A military on-duty platform communication chip

Abstract

This invention relates to the field of communication chip technology, specifically a communication chip for a military duty platform. It includes a communication chip body with symmetrically fixed pins on both sides. A lower heat sink is located below the communication chip body, with an air intake channel on one side. A flexible hose is fixedly connected to one side of the lower heat sink, and one end of the hose is fixedly connected to an upper heat sink. In this invention, the heat generated by the communication chip body itself is conducted through a first conductive plate and a second conductive plate to the air intake channel and the cavity of the upper heat sink, respectively. Since hot air typically rises, it is discharged from the exhaust hood, creating a low-pressure area in its original position. The flexible hose fills this space with gas from the air intake channel, and this cycle continues, rapidly dissipating heat from the lower and upper heat sinks. This effectively cools the communication chip body, reduces the aging and performance degradation rate of the communication chip, and improves the reliability and service life of the military duty platform.

Description

Technical Field

[0001] This invention relates to the field of communication chip technology, specifically a communication chip for a military duty platform. Background Technology

[0002] Military duty platforms are comprehensive information management systems built by the military to ensure the efficient and safe execution of duty missions. They integrate cutting-edge technologies such as the Internet of Things, artificial intelligence, big data, and communication technology to achieve digital, intelligent, and standardized management of duty processes. When a military duty platform is established, a communication chip is usually installed to collect and transmit data such as sentry post status, personnel dynamics, and environmental parameters to the command center in real time.

[0003] Currently, most communication chips for military duty platforms on the market are just single-piece structures with several wiring pins arranged on both sides of the chip. When installing the communication chip onto the circuit board of the duty platform, tools are used to solder it to achieve basic electrical connection and communication functions.

[0004] During operation, the internal communication chips of military duty platforms generate a large amount of heat due to continuous operation. Traditional equipment mostly adopts passive heat dissipation methods, which have limited heat dissipation efficiency. When soldiers perform duty missions in harsh environments such as high temperature, confined space, sandstorms, and high humidity, the heat dissipation conditions will be further deteriorated, and the heat will be difficult to dissipate effectively, easily accumulating on the chip surface. Prolonged exposure to high temperatures will accelerate the aging and performance degradation of the communication chips, seriously affecting the reliability and service life of military duty platforms, and is not conducive to the long-term stable use of equipment in field environments. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a communication chip for military duty platforms that improves passive heat dissipation, thereby reducing the aging and performance degradation of the communication chip, improving the reliability and service life of the military duty platform, and facilitating long-term stable use of equipment in field environments.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a communication chip for a military duty platform, comprising a communication chip body, with wiring pins symmetrically fixedly installed on both sides of the communication chip body, a lower heat sink disposed below the communication chip body, an air intake channel opened on one side of the lower heat sink, a flexible tube fixedly connected to one side of the lower heat sink, one end of the flexible tube fixedly connected to an upper heat sink, a cavity opened inside the upper heat sink, the communication chip body located between the lower heat sink and the upper heat sink, a conductive plate one installed in the upper middle of the lower heat sink, a conductive plate two installed in the lower middle of the upper heat sink, needle-shaped heat dissipation fins installed on one side of both the conductive plate two and the conductive plate one, the two needle-shaped heat dissipation fins extending into the air intake channel and the cavity of the upper heat sink respectively, and a vent opening penetrating through the upper middle of the upper heat sink.

[0007] Preferably, an exhaust hood is installed on the inner wall of the vent, the exhaust hood is conical, and the air inlet end of the exhaust hood is located in the cavity of the upper heat sink.

[0008] Preferably, a silicone grease layer is provided on one side of both the first conductive plate and the second conductive plate. The two silicone grease layers are coated with silicone grease and are respectively attached to the upper and lower ends of the communication chip body.

[0009] Preferably, both ends of the hose are equipped with conical covers, and the two conical covers are located in the cavity of the upper heat sink and the air intake channel, respectively.

