A flexible microchannel heat sink and method of manufacturing the same

Abstract

This application relates to a flexible microchannel heat sink and its manufacturing method, comprising a flexible microchannel body with multiple microgrooves extending along its length, a rigid heat transfer region on the flexible microchannel body, and microchannel structures communicating with the microgrooves on the rigid heat transfer region. A flexible skeleton connected to the rigid heat transfer region is embedded within the flexible microchannel body, with at least a portion of the flexible skeleton extending into the microgrooves. This application utilizes polydimethylsiloxane to fabricate a flexible microchannel heat sink and sets a high thermal conductivity rigid heat transfer region at the location in contact with the heat source, solving the technical problem of low thermal conductivity of polymer materials limiting the heat transfer efficiency of microchannel heat sinks.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for flexible electronic devices, and in particular to a flexible microchannel heat sink and its manufacturing method. Background Technology

[0002] As electronic devices evolve towards higher integration, miniaturization, and wearability, their internal heat flux density is increasing dramatically, making heat dissipation a key bottleneck restricting the performance and reliability of these devices. Microchannel heat dissipation technology, with its extremely high heat exchange efficiency, is an effective solution to the heat dissipation problem of high heat flux density electronic devices. Typically, microchannel structures are fabricated on the surface of materials with high thermal conductivity, such as copper, aluminum, and silicon, to form high-performance microchannel heat sinks. However, rigid microchannel heat sinks are difficult to bend into shape for flexible electronic devices, failing to meet the heat dissipation requirements of wearable flexible electronic devices.

[0003] Using polymer materials to fabricate flexible microchannel heat sinks not only adapts to the dynamic deformation and heat dissipation environment of flexible electronic devices but also reduces the weight of heat dissipation devices, making it an effective solution to the heat dissipation challenges of wearable flexible electronic devices. However, the extremely low thermal conductivity of polymer materials greatly limits the heat transfer efficiency of flexible microchannel heat sinks. How to fabricate flexible microchannel heat sinks that combine flexibility and high heat transfer efficiency has become a research hotspot in the field of thermal control for flexible electronic devices. Summary of the Invention

[0004] In view of this, the purpose of the present invention is to provide a flexible microchannel heat sink and its manufacturing method, so as to solve the problems that existing rigid microchannel heat sinks cannot be bent into shape and the low thermal conductivity of polymer materials limits the heat exchange performance of flexible microchannels.

[0005] The technical solution adopted by the present invention to solve the above-mentioned technical problems is: a flexible microchannel heat sink, including a flexible microchannel body, a plurality of microgrooves extending along its length direction on the flexible microchannel body, a rigid heat transfer area on the flexible microchannel body, a microchannel structure communicating with the microgrooves on the rigid heat transfer area, and a flexible skeleton embedded in the flexible microchannel body located on both sides of the rigid heat transfer area and connected to the rigid heat transfer area, the flexible skeleton extending at least partially into the microgrooves.

[0006] As a preferred embodiment, the flexible microchannel body is made of polydimethylsiloxane, and both the rigid heat transfer zone and the flexible skeleton are made of copper or aluminum. The rigid heat transfer zone is in the shape of a rectangular plate or a cylinder.

[0007] As a preferred embodiment, the rigid heat transfer zone has at least one U-shaped sealing ring. When there is only one sealing ring, a sealing groove is formed between the sealing ring and the rigid heat transfer zone. When there are two or more sealing rings, sealing grooves are formed between the sealing ring and the rigid heat transfer zone, as well as between the sealing rings. The flexible microchannel body has a sealing limiting part that cooperates with the sealing groove.

[0008] As a preferred embodiment, when the sealing ring is a single layer, the top of the sealing ring is 0.05-0.5 mm lower than the bottom surface of the microgroove. When the sealing ring is two or more layers, the height of the multi-layer sealing ring decreases sequentially from the rigid heat transfer zone outwards, and the top of the highest sealing ring is 0.05-0.5 mm lower than the bottom surface of the microgroove. The sealing ring and the rigid heat transfer zone are integrally formed.

[0009] As a preferred embodiment, the flexible skeleton is L-shaped and includes a vertical section and a horizontal section connected to the vertical section, with the vertical section welded to the rigid heat transfer zone.

