A production process of combining visual assembly PCBA
By modularizing PCBAs through visual assembly technology and utilizing visual recognition and robotic arm positioning, the problem of inflexible existing PCBA production has been solved, enabling efficient modular production and assembly, and improving production efficiency and adaptability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- DONGGUAN HONGCHUANGDA ELECTRONIC TECH CO LTD
- Filing Date
- 2026-05-29
- Publication Date
- 2026-07-31
AI Technical Summary
The current PCBA production process cannot be modularly assembled, resulting in inflexible production, especially in small PCBA products where the functions are unstable and manual assembly is inefficient.
The PCBA is modularized using a vision assembly process. The vision module identifies the module type and posture, and the robot arm positions and places the modules. The modules are then clamped together and welded, and finally covered with a protective layer to form an assembled board.
Modular production of PCBAs has been achieved, which has improved production flexibility and efficiency, is applicable to a variety of products, and reduced the frequency of production line start-ups and shutdowns and module waste.
Smart Images
Figure CN122497064A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of PCBA technology, and in particular to a production process for PCBA assembly that incorporates vision. Background Technology
[0002] PCBA, or Printed Circuit Board, refers to the process and finished product of assembling electronic components on a bare PCB using surface mount technology (SMT) or dual in-line package (DIP) processes. Currently, PCBAs are widely used and are indispensable products in social production.
[0003] For PCBAs, the common approach is currently integrated fabrication, meaning all modules on the PCBA need to be assembled on the PCB. However, in existing industrial production, such as in the PCBAs of electric toothbrushes and fruit and vegetable machines, the main structures are basically the same. Taking an electric toothbrush as an example, it inevitably has a power module and a motor drive module, with additional atomization modules added depending on customer needs.
[0004] However, under the above circumstances, it is still necessary to produce each PCBA individually according to the actual situation, and it is not possible to modularize the PCBA and assemble it according to requirements. Although there are assembled PCBAs in the existing technology, these PCBAs are usually assembled manually after manufacturing, resulting in unstable functions and unsuitability for small PCBAs. Summary of the Invention
[0005] This invention addresses the problems of existing technologies by providing a production process for PCBA that combines vision-based assembly. By modularizing the PCBA and assembling it, the production of PCBA becomes more flexible.
[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: This invention provides a manufacturing process for a vision-based PCBA assembly, comprising the following steps: S100. Obtain product information and select the required PCBA module and corresponding splicing module based on the product information; S200. Use vision to obtain the type of each PCBA module, and then combine it with product information to place each PCBA module in the correct position; S300. Place the corresponding splicing module between adjacent PCBA modules; S400. Control the splicing module to make close contact with the adjacent PCBA, and then fix the connection between the splicing module and the PCBA module to form an assembled board; S500. Cover the bottom of the assembled panel with a protective layer.
[0007] Furthermore, step S200 specifically includes: S210. Obtain images of each PCBA module through the vision module; S220. Analyze each image to obtain the corresponding PCBA module type and orientation; S230. Use a robotic arm to pick up the PCBA module, then move the PCBA module to the corresponding position in the fixture, and adjust the PCBA's orientation relative to the fixture.
[0008] Furthermore, step S220 specifically includes: S221. Obtain the distribution and positioning marks of electronic components on the PCBA module from the image; S222. Determine the type of PCBA module based on the distribution of electronic components; S223. Determine the orientation of the PCBA module based on the positioning marks.
[0009] Furthermore, step S230 specifically includes: S231. Acquire images of the fixture in real time using a camera; S232. Image acquisition of positioning marks on PCBA module in fixture; S233. Adjust the posture of the PCBA module relative to the fixture according to the positioning marks on the PCBA module.
[0010] Furthermore, step S400 specifically includes: S410. The first clamping module clamps the module in the fixture from the X direction, and the second clamping module clamps the module in the fixture from the Y direction, so that each PCBA module and the adjacent splicing module are in close contact. S420. A welding robot is used to weld the electrical connection points between the splicing module and the PCBA module to form an assembly board; S430. Perform an electrical connection test on the assembled plate and determine whether the welding is qualified based on the test results; if so, proceed to step S500; otherwise, perform repair welding on the assembled plate based on the test results.
