A hybrid transfer head, a mass transfer device and a transfer method

Abstract

This invention relates to a mixing and transfer head, a mass transfer device, and a transfer method. The mixing and transfer head is used for picking up and mixing multi-color LED chips. The LED chips to be mixed have N color types. The head includes a support shaft and a transfer array mounted on the support shaft. The transfer array includes at least N transfer surfaces arranged in a ring around the axis of the support shaft. Each transfer surface includes multiple transfer cut surfaces stacked along the axial direction of the support shaft. These transfer cut surfaces are used to pick up single-color LED chips. The transfer cut surfaces can be angularly displaced relative to the axis of the support shaft to adjust the spatial arrangement of the single-color LED chips on the transfer cut surfaces, forming a mixed arrangement of multi-color LED chips on the transfer surfaces. This invention provides a mixing and transfer head that enables efficient mixing of multi-color LED chips, thereby improving chip transfer efficiency.

Description

Technical Field

[0001] This invention relates to the field of chip transfer technology, and more specifically, to a hybrid transfer head, a mass transfer device, and a transfer method. Background Technology

[0002] In micro-display and solid-state lighting manufacturing technologies, it is necessary to transfer a large number of multi-color LED chips (such as RGB tri-color LED chips) from a carrier substrate to a target substrate. High-precision and high-efficiency integration of multi-color LED chips is a core process for manufacturing full-color Mini / Micro LED displays or high color rendering index lighting modules. Existing technologies mostly employ planar transfer head technology or robotic arm serial pickup technology. Planar transfer heads use a single-layer planar array nozzle for chip pickup and placement. Different color chips need to be transferred step-by-step, resulting in low integration efficiency and large accumulated errors from multiple alignments, limiting yield. Robotic arm serial pickup technology uses a multi-axis robotic arm to pick up different color chips one by one for assembly. While offering high flexibility, the operation speed is slow, making it difficult to meet the demands of large-scale mass production. Vibration and positioning deviations caused by frequent movement further affect the chip position accuracy. Summary of the Invention

[0003] To address the aforementioned problems, the present invention aims to provide a mixing and transfer head, a mass transfer device, and a transfer method that can achieve efficient mixing and transfer of multi-color LED chips, thereby improving the efficiency of chip transfer.

[0004] The objective of this invention is achieved through the following technical solution: A mixing and transfer head is used for picking up and mixing multi-color LED chips. The LED chips to be mixed have N color types. The head includes a support shaft and a transfer array sleeved on the support shaft. The transfer array includes at least N transfer surfaces arranged in a ring around the axis of the support shaft. Each transfer surface includes multiple transfer cut surfaces stacked along the axial direction of the support shaft. The transfer cut surfaces are used to pick up single-color LED chips. The transfer cut surfaces can be angularly displaced around the axis of the support shaft to adjust the spatial arrangement of the single-color LED chips on the transfer cut surfaces, forming a mixed arrangement of multi-color LED chips on the transfer surfaces.

[0005] In this solution, the hybrid transfer head, through its innovative design of a ring-shaped three-dimensional array and rotatable stacked facets, significantly overcomes the spatial bottlenecks and efficiency shortcomings of traditional planar transfer solutions. It balances hybrid flexibility, transfer accuracy, and mass production yield adaptability, meeting the industrial demands for mass transfer of multi-color Mini / Micro LED chips. The hybrid transfer head constructs a three-dimensional transfer architecture around the support axis. By adjusting the circumferential angular displacement of the transfer facets, it achieves dynamic spatial reconstruction of the monochrome LED chips, solving the problem that traditional planar transfer heads cannot flexibly adapt to complex multi-color hybrid layouts. Simultaneously, it combines the picking and hybridization of multiple monochrome chips into a single operation, reducing the cumulative alignment errors and chip damage risks caused by traditional step-by-step transfer, while improving chip transfer efficiency.

