Modular sealed protective high-power power adapter

Abstract

This invention discloses a modular, sealed, and protected high-power power adapter, relating to the field of power adapter technology. It includes a housing with a processing mechanism inside. The processing mechanism includes a potting compound shell, the outer surface of which is fixedly connected to the inner wall of the housing. A chassis is fixedly mounted on the inner wall of the potting compound shell. A circuit board is fixedly mounted on the bottom of the chassis. An EMI input filter module, a PFC power factor correction module, a main power conversion module, a secondary rectifier output module, an intelligent protection and sampling control module, and an external interface module are electrically connected to the upper surface of the circuit board. Connecting wires are electrically connected to the outer surface of the circuit board. A cooling component is installed inside the housing. This modular, sealed, and protected high-power power adapter, by incorporating the cooling component, allows the device to transfer the high temperature inside the chassis to the outside, thereby cooling the internal components. This results in the device having both good sealing and heat dissipation properties.

Description

Technical Field

[0001] This invention relates to the field of power adapter technology, specifically a modular, sealed, and protected high-power power adapter. Background Technology

[0002] Solar photovoltaic power generation systems, as a clean and renewable energy form, have been widely used in scenarios such as household energy storage, field communication base stations, off-grid power stations, street lighting, and power supply in remote areas. Among them, the power adapter, as a key energy conversion unit connecting photovoltaic modules and battery packs, undertakes the important functions of voltage transformation, voltage stabilization, and charging management of the unstable DC power output from the photovoltaic panels.

[0003] In existing technologies, high-power power adapters typically employ a full potting and sealing process to achieve high waterproof ratings before being encapsulated in a sealed shell. Although the potting compound has some thermal conductivity, it still constitutes a significant thermal resistance barrier compared to metal materials. Even if the shell uses excellent thermally conductive materials such as aluminum alloy, the internal potting compound layer still significantly hinders the effective conduction of heat from the heat-generating components to the shell, causing heat to accumulate inside the package. This results in electronic components operating at high temperatures for extended periods, which accelerates the failure rate of semiconductor devices, significantly shortens the lifespan of the power adapter, and reduces charging efficiency. This not only affects the stable power supply of solar energy systems but also brings great maintenance difficulties to remote areas and other scenarios where maintenance is inconvenient.

[0004] Combining the above issues, we find that existing modular sealed and protected high-power power adapters are difficult to avoid all the problems mentioned above when in use. Even if they can be solved, they require external tools, which fails to achieve the desired effect. Therefore, we propose a modular sealed and protected high-power power adapter. Summary of the Invention

[0005] The purpose of this invention is to provide a modular, sealed, and protected high-power power adapter to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a modular sealed protective high-power power adapter, including a housing, wherein a processing mechanism is provided inside the housing; The processing mechanism includes a potting shell, the outer surface of which is fixedly connected to the inner wall of the housing. A chassis is fixedly installed on the inner wall of the potting shell. A circuit board is fixedly installed on the bottom surface of the chassis. An EMI input filter module, a PFC power factor correction module, a main power conversion module, a secondary rectifier output module, an intelligent protection and sampling control module, and an external interface module are electrically connected to the upper surface of the circuit board. Connecting wires are electrically connected to the outer surface of the circuit board. The housing is equipped with a cooling component and a heat dissipation component.

[0007] Preferably, the cooling component includes a threaded rod rotatably connected to the inside of the chassis. A connecting gear is fixedly installed on the outer surface of the threaded rod, and a movable frame is threadedly connected to the outer surface of the threaded rod. A heat-conducting plate is fixedly installed on the inner wall of the movable frame. A plurality of heat-conducting columns are fixedly installed on the bottom surface of the heat-conducting plate, and a heat-conducting frame is installed on the upper surface of the heat-conducting plate. A connecting cylinder is fixedly installed on the inner top wall of the chassis, and a first shape memory alloy spring is fixedly installed on the inner wall of the connecting cylinder. A connecting column is fixedly installed at one end of the first shape memory alloy spring, and a rack plate is fixedly installed at one end of the connecting column. The outer surface of the rack plate meshes with the outer surface of the connecting gear. A heat-conducting rod is fixedly installed on the inner wall of the chassis, and a heat sink is fixedly installed on the outer surface of the housing. The outer surface of the heat-conducting rod contacts the outer surface of the heat-conducting frame and the outer surface of the heat sink, respectively.

