Electronic device

Abstract

This invention provides an electronic device that can suppress the intrusion of external liquids or the like through a simpler structure. The electronic device disclosed herein includes: an electronic substrate; a substrate on which the electronic substrate is mounted; a cover fixed to the substrate; and a resin portion. The substrate includes: a bottom surface; a wall portion including a first sidewall portion and a second sidewall portion; and a cover abutment portion including a first groove portion. The first and second sidewall portions extend from the bottom surface in a direction toward which the electronic substrate is disposed. The cover abutment portion is disposed between the first and second sidewall portions. The cover includes: a cover surface facing the electronic substrate; and a plate abutment portion abutting against the cover abutment portion and having a second groove portion disposed in at least a portion thereof. The resin portion includes: at least one of a first resin portion adhered to the plate abutment portion and the first sidewall portion, and at least one of a second resin portion adhered to the plate abutment portion and the second sidewall portion; and a third resin portion disposed in at least one of the first and second groove portions.

Description

Technical Field

[0001] This disclosure relates to an electronic device. Background Technology

[0002] In electronic devices, to protect the electronic substrate on which electronic components are mounted from liquids, a waterproof structure is sometimes provided between the housing body on which the electronic substrate is mounted and a cover that covers the opening of the housing body. For example, Patent Document 1 discloses an electronic control device that maintains waterproofness by providing a groove in the housing body, bonding the housing body to the cover using an adhesive filled in the groove, and providing a space on the outer side of the groove in the gap between the housing body and the cover, thereby using capillary action to seal off liquids that have entered from the outside into the space. Additionally, for example, Patent Document 2 discloses a sealing structure that prevents liquids from entering the housing containing vehicle electronic components by providing a sealing member consisting of a gasket between the upper surface of the upright portion of the housing body and the recess provided in the cover.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2011-205002

[0006] Patent Document 2: International Publication No. 2019 / 073910 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] However, in the technologies described in the aforementioned Patent Documents 1 and 2, for example, it is believed that the bending process of the cover is required, which sometimes complicates the manufacturing process. In addition, it is believed that it may be difficult to achieve miniaturization of the device by providing a bending portion in the cover.

[0009] This disclosure was made in view of the following circumstances, and its purpose is to provide an electronic device that can suppress the intrusion of external liquids, etc. through a simpler structure.

[0010] Technical means for solving problems

[0011] An electronic device according to one aspect of this disclosure includes: an electronic substrate on which electronic components are mounted; a base plate on which the electronic substrate is placed; a cover fixed to the base plate; and a resin portion. The base plate includes: a bottom surface; a wall portion including a first side wall portion and a second side wall portion; and a cover abutting portion including a first groove portion. The first side wall portion and the second side wall portion extend from the bottom surface in a direction in which the electronic substrate is disposed. The cover abutting portion is disposed between the first side wall portion and the second side wall portion. The cover includes: a cover surface portion opposite to the electronic substrate; and a plate abutting portion abutting against the cover abutting portion and having a second groove portion disposed in at least a portion thereof. The resin portion includes: at least one of a first resin portion adhered to the plate abutting portion and the first side wall portion, and at least one of a second resin portion adhered to the plate abutting portion and the second side wall portion; and a third resin portion disposed in at least one of the first groove portion and the second groove portion.

[0012] The effects of the invention

[0013] According to this disclosure, an electronic device can be provided that can suppress the intrusion of external liquids or the like through a simpler structure. Attached Figure Description

[0014] Figure 1 This is a schematic perspective view of the electronic device according to this embodiment.

[0015] Figure 2A This is a perspective view of the base plate of this embodiment.

[0016] Figure 2B This is a top view of the base plate in this embodiment.

[0017] Figure 3A This is a perspective view of the cover in this embodiment.

[0018] Figure 3B This is a top view of the cover in this embodiment.

[0019] Figure 4 This is an enlarged cross-sectional view of a part of the electronic device in this embodiment.

[0020] Figure 5A This is an enlarged cross-sectional view of a part of the electronic device in this embodiment.

[0021] Figure 5B This is an enlarged cross-sectional view of a portion of the electronic device in the comparative example.

[0022] Figure 6A This is a photograph of a portion of the electronic device used in the comparative example.

[0023] Figure 6B This is a photograph of a portion of the electronic device described in this embodiment.

[0024] Figure 7AThis is an enlarged cross-sectional view of a part of the electronic device in this embodiment.

[0025] Figure 7B This is an enlarged cross-sectional view of a part of the electronic device in this embodiment.

[0026] Figure 7C This is an enlarged cross-sectional view of a part of the electronic device in this embodiment.

[0027] Figure 8 This is an enlarged cross-sectional view of a part of the electronic device in this embodiment.

[0028] Figure 9A This is a schematic cross-sectional view used to illustrate the method of forming the first groove in this embodiment.

[0029] Figure 9B This is a schematic cross-sectional view used to illustrate the method of forming the first groove in this embodiment.

[0030] Figure 9C This is a schematic cross-sectional view used to illustrate the method of forming the first groove in this embodiment.

[0031] Figure 10A This is a perspective view of the base plate of this embodiment.

[0032] Figure 10B This is a top view of the base plate in this embodiment.

[0033] Figure 11A This is a perspective view of the second cover in this embodiment.

[0034] Figure 11B This is a top view of the second cover in this embodiment.

[0035] Figure 12 This is an enlarged cross-sectional view of a part of the electronic device in this embodiment.

[0036] Figure 13 This is a schematic exploded perspective view of the electronic device according to this embodiment.

[0037] Figure 14 This is a schematic exploded perspective view of the electronic device according to this embodiment.