[0006] Furthermore, the transfer array includes a plurality of transfer members stacked along the axial direction of the support shaft. Each transfer member includes a transfer block and a transfer ring connected to the transfer block and coaxially sleeved on the support shaft. The end face of the transfer block facing away from the transfer ring constitutes the transfer cross-section.

[0007] In this solution, the transfer block and transfer ring can be designed as an integral unit or as separate units. The end face of the transfer block serves as the transfer surface that directly contacts the chip, and is used to directly adsorb monochrome LED chips. The gripping stability can be enhanced through surface microstructure design, such as contoured grooves or electrostatic adsorption coatings.

[0008] Furthermore, The transfer components include N types of transfer components that are alternately distributed at intervals along the axial direction of the support shaft. The transfer array also includes N connecting rods. The N connecting rods are parallel to the axis of the support shaft and are arranged circumferentially around the support shaft. Each type of transfer component is fixedly disposed in one of the N connecting rods.

[0009] In this solution, N types of transfer components, distributed alternately, are mechanically linked through different connecting rods. Each transfer component can be independently controlled for angular or linear displacement, while synchronous action is achieved through the rigid transmission of the connecting rods. The N types of transfer components process LED chips of different colors, and the synchronous drive of the connecting rods enables the simultaneous pickup and mixing of multi-color chips.

[0010] Furthermore, the transfer array also includes N support rings coaxially sleeved on the outer periphery of the support shaft, at least N-1 of the support rings being rotatable around the support shaft, and each of the connecting rods being connected to one of the support rings respectively.

[0011] In this design, each support ring can rotate independently, which can drive the transfer component mounted on the connecting rod to adjust its position. Each support ring can independently control its angular displacement, and the synchronous action is achieved through the rigid transmission of the connecting rod.

[0012] Furthermore, the transfer array also includes support rings coaxially sleeved on the outer periphery of the support shaft and corresponding one-to-one with the transfer members. At most one of the support rings is fixed on the support shaft, and the remaining support rings can rotate around the support shaft. The transfer rings are connected one-to-one to the support rings.

[0013] In this design, a rotatable support ring directly drives the independent angular displacement of the transfer components, flexibly adjusting the spatial arrangement of each layer of chips. Each transfer component can independently adjust its circumferential angular displacement, enabling multi-color mixed arrangement of LED chips in a ring-shaped space, eliminating the need for multiple step-by-step transfers and significantly reducing cumulative errors.

[0014] Furthermore, the transfer section is a plane.

[0015] In this solution, the planar cross-section has a large contact area with the chip, ensuring stable chip adsorption, high compatibility, and suitability for imprint transfer.

[0016] Furthermore, the transfer tangent is an arc surface.

[0017] In this solution, the transfer surface is designed as an arc surface, which enables roller printing transfer.

[0018] Based on the same technical concept, a mass transfer device is designed, including at least one of the above-mentioned hybrid transfer heads.

[0019] Based on the same technical concept, a mass transfer method is designed and applied to the aforementioned mass transfer device. The method is applied to the transfer of three-color LED chips and includes: providing three sets of monochrome LED chip carrier substrates, with multiple red, green, and blue LED chips arrayed on one side of each of the three sets of carrier substrates; aligning the transfer surface of the mixed-lay transfer head with the three sets of carrier substrates, and aligning each transfer facet with a monochrome LED chip on the carrier substrate; controlling the transfer facet to pick up a monochrome LED chip from the carrier substrate; controlling the transfer facet to rotate relative to the axis of the support shaft, adjusting the spatial arrangement of the monochrome LED chips on the transfer facet to form a mixed-lay arrangement of three-color LED chips on the transfer facet; providing a target substrate, and placing the mixed-lay multiple transfer facestably against corresponding target substrates, or placing the mixed-lay multiple transfer facestably against multiple corresponding positions on a single target substrate, transferring the mixed-lay LED chips to the target substrate.