[0008] Preferably, the heat dissipation assembly includes a temperature sensor, the outer surface of which is fixedly connected to the inner wall of the housing. A controller is fixedly installed on the inner wall of the housing. A rotating shaft is rotatably connected inside the housing. A sealing plate is fixedly installed on the outer surface of the rotating shaft. A sealing ring is fixedly installed on the outer surface of the sealing plate. A heat dissipation vent is provided on the outer surface of the housing. A connecting box is fixedly installed on the inner wall of the housing. A locking block is slidably connected inside the connecting box. An unlocking block is slidably connected on the outer surface of the locking block. A fixing post is fixedly installed on the outer surface of the locking block. A tooth is fixedly installed at one end of the fixing post. The plate has a rotating gear fixedly installed on the outer surface of the rotating shaft, and the outer surface of the rotating gear meshes with the outer surface of the toothed plate. Two connecting springs are fixedly installed on the inner wall of the connecting box. A limit block is fixedly installed at one end of each connecting spring. Each limit block is engaged inside the locking block and the unlocking block. An electric push rod is fixedly installed on the inner wall of the housing. A movable cylinder is fixedly installed at the telescopic end of the electric push rod. A second memory alloy spring is fixedly installed on the inner wall of the movable cylinder. A movable rod is fixedly installed at one end of the second memory alloy spring. One end of the movable rod is fixedly connected to the outer surface of the locking block.

[0009] Preferably, a slide rod is fixedly installed on the inner wall of the chassis, and the outer surface of the slide rod is slidably connected to the inner wall of the movable frame.

[0010] Preferably, a telescopic column is fixedly installed on the inner wall of the connecting cylinder, and the telescopic end of the telescopic column is fixedly connected to one end of the connecting column.

[0011] Preferably, a slider is fixedly installed on the upper surface of the rack plate, and a groove is provided on the inner top wall of the chassis, with the slider slidably connected inside the groove.

[0012] Preferably, a telescopic rod is fixedly installed on the inner wall of the movable cylinder, and the telescopic end of the telescopic rod is fixedly connected to the outer surface of the movable rod.

[0013] Preferably, two telescopic shafts are fixedly installed on the inner wall of the connecting box, and the telescopic end of each telescopic shaft is fixedly connected to the outer surface of the limiting block.

[0014] Preferably, a sliding plate is fixedly installed on the outer surface of the toothed plate, and a slide rail is provided on the inner wall of the housing, with the sliding plate slidably connected inside the slide rail.

[0015] Preferably, a T-shaped block is fixedly installed on the outer surface of the movable cylinder, and a groove is formed on the inner wall of the shell, with the T-shaped block slidably connected inside the groove.

[0016] Compared with the prior art, the beneficial effects of the present invention are: 1. This invention incorporates a cooling component, enabling the device to operate by utilizing the thermal expansion characteristic of a first shape memory alloy spring. This, in conjunction with the connecting column, moves the rack plate, causing the rack plate to rotate the connecting gear and threaded rod. This allows the heat-conducting column to contact the various modules inside the chassis, thereby transferring the high temperature inside the chassis to the outside through the heat-conducting column, heat-conducting plate, heat-conducting frame, heat-conducting rod, and heat sink. This process effectively cools the components inside the chassis, resulting in a device that simultaneously possesses excellent sealing and heat dissipation properties.

[0017] 2. This invention incorporates a heat dissipation component, allowing the device to utilize the temperature difference between the inside and outside of the potted shell. When the internal temperature of the chassis continues to rise, the second shape memory alloy spring, due to its thermal expansion characteristic, works in conjunction with a toothed plate to drive a rotating gear and a sealing plate. This causes the sealing plate to release the blockage of the heat dissipation vents, further cooling the interior of the casing. This allows the device to employ a phased temperature response control strategy, maintaining a tight seal under mild heat conditions and only opening the damper under severe heat conditions. This minimizes the risk of electronic components being exposed to high temperatures for extended periods, significantly extending the lifespan of the solar battery charging system. Attached Figure Description

[0018] Figure 1This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a structural schematic diagram of the rear view of the housing of the present invention; Figure 3 This is a schematic diagram of the structure of the shell of the present invention in cross-section; Figure 4 This is a structural schematic diagram of the cross-sectional view of the chassis of the present invention; Figure 5 This is a schematic diagram of the threaded rod of the present invention; Figure 6 This is a schematic diagram of the structure of the connecting cylinder of the present invention, viewed from the rear sectional view. Figure 7 This is a schematic diagram of the structure of the housing of the present invention, viewed from below in cross-section. Figure 8 This is a structural schematic diagram of the cross-sectional view of the movable cylinder of the present invention.

