Two-phase cold plate and electronic device

Abstract

This application relates to a two-phase cold plate and electronic device, comprising a top cover layer, a flow distribution layer, and a substrate layer stacked sequentially. The top cover layer has an inlet and an outlet. A flow distribution channel and a flow convergence channel are formed between the top cover layer and the flow distribution layer. The flow distribution channel communicates with the inlet, and the flow convergence channel communicates with the outlet. The substrate layer has an evaporation chamber with an opening facing the flow distribution layer. The flow distribution layer has multiple flow distribution holes, which are connected to both the flow distribution channel and the evaporation chamber. The flow distribution layer also has a heat exchange channel, which is connected to both the flow convergence channel and the evaporation chamber. This two-phase cold plate can significantly reduce internal pressure drop.

Description

Technical Field

[0001] This application relates to the field of heat sink technology, and in particular to a two-phase cold plate and electronic equipment. Background Technology

[0002] With the rapid development of information technology, the power density of chips used for AI computing is constantly increasing, leading to high temperatures in electronic components during operation, which significantly reduces their stability. Therefore, improving the heat dissipation performance of electronic components has become particularly important.

[0003] Currently, the commonly used heat dissipation method is single-phase cold plate liquid cooling. However, to improve the heat dissipation effect of this method, it is necessary to simultaneously increase the flow rate and the inlet-outlet temperature difference. But high flow rates lead to huge pump power consumption and pipeline pressure drop, while increasing the inlet-outlet temperature difference will induce thermal stress, affecting the performance and reliability of the chip. In contrast, two-phase cold plates can effectively avoid the above problems. However, in two-phase cold plates, although the mass flow rate of the working fluid flowing through the cold plate remains unchanged before and after the phase change, the flow rate of the working fluid after the phase change is much higher than before the phase change, which still significantly increases the pressure drop inside the cold plate. Summary of the Invention

[0004] Therefore, it is necessary to provide a two-phase cold plate and electronic device that can significantly reduce internal pressure drop in order to address the above problems.

[0005] The technical solution is as follows:

[0006] In a first aspect, this application provides a two-phase cold plate, comprising an upper cover layer, a flow distribution layer, and a substrate layer stacked sequentially. The upper cover layer has an inlet and an outlet. A flow distribution channel and a flow confluence channel are formed between the upper cover layer and the flow distribution layer. The flow distribution channel is connected to the inlet, and the flow confluence channel is connected to the outlet. The substrate layer has an evaporation chamber with an opening facing the flow distribution layer.

[0007] The flow distribution layer has multiple flow distribution holes, which are connected to the flow distribution channel and the evaporation chamber. The flow distribution layer also has a heat exchange channel, which is connected to the convergence channel and the evaporation chamber.

[0008] The technical solution will be further explained below:

[0009] In one embodiment, the flow distribution layer includes a partition layer, a heat exchange layer, and a baffle plate, and the upper cover layer, the partition layer, the heat exchange layer, and the substrate layer are stacked sequentially; the flow distribution channel and the flow convergence channel are formed between the upper cover layer and the partition layer;

[0010] The heat exchange layer forms a heat exchange cavity with openings at both ends. One end of the partition is connected to the partition layer, and the other end extends into the heat exchange cavity and extends towards the substrate layer. The partition is connected to the side wall of the heat exchange cavity to divide the heat exchange cavity into at least two sub-channels. The partition has multiple partition holes that extend through both ends.

[0011] The separator layer is provided with a first channel and a second channel at intervals, the first channel being connected to the confluence channel and the second channel being connected to the diversion channel;

[0012] One end of the sub-channel is connected to at least one of the first channels to form the heat exchange channel; the other end of the sub-channel is connected to the evaporation chamber; one end of the partition hole is connected to the second channel to form the flow divider hole, and the other end is connected to the evaporation chamber.