[0038] Explanation of reference numerals in the attached figures:

[0039] 10: Electronic devices

[0040] 100: Base plate

[0041] 110: Substrate mounting surface

[0042] 120, 120D: Wall section

[0043] 120A, 120D: Wall section

[0044] 122: First sidewall portion

[0045] 124: Second sidewall portion

[0046] 126: Cover contact part

[0047] 126g: First groove

[0048] 128: Step Difference Part

[0049] 129: Stepped sidewall portion

[0050] 200: Cover

[0051] 210: Opposite surfaces of the substrate

[0052] 220: Plate abutment part

[0053] 220g: Second groove

[0054] 300: Electronic substrate

[0055] 410: First Resin Section

[0056] 420, 420D: Second resin section

[0057] 430: Third Resin Section

[0058] 440: Fourth Resin Section

[0059] 450: Fifth Resin Section

[0060] 460: Sixth Resin Section

[0061] 500: Second Cover Detailed Implementation

[0062] Hereinafter, one embodiment of the present disclosure (hereinafter also referred to as "this embodiment") will be described with reference to the accompanying drawings. Furthermore, in the accompanying drawings, for ease of illustration and understanding, there are instances where the scale and aspect ratios are appropriately altered and exaggerated from the actual object.

[0063] In the following figures, the X-axis, Y-axis, and Z-axis are sometimes indicated. The X-axis, Y-axis, and Z-axis form a right-handed three-dimensional Cartesian coordinate system. Hereinafter, the direction of the arrow on the X-axis is sometimes referred to as the +X direction, and the direction opposite to the arrow is sometimes referred to as the -X direction. The same applies to the other axes. Furthermore, the +Z direction and -Z direction are sometimes referred to as "upper" or "above" and "lower" or "below," respectively. Additionally, the Z-axis direction is sometimes referred to as the "layering direction." Furthermore, the plane orthogonal to the X-axis, Y-axis, or Z-axis is sometimes referred to as the YZ plane, ZX plane, or XY plane. However, these directions are used for the convenience of describing relative positional relationships. Therefore, these directions do not specify absolute positional relationships.

[0064] Furthermore, in the following, the terms and / or numerical values ​​used to describe shape and / or geometric conditions need not be limited to their strict meanings, but can be interpreted as encompassing a range of degrees to which the same function can be expected. For example, terms such as "parallel" and / or "orthogonal" are equivalent to the terms mentioned above. Similarly, terms such as "value of length" and / or "value of angle" are equivalent to the numerical values ​​mentioned above.

[0065] Furthermore, when a structure is described as being "above," "below," "on the upper side," "on the lower side," "above," or "below," it can also include situations where one structure is directly connected to another structure, and situations where another structure is contained within another structure. In other words, a situation where another structure is contained within another structure can also be described as one structure being indirectly connected to another structure. Additionally, expressions like "above," "on the upper side," or "above" can be replaced with expressions like "below," "below," or "below." In other words, the up-down direction can also be reversed. The same applies to left-right.

[0066] In addition, for the sake of clarity in explaining relative directional relationships, the terms used later in the text are sometimes omitted. Figure 3B In this context, the direction to the right of the paper is called the right side X1, and the opposite direction to the left of the paper is called the left side X2. Both directions are collectively referred to as the left-right direction X. Furthermore, sometimes... Figure 3B In the diagram, the direction on the paper is called the front (Y1), and the opposite direction below the paper is called the rear (Z2). Both directions are collectively referred to as the front-rear direction (Y). Furthermore, sometimes the vertical direction perpendicular to the paper in the diagram is called the lower (Z2), and the opposite direction perpendicular to the paper and closer to the front is called the upper (Z1). Both directions are collectively referred to as the vertical direction (Z). Moreover, looking down (looking up) refers to the angle of view when observing the potentiometer 10 from the position above (Z1, below (Z2)) towards the position below (Z2, above (Z1)).

[0067] Additionally, in the following, when the same reference numerals or similar reference numerals are used to label the same parts and / or parts having the same function, repeated descriptions are sometimes omitted. Furthermore, sometimes the dimensional ratios of the drawings differ from the actual ratios. Also, sometimes a portion of the structure of the embodiment is omitted from the drawings.

[0068] Figure 1 This is a schematic perspective view of the appearance of the electronic device 10 according to this embodiment. Figure 1 As shown, the electronic device 10 of this embodiment includes: a substrate 100 on which an electronic substrate is disposed and is open on one side (top); and a cover 200 disposed above the substrate 100.

[0069] Reference Figure 2A as well as Figure 2B The substrate 100 of the electronic device 10 of this embodiment will be described. Figure 2A This is a three-dimensional view of the base plate 100 viewed from above. Figure 2B This is a top view of the base plate 100 from above.

[0070] like Figure 2A as well as Figure 2B As shown, the substrate 100 has a bottom surface 110 and a wall portion 120. An electronic substrate 300 on which electronic components are mounted is placed on the bottom surface 110.

[0071] The wall portion 120 has a first side wall portion 122, a second side wall portion 124 disposed outside the first side wall portion 122, and a cover abutment portion 126. The cover abutment portion 126 may also be disposed between the first side wall portion 122 and the second side wall portion 124.

[0072] like Figure 2A as well as Figure 2B As shown, the first sidewall portion 122 can also be the inner surface of the wall portion 120, and the second sidewall portion 124 can also be the outer surface of the wall portion 120. A first groove portion 126g is provided in the cover abutment portion 126. The cover abutment portion 126 can also be a plane located above the wall portion 120, for example, it can also be a plane perpendicular to the vertical direction. The first groove portion 126g can also be formed in a way that it is recessed downwards from the wall portion 120. The first groove portion 126g can, for example, be provided all around the circumference of the wall portion 120.

[0073] In this embodiment, the wall portion 120 of the substrate 100 may, for example, be provided covering the entire circumference of the electronic substrate mounting surface 110. Additionally, as... Figure 2A as well as Figure 2BAs shown, the base plate 100 may, for example, include a cover fixing portion 160 for fixing the cover 200 (described later) to the base plate 100. Multiple cover fixing portions 160 may also be provided. Furthermore, the cover fixing portion 160 may include, for example, a threaded hole through which a screw can be inserted. Additionally, one or more fixing portions 164 may be provided on the base plate 100 for fixing other components or power supply devices, other than the electronic substrate 300.

[0074] Reference Figure 3A as well as Figure 3B The cover 200 of the electronic device 10 in this embodiment will be described. Figure 3A This is a three-dimensional view of cover 200 from above. Figure 3B This is a top view of cover 200 from below.