[0011] Furthermore, step S410 specifically includes: S411. Use a fixture to adhere the bottom of the PCBA module and the splicing module so that the bottom of the PCBA module and the splicing module fully contact the inner bottom wall of the fixture; S412. Use the first clamping module to clamp from both sides of the fixture in the X direction until the gap between the PCBA module and the splicing module in the X direction is less than the preset value. S413. Use the second clamping module to clamp the PCBA module and the splicing module from both sides in the Y direction inward until the gap between them in the Y direction is less than the preset value. S414. Determine whether the clamping force of the first clamping module and the second clamping module is not less than the preset value. If so, proceed to step S420. Otherwise, adjust the clamping force to the preset value before proceeding to step S420.
[0012] Furthermore, the clamping ends of the first clamping module and the second clamping module are respectively provided with airbags, and the sides of the airbags that are used to contact the PCBA module are respectively provided with pressure sensors. In step S414, when the clamping force is less than the preset value, the clamping force of the first clamping module / second clamping module on the PCBA module is adjusted by inflating the airbag.
[0013] Furthermore, step S420 specifically includes: S421. Use a camera to acquire images of the fixture, and obtain the wiring distribution and positioning marks of each PCBA module and splicing module from the images; S422. Determine the connection positions based on the wiring distribution and positioning marks, and then perform soldering on the connection positions.
[0014] Furthermore, step S500 specifically includes: S510. Remove the assembled panel from the fixture and then transfer it to the protective layer; S520. The bottom of the assembled panel is bonded to the protective layer using a hot-pressing method.
[0015] Furthermore, step S500 specifically includes: S510. Invert the assembly board so that the end of the assembly board without electronic components faces upward; S520. A hardening layer is applied to the end of the assembly board that does not have electronic components to increase the strength of the assembly board.
[0016] The beneficial effects of this invention are as follows: This invention divides different PCBAs into several core PCBA modules, and selects the corresponding PCBA modules according to actual needs to assemble them into a modular board for use, thereby making the PCBA manufacturing process modular and improving flexibility. Attached Figure Description
[0017] Figure 1 A flowchart of the present invention.
[0018] Figure 2 This is a schematic diagram illustrating the interaction between the PCBA module and the splicing module of the present invention.
[0019] Figure 3 This is a schematic diagram illustrating the interaction between the PCBA module and the splicing module in another embodiment.
[0020] Figure 4This is a schematic diagram of the first clamping module and the second clamping module of the present invention.
[0021] Reference numerals: 1—First clamping module, 2—Second clamping module, 3—Airbag, 4—Pressure sensor, 5—Circuit trace, A, B, C—PCBA modules, D, E—Assembly modules. Detailed Implementation
[0022] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to embodiments and accompanying drawings. The content mentioned in the embodiments is not intended to limit the present invention. The present invention will be described in detail below with reference to the accompanying drawings.
[0023] like Figures 1 to 4 As shown, the present invention provides a manufacturing process for a vision-based PCBA assembly, comprising the following steps: S100. Obtain product information, and select the required PCBA module and corresponding splicing module according to the product information; specifically, the product information is the PCBA module contained in the product (circuit board) and the location of each PCBA module, and this product information is mainly entered by the staff. S200. Use vision to obtain the type of each PCBA module, and then combine it with product information to place each PCBA module in the correct position; S300. Place the corresponding splicing module between adjacent PCBA modules; S400. Control the splicing module to make close contact with the adjacent PCBA, and then fix the connection between the splicing module and the PCBA module to form an assembled board; S500. Cover the bottom of the assembled panel with a protective layer.
[0024] For example, for a product, the essential PCBA modules include a power supply module and a drive module, while optional PCBA modules include an atomization module and a speed control module; and regardless of whether they are optional, the circuitry of the power supply module and the drive module is the same. In this case, the present invention can divide the PCBA modules into four types: power supply, drive, atomization, and speed control. These four types of circuit board modules are then manufactured separately. Upon receiving production information, based on the requirements in the production information, the necessary PCBA modules and corresponding splicing modules are selected, and then the PCBA modules and splicing modules are arranged in a predetermined positional order and soldered together to form an assembled board.
[0025] It should be noted that the splicing module described in this embodiment only has corresponding wiring, or some standard electronic components (such as resistors) added to the wiring, and does not require other structures. Figure 2 , 3The purpose of this design is primarily to ensure smooth electrical conduction at corresponding connection points between adjacent PCBA modules. In reality, the specific routing and component distribution of the splicing modules need to be configured according to the actual situation, and are not shown here, nor will they affect the understanding of those skilled in the art.
