Immersion cooling assembly for controlling temperature of electronics in a vehicle

Abstract

An immersion cooling assembly for controlling the temperature of electronic equipment in a vehicle includes a tank and a liquid coolant disposed in the tank. The immersion cooling assembly includes a first electronic device disposed in the tank and at least partially immersed in the liquid coolant. The immersion cooling assembly also includes a second electronic device disposed in the tank and at least partially immersed in the liquid coolant, the second electronic device being spaced laterally from the first electronic device. The immersion cooling assembly includes a perforated baffle disposed in the tank along the lateral direction between the first and second electronic devices and at least partially immersed in the liquid coolant.

Description

Technical Field

[0001] This specification generally relates to means for controlling the temperature of electronic devices in mobile environments, and more specifically, to means for controlling the temperature of electronic devices that reduce the sloshing of liquid coolant in mobile environments. Background Technology

[0002] Immersion cooling systems for electronic devices are typically used in fixed environments, such as those supported by building floors or server racks. Using immersion cooling systems for electronic devices in mobile environments, such as those supported by moving vehicles, can cause sloshing of the liquid coolant and reduce cooling performance.

[0003] Therefore, there is a need for a device for controlling the temperature of electronic devices that reduces the sloshing of liquid coolant in mobile environments. Summary of the Invention

[0004] In one embodiment, an immersion cooling assembly for controlling the temperature of an electronic device in a mobile environment includes a tank and a liquid coolant disposed within the tank. The immersion cooling assembly includes a first electronic device disposed within the tank and at least partially immersed in the liquid coolant. The immersion cooling assembly also includes a second electronic device disposed within the tank and at least partially immersed in the liquid coolant, the second electronic device being spaced laterally from the first electronic device. The immersion cooling assembly includes a perforated baffle disposed laterally within the tank between the first and second electronic devices and at least partially immersed in the liquid coolant. The perforated baffle is configured to break up coolant vapor bubbles formed in the liquid coolant due to heat generated by either the first or second electronic device and / or reduce sloshing of the liquid coolant.

[0005] In another embodiment, an immersion cooling assembly for controlling the temperature of an electronic device in a mobile environment includes a tank and a liquid coolant disposed within the tank. The immersion cooling assembly includes an electronic device disposed within the tank and immersed in the liquid coolant. The immersion cooling assembly includes a perforated baffle disposed within the tank directly above the electronic device and at least partially immersed in the liquid coolant. The perforated baffle is configured to decompose coolant vapor bubbles formed in the liquid coolant due to heat generated by the electronic device and / or reduce sloshing of the liquid coolant.

[0006] These and other additional features provided by the embodiments described herein will be more fully understood through the following detailed description in conjunction with the accompanying drawings. While specific embodiments are indicated, it will be understood that elements from one described aspect may be combined with separately identified aspects. Attached Figure Description

[0007] The embodiments illustrated in the accompanying drawings are illustrative and exemplary, and are not intended to limit the subject matter defined by the claims. The following detailed description of the illustrative embodiments will be understood when read in conjunction with the following drawings, wherein similar structures are indicated by similar reference numerals, and wherein:

[0008] Figure 1 A perspective view of a vehicle having an exemplary immersion cooling assembly according to one or more embodiments shown and described herein is schematically depicted;

[0009] Figure 2 One or more embodiments illustrated and described herein are schematically depicted. Figure 1 A cross-sectional view of an exemplary immersion cooling assembly;

[0010] Figure 3 A cross-sectional view of another exemplary immersion cooling assembly is schematically depicted according to one or more embodiments shown and described herein; and

[0011] Figure 4 A lattice structure for use in an exemplary immersion cooling assembly is schematically depicted. Detailed Implementation

[0012] The embodiments described herein relate to immersion cooling assemblies for controlling the temperature of electronic devices in mobile environments, such as in vehicles. Immersion cooling assemblies typically include a tank, a liquid coolant disposed in the tank, one or more electronic devices disposed in the tank and at least partially immersed in the liquid coolant, and one or more perforated baffles disposed in the tank and at least partially immersed in the liquid coolant. The perforated baffles can control the dynamics of the liquid coolant, for example, to reduce or eliminate sloshing of the liquid coolant, and thereby increase the heat transfer efficiency for removing heat from the electronic devices. Various embodiments of immersion cooling assemblies for controlling the temperature of electronic devices in vehicles are described in more detail herein.

[0013] As used herein, directional terms such as up, down, right, left, front, back, top, and bottom are used only relative to the drawn diagram and are not intended to imply absolute orientation. The terms “vertical,” “above,” “below,” etc., refer to the upward-downward direction of the exemplary immersion cooling assembly (i.e., in…). Figure 2 and Figure 3 The + / -Y directions are shown in the figure. That is, "above" is defined as the positive Y direction, generally oriented towards the coordinate axes shown in the figure. "Below" is defined as the negative Y direction, roughly oriented towards the coordinate axes shown in the figure. The terms "lateral," etc., refer to directions roughly perpendicular to the vertical (i.e., in...). Figure 2 and Figure 3 The direction of the + / -Y direction shown is, for example, in the approximately front-back direction and / or approximately left-right direction.

[0014] This document may express a range as from “about” one particular value and / or to “about” another particular value. When expressing such a range, another embodiment includes from one particular value and / or to another particular value. Similarly, when a value is expressed as an approximation using the antecedent “about,” it will be understood that the particular value forms another embodiment. It will be further understood that each endpoint of the range is significant both relative to and independent of the other endpoint.

