A double-layer manifold cross-flow type micro-channel cold plate device

Abstract

This invention provides a dual-layer manifold cross-flow microchannel cold plate device, comprising an upper substrate, a manifold layer, and a lower substrate sequentially and sealed together along the thickness direction. After assembly, an upper microchannel layer and a lower microchannel layer are formed on both sides of the manifold layer along the thickness direction, and their inlet ends form a connected inlet collection cavity, and their outlet ends form a connected outlet collection cavity. The upper and lower microchannel layers each include at least two upper microchannel subarrays and at least two lower microchannel subarrays that are independent of each other along a first direction, and the upper and lower microchannel subarrays correspond one-to-one along the thickness direction. A first microchannel and a second microchannel are provided at the boundary of any pair of adjacent subarrays corresponding to each other on the manifold layer, so as to form an orderly cross-flow cooling path between the inlet collection cavity and the outlet collection cavity by means of the first microchannel and the second microchannel, thereby making this invention suitable for the heat dissipation requirements of high heat flux density electronic devices.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for electronic devices, and more particularly to a dual-layer manifold cross-flow microchannel cold plate device. Background Technology

[0002] In recent years, with the rapid development of electronic technology, the integration and power density of electronic devices have increased exponentially. The problem of high heat flux density has become a key factor restricting their performance improvement and service life extension. Microchannel heat dissipation technology, as a high-efficiency thermal management technology based on micron-level flow channel structure, has been widely used in the thermal management system of high heat flux density electronic devices in aerospace, new energy, data center and other fields due to its advantages such as large heat exchange area, high heat dissipation efficiency and compact structure.

[0003] Microchannel cold plates, as the core component of microchannel cooling technology, currently generally adopt a single-layer flow channel design. It is well known that this type of microchannel cold plate, due to the single flow path of the cooling medium, experiences temperature rise along the path and insufficient temperature uniformity, typically limiting its application to low to medium heat flux density cooling scenarios. Currently, to expand the applicability of microchannel cold plates, the industry has proposed a double-layer parallel flow channel solution; however, the flow channel design of these solutions often lacks a reasonable fluid distribution and guiding mechanism, resulting in low cooling medium utilization, limited heat dissipation capacity, and the problem of heat not being simultaneously removed from the upper and lower cold plates. This leads to an imbalance in heat distribution and exacerbates temperature non-uniformity, still failing to meet the heat dissipation requirements of high heat flux density electronic devices. Therefore, the industry urgently needs to develop a microchannel cold plate device that can achieve uniform cooling medium distribution and excellent temperature uniformity to solve the current heat dissipation problems of high heat flux density electronic devices in various fields. Summary of the Invention

[0004] The purpose of this invention is to provide a dual-layer manifold cross-flow microchannel cold plate device, which enhances the heat dissipation effect and significantly improves the overall temperature uniformity under the same inlet and outlet flow rates by designing the cooling working fluid to flow in an orderly cross-flow between the upper and lower microchannel layers, thereby meeting the heat dissipation requirements of high heat flux density electronic devices.

[0005] The technical solution provided by this invention is as follows: This invention provides a dual-layer manifold cross-flow microchannel cold plate device, comprising an upper substrate, a manifold layer, and a lower substrate arranged sequentially from top to bottom along the thickness direction; The upper substrate and the lower substrate are provided with microchannel arrays on their opposite sides. The manifold layer is sealed between the upper substrate and the lower substrate, and an upper microchannel layer and a lower microchannel layer are formed on both sides of the manifold layer in the thickness direction, respectively. The upper microchannel layer includes at least two upper microchannel subarrays that are independent of each other along a first direction, and the lower microchannel layer includes at least two lower microchannel subarrays that are independent of each other along a first direction, and the upper microchannel subarrays and the lower microchannel subarrays correspond one-to-one along the thickness direction; An inlet liquid collection cavity and an outlet liquid collection cavity are provided between the upper substrate and the lower substrate. The inlet liquid collection cavity is used to connect the inlet end of the upper microchannel layer and the lower microchannel layer, and the outlet liquid collection cavity is used to connect the outlet end of the upper microchannel layer and the lower microchannel layer. On the manifold layer, a first microchannel and a second microchannel are provided at the boundary of any group of adjacent subarrays. The first microchannel connects the upper microchannel subarray corresponding to the first direction with the next adjacent lower microchannel subarray, and the second microchannel connects the lower microchannel subarray corresponding to the first direction with the next adjacent upper microchannel subarray, thereby forming an orderly cross-flow cooling path between the inlet collection chamber and the outlet collection chamber.

[0006] This invention provides a dual-layer manifold cross-flow microchannel cold plate device. By partitioning the microchannel arrays of the upper and lower microchannel layers and rationally arranging the first and second microchannels on the manifold layer, the cooling medium, after entering the inlet collection chamber, flows orderly up and down across the upper and lower microchannel layers, continuously carrying away heat from the upper and lower substrates. This shortens the flow path of the cooling medium within a single cold plate microchannel and allows for multiple, orderly, and sufficient heat exchange contacts between the cooling medium and the microchannel sidewalls, while also exhibiting impingement jet characteristics. This significantly improves the temperature uniformity of the upper and lower substrates while intensifying fluid turbulence, effectively enhancing convective heat transfer under the same inlet and outlet flow rates and increasing the heat transfer rate. Consequently, this microchannel cold plate device can meet the heat dissipation requirements of high heat flux density electronic devices, effectively expanding its application range and enhancing its practicality.

[0007] In some embodiments, the microchannels of any of the microchannel arrays extend along a first direction and are separated from each other by microchannel fins; Upper partitions are provided on the upper substrate between adjacent upper microchannel subarrays. Each of the lower substrates is provided with a lower partition plate between adjacent lower microchannel subarrays. The adjacent upper microchannel subarrays are separated by the upper partition, and the adjacent lower microchannel subarrays are separated by the lower partition; and the two end faces of any upper partition and the lower partition along the first direction are spaced apart from the adjacent microchannel fins, so as to form an inlet confluence microchannel and an outlet confluence microchannel corresponding to the inlet end and the outlet end of the adjacent microchannel. The inlet and outlet of the first microchannel are respectively connected to the outlet confluence microchannel of the corresponding upper microchannel subarray and the inlet confluence microchannel of the adjacent next lower microchannel subarray; The inlet and outlet of the second microchannel are respectively connected to the outlet confluence microchannel of the corresponding lower microchannel subarray and the inlet confluence microchannel of the adjacent next upper microchannel subarray.

[0008] This invention provides a dual-layer manifold cross-flow microchannel cold plate device. By setting an upper and lower partition, and sealing the manifold layer between the upper and lower substrates, the upper and lower microchannel layers directly correspond to form multiple independent upper and lower microchannel subarrays along a first direction. Furthermore, any upper or lower microchannel subarray automatically forms an inlet or outlet confluence microchannel adjacent to the corresponding end of the upper or lower substrate along the first direction. The forming process of the corresponding microchannel subarrays and confluence microchannels is convenient. Moreover, in actual production, only... Based on the set cooling medium flow direction, the inlet and outlet of each first microchannel and the inlet and outlet of each second microchannel can be set at the corresponding inlet and outlet confluence microchannels, without having to set up a first or second microchannel for each microchannel. On the one hand, this effectively reduces the number of first and second microchannels, shortens the production cycle of the manifold layer, and significantly improves the structural strength of the manifold layer; on the other hand, it also helps to reduce quality problems caused by processing errors, helps to enhance the functional stability of the corresponding microchannel cold plate device, and helps to promote cost reduction and efficiency improvement for enterprises.

