slide rail 15 and the second electric slide rail 16 are ring-shaped and are coaxial with the first ring plate 6.

[0029] In practical implementation, an annular channel 21 is formed between the second ring body 7 and the third ring body 12 to facilitate the transfer of the ring-arrayed molding mechanism 11 within the annular channel 21. This facilitates the placement, imprinting, and removal of the FPC substrate 119 after imprinting, and the process is repeated to continuously imprint the FPC substrate 119, thereby improving the imprinting efficiency. While the top of the annular channel 21 is sealed by the cover plate 9, only two mounting slots 10 are left open for the placement, imprinting, and removal of the FPC substrate 119 after imprinting. This reduces the contact between the FPC substrate 119 and the external environment during transfer and imprinting, thereby reducing contamination of the FPC substrate 119 and improving the imprinting effect.

[0030] The first electric slide rail 15 and the second electric slide rail 16 are coaxially arranged, which facilitates the rotation of the frame 111 from two positions at the bottom of the frame 111, improves the stability of the transfer of the frame 111 and the FPC substrate 119, and facilitates the subsequent vertical movement of the support seat 112 of the molding mechanism 11 and the FPC substrate 119 by the first electric push rod 17 along the first electric slide rail 15 and the second electric slide rail 16.

[0031] By fixing the cover plate 9 to the second ring body 7 and rotatably connecting it to the third ring body 12, the stability of the cover plate 9 installation is ensured, and the top of the cover plate 9 is always sealed to the bottom of the sealing frame 52, so that the sealing frame 52 can seal one of the mounting slots 10. This reduces the contact between the FPC substrate 119 and the external environment during the stamping process, thus reducing contamination of the FPC substrate 119. By rotatably connecting the third ring body 12 to the second ring plate 22, the gas can be stably transported when the fourth conduit 115 of the subsequent molding mechanism 11 rotates.

[0032] Please see Figure 1 , Figure 2 and Figure 14 The top two sides of the molding machine body 1 are respectively provided with a first mechanical claw 3 and a second mechanical claw 8, which are used to remove the FPC substrate 119 from the mounting groove 114 or place the FPC substrate 119 into the mounting groove 114, respectively. The imprinting mechanism 5 includes: The second electric push rod 51 is fixedly installed on one side of the top plate 4 located at the top of the molding machine body 1, and the telescopic shaft of the second electric push rod 51 extends to the bottom of the top plate 4. The sealing frame 52 is fixedly installed at the bottom of the top plate 4 and sleeved on the outside of the telescopic shaft of the second electric push rod 51. The bottom of the sealing frame 52 and the top of the cover plate 9 are designed to be sealed, and the bottom opening of the sealing frame 52 can be sleeved on the outside of the mounting through groove 10. The piezoelectric ceramic displacement device 54 is fixedly installed at the bottom of the telescopic shaft of the second electric push rod 51, and the bottom of the telescopic shaft of the piezoelectric ceramic displacement device 54 is fixedly provided with an imprint head 53.

[0033] In practice, during the imprinting process, the imprinting head 53 is first moved down to the approximate position by the second electric push rod 51, and then the imprinting head 53 is adjusted at the micro-nano level by the piezoelectric ceramic displacement device 54, thereby imprinting the FPC substrate 119 at the micro-nano level.

[0034] By ensuring that the bottom of the sealing frame 52 is always sealed to the top of the cover plate 9, and by ensuring that the bottom opening of the sealing frame 52 is located outside the mounting groove 10, the subsequent use of the FPC substrate 119 is not affected while sealing is achieved.