[0010] Preferably, a heat insulation layer is fixedly connected to the bottom of the cavity of the upper heat dissipation box, and the heat insulation layer is made of aluminum silicate fiber cotton.

[0011] Preferably, a rotating frame is fixedly connected to one side of the lower heat sink near its edge, one side of the rotating frame is fixedly connected to the lower end of the upper heat sink, a fixed base is fixedly connected to the upper end of the lower heat sink, a mounting ear is fixedly connected to one side of the upper heat sink, a fixing screw is threaded to one side of the mounting ear, and one end of the fixing screw is threaded to the fixed base.

[0012] Preferably, one end of the fixing screw is fixedly connected to a rotating cap, and the outer surface of the rotating cap is provided with anti-slip texture.

[0013] Preferably, each of the four corners of the lower heat sink is fixedly connected to a fixing post, and the four fixing posts are arranged in a rectangular array.

[0014] Compared with the prior art, the beneficial effects of the present invention are: 1. This invention utilizes a lower and upper heat sink design. The heat generated by the communication chip itself is conducted through conductive plates one and two to the air intake channel and the cavity of the upper heat sink, respectively. Needle-shaped heat dissipation fins increase the contact area with the air, rapidly transferring the conducted heat. Since hot air typically rises, it is discharged from the exhaust hood, creating a low-pressure area in its original position. A flexible hose fills this space with gas from the air intake channel, and this cycle continues, rapidly dissipating heat from the lower and upper heat sinks, effectively cooling the communication chip. This structural design reduces the aging and performance degradation rate of the communication chip, improving the reliability and service life of the military duty platform.

[0015] 2. This invention uses two layers of silicone grease to fill the air gaps between the conductive plates 1 and 2 and the upper and lower ends of the communication chip body, allowing heat to be smoothly conducted to the lower and upper heat sinks, greatly improving heat dissipation efficiency. At the same time, the exhaust hood's structural design, due to its large inlet cross-sectional area and small outlet cross-sectional area, causes the flow channel to gradually contract as the airflow enters. According to the fluid continuity equation, the gas velocity will increase significantly, thereby allowing heat to be quickly discharged, increasing the gas velocity in the inlet channel and the cavity of the lower heat sink, and achieving rapid cooling of the communication chip body.

[0016] 3. This invention places the communication chip body in the upper middle of the lower heat sink, rotates the upper heat sink to bring its lower end into contact with the upper end of the communication chip body, and then rotates the rotating cap to move the fixing screw along the internal thread of the mounting ear, threading one end of the fixing screw onto the fixing seat. This stably fixes the communication chip body between the lower and upper heat sinks, preventing movement of the communication chip body and ensuring the cooling effect of the communication chip body. Furthermore, fixing posts are provided at the four corners of the lower end of the lower heat sink, and the four fixing posts are respectively inserted into the mounting holes of the mounting circuit board, which can locate the installation position of the communication chip body and improve the installation efficiency of the communication chip body. Attached Figure Description

[0017] Figure 1 This is a first-view structural schematic diagram of the device of the present invention.

[0018] Figure 2 This is a second-view structural schematic diagram of the device of the present invention.

[0019] Figure 3 This is a cross-sectional structural diagram showing the connection between the lower and upper heat sinks in the device of the present invention.

[0020] Figure 4 for Figure 3 A magnified view of a portion of region A in the middle.

[0021] Figure 5 for Figure 3A magnified view of a portion of region B in the middle.

[0022] Figure 6 This is an exploded view showing the connection relationship between the lower heat sink, the upper heat sink, and the main body of the communication chip in the device of the present invention.

[0023] Figure 7 This is a three-dimensional structural diagram of the main body of the communication chip in the device of the present invention.

