A multi-faceted, laminated conductive shielding material
By using multi-layered conductive shielding materials, combined with heat dissipation components and conductive cloth, the problems of weak bonding and insufficient heat dissipation capacity of conductive foam are solved, achieving all-round electromagnetic shielding and active heat dissipation, which is suitable for high-end electronic equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- LONG YOUNG ELECTRONIC (KUNSHAN) CO LTD
- Filing Date
- 2026-05-29
- Publication Date
- 2026-07-31
AI Technical Summary
Existing conductive foams only have a conductive layer on one side of the surface, resulting in weak adhesion and easy detachment. They also have high production costs, their conductivity is easily affected by the external environment, and they lack active heat dissipation capabilities, failing to meet the comprehensive electromagnetic shielding and stable grounding requirements of high-end fields.
The conductive shielding material adopts a multi-faceted composite structure, including a foam substrate, heat dissipation components and multiple layers of conductive cloth, which are fixed with tape to achieve six-sided electromagnetic shielding, and actively dissipate heat using heat dissipation pipes and heat-conducting components.
It achieves all-round electromagnetic shielding, ensuring the stable operation of electronic components, and reduces heat through active heat dissipation to avoid damage caused by heat accumulation. It is suitable for high-end fields such as precision electronics, high-frequency communication and medical electronics.
Smart Images
Figure CN122497060A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of electromagnetic shielding technology, and in particular to a multi-faceted, stacked conductive shielding material. Background Technology
[0002] Currently, conductive foams prepared using conventional processes only have a conductive layer formed on one side of the surface. The bonding force between the conductive layer and the foam substrate is weak, and the coating is prone to peeling off during use. At the same time, the traditional preparation process is complex, the production cost is high, and the conductivity of the product is easily affected by the external environment, resulting in poor working stability.
[0003] In high-end fields such as precision electronics, high-frequency communication, and medical electronics, electromagnetic shielding applications place higher demands on foam, requiring products to have excellent conductivity on multiple sides to achieve all-round electromagnetic shielding and stable grounding. Conventional single-sided conductive foam can no longer meet the needs of such applications. In addition, existing conductive foam does not have active heat dissipation capabilities and relies solely on natural heat dissipation for cooling, which can easily lead to overheating of electronic components and damage to the devices.
[0004] To address the aforementioned problems, this application discloses a multi-faceted, stacked conductive shielding material. Summary of the Invention
[0005] To overcome the shortcomings of existing technologies, this invention discloses a multi-faceted laminated conductive shielding material.
[0006] To achieve the above objectives, the technical solution adopted by the present invention is: a multi-faceted stacked conductive shielding material, comprising:
[0007] A foam substrate, wherein a hollow groove for avoiding electronic devices is provided on one side to the opposite side of the foam substrate;
[0008] A heat dissipation assembly includes heat dissipation pipes and a heat-conducting component. The heat dissipation pipes are inserted inside a hollow groove and extend outward at both ends. A protruding cavity is provided on the side of the heat dissipation pipes facing the electronic device. The heat-conducting component is installed in the protruding cavity and can contact the electronic device.
[0009] The first conductive cloth is wrapped around the foam substrate by the first tape. The first conductive cloth has first grooves on both sides facing the hollow groove and second grooves on both ends facing the heat dissipation pipe.
[0010] The second conductive cloth has a reference surface and two side wrapping surfaces connected to both ends of the reference surface. The reference surface is attached to one side of the first conductive cloth by a second adhesive tape, and the two side wrapping surfaces are respectively attached to the other two sides of the foam substrate by a third adhesive tape.
[0011] More preferably, slots communicating with the hollow groove are respectively opened on the opposite sides of the foam substrate, and stepped grooves are respectively opened on the inside of the hollow groove above the two slots. The heat dissipation pipe is inserted into the two slots, and baffles are integrally provided on the upper ends of the heat dissipation pipe and embedded in the corresponding stepped grooves.