[0075] like Figure 3B As shown, the cover 200 has an interface with the electronic substrate 300 ( Figure 2A and Figure 2B The opposing cover surface 210. Furthermore, in the electronic device 10 of this embodiment, such as... Figure 1 As shown, the cover 200 is disposed above the substrate 100, and the cover surface 210 of the cover 200 is disposed at a position opposite to the electronic substrate 300 placed on the substrate 100 when the cover 200 is fixed relative to the substrate 100.

[0076] like Figure 3B As shown, the cover 200 has a plate abutting portion 220 that abuts against the cover abutting portion 126. The plate abutting portion 220 is disposed around the cover surface 210. In the electronic device 10 of this embodiment, the cover abutting portion 126 of the base plate 100 and the plate abutting portion 220 of the cover 200 may also have the same shape when viewed from above. Therefore, in this embodiment, it may also be configured such that when the cover 200 is fixed to the base plate 100, the cover abutting portion 126 of the base plate 100 and the plate abutting portion 220 of the cover 200 overlap each other in the Z direction.

[0077] A second groove 220g is provided on at least a portion of the plate abutment portion 220. In this embodiment, the second groove 220g is provided, for example, throughout the entire circumference of the plate abutment portion 220. The second groove 220g is formed such that it is recessed upward from the plate abutment portion 220 when the cover 200 is fixed to the base plate 100.

[0078] like Figure 3B As shown, the plate abutment portion 220 of the cover 200 can also be provided covering the entire circumference of the cover surface 210. Additionally, as... Figure 3A as well as Figure 3BAs shown, the cover 200 may also be provided with a plate fixing part 260 for fixing the cover 200 relative to the base plate 100. Multiple plate fixing parts 260 may also be provided. In addition, the plate fixing part 260 may also include a threaded hole through which a screw can be inserted.

[0079] exist Figure 4 The diagram shows an enlarged cross-sectional view taken from the -Y direction of the portion where the base plate 100 and the cover 200 of the electronic device 10 abut against each other. The electronic device 10 of this embodiment is provided with at least one of a plate abutment portion 220 adhered to the cover 200 and a first resin portion 410 of a first sidewall portion 122 of the base plate 100, and a second resin portion 420 adhered to the plate abutment portion 220 of the cover 200 and a second sidewall portion 124 of the base plate 100. Figure 4 In the example shown, both the first resin portion 410 and the second resin portion 420 are provided. Furthermore, in the electronic device 10 of this embodiment, the first resin portion 410 and the second resin portion 420 may also be provided as gaskets for sealing between the cover abutment portion 126 of the base plate 100 and the plate abutment portion 220 of the cover 200, which are the joint portions of the base plate 100 and the cover 200.

[0080] For example, the second resin portion 420 is provided to suppress the infiltration of moisture and the like from the outside (e.g., left side X2) of the electronic device 10 into the interior of the electronic device 10. Furthermore, the first resin portion 410 is provided to suppress the infiltration of moisture that can infiltrate from the outside (e.g., left side X2) of the electronic device 10 and into the interior (right side X1) of the joint between the base plate 100 and the cover 200 (between the cover abutment portion 126 of the base plate 100 and the plate abutment portion 220 of the cover 200) into the interior of the electronic device 10.

[0081] Furthermore, the electronic device 10 of this embodiment includes a third resin portion 430 disposed in at least one of the first tank portion 126g and the second tank portion 220g. Figure 4 In the example shown, for instance, the first groove 126g is arranged in a rectangular manner in the cross-sectional view. Similarly, the second groove 220g is arranged in a rectangular manner in the cross-sectional view. Furthermore, a third resin portion 430 is provided over both the first groove 126g and the second groove 220g.

[0082] In addition, such as Figure 4 As shown, the cover 200 may also have, for example, an inner wall portion 222 near the plate abutment portion 220, which is used to... Figure 4 The right side X1 (inner side) is arranged in a diagonally upward direction (right side X1 and upper Z1); and the outer wall portion 224 is arranged in a way that... Figure 4It is arranged such that the left side X2 (outer side) extends upward Z1. The inner sidewall 222 may also be connected to the cover surface 210, for example.

[0083] As described above, an electronic device 10 according to one aspect of this disclosure includes: an electronic substrate 300 on which electronic components are mounted; a substrate 100 on which the electronic substrate 300 is placed; a cover 200 fixed to the substrate 100; and a resin portion 400. The substrate 100 has a bottom surface 110, a wall portion 120, and a cover abutment portion 126. The wall portion 120 includes a first sidewall portion 122 and a second sidewall portion 124. The cover abutment portion includes a first groove portion 126g. The first sidewall portion 122 and the second sidewall portion 124 extend from the bottom surface 110 in a direction (Z direction) in which the electronic substrate 300 is disposed. The cover abutment portion 126 is disposed between the first sidewall portion 122 and the second sidewall portion 124. The cover 200 has a cover surface 210 opposite to the electronic substrate 300 and a plate abutment portion 220 that abuts against the cover abutment portion 126 and has a second groove portion 220g disposed in at least a portion thereof. The resin portion 400 includes at least one of a first resin portion 410 adhered to the plate abutment portion 220 and the first sidewall portion 122, and a second resin portion 420 adhered to the plate abutment portion 220 and the second sidewall portion 124; and a third resin portion 430 disposed in at least one of the first groove portion 126g and the second groove portion 220g. In the electronic device 10 according to one aspect of the present disclosure, the above structure can, for example, delay corrosion of the substrate 100 and the cover 200 caused by the intrusion of liquids or the like from outside the electronic device 10, and as a result, can suppress the intrusion of liquids or the like into the interior of the electronic device 10.

[0084] Reference Figure 5A as well as Figure 5B The effects of the electronic device 10 according to one aspect of the present disclosure will be explained using comparative examples. Figure 5A This is an enlarged cross-sectional view taken from the -Y direction of the portion where the base plate 100 and the cover 200 of the electronic device 10 of this embodiment abut against each other. Figure 5B An enlarged cross-sectional view taken from the -Y direction showing the portion of the electronic device 70 of the comparative example, in which the base plate 700 and the cover 800 abut against each other.