[0013] In one embodiment, the end of the partition away from the substrate layer passes through the second channel and is flush with the surface of the partition layer facing the upper cover layer.

[0014] In one embodiment, the partition has a connecting protrusion at one end away from the substrate layer. The connecting protrusion is located in the diversion channel and is connected to the upper cover layer.

[0015] In one embodiment, the partition includes a first partition and a second partition, the first partition and the second partition are arranged at an angle, one end of the first partition and one end of the second partition are connected to the partition layer, and the other end of each partition extends into the heat exchange cavity and extends to the substrate layer. At least two flow diversion holes are provided on the first partition and the second partition.

[0016] In one embodiment, the upper cover layer includes an upper cover plate, a surrounding plate, and an annular baffle. The upper cover plate and the partition layer are spaced apart. The surrounding plate and the annular baffle are both connected between the upper cover plate and the partition layer. The surrounding plate is spaced around the outer periphery of the annular baffle to form the confluence channel. The upper cover plate, the annular baffle, and the partition layer together form the diversion channel.

[0017] And / or, a plurality of heat dissipation fins are provided at intervals within the sub-channel, the heat dissipation fins extending along the extension direction of the sub-channel to divide the sub-channel into a plurality of connecting gaps.

[0018] In one embodiment, the bottom of the evaporation chamber is provided with a plurality of heat dissipation protrusions spaced apart.

[0019] In one embodiment, one end of the heat dissipation protrusion facing away from the bottom wall of the evaporation cavity is flush with the opening edge of the evaporation cavity, and at least part of the heat dissipation protrusion is fixedly connected to the flow distribution layer.

[0020] In one embodiment, the two-phase cold plate includes a copper cold plate or an aluminum cold plate.

[0021] Secondly, this application provides an electronic device, including the two-phase cold plate and electronic components as described in any of the above claims, wherein the substrate layer is attached to the heating end of the electronic components.

[0022] In the aforementioned two-phase cold plate and electronic equipment, a distribution channel and a confluence channel are formed between the upper cover layer and the distribution layer. The distribution channel is connected to the evaporation chamber through a distribution hole, and the confluence channel is connected to the evaporation chamber through a heat exchange channel. Furthermore, the distribution channel is connected to the liquid inlet, and the confluence channel is connected to the liquid outlet. Therefore, when the substrate layer of the two-phase cold plate is attached to the heating end of the electronic component, the liquid cooling medium enters the distribution channel from the liquid inlet and then flows into the evaporation chamber through the distribution hole. Inside the evaporation chamber, the working medium absorbs the heat transferred from the electronic component to the substrate layer, transforming into a gaseous or gas-liquid mixture. It then flows into the confluence channel through the heat exchange channel and is finally discharged from the liquid outlet, thus completing the heat dissipation for the electronic component. Since there are multiple flow-diverting holes connecting the flow-diverting channel and the evaporation chamber, the liquid cooling medium is divided into multiple parallel fine streams at the flow-diverting channel and then merged into a single total flow in the evaporation chamber. Thus, with the total flow rate remaining constant, the two-phase cold plate can reduce the internal pressure drop and flow resistance by reducing the hydraulic diameter of each fine stream, thereby effectively reducing the inlet pressure and pumping power and improving the system energy efficiency. In addition, this design can also reduce the inlet and outlet temperature difference and the overall internal saturation temperature at the same time. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of a two-phase cold plate in one embodiment.

[0024] Figure 2 This is a cross-sectional view of the two-phase cold plate in one embodiment.

[0025] Figure 3 This is a partial structural schematic diagram of a two-phase cold plate in one embodiment.

[0026] Figure 4 This is an exploded view of a two-phase cold plate in one embodiment.

[0027] Figure 5 for Figure 4 The diagram shows a magnified view of the structure at point A.

[0028] Figure 6 This is a schematic diagram of the structure of the upper cover layer in one embodiment.

[0029] Figure 7 This is a schematic diagram of a simulated structure of a copper cooling plate in one embodiment.