[0024] In the diagram: 1. Communication chip body; 11. Wiring pins; 2. Lower heat sink; 21. Upper heat sink; 22. Exhaust hood; 23. Air intake channel; 24. Hose; 25. Conductive plate one; 26. Needle-shaped heat dissipation fins; 27. Conductive plate two; 28. Heat insulation layer; 3. Rotating frame; 31. Fixing post; 32. Fixing screw; 33. Fixing base; 34. Rotating cap; 35. Anti-slip texture; 36. Mounting ear; 4. Silicone grease layer; 41. Conical cover. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Example 1:

[0026] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 6 and Figure 7 This is the first embodiment of the present invention, which provides a technical solution: a communication chip for a military duty platform, including a communication chip body 1, with wiring pins 11 symmetrically fixed on both sides of the communication chip body 1, a lower heat sink 2 disposed below the communication chip body 1, an air intake channel 23 opened on one side of the lower heat sink 2, a flexible hose 24 fixedly connected to one side of the lower heat sink 2, one end of the flexible hose 24 fixedly connected to an upper heat sink 21, a cavity opened inside the upper heat sink 21, the communication chip body 1 being located between the lower heat sink 2 and the upper heat sink 21, a first conductive plate 25 installed in the upper middle of the lower heat sink 2, a second conductive plate 27 installed in the lower middle of the upper heat sink 21, needle-shaped heat dissipation fins 26 installed on one side of both the second conductive plate 27 and the first conductive plate 25, the two needle-shaped heat dissipation fins 26 extending into the air intake channel 23 and the cavity of the upper heat sink 21 respectively, and a vent opening penetrating through the upper middle of the upper heat sink 21.

[0027] Through the structural design of the lower heat sink 2 and the upper heat sink 21, the heat generated by the communication chip body 1 is conducted through the first conduction plate 25 and the second conduction plate 27 to the air intake channel 23 and the cavity of the upper heat sink 21, respectively. The needle-shaped heat dissipation fins 26 increase the contact area with the air, and quickly transfer the conducted heat. Since hot air usually flows upward, the hot air is discharged from the exhaust hood 22 after rising, and a low-pressure area will be formed in the original position. The hose 24 fills this space with the gas in the air intake channel 23. In this cycle, the heat in the lower heat sink 2 and the upper heat sink 21 is quickly discharged, and the communication chip body 1 is effectively cooled. This structural design reduces the aging and performance degradation rate of the communication chip and improves the reliability and service life of the military duty platform.

[0028] It should be noted that when the communication chip body 1 is installed on the circuit board, the air intake channel 23 of the lower heat sink 2 is the heat dissipation port of the communication equipment of the lower military duty platform, which facilitates the air to enter the heat dissipation from the air intake channel 23; there are multiple needle-shaped heat dissipation fins 26, which are evenly distributed on the second conductive plate 27 and the first conductive plate 25. Example 2:

[0029] Please see Figures 1 to 4 This is the second embodiment of the present invention. The difference between this embodiment and the first embodiment is that: an exhaust hood 22 is installed on the inner wall of the vent. The exhaust hood 22 is conical. The air inlet end of the exhaust hood 22 is located in the cavity of the upper heat sink 21. A silicone grease layer 4 is provided on one side of the first conductive plate 25 and the second conductive plate 27. The two silicone grease layers 4 are coated with silicone grease and are respectively attached to the upper and lower ends of the communication chip body 1. Conical covers 41 are installed on both ends of the hose 24. The two conical covers 41 are respectively located in the cavity of the upper heat sink 21 and the air inlet channel 23. A heat insulation layer 28 is fixedly connected to the bottom of the cavity of the upper heat sink 21. The heat insulation layer 28 is made of aluminum silicate fiber cotton.

