An industrial automation controller device with integrated heat dissipation structure

Abstract

This invention relates to the field of industrial automation control equipment technology. It discloses an industrial automation controller device with an integrated heat dissipation structure, comprising an upper housing and a lower housing. A gradient composite heat dissipation substrate is installed at the bottom of the inner cavity of the lower housing. Multiple sets of positioning grooves are formed within the gradient composite heat dissipation substrate, each containing a core control module and a power module. The inner walls of the positioning grooves are coated with thermally conductive silicone grease. Heat dissipation fins are integrally formed at the bottom of the lower housing. This device integrates gradient composite heat conduction, partitioned fin air cooling, and water cooling active circulation structure, breaking through the limitations of traditional single heat dissipation, significantly improving heat dissipation efficiency. It can adapt to the long-cycle operation requirements of high-power-density controllers, precisely solving the problems of low heat dissipation efficiency and poor adaptability of existing devices, ensuring the stability and service life of the controller, fundamentally avoiding production interruptions caused by high-temperature failures, and ensuring continuous and safe industrial production.

Description

Technical Field

[0001] This invention relates to the field of industrial automation control equipment technology, specifically to an industrial automation controller device with an integrated heat dissipation structure. Background Technology

[0002] Industrial automation controllers, as core control units on industrial production lines, are widely used in various industrial scenarios such as steel mills, chemical plants, ports, and smart production lines. They undertake critical tasks such as command issuance, data acquisition, logic control, and module linkage. Their operational stability directly determines the continuity, safety, and production efficiency of industrial production, making them an indispensable core device in modern intelligent manufacturing systems. With the advancement of Industry 4.0 and the deep development of intelligent manufacturing, industrial automation controllers are iterating towards higher power density, compactness, and long-cycle continuous operation. The integration of internally integrated electronic components such as CPUs, PLC modules, power IGBTs, MOSFETs, and communication modules is constantly increasing, leading to a significant increase in heat generated during operation. Thermal management has become a core bottleneck restricting the improvement of controller performance and the extension of its service life.

[0003] Currently, existing industrial automation controllers employ limited and poorly adaptable heat dissipation methods, resulting in low thermal management efficiency. Most existing controllers utilize single-fan air cooling or passive cooling with simple heat sinks. Passive cooling relies solely on heat conduction and natural convection from the heat sink, offering limited efficiency and failing to meet the heat dissipation requirements of high-power-density controllers. Therefore, we propose an industrial automation controller device with an integrated heat dissipation structure to address these issues. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides an industrial automation controller device with an integrated heat dissipation structure, which solves the problems of single heat dissipation method, poor adaptability, and low thermal management efficiency of existing industrial automation controllers.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an industrial automation controller device with an integrated heat dissipation structure, comprising an upper housing and a lower housing;

[0006] A gradient composite heat dissipation substrate is installed at the bottom of the inner cavity of the lower housing. Multiple sets of positioning grooves are formed in the gradient composite heat dissipation substrate, and the core control module and power module are respectively embedded in the interior of the positioning grooves. The inner wall of the positioning grooves is coated with thermal grease.

[0007] The bottom of the lower housing is integrally formed with heat dissipation fins;

[0008] The water-cooling component, integrated on the upper or lower housing, is used to cool the core control module and power module.

[0009] Preferably, the gradient composite heat dissipation substrate comprises, from top to bottom, a nanoscale diamond heat dissipation layer, a titanium / tungsten transition layer, and a high thermal conductivity copper base layer.

