Plug-in immersion jet cooling heat dissipation system

The modular design of the plug-in immersion jet cooling system resolves the conflict between heat dissipation and ease of maintenance in liquid cooling systems, achieving efficient heat dissipation and rapid module replacement, thereby improving the availability and maintainability of electronic equipment.

CN122497032APending Publication Date: 2026-07-31WENZHOU UNIV OUJIANG COLLEGE
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
WENZHOU UNIV OUJIANG COLLEGE
Filing Date
2026-01-19
Publication Date
2026-07-31

AI Technical Summary

Technical Problem

Existing liquid cooling systems present a contradiction between efficient heat dissipation and convenient maintenance. Traditional designs result in cumbersome replacement of faulty modules, and the plugging and unplugging process can easily cause overheating and damage to the equipment, affecting system availability and maintainability.

Method used

The modular design of the plug-in immersion jet cooling system enables synchronous connection and disconnection of the coolant path and power signal, supports hot-swapping, simplifies maintenance procedures, and ensures fast and safe module replacement.

Benefits of technology

It achieves efficient heat dissipation and fast, safe module replacement, improving system availability and maintainability, and meeting the heat dissipation requirements of high-performance electronic devices.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention belongs to the field of electronic device heat dissipation technology, specifically relating to a pluggable immersion jet cooling system. The pluggable immersion jet cooling system includes a cover plate, front and rear panels, left and right side panels, a base, a printed circuit board (PCB) motherboard, and immersion jet cooling modules. The immersion jet cooling modules are pluggable. When a module is inserted into the system, a precise positioning mechanism automatically aligns the module connector with the base connector, establishing a coolant circulation channel. Simultaneously, the module connector and the PCB motherboard connector are connected, enabling power supply and signal transmission. When the module is removed, it is completely disconnected from the fluid and electrical interfaces of the base. This invention synergistically achieves efficient heat dissipation from the immersion jet and rapid, safe pluggable / unpluggable modules, ensuring stable electrical performance of the PCB while maintaining efficient heat dissipation. Furthermore, the system supports hot-swappable expansion, allowing for flexible module configuration according to heat dissipation requirements, enabling maintenance and upgrades without system downtime, significantly enhancing system adaptability and lifecycle value.
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Description

Technical Field

[0001] This invention belongs to the field of heat dissipation technology for electronic devices, and specifically relates to a plug-in immersion jet cooling system. Background Technology

[0002] The current electronic devices face severe challenges in heat dissipation. With the explosive growth of chip power density, traditional air-cooling technology can no longer meet the heat dissipation requirements of devices with high heat flux density. Although advanced technologies such as immersion liquid cooling and jet impingement cooling can provide excellent heat dissipation performance, they encounter a key bottleneck in practical applications: a prominent contradiction between efficient heat dissipation and convenient maintenance. Existing liquid cooling systems often employ integrated or complex piping designs, requiring the replacement of faulty modules to interrupt the entire cooling system, resulting in cumbersome and time-consuming maintenance procedures. Furthermore, improper handling of the separation sequence of coolant passages and electrical connections during insertion and removal can easily lead to overheating and damage to the equipment, severely restricting system availability and maintainability. Therefore, the industry urgently needs an innovative cooling solution that meets heat dissipation requirements, ensures rapid insertion and removal functionality, and does not affect the operation of the entire system. This solution needs to be able to synergistically achieve efficient heat dissipation from immersion jets and rapid, safe insertion and removal of modules, thereby completely resolving the contradiction between heat dissipation performance and ease of maintenance, and meeting the dual stringent requirements of high-performance electronic devices for heat dissipation and reliable operation. Summary of the Invention

[0003] In view of this, the present invention provides a heat dissipation system with a pluggable modular design employing immersion jet cooling. During insertion, precise positioning ensures synchronous connection between the coolant passage and the power signal; when the module is removed, the fluid connector and electrical connector disconnect synchronously, making operation simple and reliable. The system supports hot-swappable expansion, allowing for flexible module configuration according to heat dissipation requirements, enabling maintenance and upgrades without system downtime.

[0004] To achieve the above technical objectives, the specific technical solution adopted by this invention is as follows: This invention proposes a pluggable immersion jet cooling and heat dissipation system, comprising: a system coolant inlet, which is connected to an external coolant inlet when the pluggable immersion jet cooling and heat dissipation system is in the working position; and a system coolant outlet, which is connected to an external coolant outlet when the pluggable immersion jet cooling and heat dissipation system is in the working position; wherein, when the pluggable immersion jet cooling and heat dissipation system is in the working position, coolant flows through the system coolant inlet - module coolant inlet - module coolant outlet - system coolant outlet; the left and right side plates of the system have grooves for fixing the immersion jet cooling heat exchange module.