[0085] like Figure 5BAs shown, in the base plate 700 of the comparative example electronic device 70, a first sidewall portion 722 and a second sidewall portion 724 are provided in the same manner as in the base plate 100 of the electronic device 10 of this embodiment. However, the comparative example electronic device 70 differs from the electronic device 10 of this embodiment in that the cover abutment portion 726 of the comparative example electronic device 70 does not have the first groove portion 126g of the base plate 100 of the electronic device 10 of this embodiment. In the cover 800 of the comparative example electronic device 70, a plate abutment portion 820 is provided, along with an inner sidewall portion 822 and an outer sidewall portion 824. However, it differs from the electronic device 10 of this embodiment in that the second groove portion 220g of the cover 200 of the electronic device 10 of this embodiment is not provided.

[0086] In addition, such as Figure 5B As shown, in the electronic device 70 of the comparative example, a first resin portion 910 is provided that is adhered to the plate abutment portion 820 of the cover 800 and the first side wall portion 722 of the base plate 700, and a second resin portion 920 is provided that is adhered to the plate abutment portion 820 of the cover 800 and the second side wall portion 724 of the base plate 700. However, in the electronic device 870 of the comparative example, the first groove portion 126g and the second groove portion 220g of the electronic device 10 of this embodiment are not provided. Therefore, the same resin portion as the third resin portion 430 is not provided.

[0087] Figure 5B Water droplets wd1 and wd2 adhering to the exterior of the electronic device 70 of the comparative example are also schematically shown. Figure 5B As shown in the water droplet wd1, water droplets wd1 and wd2 are attached from the outside of the electronic device 70 of the comparative example (e.g., left side X2) to the outside of the first side wall 722 of the wall portion 720 of the substrate 700 (left side X2), the lower side of the plate abutment portion 820, etc.

[0088] Similar to the first resin portion 410 and the second resin portion 420 of electronic device 10, in the comparative example electronic device 70, the first resin portion 910 and the second resin portion 920 can also function as gaskets between the base plate 700 and the cover 800. Therefore, it is believed that water droplets wd1 and wd2 can be suppressed from entering the interior of electronic device 70. Figure 5B The inner side (right side X1) of the container is immersed. However, according to the research of the inventors, although a second resin part 920 is provided, water droplets wd1 and wd2 sometimes penetrate between the cover abutment part 726 and the plate abutment part 820.

[0089] Furthermore, it is known that moisture that has seeped into the cover abutment portion 726 and the plate abutment portion 820 may remain between them, sometimes causing corrosion to the cover abutment portion 726 and / or the plate abutment portion 820, which are made of metal or the like. In addition, water droplets wd1 and wd2 may sometimes seep into the gasket (second resin portion 920) and the space between the second sidewall portion 724 and the plate abutment portion 820, and due to capillary action, may penetrate into the interior of the electronic device 70 through the space between the cover abutment portion 726 and the plate abutment portion 820. Furthermore, even if a first resin portion 910 is provided as a gasket on the inner side (right side X1) between the cover abutment portion 726 and the plate abutment portion 820, if the adhesion of the first resin portion 910 to the base plate 700 and the cover 800 is insufficient, the function of the gasket may become inadequate, and in this case, moisture from outside the electronic device 70 may sometimes seep into the interior of the electronic device 70. It is believed that if moisture seeps into the internal electronic device 70, it may cause adverse conditions such as short circuits.

[0090] In the electronic device 10 of this embodiment, as described above, a first groove 126g is provided in the cover abutment portion 126 of the base plate 100. Furthermore, in the electronic device 10 of this embodiment, a second groove 220g is provided in the plate abutment portion 220 of the cover 200. Therefore, as... Figure 5A As shown, in the electronic device 10 of this embodiment, for example, even from outside the electronic device 10 (in Figure 5A When water droplets wd1 and wd2 (left side X2) are attached to the electronic device 10 and are immersed between the cover abutment portion 126 of the substrate 100 and the plate abutment portion 220 of the cover 200, the creepage distance from the outside to the inside of the electronic device 10 can be increased compared to the electronic device 70 of the comparative example by providing the first groove portion 126g. Therefore, the immersion of water droplets wd1 and wd2 between the cover abutment portion 126 of the substrate 100 and the plate abutment portion 220 of the cover 200 into the interior of the electronic device 10 can be delayed or suppressed.

[0091] Furthermore, even if water droplets wd1 and wd2, which are immersed between the cover abutment portion 126 of the base plate 100 and the plate abutment portion 220 of the cover 200, move in the direction of the cover 200 upward Z1 and are immersed in the groove portion 220g, the creepage distance from the outside to the inside of the electronic device 10 can be relatively increased in the same way as the first groove portion 126g. Therefore, the immersion of water droplets wd1 and wd2 into the inside of the electronic device 10 can be delayed or suppressed.

[0092] Furthermore, in the electronic device 10 of this embodiment, water immersed in the first groove 126g, which is recessed downwards (Z2), can remain at the bottom 126b of the first groove 126g, for example, without violating gravity. This also helps to suppress the penetration of water droplets wd1 and wd2 between the cover abutment portion 126 of the substrate 100 and the plate abutment portion 220 of the cover 200 into the interior of the electronic device 10.

[0093] In addition, in the electronic device 10 of this embodiment, at least one of the first tank portion 126g and the second tank portion 220g is provided with a third resin portion 430, which serves as a gasket and can suppress the infiltration of moisture that may have entered the first tank portion 126g and the second tank portion 220g into the interior of the electronic device 10.

[0094] The inventors studied an electronic device 10 having the same structure as the electronic device 10 of this embodiment. As a result, when a first groove 126g, a second groove 220g, and a third resin portion 430 are provided in at least one of the first groove 126g and the second groove 220g, corrosion that occurs between the base plate 100 formed of a metal material and the cover 200 (between the cover abutment portion 126 of the base plate 100 and the plate abutment portion 220 of the cover 200) occurs in portions up to the first groove 126g and the second groove 220g, but the inner portions of the first groove 126g and the second groove 220g are not corroded.