[0030] Two layers of silicone grease 4 are used to fill the air gaps between the conductive plates 25 and 27 and the upper and lower ends of the communication chip body 1, allowing heat to be smoothly conducted to the lower heat sink 2 and the upper heat sink 21, greatly improving heat dissipation efficiency. At the same time, the exhaust hood 22 is designed with a large cross-sectional area at the air inlet and a small cross-sectional area at the air outlet. When the airflow enters, the flow channel gradually contracts. According to the fluid continuity equation, the gas velocity will increase significantly, thereby allowing heat to be quickly discharged and increasing the gas velocity in the air inlet channel 23 and the cavity of the lower heat sink 2, so as to achieve rapid cooling of the communication chip body 1.

[0031] During use, the conical shroud 41 inside the air intake channel 23 can increase the speed at which gas enters the hose 24 from the air intake channel 23, and the conical shroud 41 inside the upper heat sink 21 cavity can increase the speed at which gas exits from the hose 24, while increasing the exhaust range, so that the gas can quickly diffuse to the needle-shaped heat dissipation fins 26 of the conduction plate 27, thereby achieving rapid heat dissipation.

[0032] It should be noted that a heat insulation layer 28 is provided at the bottom of the interior of the upper heat sink 21 cavity. The heat insulation layer 28 is made of aluminum silicate fiber cotton, which has a good heat insulation effect and prevents the heat of the upper heat sink 21 cavity from being re-conducted to the communication chip body 1.

[0033] The remaining structure is the same as that in Example 1. Example 3:

[0034] Please see Figure 1 , Figure 2 , Figure 3 , Figure 5 and Figure 6 This is the third embodiment of the present invention. This embodiment differs from the first and second embodiments in that: a rotating frame 3 is fixedly connected to one side of the lower heat sink 2 near its edge; one side of the rotating frame 3 is fixedly connected to one side of the lower end of the upper heat sink 21; a fixing seat 33 is fixedly connected to one side of the upper heat sink 2; a mounting ear 36 is fixedly connected to one side of the upper heat sink 21; a fixing screw 32 is threadedly connected to one side of the mounting ear 36; one end of the fixing screw 32 is threadedly connected to the fixing seat 33; a rotating cap 34 is fixedly connected to one end of the fixing screw 32; the outer surface of the rotating cap 34 has anti-slip texture 35; fixing posts 31 are fixedly connected to the four corners of the lower end of the lower heat sink 2, and the four fixing posts 31 are arranged in a rectangular array; the anti-slip texture 35 prevents the surface of the rotating cap 34 from being too smooth, making it difficult for workers to rotate the rotating cap 34.

[0035] By placing the communication chip body 1 in the upper middle part of the lower heat sink 2, rotating the upper heat sink 21 to bring the lower end of the upper heat sink 21 into contact with the upper end of the communication chip body 1, and then rotating the rotating cap 34, the fixing screw 32 moves along the internal thread of the mounting ear 36, and one end of the fixing screw 32 is threaded onto the fixing seat 33, thereby stably fixing the communication chip body 1 between the lower heat sink 2 and the upper heat sink 21, preventing the communication chip body 1 from moving and ensuring the cooling effect of the communication chip body 1; and fixing posts 31 are provided at the four corners of the lower end of the lower heat sink 2, and the four fixing posts 31 are respectively inserted into the mounting holes of the mounting circuit board, which can locate the installation position of the communication chip body 1 and improve the installation efficiency of the communication chip body 1.

[0036] It should be noted that when the communication chip body 1 is installed on the circuit board, the circuit board has four mounting holes, and the four fixing posts 31 are respectively inserted into the four mounting holes.

[0037] The remaining structures are the same as those in Examples 1 and 2.