[0030] Figure 8 This is a schematic diagram of the simulated structure of the aluminum cooling plate in one embodiment.

[0031] Explanation of reference numerals in the attached figures:

[0032] 100. Two-phase cold plate; 1. Top cover layer; 11. Top cover plate; 12. Enclosure plate; 13. Annular baffle; 1a. Liquid inlet; 1b. Liquid outlet; 1c. Diverting channel; 1d. Merging channel; 2. Diverting layer; 21. Separating layer; 21b. First channel; 21a. Second channel; 22. Partition plate; 22a. Separating hole; 221. Connecting protrusion; 222. First partition plate; 223. Second partition plate; 23. Heat exchange layer; 23b. Heat exchange cavity; 23c. Sub-channel; 24. Heat dissipation fins; 2a. Diverting hole; 2b. Heat exchange channel; 3. Substrate layer; 3a. Evaporation cavity; 31. Heat dissipation protrusion. Detailed Implementation

[0033] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0034] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0035] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0036] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0037] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0038] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0039] See Figure 1 to, Figure 2 and Figure 3 An embodiment of this application provides a two-phase cold plate 100, comprising a top cover layer 1, a flow distribution layer 2, and a substrate layer 3 stacked sequentially, wherein:

[0040] The upper cover layer 1 has an inlet 1a and an outlet 1b. The upper cover layer 1 and the distribution layer 2 form a distribution channel 1c and a confluence channel 1d. The distribution channel 1c is connected to the inlet 1a, and the confluence channel 1d is connected to the outlet 1b. The substrate layer 3 has an evaporation chamber 3a with an opening facing the distribution layer 2. The distribution layer 2 has multiple distribution holes 2a, which are connected to the distribution channel 1c and the evaporation chamber 3a. The distribution layer 2 also has a heat exchange channel 2b, which is connected to the confluence channel 1d and the evaporation chamber 3a.

[0041] In the aforementioned two-phase cold plate 100, a flow distribution channel 1c and a flow convergence channel 1d are formed between the upper cover layer 1 and the flow distribution layer 2. The flow distribution channel 1c is connected to the evaporation chamber 3a through the flow distribution hole 2a, and the flow convergence channel 1d is connected to the evaporation chamber 3a through the heat exchange channel 2b. The flow distribution channel 1c is also connected to the liquid inlet 1a, and the flow convergence channel 1d is connected to the liquid outlet 1b. Therefore, when the substrate layer 3 of the two-phase cold plate 100 is attached to the heating end of the electronic component, the liquid cooling medium enters the flow distribution channel 1c from the liquid inlet 1a and then flows into the evaporation chamber 3a through the flow distribution hole 2a. In the evaporation chamber 3a, the working medium absorbs the heat transferred from the electronic component to the substrate layer 3 and transforms into a gaseous or gas-liquid mixture. It then flows into the flow convergence channel 1d through the heat exchange channel 2b and is finally discharged from the liquid outlet 1b, thereby completing the heat dissipation of the electronic component. Since there are multiple diversion holes 2a connecting the diversion channel 1c and the evaporation chamber 3a, the liquid cooling medium is diverted into multiple parallel fine streams at the diversion channel 1c, and then merged into a total flow in the evaporation chamber 3a. Thus, with the total flow rate remaining constant, the two-phase cold plate 100 can reduce the internal pressure drop and flow resistance by reducing the hydraulic diameter of each fine stream, thereby effectively reducing the inlet pressure and pumping power and improving the system energy efficiency. In addition, this design can also reduce the inlet and outlet temperature difference and the overall internal saturation temperature at the same time.

[0042] Schematic, the liquid inlet 1a is located in the middle of the upper cover layer 1, and the liquid outlet 1b is located at the edge of the upper cover layer 1.