[0095] Figure 6A A photograph showing the removal of the cover after a corrosion test on a portion of the cover abutting part 726 of the electronic device 70 in the comparative example. Additionally, Figure 6B This is a photograph showing a portion of the cover peeled off after a corrosion test of the cover abutment portion 126 of the electronic device 10 in this embodiment. (See attached image.) Figure 6A As shown, in the comparative example electronic device 70, a corrosion area 700c, indicated by dark gray, is formed in a portion of the cover contact portion 726. In the electronic device 10 of this embodiment, as... Figure 6B As shown, a corrosion area 100c, indicated by dark gray, is formed in region A12o outside the portion where the first groove 126g is provided in the cover abutment portion 126. However, no corrosion area is observed in region A12i inside the portion where the first groove 126g is provided. This is believed to be because, as described above, in the electronic device 10 of this embodiment, by providing the first groove 126g, corrosion can be suppressed in region A12i of the cover abutment portion 126. That is, it is confirmed that in the electronic device 10 of this embodiment, the intrusion of liquids from the outside can be suppressed.

[0096] In addition, in reference Figure 5A In the electronic device 10 of this embodiment described above, an example case with a first resin portion 410 and a second resin portion 420 has been used, but the structure of the electronic device 10 of this embodiment is not limited to this. As described above, for example, the first resin portion 410 functions as a gasket to prevent moisture that has penetrated between the cover abutment portion 126 of the substrate 100 and the plate abutment portion 220 of the cover 200 from seeping into the interior of the electronic device 10. Furthermore, for example, the second resin portion 420 functions as a gasket to prevent water droplets wd1 and wd2 that have adhered to the electronic device 10 from the outside from seeping into the space between the cover abutment portion 126 of the substrate 100 and the plate abutment portion 220 of the cover 200. Therefore, in the electronic device 10 of this embodiment, either the first resin portion 410 or the second resin portion 420 may be provided, for example. In the electronic device 10 of this embodiment, for example, even if either the first resin portion 410 or the second resin portion 420 is provided, the electronic device 10 is provided with the first groove portion 126g, the second groove portion 220g, and the third resin portion 430 is provided in at least one of the first groove portion 126g and the second groove portion 220g as described above. Therefore, it is also possible to effectively suppress the infiltration of moisture into the interior of the electronic device 10.

[0097] In addition, in reference Figure 5A In the electronic device 10 of this embodiment described above, for example, the case where the third resin portion 430 is provided in either the first groove portion 126g or the second groove portion 220g has been used as an example, but the structure of the electronic device 10 of this embodiment is not limited to this. For example, the third resin portion 430 can function as a gasket in the space formed by the first groove portion 126g and the second groove portion 220g, as described above. Therefore, the third resin portion 430 can also be provided in either the first groove portion 126g or the second groove portion 220g. Even if the third resin portion 430 is provided in either the first groove portion 126g or the second groove portion 220g, it is possible to effectively suppress the infiltration of moisture that has penetrated between the cover abutment portion 126 of the substrate 100 and the plate abutment portion 220 of the cover 200 into the interior of the electronic device 10.

[0098] As explained above, in the electronic device 10 of this embodiment, a first groove 126g is provided in the cover abutment portion 126 of the base plate 100, and a second groove 220g is provided in the plate abutment portion 220 of the cover 200. Furthermore, at least one of a first resin portion 410, which adheres to the plate abutment portion 220 of the cover 200 and the first sidewall portion 122 of the base plate 100, and a second resin portion 420, which adheres to the plate abutment portion 220 of the cover 200 and the second sidewall portion 124 of the base plate 100, is provided. Additionally, a third resin portion 430 is provided in at least one of the first groove 126g and the second groove 220g. Therefore, in the electronic device 10 of this embodiment, the infiltration of moisture from water droplets wd1 and wd2 from outside the electronic device 10 into the interior of the electronic device 10 can be effectively suppressed with a simpler structure.

[0099] In the electronic device 10 of this embodiment, as described above, either the first resin portion 410 or the second resin portion 420 may be provided, but both the first resin portion and the second resin portion 420 may also be provided. By providing the second resin portion 420 in addition to the first resin portion, the infiltration of moisture into the area between the cover abutment portion 126 of the substrate 100 and the plate abutment portion 220 of the cover 200 can be effectively suppressed. Therefore, corrosion of the metal materials used in the formation of the substrate 100 and the cover 200 that may occur between the cover abutment portion 126 of the substrate 100 and the plate abutment portion 220 of the cover 200 can be suppressed.

[0100] Alternatively, another resin portion (fourth resin portion 440) may be provided between the cover abutment portion 126 of the base plate 100 and the plate abutment portion 220 of the cover 200. For example, such as Figure 5A As shown, it is also possible to place the first groove 126g and the second groove 220g in the inner side (right side X1) of the portion between the cover abutment portion 126 of the base plate 100 and the plate abutment portion 220 of the cover 200. Figure 5A The area shown is A12i) and the area outside (left x2) of the portion where the first groove 126g and the second groove 220g are provided. Figure 5A At least a portion of at least one of the regions A12o shown is provided with a fourth resin section 440.

[0101] In the electronic device 10 of this embodiment, by providing a fourth resin portion 440, it is possible to more effectively suppress the seepage of moisture between the cover abutment portion 126 of the substrate 100 and the plate abutment portion 220 of the cover 200. Furthermore, in Figure 5AThe illustration shows a case where the fourth resin portion 440 is provided in either region A12i (right side X1) inside the portion where the first groove portion 126g and the second groove portion 220g are provided, or in region A12o (left side X2) outside the portion where the first groove portion 126g and the second groove portion 220g are provided. However, the structure of the electronic device 10 in this embodiment is not limited to this. The fourth resin portion 440 may also be provided only in either region A12i or region A12o. Even if the fourth resin portion 440 is provided only in either region, it is possible to effectively suppress the infiltration of moisture into the interior of the electronic device 10. In addition, the fourth resin portion 440 may be provided entirely in at least one of region A12i and region A12o, or it may be provided only in at least a portion of at least one of region A12i and region A12o. In either case, it is possible to effectively suppress the infiltration of moisture into the interior of the electronic device 10.

