A ceramic circuit board film hole metalization wall hanging device

Abstract

This invention relates to a ceramic circuit board membrane hole metallization wall-mounting device, comprising a ceramic substrate, with sealing frames at both the upper and lower ends of the ceramic substrate. A moving component for driving the relative movement of the sealing frames is provided at one end of each sealing frame. A sealing strip is provided at the contact point between the sealing frame and the ceramic substrate. A pressurizing component is provided inside the sealing frame. A negative pressure pipe is provided on the sealing frame at the lower end of the ceramic substrate. The pressurizing components at both ends can drive the wall-mounting liquid within the membrane holes of the ceramic substrate to repeatedly move and adhere within the membrane holes. This invention, by using the pressurizing components at both ends to drive the wall-mounting liquid within the membrane holes of the ceramic substrate to repeatedly move and adhere within the membrane holes, makes the slurry adhere more firmly and uniformly within the membrane holes.

Description

Technical Field

[0001] This invention relates to the field of diaphragm hole wall metallization production technology, specifically to a wall-mounted device for diaphragm hole metallization of ceramic circuit boards. Background Technology

[0002] Ceramic surface metallization is a crucial step in the practical application of ceramic substrates in electronic packaging. The wettability of metal on the ceramic surface at high temperatures determines the bonding force between the metal and the ceramic, and good bonding force is an important guarantee for the stability of packaging performance.

[0003] A Chinese invention patent with application publication number CN115379664B discloses a production device for metallizing the perforated walls of a diaphragm, including a frame and a negative pressure platform. The frame contains rotating chains a and b, with several sets of supporting components between them. A conveying component, including a conveying roller a, is positioned above the negative pressure platform. A lifting component is positioned above the conveying component, and a cutting component is positioned along the output path of the conveying component. The negative pressure platform is used to absorb the slurry from the small holes on the diaphragm. The lifting component is used to press the diaphragm on the supporting components downwards onto the breathable barrier layer, and the negative pressure platform absorbs the slurry from the small holes onto the breathable barrier layer. The conveying roller a is used to pull the breathable barrier layer. The cutting component is used to cut the breathable barrier layer printed with slurry when the conveying roller a detaches from the breathable barrier layer.

[0004] However, the inventors discovered that in actual operation, the paste is squeezed into the membrane hole of the ceramic substrate by a printing machine, and then the paste in the membrane hole is sucked out by a negative pressure suction device so that the paste adheres to the inner wall of the membrane hole. However, the adhesion effect of a single application is limited, resulting in the paste not being able to adhere evenly in the membrane hole. Based on this, we proposed a ceramic circuit board membrane hole metallization wall-mounted device. Summary of the Invention

[0005] The purpose of this invention is to address the shortcomings of existing technologies by providing sealing frames at both the upper and lower ends of a ceramic substrate. One end of each sealing frame is equipped with a moving component that drives the relative movement of the sealing frame. A sealing strip is provided at the point where the sealing frame abuts against the ceramic substrate. A pressurizing component is provided inside the sealing frame. A negative pressure pipe is provided on the sealing frame at the lower end of the ceramic substrate. This invention uses the pressurizing components at both ends to drive the wall liquid in the membrane pores of the ceramic substrate to move and adhere repeatedly within the membrane pores, making the slurry adhere more firmly and evenly within the membrane pores.

[0006] To address the aforementioned technical problems, the present invention adopts the following technical solution:

[0007] A ceramic circuit board membrane hole metallization wall-mounting device includes a ceramic substrate, with sealing frames at both the upper and lower ends of the ceramic substrate. A moving component for driving the relative movement of the sealing frame is provided at one end of the sealing frame. A sealing strip is provided at the contact point between the sealing frame and the ceramic substrate. A pressurizing component is provided inside the sealing frame. A negative pressure pipe is provided on the sealing frame at the lower end of the ceramic substrate. The pressurizing components at both ends can drive the wall-mounting liquid in the membrane hole of the ceramic substrate to move and adhere repeatedly within the membrane hole.