[0015] As used herein, the singular forms “a,” “an,” and “the” include plural referents unless the context explicitly indicates otherwise. Thus, for example, a reference to a component “a” includes aspects having two or more such components unless the context explicitly indicates otherwise.

[0016] Wherever possible, the same reference numerals will be used throughout the figures to refer to the same or similar parts.

[0017] Now for reference Figure 1 The image schematically depicts a carrier 10 having an exemplary immersion cooling assembly 12. The immersion cooling assembly 12 is configured to utilize a liquid coolant 14 as a means of controlling one or more electronic devices 16, 18 (in...). Figure 2 and Figure 3 The heat transfer medium at the temperature (shown schematically in the diagram).

[0018] Vehicle 10 may be, for example, but not limited to, a car, van, SUV, bus, boat, aircraft, and / or any other type of vehicle configured for mobility. Vehicle 10 may operate in an autonomous mode, i.e., with limited human input or without human input. An exemplary immersion cooling assembly 12 may be supported by vehicle 10, for example, fixed to vehicle 10, such as under the hood 11 in the front vehicle compartment 13 (as shown), in the rear vehicle compartment (not shown), by the top of the vehicle, such as within a housing supported by the top, and may include sensors (e.g., cameras, LiDAR sensors, etc. (not shown)) or any other suitable structures for autonomous operation of vehicle 10. For example, the exemplary immersion cooling assembly 12 is schematically represented and not shown to scale relative to the dimensions of the illustrated vehicle 10.

[0019] refer to Figure 2 and Figure 3One or more electronic devices 16, 18 may facilitate the operation of various components and / or systems of the vehicle 10 that rely on each of the one or more electronic devices 16, 18 for information processing, analysis, generation of electronic commands, etc. For example, but not limited to, the vehicle 10 operates in an autonomous mode. For example, but not limited to, each of the one or more electronic devices 16, 18 may be configured to analyze image data (e.g., captured by a camera or LIDAR device 15) to identify objects near the vehicle 10 and navigate the vehicle 10 to avoid contact with the identified objects.

[0020] Liquid coolant 14 may include, for example, but not limited to, water, ethylene glycol (EG), propylene glycol (PG), etc. Liquid coolant 14 may be a dielectric liquid that provides electrical isolation for the one or more electronic devices 16, 18. For example, liquid coolant 14 may include mineral oil, n-hexane, n-heptane, natural castor oil ester, refined and dried castor oil, Hatcol 5005 synthetic ester, silicone oil, fluorinated liquid FC-72, Novec 649, Novec 7100, polychlorinated biphenyls, pure water, liquid nitrogen, liquid helium, liquid argon, or other suitable dielectric liquids.

[0021] The exemplary immersion cooling assembly 12 can be a single-phase cooler or a two-phase cooler. As a single-phase cooler, the liquid coolant 14 remains in a single-phase state, i.e., a liquid. In other words, when the exemplary immersion cooling assembly 12 is a single-phase cooler, the liquid coolant 14 remains in a liquid phase during operation and only changes temperature when heat is removed from the one or more electronic devices 16, 18. As a two-phase cooler, the liquid coolant 14 changes phase, i.e., from liquid to gas, and vice versa. In other words, when the exemplary immersion cooling assembly 12 is a two-phase cooler, the liquid coolant 14 can change from a liquid to a gaseous state when heat is removed from the one or more electronic devices 16, 18. When heated to the boiling point of the liquid coolant 14, the liquid coolant 14 can change to a gaseous phase. For example, water as the liquid coolant 14, at a pressure of 1 atmosphere (atm), will change from a liquid phase to a gaseous phase when heated to 100 degrees Celsius by the one or more electronic devices 16, 18.

[0022] Continue to refer to Figure 2 and Figure 3An exemplary immersion cooling assembly 12 includes a tank 20 for containing a liquid coolant 14 and support components (e.g., the one or more electronic devices 16, 18 of the exemplary immersion cooling assembly 12). The tank 20 may include, for example, but not limited to, a bottom 22 and sidewalls 24 connected to and extending from the bottom 22. The sidewalls 24 may circumferentially surround the bottom 22. For example, but not limited to, a pair of sidewalls 24 spaced apart from each other in a lateral direction (i.e., in the + / -X direction) may extend upward from opposite ends of the bottom 22 in a vertical direction (i.e., in the + / -Y direction). Another pair of sidewalls 24 (not shown) may be spaced apart from each other in a direction perpendicular to both the lateral direction (i.e., in the + / -X direction) and the vertical direction (i.e., in the + / -Y direction), and may extend upward from opposite ends of the bottom 22 in the vertical direction (i.e., in the + / -Y direction), and may extend from one of the pair of sidewalls 24 spaced apart in the lateral direction (i.e., in the + / -X direction) to the other of the pair of sidewalls 24 spaced apart in the lateral direction (i.e., in the + / -X direction).