[0012] More preferably, the heat dissipation pipe is made of aluminum alloy, magnesium alloy or titanium alloy.
[0013] More preferably, the heat dissipation pipe has multiple inclined fins inside facing a set direction.
[0014] More preferably, the thermally conductive element is a high thermal conductivity graphite block, which is used for localized contact with the electronic device.
[0015] More preferably, the foam matrix is either polyurethane foam or silicone foam.
[0016] More preferably, the first conductive cloth and the second conductive cloth are respectively plated with one of the following materials: silver, nickel, copper, and carbon.
[0017] More preferably, a fourth tape for mounting conductive foam is provided on the reference surface of the second conductive cloth.
[0018] More preferably, the reference surface of the second conductive cloth is attached to one side of the first conductive cloth having the first groove, the reference surface of the second conductive cloth has a third groove corresponding to the first groove, and the fourth adhesive tape has a fourth groove corresponding to it.
[0019] More preferably, both sides of the second conductive cloth partially wrap the first conductive cloth.
[0020] The present invention achieves the following beneficial effects:
[0021] The conductive shielding material provided in this application achieves all-round electromagnetic shielding by wrapping conductive cloth on six sides. Moreover, the conductive shielding material of this application can simultaneously dissipate heat from electronic components during use, effectively reducing the heat of electronic components and ensuring their stable operation, thus having strong practicality.
[0022] Other features and advantages of the invention will be set forth in the following description and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention can be realized and obtained by means of the structures pointed out in the description and the drawings. Attached Figure Description
[0023] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the disclosure of this invention and, together with the description, serve to explain the principles of this disclosure.
[0024] Figure 1 This is a schematic diagram of the overall structure disclosed in this invention;
[0025] Figure 2 This is a schematic diagram of the heat dissipation component structure disclosed in this invention;
[0026] Figure 3 This is a schematic diagram of the foam substrate with a first conductive cloth attached as disclosed in this invention.
[0027] Figure 4 This is a schematic diagram of the unfolded structure of the first conductive cloth disclosed in this invention;
[0028] Figure 5 This is a schematic diagram of the unfolded structure of the second conductive cloth disclosed in this invention;
[0029] In the diagram: 10, foam substrate; 11, hollow groove; 12, slot; 13, stepped groove; 20, heat dissipation assembly; 21, heat dissipation pipe; 211, baffle; 212, fin; 22, protruding cavity; 23, heat-conducting component; 30, first conductive cloth; 31, first groove; 32, second groove; 40, second conductive cloth; 41, reference surface; 42, side wrapping surface; 43, third groove; 50, fourth tape; 51, fourth groove. Detailed Implementation
[0030] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.
[0031] In the description of this invention, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inner", "around", etc., which indicate orientation or positional relationship, are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this invention.
[0032] Example
[0033] To solve the following technical problems:
[0034] First, in high-end fields such as precision electronics, high-frequency communication, and medical electronics, products need to have excellent conductivity on multiple sides in order to achieve all-round electromagnetic shielding and stable grounding. Conventional single-sided conductive foam can no longer be adapted to such application scenarios.
[0035] Secondly, existing conductive foams do not have active heat dissipation capabilities and rely solely on natural heat dissipation for cooling, which can easily lead to overheating of electronic components and damage to the devices.
[0036] refer to Figures 1-5 As shown, this application discloses a multi-sided stacked conductive shielding material, including a foam substrate 10, a heat dissipation component 20, a first conductive cloth 30, and a second conductive cloth 40. Specifically, it is to form a conductive foam with electromagnetic shielding capability on all six sides. The foam substrate 10 can be selected as polyurethane foam or silicone foam. A hollow groove 11 for avoiding electronic devices is provided on one side to the opposite side of the foam substrate 10.