[0035] Example 2, please refer to Figures 8-13 The difference between this embodiment and Embodiment 1 lies in that the molding mechanism 11 includes: The frame 111 is fitted onto the inner wall of the annular channel 21, and the side wall of the frame 111 is dynamically sealed to the inner wall of the annular channel 21. The top of the frame 111 is dynamically sealed to the bottom of the cover plate 9. The side wall of the frame 111 is arc-shaped to fit against the inner wall of the annular channel 21. The bottom of the frame 111 is fixedly connected to the sliding end of the first electric slide rail 15 and the second electric slide rail 16. The support seat 112 is fitted inside the frame 111 and fits against the inner wall of the frame 111 and the inner wall of the annular channel 21. The mounting groove 10 is adapted to the shape of the frame 111 and the support seat 112.

[0036] The molding mechanism 11 also includes: The positioning rod 1192 is fixedly installed at the bottom of the inner wall of the frame 111 and near the end corner of the frame 111. The top of the positioning rod 1192 is designed to be open. The bottom of the bearing seat 112 is provided with a positioning groove that is compatible with the positioning rod 1192. The side wall of the positioning rod 1192 and the inner side wall of the positioning groove are designed to be dynamically sealed. Mounting slot 114 is provided on the top of support 112 for placing FPC substrate 119 and auxiliary layer 1191.

[0037] The molding mechanism 11 also includes: The top rod 117 is detachably installed at the bottom of the bearing seat 112. The bottom of the top rod 117 extends along the annular channel 21 and the annular through groove 23 to the bottom of the second ring plate 22. The bottom of the frame 111 is provided with a through hole for fitting the top rod 117. The limiting groove 1196 is arranged in a ring array on the side wall of the top rod 117. The limiting slider is placed inside the limiting groove 1196. There are two sets of limiting sliders, one of which is fixedly connected to the inner wall of the frame 111.

[0038] The molding mechanism 11 also includes: A retaining ring 116 is sleeved on the side wall of the top rod 117 and located at the bottom of the first ring plate 6 and the second ring plate 22. The inner wall of the retaining ring 116 is fixedly connected to another set of limiting sliders. The inner diameter of the retaining ring 116 is larger than the spacing between the annular through grooves 23. The top of the retaining ring 116 is sleeved with spaced-apart balls 1197. The top of the balls 1197 contacts the bottom of the first ring plate 6 and the second ring plate 22. The bottom ring 118 is fixedly sleeved on the lower end of the side wall of the top rod 117, and a spring is sleeved on the side wall of the top rod 117 between the bottom ring 118 and the retaining ring 116. The first electric push rod 17 is fixedly installed inside the molding machine body 1, and the telescopic shaft of the first electric push rod 17 is fixedly provided with a lifting plate 18.

[0039] The molding mechanism 11 also includes: The first guide channel 113 is spaced apart on the inner side wall and the bottom inner wall of the mounting groove 114, and the bottom inner wall of the mounting groove 114 is provided with a second guide channel 1198. The first conduit 1193 is fixed inside the positioning rod 1192. The bottom of the first conduit 1193 is fixedly provided with the second conduit 1194. The second conduit 1194 and the first conduit 1193 are interconnected. The outer wall of the first conduit 1193 is provided with the first valve body.

[0040] The molding mechanism 11 also includes: The third conduit 1195 is fixedly disposed on the bottom inner wall of the second guide channel 1198 and connected to the second conduit 1194 located on the top inner side of the frame 111. The outer wall of the third conduit 1195 is fixedly provided with a second valve body. The fourth conduit 115 is fixedly disposed on the outer wall of the second conduit 1194 away from the third conduit 1195. The second conduit 1194 is provided with a third valve body and a fourth valve body on the outer walls on both sides of the third conduit 1195. The outer wall of the fourth conduit 115 is provided with a fifth valve body. A rotary joint 19 is fixedly disposed at the top center of the second ring plate 22. One end of the rotary joint 19 is connected to the fourth conduit 115, and the other end of the rotary joint 19 is fixedly disposed with the fifth conduit 20.