[0038] This invention provides a communication chip for a military duty platform, the specific working principle of which is as follows: When installing the communication chip body 1 onto the circuit board of the military duty platform, the four fixing posts 31 at the bottom of the upper heat sink 21 are respectively inserted into the four mounting holes on the circuit board. Then, the wiring pins 11 of the communication chip body 1 are soldered onto the circuit of the circuit board to achieve basic electrical connection and communication functions. When soldiers are on duty, the heat generated by the communication chip body 1 is conducted through the first conduction plate 25 and the second conduction plate 27 to the air intake channel 23 and the cavity of the upper heat sink 21, respectively. The needle-shaped heat dissipation fins 26 increase the contact with the air. The contact area allows for rapid heat transfer. Since hot air typically flows upwards, it rises and exits through the exhaust hood 22. Because the inlet cross-sectional area of ​​the exhaust hood 22 is large and the outlet cross-sectional area is small, the flow channel gradually contracts as the airflow enters. According to the fluid continuity equation, the gas velocity will increase significantly, thus allowing the heat to be discharged quickly. This creates a low-pressure area at the original location. The hose 24 fills this space with gas from the inlet channel 23. This cycle continues, rapidly discharging the heat from the lower heat sink 2 and the upper heat sink 21, effectively cooling the communication chip body 1.

[0039] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A communication chip for a military duty platform, comprising, characterized in that: A communication chip body (1) is provided, with wiring pins (11) symmetrically fixed on both sides of the communication chip body (1). A lower heat sink (2) is provided below the communication chip body (1). An air intake channel (23) is provided on one side of the lower heat sink (2). A flexible hose (24) is fixedly connected to one side of the lower heat sink (2). One end of the flexible hose (24) is fixedly connected to an upper heat sink (21). A cavity is provided inside the upper heat sink (21). The communication chip body (1) is located in the lower heat sink. (2) Between the upper heat sink (21) and the lower heat sink (2), a conductive plate one (25) is installed at the upper middle part of the lower heat sink (2), and a conductive plate two (27) is installed at the lower middle part of the upper heat sink (21). A needle-shaped heat sink fin (26) is installed on one side of both the conductive plate two (27) and the conductive plate one (25). The two needle-shaped heat sink fins (26) extend into the air intake channel (23) and the cavity of the upper heat sink (21) respectively. A vent is opened through the upper middle part of the upper heat sink (21).

2. The communication chip for a military duty platform according to claim 1, characterized in that: An exhaust hood (22) is installed on the inner wall of the vent. The exhaust hood (22) is conical, and the air inlet end of the exhaust hood (22) is located in the cavity of the upper heat sink (21).

3. The communication chip for a military duty platform according to claim 1, characterized in that: A silicone grease layer (4) is provided on one side of both the first conductive plate (25) and the second conductive plate (27). The two silicone grease layers (4) are coated with silicone grease, and the two silicone grease layers (4) are respectively attached to the upper and lower ends of the communication chip body (1).

4. The communication chip for a military duty platform according to claim 1, characterized in that: Both ends of the hose (24) are equipped with conical covers (41), and the two conical covers (41) are located in the cavity of the upper heat sink (21) and the air intake channel (23), respectively.

5. A communication chip for a military duty platform according to claim 1, characterized in that: The bottom of the cavity of the upper heat dissipation box (21) is fixedly connected to a heat insulation layer (28), which is made of aluminum silicate fiber cotton.

6. A communication chip for a military duty platform according to claim 1, characterized in that: A rotating frame (3) is fixedly connected to one side of the lower heat sink (2) near its edge. One side of the rotating frame (3) is fixedly connected to the lower side of the upper heat sink (21). A fixed seat (33) is fixedly connected to the upper side of the lower heat sink (2). A mounting ear (36) is fixedly connected to one side of the upper heat sink (21). A fixing screw (32) is threadedly connected to one side of the mounting ear (36). One end of the fixing screw (32) is threadedly connected to the fixed seat (33).

7. A communication chip for a military duty platform according to claim 6, characterized in that: One end of the fixing screw (32) is fixedly connected to a rotating cap (34), and the outer surface of the rotating cap (34) is provided with anti-slip texture (35).

8. A communication chip for a military duty platform according to claim 1, characterized in that: The lower heat sink (2) is fixedly connected to four corners of the lower end with fixed posts (31), and the four fixed posts (31) are arranged in a rectangular array.

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