[0010] As a preferred embodiment, the horizontal portion extends into the microgroove, and the width of the horizontal portion is smaller than the width of the microgroove.

[0011] As a preferred embodiment, the horizontal portion has multiple protrusions, some of which extend into the microgroove.

[0012] As a preferred embodiment, the protrusion is inverted U-shaped and includes a horizontal connecting portion. Each end of the horizontal connecting portion is provided with a vertical connecting portion that is perpendicularly connected to it, and the vertical connecting portion is connected to the horizontal portion.

[0013] As a preferred embodiment, the rigid heat transfer zone has multiple micropillars arranged in a rectangular array, forming a micropillar array. The gaps between adjacent micropillars form an interlocking microchannel structure. The micropillars are cylindrical, rectangular, triangular, or teardrop-shaped.

[0014] This application also provides a method for manufacturing a flexible microchannel heat sink, including the following steps: S1. Clean, dry and surface plasma treat the rigid heat transfer zone and flexible frame; S2. Place the treated rigid heat transfer zone and flexible skeleton into the molding mold. The molding mold is made of polytetrafluoroethylene. The molding mold has pits, and the bottom of the pits has multiple microgroove structures. The bottom of the pits also has multiple sinks that cooperate with the micro pillars. S3. Mix the prepolymer of polydimethylsiloxane and the curing agent in a ratio of 10:1, stir evenly, pour into a molding mold, place in a vacuum oven, and cure at 50-100 ℃. After the polydimethylsiloxane has cured, demold to obtain a flexible microchannel heat sink.

[0015] The beneficial effects of this application are as follows: 1. This application utilizes polydimethylsiloxane to fabricate a flexible microchannel heat sink, and sets a rigid heat transfer zone at the position where it contacts the heat source, thus solving the technical problem of low thermal conductivity of polymer materials limiting the heat transfer efficiency of microchannel heat sinks. At the same time, a flexible skeleton is set around the rigid heat transfer zone to construct an efficient heat path between the heat source, the flexible microchannel, and the cooling medium.

[0016] 2. The rigid heat transfer zone of this application has a sealing ring structure, and the top of the sealing ring structure is located below the bottom of the microchannel. The sealing ring structure avoids the risk of liquid working fluid leakage caused by cracks forming between the flexible and rigid zones during bending and use of the flexible microchannel radiator. Simultaneously, the height difference between the sealing ring structure and the bottom of the microchannel ensures that the weld between the rigid heat transfer zone and the flexible frame is located inside the flexible microchannel, preventing the cooling medium from corroding the weld and improving the service life and reliability of the microchannel radiator.

[0017] 3. This application forms a protrusion by bending a flexible skeleton, which creates a turbulence structure in the middle of the microchannel. This not only builds an efficient heat path between the heat source and the cooling medium and enhances the convective heat transfer efficiency, but also avoids the need to use high-precision manufacturing technology to process the polydimethylsiloxane turbulence structure, thus reducing the manufacturing cost of the flexible microchannel heat sink. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the flexible microchannel heat sink according to Embodiment 1 of the present invention.

[0019] Figure 2 This is a cross-sectional view of the flexible microchannel heat sink of Embodiment 1 of the present invention.

[0020] Figure 3 This is a schematic diagram of the rigid heat transfer zone in Embodiment 1 of the present invention.

[0021] Figure 4 This is a schematic diagram of the flexible skeleton in Embodiment 1 of the present invention.

[0022] Figure 5 This is a schematic diagram of the molding die in Embodiment 1 of the present invention.

[0023] Figure 6 This is a schematic diagram of the flexible microchannel heat sink according to Embodiment 2 of the present invention.

[0024] Figure 7 This is a cross-sectional view of the flexible microchannel heat sink of Embodiment 2 of the present invention.

[0025] Figure 8 This is a schematic diagram of the rigid heat transfer zone in Embodiment 2 of the present invention.

[0026] Figure 9This is a schematic diagram of the flexible skeleton in Embodiment 2 of the present invention.