[0010] Preferably, the water-cooling assembly includes a water tank fixed to one side of the lower housing, a cooling fin fixedly installed on one side of the water tank, a cooling fan for dissipating heat from the cooling fin's heat dissipation surface installed on one side of the water tank, a housing cover fixedly installed on the top of the water tank, a circulation pump housed inside the housing cover, the circulation pump and the water tank being fixedly connected, the output end of the circulation pump being connected to a bend pipe via a pipe body, the bend pipe being fixedly connected to the upper housing, the other end of the bend pipe being fixedly connected to a connecting hose, a fiber-reinforced composite rubber liquid cooling bladder being housed in the cavity formed by the upper and lower housings, the top of the fiber-reinforced composite rubber liquid cooling bladder being connected to a connecting hose, a drain pipe fixed on the lower housing, one end of the drain pipe extending into the water tank, the bottom of the fiber-reinforced composite rubber liquid cooling bladder being connected to the drain pipe via a pipe body, and the input end of the circulation pump penetrating the water tank and extending to the bottom of the water tank's inner cavity.

[0011] Preferably, a hydrophobic thermally conductive and moisture-absorbing composite pad is provided between the fiber-reinforced composite rubber liquid cooling pad and the gradient composite heat dissipation substrate, and the edge of the hydrophobic thermally conductive and moisture-absorbing composite pad is sealed to the lower shell.

[0012] Preferably, the housing cover has symmetrically arranged partitions fixed inside, and the cavity formed by the housing cover and the partitions is provided with a drive fan wheel. A stirring rod is fixedly installed at the center of the drive fan wheel, and one end of the stirring rod extends into the water storage tank. The output end of the circulation pump is connected to a branch pipe, and both ends of the branch pipe pass through the partition and correspond to the edges of the two sets of drive fan wheels. The top of the water storage tank is provided with a drain outlet in the cavity.

[0013] Preferably, a temperature sensor is integrated inside the water storage tank, and a control panel is installed on the outer surface of the water storage tank.

[0014] Preferably, the heat dissipation fins adopt a partitioned design, with the heat dissipation fins grouped into a high-power heat dissipation area and a low-power heat dissipation area: the high-power heat dissipation area corresponds to the power module, with a fin density of 8-10 fins / cm² and a fin height of 25-30mm, and adopts a corrugated structure to increase the heat dissipation area; the low-power heat dissipation area corresponds to the core control module, with a fin density of 4-6 fins / cm² and a fin height of 15-20mm, and adopts a straight plate structure to balance heat dissipation efficiency and space compactness.

[0015] Preferably, the surface of the heat dissipation fins is coated with a nano-level anti-corrosion and anti-dust coating with a thickness of 5-10μm. The coating is made of hydrophobic material, which can effectively prevent the adhesion of industrial dust and water vapor, reduce the clogging of heat dissipation fins, and reduce the maintenance frequency. At the same time, the heat dissipation fins are provided with airflow guides to guide the orderly flow of air and avoid heat dissipation dead zones caused by airflow turbulence.

[0016] Beneficial effects

[0017] This invention provides an industrial automation controller device with an integrated heat dissipation structure. Compared with the prior art, it has the following advantages:

[0018] This industrial automation controller device with an integrated heat dissipation structure adopts an integrated heat dissipation structure with gradient composite heat conduction, partitioned fin air cooling, and active circulation of water cooling components. It breaks through the limitations of traditional single heat dissipation methods, significantly improving heat dissipation efficiency and meeting the long-cycle operation requirements of high power density and compact controllers. The gradient composite heat dissipation substrate enables rapid heat conduction, and the partitioned fins are precisely adapted according to the heat generation differences of the core control module and power module, balancing heat dissipation efficiency and space compactness. The flexible liquid cooling bladder of the water cooling component can adapt to the concave and convex structure of the module to achieve full-area heat exchange. The closed-loop circulation pipeline, together with the cooling chip, continuously provides low-temperature coolant, completely solving the core problems of low heat dissipation efficiency and poor adaptability of existing devices.