[0043] As an illustration, the diversion channel 1c is not directly connected to the confluence channel 1d, and the heat exchange channel 2b is not directly connected to the diversion hole 2a. This helps ensure that the cooling medium flows along the preset path to achieve the corresponding heat dissipation effect.

[0044] Schematic illustration: The number of diversion orifices 2a can be designed according to actual needs, such as ten, twenty, or thirty-two. Furthermore, the cross-sectional shape of the diversion orifices 2a can be designed as needed, such as circular or rectangular. Further, the cross-sectional shape of the diversion orifices 2a is circular, and the diameter of the diversion orifices 2a can be designed as needed, such as 1mm, 2mm, or 3mm. Preferably, the number of diversion orifices 2a is 32, the cross-sectional shape of the diversion orifices 2a is circular, and its diameter is 1.2mm.

[0045] Combination Figure 2 , Figure 3 and Figure 4 As shown, in some embodiments, the flow distribution layer 2 includes a partition layer 21, a heat exchange layer 23, and a partition plate 22. The upper cover layer 1, the partition layer 21, the heat exchange layer 23, and the substrate layer 3 are stacked sequentially. A flow distribution channel 1c and a flow convergence channel 1d are formed between the upper cover layer 1 and the partition layer 21. The heat exchange layer 23 has a heat exchange cavity 23b with openings at both ends. One end of the partition plate 22 is connected to the partition layer 21, and the other end extends into the heat exchange cavity 23b and extends towards the substrate layer 3. The partition plate 22 is connected to the sidewall of the heat exchange cavity 23b to divide the heat exchange cavity 23b into at least two sub-channels 23c. The partition plate 22 has a plurality of partition holes 22a extending through both ends. The partition layer 21 has a first channel 21b and a second channel 21a spaced apart. The first channel 21b connects to the flow convergence channel 1d, and the second channel 21a connects to the flow distribution channel 1c. One end of the sub-channel 23c connects to at least one first channel 21b to form a heat exchange channel 2b. The other end of the sub-channel 23c is connected to the evaporation chamber 3a. One end of the partition hole 22a is connected to the second channel 21a to form a diversion hole 2a, and the other end is connected to the evaporation chamber 3a. Thus, since the partition layer 21 is provided with a first channel 21b that is connected to the confluence channel 1d, the partition plate 22 divides the heat exchange chamber 23b into at least two sub-channels 23c, and one end of the sub-channel 23c is connected to at least one first channel 21b to form a heat exchange channel 2b, and the other end is connected to the evaporation chamber 3a, a plurality of parallel heat exchange channels 2b are formed in the diversion layer 2. This allows the cooling medium to absorb heat in the evaporation chamber 3a and then be diverted during the liquid discharge process through the parallel heat exchange channels 2b. As a result, when the cooling medium flows inside the two-phase cold plate 100, not only can the diversion and pressure reduction during liquid inflow be achieved by means of the parallel design of multiple diversion holes 2a, but the diversion and pressure reduction effect can also be further enhanced by means of the parallel design of multiple heat exchange channels 2b. In addition, since the diversion hole 2a passes through the partition 22, and the partition 22 is located between two adjacent sub-channels 23c, this design helps to ensure the compactness of the structure, thereby enabling the product to be miniaturized.

[0046] In addition, the design of the partition plate 22, which is connected to the partition layer 21 at one end and extends into the heat exchange cavity 23b and towards the substrate layer 3 at the other end, can effectively ensure that each sub-channel 23c is independent of each other, thereby ensuring that the entire two-phase cold plate 100 can achieve the effect of reducing internal pressure drop by means of the design of multiple heat exchange channels 2b connected in parallel.

[0047] Schematic, the flow divider 2a extends along the stacking direction of the upper cover layer 1, the flow divider layer 2, and the substrate layer 3. In this way, when the liquid cooling medium flows into the evaporation chamber 3a through the connecting hole 23a, the cooling medium can diffuse to both sides to the connecting channel to ensure effective heat dissipation.