[0005] Furthermore, the number of grooves on the left and right side plates can be determined based on the number of immersion jet cooling heat exchange modules in the system.

[0006] An immersion jet cooling heat exchange module includes: a lower cover plate for fixing a printed circuit board assembly; a jet cover plate containing an array jet structure; and a printed circuit board assembly perpendicular to the jet direction of the jet cover plate and disposed between the jet cover plate and the lower cover plate; wherein the immersion jet cooling heat exchange module is pluggable, and when in the working position, the printed circuit board assembly is powered on and the module obtains coolant flow through the inlet and outlet connectors of the base connected to the connector.

[0007] Furthermore, the immersion jet cooling heat exchange module also includes an electrical connector disposed on the side of the immersion jet cooling heat exchange module containing the connector, and electrically connected to the printed circuit board assembly; two opposite sides, different from the side of the electrical connector, are respectively provided with a coolant inlet and a coolant outlet; the coolant inlet is on the jet cover plate, and the coolant outlet is on the lower cover plate, and the coolant inlet and coolant outlet are used to provide circulating coolant to the immersion jet cooling heat exchange module; the insertion and removal directions of the coolant inlet and coolant outlet are the same as those of the electrical connector.

[0008] Furthermore, jet holes are arrayed on the jet cover plate; the diameter of each jet hole and the spacing between the holes can be adjusted according to the temperature and flow field distribution of the heat exchange module assembly. Attached Figure Description

[0009] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0010] Figure 1 This is a schematic diagram of a plug-in immersion jet cooling and heat dissipation system according to a specific embodiment of the present invention; Figure 2 This is a schematic diagram of the plug-in immersion jet cooling system in a specific embodiment of the present invention.

[0011] Figure 3 This is a schematic diagram of the immersion jet cooling heat exchange module in a specific embodiment of the present invention; wherein: 1, system coolant inlet connector; 2, system coolant outlet connector; 3, front panel; 4, upper cover plate; 5, base; 6, right side plate; 7, printed circuit board motherboard; 8, left side plate; 9, immersion jet cooling heat exchange module; 10, rear panel; 11, module coolant inlet; 12, module coolant outlet; 13, module connector; 14, lower cover plate; 15, module printed circuit board; 16, jet cover plate.

Claims

1. An immersion jet cooling heat exchange module assembly, characterized in that, include: The bottom cover is used to secure the printed circuit board assembly. A jet cover plate containing an array jet structure; A printed circuit board assembly is disposed between the jet cover and the lower cover, perpendicular to the jet direction of the jet cover. Wherein: the immersion jet cooling heat exchange module is pluggable. When it is in the working position, the printed circuit board assembly is powered on and the module obtains coolant flow by connecting the inlet and outlet connectors of the base through the connector.

2. The immersion jet cooling heat exchange module according to claim 1, characterized in that, The immersion jet cooling heat exchange module also includes an electrical connector, which is disposed on one side of the heat exchange module and electrically connected to the printed circuit board; Two opposite sides, different from the electrical connector, are respectively provided with a coolant inlet and a coolant outlet; the coolant inlet is on the jet cover plate, and the coolant outlet is on the lower cover plate. The coolant inlet and coolant outlet are used to provide circulating coolant for the immersion jet cooling heat exchange module; the insertion and removal directions of the coolant inlet and coolant outlet are the same as those of the electrical connector.

3. The immersion jet cooling heat exchange module according to claim 2, characterized in that, Liquid cooling connectors are provided at both the coolant inlet and coolant outlet.

4. The immersion jet cooling heat exchange module assembly according to claim 3, characterized in that, The jet cover plate has an array of jet holes; the diameter of each jet hole and the spacing between the holes can be adjusted according to the temperature and flow field distribution of the heat exchange module assembly.

5. A pluggable immersion jet cooling heat dissipation system for controlling the immersion jet cooling heat exchange module according to any one of claims 1-4, characterized in that, include: When the immersion jet cooling heat exchange module is in the working position, the system coolant inlet is connected to the external coolant inlet. When the immersion jet cooling heat exchange module is in the working position, the system coolant outlet is connected to the external coolant outlet. When the plug-in immersion jet cooling system is in the working position, the coolant forms a coolant flow from the system coolant inlet to the module coolant inlet, then to the module coolant outlet, and finally to the system coolant outlet. The system's left and right side plates have grooves for fixing the immersion jet cooling heat exchange module; The system's left and right side plates have grooves for fixing the immersion jet cooling heat exchange module.

6. Furthermore, the number of grooves on the left and right side plates can be determined based on the number of immersion jet cooling heat exchange modules in the system.