[0027] Illustration markings: 1. Flexible microchannel body, 11. Microgroove, 2. Rigid heat transfer zone, 21. Sealing ring, 22. Sealing groove, 23. Micro-column, 3. Flexible skeleton, 31. Horizontal part, 311. Protrusion, 32. Vertical part, 4. Molding mold, 41. Pits, 42. Sink, 43. Microgroove structure. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that, in the description of this invention, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0029] Please see Figure 1-5 Embodiment 1 of the present invention provides a flexible microchannel heat sink, including a flexible microchannel body 1, on which a plurality of microgrooves 11 extending along its length are provided. The flexible microchannel body 1 is characterized in that it has a rigid heat transfer zone 2, and the rigid heat transfer zone 2 has a microchannel structure communicating with the microgrooves 11. A flexible skeleton 3 is embedded in the flexible microchannel body 1, located on both sides of the rigid heat transfer zone 2 and connected to the rigid heat transfer zone 2. The flexible skeleton 3 extends at least partially into the microgrooves 11, and the rigid heat transfer zone 2 is in contact with the heat source.

[0030] The flexible microchannel body 1 is made of polydimethylsiloxane, while the rigid heat transfer zone 2 and the flexible skeleton 3 are both made of copper or aluminum. The rigid heat transfer zone 2 is rectangular in shape. A U-shaped sealing ring 21 is present on the rigid heat transfer zone 2, forming a sealing groove 22 between the sealing ring 21 and the rigid heat transfer zone 2. The flexible microchannel body 1 has a sealing limiting part 311 that mates with the sealing groove 22. The sealing ring 21 is a single layer, with its top 0.05-0.5 mm below the bottom surface of the microgroove 11. The sealing ring 21 and the rigid heat transfer zone 2 are integrally formed.

[0031] Specifically, the flexible skeleton 3 is L-shaped and includes a vertical portion 32 and a horizontal portion 31 connected to the vertical portion 32. The vertical portion 32 is welded to the rigid heat transfer zone 2. The horizontal portion 31 extends into the microgroove 11, and the width of the horizontal portion 31 is smaller than the width of the microgroove 11. It should be noted that any parts not described in detail in this application are prior art.

[0032] The high thermal conductivity flexible framework 3 is mainly distributed between the inlet of the flexible microchannel radiator and the high thermal conductivity rigid heat transfer zone 2, and is less distributed or not distributed between the rigid heat transfer zone 2 and the outlet of the flexible microchannel radiator. By setting more flexible frameworks 3 between the inlet of the flexible microchannel radiator and the heat source, the lower liquid working fluid temperature between the inlet and the heat source is utilized to further improve the heat exchange efficiency of the flexible microchannel radiator.

[0033] In addition, the rigid heat transfer zone 2 has multiple micro-pillars 23 arranged in a rectangular array, which form a micro-pillar array. The gaps between adjacent micro-pillars 23 form an interlocking microchannel structure. The micro-pillars 23 are cylindrical, triangular or raindrop-shaped.

[0034] The flexible frame 3 and the rigid heat transfer zone 2 can be integrally formed or independently formed and then welded together to achieve low thermal resistance.

[0035] More specifically, the flexible microchannel heat sink of Embodiment 1 of this application includes a flexible microchannel body 1, a rigid heat transfer zone 2, and a flexible frame 3. Both the rigid heat transfer zone 2 and the flexible frame 3 are made of copper, and the flexible microchannel body 1 has dimensions of 50 × 40 × 2 mm. 3 Its surface has a microgroove structure 11 with a width of 0.5 mm, a depth of 0.5 mm, and a spacing of 0.5 mm. The rigid heat transfer zone 2 has dimensions of 10 × 10 × 2 mm. 3 The rigid heat transfer zone 2 has a sealing ring 21 around its perimeter, with a height of 1.3 mm and a width of 0.5 mm. Its inner side has an annular sealing groove 22 with a width of 0.5 mm and a depth of 1 mm. The surface of the rigid heat transfer zone 2 has multiple micropillars 23 with a width of 0.5 mm and a height of 0.5 mm. These micropillars form a micropillar array structure. The gaps in the micropillar array structure form an interlocking microchannel structure, which communicates with the microchannels 11 of the flexible microchannel body 1, forming a flow channel for the cooling medium. Figure 2As shown, the rigid heat transfer zone 2 has flexible skeletons 3 on both sides. The width and thickness of the flexible skeletons 3 are both 0.2 mm, and their length is 20 mm, arranged in an L-shape. The flexible skeletons 3 are fixed to the rigid heat transfer zone 2 by laser welding. There are 7 flexible skeletons 3 between the inlet of the flexible microchannel radiator and the rigid heat transfer zone 2, and 4 flexible skeletons 3 between the rigid heat transfer zone 2 and the outlet of the flexible microchannel radiator. The upper surface of the flexible skeletons 3 is flush with the bottom surface of the microgroove 11 of the flexible microchannel body 1, and the upper surface of the sealing ring 21 is 0.2 mm lower than the bottom surface of the microgroove of the flexible microchannel body 1.