[0019] Meanwhile, the device features multiple protection and intelligent control designs, adapting to various complex industrial scenarios and significantly reducing maintenance costs. The nano-coating of the heat sink fins is corrosion-resistant and dust-proof, the airflow channels avoid airflow dead zones, and the hydrophobic thermally conductive and moisture-absorbing composite pad achieves triple effects of heat conduction, moisture prevention, and sealing, preventing modules from getting damp and coolant from leaking. The water-cooling component's diversion and stirring structure ensures uniform coolant temperature and improves heat dissipation stability. The temperature sensor and control panel achieve intelligent temperature control, balancing energy saving and heat dissipation. The overall heat dissipation structure ensures the operating temperature of the controller's electronic components, significantly improving their operational stability and service life, fundamentally avoiding production interruptions caused by controller overheating failures, and ensuring the continuity and safety of industrial production. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 This is a rear view of the overall structure of the present invention;

[0022] Figure 3 This is a partial cross-sectional view of the structure of the water-cooling assembly of the present invention; Figure 4 This is a structural breakdown diagram of the entire invention.

[0023] In the diagram: 101, upper shell; 102, lower shell; 103, heat dissipation fins; 104, gradient composite heat dissipation substrate; 105, positioning groove; 2, water cooling assembly; 201, water tank; 202, cooling chip; 203, cooling fan; 204, shell cover; 205, circulation pump; 206, bend; 207, connecting hose; 208, hydrophobic thermally conductive and moisture-absorbing composite pad; 209, branch pipe; 210, partition; 211, drain outlet; 212, drive fan wheel; 213, stirring rod; 214, fiber-reinforced composite rubber liquid cooling pad; 215, drain pipe. Detailed Implementation

[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] like Figure 1-4 As shown:

[0026] An industrial automation controller device with an integrated heat dissipation structure includes an upper housing 101 and a lower housing 102;

[0027] The bottom of the inner cavity of the lower housing 102 is equipped with a gradient composite heat dissipation substrate 104. Multiple sets of positioning grooves 105 are formed in the gradient composite heat dissipation substrate 104, and the core control module and power module are embedded in them respectively. The inner wall of the positioning groove 105 is coated with thermal grease. The gradient composite heat dissipation substrate 104 includes a nano-diamond heat dissipation layer, a titanium / tungsten transition layer and a high thermal conductivity copper base layer from top to bottom.

[0028] The bottom of the lower housing 102 is integrally formed with heat dissipation fins 103. The heat dissipation fins 103 adopt a partitioned design, divided into a high-power heat dissipation area and a low-power heat dissipation area: the high-power heat dissipation area corresponds to the power module, with a fin density of 8-10 fins / cm² and a fin height of 25-30mm, and adopts a corrugated structure to increase the heat dissipation area; the low-power heat dissipation area corresponds to the core control module, with a fin density of 4-6 fins / cm² and a fin height of 15-20mm, and adopts a straight fin structure to balance heat dissipation efficiency and space compactness. The surface of the heat dissipation fins 103 is coated with a nano-level anti-corrosion and anti-dust coating with a thickness of 5-10μm, made of hydrophobic material, which can effectively prevent the adhesion of industrial dust and moisture, reduce the clogging of the heat dissipation fins 103, and reduce the maintenance frequency; at the same time, guide grooves are set between the heat dissipation fins 103 to guide the airflow in an orderly manner and avoid heat dissipation dead corners caused by turbulent airflow.