[0023] Bottom 22 and sidewall 24 may define chamber 26. Bottom 22 may define the bottom of chamber 26 and sidewall 24 may define the sides of chamber 26. Can 20 may include a top wall 28 connected to the sidewall and opposite to bottom 22. Top wall 28 may further define chamber 26, for example, by closing or defining the top of chamber 26. One or more components of can 20 (e.g., bottom 22, sidewall 24, and / or top wall 28) may be integral. For the purposes of this disclosure, "integral" means a single unit, i.e., continuous material without fasteners, joints, welds, adhesives, etc., holding multiple components together. For example, can 20 may be formed in a common injection molding operation, 3D printing in the same operation, stamping operation, etc. Alternatively, the components of can 20 (e.g., bottom 22, sidewalls 24, and / or top wall 28) may be formed separately and then secured to each other, for example, by fasteners such as, but not limited to, welds, screws, rivets, nuts and bolts, adhesives, epoxy resins, and other suitable structures and / or processes. Can 20 may be made of metal, plastic, fiberglass, or any other suitable material.

[0024] Liquid coolant 14 is disposed in and held by chamber 26 of tank 20. For example, but not limited to, chamber 26 defined by tank 20 may be at least partially filled with liquid coolant 14. The liquid coolant 14 in chamber 26 may be spaced apart from top wall 28, for example, to provide a volume 30 within chamber 26 that is substantially free of liquid coolant 14. In other words, tank 20 may include fluids other than liquid coolant 14, for example, gases disposed therein together with liquid coolant 14. The fluids and the liquid coolant 14 may generally be separated from each other, for example, due to gravity.

[0025] The one or more electronic devices 16, 18 are disposed within the chamber 26 of the tank 20. For example, but not limited to, the exemplary immersion cooling assembly 12 may include a first electronic device 16 and a second electronic device 18 positioned within the chamber 26 of the tank 20. It should be understood and appreciated that a smaller number (e.g., only one) or a larger number (e.g., three or more) of electronic devices 16, 18 may be positioned within the chamber 26 of the tank 20.

[0026] The one or more electronic devices 16, 18 may be configured to process information and / or command vehicle components, for example, but not limited to, to facilitate autonomous operation of one or more vehicle systems (such as braking systems, steering systems, propulsion systems, etc.). Each of the one or more electronic devices 16, 18 may include, for example, a circuit board assembly 34 attached to a direct-bonded copper (DBC) substrate 36. For example, in some embodiments, the circuit board assembly 34 may be a printed circuit board (PCB). In other embodiments, the circuit board assembly 34 may be flexible, rigid, high-density interconnected, etc. Furthermore, in some embodiments, the circuit board assembly 34 may be single-layered. In other embodiments, the circuit board assembly 34 may be multi-layered.

[0027] The circuit board assembly 34 for each of the one or more electronic devices 16, 18 may be an active device, including one or more insulated-gate bipolar transistors (IGBTs), one or more metal-oxide-semiconductor field-effect transistors (MOSFETs), etc. For example, but not limited to, the circuit board assembly 34 may include embedded semiconductors, control / drive / protection electronic circuitry, power devices, and / or passive components. The circuit board assembly 34 for each of the one or more electronic devices 16, 18 may include multiple dielectric layers and multiple power layers. The power layers may include dielectric and conductive materials. The dielectric layers may include dielectric materials and conductive vias that provide electrical communication or paths between adjacent power layers. In other words, the power layers may include conductive (e.g., copper) patterns, and the dielectric layers may include conductive (e.g., copper) paths connecting the conductive patterns, such that the circuit board assembly 34 for each of the one or more electronic devices 16, 18 operates and / or functions as desired.

[0028] The DBC substrate 36 may include a ceramic base 38 and a copper layer 40 opposite to the circuit board assembly 34. The ceramic base 38 may be configured to electrically insulate the circuit board assembly 34 from the copper layer 40. Materials other than ceramic may be used for the DBC substrate 36. For example, but not limited to, the base 38 may be aluminum, or other materials having generally high thermal conductivity. A dielectric layer may be included between the base 38 and the copper layer 40, for example, when the base 38 is a conductive material, using techniques known to those skilled in the art to insulate the base 38 and the copper layer 40.

[0029] During operation of electronic devices 16, 18, circuit board assembly 34 may generate heat. This heat can be dissipated from circuit board assembly 34 via DBC substrate 36, for example, keeping the temperature of circuit board assembly 34 below its maximum operating temperature. For example, the maximum operating temperature may typically be in the range of about 90 to about 110 degrees Celsius. Heat can flow through base 38 and reach copper layer 40 of DBC substrate 36. At copper layer 40, heat can be absorbed by liquid coolant 14 retained in chamber 26 of tank 20, for example, causing coolant 14 to undergo a phase change to gas and generate bubbles 42.

[0030] The one or more electronic devices 16, 18 (e.g., first electronic device 16 and second electronic device 18) may be spaced apart from each other in the lateral direction (i.e., in the + / -X direction). Each of the one or more electronic devices 16, 18 in the chamber 26 of the can 20 may extend in the vertical direction (i.e., in the + / -Y direction). That is, the height of each of the one or more electronic devices 16, 18 in the vertical direction (i.e., in the + / -Y direction) may be greater than the width of each of the one or more electronic devices 16, 18 in the lateral direction (i.e., in the + / -X direction). The first electronic device 16 and the second electronic device 18 may be oriented such that the phase transition surface 17 of the first electronic device 16 and the phase transition surface 19 of the second electronic device 18 face each other. For example, but not limited to, the copper layer 40 of the first electronic device 16 may face the copper layer 40 of the second electronic device 18. In other words, the copper layers 40 of the first electronic device 16 and the second electronic device 18 may be located between the circuit board assembly 34 of the first electronic device 16 and the ceramic base 38 of the second electronic device 18, respectively.