[0019] In the picture: 1. Shell; 2. Processing mechanism; 201. Potting housing; 202. Chassis; 203. Circuit board; 204. EMI input filter module; 205. PFC power factor correction module; 206. Main power conversion module; 207. Secondary rectifier output module; 208. Intelligent protection and sampling control module; 209. External interface module; 210. Connecting cable; 3. Cooling components; 301. Threaded rod; 302. Connecting gear; 303. Moving frame; 304. Heat-conducting plate; 305. Heat-conducting column; 306. Heat-conducting frame; 307. Connecting cylinder; 308. First shape memory alloy spring; 309. Connecting column; 310. Rack plate; 311. Heat-conducting rod; 312. Heat sink; 4. Heat dissipation assembly; 401. Temperature sensor; 402. Controller; 403. Rotating shaft; 404. Sealing plate; 405. Sealing ring; 406. Heat dissipation vent; 407. Connecting box; 408. Locking block; 409. Unlocking block; 410. Fixing column; 411. Toothed plate; 412. Rotating gear; 413. Connecting spring; 414. Limiting block; 415. Moving cylinder; 416. Second shape memory alloy spring; 417. Moving rod; 418. Electric push rod; 5. Slide rod; 6. Telescopic column; 7. Slider; 8. Slide groove; 9. Telescopic rod; 10. Telescopic shaft; 11. Slide plate; 12. Slide rail; 13. T-block; 14. Groove. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] Example 1: Please refer to Figures 1-7 This invention provides a technical solution: a modular sealed and protected high-power power adapter, including a housing 1. A processing mechanism 2 is disposed inside the housing 1. The processing mechanism 2 includes a potting shell 201. The outer surface of the potting shell 201 is fixedly connected to the inner wall of the housing 1. A chassis 202 is fixedly installed on the inner wall of the potting shell 201. A circuit board 203 is fixedly installed on the bottom surface of the chassis 202. The upper surface of the circuit board 203 is electrically connected to an EMI input filter module 204, a PFC power factor correction module 205, a main power conversion module 206, a secondary rectifier output module 207, an intelligent protection and sampling control module 208, and an external interface module 209. A connecting wire 210 is electrically connected to the outer surface of the circuit board 203. The EMI input filter module 204 includes components such as a fuse, an NTC surge suppression resistor, a varistor, a common-mode inductor, and X / Y safety capacitors to form a π-type EMI filter, filtering out grid noise and lightning pulse interference. The PFC power factor correction module 205 includes... The PFC control IC, boost MOS + PFC inductor, and high-voltage electrolytic capacitor boost the rectified DC to 380V DC with a power factor greater than or equal to 0.95, reducing grid harmonic losses. The main power conversion module 206 includes a PWM or LLC resonant main control chip, a high-frequency isolation transformer, and a primary-side switching transistor. High-power models commonly use an LLC resonant topology with an efficiency of 92%-96%. The secondary rectifier output module 207 includes Schottky and synchronous rectifier MOS, low-voltage filter capacitors, and ferrite bead filters, converting high-frequency low-voltage AC to smooth DC. Multi-output models can have multiple independent rectifier sub-modules. The secondary rectifier output module 207 includes optocoupler feedback, voltage / current sampling resistors, NTC temperature thermistors, and MCU protection chips, thus integrating six protection circuits: overvoltage OVP, overcurrent OCP, short-circuit SCP, overtemperature OTP, undervoltage UVP, and lightning protection. The circuit board 203 is equipped with six modular circuit units. The modular design facilitates individual repair and replacement of faulty modules without scrapping the entire power supply.

[0022] The housing 1 is equipped with a cooling component 3.