[0048] Indicatively, the partition layer 21 and the partition plate 22 are sealed together.

[0049] Furthermore, combined Figure 2 , Figure 3 and Figure 4 As shown, in some embodiments, the end of the partition 22 facing away from the substrate layer 3 passes through the second channel 21a and is flush with the surface of the partition layer 21 facing the upper cover layer 1. Thus, the partition layer 21, the partition 22, and the upper cover layer 1 together form a diversion channel 1c, ensuring that the cooling medium in the diversion channel 1c can be diverted to each diversion hole 2a, thereby effectively reducing the internal pressure drop of the two-phase cold plate 100. Furthermore, it effectively ensures that the partition layer 21, the partition 22, and the heat exchange layer 23 can effectively form mutually isolated heat exchange channels 2b.

[0050] Indicatively, the partition 22 and the heat exchange layer 23 can be designed as an integrally formed structure or as separate connected structures.

[0051] Schematic, both sides of the partition 22 are connected to the sidewall of the heat exchange chamber 23b.

[0052] Specifically, in combination Figure 2 and Figure 3 As shown, in some embodiments, the end of the partition 22 facing away from the substrate layer 3 has a connecting protrusion 221. The connecting protrusion 221 is located in the diversion channel 1c and connected to the upper cover layer 1. In this way, the upper cover layer 1 can be supported by the connecting protrusion 221 to ensure the reliability of the overall structure.

[0053] Indicatively, the partition 22 and the connecting protrusion 221 are integrally formed.

[0054] Schematic, there are multiple connecting protrusions 221, which are located between two adjacent diversion holes 2a.

[0055] Furthermore, combined Figure 4As shown, in some embodiments, the partition 22 includes a first partition 222 and a second partition 223, which are arranged at an angle. One end of the first partition 222 and one end of the second partition 223 are connected to the partition layer 21, and the other ends extend into the heat exchange cavity 23b and extend towards the substrate layer 3. At least two diversion holes 2a are provided on both the first partition 222 and the second partition 223. In this way, the heat exchange cavity 23b can be effectively divided into multiple sub-channels 23c by the first partition 222 and the second partition 223, so as to effectively reduce the internal pressure drop of the two-phase cold plate 100.

[0056] Schematic, both sides of the first partition 222 and both sides of the second partition 223 are connected to the sidewall of the heat exchange chamber 23b.

[0057] Schematic, the number of second partitions 223 is at least two, and the at least two second partitions 223 are arranged at intervals along the extending direction of the first partition 22. Further, the number of first partitions 222 is at least two, and the at least two first partitions 222 are arranged along the extending direction of the second partition 22. Further, the first partitions 222 and the second partitions 223 are arranged perpendicularly.

[0058] Combination Figure 3 , Figure 4 and Figure 5 As shown, in some embodiments, multiple heat dissipation fins 24 are spaced apart within the sub-channel 23c. The heat dissipation fins 24 extend along the extension direction of the heat exchange channel 2b to divide the sub-channel 23c into multiple interconnected gaps. Thus, not only can secondary heat exchange be achieved using the heat dissipation fins 24 disposed within the heat exchange channel 2b, but the design of the heat dissipation fins 24 extending along the heat exchange channel 2b also divides the heat exchange channel 2b into multiple parallel interconnected gaps. This allows the cooling medium flowing within the heat exchange channel 2b to be divided into multiple portions, thereby achieving uniform flow and further reducing the pressure drop and flow resistance inside the two-phase cold plate 100.