[0008] As a preferred embodiment, the movable component includes a support frame, a threaded rod rotatably disposed within the support frame, a first motor for driving the threaded rod to rotate, a fixed block rotatably disposed on the threaded rod, a slide groove disposed on the inner side of the support frame, and a slider disposed at the end of the fixed block that cooperates with the slide groove.

[0009] As a preferred embodiment, the upper and lower ends of the threaded rod are respectively provided with thread a and thread b, with thread a being arranged in opposite directions to thread b.

[0010] As a preferred embodiment, the pressurizing assembly includes a piston plate slidably disposed within a sealing frame, a hole plate disposed at the lower end of the sealing frame, a support rod disposed on the piston plate, a column disposed on the support rod, a sleeve plate disposed on the other side of the sealing frame, a pressure plate rotatably disposed on the sleeve plate, a gear disposed on the outer side of the pressure plate, and a servo motor for driving the pressure plate to rotate.

[0011] As a preferred embodiment, the pressure plate is provided with an arc-shaped groove, and the arc-shaped groove is provided with a downward pressing groove, with the downward pressing grooves on the upper and lower ends of the pressure plate arranged in the same direction.

[0012] As a preferred embodiment, a rectangular groove is provided on one side of the sealing frame, and the support rod is slidably disposed within the rectangular groove.

[0013] As a preferred embodiment, the horizontal position of the orifice plate is lower than the horizontal position of the sealing strip, and the sealing strip is squeezed to be at the same horizontal line as the orifice plate.

[0014] As another preferred embodiment, the perforated plate is aligned with the membrane pores of the ceramic substrate, and the perforated plate is tightly fitted to the ceramic substrate.

[0015] The beneficial effects of this invention are:

[0016] 1. In this invention, the piston plates at the upper and lower ends are alternately driven by the extrusion assembly to pressurize the gas in the sealing frame, thereby driving the slurry in the membrane hole to move back and forth between the membrane hole and the orifice plate, so that the slurry can be repeatedly adhered to the inner wall of the membrane hole, making the slurry more firmly and uniformly attached to the inner wall of the membrane hole.

[0017] In summary, this equipment has the advantages of uniform and firm wall mounting, and is particularly suitable for the field of diaphragm hole wall metallization production technology. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A schematic diagram of the isometric structure of a ceramic circuit board film hole metallization wall-mounted device;

[0020] Figure 2 A schematic diagram of the isometric structure of a ceramic circuit board film hole metallization wall-mounted device;

[0021] Figure 3 This is an isometric structural diagram of the moving component;

[0022] Figure 4 A schematic diagram of the isometric structure of the sealing frame.

[0023] Figure 5 A cross-sectional view of the pressurization component;

[0024] Figure 6 This is a schematic diagram of the structure of the perforated plate and the ceramic substrate;

[0025] Figure 7 Diagram showing the operating status of the pressurization component;

[0026] Figure 8 for Figure 7 Enlarged view of point A in the middle;

[0027] Figure 9 Diagram showing the operating status of the pressurization component;

[0028] In the diagram: 1-Ceramic substrate; 2-Sealing frame; 3-Moving component; 4-Sealing strip; 5-Pressure component; 6-Negative pressure pipe; 21-Rectangular slide groove; 31-Support frame; 32-Threaded rod; 33-First motor; 34-Fixing block; 35-Slide groove; 36-Slider; 51-Piston plate; 52-Hole plate; 53-Support rod; 54-Column; 55-Sleeve plate; 56-Pressure plate; 57-Gear; 58-Servo motor; 321-Thread a; 322-Thread b; 561-Arc groove; 562-Lower pressure groove. Detailed Implementation

[0029] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0030] Example 1

[0031] like Figures 1 to 9As shown, a ceramic circuit board membrane hole metallization wall-mounting device includes a ceramic substrate 1. Sealing frames 2 are provided at both the upper and lower ends of the ceramic substrate 1. A moving component 3 is provided at one end of each sealing frame 2 to drive relative movement of the sealing frame 2. A sealing strip 4 is provided at the contact point between the sealing frame 2 and the ceramic substrate 1. A pressurizing component 5 is provided inside the sealing frame 2. A negative pressure pipe 6 is provided on the sealing frame 2 at the lower end of the ceramic substrate 1. The pressurizing components 5 at both the upper and lower ends can drive the wall-mounting liquid inside the membrane hole of the ceramic substrate 1 to repeatedly move and adhere within the membrane hole.