[0023] As a further definition of the cooling component 3 of the present invention, the cooling component 3 includes a threaded rod 301, which is rotatably connected to the inside of the housing 202. A connecting gear 302 is fixedly installed on the outer surface of the threaded rod 301. A movable frame 303 is threadedly connected to the outer surface of the threaded rod 301. A heat-conducting plate 304 is fixedly installed on the inner wall of the movable frame 303. A plurality of heat-conducting columns 305 are fixedly installed on the bottom surface of the heat-conducting plate 304. A heat-conducting frame 306 is installed on the upper surface of the heat-conducting plate 304. A connecting cylinder 307 is fixedly installed on the inner top wall of the housing 202. A first memory alloy spring 308 is fixedly installed on the inner wall of the connecting cylinder 307. A connecting column 309 is fixedly installed on one end of the first memory alloy spring 308. A rack plate 310 is fixedly installed on one end of the connecting column 309. The outer surface of the rack plate 310 meshes with the outer surface of the connecting gear 302. A heat-conducting rod 311 is fixedly installed on the inner wall of the housing 202. A heat dissipation device is fixedly installed on the outer surface of the housing 1. The outer surfaces of the heat-conducting rod 311 and the heat-conducting plate 312 are in contact with the outer surfaces of the heat-conducting frame 306 and the heat sink 312, respectively. By adjusting the lifting of the moving frame 303, the device avoids the heat-conducting column 305 from pressing on the modules for a long time, thus preventing damage to the modules. With the cooling component 3, when the device is running, the first memory alloy spring 308 expands when heated, which, together with the connecting column 309, drives the rack plate 310 to move. The rack plate 310 drives the connecting gear 302 and the threaded rod 301 to rotate, thereby making the heat-conducting column 305 contact the modules inside the chassis 202. The heat is transferred from the inside of the chassis 202 to the outside through the heat-conducting column 305, heat-conducting plate 304, heat-conducting frame 306, heat-conducting rod 311 and heat sink 312, thereby cooling the components inside the chassis 202. This gives the device both good sealing and heat dissipation.

[0024] A slide bar 5 is fixedly installed on the inner wall of the chassis 202. The outer surface of the slide bar 5 is slidably connected to the inner wall of the movable frame 303. The installation of the slide bar 5 restricts the movement trajectory of the movable frame 303, thereby preventing the movable frame 303 from rotating during movement and ensuring the stability of the movement of the movable frame 303.

[0025] A telescopic column 6 is fixedly installed on the inner wall of the connecting cylinder 307. The telescopic end of the telescopic column 6 is fixedly connected to one end of the connecting column 309. The installation of the telescopic column 6 plays a role in restricting the movement trajectory of the connecting column 309, thereby ensuring the stability of the movement of the connecting column 309.

[0026] A slider 7 is fixedly installed on the upper surface of the rack plate 310. A groove 8 is provided on the inner top wall of the housing 202. The slider 7 is slidably connected inside the groove 8. The installation of the slider 7 and the groove 8 plays a role in limiting the movement trajectory of the rack plate 310, thereby ensuring the stability of the movement of the rack plate 310.

[0027] The specific implementation of this embodiment is as follows: After the power adapter is connected to the photovoltaic power supply and starts working, the EMI input filter module 204, PFC power factor correction module 205, and main power conversion module 206 on the circuit board 203 are the main heat-generating components. The working losses continuously generate heat and accumulate inside the sealed chassis 202 and the inner space of the potting shell 201. When the temperature inside the chassis 202 rises to the phase change critical temperature of the first memory alloy spring 308, the first memory alloy spring inside the connecting cylinder 307... When heated, spring 308 undergoes martensitic deformation and axial elongation, causing connecting column 309 to move. This causes connecting column 309 to synchronously push rack plate 310 outwards. The slider 7 above rack plate 310 slides horizontally along the groove 8 on the inner top wall of housing 202, ensuring smooth lateral movement of rack plate 310. The horizontal movement of rack plate 310 engages and drives connecting gear 302 to rotate. Connecting gear 302 is coaxially fixed to threaded rod 301, causing threaded rod 301 to rotate synchronously with the gear. The rotation of 301 causes the moving frame 303 to move vertically downwards, which in turn causes the moving frame 303 to move downwards synchronously with the heat-conducting plate 304 and heat-conducting pillars 305. The bottom ends of the multiple heat-conducting pillars 305 are tightly pressed against the device housings 1 of each heat-generating module on the surface of the circuit board 203. The heat generated by the components is quickly conducted to the heat-conducting plate 304 through the heat-conducting pillars 305, and the heat continues to rise through the heat-conducting frame 306 to the heat-conducting rod 311. The heat-conducting rod 311 penetrates the potting shell 201 and is attached to the outside of the shell 1. When the heat sink 312 contacts the surface, the heat is eventually dissipated through natural convection between the large-area heat sink 312 and the outside air. When the internal temperature of the chassis 202 drops to room temperature, the first memory alloy spring 308 cools down and contracts, pulling the rack plate 310 back to its original position. The threaded rod 301 rotates in the opposite direction, and the moving frame 303, along with the heat-conducting column 305, is lifted upwards and removed from the surface of the components. This reduces unnecessary contact and compression at room temperature, avoids long-term pressure damage to the components, and the whole machine remains fully encapsulated and sealed, so dust and water protection are not affected.