[0059] Furthermore, combined Figure 2 , Figure 3 and Figure 6As shown, in some embodiments, the upper cover layer 1 includes an upper cover plate 11, a surrounding plate 12, and an annular baffle 13. The upper cover plate 11 and the partition layer 21 are spaced apart. The surrounding plate 12 and the annular baffle 13 are both connected between the upper cover plate 11 and the partition layer 21, and the surrounding plate 12 is spaced around the outer periphery of the annular baffle 13 to form a confluence channel 1d. The upper cover plate 11, the annular baffle 13, and the partition layer 21 together form a diversion channel 1c. In this way, a structure can be constructed in which the diversion channel 1c is located on the inner side and the confluence channel 1d is arranged around the outer periphery of the diversion channel 1c, thereby ensuring that the diversion channel 1c and the confluence channel 1d are not directly connected. Meanwhile, this structural design can also be combined with the scheme of dividing the heat exchange chamber 23b by the partition 22 to form at least two heat exchange channels 2b, ensuring that when liquid is fed in, the inner diversion channel 1c can divert the cooling medium to each diversion hole 2a; when liquid is discharged, the outer confluence channel 1d can converge the cooling medium flowing out of each heat exchange channel 2b, thereby improving the structural reliability of the entire two-phase cold plate 100 and ensuring that the two-phase cold plate 100 can effectively reduce internal pressure drop and flow resistance.

[0060] In illustrative purposes, the shape of the annular baffle 13 can be designed according to actual conditions, such as a circle, rectangle, or irregular shape. Preferably, the shape of the annular baffle 13 is adapted to the shape of the partition 22.

[0061] Combination Figure 2 , Figure 4 and Figure 5 As shown, in some embodiments, a plurality of heat dissipation protrusions 31 are arranged at intervals on the bottom of the evaporation cavity 3a. In this way, the substrate layer 3 can not only reduce the material thickness between itself and electronic components by opening the evaporation cavity 3a, thereby reducing the thermal resistance of the material and improving the heat transfer efficiency; it can also increase the contact surface area between itself and the cooling medium by utilizing the heat dissipation protrusions 31, further improving the heat transfer efficiency.

[0062] Indicatively, the thickness between the bottom of the evaporation chamber 3a and the surface of the substrate layer 3 facing away from the distribution layer 2 can be designed as needed, for example, it can be 0.3mm, 0.4mm, 0.5mm, 0.6mm or 0.7mm, etc.

[0063] Specifically, in combination Figure 2 As shown, in some embodiments, the end of the heat dissipation protrusion 31 facing away from the bottom wall of the evaporation cavity 3a is flush with the opening edge of the evaporation cavity 3a, and at least part of the heat dissipation protrusion 31 is fixedly connected to the distribution layer 2. In this way, the arrangement of the heat dissipation protrusion 31 can not only improve the heat exchange efficiency, but also improve the connection reliability between the substrate layer 3 and the distribution layer 2, thereby improving the structural strength when the evaporation cavity 3a is directly formed on the substrate layer 3.

[0064] Schematic illustration: The shape of the heat dissipation protrusion 31 can be designed according to actual needs. For example, the heat dissipation protrusion 31 can be a cylinder, a frustum, or a polygonal prism. Furthermore, the height of the heat dissipation protrusion 31 can be designed according to actual needs, as long as it ensures that the heat dissipation protrusion 31 does not protrude from the opening of the evaporation cavity 3a. For example, the height of the heat dissipation protrusion 31 can be 0.3mm, 0.4mm, 0.5mm, 0.6mm, or 0.7mm. Preferably, the depth of the evaporation cavity 3a is 0.5mm, and the heat dissipation protrusion 31 is a cylinder with a diameter of 1mm and a height of 0.5mm.

[0065] In some embodiments, the two-phase cold plate 100 includes a copper cooling plate. The two-phase cold plate 100 can utilize the excellent heat transfer properties of copper to achieve rapid heat exchange, thereby improving heat exchange efficiency.

[0066] In other embodiments, the two-phase cold plate 100 comprises an aluminum cooling plate. Thus, the two-phase cold plate 100 can effectively reduce the total weight of the cold plate while maintaining a certain heat exchange efficiency.