[0031] like Figure 2 and Figure 3 As schematically shown, the one or more electronic devices 16, 18 can be completely immersed in the liquid coolant 14, i.e., completely encapsulated by the liquid coolant 14. That is, the top surface 32 of the liquid coolant 14 in the chamber 26 of the tank 20 can be higher than the farthest top of the one or more electronic devices 16, 18 in the vertical direction (i.e., in the + / -Y direction). The one or more electronic devices 16, 18 can be partially immersed in the liquid coolant 14 in the tank 20 (not shown). That is, the one or more electronic devices 16, 18 can extend vertically (i.e., in the + / -Y direction) from inside the liquid coolant 14 in the tank 20 above the top surface 32 of the liquid coolant 14 in the tank 20.

[0032] An exemplary immersion cooling assembly 12 may include a condenser 44. The condenser 44 may be disposed within a chamber 26 of the tank 20 and positioned above the liquid coolant 14 in a vertical direction (i.e., in the + / - Y direction). For example, the condenser 44 may be disposed within a volume 30 above the top surface 32 of the liquid coolant 14, for instance, near the top wall 28 within the chamber 26. The condenser 44 may be included in the exemplary immersion cooling assembly 12 to remove heat from the gaseous coolant in the volume 30, causing the gas to undergo a phase change to a liquid state. In this case, the condenser 44 relies on efficient heat transfer that occurs during the phase change as the coolant fluid in the gaseous phase condenses into the liquid phase. The gaseous coolant contacts the outer surface of the condenser 44 at a temperature higher than that of the secondary fluid circulating in the condenser 44. As the gaseous coolant cools, it reaches its saturation temperature, condenses into a liquid on the outer surface of the condenser 44, and releases a significant amount of latent heat. When this process occurs, the amount of vapor coolant retained in chamber 26 of tank 20 decreases and the amount of liquid coolant 14 increases.

[0033] One or more perforated baffles 46, 48, 50, 52 are disposed in tank 20 to reduce sloshing and / or other agitation of the liquid coolant 14. For example, as further discussed below, the one or more perforated baffles 46, 48 may reduce the movement of the liquid coolant 14 within tank 20 in the lateral (i.e., in the + / -X direction) and / or vertical (i.e., in the + / -Y direction) directions, and may break down and generally disperse bubbles 42 in the liquid coolant 14, such bubbles being generated, for example, when the liquid coolant 14 changes from a liquid phase to a gaseous phase in response to sufficient heat transfer from the one or more electronic devices 16, 18 to the liquid coolant 14. The one or more perforated baffles 46, 48, 50, 52 are positioned vertically (i.e., in the + / -Y direction) between the bottom 22 and the condenser 44. Each perforated baffle 46, 48, 50, 52 may be fully or partially immersed in the liquid coolant 14, as further discussed below. The one or more perforated baffles 46, 48, 50, 52 may extend completely across the chamber 26, for example from one sidewall 24 to the opposite sidewall 24, and as further discussed below. The one or more perforated baffles 46, 48, 50, 52 may be supported by the tank 20, for example, but not limited to being fixed to the bottom 22 and / or the sidewall 24.

[0034] Each perforated baffle 46, 48, 50, 52 includes one or more openings 54, 56, 58 that allow fluid (such as liquid coolant 14 and / or air bubbles 42 therein) to flow from one side of the perforated baffle 46, 48, 50, 52 to the opposite side. The openings 54, 56, 58 may have the same size as each other and / or may vary in size. The openings 54, 56, 58 may be uniformly or non-uniformly distributed. The openings 54, 56, 58 may be circular or any shape, including irregular shapes.

[0035] As a non-limiting example, openings 54, 56, and 58 may be provided by extending through the through holes of perforated baffles 46, 48, 50, and 52. Openings 54, 56, and 58 may extend in a transverse (i.e., in the + / -X direction), vertical (i.e., in the + / -Y direction), and / or transverse to both the transverse (i.e., in the + / -X direction) and vertical (i.e., in the + / -Y direction) directions.

[0036] As another non-limiting example, the perforated baffles 46, 48, 50, and 52 may include a lattice structure 60, such as... Figure 4 As shown. The lattice structure 60 includes interconnected porous cells 62 arranged in a periodic and regular manner. The interconnected porous cells 62 are open to provide openings 54, 56, 58, i.e., allowing fluid to flow into and through each cell 62. Cells 62 can be, for example, but not limited to, hexagonal, octagonal, or any other suitable shape. The lattice structure 60 can be provided, for example, by additive manufacturing or any other suitable process.

[0037] The examples shown for perforated baffles 46, 48, 50, and 52 with openings 54, 56, and 58 are not limiting, and other baffles, such as screens, honeycomb cores, and simple perforated plates (i.e., plates with holes of different sizes), can be envisioned using additive or subtractive manufacturing processes.

[0038] As used herein, the term "additive manufacturing" or "additive manufacturing technology or process" generally refers to a manufacturing process in which continuous layers of material are stacked on top of each other to "build" a three-dimensional part layer by layer. Continuous layers are typically fused together to form a single part, which may have various monolithic sub-parts. While this document describes additive manufacturing techniques capable of creating complex objects by typically building objects point-by-point, layer by layer in a vertical direction, other manufacturing methods are possible and within the scope of this subject matter. For example, although the discussion herein involves adding material to form continuous layers, those skilled in the art will understand that the methods and structures disclosed herein can be implemented using any additive manufacturing technology or manufacturing technique. For example, embodiments of the invention may use layer-additive processes, layer-subtractive processes, or hybrid processes.