[0009] In some implementations, at the boundary between adjacent subarrays, the first microchannel and the second microchannel are evenly spaced in multiple places along the extension direction of the inlet confluence microchannel or the outlet confluence microchannel, and the first microchannel and the second microchannel are arranged alternately.

[0010] The present invention provides a dual-layer manifold cross-flow microchannel cold plate device, wherein multiple first microchannels are evenly distributed between any upper microchannel subarray and the next adjacent lower microchannel subarray along the first direction, and multiple second microchannels are evenly distributed between any lower microchannel subarray and the next adjacent upper microchannel subarray along the first direction. This helps to reduce the cross-flow resistance of the cooling working fluid between the upper and lower microchannel layers while avoiding local hot spots as much as possible, thereby further improving the stability and uniformity of the upper and lower substrates.

[0011] In some embodiments, the outlet busbar microchannel of any of the upper microchannel subarrays is aligned along the thickness direction with the inlet busbar microchannel of the next adjacent lower microchannel subarray and is connected through the first microchannel; Alternatively, the outlet busbar microchannel of any of the lower microchannel subarrays is aligned along the thickness direction with the inlet busbar microchannel of the next adjacent upper microchannel subarray and is connected through the second microchannel.

[0012] This invention provides a dual-layer manifold cross-flow microchannel cold plate device. By aligning the outlet confluence microchannel of the upper microchannel subarray with the inlet confluence microchannel of the next adjacent lower microchannel subarray along the thickness direction, or aligning the outlet confluence microchannel of the lower microchannel subarray with the inlet confluence microchannel of the next adjacent upper microchannel subarray along the thickness direction, one of the first or second microchannels can be configured as a straight channel penetrating the manifold layer along the thickness direction. Compared to a scheme where both the first and second microchannels are curved channels, this scheme reduces the production difficulty of the manifold layer and helps to further reduce the resistance of the cooling working fluid flowing across the upper and lower microchannel layers.

[0013] In some embodiments, the first microchannel includes an upper straight section, a connecting section, and a lower straight section that are bent and connected in sequence; The inlet connection of the upper straight section corresponds to the outlet confluence microchannel of the upper microchannel subarray, the outlet connection of the lower straight section corresponds to the inlet confluence microchannel of the lower microchannel subarray, and the connecting section connects the upper straight section and the lower straight section. The manifold layer includes an upper manifold layer and a lower manifold layer that are sealed together along the thickness direction; The upper straight section is vertically penetrating through the upper manifold layer, and the lower straight section is vertically penetrating through the lower manifold layer. Upper and lower waist-shaped grooves are correspondingly formed on opposite sides of the upper and lower manifold layers, with each groove corresponding to the other along its thickness. The upper straight section connects to one end of the corresponding upper waist-shaped groove, and the lower straight section connects to the other end of the corresponding lower waist-shaped groove. After the upper and lower manifold layers are sealed and joined, the upper waist-shaped groove and the corresponding lower waist-shaped groove are sealed and joined to form the connecting section, simultaneously connecting the upper and lower straight sections.

[0014] The present invention provides a double-layer manifold cross-flow type microchannel cold plate device, which forms a manifold layer by setting an upper manifold layer and a lower manifold layer that are sealed and stacked along the thickness direction. An upper waist-shaped groove and a lower waist-shaped groove are respectively opened on the opposite sides of the upper manifold layer and the lower manifold layer, so that the upper manifold layer and the lower manifold layer are sealed and stacked along the thickness direction to naturally form a connecting section of the first microchannel, which facilitates the processing and shaping of the first microchannel and helps to further reduce the production difficulty of the manifold layer.

[0015] In some embodiments, grooves are provided on the opposite end faces of the upper manifold layer and the lower manifold layer; The microchannel fins and the upper partition plate on the upper substrate, and the microchannel fins and the lower partition plate on the lower substrate are respectively embedded in the corresponding slots.

[0016] This invention provides a double-layer manifold cross-flow microchannel cold plate device. Grooves are formed on both sides of the manifold layer in the thickness direction to accommodate the microchannel fins of the upper and lower microchannel layers, along with corresponding upper and lower partitions. While ensuring the structural strength and functional stability of the microchannel cold plate device, it effectively promotes its integration and miniaturization, enabling it to meet the heat dissipation needs of electronic devices with a wider range of sizes. This further promotes the trend of miniaturization and lightweighting of electronic devices, and enhances its practicality.

[0017] In some embodiments, the upper manifold layer has a first upper through hole and a second upper through hole at both ends along the first direction, respectively. The lower manifold layer has a first lower through hole and a second lower through hole at both ends along the first direction, respectively. After the upper manifold layer and the lower manifold layer are sealed and assembled, the upper substrate and the lower substrate cooperate with the inner walls of the first upper through hole and the first lower through hole to jointly form the inlet liquid collection cavity; the upper substrate and the lower substrate cooperate with the inner walls of the second upper through hole and the second lower through hole to jointly form the outlet liquid collection cavity.

[0018] In some embodiments, the inner wall of the inlet collection cavity formed by the joining of the inner wall of the first upper through hole and the inner wall of the first lower through hole is coplanar with the end face of the inlet end of the upper microchannel layer and the end face of the inlet end of the lower microchannel layer, forming a flow guiding surface. The flow guiding surface is used to guide the cooling working fluid entering the inlet collection cavity to be evenly distributed to the inlet end of the upper microchannel layer and the inlet end of the lower microchannel layer.

[0019] In some embodiments, the upper substrate is provided with an inlet nacelle corresponding to the inlet liquid collection chamber, and the inlet nacelle is used to connect the liquid supply pipeline of the cooling circulation system to the inlet liquid collection chamber; The upper substrate is provided with an outlet nozzle corresponding to the outlet liquid collection chamber. The outlet nozzle is used to connect the outlet liquid collection chamber to the return liquid pipeline of the cooling circulation system.

[0020] In some embodiments, the upper substrate has cover fins on the side opposite to the lower substrate.

[0021] The present invention provides a dual-layer manifold cross-flow microchannel cold plate device, wherein the cover plate fins are used to remove the heat of electronic devices conducted on the upper substrate through air cooling assistance, thereby forming a heat dissipation mode of liquid cooling and air cooling in the upper microchannel layer, further improving the heat dissipation effect.