[0102] Alternatively, in the electronic device 10 of this embodiment, for example, it may be configured such that at least a portion of the first groove 126g of the base plate 100 and the second groove 220g of the cover 200 are in communication. That is, for example, as... Figure 5A As shown, in the electronic device 10 of this embodiment, the first groove 126g and the second groove 220g may also be provided in the cross-sectional view (e.g., from...). Figure 5A The cross-sectional view shown (observed in the -Y direction) overlaps in the vertical direction (Z direction). That is, in Figure 5A Alternatively, the first groove 126g and the second groove 220g can be arranged such that the right side X1 end of the first groove 126g and the right side X1 end of the second groove 220g are at the same position in the Z direction, and the left side X2 end of the first groove 126g and the left side X2 end of the second groove 220g are at the same position in the Z direction. Furthermore, in Figure 5A In the example shown, the first groove 126g and the second groove 220g are arranged such that the opening at the top Z1 of the first groove 126g and the opening at the bottom Z2 of the second groove 220g overlap in the Z direction in the cross-sectional view. However, for example, the first groove 126g and the second groove 220g may also be arranged such that a portion of the opening at the top Z1 of the first groove 126g overlaps with a portion of the opening at the bottom Z2 of the second groove 220g in the cross-sectional view. For example, in the cross-sectional view, the first groove 126g and the second groove 220g may also be arranged such that the right end X1 or the left end X2 of the opening at the bottom Z2 of the second groove 220g exists between the right end X1 and the left end X2 of the opening at the top Z1 of the first groove 126g.

[0103] In the electronic device 10 of this embodiment, the third resin portion 430 can be provided throughout the first tank portion 126g and the second tank portion 220g using the above-described structure. Therefore, when the third resin portion 430 is provided in either the first tank portion 126g or the second tank portion 220g, the manufacturing process of the third resin portion 430 can be simplified. Furthermore, since the third resin portion 430 can be provided throughout the first tank portion 126g and the second tank portion 220g, for example, compared to the case where the third resin portion 430 is provided by dividing the first tank portion 126g and the second tank portion 220g respectively, a structure that can more effectively suppress the infiltration of moisture into the interior of the electronic device 10 can be provided.

[0104] Additionally, in the electronic device 10 of this embodiment, the bottom of the first groove 126g ( Figure 5A A space layer 126bc (also referred to as the "first space layer" in this embodiment) is provided at the bottom 126b. In this embodiment, the space layer 126bc may be, for example, an air layer. Additionally, in this embodiment, as... Figure 5A As shown, for example, the space layer 126bc may also be provided in the area between the bottom 126b and the portion below the third resin part 430, Z1.

[0105] In addition, in this embodiment, besides the space layer 126bc provided at the bottom 126b of the first groove 126g, or instead of the space layer 126bc, a space layer 126sc may also be provided, for example, at the side portion 126s of the first groove 126g. In this embodiment, as... Figure 5A As shown, the first groove portion 126g, for example, has a side portion 126s including a first side portion 126s1 disposed on the right side X1 and a second side portion 126s2 disposed on the left side X2. Space layers 126sc1 and 126sc2 (referred to as "second space layers" in this embodiment) may also be provided on the first side portion 126s1 and the second side portion 126s2, respectively. Similar to space layer 126bc, space layers 126sc1 and 126sc2 may, for example, be air layers.

[0106] For example, when moisture seeps between the first tank portion 126g and the third resin portion 430, it is considered that the moisture may, for example, cause capillary action or other reasons, seep into a portion closer to the interior of the electronic device 10. In this embodiment, by providing space layers 126bc, 126sc1, and 126sc2 between the third resin portion 430 and the first tank portion 126g, compared to the case where space layers 126bc, 126sc1, and 126sc2 are not provided, for example, it is possible to delay or suppress the seepage of moisture that has seeped between the first tank portion 126g and the third resin portion 430 into a portion closer to the interior of the electronic device 10. Therefore, in this embodiment, by using space layers 126bc, 126sc1, and 126sc2, it is possible to further suppress the seepage of moisture that has seeped between the first tank portion 126g and the third resin portion 430 into the interior of the electronic device 10.

[0107] In addition, Figure 5A The description uses the case of providing space layers 126bc, 126sc1, and 126sc2 as an example, but the structure of this embodiment is not limited to this. For example, when any one or two of space layers 126bc, 126sc1, and 126sc2 are provided, the same as described above, the infiltration of moisture that has entered between the first tank portion 126g and the third resin portion 430 into the interior of the electronic device 10 can be suppressed.

[0108] Furthermore, a space layer identical to space layers 126bc, 126sc1, and 126sc2 can be provided not only between the first tank portion 126g and the third resin portion 430, but also between the second tank portion 220g and the third resin portion 430. That is, a space layer identical to space layers 126bc, 126sc1, and 126sc2 can be provided on the side portions of the second tank portion 220g (right side X1, left side X2) and the upper surface portion of the second tank portion 220g (upper surface Z1). Even when a space layer is provided between the second tank portion 220g and the third resin portion 430, the same principle applies as when a space layer is provided between the first tank portion 126g and the third resin portion 430, enabling the delay or suppression of moisture penetration into the inner part of the electronic device 10.

[0109] In reference Figure 5AIn the electronic device 10 of this embodiment described above, the case where the first groove 126g and the second groove 220g are provided as a rectangular groove in cross-sectional view has been used as an example. However, the structure of the electronic device 10 of this embodiment is not limited to this. The shape of the first groove 126g and the second groove 220g may be, for example, a polygon other than a rectangle or at least a portion of a polygon in cross-sectional view. In addition, the shape of the first groove 126g and the second groove 220g may also be at least a circular or elliptical shape in cross-sectional view.

[0110] Reference Figures 7A to 7C For grooves that have shapes other than rectangles in the cross-sectional view (the first groove 126Ag described later) Figure 7A ), 126Bg ( Figure 7B ) and 126Cg ( Figure 7C Please provide an explanation. Figure 7A , Figure 7B and Figure 7C These are enlarged cross-sectional views of the vicinity of the first groove portions 126Ag, 126Bg, and 126Cg of the substrates 100A, 100B, and 100C of the electronic devices 10A, 10B, and 10C in this embodiment.