[0026] In this embodiment, the substrate thickness of each PCBA module and splicing module is smaller than that of a typical PCBA. For example, if the thickness of the PCBA itself is X, then the thickness of the PCBA module and splicing module in this invention is 0.3-0.7X. This results in a smaller thickness error between different PCBA modules and splicing modules, making it easier to align the PCBA modules and splicing modules during soldering. After the assembly board is formed, a protective layer is applied to the bottom of the assembly board to enhance its overall strength and to ensure that the different modules form a unified whole, preventing loosening.
[0027] Since different products have different positions and even orientations for the same type of PCBA module, this invention also requires the cooperation of vision. That is, each PCBA module can be transported to the vision module via a conveyor belt. Then, the vision module determines the type of PCBA module by the distribution of electronic components in the PCBA module, thereby determining the type of the PCBA module. Then, a robot is used to move the PCBA module to the position where the PCBA module should be during splicing, thereby realizing the automated completion of the assembly process.
[0028] This invention transforms the traditional "integrated molded PCBA" into a "modular assembled PCBA." For the same type of product, a sufficient number of PCBA modules and splicing modules can be prepared before receiving order requirements. These modules are then assembled according to the order specifications to form the desired product. This significantly improves production efficiency and avoids frequent production line start-ups and shutdowns. Furthermore, when customers require new functionalities, new PCBA modules and splicing modules can be produced based on the existing ones, preventing waste of pre-produced PCBA modules.
[0029] For example, if a low-end version of a product only requires a power supply module, a driver module, and an atomization module, then only these three modules are selected during assembly. However, if a high-end version of the same product requires a power supply module, a driver module, an atomization module, and a speed control module, then all four modules are selected during assembly. Therefore, before setting the production plan, four types of PCBA modules and their corresponding splicing modules can be pre-made. Then, the appropriate PCBA modules and splicing modules can be selected and assembled according to actual production needs.
[0030] Furthermore, when multiple products can share a single PCBA module (e.g., electric toothbrushes, e-cigarettes, and electric shavers can share a single power supply module), this invention can further enhance production flexibility.
[0031] In this embodiment, step S100 specifically includes: Obtain the product's circuit diagram, and then divide the circuit diagram into multiple functional modules according to the preset logic; Save the feature information, attitude information, etc. of each functional module; Select the required PCBA module based on the feature information of the functional module; Select the required splicing modules based on the selected PCBA modules and their locations.
[0032] Generally, users can directly input the segmented PCBA modules, and this invention can then match the required splicing modules based on the PCBA modules. However, for users who directly input circuit diagrams, this invention can perform functional module segmentation based on preset cutting logic. That is, the actual circuit diagram may differ from the connections between the PCBA modules. In this case, the system needs to automatically segment the circuit diagram, dividing it into PCBA modules based on functional modules, arranging them according to the actual connection relationships of each functional module, and then selecting the required splicing modules based on the arrangement results. This allows the invention to automatically complete the entire splicing process, improving efficiency.
[0033] It is important to note that the automatic PCBA module segmentation method of this invention can be achieved through a combination of deep learning and manual training, allowing the system to achieve automatic segmentation after multiple learning iterations. If the system cannot segment a circuit, it can be manually segmented and then stored by the system. Through numerous practical exercises, it is eventually possible to segment almost all circuit diagrams into PCBA modules by the system.
[0034] In this embodiment, step S200 specifically includes: S210. Obtain images of each PCBA module through the vision module; S220. Analyze each image to obtain the corresponding PCBA module type and orientation; S230. Use a robotic arm to pick up the PCBA module, then move the PCBA module to the corresponding position in the fixture, and adjust the PCBA's orientation relative to the fixture.
[0035] This means that PCBA modules contain different functions, and the relative positions of these different PCBA modules may also differ. Therefore, this invention requires a splicing module to facilitate the transition between adjacent PCBA modules. For example... Figure 2As shown, in one embodiment, PCBA module A and PCBA module B are connected via splicing module D; however, as Figure 3 As shown, in another embodiment, PCBA module A and PCBA module C are connected via splicing module E. However, it is clear that their circuit traces 5 are completely different, therefore the required splicing modules must also be different.
[0036] Therefore, identifying the type and orientation of the PCBA module is beneficial for selecting splicing modules and adjusting the orientation of the PCBA module, which refers to whether the PCBA module needs to be rotated horizontally when viewed from above.
[0037] In this embodiment, step S220 specifically includes: S221. Obtain the distribution and positioning marks of electronic components on the PCBA module from the image; S222. Determine the type of PCBA module based on the distribution of electronic components; S223. Determine the orientation of the PCBA module based on the positioning marks.