[0067] To verify the structural strength of the copper cooling plate, structural mechanics simulation was performed on it in a specific embodiment. Combined with... Figure 2 and Figure 4 As shown, the copper cooling plate has multiple flow-diverting holes 2a and multiple heat exchange channels 2b. Multiple heat dissipation fins 24 are arranged within the heat exchange channels 2b, and multiple heat dissipation protrusions 31 are arranged within the evaporation chamber 3a, with the protrusions 31 connected to the flow-diverting layer 2. Simulation results show that under an internal pressure load of 1 MPa, the maximum deformation of the copper cooling plate is 7 μm, and the maximum deformation of its contact surface with electronic components is 4.8 μm. Figure 7 The aforementioned minute deformation has almost no impact on the heat dissipation performance of the cold plate, meeting the structural strength requirements. Furthermore, when the contact material thickness between the cold plate and electronic components is 0.5 mm, its thermal resistance is reduced by more than 50% compared to a 1 mm thickness design. Under the same conditions, if the two-phase cold plate 100 is an aluminum cooling plate, simulation results show that it also meets the structural strength requirements, such as... Figure 8 As shown, it weighs only one-third of a copper cooling plate.

[0068] Combination Figures 1 to 4 As shown, this application also provides an electronic device, including a two-phase cold plate 100 of any of the above and electronic components, wherein the substrate layer 3 is attached to the heating end of the electronic components.

[0069] In the aforementioned electronic device, due to the flow-dividing channel 1c and the confluence channel 1d formed between the upper cover layer 1 and the flow-dividing layer 2, the flow-dividing channel 1c can be connected to the evaporation chamber 3a through the flow-dividing hole 2a, and the confluence channel 1d can be connected to the evaporation chamber 3a through the heat exchange channel 2b. Furthermore, the flow-dividing channel 1c is connected to the liquid inlet 1a, and the confluence channel 1d is connected to the liquid outlet 1b. Therefore, when the substrate layer 3 of the two-phase cold plate 100 is attached to the heating end of the electronic component, the liquid cooling medium enters the flow-dividing channel 1c from the liquid inlet 1a and then flows into the evaporation chamber 3a through the flow-dividing hole 2a. Inside the evaporation chamber 3a, the working medium absorbs the heat transferred from the electronic component to the substrate layer 3, transforms into a gaseous state or a gas-liquid mixture, and then flows into the confluence channel 1d through the heat exchange channel 2b, finally being discharged from the liquid outlet 1b, thereby completing the heat dissipation for the electronic component. Since there are multiple diversion holes 2a connecting the diversion channel 1c and the evaporation chamber 3a, the liquid cooling medium is diverted into multiple parallel fine streams at the diversion channel 1c, and then merged into a total flow in the evaporation chamber 3a. Thus, with the total flow rate remaining constant, the two-phase cold plate 100 can reduce the internal pressure drop and flow resistance by reducing the hydraulic diameter of each fine stream, thereby effectively reducing the inlet pressure and pumping power and improving the system energy efficiency. In addition, this design can also reduce the inlet and outlet temperature difference and the overall internal saturation temperature at the same time.

[0070] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0071] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A two-phase cold plate, characterized in that, The system includes a top cover layer (1), a flow distribution layer (2), and a substrate layer (3) stacked sequentially. The top cover layer (1) has an inlet (1a) and an outlet (1b). A flow distribution channel (1c) and a flow confluence channel (1d) are formed between the top cover layer (1) and the flow distribution layer (2). The flow distribution channel (1c) is connected to the inlet (1a), and the flow confluence channel (1d) is connected to the outlet (1b). The substrate layer (3) has an evaporation chamber (3a) with an opening facing the flow distribution layer (2). The flow distribution layer (2) is provided with a plurality of flow distribution holes (2a), which are connected to the flow distribution channel (1c) and the evaporation chamber (3a). The flow distribution layer (2) is also provided with a heat exchange channel (2b), which is connected to the confluence channel (1d) and the evaporation chamber (3a).