[0028] Example 2: Please refer to Figure 2 , Figure 3 , Figure 7 and Figure 8 The present invention provides a technical solution: a modular sealed protective high-power power adapter. The present invention makes corresponding improvements to the technical problems mentioned in the background art. The heat dissipation component 4 is provided inside the housing 1.

[0029] As a further definition of the heat dissipation assembly 4 of the present invention, the heat dissipation assembly 4 includes a temperature sensor 401. The outer surface of the temperature sensor 401 is fixedly connected to the inner wall of the housing 1. Due to the difference in thermal conductivity between the potting shell 201 and the housing 1, and the fact that a heat sink 312 is provided on the outside of the housing 1, a significant temperature difference will occur between the housing 1 and the potting shell 201 and the inside of the chassis 202. A controller 402 is fixedly installed on the inner wall of the housing 1. A rotating shaft 403 is rotatably connected inside the housing 1. A sealing plate 404 is fixedly installed on the outer surface of the rotating shaft 403. A sealing ring 405 is fixedly installed on the outer surface of the sealing plate 404. A heat dissipation vent 406 is provided on the outer surface of the housing 1. A connecting box 40 is fixedly installed on the inner wall of the housing 1. 7. A locking block 408 is slidably connected inside the connecting box 407. An unlocking block 409 is slidably connected to the outer surface of the locking block 408. A fixing post 410 is fixedly installed on the outer surface of the locking block 408. A toothed plate 411 is fixedly installed at one end of the fixing post 410. A rotating gear 412 is fixedly installed on the outer surface of the rotating shaft 403. The outer surface of the rotating gear 412 meshes with the outer surface of the toothed plate 411. Two connecting springs 413 are fixedly installed on the inner wall of the connecting box 407. A limit block 414 is fixedly installed at one end of each connecting spring 413. Each limit block 414 is engaged inside the locking block 408 and the unlocking block 409. An electric push rod 418 is fixedly installed on the inner wall of the housing 1. The electric push rod 418 drives... The moving cylinder 415 moves, causing the unlocking block 409 to move to the other side of the limiting block 414, thereby assisting the locking block 408 in unlocking. The locking structure prevents temperature fluctuations inside the housing 1 due to heat dissipation from the heat vent 406, which could cause unstable opening of the sealing plate 404. The telescopic end of the electric push rod 418 is fixedly fitted with the moving cylinder 415. A second memory alloy spring 416 is fixedly fitted to the inner wall of the moving cylinder 415. A moving rod 417 is fixedly fitted to one end of the second memory alloy spring 416. One end of the moving rod 417 is fixedly connected to the outer surface of the locking block 408. The temperature sensor 401 detects the temperature inside the housing 1, and when the temperature inside the housing 1 drops to a certain range, the locking block 408 is unlocked. The device unlocks by controlling the operation of the electric push rod 418. With the heat dissipation component 4, the device utilizes the temperature difference between the inside and outside of the potted shell 201. When the internal temperature of the chassis 202 continues to rise, the second shape memory alloy spring 416 expands due to heat, which, in conjunction with the toothed plate 411, drives the rotating gear 412 and the sealing plate 404 to rotate. This causes the sealing plate 404 to release the blockage of the heat dissipation vent 406, further dissipating heat inside the shell 1. The device adopts a temperature-stage response control strategy, maintaining a tight seal as much as possible under light heat conditions and opening the damper only under heavy heat conditions. This minimizes the risk of electronic components being exposed to high temperatures for extended periods and significantly extends the service life of the solar battery charging system.

[0030] A telescopic rod 9 is fixedly installed on the inner wall of the movable cylinder 415. The telescopic end of the telescopic rod 9 is fixedly connected to the outer surface of the movable rod 417. The installation of the telescopic rod 9 plays a role in limiting the movement trajectory of the movable rod 417, thereby ensuring the stability of the movement of the movable rod 417.

[0031] Two telescopic shafts 10 are fixedly installed on the inner wall of the connecting box 407. The telescopic end of each telescopic shaft 10 is fixedly connected to the outer surface of the limiting block 414. The installation of the telescopic shafts 10 serves to limit the movement trajectory of the limiting block 414.