[0022] Compared with the prior art, the alternating flow double-layer manifold microchannel cold plate device provided by the present invention has the following beneficial effects: This invention partitions the microchannel arrays of the upper and lower microchannel layers and rationally arranges the first and second microchannels on the manifold layer, creating an orderly, cross-flow cooling path between the inlet and outlet liquid collection chambers. This allows the cooling medium to flow orderly and cross-flow between the upper and lower microchannel layers. Compared to traditional single-layer microchannel cold plates, this significantly reduces the heat source temperature under the same inlet and outlet flow rates, reduces local heat accumulation, and allows the cooling medium to make multiple, thorough contacts with the microchannel fins, creating a turbulence effect within the microchannels. This enhances convective heat transfer, increases the heat transfer rate, and improves overall temperature uniformity. Meanwhile, in actual production, key parameters such as microchannel size and microchannel fin density can be flexibly adjusted according to the power requirements, operating temperature, and ambient temperature requirements of electronic devices. This allows it to adapt to the heat dissipation needs of aerospace electronic equipment, high-power semiconductor devices, and data center server chips. In addition, its compact structural design effectively controls the overall weight and volume while ensuring structural strength and heat dissipation performance. This aligns with the development trend of miniaturization and lightweighting of next-generation electronic devices, and has broad application prospects and practical value. Attached Figure Description

[0023] The preferred embodiments will now be described in a clear and easy-to-understand manner, with reference to the accompanying drawings, to further explain the above-mentioned characteristics, technical features, advantages, and implementation methods of this solution.

[0024] Figure 1 This is an isometric schematic diagram of the overall structure of the double-layer manifold cross-flow microchannel cold plate device, which is the main embodiment of the present invention. Figure 2 This is an exploded view of the structure of each layer of the double-layer manifold cross-flow microchannel cold plate device, which is the main embodiment of the present invention. Figure 3 This is an isometric schematic diagram of the main structure of the upper substrate in an embodiment of the present invention; Figure 4 This is an isometric schematic diagram illustrating the layout of the upper straight section and the upper passage section, which are the main features of this invention. Figure 5 This is an isometric schematic diagram of the relative positions of the upper waist-shaped groove and the upper straight section, which is the main embodiment of the present invention. Figure 6 This is an isometric schematic diagram of the relative positions of the lower waist-shaped groove and the lower straight section, which is the main embodiment of the present invention. Figure 7 This is an isometric schematic diagram illustrating the relative positions of the lower straight section and the lower channel section, which is the main embodiment of the present invention. Figure 8 This is a top view of the main embodiment of the present invention, showing the arrangement of the cover plate fins; Figure 9 yes Figure 8 The axonometric view of the section along the AA direction is mainly used to illustrate the structural form of the first microchannel; Figure 10 yes Figure 9 The enlarged view at point A in the middle is mainly used to illustrate the opening method of the first micro-channel; Figure 11 This is a top view of the main embodiment of the present invention, showing the arrangement of the cover plate fins; Figure 12 yes Figure 11 The axonometric view of the section along the BB direction is mainly used to illustrate the structural form of the second microchannel; Figure 13 yes Figure 12 The enlarged view in section B is mainly used to illustrate how the second micro-channel is opened.

[0025] Explanation of reference numerals in the attached figures: 100. Cold plate structure; 110. Upper substrate; 111. Upper microchannel fins; 112. Upper partition; 113. Upper microchannel layer; 1131. Upper microchannel subarray; 114. Cover plate fins; 120. Manifold layer; 121. Upper manifold layer; 1211. Upper straight section; 1212. Upper waist-shaped groove; 1213. Upper channel section; 1214. First upper through hole; 1215. Second upper through hole; 1216. Upper recessed groove; 122. Lower manifold layer; 1221. Lower straight section; 1222. Lower waist-shaped groove; 1223. Lower channel section; 1224. First lower through hole; 1225. Second lower through hole ; 1226, Lower groove; 130, Lower substrate; 131, Lower microchannel fin; 132, Lower partition; 133, Lower microchannel layer; 1331, Lower microchannel subarray; 140, Inlet collection chamber; 141, Guide surface; 150, Outlet collection chamber; 160, First microchannel; 161, Upper straight section; 162, Connecting section; 163, Lower straight section; 170, Second microchannel; 171, Upper channel section; 172, Lower channel section; 180, Inlet confluence microchannel; 190, Outlet confluence microchannel; 200, Nail head assembly; 210, Inlet nappe head; 220, Outlet nappe head. Detailed Implementation

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the specific implementation methods of the present invention will be described below with reference to the accompanying drawings. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without any creative effort.

[0027] To keep the drawings concise, only the parts relevant to the invention are shown schematically in each figure, and they do not represent the actual structure of the product. Furthermore, for ease of understanding, in some figures, only one of components with the same structure or function is shown schematically, or only one is labeled. In this document, "one" can mean not only "only one" but also "more than one".

[0028] In recent years, with the continuous improvement of the integration and power density of electronic devices, the demand for high heat flux density heat dissipation in various fields has become increasingly urgent, leading to the rapid development of microchannel cooling technology. Among these technologies, microchannel cold plates, as the core component of microchannel cooling technology, currently mostly adopt a single-layer flow channel or a simple double-layer parallel flow channel structure. Single-layer flow channel cold plates, due to the single flow path of the cooling medium, experience significant temperature rise along the path and poor temperature uniformity, and are typically only used in low to medium heat flux density scenarios. Simple double-layer parallel flow channel cold plates, lacking a reasonable fluid distribution and guiding structure, not only have low cooling medium utilization and limited heat dissipation performance, but also often suffer from the problem of heat not being carried away synchronously and efficiently from the upper and lower flow channels. Their overall temperature uniformity is also poor, making it difficult to meet the heat dissipation requirements of electronic devices with high heat flux density and stringent temperature uniformity requirements, thus requiring further improvement and optimization.

[0029] In one embodiment, reference is made to the accompanying drawings. Figures 1 to 13 A double-layer manifold cross-flow microchannel cold plate device is provided, which includes a thickness-direction ( Figure 1 The upper substrate 110, manifold layer 120, and lower substrate 130 are sequentially and sealed from top to bottom (in the direction indicated by the middle arrow). The upper substrate 110 and the lower substrate 130 are provided with microchannel arrays on their opposite sides. After the manifold layer 120 is assembled between the upper substrate 110 and the lower substrate 130, an upper microchannel layer 113 and a lower microchannel layer 133 are formed on both sides of the manifold layer 120 in the thickness direction. In other words, the upper microchannel layer 113 and the lower microchannel layer 133 are arranged side by side between the upper substrate 110 and the lower substrate 130 in the thickness direction. In addition, an inlet liquid collection chamber 140 and an outlet liquid collection chamber 150 are provided between the upper substrate 110 and the lower substrate 130. The inlet liquid collection chamber 140 is used to connect the inlet end of the upper microchannel layer 113 and the inlet end of the lower microchannel layer 133, and the outlet liquid collection chamber 150 is used to connect the outlet end of the upper microchannel layer 113 and the outlet end of the lower microchannel layer 133.

[0030] It should be noted that the upper microchannel layer 113 of the present invention includes at least two upper microchannel subarrays 1131 that are independent of each other along the first direction, and the lower microchannel layer 133 includes at least two lower microchannel subarrays 1331 that are independent of each other along the first direction, and the upper microchannel subarrays 1131 and the lower microchannel subarrays 1331 correspond one-to-one along the thickness direction; moreover, a first microchannel 160 and a second microchannel 170 are provided at the boundary of any pair of adjacent subarrays corresponding to each other on the manifold layer 120, wherein the first microchannel 160 is used to connect the upper microchannel subarray 1131 corresponding to each other along the first direction with the next adjacent lower microchannel subarray 1331, and the second microchannel 170 is used to connect the lower microchannel subarray 1331 corresponding to each other along the first direction with the next adjacent upper microchannel subarray 1131.