[0037] The heat dissipation assembly 20 includes a heat dissipation pipe 21 and a heat conduction component 23. The heat dissipation pipe 21 is made of aluminum alloy, magnesium alloy or titanium alloy. In specific implementation, the heat dissipation pipe 21 can also be made of other materials, as long as it meets the requirements of lightweight and good heat dissipation. The heat conduction component 23 is a high thermal conductivity graphite block. The high thermal conductivity graphite block is used to make local contact with the electronic device. Similarly, the heat conduction component 23 can also be made of other materials, as long as it can meet the requirements of rapid heat conduction to the electronic component. The heat dissipation pipe 21 is inserted into the hollow groove 11 and its two ends extend outward. The side of the heat dissipation pipe 21 facing the electronic device is connected to a protruding cavity 22. The heat conduction component 23 is installed in the protruding cavity 22 and can contact the electronic device.
[0038] The first conductive cloth 30 is wrapped around the foam substrate 10 by the first tape (not shown in this application). The first conductive cloth 30 has first grooves 31 on both sides facing the hollow groove 11, and second grooves 32 on both ends facing the heat dissipation pipe 21.
[0039] The second conductive cloth 40 has a reference surface 41 and two side wrapping surfaces 42 connected to both ends of the reference surface 41. The reference surface 41 is attached to one side of the first conductive cloth 30 by a second tape (not shown in this application). The two side wrapping surfaces 42 are respectively attached to the other two sides of the foam substrate 10 by a third tape (not shown in this application). Specifically, the reference surface 41 of the second conductive cloth 40 is attached to one side of the first conductive cloth 30 with a first groove 31. A fourth tape 50 for installing shielding material is provided on the reference surface 41 of the second conductive cloth 40. A third groove 43 is opened on the reference surface 41 of the second conductive cloth 40 corresponding to the first groove 31, and a fourth groove 51 is opened on the fourth tape 50.
[0040] The first conductive cloth 30 and the second conductive cloth 40 are respectively plated with one of the following materials: silver, nickel, copper, and carbon. Of course, those skilled in the art can also use conductive cloths made of other materials, which will not be elaborated on here.
[0041] When installing the multi-sided conductive foam with the above structure, first peel off the release layer on the fourth adhesive tape 50 and place the side with the fourth adhesive tape 50 as the bottom surface facing the carrier. Insert the corresponding electronic components on the carrier into the hollow groove 11 until the fourth adhesive tape 50 is pasted in the corresponding position on the carrier. After installation, the heat-conducting component 23 should be in partial contact with the electronic components. When the electronic components are running, the heat generated will be conducted through the heat-conducting component 23 to the heat dissipation pipe 21 for outward dissipation. Overall, this operation method is relatively simple, time-saving and labor-saving. Furthermore, by wrapping the foam substrate 10 with the first conductive cloth 30 and the second conductive cloth 40 on all six sides, all-round electromagnetic shielding can be achieved, meeting the needs of high-requirement electromagnetic shielding application scenarios. In addition, the cooperation between the heat-conducting component 23 and the heat dissipation pipe 21 enables the electronic components to dissipate heat quickly during operation, preventing damage caused by overheating due to heat accumulation.
[0042] To stably install the heat dissipation pipe 21 within the foam substrate 10, this application provides slots 12 communicating with hollow grooves 11 on opposite sides of the foam substrate 10. Above each slot 12, stepped grooves 13 are formed opposite each other inside the hollow grooves 11. The heat dissipation pipe 21 passes through the two slots 12. Each end of the heat dissipation pipe 21 has an integrally formed baffle 211 embedded in the corresponding stepped groove 13. During assembly, the operator first inserts one end of the heat dissipation pipe 21 into a slot 12 and embeds the corresponding baffle 211 into the corresponding stepped groove 13. Afterward, the operator then... The other end of the tube 21 is inserted into another slot 12 and the corresponding baffle 211 is embedded in the corresponding stepped groove 13 (the foam substrate 10 is elastic, so the heat dissipation tube 21 can be easily inserted into another slot 12 when the other end is installed). The baffle 211 and the stepped groove 13 cooperate to fix it. In addition, it should be noted that the heat dissipation tube 21 of this application can also play a role in stabilizing the foam substrate 10 when installed inside the foam substrate 10. Under the action of external force, it can ensure that the foam substrate 10 will not be deformed, so that the electronic components located in the hollow groove 11 will not be easily damaged.