[0041] In specific implementation, the frame 111, the support seat 112 and the FPC substrate 119 are driven to rotate along the annular channel 21 by the first electric slide rail 15 and the second electric slide rail 16. Since the side wall and top of the frame 111 are dynamically sealed with the inner wall of the annular channel 21 and the bottom of the cover plate 9, the contact between the external gas and the FPC substrate 119 is reduced while transferring the FPC substrate 119, which facilitates the cyclic pressing and molding of the FPC substrate 119 and improves the pressing effect.

[0042] After the FPC substrate 119 is placed in the carrier 112, the suction line can be connected to the fifth conduit 20. The suction force is transmitted along the fifth conduit 20 and the rotary joint 19 to the fourth conduit 115 connected to the corresponding molding mechanism 11. The fifth valve body corresponding to the molding mechanism 11 is opened, so that the suction force enters the designated fourth conduit 115 along the fifth conduit 20. The second conduit 1194 is connected through the third valve body and the fourth valve body, so that the suction force enters the first conduit 1193 along the second conduit 1194, so that a negative pressure is generated between the positioning rod 1192 and the positioning groove, thereby facilitating the stable transport of the FPC substrate 119.

[0043] During the transfer of the FPC substrate 119, the second valve body is opened, allowing suction to be transmitted through the fourth conduit 115 to the third conduit 1195. Subsequently, the gas in the carrier 112 is extracted along the second guide groove 1198 and the first guide groove 113, thereby reducing the contact between external air and the FPC substrate 119 and placing the FPC substrate 119 in an environment with less external air or a vacuum, further reducing the impact of external gas on the molding of the FPC substrate 119. After the FPC substrate 119 is transferred to the bottom of the imprinting mechanism 5, the lifting plate 18 is moved upward by the first electric push rod 17, thereby pushing the bottom ring 118 and the top rod 117 to move upward against the pressure of the spring. When the top rod 117 moves, it drives the support seat 112 to move upward, so that the support seat 112 enters the sealing frame 52 through the opening at the bottom of the sealing frame 52. During this process, the FPC substrate 119 does not come into contact with the external environment, thereby further reducing the pollution of the external environment. In addition, during the subsequent vacuuming, there is less outside air around the FPC substrate 119, which improves the efficiency of vacuuming and thus improves the efficiency of the FPC substrate 119 imprinting.

[0044] The top rod 117 is connected to the frame 111 by the limiting slide groove 1196 and the limiting slider, which makes it easy for the frame 111 to drive the top rod 117 to move, without affecting the vertical movement of the top rod 117.

[0045] The friction between the retaining ring 116 and the first ring plate 6 and the second ring plate 22 is reduced by the ball bearing 1197, which makes it easier to rotate with the frame 111.

[0046] When the support seat 112 is reset downwards, the speed at which the first electric push rod 17 descends is controlled. Under the action of the spring, the first electric push rod 17 drives the lifting plate 18 to stably resist the descent of the support seat 112, thereby improving stability.

[0047] By sealing the bottom of the first ring body 2 with a circular plate 13, the space formed by the first ring body 2, circular plate 13, first ring plate 6, second ring plate 22, second ring body 7, third ring body 12 and cover plate 9 is connected to the external environment only through two mounting slots 10. One of the mounting slots 10 is sealed by a sealing frame 52, so that the annular channel 21 is connected to the external environment only through one mounting slot 10. This reduces the amount of external gas entering the annular channel 21. In actual design, the frames 111 arranged in a ring array can be connected end to end, so that there is no gap between two adjacent frames 111. That is, during the rotation of the frame 111, the gas from the external environment only enters the carrier 112 through the mounting slot 10. After the FPC substrate 119 is placed, it will no longer come into contact with the external gas during the transfer process, further reducing contact with the external environment and thus reducing the contamination of the FPC substrate 119.

[0048] The telescopic shaft of the first electric push rod 17 and the bottom of the circular plate 13 are designed to be dynamically sealed, and the outer wall of the fifth conduit 20 and the circular plate 13 are designed to be sealed, so as to ensure the airtightness of the space above the circular plate 13.