[0029] A water-cooling assembly 2, integrated on the upper housing 101 or the lower housing 102, is used to cool the core control module and power module. The water-cooling assembly 2 includes a water tank 201 fixed to one side of the lower housing 102. A cooling fin 202 is fixedly installed on one side of the water tank 201. A cooling fan 203 is installed on one side of the water tank 201 to dissipate heat from the cooling fin 202. A housing cover 204 is fixedly installed on the top of the water tank 201. A circulation pump 205 is housed inside the housing cover 204. The circulation pump 205 and the water tank 102... 01. Fixed connection: The output end of the circulation pump 205 is connected to a bend 206 via a pipe body. The bend 206 is fixedly connected to the upper housing 101. The other end of the bend 206 is fixed with a connecting hose 207. A fiber-reinforced composite rubber liquid cooling bladder 214 is provided in the cavity formed by the upper housing 101 and the lower housing 102. The top of the fiber-reinforced composite rubber liquid cooling bladder 214 is connected to the connecting hose 207. A drain pipe 215 is fixed on the lower housing 102. One end of the drain pipe 215 extends into the water storage tank 201. The bottom of the fiber-reinforced composite rubber liquid cooling pad 214 is connected to the drain pipe 215 via a tube. The input end of the circulating pump 205 passes through the water storage tank 201 and extends to the bottom of the inner cavity of the water storage tank 201. A hydrophobic thermally conductive and moisture-absorbing composite pad 208 is provided between the fiber-reinforced composite rubber liquid cooling pad 214 and the gradient composite heat dissipation substrate 104. The edge of the hydrophobic thermally conductive and moisture-absorbing composite pad 208 is sealed to the lower shell 102. A symmetrically arranged partition plate 210 is fixed inside the shell cover 204. The shell cover 204 and the partition plate 210... The cavity formed by 10 is equipped with a drive fan wheel 212. A stirring rod 213 is fixedly installed at the center of the drive fan wheel 212. One end of the stirring rod 213 extends into the water storage tank 201. The output end of the circulation pump 205 is connected to a branch pipe 209. Both ends of the branch pipe 209 pass through the partition 210 and correspond to the edges of the two sets of drive fan wheels 212. The top of the water storage tank 201 is provided with a drain outlet 211 in the cavity. A temperature sensor is integrated into the water storage tank 201. A control panel is installed on the outer surface of the water storage tank 201.

[0030] In this implementation scheme: When the industrial automation controller device with integrated heat dissipation structure is in use, a gradient composite heat dissipation substrate 104 is fixedly installed at the bottom of the inner cavity of the lower housing 102. The substrate consists of a nano-diamond heat dissipation layer, a titanium / tungsten transition layer, and a high thermal conductivity copper base layer from top to bottom. First, thermal conductive silicone grease is uniformly coated on the inner wall of multiple positioning grooves 105 on the substrate. Then, the core control module and power module are respectively embedded into the corresponding positioning grooves 105. The contact gap between the module and the groove is eliminated by the thermal conductive silicone grease, so as to achieve unobstructed initial heat conduction.

[0031] A hydrophobic thermally conductive and moisture-absorbing composite pad 208 is laid on the surface module of the gradient composite heat dissipation substrate 104. The edge of the composite pad is sealed to the inner wall of the lower housing 102. This ensures that the composite pad is tightly attached to the module and the substrate, improves the heat conduction efficiency, prevents the coolant of the water-cooled components from leaking, and absorbs trace amounts of water vapor in the cavity to prevent the module from getting damp.

[0032] The fiber-reinforced composite rubber liquid cooling pad 214 is placed on top of the hydrophobic thermally conductive and moisture-absorbing composite pad 208. Utilizing the flexible and non-expanding design of the liquid cooling pad, it adapts to the uneven structure of the module surface, achieving a complete and tight fit with the heating module, maximizing the water-cooling contact area, and laying the foundation for heat absorption in subsequent water-cooling cycles.

[0033] Close and assemble the upper housing 101 and the lower housing 102 to seal the controller cavity; at the same time, confirm the pipeline connection of the water-cooling component 2: the output end of the circulation pump 205 is connected to the inlet of the liquid cooling bladder 214 through the bend 206 and the connecting hose 207, the outlet of the liquid cooling bladder 214 is connected to the drain pipe 215 through the pipe body, the other end of the drain pipe 215 extends to the inner cavity of the water storage tank 201, and the input end of the circulation pump 205 passes through the water storage tank 201 and extends to its bottom, forming a complete water-cooling circulation pipeline;