[0031] In practical applications, after the cooling medium is introduced into the inlet collection chamber 140, it flows into the corresponding first upper microchannel subarray 1131 and first lower microchannel subarray 1331 from the inlet end of the upper microchannel layer 113 and the inlet end of the lower microchannel layer 133, respectively. The cooling medium flowing into the first upper microchannel subarray 1131 makes full contact with the wall surface of the first upper microchannel subarray 1131, performing a first-stage heat exchange and removing some of the heat conducted by the electronic devices on the upper substrate 110. Then, the cooling medium passes through the manifold layer 120 via the first microchannel 160 and flows into the corresponding second lower microchannel subarray 1331 along the first direction. During this process, the cooling medium makes full contact with the wall surface of the second lower microchannel subarray 1331, performing a second-stage heat exchange and removing some of the heat conducted by the electronic devices on the lower substrate 130… Simultaneously, the cooling medium flowing into the first lower microchannel subarray 1331 makes full contact with the wall surface of the first lower microchannel subarray 1331, performing a first-stage heat exchange… The first heat exchange removes some of the heat conducted by the electronic components on the lower substrate 130. Then, the cooling medium passes through the second microchannel 170 through the manifold layer 120 and flows into the second upper microchannel subarray 1131 along the first direction. During this process, the cooling medium fully contacts the wall of the second upper microchannel subarray 1131, performing a second stage of heat exchange to remove some of the heat conducted by the electronic components on the upper substrate 110. Based on the dimensions of the dual-layer manifold cross-flow microchannel cold plate device along the first direction (the number of upper microchannel subarrays 1131 and lower microchannel subarrays 1331 is reasonably set according to the dimensions of the microchannel cold plate device along the first direction) and the heat dissipation requirements, the above alternating heat exchange process is repeated until the heat from the upper microchannel layer 113 and lower microchannel layer 133 is fully removed. The cooling medium that has completed the entire heat exchange process collects in the outlet liquid collection chamber 150 and then enters the return liquid pipeline of the subsequent cooling circulation system (such as a radiator, condenser, etc.) to complete one round of heat dissipation.

[0032] Thus, an orderly, cross-flow cooling path is formed between the inlet collection chamber 140 and the outlet collection chamber 150, allowing heat from the upper microchannel layer 113 and the lower microchannel layer 133 to be carried away simultaneously. This shortens the flow path of the cooling medium within the upper and lower microchannel layers 113 and 133, effectively reducing temperature rise along the flow path and significantly improving the temperature uniformity of the upper and lower microchannel layers 113 and 133. Furthermore, the multiple and thorough heat exchange contacts between the upper and lower microchannel layers 113 and 133 enhance fluid turbulence, thereby strengthening convective heat transfer and increasing the heat transfer rate under the same inlet and outlet flow rates. These advantages make this double-layer manifold cross-flow microchannel cold plate device suitable for heat dissipation scenarios of electronic devices with high heat flux density and stringent temperature uniformity requirements, effectively enhancing its applicability and practicality.

[0033] In one embodiment, based on the above embodiments, specifically referring to... Figures 1 to 13 The upper substrate 110, the manifold layer 120, and the lower substrate 130 are stacked to form a cold plate structure 100. In actual production, different materials and manufacturing processes can be selected to manufacture the cold plate structure 100 according to the application scenario. For example, when good thermal conductivity and processing performance are required, copper or aluminum materials are selected to produce the upper substrate 110, the manifold layer 120, and the lower substrate 130, and then the three are assembled to form the cold plate structure 100 through welding and other processes. Alternatively, to meet the needs of scenarios with high corrosion resistance requirements, titanium alloy materials are selected to produce the cold plate structure 100. Or, ceramic matrix composite materials are selected to manufacture the cold plate structure 100 to adapt to the application requirements of high temperature and high insulation scenarios. In this embodiment, to be suitable for heat dissipation scenarios of electronic devices with high heat flux density and strict requirements for temperature uniformity, the cold plate structure 100 is preferably made of copper, that is, the upper substrate 110, the manifold layer 120 and the lower substrate 130 are all made of copper. Furthermore, it is preferable that the three are sequentially sealed and connected by welding process, so as to reduce the production difficulty while ensuring the sealing and connection strength of each connection part, effectively preventing the leakage of cooling fluid, and ensuring the long-term stability and reliability of the performance of the cold plate structure 100.

[0034] In this embodiment, the upper substrate 110, manifold layer 120, and lower substrate 130 are all generally rectangular plate structures, making the cold plate structure 100 generally cuboid in shape. Of course, in actual production, the shape of the cold plate structure 100 is specifically designed according to the actual application scenario, and it is not limited to the above-mentioned cuboid shape. The embodiments of the present invention do not specifically limit the shape of the upper substrate 110, manifold layer 120, lower substrate 130, and the assembled cold plate structure 100. This embodiment only uses the example of the upper substrate 110, manifold layer 120, and lower substrate 130 being rectangular plate structures and the cold plate structure 100 being cuboid to specifically illustrate the technical solution of the present invention.

[0035] Furthermore, in embodiments of the present invention, the first direction can be any direction parallel to the plane of the upper substrate 110, such as the length direction, width direction, or any other direction parallel to the same plane of the cold plate structure 100; this embodiment comprehensively considers factors such as heat exchange uniformity, pressure drop, and ease of installation, and refers to... Figure 1 The first direction is defined as the length direction of the cold plate structure 100.

[0036] Specifically, in this embodiment, referring to Figure 9 and Figure 12 In any microchannel array (including the microchannel array on the upper substrate 110 and the microchannel array on the lower substrate 130), the microchannels extend along the first direction and are separated from each other by microchannel fins. That is, all microchannels in the microchannel array on the upper substrate 110 and the microchannel array on the lower substrate 130 are parallel array structures. Moreover, for ease of explanation of the technical solution, in this embodiment, reference is made to... Figure 10 and Figure 13 The microchannel fins on the upper substrate 110 are designated as upper microchannel fins 111, and the microchannel fins on the lower substrate 130 are designated as lower microchannel fins 131.

[0037] In this embodiment, refer to Figure 2 , Figure 3 , Figure 10 and Figure 12 The upper substrate 110 is also provided with an upper partition 112, and correspondingly, the lower substrate 130 is provided with a lower partition 132. Both the upper partition 112 and the lower partition 132 are arranged perpendicular to the first direction. After the manifold layer 120 is assembled between the upper substrate 110 and the lower substrate 130, the upper partition 112 is sealed and connected (fixedly connected or abutted) to the upper side of the manifold layer 120 in the thickness direction away from the end face of the upper substrate 110, so as to divide the upper microchannel layer 113 into at least two upper microchannel subarrays 1131 that are independent of each other in the first direction. Similarly, the lower partition 132 is sealed and connected (fixedly connected or abutted) to the lower side of the manifold layer 120 in the thickness direction away from the end face of the lower substrate 130, so as to divide the lower microchannel layer 133 into at least two lower microchannel subarrays 1331 that are independent of each other in the first direction.