[0111] In this embodiment, such as Figure 7A As shown, the shape of the first groove 126Ag is, for example, roughly triangular in cross-sectional view; alternatively, it can be a curve, such as a portion of a circle in cross-sectional view, at the bottom 126Ab. In this embodiment, as... Figure 7B As shown, the shape of the first groove 126Bg is, for example, approximately pentagonal in the cross-sectional view. Alternatively, the corners of the pentagon in the bottom 126Bb, etc., may be curved, such as a portion of a circle in the cross-sectional view. Or, in this embodiment, as... Figure 7C As shown, the shape of the first groove 126Cg is, for example, roughly trapezoidal in the cross-sectional view, or it may be a curve, such as a part of a circle in the cross-sectional view at the corner of the trapezoid.

[0112] Figures 7A to 7C The shapes of the first groove portions 126Ag, 126Bg, and 126Cg shown respectively are examples. The first groove portion 126g of this embodiment may also be formed in a shape that has other straight lines or curves in the cross-sectional view, or a combination of other straight lines or curves.

[0113] Reference Figure 8 Other examples of the shape of the groove 220g of the cover 200 will be explained. Figure 8 and Figure 4 Similarly, this is an enlarged cross-sectional view of the area near the junction of the cover abutment portion 126 and the plate abutment portion 220 of the electronic device 10A. Figure 8As shown, for example, the second groove 220g of the cover 200 may also be approximately triangular in shape in the cross-sectional view. Alternatively, the second groove 220g of the cover 200 may also be provided by bending the area near the plate abutment portion 220 of the cover 200 in an upward Z1 (the upward Z1 when the cover 200 is fixed to the base plate 100) during the manufacture of the cover 200.

[0114] As described above, in the base plate 100 of this embodiment, such as Figure 2A and Figure 2B As shown, the first groove 126g can also be provided throughout the entire circumference of the cover abutment portion 126, similar to the first groove 126g of the base plate 100, in the cover 200, as... Figure 3B As shown, the second groove 220g can also be provided all around the plate abutment portion 220. According to this structure, for example, water leakage between the cover abutment portion 126 and the plate abutment portion 220 can be suppressed all around the electronic device 10, and thus, water can be effectively prevented from seeping into the interior of the electronic device 10.

[0115] Furthermore, in this embodiment, both the first groove 126g and the second groove 220g are provided covering the entire circumference of the cover abutment portion 126 of the base plate 100 and the plate abutment portion 220 of the cover 200, respectively. However, the structure of this embodiment is not limited to this. For example, either the first groove 126g or the second groove 220g may be provided covering the entire circumference of the cover abutment portion 126 of the base plate 100 and the entire circumference of the plate abutment portion 220 of the cover 200, respectively. Even if either the first groove 126g or the second groove 220g is provided covering the entire circumference, it is possible to more effectively suppress the infiltration of moisture into the interior of the electronic device 10.

[0116] Reference Figures 9A to 9C The method for forming the first groove 126g of this embodiment will be described. Figure 9A , Figure 9B and Figure 9C This is a schematic cross-sectional view (viewed from the Y2 direction) used to illustrate the method of forming the first groove 126g in this embodiment.

[0117] like Figure 9A As shown, firstly, a base plate 102 formed from a metal material such as an aluminum die-casting is prepared. Grooves 102ag and 102bg are formed on the upper Z1 surface of the base plate substrate 102 using a cutting tool 90 such as an end mill. Furthermore, the base plate substrate 102 has, for example, a substrate portion 102b and a allowance portion 102a provided on the upper Z1 surface of the substrate portion 102b. Additionally, grooves are formed on the base plate substrate 102 from the surface of the allowance portion 102a using the cutting tool 90.

[0118] Through the cutting tool 90, such as Figure 9B As shown, for example, a groove 102bg is formed continuously with the groove 120ag above the groove 102ag in the groove portion 102a and the substrate portion 102b above the groove portion 102ag in the lower Z2 of the groove portion 102ag.

[0119] Next, as Figure 9C As shown, removal is achieved through etching, etc. Figure 9B The remaining portion 102a described herein forms a base plate 100 on which the aforementioned groove portion 126g is provided.

[0120] In addition, refer to Figures 9A to 9C The above method can also be used, for example, in the case of forming the second groove 220g of the cover 200.

[0121] In this embodiment, the first groove 126g and the second groove 220g are not limited to the above method, and can also be formed by using a mold, for example.

[0122] In the electronic device 10 of this embodiment, in addition to the structure described above, it may also be configured such that another cover (second cover) is fixed at the bottom Z2. (See reference...) Figure 10A , Figure 10B , Figure 11A , Figure 11B as well as Figure 12 The structure is described below. Figure 10A and Figure 10B These are, respectively, a perspective view and a top view of the base plate 100 at Z2 below. Additionally, Figure 11A as well as Figure 11B These are a perspective view and a top view of the second cover, 500. Additionally, Figure 12 This is an enlarged cross-sectional view of the portion of the base plate 100 where the second cover 500 is fixed.

[0123] At this time, the electronic device 10 of this embodiment may also be, for example, as follows: Figure 10A and Figure 10B As shown, a second cover 500 is also provided on the side opposite (lower Z2) of the substrate mounting surface 110 of the base plate 100, namely the cover fixing surface 130. The base plate 100 may also have a second wall portion 140 protruding from the cover fixing surface 130. The second wall portion 140 has: a third side wall portion 142; a fourth side wall portion 144 disposed outside the third side wall portion 142; and a second cover abutting portion 146 disposed between the third side wall portion 142 and the fourth side wall portion 144, abutting against the second cover 500, and having a third groove portion 146g provided in at least a portion thereof. Furthermore, as Figure 11A as well as Figure 11BAs shown, the second cover 500 has: a plate facing surface 510 that faces the cover fixing surface 130 of the base plate 100; and a second plate abutting portion 520 that abuts against the second cover abutting portion 146 of the base plate 100, and a fourth groove portion 520g is provided in at least a portion thereof.

[0124] In addition, such as Figure 12 As shown, the electronic device 10 of this embodiment includes at least one of a fourth resin portion 440 adhered to the second plate abutment portion 520 and the third sidewall portion 142 of the second cover 500, and a fifth resin portion 450 adhered to the plate abutment portion 520 and the fourth sidewall portion 144 of the second cover 500; and a sixth resin portion 460 disposed in at least one of the third groove portion 146g and the fourth groove portion 520g.