[0039] Suitable additive manufacturing techniques according to this disclosure may include, for example, but not limited to, fused deposition modeling (FDM), selective laser sintering (SLS), 3D printing (such as by inkjet printers and laser printers), stereolithography (SLA), direct selective laser sintering (DSLS), electron beam sintering (EBS), electron beam melting (EBM), laser engineered net-shape (LENS), laser net-shape manufacturing (LNSM), direct metal deposition (DMD), digital light processing (DLP), direct selective laser melting (DSLM), selective laser melting (SLM), direct metal laser melting (DMLM), and other known processes.

[0040] The additive manufacturing processes described herein can be used to form parts using any suitable materials. For example, materials can be plastics, metals, concrete, ceramics, polymers, epoxy resins, photosensitive polymer resins, or any other suitable material, which can be solid, liquid, powder, sheet material, wire, or any other suitable form. More specifically, according to exemplary embodiments of this subject matter, the additively manufactured parts described herein can be formed partially, wholly, or in combination of materials, including but not limited to pure metals, nickel alloys, chromium alloys, titanium, titanium alloys, magnesium, magnesium alloys, aluminum, aluminum alloys, and nickel or cobalt-based superalloys (e.g., those available from Special Metals Corporation under the name Inconel®). These materials are examples of materials suitable for use in the additive manufacturing processes described herein and may generally be referred to as “additive materials.”

[0041] Furthermore, those skilled in the art will understand that a variety of materials and methods for bonding these materials can be used and considered within the scope of this disclosure. The reference to “fusion” as used herein can refer to any suitable process used to create a bonding layer of any of the materials described above. For example, if the object is made of a polymer, fusion can refer to creating a thermosetting bond between polymeric materials. If the object is an epoxy resin, the bond can be formed by a crosslinking process. If the material is ceramic, the bond can be formed by a sintering process. If the material is a powder metal, the bond can be formed by a melting or sintering process. Those skilled in the art will understand that other methods of manufacturing parts using additive manufacturing are possible, and these methods can be employed to implement the subject matter currently disclosed.

[0042] Furthermore, the additive manufacturing processes disclosed herein allow for the formation of a single part from multiple materials. Therefore, the parts described herein can be formed from any suitable mixture of the aforementioned materials. For example, a part may comprise multiple layers, segments, or components formed using different materials, processes, and / or on different additive manufacturing machines. In this way, parts with different materials and material properties that meet the requirements of any particular application can be constructed. Moreover, although the parts described herein are entirely constructed using additive manufacturing processes, it should be understood that, in alternative embodiments, all or part of these parts may be formed by casting, machining, and / or any other suitable manufacturing process. In fact, these parts can be formed using any suitable combination of materials and manufacturing methods.

[0043] An exemplary additive manufacturing process will now be described. Additive manufacturing processes use three-dimensional (3D) information about a part, such as a three-dimensional computer model of the part, to manufacture the part. Therefore, a three-dimensional design model of the part can be defined before manufacturing. In this regard, a model or prototype of the part can be scanned to determine the part's three-dimensional information. As another example, a model of the part can be constructed using a suitable computer-aided design (CAD) program to define the part's three-dimensional design model.

[0044] The design model may include 3D digital coordinates of the entire configuration of a component, including both its external and internal surfaces. For example, the design model may define a body, surfaces and / or internal channels (such as openings 54, 56, 58), support structures, etc. In one exemplary embodiment, the three-dimensional design model is converted into multiple slices or segments, for example, along a central (e.g., vertical) axis or any other suitable axis of the component. Each slice may define a thin cross-section of the component at a predetermined height. Multiple consecutive cross-sectional slices together form the 3D component. The component is then “built” slice by slice or layer by layer until completion.

[0045] In this way, the parts described herein can be manufactured using additive manufacturing processes, or more specifically, by forming each layer sequentially, for example, by fusing or polymerizing plastics using laser energy or heat, or by sintering or melting metal powders. Certain types of additive manufacturing processes can use energy beams, such as electron beams, or electromagnetic radiation (such as laser beams) to sinter or melt powder materials. Any suitable laser and laser parameters can be used, including considerations regarding power, laser beam spot size, and scanning speed. The building material can be formed from any suitable powder or material.

[0046] The condenser 44 may be positioned vertically (i.e., in the + / - Y direction) above one or more perforated baffles 46, 48, 50, 52 of the exemplary immersion cooling assembly 12. The condenser 44 may also be positioned vertically (i.e., in the + / - Y direction) above the one or more electronic devices 16, 18 within the tank 20 of the exemplary immersion cooling assembly 12. For example, but not limited to, the condenser 44 may be positioned vertically (i.e., in the + / - Y direction) above the top surface 32 of the liquid coolant 14 within the tank 20 (e.g., within volume 30).

[0047] refer to Figure 2 One or more perforated baffles 46, 48 (e.g., a first perforated baffle 46 and a second perforated baffle 48) may be disposed in the tank 20 along the lateral direction (i.e., in the + / -X direction) between the first electronic device 16 and the second electronic device 18. The first perforated baffle 46 and / or the second perforated baffle 48 may control the lateral fluid movement within the tank 20. For example, the first perforated baffle 46 and / or the second perforated baffle 48 may allow fluid to flow laterally through the openings 54 of the first perforated baffle 46 and the second perforated baffle 48.