[0038] Reference Figure 10 and Figure 12The diagram illustrates a technical solution where the upper partition 112 and the lower partition 132 are evenly spaced along a first direction on the corresponding upper substrate 110 and lower substrate 130. In this case, multiple upper microchannel subarrays 1131 are formed in the upper microchannel layer 113, and multiple lower microchannel subarrays 1331 are formed in the lower microchannel layer 133. In actual application, after the cooling medium flowing into the first upper microchannel subarray 1131 completes the second stage of heat exchange, it immediately passes through the manifold layer 120 through the second microchannel 170 and then flows into the corresponding third upper microchannel subarray 1131 along the first direction... Similarly, after the cooling medium flowing into the first lower microchannel subarray 1331 completes the second stage of heat exchange, it immediately passes through the manifold layer 120 through the first microchannel 160 and then flows into the corresponding third lower microchannel subarray 1331 along the first direction... until the heat of the upper microchannel layer 113 and the lower microchannel layer 133 is fully carried away.

[0039] Furthermore, in this embodiment, the two sides of any upper partition 112 along the first direction are spaced apart from the upper microchannel fins 111 of the adjacent upper microchannel subarray 1131, as shown in the reference. Figure 9 , Figure 10 In any upper microchannel subarray 1131, a predetermined gap is left between the ends of all upper microchannel fins 111 near the corresponding upper partition 112 along the length direction, so that an inlet confluence microchannel 180 and an outlet confluence microchannel 190 are respectively formed between any upper partition 112 and the inlet end of the adjacent upper microchannel subarray 1131, and between any upper partition 112 and the outlet end of the adjacent upper microchannel subarray 1131; in this embodiment, referring to Figure 12 , Figure 13 The arrangement of the lower partition 132 on the lower substrate 130 is the same as that of the upper partition 112 on the upper substrate 110. An inlet confluence microchannel 180 and an outlet confluence microchannel 190 are also formed between the inlet end of any lower partition 132 and the adjacent lower microchannel subarray 1331, and between the outlet end of any lower partition 132 and the adjacent lower microchannel subarray 1331, respectively.

[0040] In this embodiment, refer to Figures 8 to 13The inlet and outlet of the first microchannel 160 are respectively connected to the outlet confluence microchannel 190 of the upper microchannel subarray 1131 at the boundary of the corresponding subarray and the inlet confluence microchannel 180 of the next adjacent lower microchannel subarray 1331 along the first direction; correspondingly, the inlet and outlet of the second microchannel 170 are respectively connected to the outlet confluence microchannel 190 of the lower microchannel subarray 1331 at the boundary of the corresponding subarray and the inlet confluence microchannel 180 of the next adjacent upper microchannel subarray 1131 along the first direction; compared with the scheme of correspondingly arranging the inlet or outlet of the first microchannel 160 and the inlet or outlet of the second microchannel 170 in each microchannel, the scheme of arranging the inlet and outlet of the first microchannel 160 and the inlet and outlet of the second microchannel 170 corresponding to the inlet confluence microchannel 180 and the outlet confluence microchannel 190 is beneficial to reducing the number and density of the first microchannel 160 and the second microchannel 170, while significantly improving the structural strength of the manifold layer 120.

[0041] Reference Figures 2 to 13 The extension direction of any inlet confluence microchannel 180 and outlet confluence microchannel 190 is parallel to the width direction of the cold plate structure 100. Based on the foregoing, in this embodiment, to ensure the temperature uniformity of the upper microchannel layer 113 and the lower microchannel layer 133, and at the same time reduce the flow resistance of the cooling medium, refer to... Figure 9 and Figure 12 Multiple microchannels 160 and 170 are evenly spaced along the width of the cold plate structure 100, and the first microchannel 160 and the second microchannel 170 are arranged alternately along the width of the cold plate structure 100 to avoid mutual interference.

[0042] As is well known, to reduce the flow resistance of the cooling medium, it is preferable to minimize the length of the first microchannel 160 and the second microchannel 170. Therefore, further, in this embodiment, the outlet manifold microchannel 190 of any lower microchannel subarray 1331 is aligned with the inlet manifold microchannel 180 of the next adjacent upper microchannel subarray 1131 along the first direction in the thickness direction, so that the corresponding second microchannel 170 is set as a straight channel that vertically penetrates the manifold layer 120, thereby minimizing the length of the second microchannel 170. Of course, in the embodiments of this application, the outlet manifold microchannel 190 of any upper microchannel subarray 1131 can also be aligned with the inlet manifold microchannel 180 of the next adjacent lower microchannel subarray 1331 along the first direction in the thickness direction, so that the corresponding first microchannel 160 is set as a straight channel that vertically penetrates the manifold layer 120, thereby minimizing the length of the first microchannel 160.

[0043] Reference Figure 12 This shows the case where the length of the second microchannel 170 is at its minimum; at this time, refer to 8 and Figure 10 The first microchannel 160 is configured as a Z-shaped channel.

[0044] Specifically, for the first microchannel 160, refer to Figures 4 to 7 , Figure 10 and Figure 13 It includes an upper straight section 161 / 1211, a connecting section 162, and a lower straight section 163 / 1221 that are bent and connected in sequence. The upper straight section 161 / 1211, the connecting section 162, and the lower straight section 163 / 1221 are arranged sequentially from the inlet end to the outlet end of the first microchannel 160. The inlet of the upper straight section 161 / 1211 is connected to the outlet convergence microchannel 190 of the upper microchannel subarray 1131, and the outlet of the lower straight section 163 / 1221 is connected to the inlet convergence microchannel 180 of the next adjacent lower microchannel subarray 1331 along the first direction. The connecting section 162 is used to connect the corresponding upper straight section 161 / 1211 and the lower straight section 163 / 1221. As is well known, microchannels in microchannel cold plates in the industry are usually formed by etching process. In the embodiments of the present invention, in order to reduce the process difficulty and improve the processing accuracy, the manifold layer 120 includes an upper manifold layer 121 and a lower manifold layer 122 that are arranged parallel to each other along the thickness direction and are correspondingly sealed and connected. The upper straight section 161 / 1211 of any first microchannel 160 is formed in the upper manifold layer 121 and penetrates the side of the upper manifold layer 121 near the upper substrate 110. Correspondingly, the lower straight section 163 / 1221 of any first microchannel 160 is formed in the lower manifold layer 122 and penetrates the side of the lower manifold layer 122 near the lower substrate 130. The connecting section 162 is formed at the connecting surface of the upper manifold layer 121 and the lower manifold layer 122.