[0038] Before splicing, this invention requires the use of a vision module to identify the type of the PCBA module. This identification primarily focuses on the location and type of electronic components within the PCBA module. These features are compared with pre-stored features in a database to determine the type of the PCBA module. Furthermore, a positioning mark can be specifically set on the PCBA module during manufacturing; this positioning mark can be a "+" mark located at a corner (see reference). Figure 2 or Figure 3 The current posture of the PCBA module can be determined based on the relative position of the positioning mark and the PCBA module. After the robot picks up the PCBA module and transfers it to the fixture, it can adjust the PCBA module to rotate horizontally at a suitable angle according to the difference between the current posture and the required posture, so that the PCBA module can be placed in the fixture in the required posture.
[0039] Of course, the splicing module also needs to be set with corresponding positioning marks. The vision module uses the wiring path in the splicing module to determine which two PCBA modules it connects to, and the positioning marks can be used to determine how the posture of the splicing module needs to be adjusted. After determination, the robot also moves the splicing module to the fixture for placement.
[0040] When placing PCBA modules and splicing modules, there can be a certain gap between adjacent PCBA modules and splicing modules. For example, when the length of a PCBA module is 10-30cm, the length of the corresponding side of the splicing module is usually 2-6cm. Therefore, the gap between the PCBA module and the splicing module can be 0.5-3cm. This gap allows for placement without being too precise, which helps improve placement efficiency.
[0041] It should be noted that the types of electronic components identified by this invention can be determined by comparing the electronic component images with the images stored in the database. By identifying the types and locations of multiple electronic components and then combining this with the distribution of electronic components in the circuit diagram, the type of the PCBA module can be quickly determined, achieving automated identification and placement.
[0042] In this embodiment, step S230 specifically includes: S231. Acquire images of the fixture in real time using a camera; S232. Obtain the positioning marks on the PCBA module from the image of the fixture; S233. Adjust the posture of the PCBA module relative to the fixture according to the positioning marks on the PCBA module.
[0043] After the PCBA module is transferred to the fixture, the positioning marks on the PCBA module need to be identified again. Using these positioning marks in conjunction with the robot arm, the posture of the PCBA module can be accurately adjusted.
[0044] In this embodiment, step S400 specifically includes: S410. The first clamping module 1 clamps the module in the fixture from the X direction, and the second clamping module 2 clamps the module in the fixture from the Y direction, so that each PCBA module and the adjacent splicing module are in close contact. S420. A welding robot is used to weld the electrical connection points between the splicing module and the PCBA module to form an assembly board; S430. Perform an electrical connection test on the assembled plate and determine whether the welding is qualified based on the test results; if so, proceed to step S500; otherwise, perform repair welding on the assembled plate based on the test results.
[0045] As mentioned above, there is a certain gap between the placed PCBA modules and the splicing modules. Therefore, after all the PCBA modules and splicing modules are placed, the first clamping module 1 and the second clamping module 2 are used to move the PCBA modules and splicing modules in the fixture so that the adjacent modules are in close contact. Only after close contact can the welding robot successfully weld the specific positions of the adjacent modules, thereby enabling the adjacent modules to conduct electricity.
[0046] To ensure a good forming result, the assembled panels need to undergo an electrical connection test after welding. This test primarily checks whether all welding positions are properly powered and whether all modules are functioning correctly and without damage. If any panel fails the test, the welding robot will perform a re-weld at the corresponding location. If the re-weld still fails, it indicates a damaged module on the assembled panel, and the panel is discarded. For panels that pass the test, a protective layer is applied to thicken the panel and strengthen the connections between the modules.
[0047] To improve efficiency, steps S420 and S430 can be performed by a robot, meaning that the welding robot has both a welding device and a testing device. For example, a welding robot has two hands, one with a welding device and the other with a testing device.
[0048] In this embodiment, step S410 specifically includes: S411. Use a fixture to adhere the bottom of the PCBA module and the splicing module so that the bottom of the PCBA module and the splicing module fully contact the inner bottom wall of the fixture; S412. Using the first clamping module 1, clamp the PCBA module and the splicing module from both sides in the X direction inward until the gap in the X direction is less than the preset value. S413. Use the second clamping module 2 to clamp the PCBA module and the splicing module from both sides in the Y direction inward until the gap in the Y direction is less than the preset value. S414. Determine whether the clamping force of the first clamping module 1 and the second clamping module 2 is not less than the preset value. If so, proceed to step S420. Otherwise, adjust the clamping force to the preset value before proceeding to step S420.