[0049] In actual design, UV curing lamps can be arranged inside the frame 111 to cure the ink. This is existing technology and is not shown in the figure, so it will not be described in detail here.

[0050] The electronic components, such as the first electric push rod 17 of the present invention, are all connected to the controller and external power supply via wires. This is prior art and will not be described in detail here.

[0051] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0052] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0053] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A micro-nano scale imprinting FPC solder resist forming device based on integrated circuit manufacturing, comprising a forming machine body and a top plate fixed on the back of the forming machine body and extending to the top of the forming machine body, characterized in that, Also includes: The first ring body is fixedly installed on the top of the molding machine body. The top of the first ring body is fixedly provided with a first ring plate. The lower end of the inner wall of the first ring body is fixedly provided with a circular plate, and the circular plate is fixedly connected to the top of the molding machine body. A column is fixedly mounted on the top of a circular plate. A second ring plate is fixedly mounted on the top of the column. The outer diameter of the second ring plate is smaller than the inner diameter of the first ring plate, so that an annular through groove is formed between the second ring plate and the first ring plate. A second ring body is fixedly mounted on the top of the first ring plate. A third ring body is rotatably mounted on the top of the second ring plate. A forming mechanism arranged in an annular array is provided between the second ring body and the third ring body. The forming mechanism can rotate around the center point of the column. The embossing mechanism is located on the top of the top plate. The embossing mechanism works in conjunction with the forming mechanism to emboss and form the solder mask layer of the FPC.

2. The FPC solder resist layer forming apparatus based on micro-nano-level imprinting in integrated circuit manufacturing according to claim 1, characterized in that, The inner diameter of the second ring is larger than the outer diameter of the third ring, so that an annular channel for the forming mechanism to rotate is formed between the second and third rings; The first ring plate, the second ring plate, the second ring body, the third ring body, the column, the circular plate, and the first ring body are all coaxially arranged. The first ring plate and the second ring plate are at the same horizontal height, and the second ring body and the third ring body are at the same horizontal height.

3. The FPC solder resist layer forming apparatus based on micro-nano-level imprinting in integrated circuit manufacturing according to claim 2, characterized in that, The top of the second ring body is fixedly provided with a cover plate, the bottom of the cover plate is rotatably connected to the top of the third ring body, and the top of the cover plate is provided with an installation through groove. There are two installation through grooves, which are symmetrically arranged with respect to the center point of the cover plate. A first electric slide rail is fixedly installed on the top of the first ring plate and inside the second ring body, and a second electric slide rail is fixedly installed on the top of the second ring plate and outside the third ring body. Both the first and second electric slide rails are ring-shaped and are coaxially arranged with the first ring plate.

4. The FPC solder resist layer forming apparatus based on micro-nano-level imprinting of integrated circuit manufacturing according to claim 3, characterized in that, The molding mechanism includes: The frame is fitted onto the inner wall of the annular channel, and the side wall of the frame is dynamically sealed to the inner wall of the annular channel. The top of the frame is dynamically sealed to the bottom of the cover plate. The side wall of the frame is arc-shaped to fit against the inner wall of the annular channel. The bottom of the frame is fixedly connected to the sliding ends of the first electric slide rail and the second electric slide rail. The support seat is fitted inside the frame and fits against the inner wall of the frame and the inner wall of the annular channel. The mounting slot is adapted to the shape of the frame and the support seat.

5. The FPC solder resist layer forming apparatus based on micro-nano-level imprinting of integrated circuit manufacturing according to claim 4, characterized in that, The molding mechanism further includes: The positioning rod is fixedly installed at the bottom of the inner wall of the frame and near the corner of the frame. The top of the positioning rod is designed to be open. The bottom of the bearing seat is provided with a positioning groove that matches the positioning rod. The side wall of the positioning rod and the inner side wall of the positioning groove are designed to be dynamically sealed. The mounting slot is located on the top of the support and is used to place the FPC substrate and auxiliary layers.