[0043] In one preferred embodiment, the present application has a plurality of inclined fins 212 inside the heat dissipation pipe 21 facing a set direction. In actual use, the heat transferred by the heat conductor 23 will flow out of the heat dissipation pipe 21 quickly along the plurality of fins 212 when it enters the heat dissipation pipe 21, and the heat dissipation efficiency is greatly improved.
[0044] In one preferred embodiment, the two side wrapping surfaces 42 of the second conductive cloth 40 of this application each partially wrap the first conductive cloth 30. This allows the second conductive cloth 40 to be overlapped and connected with the first conductive cloth 30. Compared with directly attaching the two side wrapping surfaces 42 of the second conductive cloth 40 to both sides of the foam substrate 10, this method is more stable and can ensure the long-term use of the entire structure.
[0045] In the description of this specification, the references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0046] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent transformations or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.
Claims
1. A multi-faceted laminated conductive shielding material, characterized in that, include: A foam substrate, wherein a hollow groove for avoiding electronic devices is provided on one side to the opposite side of the foam substrate; A heat dissipation assembly includes heat dissipation pipes and a heat-conducting component. The heat dissipation pipes are inserted inside a hollow groove and extend outward at both ends. A protruding cavity is provided on the side of the heat dissipation pipes facing the electronic device. The heat-conducting component is installed in the protruding cavity and can contact the electronic device. The first conductive cloth is wrapped around the foam substrate by the first tape. The first conductive cloth has first grooves on both sides facing the hollow groove and second grooves on both ends facing the heat dissipation pipe. The second conductive cloth has a reference surface and two side wrapping surfaces connected to both ends of the reference surface. The reference surface is attached to one side of the first conductive cloth by a second adhesive tape, and the two side wrapping surfaces are respectively attached to the other two sides of the foam substrate by a third adhesive tape.
2. The multi-faceted laminated conductive shielding material according to claim 1, characterized in that, The foam substrate has slots on its opposite sides that communicate with the hollow groove. Above the two slots, stepped grooves are formed opposite each other inside the hollow groove. The heat dissipation pipe is inserted into the two slots. At the top of each end of the heat dissipation pipe, baffles are integrally provided and embedded in the corresponding stepped grooves.
3. The multi-faceted laminated conductive shielding material according to claim 1, characterized in that, The heat dissipation pipes are made of aluminum alloy, magnesium alloy or titanium alloy.
4. The multi-faceted laminated conductive shielding material according to claim 1, characterized in that, The heat dissipation pipe has multiple inclined fins facing a set direction inside.
5. The multi-faceted laminated conductive shielding material according to claim 1, characterized in that, The thermally conductive component is a high thermal conductivity graphite block, which is used for localized contact with electronic devices.
6. The multi-faceted laminated conductive shielding material according to claim 1, characterized in that, The foam matrix is either polyurethane foam or silicone foam.
7. The multi-faceted laminated conductive shielding material according to claim 1, characterized in that, The first conductive cloth and the second conductive cloth are respectively plated with one of the following materials: silver, nickel, copper, and carbon.
8. The multi-faceted laminated conductive shielding material according to claim 1, characterized in that, A fourth tape for installing conductive foam is provided on the reference surface of the second conductive cloth.
9. The multi-faceted laminated conductive shielding material according to claim 1, characterized in that, The reference surface of the second conductive cloth is attached to one side of the first conductive cloth with the first groove, and the reference surface of the second conductive cloth is provided with a third groove corresponding to the first groove, and the fourth tape is provided with a fourth groove.
10. A multi-faceted laminated conductive shielding material according to claim 1, characterized in that, The first conductive cloth is partially wrapped on both sides of the second conductive cloth.