[0049] Because the substrates of both the PCBA module and the splicing module are relatively thin, they may warp. This invention addresses this by using negative pressure to adsorb the PCBA module and splicing module through holes in the bottom wall of the fixture before splicing, ensuring they are placed flat on the fixture. Then, after the negative pressure adsorption stops, the modules are clamped to ensure tight contact. This tight contact is determined not only by visual inspection but also by pressure.
[0050] Visual inspection may reveal the following situation: the PCBA module and the splicing module are just touching, which visually indicates they are in contact. However, due to insufficient tightness, they may loosen during the soldering process, affecting the soldering effect. Therefore, this invention combines visual inspection with pressure sensing to ensure a tight contact between the PCBA module and the splicing module, resulting in better subsequent soldering.
[0051] During clamping, in order to avoid misalignment of the thinner PCBA module and splicing module due to force, the moving speed of the first clamping module 1 and the second clamping module 2 is relatively low. Generally speaking, the optimal moving speed is 10-20cm / s.
[0052] Specifically, the clamping ends of the first clamping module 1 and the second clamping module 2 are respectively provided with airbags 3, and the sides of the airbags 3 that are used to contact the PCBA module are respectively provided with pressure sensors 4. In step S414, when the clamping force is less than the preset value, the clamping force of the first clamping module 1 / second clamping module 2 on the PCBA module is adjusted by inflating the airbag 3.
[0053] Taking the first clamping module 1 as an example, the clamping action consists of two steps: First, a servo motor drives the clamping end to move until all PCBA modules are in contact with adjacent splicing modules from a visual perspective; then, based on the feedback value from the pressure sensor 4 of the airbag 3 at the clamping end, the airbag 3 is inflated to fine-tune the clamping force, thereby achieving a tight contact between the PCBA modules and the splicing modules. The inflation of the airbag 3 allows for more precise pressure adjustment, and the presence of the airbag 3 also effectively prevents damage to the PCBA modules.
[0054] It should be noted that this embodiment mainly describes the manufacturing process of rectangular PCBAs. In reality, for ease of installation, many PCBAs are irregularly shaped. In such cases, the present invention more preferably employs the method of cutting the PCBA into the required shape after it has been manufactured, rather than directly splicing irregularly shaped PCBA modules.
[0055] In this embodiment, step S420 specifically includes: S421. Use a camera to acquire images of the fixture, and obtain the wiring distribution and positioning marks of each PCBA module and splicing module from the images; S422. Determine the connection positions based on the wiring distribution and positioning marks, and then perform soldering on the connection positions.
[0056] At the fixture, visual inspection is used to determine the routing of each PCBA module and splicing module. Locations requiring soldering should be connected after close contact, with clear paths on the substrate. In addition to identifying connection locations, the image also shows the width of these connections, allowing for adjustments to soldering time, pressure, and other parameters to ensure the solder joints are neither too thick nor too thin.
[0057] Specifically, step S500, which involves setting the protective layer, typically employs one of the following two methods: I. The hot pressing method is adopted, specifically as follows: S510. Remove the assembled panel from the fixture and then transfer it to the protective layer; S520. The bottom of the assembled panel is bonded to the protective layer using a hot-pressing method.
[0058] II. The coating method is adopted, specifically as follows: S510. Invert the assembly board so that the end of the assembly board without electronic components faces upward; S520. A hardening layer is applied to the end of the assembly board that does not have electronic components to increase the strength of the assembly board.
[0059] In Method 1, the protective layer is essentially a substrate. This substrate is laminated to the substrate of the assembly board and then hot-pressed together to bond the two substrates into a single unit, thus achieving the desired protective layer effect. In this method, the protective layer can first be placed in another fixture, then the assembly board can be transferred to that fixture, and finally, the fixture can be fed into a hot-pressing device for hot-pressing molding.
[0060] In method two, a hardening layer is directly coated and formed on the bottom of the assembly plate. This hardening layer strengthens the substrate thickness and strength of the assembly plate, achieving the same protective effect. In this method, the assembly plate needs to be inverted. Preferably, another jig is placed over the assembly jig, and then both jigs are inverted. Finally, the assembly jig is removed, allowing the assembly plate to be inverted without affecting the welding position.