[0036] A method for manufacturing a flexible microchannel heat sink, comprising the following main steps: Step 1: Machining the rigid heat transfer zone 2 using micromilling technology, cutting a 0.2 mm thick copper sheet using laser cutting technology, and bending it to create a flexible skeleton 3. Cleaning the rigid heat transfer zone 2 and the flexible skeleton 3 sequentially using approximately 10% hydrochloric acid, anhydrous ethanol, and pure water, and then drying them with dry air.

[0037] Step 2: Use a stainless steel welding mold to attach and fix the flexible skeleton 3 to the side of the rigid heat transfer zone 2, and use a pulsed laser beam to achieve the connection between the rigid heat transfer zone 2 and the flexible skeleton 3.

[0038] Step 3: Place the welded rigid heat transfer zone 2 and flexible frame 3 into the forming mold 4, as shown. Figure 5 As shown, the flexible microchannel forming mold 4 has a recess 41 with a depth of 1.5 mm. The center of the recess 41 has an array of grooves 42 with a width of 0.5 mm and a depth of 0.5 mm. The bottom of the recess 41 has a microgroove structure 43 with a width of 0.5 mm, a depth of 0.5 mm, and a spacing of 0.5 mm. The micropillar array structure on the surface of the rigid heat transfer zone 2 and the grooves 42 at the bottom of the flexible microchannel forming mold 4 are used for positioning, ensuring that the 0.2 mm wide flexible skeleton 3 is located in the middle of the 0.5 mm wide microgroove structure 43.

[0039] Step 4: Mix the prepolymer of polydimethylsiloxane and the curing agent at a volume ratio of 10:1, stir evenly, pour into molding mold 4, place the whole in an oven, set the curing temperature to 60 ℃, and set the curing time to 5 hours.

[0040] Step 5: After the polydimethylsiloxane has cured, the flexible microchannel body 1, the rigid heat transfer zone 2 and the flexible skeleton 3 are fixed together. They are then removed from the molding mold 4 and further connected to the flexible cover plate and pipeline to obtain the flexible microchannel heat sink.

[0041] Of course, the present invention is not limited to the embodiments described above. Several other embodiments based on the design concept of the present invention are also provided below.

[0042] For example, in Embodiment 2, unlike the implementation method described above, as follows: Figure 6-9 As shown, the rigid heat transfer zone 2 has two layers of U-shaped sealing rings 21, and sealing grooves 22 are formed between the sealing rings 21 and the rigid heat transfer zone 2, as well as between the sealing rings 21. The height of the multiple sealing rings 21 decreases sequentially from the rigid heat transfer zone 2 outwards, and the top of the highest sealing ring 21 is 0.05-0.5 mm lower than the bottom surface of the micro-groove 11.

[0043] The horizontal portion 31 has multiple protrusions 311, some of which extend into the microgrooves 11. These protrusions form a turbulence structure within the microgrooves 11, enhancing heat transfer efficiency and increasing the contact area with the microgrooves 11, thus increasing the bonding strength. Each protrusion 311 is inverted U-shaped and includes a horizontal connecting portion. Vertical connecting portions are provided at both ends of the horizontal connecting portion and are perpendicularly connected to it, thus connecting to the horizontal portion 31.