[0032] In this embodiment, as Figures 2 to 4 As shown, the moving component 3 includes a support frame 31, a threaded rod 32 rotatably disposed within the support frame 31, a first motor 33 for driving the threaded rod 32 to rotate, a fixed block 34 rotatably disposed on the threaded rod 32, a sliding groove 35 disposed on the inner side of the support frame 31, and a slider 36 disposed at the end of the fixed block 34 that cooperates with the sliding groove 35; the upper and lower ends of the threaded rod 32 are respectively provided with threads a321 and b322, and threads a321 and b322 are arranged oppositely; in this invention, the first motor 33 drives the threaded rod 32 to rotate, and the sliding groove 35 limits the slider 36, so that the sealing frame 2 connected to the fixed block 34 at the upper and lower ends makes relative movement or opposite movement.

[0033] It needs to be emphasized that, such as Figure 3 As shown, the pressurizing assembly 5 includes a piston plate 51 slidably disposed within the sealing frame 2, a hole-fitting plate 52 disposed at the lower end of the sealing frame 2, a support rod 53 disposed on the piston plate 51, a column 54 disposed on the support rod 53, a sleeve plate 55 disposed on the other side of the sealing frame 2, a pressure plate 56 rotatably disposed on the sleeve plate 55, a gear 57 disposed on the outer side of the pressure plate 56, and a servo motor 58 driving the pressure plate 56 to rotate; the pressure plate 56 is provided with an arc-shaped groove 561, and the arc-shaped groove 561 is provided with a lower pressure groove 562, and the upper and lower ends of the... The lower pressure grooves 562 on the pressure plate 56 are arranged in the same direction. In this invention, the pressure plate 56 is driven to rotate by the servo motor 58, and the lower pressure plate 56 is driven to rotate by the meshing of the gear 57. The column 54 is slidably arranged in the arc groove 561. When the upper column 54 slides in the arc groove 561, the lower column 54 is limited by the lower pressure groove 562, driving the column 54 and the piston plate 51 to move closer to the ceramic substrate 1, so that the air pressure in the sealing frame 2 increases and squeezes the slurry to move towards the hole plate 52 at the other end. The piston plates 51 at the upper and lower ends squeeze alternately.

[0034] It is worth mentioning here that, as Figure 5 As shown, a rectangular groove 21 is provided on one side of the sealing frame 2, and the support rod 53 is slidably disposed in the rectangular groove 21; in this invention, the support rod 53 is limited by moving within the rectangular groove 21 to prevent it from shifting.

[0035] In addition, such as Figure 7 As shown, the horizontal position of the orifice plate 52 is lower than the horizontal position of the sealing strip 4. After the sealing strip 4 is squeezed, it is at the same horizontal line as the orifice plate 52. The orifice plate 52 is consistent with the membrane hole of the ceramic substrate 1, and the orifice plate 52 is tightly attached to the ceramic substrate 1. In this invention, after the sealing strip 4 is squeezed into place, the orifice plate 52 is tightly attached to the ceramic substrate 1 to prevent the slurry from overflowing.

[0036] Work process

[0037] The first motor 33 drives the threaded rod 32 to rotate, and limits the slider 36 through the slide groove 35, so that the sealing frame 2 connected to the fixed block 34 at both ends makes relative movement or opposite movement. When the sealing frame 2 is in contact with the ceramic substrate 1 in the middle, the first motor 33 stops.