2. The two-phase cold plate according to claim 1, characterized in that, The diversion layer (2) includes a partition layer (21), a heat exchange layer (23), and a partition plate (22). The upper cover layer (1), the partition layer (21), the heat exchange layer (23), and the substrate layer (3) are stacked in sequence. The diversion channel (1c) and the confluence channel (1d) are formed between the upper cover layer (1) and the partition layer (21). The heat exchange layer (23) forms a heat exchange cavity (23b) with openings at both ends. One end of the partition (22) is connected to the partition layer (21), and the other end extends into the heat exchange cavity (23b) and extends toward the substrate layer (3). The partition (22) is connected to the side wall of the heat exchange cavity (23b) to divide the heat exchange cavity (23b) into at least two sub-channels (23c). The partition (22) has a plurality of partition holes (22a) that extend through both ends. The partition layer (21) is provided with a first channel (21b) and a second channel (21a) spaced apart. The first channel (21b) is connected to the confluence channel (1d), and the second channel (21a) is connected to the branch channel (1c). One end of the sub-channel (23c) is connected to at least one of the first channels (21b) to form the heat exchange channel (2b); the other end of the sub-channel (23c) is connected to the evaporation chamber (3a); one end of the partition hole (22a) is connected to the second channel (21a) to form the diversion hole (2a), and the other end is connected to the evaporation chamber (3a).

3. The two-phase cold plate according to claim 2, characterized in that, The partition (22) is disposed at one end away from the substrate layer (3) through the second channel (21a) and is flush with the surface of the partition layer (21) facing the upper cover layer (1).

4. The two-phase cold plate according to claim 3, characterized in that, The partition (22) has a connecting protrusion (221) at one end away from the substrate layer (3). The connecting protrusion (221) is located in the diversion channel (1c) and is connected to the upper cover layer (1).

5. The two-phase cold plate according to claim 2, characterized in that, The partition (22) includes a first partition (222) and a second partition (223). The first partition (222) and the second partition (223) are arranged at an angle. One end of the first partition (222) and one end of the second partition (223) are connected to the partition layer (21), and the other end of each partition extends into the heat exchange cavity (23b) and extends toward the substrate layer (3). At least two flow diversion holes (2a) are provided on the first partition (222) and the second partition (223).

6. The two-phase cold plate according to claim 2, characterized in that, The upper cover layer (1) includes an upper cover plate (11), a surrounding plate (12) and an annular baffle (13). The upper cover plate (11) and the partition layer (21) are spaced apart. The surrounding plate (12) and the annular baffle (13) are both connected between the upper cover plate (11) and the partition layer (21). The surrounding plate (12) is spaced around the outer periphery of the annular baffle (13) to form the confluence channel (1d). The upper cover plate (11), the annular baffle (13) and the partition layer (21) together form the diversion channel (1c). And / or, a plurality of heat dissipation fins (24) are provided at intervals within the sub-channel (23c), the heat dissipation fins (24) extending along the extension direction of the sub-channel (23c) to divide the sub-channel (23c) into a plurality of connecting gaps.

7. The two-phase cold plate according to any one of claims 1 to 6, characterized in that, The bottom of the evaporation chamber (3a) is provided with a plurality of heat dissipation protrusions (31) spaced apart.

8. The two-phase cold plate according to claim 7, characterized in that, The end of the heat dissipation protrusion (31) facing away from the bottom wall of the evaporation cavity (3a) is flush with the opening edge of the evaporation cavity (3a), and at least part of the heat dissipation protrusion (31) is fixedly connected to the flow distribution layer (2).

9. The two-phase cold plate according to any one of claims 1 to 6, characterized in that, The two-phase cold plate (100) includes a copper cold plate or an aluminum cold plate.

10. An electronic device, characterized in that, Includes the two-phase cold plate (100) as described in any one of claims 1 to 9 and electronic components, wherein the substrate layer (3) is attached to the heating end of the electronic components.

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