[0034] After the controller is powered on, the core control module and power module generate a large amount of heat. The device works simultaneously through a triple heat dissipation path: gradient substrate heat conduction, partitioned fin air cooling, and active circulation of water cooling components. At the same time, the water cooling components have built-in water temperature homogenization and cooling temperature control functions, achieving efficient heat dissipation throughout the entire process. Specific steps:

[0035] The heat generated by the module operation is first transferred to the nanoscale diamond heat dissipation layer of the gradient composite heat dissipation substrate 104 through the thermal grease in the positioning groove 105, and then through the titanium / tungsten transition layer to eliminate the thermal expansion difference, and finally conducted to the high thermal conductivity copper base layer, completing the concentrated conduction of heat from the module to the substrate, and collecting heat for subsequent heat dissipation.

[0036] The heat collected by the gradient composite heat dissipation substrate 104 is partially transferred directly to the lower housing 102, and then conducted to the integrally formed heat dissipation fins 103 at the bottom of the lower housing. Passive air cooling is achieved through convection between the fins and the outside air, and the fins are designed in a partitioned manner.

[0037] The high-power heat dissipation area corresponds to the power module: fin density of 8-10 fins / cm², height of 25-30mm, and corrugated structure to increase the heat dissipation area and quickly dissipate the high heat of the power module;

[0038] The low-power heat dissipation area corresponds to the core control module: fin density 4-6 fins / cm², height 15-20mm, straight plate structure takes into account heat dissipation efficiency and space compactness, and is suitable for the low heat dissipation of the core module.

[0039] Meanwhile, the fin surface is coated with a 5-10μm nano-level anti-corrosion, anti-dust and hydrophobic coating, which, together with the airflow guide grooves between the fins, guides the airflow to flow in an orderly manner, avoids dust / moisture adhesion and blockage, and avoids airflow turbulence that forms heat dissipation dead corners, thus ensuring the long-term stability of air cooling efficiency;

[0040] The control panel outside the water storage tank 201 activates the water cooling assembly, powering on the circulation pump 205. This pump draws coolant from the bottom of the water storage tank 201, delivering it through the bend 206 and connecting hose 207 to the fiber-reinforced composite rubber liquid cooling bladder 214. As the coolant flows within the flexible bladder, it comes into full contact with the hydrophobic, thermally conductive, and moisture-absorbing composite pad 208 beneath the bladder, rapidly absorbing heat transferred from the module to the pad. This completes the heat transfer from the controller cavity to the coolant. The cooled coolant, after absorbing heat, flows through the outlet of the liquid cooling bladder 214 into the drain pipe 215, and then returns to the water storage tank 201, achieving a closed-loop circulation of the coolant. Simultaneously, the cooling plate 202 installed on one side of the water storage tank 201 cools the returned high-temperature coolant. The cooling plate 202's heat dissipation surface is cooled by the cooling fan 203, ensuring the cooling plate's heat dissipation... The cooling efficiency ensures that the coolant in the water tank remains at a low temperature. Part of the coolant output by the circulation pump 205 enters the liquid cooling fins via the main pipeline, while the other part is discharged through the branch pipe 209. The outlet of the branch pipe is aligned with the edge of the drive fan wheel 212 inside the housing 204. The impact force of the coolant drives the drive fan wheel 212 to rotate. The stirring rod 213 at the center of the drive fan wheel rotates synchronously with the fan wheel, with one end extending into the water tank 201. During rotation, it thoroughly stirs the coolant in the water tank, preventing uneven water temperature caused by excessively low coolant temperature near the cooling fins and excessively high return coolant temperature, ensuring a consistent overall coolant temperature and improving the heat absorption efficiency of the water cooling cycle. The coolant impacting the drive fan wheel flows back to the water tank through the drain outlet 211 connecting the housing 204 and the water tank, eliminating coolant waste.