[0032] A slide plate 11 is fixedly installed on the outer surface of the toothed plate 411, and a slide rail 12 is provided on the inner wall of the housing 1. The slide plate 11 is slidably connected inside the slide rail 12. The installation of the slide plate 11 and the slide rail 12 plays a role in limiting the movement trajectory of the toothed plate 411, thereby ensuring the stability of the movement of the toothed plate 411.

[0033] A T-shaped block 13 is fixedly installed on the outer surface of the movable cylinder 415, and a groove 14 is provided on the inner wall of the housing 1. The T-shaped block 13 is slidably connected inside the groove 14. The installation of the T-shaped block 13 and the groove 14 plays a role in restricting the movement trajectory of the movable cylinder 415, thereby ensuring the stability of the movement of the movable cylinder 415.

[0034] The specific implementation of this embodiment is as follows: Under normal low-temperature conditions, the sealing plate 404, along with the sealing ring 405, completely seals the heat dissipation port 406. The sealing ring 405 is pressed to achieve sealing, waterproofing, and dustproofing. When the ambient temperature is high and the adapter is running at full power and full load, and the internal temperature of the chassis 202 exceeds the warning value, and the primary heat conduction and heat dissipation cannot meet the heat dissipation requirements, the second memory alloy spring 416 inside the moving cylinder 415 extends due to heat. Under the guidance and limitation of the telescopic rod 9, it pushes the moving rod 417 forward, and the moving rod 417 pushes the locking block 4. 08 Lateral displacement causes the locking block 408 to press against the limiting blocks 414 on both sides. The limiting blocks 414 overcome the elastic force of the connecting spring 413 and retract along the telescopic shaft 10 to disengage from the slot. Then, the locking block 408 continues to move, causing the limiting blocks 414 to engage between the locking block 408 and the unlocking block 409 under the action of the elastic force of the connecting spring 413, thereby limiting the locking block 408. The locking block 408 is pulled by the fixed column 410 to move the toothed plate 411, so that the toothed plate 411 meshes with the rotating gear 4. 12. Rotating gear 412 drives coaxial rotating shaft 403 to rotate. Rotating shaft 403 drives sealing plate 404 to flip, causing sealing ring 405 to move away from heat dissipation vent 406 along with sealing plate 404. Heat dissipation vent 406 is fully open, forming a convection airflow channel between the inside of housing 1 and the outside air, quickly dissipating accumulated residual heat. After the internal temperature of housing 1 drops to a safe value, electric push rod 418 retracts, thereby driving locking block 408 to continue moving closer to the side of sealing plate 404, thus allowing... The unlocking block 409 moves to the other side of the limiting block 414 for easy unlocking. Then, the electric push rod 418 extends back to its original position, causing the unlocking block 409 to move away from the sealing plate 404 in conjunction with the locking block 408. Afterward, the second memory alloy spring 416 cools down and contracts, causing the toothed plate 411 to rotate in conjunction with the rotating gear 412, driving the rotating shaft 403 and the sealing plate 404 to rotate. This causes the sealing plate 404 to seal the heat dissipation port 406 again, ensuring the good sealing performance of the device.