[0048] The first perforated baffle 46 and / or the second perforated baffle 48 may extend in the vertical direction (i.e., in the + / -Y direction). That is, the height of the first perforated baffle 46 and / or the second perforated baffle 48 in the vertical direction (i.e., in the + / -Y direction) may be longer than the width of the first perforated baffle 46 and / or the second perforated baffle 48 in the transverse direction (i.e., in the + / -X direction). The first perforated baffle 46 and / or the second perforated baffle 48 may extend from one sidewall 24 (not shown) of a pair of sidewalls 24 (not shown) to the other sidewall 24 (not shown) in a direction perpendicular to both the transverse direction (i.e., in the + / -X direction) and the vertical direction (i.e., in the + / -Y direction), and the pair of sidewalls 24 are spaced apart from each other in a direction perpendicular to both the transverse direction (i.e., in the + / -X direction) and the vertical direction (i.e., in the + / -Y direction). The first perforated baffle 46 and / or the second perforated baffle 48 may be generally planar and generally perpendicular to the lateral direction (i.e., in the + / -X direction).

[0049] Although two perforated baffles 46, 48 are shown between the first electronic device 16 and the second electronic device 18, it is to be understood that fewer (i.e., zero or one) or more (i.e., more than two) perforated baffles may be provided between the first electronic device 16 and the second electronic device 18.

[0050] The one or more perforated baffles 46, 48 disposed between the first electronic device 16 and the second electronic device 18 can be completely submerged in the liquid coolant 14 in the tank 20. That is, the top surface 32 of the liquid coolant 14 in the tank 20 can be positioned vertically (i.e., in the + / - Y direction) above the farthest end of the one or more perforated baffles 46, 48 disposed between the first electronic device 16 and the second electronic device 18. The one or more perforated baffles 46, 48 disposed between the first electronic device 16 and the second electronic device 18 can be partially submerged in the liquid coolant 14 in the tank 20 (not shown). That is, the one or more perforated baffles 46, 48 disposed between the first electronic device 16 and the second electronic device 18 can extend vertically (i.e., in the + / - Y direction) from within the liquid coolant 14 in the tank 20 above the top surface 32 of the liquid coolant 14 in the tank 20.

[0051] The first perforated baffle 46 may be spaced apart from the second perforated baffle 48 in the lateral direction (i.e., in the + / -X direction) and define a flow channel 64 between the first perforated baffle 46 and the second perforated baffle 48. The flow channel 64 may extend in the vertical direction (i.e., in the + / -Y direction). The flow channel 64 may be without any other components therein. For example, but not limited to, the flow channel 64 may be without any electronic equipment therein. The condenser 44 may be disposed above the flow channel 64 in the vertical direction (i.e., in the + / -Y direction). The condenser 44 may be located directly above the flow channel 64. That is, the condenser 44 and the flow channel 64 may overlap in the lateral direction (i.e., in the + / -X direction).

[0052] The one or more perforated baffles 46, 48 (e.g., first perforated baffle 46 and second perforated baffle 48) disposed between the first electronic device 16 and the second electronic device 18 can cause the coolant vapor bubbles 42 formed in the liquid coolant 14 to break up. That is, the first perforated baffle 46 and the second perforated baffle 48 can disperse the coolant vapor bubbles 42 formed in the liquid coolant 14 within the liquid coolant 14. For example, but not limited to, the openings 54 of the first perforated baffle 46 and the second perforated baffle 48 can be smaller than the average size of the bubbles 42 formed by the electronic devices 16, 18 during operation of the first electronic device 16 and the second electronic device 18. For example, the average size of the bubbles 42 can be predetermined by using a photographic technique that includes capturing an image of the bubbles 42 with a camera and then analyzing the image to calculate the bubble diameter based on pixel measurements. The bubbles 42 formed by the electronic devices 16, 18 during operation can flow through the openings 54 of the first perforated baffle 46 or the second perforated baffle 48 into the flow channel 64, for example, due to lateral forces generated during the movement of the carrier 10. As the liquid flows past the first perforated baffle 46 or the second perforated baffle 48, the bubbles 42 formed by the electronic devices 16, 18 during operation can break into smaller bubbles 42 in the flow channel 64. Within the flow channel 64, the bubbles 42 rise upwards in the liquid toward the condenser 44.

[0053] refer to Figure 3 In some embodiments, one or more perforated baffles 50, 52 (e.g., a third perforated baffle 50 and a fourth perforated baffle 52) may be disposed directly above the one or more electronic devices 16, 18 in the tank 20 in a vertical direction (i.e., in the + / -Y direction). That is, the third perforated baffle 50 and / or the fourth perforated baffle 52 may overlap with the first electronic device 16 and / or the second electronic device 18 in a lateral direction (i.e., in the + / -X direction) and in a direction perpendicular to both the lateral direction (i.e., in the + / -X direction) and the vertical direction (i.e., in the + / -Y direction).

[0054] The third perforated baffle 50 and the fourth perforated baffle 52 can control the vertical fluid movement within the tank 20. For example, the third perforated baffle 50 and the fourth perforated baffle 52 can allow fluid to flow from one side of the respective perforated baffle 50, 52 to the opposite side of the perforated baffle 50, 52 through the openings 56, 58 of the third perforated baffle 50 and the fourth perforated baffle 52.