6. The FPC solder resist layer forming apparatus based on micro-nano-level imprinting of integrated circuit manufacturing according to claim 5, characterized in that, The molding mechanism further includes: The top rod is detachably installed at the bottom of the bearing seat. The bottom of the top rod extends along the annular channel and the annular through groove to the bottom of the second ring plate. The bottom of the frame is provided with a through hole for fitting the top rod. The limiting slide groove is arranged in a ring array on the side wall of the top rod. The limiting slide groove contains limiting sliders. There are two sets of limiting sliders, one of which is fixedly connected to the inner wall of the frame.

7. The FPC solder resist layer forming apparatus based on micro-nano-level imprinting in integrated circuit manufacturing according to claim 6, characterized in that, The molding mechanism further includes: A retaining ring is sleeved on the side wall of the top rod and located at the bottom of the first ring plate and the second ring plate. The inner wall of the retaining ring is fixedly connected to another set of limiting sliders. The inner diameter of the retaining ring is larger than the spacing between the annular through grooves. The top of the retaining ring is sleeved with spaced balls, and the top of the balls contacts the bottom of the first ring plate and the second ring plate. A bottom ring is fixedly sleeved on the lower end of the side wall of the top rod, and a spring is sleeved on the side wall of the top rod between the bottom ring and the retaining ring; The first electric push rod is fixedly installed inside the molding machine body, and the telescopic shaft of the first electric push rod is fixedly equipped with a lifting plate.

8. The FPC solder resist layer forming apparatus based on micro-nano-scale imprinting of integrated circuit manufacturing according to claim 5, characterized in that, The molding mechanism further includes: The first guide channel is provided at intervals on the inner side wall and the bottom inner wall of the mounting groove, and the bottom inner wall of the mounting groove is provided with a second guide channel. The first conduit is fixed inside the positioning rod. The bottom of the first conduit is fixed with a second conduit. The second conduit and the first conduit are connected to each other. The outer wall of the first conduit is provided with a first valve body.

9. The FPC solder resist layer forming apparatus based on micro-nano-scale imprinting of integrated circuit manufacturing according to claim 8, characterized in that, The molding mechanism further includes: The third conduit is fixedly installed on the bottom inner wall of the second guide channel and connected to the second conduit located on the inner side of the top of the frame. The outer wall of the third conduit is fixedly provided with a second valve body. The fourth conduit is fixed on the outer wall of the second conduit on the side away from the third conduit. The second conduit is provided with a third valve body and a fourth valve body on the outer walls on both sides of the third conduit. The outer wall of the fourth conduit is provided with a fifth valve body. A rotary joint is fixed at the top center of the second ring plate. One end of the rotary joint is connected to the fourth conduit, and the other end of the rotary joint is fixed with the fifth conduit.

10. The FPC solder resist layer forming apparatus based on micro-nano-scale imprinting of integrated circuit manufacturing according to claim 5, characterized in that, The top two sides of the molding machine body are respectively provided with a first mechanical claw and a second mechanical claw, which are used to remove the FPC substrate from the mounting slot or place the FPC substrate into the mounting slot, respectively. The imprinting mechanism includes: The second electric push rod is fixedly installed on one side of the top plate located at the top of the molding machine body, and the telescopic shaft of the second electric push rod extends to the bottom of the top plate. The sealing frame is fixedly installed at the bottom of the top plate and sleeved on the outside of the telescopic shaft of the second electric push rod. The bottom of the sealing frame and the top of the cover plate are designed to be sealed, and the bottom opening of the sealing frame can be sleeved on the outside of the mounting through groove. A piezoelectric ceramic displacement device is fixedly installed at the bottom of the telescopic shaft of the second electric push rod, and an imprint head is fixedly installed at the bottom of the telescopic shaft of the piezoelectric ceramic displacement device.

Images