[0038] The servo motor 58 is started, driving the pressure plate 56 to rotate. Through the meshing of the gear 57, the lower pressure plate 56 rotates. The column 54 is slidably set in the arc groove 561. When the upper column 54 slides in the arc groove 561, the lower column 54 is limited by the lower pressure groove 562, driving the column 54 and piston plate 51 to move closer to the ceramic substrate 1, so that the air pressure in the sealing frame 2 increases and squeezes the slurry to move towards the hole plate 52 at the other end. The piston plates 51 at the upper and lower ends squeeze alternately.

[0039] After the servo motor 58 stops working, the negative pressure pipe 6 is connected to an external negative pressure device to adsorb the air in the lower sealing frame 2, so that the excess slurry flows from the membrane hole to the lower orifice plate 52 and then flows out.

[0040] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art under the technical guidance of the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A ceramic circuit board film hole metalization wall hanging device, comprising a ceramic substrate (1), characterized in that: The ceramic substrate (1) is provided with sealing frames (2) at both the upper and lower ends. A moving component (3) is provided at one end of the sealing frame (2) to drive the sealing frame (2) to move relative to each other. A sealing strip (4) is provided at the point where the sealing frame (2) abuts against the ceramic substrate (1). A pressurizing component (5) is provided inside the sealing frame (2). A negative pressure pipe (6) is provided on the sealing frame (2) at the lower end of the ceramic substrate (1). The pressurizing components (5) at both the upper and lower ends can drive the wall liquid in the membrane pores of the ceramic substrate (1) to move and adhere repeatedly in the membrane pores.

2. A ceramic circuit substrate film hole metalizing wall hanging device according to claim 1, characterized in that, The moving component (3) includes a support frame (31), a threaded rod (32) rotatably disposed in the support frame (31), a first motor (33) for driving the threaded rod (32) to rotate, a fixed block (34) rotatably disposed on the threaded rod (32), a slide groove (35) disposed inside the support frame (31), and a slider (36) disposed at the end of the fixed block (34) that cooperates with the slide groove (35).

3. A ceramic circuit substrate film hole metalizing wall hanging device according to claim 2, characterized in that, The threaded rod (32) is provided with thread a (321) and thread b (322) at its upper and lower ends respectively, with thread a (321) and thread b (322) being arranged oppositely.

4. A ceramic circuit substrate film hole metalizing wall hanging device according to claim 1, characterized in that, The pressurizing assembly (5) includes a piston plate (51) slidably disposed within the sealing frame (2), a hole plate (52) disposed at the lower end of the sealing frame (2), a support rod (53) disposed on the piston plate (51), a column (54) disposed on the support rod (53), a sleeve plate (55) disposed on the other side of the sealing frame (2), a pressure plate (56) rotatably disposed on the sleeve plate (55), a gear (57) disposed on the outer side of the pressure plate (56), and a servo motor (58) for driving the pressure plate (56) to rotate.

5. A ceramic circuit substrate film hole metalizing wall hanging device according to claim 4, characterized in that, The pressure plate (56) is provided with an arc-shaped groove (561), and the arc-shaped groove (561) is provided with a lower pressure groove (562). The lower pressure grooves (562) on the upper and lower ends of the pressure plate (56) are arranged in the same direction.

6. A ceramic circuit substrate film hole metalizing wall hanging device according to claim 1, characterized in that, A rectangular groove (21) is provided on one side of the sealing frame (2), and the support rod (53) is slidably disposed in the rectangular groove (21).

7. A ceramic circuit substrate film hole metalizing wall hanging device according to claim 4, characterized in that, The horizontal position of the orifice plate (52) is lower than the horizontal position of the sealing strip (4), and the sealing strip (4) is squeezed to be at the same horizontal line as the orifice plate (52).

8. A ceramic circuit board membrane hole metallization wall-mounted device according to claim 4, characterized in that, The perforated plate (52) has the same membrane pores as the ceramic substrate (1), and the perforated plate (52) is tightly attached to the ceramic substrate (1).

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