[0055] The third perforated baffle 50 and the fourth perforated baffle 52 can be located below the condenser 44. That is, the third perforated baffle 50 and the fourth perforated baffle 52 can be arranged vertically within the tank 20 and positioned between the one or more electronic devices 16, 18 and the condenser 44. The third perforated baffle 50 and the fourth perforated baffle 52 can be located directly below the condenser 44.

[0056] The fourth perforated baffle 52 may be disposed above the third perforated baffle 50 in the vertical direction (i.e., in the + / -Y direction). For example, but not limited to, the fourth perforated baffle 52 may be disposed between the condenser 44 and the third perforated baffle 50 in the vertical direction (i.e., in the + / -Y direction).

[0057] The third perforated baffle 50 and / or the fourth perforated baffle 52 may extend above the electronic devices 16, 18 from one sidewall 24 of the pair of sidewalls 24 in a lateral direction (i.e., in the + / -X direction), the pair of sidewalls 24 being spaced apart from each other in the lateral direction (i.e., in the + / -X direction). The third perforated baffle 50 and / or the fourth perforated baffle 52 may extend above the electronic devices 16, 18 from one sidewall 24 (not shown) of the pair of sidewalls 24 in a direction perpendicular to both the lateral direction (i.e., in the + / -X direction) and the vertical direction (i.e., in the + / -Y direction), the pair of sidewalls 24 being spaced apart from each other in a direction perpendicular to both the lateral direction (i.e., in the + / -X direction) and the vertical direction (i.e., in the + / -Y direction). The third perforated baffle 50 and / or the fourth perforated baffle 52 may be generally planar and generally perpendicular to the vertical direction (i.e., in the + / -Y direction).

[0058] The third perforated baffle 50 and / or the fourth perforated baffle 52 may extend in the lateral direction (i.e., in the + / -X direction). That is, the width of the third perforated baffle 50 and / or the fourth perforated baffle 52 in the lateral direction (i.e., in the + / -X direction) may be longer than the height of the third perforated baffle 50 and / or the fourth perforated baffle 52 in the vertical direction (i.e., in the + / -Y direction). Although two perforated baffles 50, 52 are shown disposed above the first electronic device 16 and the second electronic device 18, it should be understood that fewer (i.e., zero or one) or more than two perforated baffles may be disposed above the first electronic device 16 and the second electronic device 18.

[0059] The one or more perforated baffles 50, 52 disposed above the first electronic device 16 and the second electronic device 18 can be completely submerged in the liquid coolant 14 in the tank 20. That is, the top surface 32 of the liquid coolant 14 in the tank 20 can be located vertically (i.e., in the + / - Y direction) above the farthest end of the one or more perforated baffles 50, 52 disposed above the one or more electronic devices 16, 18. For example, but not limited to, both the third perforated baffle 50 and the fourth perforated baffle 52 can be completely submerged in the liquid coolant 14. Alternatively, the fourth perforated baffle 52 can be disposed above or partially submerged in the liquid coolant 14, while the third perforated baffle 50 is completely submerged in the liquid coolant 14 (not shown), or the fourth perforated baffle 52 can be disposed above the top surface 32 of the liquid coolant 14, while the third perforated baffle 50 is partially submerged in the liquid coolant 14 (also not shown).

[0060] The one or more perforated baffles 50, 52 (e.g., third and fourth perforated baffles 52) disposed above the one or more electronic devices 16, 18 in the tank 20 can decompose the coolant vapor bubbles 42 formed in the liquid coolant 14. That is, the third and fourth perforated baffles 50 and 52 can disperse the coolant vapor bubbles 42 formed in the liquid coolant 14 into smaller bubbles 42 within the liquid coolant 14. For example, but not limited to, the openings 56, 58 of the third and fourth perforated plates can be smaller than the average size of the bubbles 42 formed by the electronic devices 16, 18 during operation.

[0061] When two or more perforated baffles 50, 52 are positioned above one or more electronic devices 16, 18 in the tank 20 (e.g., a third perforated baffle 50 and a fourth perforated baffle 52), such perforated baffles 50, 52 can progressively decompose the coolant vapor bubbles 42 formed in the liquid coolant 14, for example, first decomposing into bubbles 42 smaller than those initially formed by the one or more electronic devices 16, 18 in the liquid coolant 14, and then into even smaller bubbles 42. For example, but not limited to, the opening 56 of the third perforated baffle 50 may be smaller than the opening 58 of the fourth perforated baffle 52 in terms of width, diameter, and / or cross-sectional area. The dimensions of the openings 56, 58 of the third perforated baffle 50 and / or the fourth perforated baffle 52 may be measured, for example, along the lateral direction (i.e., in the + / -X direction). Additionally or alternatively, the opening 56 of the third perforated baffle 50 may be offset from the opening 58 of the fourth perforated baffle 52 in the lateral direction (i.e., in the + / -X direction). That is, the opening 56 of the third perforated baffle 50 and the opening 58 of the fourth perforated baffle 52 may be positioned such that the opening 56 of the third perforated baffle 50 does not completely overlap with the opening 58 of the fourth perforated baffle 52 in the lateral direction (i.e., in the + / -X direction). The opening 56 of the third perforated baffle 50 and the opening 58 of the fourth perforated baffle 52 may be positioned such that the opening 56 of the third perforated baffle 50 does not overlap with the openings 54, 56, and 58 of the fourth perforated baffle 52 in the lateral direction (i.e., in the + / -X direction).