[0035] Specifically, when using this device: First, after the power adapter is connected to the photovoltaic power supply and starts working, the EMI input filter module 204, PFC power factor correction module 205, and main power conversion module 206 on the circuit board 203 are the main heat-generating components. Their operating losses continuously generate heat, which accumulates inside the sealed chassis 202 and the inner space of the potting shell 201. When the temperature inside the chassis 202 reaches the critical phase transformation temperature of the first memory alloy spring 308, the first memory alloy spring 308 inside the connecting cylinder 307 undergoes martensitic to austenitic deformation and axial elongation, thereby driving the connecting column 309 to move. This causes the connecting column 309 to simultaneously push the rack plate 310 outwards. The slider 7 above the rack plate 310 slides horizontally along the sliding groove 8 on the inner top wall of the chassis 202, ensuring the rack plate 310 moves smoothly laterally. 310 horizontal movement meshes with the connecting gear 302, which is coaxially fixed to the threaded rod 301, causing the threaded rod 301 to rotate synchronously with the gear. The rotation of the threaded rod 301 causes the moving frame 303 to move vertically downwards, which in turn causes the moving frame 303 to move downwards synchronously with the heat-conducting plate 304 and the heat-conducting column 305. The bottom ends of the multiple heat-conducting columns 305 are tightly pressed against the device housing 1 of each heat-generating module on the surface of the circuit board 203. The heat generated by the components is quickly conducted to the heat-conducting plate 304 through the heat-conducting column 305. The heat continues to rise and is conducted upwards through the heat-conducting frame 306 to the heat-conducting rod 311. The heat-conducting rod 311 penetrates the potting shell 201 and contacts the heat sink 312 attached to the outside of the shell 1. Finally, the heat is dissipated through the large-area heat sink 312 and natural convection with the outside air. Then, under normal low-temperature conditions, the sealing plate 404, along with the sealing ring 405, completely seals the heat dissipation vent 406. The sealing ring 405 is pressed tightly to achieve a seal that is waterproof and dustproof. When the ambient temperature is high and the adapter is running at full power and full load, and the internal temperature of the chassis 202 exceeds the warning value, and the primary heat conduction and heat dissipation cannot meet the heat dissipation requirements, the second memory alloy spring 416 inside the moving cylinder 415 is heated and elongates. Under the guidance and limitation of the telescopic rod 9, it pushes the moving rod 417 forward. The moving rod 417 pushes the locking block 408 to move laterally, causing the locking block 408 to press against the limit blocks 414 on both sides. The limit blocks 414 overcome the elastic force of the connecting spring 413 and retract along the telescopic shaft 10 to disengage from the slot. After that, the lock... As the fixed block 408 continues to move, the limiting block 414 is engaged between the locking block 408 and the unlocking block 409 under the action of the connecting spring 413, thereby limiting the locking block 408. The locking block 408 is pulled by the fixed column 410 to move the toothed plate 411, so that the toothed plate 411 meshes and drives the rotating gear 412 to rotate. The rotating gear 412 drives the coaxial rotating shaft 403 to rotate. The rotating shaft 403 drives the sealing plate 404 to flip, so that the sealing ring 405 leaves the heat dissipation port 406 opening along with the sealing plate 404. The heat dissipation port 406 is fully open, and the interior of the housing 1 forms a convection air channel with the outside air, quickly dissipating the accumulated residual heat. Furthermore, after the internal temperature of housing 1 drops to a safe level, the electric push rod 418 retracts, thereby causing the locking block 408 to continue moving closer to the sealing plate 404, thus moving the unlocking block 409 to the other side of the limit block 414 for easy unlocking. Then, the electric push rod 418 extends back to its original position, causing the unlocking block 409 to move away from the sealing plate 404 in conjunction with the locking block 408. Afterwards, the second memory alloy spring 416 cools and retracts, causing the toothed plate 411 to work with the rotating gear 412 to drive the rotating shaft 40. 3. The sealing plate 404 rotates, thereby sealing the heat dissipation port 406 again, ensuring the good sealing performance of the device. When the internal temperature of the chassis 202 drops to room temperature, the first memory alloy spring 308 cools and contracts, pulling the rack plate 310 back to its original position. The threaded rod 301 rotates in the opposite direction, and the moving frame 303, together with the heat-conducting column 305, is lifted upward and removed from the surface of the components, reducing unnecessary contact and compression at room temperature and avoiding long-term pressure damage to the components. The whole machine still maintains a fully sealed potting state, and dust and water protection are not affected.

[0036] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0037] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A modular sealed ruggedized high power power supply adapter comprising a housing (1), characterized in that: The housing (1) is equipped with a processing mechanism (2); The processing mechanism (2) includes a potting shell (201), the outer surface of which is fixedly connected to the inner wall of the shell (1), a chassis (202) is fixedly installed on the inner wall of the potting shell (201), a circuit board (203) is fixedly installed on the bottom surface of the chassis (202), and an EMI input filter module (204), a PFC power factor correction module (205), a main power conversion module (206), a secondary rectifier output module (207), an intelligent protection and sampling control module (208), and an external interface module (209) are electrically connected to the upper surface of the circuit board (203). A connecting wire (210) is electrically connected to the outer surface of the circuit board (203). The housing (1) is provided with a cooling component (3) and a heat dissipation component (4).