[0044] The flexible microchannel heat sink of this embodiment includes a flexible microchannel body 1, a rigid heat exchange zone 2, and a flexible frame 3. The dimensions of the flexible microchannel body 1 are 50×40×2 mm. 3 Its surface has a microgroove structure with a width of 0.5 mm, a depth of 0.25 mm, and a spacing of 0.5 mm. The rigid heat transfer zone 2 has dimensions of 10 × 10 × 2 mm. 3 ,like Figure 8 As shown, the device has two sealing rings 2 around its perimeter, namely an outer sealing ring and an inner sealing ring. An outer sealing groove is formed between the outer and inner sealing rings, and an inner sealing groove is formed between the inner sealing ring and the rigid heat transfer zone 2. The rigid heat transfer zone 2 has multiple micropillars 23 at its center. Each micropillar 23 is cylindrical, 1 mm in diameter, with a center-to-center distance of 1 mm between adjacent micropillars, and a height of 0.25 mm. The widths of the outer and inner sealing rings are 0.25 mm, as are the widths of the outer and inner sealing grooves (1 mm and 1.15 mm respectively). The upper surface of the inner sealing ring 211 is 0.1 mm lower than the bottom surface of the micropillars 23. The multiple micropillars 23 form a micropillar array structure. The gaps in the micropillar array structure form an interlocking microchannel structure, which communicates with the microchannels 11 of the flexible microchannel body 1, forming a flow channel for the cooling medium. Figure 6 As shown, there are 7 flexible skeletons 3 between the inlet of the flexible microchannel and the rigid heat exchange zone 2, and 3 flexible skeletons 3 between the rigid heat exchange zone 2 and the outlet of the flexible microchannel. The width and thickness of the flexible skeleton 3 are both 0.2 mm, and it is bent to form a protrusion 311, which protrudes 0.2 mm from the bottom of the microgroove 11.

[0045] A method for manufacturing a flexible microchannel heat sink, comprising the following main steps: Step 1: Machining the rigid heat transfer zone 2 using micromilling technology, cutting a 0.2 mm thick copper sheet using laser cutting technology, and bending it to create a flexible skeleton 3. Cleaning the rigid heat transfer zone 2 and the flexible skeleton 3 sequentially using approximately 10% hydrochloric acid, anhydrous ethanol, and pure water, and then drying them with dry air.

[0046] Step 2: Using a stainless steel welding mold, fix the flexible skeleton 3 to the side of the rigid heat transfer zone 2. Apply an appropriate amount of Sn63Pb37 solder paste evenly to the contact surface between the rigid heat transfer zone 2 and the flexible skeleton 3. After fixing with the stainless steel mold, place it in an oven, set the heating temperature to 200℃, and hold for 30 minutes to ensure the solder paste melts completely. After holding, turn off the oven power and cool to room temperature. Clean the welded rigid heat transfer zone 2 and flexible skeleton 3 with anhydrous ethanol to remove flux residue. The stainless steel mold can position the rigid heat transfer zone 2 and flexible skeleton 3, ensuring successful welding.

[0047] Step 3: The rigid heat transfer zone 2 and flexible skeleton 3 are treated with a plasma cleaner to enhance their bonding force with the flexible microchannels. The treated rigid heat transfer zone 2 and flexible skeleton 3 are then placed into a molding die 4. The molding die 4 has a recess 41 with a depth of 1.75 mm. The center of the recess 41 has an array of multiple grooves 42 with a diameter of 1 mm and a depth of 0.25 mm. The bottom of the recess 41 has a microgroove structure 43 with a width of 0.5 mm, a depth of 0.25 mm, and a spacing of 0.5 mm. The micropillar array structure on the surface of the rigid heat transfer zone 2 and the grooves 42 at the bottom of the molding die are used for positioning, ensuring that the 0.2 mm wide flexible skeleton 3 is located in the middle of the 0.5 mm wide microgroove structure 43. The molding die 4 is made of polytetrafluoroethylene (PTFE).

[0048] Step 4: Mix the prepolymer of polydimethylsiloxane and the curing agent at a volume ratio of 10:1, stir evenly, pour into molding mold 4, place the whole in an oven, set the curing temperature to 60 ℃, and set the curing time to 5 hours.

[0049] Step 5: After the polydimethylsiloxane has cured, the flexible microchannel body 1, the rigid heat transfer zone 2 and the flexible skeleton 3 are fixed together. They are then removed from the molding mold 4 and further connected to the flexible cover plate and pipeline to obtain the flexible microchannel heat sink.

[0050] The welding surfaces of the rigid heat transfer zone 2 and the flexible skeleton 3 are located inside the flexible microchannel body 1, which avoids the tin and lead components in the solder paste from coming into contact with the cooling medium, effectively improving the service life of the flexible microchannel heat sink.