[0062] Bubbles 42 formed by electronic devices 16 and 18 during operation can flow upwards to the third perforated baffle 50 and through its opening 56. Flowing through the opening 56 of the third perforated baffle 50 reduces the size of the bubbles 42. Starting from the opening 56 of the third perforated baffle 50, bubbles 42 flow upwards to the fourth perforated baffle 52, for example, contacting the solid portion of the fourth perforated baffle 52 located between its openings 58. Bubbles 42 can then flow through the openings 58 of the fourth perforated baffle, further reducing their size and dispersing them.

[0063] Figure 3 The third perforated baffle 50 and / or the fourth perforated baffle 52 shown can be used with Figure 2 The first perforated baffle 46 and / or the second perforated baffle 48 (not shown) are used in combination. In this combination, the third perforated baffle 50 and / or the fourth perforated baffle 52 may be disposed above the one or more perforated baffles 46, 48 between the first electronic device 16 and the second electronic device 18 in a vertical direction (i.e., in the + / -Y direction).

[0064] As can be seen from the above, this article defines an immersion cooling assembly for use in vehicles or other mobile environments, which controls the temperature of one or more electronic devices and is configured to reduce sloshing of liquid coolant during vehicle operation.

[0065] The document uses adjectives such as "first," "second," etc., as identifiers, and is not intended to indicate importance or order.

[0066] It should be noted that the term "approximately" can be used to indicate the degree of uncertainty attributable to any quantitative comparison, value, measurement, or other representation. The term is also used to indicate the extent to which a quantitative representation may deviate from the stated reference without causing a change in the fundamental function of the subject of interest.

[0067] While specific embodiments have been shown and described, it should be understood that various other changes and modifications may be made without departing from the spirit and scope of the claimed subject matter. Furthermore, although various aspects of the claimed subject matter have been described herein, these aspects are not necessarily used in combination. Therefore, the appended claims are intended to cover all such changes and modifications within the scope of the claimed subject matter.

Claims

1. An immersion cooling assembly for controlling the temperature of electronic devices in a mobile environment, the immersion cooling assembly comprising: Can; Liquid coolant contained in the tank; A first electronic device disposed in the tank and at least partially immersed in the liquid coolant; A second electronic device is disposed in the tank and at least partially immersed in the liquid coolant, the second electronic device being spaced apart from the first electronic device in the lateral direction; as well as A perforated baffle is disposed in the tank along the lateral direction between the first electronic device and the second electronic device and is at least partially submerged in the liquid coolant. The perforated baffle is configured to decompose coolant vapor bubbles formed in the liquid coolant due to heat generated by the first electronic device or the second electronic device and / or reduce the sloshing of the liquid coolant.

2. The immersion cooling assembly of claim 1, wherein the perforated baffle extends along a vertical axis.

3. The immersion cooling assembly of claim 1, wherein the perforated baffle comprises a grid structure.

4. The immersion cooling assembly of claim 1 further includes a second perforated baffle disposed in the tank between the first electronic device and the second electronic device along the lateral direction.

5. The immersion cooling assembly of claim 4, wherein the perforated baffle is spaced apart from the second perforated baffle along the lateral direction and defines a flow channel between the perforated baffle and the second perforated baffle.

6. The immersion cooling assembly according to claim 5 further includes a condenser disposed above the flow channel.

7. The immersion cooling assembly according to claim 1 further includes a second perforated baffle disposed above the first electronic device and the second electronic device.

8. The immersion cooling assembly of claim 7, wherein the second perforated baffle extends along the lateral direction.

9. The immersion cooling assembly of claim 8, wherein the second perforated baffle is immersed in the liquid coolant.

10. The immersion cooling assembly according to claim 9 further includes a third perforated baffle disposed above the second perforated baffle.

11. The immersion cooling assembly of claim 10, wherein the opening of the third perforated baffle is smaller than the opening of the second perforated baffle.

12. The immersion cooling assembly of claim 10, wherein the opening of the third perforated baffle is offset from the opening of the second perforated baffle.

13. An immersion cooling assembly for controlling the temperature of an electronic device in a mobile environment, the immersion cooling assembly comprising: Can; Liquid coolant contained in the tank; Electronic equipment disposed in the tank and immersed in the liquid coolant; as well as A perforated baffle is disposed in the tank directly above the electronic device and at least partially submerged in the liquid coolant; The perforated baffle is configured to decompose coolant vapor bubbles formed in the liquid coolant due to heat generated by the electronic device and / or reduce the sloshing of the liquid coolant.

14. The immersion cooling assembly of claim 13, wherein the perforated baffle comprises a grid structure.

15. The immersion cooling assembly of claim 13, further comprising a condenser disposed above the perforated baffle.

16. The immersion cooling assembly of claim 13, wherein the perforated baffle extends laterally and is completely immersed in the liquid coolant.

17. The immersion cooling assembly of claim 13, wherein the tank includes a first sidewall and a second sidewall opposite to the first sidewall, and wherein the perforated baffle extends from the first sidewall to the second sidewall above the electronic device.

18. The immersion cooling assembly of claim 13, further comprising a second perforated baffle disposed in the tank directly above the electronic device and above the perforated baffle, the second perforated baffle being at least partially immersed in the liquid coolant.

19. The immersion cooling assembly of claim 18, wherein the opening of the second perforated baffle is smaller than the opening of the perforated baffle.

20. The immersion cooling assembly of claim 18, wherein the opening of the second perforated baffle is offset from the opening of the perforated baffle.

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