[0041] The temperature sensor integrated inside the water tank 201 monitors the coolant temperature in real time and transmits the temperature data to the control panel outside the water tank. The operator can set the temperature threshold through the control panel. When the coolant temperature exceeds the threshold, the cooling fins 202 and the cooling fan 203 automatically increase their working power to accelerate cooling and heat dissipation. When the temperature is below the threshold, the power can be appropriately reduced to achieve energy-saving intelligent control of the heat dissipation system, taking into account both heat dissipation efficiency and energy consumption.

[0042] Throughout the heat dissipation process, the hydrophobic thermally conductive and moisture-absorbing composite pad 208 plays a triple role of heat conduction, moisture absorption, and sealing: it ensures efficient heat transfer from the substrate to the liquid cooling bladder, continuously absorbs trace amounts of moisture in the controller's sealed cavity to prevent the electronic module from getting damp and short-circuiting, and its sealed connection with the lower housing completely prevents the coolant of the water-cooled components from leaking to the module surface, ensuring the safe operation of the electronic components inside the controller.

[0043] This solution employs an integrated heat dissipation structure that combines gradient composite heat conduction, partitioned fin air cooling, and active circulation of water-cooling components. This breaks through the limitations of traditional single heat dissipation methods, significantly improving heat dissipation efficiency and meeting the long-cycle operation requirements of high-power-density, compact controllers. The gradient composite heat dissipation substrate enables rapid heat conduction, and the partitioned fins are precisely adapted to the heat generation differences of the core control module and power module, balancing heat dissipation efficiency with space compactness. The flexible liquid cooling bladder of the water-cooling component can adapt to the concave and convex structure of the module, achieving full-area heat exchange. The closed-loop circulation pipeline, together with the cooling chip, continuously provides low-temperature coolant, completely solving the core problems of low heat dissipation efficiency and poor adaptability of existing devices.

[0044] Meanwhile, the device features multiple protection and intelligent control designs, adapting to various complex industrial scenarios and significantly reducing maintenance costs. The nano-coating of the heat sink fins is corrosion-resistant and dust-proof, the airflow channels avoid airflow dead zones, and the hydrophobic thermally conductive and moisture-absorbing composite pad achieves triple effects of heat conduction, moisture prevention, and sealing, preventing modules from getting damp and coolant from leaking. The water-cooling component's diversion and stirring structure ensures uniform coolant temperature and improves heat dissipation stability. The temperature sensor and control panel achieve intelligent temperature control, balancing energy saving and heat dissipation. The overall heat dissipation structure ensures the operating temperature of the controller's electronic components, significantly improving their operational stability and service life, fundamentally avoiding production interruptions caused by controller overheating failures, and ensuring the continuity and safety of industrial production.

[0045] It should be noted that: all contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0046] The control method of this invention is to control the device by manually starting and stopping the switch. The wiring diagram of the power element and the supply of power are common knowledge in the field. Since this invention is mainly used to protect mechanical devices, the control method and wiring layout will not be explained in detail.

[0047] The control method of this invention is automatic control through a controller. The control circuit of the controller can be implemented by simple programming by those skilled in the art. The power supply is also common knowledge in the field. Furthermore, since this invention is mainly used to protect mechanical devices, the control method and circuit connection will not be explained in detail here.

[0048] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An industrial automation controller device with an integrated heat dissipation structure, characterized in that: It includes an upper shell (101) and a lower shell (102); The bottom of the inner cavity of the lower housing (102) is equipped with a gradient composite heat dissipation substrate (104). The gradient composite heat dissipation substrate (104) has multiple sets of positioning grooves (105) inside, and the core control module and power module are embedded in them respectively. The inner wall of the positioning groove (105) is coated with thermal grease. The bottom of the lower housing (102) is integrally formed with heat dissipation fins (103). A water-cooling component (2) is integrated on the upper housing (101) or the lower housing (102) for cooling the core control module and power module.

2. The industrial automation controller device with an integrated heat dissipation structure according to claim 1, characterized in that: The gradient composite heat dissipation substrate (104) comprises, from top to bottom, a nanoscale diamond heat dissipation layer, a titanium / tungsten transition layer, and a high thermal conductivity copper base layer.