[0051] It should be noted that the above embodiments are only used to illustrate the present invention, but the present invention is not limited to the above embodiments. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention shall fall within the protection scope of the present invention.

Claims

1. A flexible microchannel heat sink comprising a flexible microchannel body (1) having a plurality of microgrooves (11) extending along the length of the body (1), characterized in that, The flexible microchannel body (1) has a rigid heat transfer zone (2), and the rigid heat transfer zone (2) has a microchannel structure that communicates with the microgroove (11). The flexible microchannel body (1) is embedded with a flexible skeleton (3) that is connected to the rigid heat transfer zone (2), and the flexible skeleton (3) extends at least partially into the microgroove (11).

2. The flexible microchannel heat sink of claim 1, wherein, The flexible microchannel body (1) is made of polydimethylsiloxane, and the rigid heat transfer zone (2) and the flexible skeleton (3) are both made of copper or aluminum.

3. The flexible microchannel heat sink of claim 2, wherein, The rigid heat transfer zone (2) has at least one layer of U-shaped sealing ring (21). When the sealing ring (21) is one layer, a sealing groove (22) is formed between the sealing ring (21) and the rigid heat transfer zone (2). When the sealing ring (21) is two or more layers, a sealing groove (22) is formed between the sealing ring (21) and the rigid heat transfer zone (2) and between the sealing rings (21) and the sealing rings (21). The flexible microchannel body (1) has a sealing limiting part (311) that cooperates with the sealing groove (22).

4. The flexible microchannel heat sink of claim 3, wherein, When the sealing ring (21) is a single layer, the top of the sealing ring (21) is 0.05-0.5 mm lower than the bottom surface of the micro-groove (11). When the sealing ring (21) is two or more layers, the height of the multi-layer sealing ring (21) decreases sequentially from the rigid heat transfer zone (2) outwards, and the top of the highest sealing ring (21) is 0.05-0.5 mm lower than the bottom surface of the micro-groove (11). The sealing ring (21) and the rigid heat transfer zone (2) are integrally formed.

5. The flexible microchannel heat sink of claim 4, wherein, The flexible skeleton (3) is L-shaped and includes a vertical part (32) and a horizontal part (31) connected to the vertical part (32). The vertical part (32) is welded to the rigid heat transfer zone (2).

6. A flexible microchannel heat sink according to claim 5, characterized in that, The horizontal portion (31) extends into the microgroove (11), and the width of the horizontal portion (31) is smaller than the width of the microgroove (11).

7. A flexible microchannel heat sink according to claim 5, characterized in that, The horizontal portion (31) has a plurality of protrusions (311), which partially extend into the microgroove (11).

8. A flexible microchannel heat sink according to claim 7, characterized in that, The protrusion (311) is inverted U-shaped and includes a horizontal connecting part. The two ends of the horizontal connecting part are respectively provided with vertical connecting parts that are perpendicular to it. The vertical connecting parts are connected to the horizontal part (31).

9. A flexible microchannel heat sink according to claim 8, characterized in that, The rigid heat transfer zone (2) has a rectangular array of multiple micro-pillars (23), which form a micro-pillar (23) array. The gaps between adjacent micro-pillars (23) form an interlocking microchannel structure. The micro-pillars (23) are cylindrical, rectangular, triangular or raindrop-shaped.

10. A method for manufacturing a flexible microchannel heat sink according to claim 9, characterized in that, Includes the following steps: S1. The rigid heat transfer zone (2) and the flexible skeleton (3) are cleaned, dried and surface plasma treated. S2. The treated rigid heat transfer zone (2) and flexible skeleton (3) are placed into the molding mold (4). The molding mold (4) is made of polytetrafluoroethylene. The molding mold (4) has a pit (41). The bottom of the pit (41) has multiple microgroove structures (43). The bottom of the pit (41) also has multiple sinks (42) that cooperate with the micro pillars (23). S3. Mix the prepolymer of polydimethylsiloxane and the curing agent in a ratio of 10:1, stir evenly and pour into the molding mold (4), then put it into a vacuum oven and cure it at 50-100 ℃. After the polydimethylsiloxane is cured, demold to obtain a flexible microchannel heat sink.

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