[0045] Reference Figure 5 and Figure 6 The upper manifold layer 121 and the lower manifold layer 122 have corresponding upper waist-shaped grooves 1212 and lower waist-shaped grooves 1222 on their opposite sides. The upper waist-shaped grooves 1212 and lower waist-shaped grooves 1222 correspond one-to-one along the thickness direction and both extend their length along the first direction. At the same time, the upper straight section 161 / 1211 corresponds one-to-one with the upper waist-shaped groove 1212, and its end away from its own opening is connected to the end of the corresponding upper waist-shaped groove 1212 along its length direction. Correspondingly, the lower... The straight section 163 / 1221 corresponds one-to-one with the lower waist-shaped groove 1222, and the end of the straight section 163 / 1222 away from its own outlet is connected to the other end of the lower waist-shaped groove 1222 along its length direction. When the upper manifold layer 121 and the lower manifold layer 122 are spliced ​​together along the thickness direction to form the manifold layer 120, the upper waist-shaped groove 1212 and the corresponding lower waist-shaped groove 1222 are sealed together to form the connecting section 162, and at the same time, the upper straight section 161 / 1211 and the lower straight section 163 / 1221 are connected.

[0046] Reference Figure 10The diagram illustrates the situation where the connecting segment 162 is connected to the upper straight segments 161 / 1211 and the lower straight segments 163 / 1221. In this embodiment, to minimize the length of the first microchannel 160, the upper straight segments 161 / 1211 of any first microchannel 160 are perpendicular to the upper manifold layer 121, and the lower straight segments 163 / 1221 of any first microchannel 160 are perpendicular to the lower manifold layer 122. Furthermore, the connecting segment 162 is perpendicular to both the corresponding upper straight segments 161 / 1211 and the lower straight segments 163 / 1221, meaning that the angle at the turning point within any first microchannel 160 is 90°. Of course, in embodiments of the present invention, the angle between the connecting segment 162 and the upper straight segments 161 / 1211 and the lower straight segments 163 / 1221 is not limited to 90°; any angle value that ensures the flow resistance of the cooling medium at the turning point is within a reasonable range and that ensures a smooth flow process is acceptable.

[0047] For the second microchannel 170, refer to Figure 12 It includes upper channel sections 171 / 1213 and lower channel sections 172 / 1223. The upper channel sections 171 / 1213 are vertically penetrating through the upper manifold layer 121, and the lower channel sections 172 / 1223 are vertically penetrating through the lower manifold layer 122, corresponding to the upper channel sections 171 / 1213. (Refer to...) Figure 4 and Figure 7 The inlets of the upper channel section 171 / 1213 and the upper straight section 161 / 1211 are arranged in a cross-array pattern along the width direction of the cold plate structure 100, and the inlets of the lower channel section 172 / 1223 and the lower waist-shaped groove 1222 are arranged in a cross-array pattern along the width direction of the cold plate structure 100, so as to realize the cross-array distribution of the first microchannel 160 and the second microchannel 170 at any adjacent subarray boundary along the width direction of the cold plate structure 100.

[0048] It is worth noting that in actual production, the inner diameters of the first microchannel 160 and the second microchannel 170 must be compatible with the hydraulic diameter of the microchannels. In this embodiment, it is preferable that the inner diameters of the first microchannel 160 and the second microchannel 170 at any position along their length are both set to 200 μm. Of course, in the embodiments of the present invention, the corresponding aperture size is not limited to this; the corresponding aperture size can be reasonably set according to the product application scenario during the production process. Furthermore, in this embodiment, the first microchannel 160 is set as a square flow channel, and the second microchannel 170 is set as a circular flow channel.

[0049] Reference Figures 4 to 7In this embodiment, the upper manifold layer 121 has a first upper through hole 1214 and a second upper through hole 1215 respectively at both ends along the first direction, and the lower manifold layer 122 has a first lower through hole 1224 and a second lower through hole 1225 respectively at both ends along the first direction. The first upper through hole 1214 and the first lower through hole 1224 are correspondingly arranged along the thickness direction, and the second upper through hole 1215 and the second lower through hole 1225 are correspondingly arranged along the thickness direction. (Refer to...) Figure 9 and Figure 12 After the upper substrate 110, upper manifold layer 121, lower manifold layer 122 and lower substrate 130 are sequentially sealed and assembled along the thickness direction, the inner wall of the first upper through hole 1214 and the inner wall of the first lower through hole 1224 cooperate with the upper substrate 110 and the lower substrate 130 to jointly form an inlet liquid collection cavity 140, and the inner wall of the second upper through hole 1215 and the inner wall of the second lower through hole 1225 cooperate with the upper substrate 110 and the lower substrate 130 to jointly form an outlet liquid collection cavity 150.

[0050] In this embodiment, a nano-head assembly 200 is also mounted on the upper substrate 110, which is used for the input and output of the cooling working fluid; specifically, refer to Figure 1 and Figure 2 , Figure 9 and Figure 12 The nacelle assembly 200 includes an inlet nacelle 210 and an outlet nacelle 220. The inlet nacelle 210 is disposed corresponding to the inlet collection chamber 140 and is used to connect the liquid supply pipeline of the cooling circulation system to the inlet collection chamber 140. The outlet nacelle 220 is disposed corresponding to the outlet collection chamber 150 and is used to connect the outlet collection chamber 150 to the return pipeline of the cooling circulation system. Preferably, in this embodiment, the ends of the inlet nacelle 210 and the outlet nacelle 220 that connect to the cooling circulation system are both located on the side of the upper substrate 110 away from the lower substrate 130.

[0051] In practical applications, coolants are typically selected or combined flexibly based on factors such as heat dissipation power rating, operating temperature range, system corrosion and insulation requirements, environmental conditions (low or high temperature), and safety requirements. For example, ethylene glycol aqueous solution is chosen as the coolant for low-temperature conditions (e.g., -30℃ to 0℃) requiring antifreeze and corrosion protection; deionized water is chosen as the coolant for general electronic heat dissipation scenarios with normal / medium temperature (10℃ to 60℃), low to medium heat flux density, and cost sensitivity; liquid metal is chosen as the coolant for medium to high temperature (20℃ to 150℃), high heat flux density, and ultra-high heat dissipation power scenarios, such as aerospace, high-power lasers, and new energy power modules, which have extreme heat dissipation requirements; or fluorinated liquids are typically chosen as the coolant for wide temperature ranges (-50℃ to 150℃), high voltage, high-voltage, precision electronics, and scenarios requiring classified or high insulation.

[0052] According to this embodiment, in order to be suitable for heat dissipation scenarios of electronic devices with high heat flux density and strict requirements for temperature uniformity, such as aerospace electronic equipment, high-power semiconductor devices, data center server chips, etc., liquid metal (such as gallium-based alloy) is preferred as the cooling medium; correspondingly, the nanohead assembly 200 is made of corrosion-resistant and high-strength material. Preferably, in this embodiment, both the inlet nanohead 210 and the outlet nanohead 220 are made of copper.