[0125] In the electronic device 10 of this embodiment, the above-described structure is used, for example, according to reference... Figure 5A and Figure 5B For the same reasons mentioned above, the Z2 below can also prevent moisture from seeping into the interior of the electronic device 10 from the outside of the electronic device 10 through the space between the base plate 100 and the second cover 500.

[0126] Furthermore, in the electronic device 10 of this embodiment, for example, such as Figure 2A and Figure 11A As shown, the cover 200 fixed above the base plate 100 (Z1) and the second cover 500 fixed below the base plate 100 (Z2) can also have different shapes when viewed from above. Furthermore, as... Figure 10A , Figure 10B , Figure 11A as well as Figure 11B As shown, a third groove 146g and a fourth groove 520g may also be provided around the entire circumference of the second cover abutment portion 146 of the base plate and the second plate abutment portion 520 of the second cover 500, respectively.

[0127] In addition, such as Figure 10A as well as Figure 10B As shown, the base plate 100 may also include a second cover fixing part 162 for fixing the second cover 500 to the base plate 100. Multiple second cover fixing parts 162 may be provided, for example, including second cover fixing parts 162-1, 162-2, 162-3, and 162-4. Furthermore, the second cover fixing part 162 may also include a threaded hole through which a screw can be inserted.

[0128] In addition, such as Figure 11A as well as Figure 11BAs shown, the second cover 500 may also include a second plate fixing portion 562 for fixing the second cover 500 relative to the base plate 100. Multiple second plate fixing portions 562 may be provided, for example, including second plate fixing portions 562-1, 562-2, 562-3, and 562-4. Furthermore, the second plate fixing portion 562 may also include, for example, a threaded hole through which a screw can be inserted.

[0129] Reference Figure 13 and Figure 14 The method for fixing the cover 200 and the second cover 500 relative to the base plate 100 will be described. Figure 13 From Figure 13 Above the paper in the diagram, the elements are represented in a perspective view in the order of cover 200, base plate 100, and second cover 500. Figure 14 From Figure 14 The top of the paper is represented by a perspective view in the order of second cover 500, base plate 100, and cover 200.

[0130] like Figure 13 and Figure 14 As shown, when the cover 200 is fixed to the base plate 100, for example, plate fixing portions 260-1, 260-2, ..., and 260-8 are fixed relative to the cover fixing portions 160-1, 160-2, ..., and 160-8 of the base plate 100, thereby fixing the cover 200 relative to the base plate 100. Similarly, when the second cover 500 is fixed to the base plate 100, for example, the second plate fixing portions 562-1, 562-2, 562-3, and 560-4 are fixed relative to the second cover fixing portions 162-1, 162-2, 162-3, and 162-4 of the base plate 100, respectively, thereby fixing the second cover 500 relative to the base plate 100. In this embodiment, when the cover 200 is fixed to the base plate 100 or the second cover 500 is fixed to the base plate 100, the first resin part 410, the second resin part 420 and the third resin part 430 or the fourth resin part 440, the fifth resin part 450 and the sixth resin part 460 may be provided respectively.

[0131] The embodiments described above are provided for easy understanding of the present invention and are not intended to limit or interpret the invention. The elements, configurations, materials, conditions, shapes, and dimensions of the embodiments are not limited to those illustrated and can be appropriately modified. Furthermore, the structures shown in different embodiments can be partially substituted for or combined with each other.

Claims

1. An electronic device, wherein, have: Electronic substrate, on which electronic components are mounted; A substrate on which the electronic substrate is mounted; The cover, which is fixed to the base plate; and Resin section, The base plate has: bottom surface; The wall portion includes a first sidewall portion and a second sidewall portion; and The cover abutting portion includes a first groove portion. The first sidewall portion and the second sidewall portion extend from the bottom surface in the direction in which the electronic substrate is disposed. The cover abutment portion is disposed between the first sidewall portion and the second sidewall portion. The cover has: The surface of the cover, which is opposite to the electronic substrate; and The plate abutting portion abuts against the cover abutting portion, and at least a portion thereof is provided with a second groove. The resin portion includes: At least one of the first resin portion adhered to the plate abutment portion and the first sidewall portion, and the second resin portion adhered to the plate abutment portion and the second sidewall portion; and A third resin section is disposed in at least one of the first tank section and the second tank section.

2. The electronic device according to claim 1, wherein, The electronic device includes the second resin portion.

3. The electronic device according to claim 1, wherein, The electronic device includes: a fourth resin portion disposed at least a portion between the cover abutment portion and the plate abutment portion.

4. The electronic device according to claim 1, wherein, The first groove and the second groove are connected in at least a portion.

5. The electronic device according to claim 1, wherein, A first space layer is provided between the bottom of the first groove or the bottom of the second groove and the third resin section.

6. The electronic device according to claim 1, wherein, A second space is provided between the cover abutment portion and the third resin portion within the first groove or the second groove.

7. The electronic device according to claim 1, wherein, The first groove or the second groove is at least a portion of a polygon, a circle or an ellipse in the cross-sectional view.

8. The electronic device according to claim 1, wherein, The first groove is provided around the entire circumference of the cover abutment portion of the wall portion. The second groove is provided around the entire circumference of the plate abutment portion of the wall portion.

9. The electronic device according to claim 1, wherein, The electronic device further comprises: a second cover fixed to a cover fixing surface, the cover fixing surface being the side opposite to the side of the substrate on which the electronic substrate is placed. The base plate includes a second wall portion protruding from the cover fixing surface. The second wall portion has: Third side wall portion; A fourth sidewall portion, which is disposed outside the third sidewall portion; and The second cover abutting portion is disposed between the third side wall portion and the fourth side wall portion, abutting against the second cover, and has a third groove portion provided in at least a portion thereof. The second cover has: The plate opposite surface, which is opposite to the fixed surface of the cover; and The second plate abutting portion abuts against the second cover abutting portion, and at least a portion thereof is provided with a fourth groove. The electronic device includes: at least one of a fourth resin portion adhering to the second plate abutting portion and the third side wall portion of the second cover, and a fifth resin portion adhering to the second plate abutting portion and the fourth side wall portion of the second cover; and a sixth resin portion provided to at least one of the third groove portion and the fourth groove portion.

Images