2. The modular sealed protective high-power power adapter according to claim 1, characterized in that: The cooling component (3) includes a threaded rod (301), which is rotatably connected to the inside of the chassis (202). A connecting gear (302) is fixedly installed on the outer surface of the threaded rod (301). A movable frame (303) is threadedly connected to the outer surface of the threaded rod (301). A heat-conducting plate (304) is fixedly installed on the inner wall of the movable frame (303). Several heat-conducting columns (305) are fixedly installed on the bottom surface of the heat-conducting plate (304). A heat-conducting frame (306) is installed on the upper surface of the heat-conducting plate (304). A connecting cylinder (307) is fixedly installed on the inner top wall of the chassis (202). A first memory alloy spring (308) is fixedly installed on the inner wall of the cylinder (307). A connecting column (309) is fixedly installed on one end of the first memory alloy spring (308). A rack plate (310) is fixedly installed on one end of the connecting column (309). The outer surface of the rack plate (310) meshes with the outer surface of the connecting gear (302). A heat-conducting rod (311) is fixedly installed on the inner wall of the chassis (202). A heat sink (312) is fixedly installed on the outer surface of the shell (1). The outer surface of the heat-conducting rod (311) contacts the outer surface of the heat-conducting frame (306) and the outer surface of the heat sink (312) respectively.

3. A modular sealed protective high-power power adapter according to claim 1, characterized in that: The heat dissipation assembly (4) includes a temperature sensor (401), the outer surface of which is fixedly connected to the inner wall of the housing (1). A controller (402) is fixedly installed on the inner wall of the housing (1). A rotating shaft (403) is rotatably connected inside the housing (1). A sealing plate (404) is fixedly installed on the outer surface of the rotating shaft (403). A sealing ring (405) is fixedly installed on the outer surface of the sealing plate (404). A heat dissipation vent (406) is opened on the outer surface of the housing (1). A connecting box (407) is fixedly installed on the inner wall of the housing (1). A locking block (408) is slidably connected inside the connecting box (407). An unlocking block (409) is slidably connected on the outer surface of the locking block (408). A fixing post (410) is fixedly installed on the outer surface of the locking block (408). A toothed plate (41) is fixedly installed at one end of the fixing post (410). 1) A rotating gear (412) is fixedly installed on the outer surface of the rotating shaft (403). The outer surface of the rotating gear (412) meshes with the outer surface of the toothed plate (411). Two connecting springs (413) are fixedly installed on the inner wall of the connecting box (407). A limit block (414) is fixedly installed at one end of each connecting spring (413). Each limit block (414) is snapped into the inside of the locking block (408) and the unlocking block (409). An electric push rod (418) is fixedly installed on the inner wall of the housing (1). A moving cylinder (415) is fixedly installed at the telescopic end of the electric push rod (418). A second memory alloy spring (416) is fixedly installed on the inner wall of the moving cylinder (415). A moving rod (417) is fixedly installed at one end of the second memory alloy spring (416). One end of the moving rod (417) is fixedly connected to the outer surface of the locking block (408).

4. A modular sealed and protected high-power power adapter according to claim 2, characterized in that: A slide rod (5) is fixedly installed on the inner wall of the chassis (202), and the outer surface of the slide rod (5) is slidably connected to the inner wall of the movable frame (303).

5. A modular sealed and protected high-power power adapter according to claim 2, characterized in that: The inner wall of the connecting cylinder (307) is fixedly installed with a telescopic column (6), and the telescopic end of the telescopic column (6) is fixedly connected to one end of the connecting column (309).

6. A modular sealed protective high-power power adapter according to claim 2, characterized in that: A slider (7) is fixedly installed on the upper surface of the rack plate (310), and a groove (8) is provided on the inner top wall of the housing (202). The slider (7) is slidably connected inside the groove (8).

7. A modular sealed protective high-power power adapter according to claim 3, characterized in that: The inner wall of the movable cylinder (415) is fixedly installed with a telescopic rod (9), and the telescopic end of the telescopic rod (9) is fixedly connected to the outer surface of the movable rod (417).

8. A modular sealed protective high-power power adapter according to claim 3, characterized in that: The inner wall of the connecting box (407) is fixedly installed with two telescopic shafts (10), and the telescopic end of each telescopic shaft (10) is fixedly connected to the outer surface of the limiting block (414).

9. A modular sealed protective high-power power adapter according to claim 3, characterized in that: A slide plate (11) is fixedly installed on the outer surface of the toothed plate (411), and a slide rail (12) is provided on the inner wall of the housing (1). The slide plate (11) is slidably connected to the inside of the slide rail (12).

10. A modular sealed protective high-power power adapter according to claim 3, characterized in that: A T-shaped block (13) is fixedly installed on the outer surface of the movable cylinder (415), and a groove (14) is provided on the inner wall of the shell (1). The T-shaped block (13) is slidably connected inside the groove (14).

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