[0053] Reference Figures 4 to 7 , Figure 9 , Figure 10 and Figure 12 The dimensions of the first upper through hole 1214 and the second upper through hole 1215 along the width direction of the cold plate structure 100 completely cover the inlet end and outlet end of the corresponding upper microchannel layer 113. Similarly, the dimensions of the first lower through hole 1224 and the second lower through hole 1225 along the width direction of the cold plate structure 100 completely cover the inlet end and outlet end of the corresponding lower microchannel layer 133. Furthermore, the first upper through hole 1214, the second upper through hole 1215, the first lower through hole 1224, and the second lower through hole 1225 are all generally rectangular through holes, making the inlet liquid collecting chamber 140 and the outlet liquid collecting chamber 150 generally rectangular chambers. Further, referring to… Figure 10 In this embodiment, the inner wall of the inlet liquid collection cavity 140, which is formed by the splicing of the inner wall of the first upper through hole 1214 and the inner wall of the first lower through hole 1224, is coplanar with the end face of the inlet end of the upper microchannel layer 113 and the end face of the inlet end of the lower microchannel layer 133, and forms a flow guiding surface 141. The flow guiding surface 141 is used to guide the cooling working fluid input from the inlet nacelle 210 to be evenly distributed to the inlet end of the upper microchannel layer 113 and the inlet end of the lower microchannel layer 133, effectively avoiding the accumulation of local hot spots and the decrease in heat exchange efficiency caused by uneven distribution of cooling working fluid.

[0054] Furthermore, in this embodiment, the upper substrate 110 is also provided with a cover plate fin 114 on the side opposite to the lower substrate 130, as shown in the figure. Figure 1 and Figure 2 The cover plate fins 114 are arranged in multiple rows along the length direction of the upper substrate 110, i.e., the first direction, and are at least partially perpendicular to the upper substrate 110. In practical applications, while the cooling medium gradually removes heat from the upper substrate 110, the cover plate fins 114 simultaneously dissipate heat under the action of airflow, forming a composite heat dissipation mode of liquid cooling and air cooling on the upper substrate 110, further improving the overall heat dissipation effect.

[0055] In addition, refer to Figure 4 and Figure 7To promote the evolution of the cold plate structure 100 towards greater integration and thinner profile, in this embodiment, grooves are provided on the opposite sides of the upper manifold layer 121 and the lower manifold layer 122. For ease of explanation, the groove on the upper manifold layer 121 is designated as upper groove 1216, and the groove on the lower manifold layer 122 is designated as lower groove 1226. The microchannel fins and upper partition 112 on the upper substrate 110, and the microchannel fins and lower partition 132 on the lower substrate 130 are respectively embedded in the grooves on the corresponding sides. In the embodiments of this application, the thickness of the upper manifold layer 121 and the lower manifold layer 122 is preferably 1 mm. By setting a reasonable plate thickness, while ensuring the overall strength of the cold plate structure 100, its weight and volume are further avoided from being too large, thus adapting it to the miniaturization trend of next-generation electronic devices.

[0056] In actual production, the inlet nanohead 210, outlet nanohead 220, upper substrate 110, lower substrate 130, upper manifold layer 121, lower manifold layer 122, and corresponding microchannel fins are fabricated using precision machining technology. Microchannels on the upper substrate 110 and lower substrate 130 are formed through processes such as toothing, machining, and etching to ensure uniformity and smoothness. The first microchannel 160 and the second microchannel 170 on the manifold layer 120 are machined using drilling technology to ensure precise aperture and alignment with the upper manifold layer 121. The holes on the lower manifold layer 122 correspond to the microchannel fins. Then, the microchannel fins are fixed to the microchannel and the top of the upper substrate 110 by integral molding or brazing. The upper substrate 110, upper manifold layer 121, lower manifold layer 122 and lower substrate 130 are stacked from bottom to top along the thickness direction. After the four are accurately positioned by the positioning pins, they are welded and sealed as a whole. After the welding is completed, the airtightness test is carried out to ensure that there is no leakage of cooling medium. The double-layer manifold cross-flow type microchannel cold plate device can then be assembled.

[0057] In practical applications, the upper substrate 110 and / or lower substrate 130 are bonded to the electronic device to be cooled, and the inlet nozzle 210 is sealed and connected to the cooling circulation system's liquid supply pipeline, and the outlet nozzle 220 is sealed and connected to the cooling circulation system's liquid return pipeline, so that the double-layer manifold cross-flow microchannel cold plate device is connected to the cooling circulation system pipeline. For specific operations, refer to... Figure 6The cooling medium is pressurized and transported to the inlet nacelle 210 by the cooling circulation system, and then enters the inlet collection chamber 140. Under the guidance of the guide surface 141, the cooling medium is evenly distributed to the inlets of the upper microchannel layer 113 and the lower microchannel layer 133, and flows into the corresponding first upper microchannel subarray 1131 and first lower microchannel subarray 1331 respectively. In this process, the cooling medium flowing into the first upper microchannel subarray 1131 comes into full contact with the microchannel fins arranged inside the first upper microchannel subarray 1131, performing a first-stage heat exchange and efficiently removing the heat from the electronic devices conducted by the upper substrate 110. Then, the cooling medium passes through the first microchannel 160 sequentially through the upper manifold layer 121 and the lower manifold layer 122, and flows into the second lower microchannel subarray 1331 along the first direction. During this process, the cooling medium comes into full contact with the microchannel fins arranged inside the second lower microchannel subarray 1331, performing a second-stage heat exchange and removing the heat from the electronic devices conducted by the lower substrate 130. After completing the second-stage heat exchange, the cooling medium then passes through the second microchannel 170 sequentially through the lower manifold layer 122 and the upper manifold layer 121, and then flows into the third upper microchannel subarray 1131 along the first direction… Simultaneously, the cooling medium flowing into the first lower microchannel subarray 1331 comes into full contact with the microchannel fins arranged inside the first lower microchannel subarray 1331… The microchannel fins make full contact to perform the first stage of heat exchange, carrying away the heat from the electronic devices conducted by the lower substrate 130. Then, the cooling medium passes through the manifold layer 120 through the second microchannel 170 and flows into the second upper microchannel subarray 1131 corresponding to the first direction. During this process, the cooling medium makes full contact with the microchannel fins arranged inside the second upper microchannel subarray 1131 to perform the second stage of heat exchange. After the second stage of heat exchange is completed, the cooling medium then passes through the manifold layer 120 through the first microchannel 160 and flows into the third lower microchannel subarray 1331 corresponding to the first direction. ... According to the size and heat dissipation requirements of the double-layer manifold cross-flow type microchannel cold plate device along the first direction, the above-mentioned alternating heat exchange process is repeated until the heat of the upper microchannel layer 113 and the lower microchannel layer 133 is completely and evenly carried away, thereby effectively avoiding the accumulation of local hot spots. During this process, the cover plate fins 114 dissipate heat synchronously under the action of airflow, further improving the overall heat dissipation efficiency. The cooling medium that has completed the entire heat exchange process is collected in the outlet liquid collection chamber 150, and then flows into the return liquid pipeline of the cooling circulation system through the outlet nacelle 220. After being cooled, it is transported back to the inlet nacelle 210 to form a complete heat dissipation cycle.

[0058] This method forms an orderly, cross-flow cooling path between the inlet collection chamber 140 and the outlet collection chamber 150, enhancing heat dissipation under the same inlet and outlet flow rates and significantly improving overall temperature uniformity. Test results show that this double-layer manifold cross-flow microchannel cold plate device can effectively optimize temperature distribution, eliminate local hot spots, and has excellent heat exchange efficiency. It is also compact, reliable, and fully adaptable to the heat dissipation needs of high heat flux density electronic equipment. At the same time, its overall process is simple, easy to produce, low in cost, and has good comprehensive performance, making it of good economic and practical value and worthy of promotion and application in the industry.