3. The industrial automation controller device with integrated heat dissipation structure according to claim 1, characterized in that: The water-cooling assembly (2) includes a water tank (201) fixed to one side of the lower housing (102). A cooling chip (202) is fixedly installed on one side of the water tank (201). A cooling fan (203) for dissipating heat from the cooling chip (202) is installed on one side of the water tank (201). A housing cover (204) is fixedly installed on the top of the water tank (201). A circulation pump (205) is provided inside the housing cover (204). The circulation pump (205) is fixedly connected to the water tank (201). The output end of the circulation pump (205) is connected to a bend pipe (206) through a pipe body. The bend pipe (206) is fixedly connected to the upper housing (101). (206) has a connecting hose (207) fixed at the other end. The cavity formed by the upper shell (101) and the lower shell (102) is provided with a fiber-reinforced composite rubber liquid cooling bladder (214). The top of the fiber-reinforced composite rubber liquid cooling bladder (214) is connected to the connecting hose (207). A drain pipe (215) is fixed on the lower shell (102). One end of the drain pipe (215) extends into the water storage tank (201). The bottom of the fiber-reinforced composite rubber liquid cooling bladder (214) is connected to the drain pipe (215) through the pipe body. The input end of the circulation pump (205) passes through the water storage tank (201) and extends to the bottom of the inner cavity of the water storage tank (201).

4. The industrial automation controller device with integrated heat dissipation structure according to claim 3, characterized in that: A hydrophobic thermally conductive and moisture-absorbing composite pad (208) is provided between the fiber-reinforced composite rubber liquid cooling pad (214) and the gradient composite heat dissipation substrate (104), and the edge of the hydrophobic thermally conductive and moisture-absorbing composite pad (208) is sealed to the lower shell (102).

5. The industrial automation controller device with an integrated heat dissipation structure according to claim 4, characterized in that: The housing cover (204) is fixed with symmetrically arranged partitions (210). The cavity formed by the housing cover (204) and the partitions (210) is provided with a drive fan wheel (212). A stirring rod (213) is fixedly installed at the center of the drive fan wheel (212). One end of the stirring rod (213) extends into the water storage tank (201). The output end of the circulation pump (205) is connected to a branch pipe (209). Both ends of the branch pipe (209) pass through the partitions (210) and correspond to the edges of the two sets of drive fan wheels (212). The top of the water storage tank (201) is provided with a drain outlet (211) in the cavity.

6. The industrial automation controller device with an integrated heat dissipation structure according to claim 5, characterized in that: A temperature sensor is integrated inside the water storage tank (201), and a control panel is installed on the outer surface of the water storage tank (201).

7. The industrial automation controller device with integrated heat dissipation structure according to claim 1, characterized in that: The heat dissipation fins (103) adopt a partitioned design, and the heat dissipation fins (103) are divided into a high-power heat dissipation area and a low-power heat dissipation area: the high-power heat dissipation area corresponds to the power module, the fin density is 8-10 fins / cm², the fin height is 25-30mm, and a corrugated structure is adopted to increase the heat dissipation area; the low-power heat dissipation area corresponds to the core control module, the fin density is 4-6 fins / cm², the fin height is 15-20mm, and a straight plate structure is adopted to balance heat dissipation efficiency and space compactness.

8. The industrial automation controller device with an integrated heat dissipation structure according to claim 7, characterized in that: The surface of the heat dissipation fins (103) is coated with a nano-level anti-corrosion and anti-dust coating with a thickness of 5-10μm. The coating is made of hydrophobic material, which can effectively prevent industrial dust and water vapor from adhering, reduce the blockage of the heat dissipation fins (103), and reduce the maintenance frequency. At the same time, the heat dissipation fins (103) are provided with guide grooves to guide the airflow in an orderly manner and avoid heat dissipation dead corners caused by airflow turbulence.

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