[0061] In practical applications, method one is preferred because it does not involve inverting the assembly. It only requires a robot to pick up the assembly panel and then move it. Multi-point negative pressure adsorption can be used to pick up the panel to ensure its stability.
[0062] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some changes or modifications to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes, and modifications made to the above embodiments based on the present invention without departing from the scope of the present invention are within the scope of the present invention.
Claims
1. A manufacturing process for PCBA assembly combined with vision, characterized in that, Includes the following steps: S100. Obtain product information and select the required PCBA module and corresponding splicing module based on the product information; S200. Use vision to obtain the type of each PCBA module, and then combine it with product information to place each PCBA module in the correct position; S300. Place the corresponding splicing module between adjacent PCBA modules; S400. Control the splicing module to make close contact with the adjacent PCBA, and then fix the connection between the splicing module and the PCBA module to form an assembled board; S500. Cover the bottom of the assembled panel with a protective layer; Step S200 specifically includes: S210. Obtain images of each PCBA module through the vision module; S220. Analyze each image to obtain the corresponding PCBA module type and orientation; S230. Use a robotic arm to pick up the PCBA module, then move the PCBA module to the corresponding position in the fixture, and adjust the PCBA's orientation relative to the fixture.
2. The production process of combining vision-based PCBA according to claim 1, characterized in that, Step S220 specifically includes: S221. Obtain the distribution and positioning marks of electronic components on the PCBA module from the image; S222. Determine the type of PCBA module based on the distribution of electronic components; S223. Determine the orientation of the PCBA module based on the positioning marks.
3. The production process of combining vision-based PCBA according to claim 2, characterized in that, Step S230 specifically includes: S231. Acquire images of the fixture in real time using a camera; S232. Image acquisition of positioning marks on PCBA module in fixture; S233. Adjust the posture of the PCBA module relative to the fixture according to the positioning marks on the PCBA module.
4. The production process of combining vision-based PCBA according to claim 1, characterized in that, Step S400 specifically includes: S410. The first clamping module clamps the module in the fixture from the X direction, and the second clamping module clamps the module in the fixture from the Y direction, so that each PCBA module and the adjacent splicing module are in close contact. S420. A welding robot is used to weld the electrical connection points between the splicing module and the PCBA module to form an assembly board; S430. Perform an electrical connection test on the assembled plate and determine whether the welding is qualified based on the test results; if so, proceed to step S500; otherwise, perform repair welding on the assembled plate based on the test results.
5. The production process of combining vision-based PCBA according to claim 4, characterized in that, Step S410 specifically includes: S411. Use a fixture to adhere the bottom of the PCBA module and the splicing module so that the bottom of the PCBA module and the splicing module fully contact the inner bottom wall of the fixture; S412. Use the first clamping module to clamp from both sides of the fixture in the X direction until the gap between the PCBA module and the splicing module in the X direction is less than the preset value. S413. Use the second clamping module to clamp the PCBA module and the splicing module from both sides in the Y direction inward until the gap between them in the Y direction is less than the preset value. S414. Determine whether the clamping force of the first clamping module and the second clamping module is not less than the preset value. If so, proceed to step S420. Otherwise, adjust the clamping force to the preset value before proceeding to step S420.
6. The production process of combining vision-based PCBA according to claim 5, characterized in that, The clamping ends of the first clamping module and the second clamping module are respectively provided with airbags, and the sides of the airbags that are used to contact the PCBA module are respectively provided with pressure sensors. In step S414, when the clamping force is less than the preset value, the clamping force of the first clamping module / second clamping module on the PCBA module is adjusted by inflating the airbag.
7. The production process of combining vision-based PCBA according to claim 5, characterized in that, Step S420 specifically includes: S421. Use a camera to acquire images of the fixture, and obtain the wiring distribution and positioning marks of each PCBA module and splicing module from the images; S422. Determine the connection positions based on the wiring distribution and positioning marks, and then perform soldering on the connection positions.
8. The production process of combining vision-based PCBA according to claim 1, characterized in that, Step S500 specifically includes: S510. Remove the assembled panel from the fixture and then transfer it to the protective layer; S520. The bottom of the assembled panel is bonded to the protective layer using a hot-pressing method.
9. The production process of combining vision-based PCBA according to claim 1, characterized in that, Step S500 specifically includes: S510. Invert the assembly board so that the end of the assembly board without electronic components faces upward; S520. A hardening layer is applied to the end of the assembly board that does not have electronic components to increase the strength of the assembly board.