[0059] It should be noted that the above embodiments can be freely combined as needed. The above description is only a preferred embodiment of the present invention. It should be pointed out that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A double-layer manifold cross-flow type microchannel cold plate device, characterized in that, It includes an upper substrate, a manifold layer, and a lower substrate arranged sequentially along the thickness direction; The upper substrate and the lower substrate are provided with microchannel arrays on their opposite sides. The manifold layer is sealed between the upper substrate and the lower substrate, and an upper microchannel layer and a lower microchannel layer are formed on both sides of the manifold layer in the thickness direction, respectively. The upper microchannel layer includes at least two upper microchannel subarrays that are independent of each other along a first direction, and the lower microchannel layer includes at least two lower microchannel subarrays that are independent of each other along a first direction, and the upper microchannel subarrays and the lower microchannel subarrays correspond one-to-one along the thickness direction; An inlet liquid collection cavity and an outlet liquid collection cavity are provided between the upper substrate and the lower substrate. The inlet liquid collection cavity is used to connect the inlet end of the upper microchannel layer and the lower microchannel layer, and the outlet liquid collection cavity is used to connect the outlet end of the upper microchannel layer and the lower microchannel layer. On the manifold layer, a first microchannel and a second microchannel are provided at the boundary of any group of adjacent subarrays. The first microchannel connects the upper microchannel subarray corresponding to the first direction with the next adjacent lower microchannel subarray, and the second microchannel connects the lower microchannel subarray corresponding to the first direction with the next adjacent upper microchannel subarray, thereby forming an orderly cross-flow cooling path between the inlet collection chamber and the outlet collection chamber.

2. The double-layer manifold cross-flow microchannel cold plate device according to claim 1, characterized in that, The microchannels of any of the microchannel arrays extend along the first direction and are separated from each other by microchannel fins; The upper substrate is further provided with an upper partition, and adjacent upper microchannel subarrays are separated by the upper partition; and the two sides of the upper partition along the first direction are spaced apart from the microchannel fins of the adjacent upper microchannel subarrays, so as to form an inlet confluence microchannel and an outlet confluence microchannel between the upper partition and the inlet end of the adjacent upper microchannel subarray, and between the upper partition and the outlet end of the adjacent upper microchannel subarray, respectively. The lower substrate is also provided with a lower partition plate. The arrangement of the lower partition plate on the lower substrate is the same as the arrangement of the upper partition plate on the upper substrate, and the inlet confluence microchannel and the outlet confluence microchannel are also formed at the corresponding adjacent subarray boundaries. The inlet and outlet of the first microchannel are respectively connected to the outlet confluence microchannel of the corresponding upper microchannel subarray and the inlet confluence microchannel of the next lower microchannel subarray adjacent along the first direction; The inlet and outlet of the second microchannel are respectively connected to the outlet confluence microchannel of the corresponding lower microchannel subarray and the inlet confluence microchannel of the next adjacent upper microchannel subarray along the first direction.

3. The double-layer manifold cross-flow type microchannel cold plate device according to claim 2, characterized in that, At the boundary between adjacent subarrays, the first microchannel and the second microchannel are evenly spaced in multiple places along the extension direction of the inlet confluence microchannel or the outlet confluence microchannel, and the first microchannel and the second microchannel are arranged alternately.

4. The double-layer manifold cross-flow type microchannel cold plate device according to claim 3, characterized in that, The outlet confluence microchannel of any of the upper microchannel subarrays is aligned along the thickness direction with the inlet confluence microchannel of the next adjacent lower microchannel subarray and is connected through the first microchannel; Alternatively, the outlet busbar microchannel of any of the lower microchannel subarrays is aligned along the thickness direction with the inlet busbar microchannel of the next adjacent upper microchannel subarray and is connected through the second microchannel.

5. A double-layer manifold cross-flow microchannel cold plate device according to any one of claims 2-4, characterized in that, The first microchannel includes an upper straight section, a connecting section, and a lower straight section that are bent and connected in sequence; The inlet connection of the upper straight section corresponds to the outlet confluence microchannel of the upper microchannel subarray, the outlet connection of the lower straight section corresponds to the inlet confluence microchannel of the lower microchannel subarray, and the connecting section connects the upper straight section and the lower straight section. The manifold layer includes an upper manifold layer and a lower manifold layer that are sealed together along the thickness direction; The upper straight section is vertically penetrating through the upper manifold layer, and the lower straight section is vertically penetrating through the lower manifold layer. Upper and lower waist-shaped grooves are correspondingly formed on opposite sides of the upper and lower manifold layers, with each groove corresponding to the other along its thickness. The upper straight section connects to one end of the corresponding upper waist-shaped groove, and the lower straight section connects to the other end of the corresponding lower waist-shaped groove. After the upper and lower manifold layers are sealed and joined, the upper waist-shaped groove and the corresponding lower waist-shaped groove are sealed and joined to form the connecting section, simultaneously connecting the upper and lower straight sections.

6. The double-layer manifold cross-flow type microchannel cold plate device according to claim 5, characterized in that, The upper manifold layer and the lower manifold layer have grooves on their opposite ends; The microchannel fins and the upper partition plate on the upper substrate, and the microchannel fins and the lower partition plate on the lower substrate are respectively embedded in the corresponding slots.

7. The double-layer manifold cross-flow type microchannel cold plate device according to claim 5, characterized in that, The upper manifold layer has a first upper through hole and a second upper through hole at both ends along the first direction, respectively. The lower manifold layer has a first lower through hole and a second lower through hole at both ends along the first direction, respectively. After the upper manifold layer and the lower manifold layer are sealed and assembled, the upper substrate and the lower substrate cooperate with the inner walls of the first upper through hole and the first lower through hole to jointly form the inlet liquid collection cavity; the upper substrate and the lower substrate cooperate with the inner walls of the second upper through hole and the second lower through hole to jointly form the outlet liquid collection cavity.

8. The double-layer manifold cross-flow type microchannel cold plate device according to claim 7, characterized in that, The inner wall of the inlet liquid collection cavity, which is formed by the splicing of the inner wall of the first upper through hole and the inner wall of the first lower through hole, is coplanar with the end face of the inlet end of the upper microchannel layer and the end face of the inlet end of the lower microchannel layer, and forms a flow guiding surface. The flow guiding surface is used to guide the cooling working fluid entering the inlet liquid collection cavity to be evenly distributed to the inlet end of the upper microchannel layer and the inlet end of the lower microchannel layer.

9. A double-layer manifold cross-flow type microchannel cold plate device according to claim 7 or 8, characterized in that, The upper substrate is provided with an inlet nacelle corresponding to the inlet liquid collection chamber. The inlet nacelle is used to connect the liquid supply pipeline of the cooling circulation system to the inlet liquid collection chamber. The upper substrate is provided with an outlet nozzle corresponding to the outlet liquid collection chamber. The outlet nozzle is used to connect the outlet liquid collection chamber to the return liquid pipeline of the cooling circulation system.

10. The double-layer manifold cross-flow type microchannel cold plate device according to claim 1, characterized in that, The upper substrate has cover fins on the side opposite to the lower substrate.

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