[0020] Furthermore, the method of forming the three-color LED chips by mixing and arranging them on the transfer surface also includes: Before controlling the transfer surfaces to rotate relative to each other about the axis of the support shaft, the spacing between the transfer surfaces is increased; after controlling the transfer surfaces to rotate relative to each other about the axis of the support shaft, the spacing between the transfer surfaces is decreased.

[0021] Compared with the prior art, the beneficial effects of the present invention are: In this solution, the hybrid transfer head, through its innovative design of a ring-shaped three-dimensional array and rotatable stacked facets, significantly overcomes the spatial bottlenecks and efficiency shortcomings of traditional planar transfer solutions. It balances hybrid flexibility, transfer accuracy, and mass production yield adaptability, meeting the industrial demands for mass transfer of multi-color Mini / Micro LED chips. The hybrid transfer head constructs a three-dimensional transfer architecture around the support axis. By adjusting the circumferential angular displacement of the transfer facets, it achieves dynamic spatial reconstruction of the monochrome LED chips, solving the problem that traditional planar transfer heads cannot flexibly adapt to complex multi-color hybrid layouts. Simultaneously, it combines the picking and hybridization of multiple monochrome chips into a single operation, reducing the cumulative alignment errors and chip damage risks caused by traditional step-by-step transfer, while improving chip transfer efficiency. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of the first carrier substrate according to an embodiment of the present invention.

[0023] Figure 2 This is a schematic diagram of the transfer head picking up a red LED chip from a first carrier substrate, according to an embodiment of the present invention.

[0024] Figure 3 This is a schematic diagram of attaching a red LED chip to the target substrate in an embodiment of the present invention.

[0025] Figure 4 This is a schematic diagram of the structure of the second carrier substrate according to an embodiment of the present invention.

[0026] Figure 5 This is a schematic diagram of the transfer head picking up a green LED chip from a second carrier substrate, according to an embodiment of the present invention.

[0027] Figure 6 A schematic diagram showing the attachment of red LED chips and green LED chips to the target substrate in an embodiment of the present invention.

[0028] Figure 7 This is a schematic diagram of the structure of the third carrier substrate according to an embodiment of the present invention.

[0029] Figure 8 This is a schematic diagram of the transfer head picking up a blue LED chip from a third carrier substrate, according to an embodiment of the present invention.

[0030] Figure 9 This is a schematic diagram showing the attachment of red LED chips, green LED chips, and blue LED chips to the target substrate of an embodiment of the present invention.

[0031] Figure 10 This is a schematic diagram of the hybrid transfer head according to an embodiment of the present invention.

[0032] Figure 11 This is a schematic diagram of the structure of a transfer array (the transfer surface picks up monochrome LED chips without mixing multicolor LED chips) according to an embodiment of the present invention.

[0033] Figure 12 This is a schematic diagram of the transfer array (after multi-color LED chips are mixed and arranged) according to an embodiment of the present invention.

[0034] Figure 13 This is a schematic diagram of the transfer component according to an embodiment of the present invention.

[0035] Figure 14 This is a schematic diagram of the connection between the support shaft and the support ring according to an embodiment of the present invention.

[0036] Figure 15 This is a schematic diagram of the transfer array (after adjusting the spacing of the transfer elements) according to an embodiment of the present invention.

[0037] Figure 16 This is a flowchart of the mass transfer method described in an embodiment of the present invention.

[0038] Figure 17 This is a flowchart of the mass transfer method described in an embodiment of the present invention.

[0039] Explanation of icon numbers: 1. Mixed transfer head; 11. Support shaft; 12. Transfer array; 121. Transfer surface; 122. Transfer component; 122a. First transfer component; 122b. Second transfer component; 122c. Third transfer component; 1221. Transfer block; 1222. Transfer ring; 1223. Transfer cross-section; 123. Connecting rod; 124. Support ring. 2. Transfer head; 3. First carrier substrate; 31. Red LED chip; 4. Second carrier substrate; 41. Green LED chip; 5. Third carrier substrate; 51. Blue LED chip; 6. Target substrate. Detailed Implementation

[0040] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein.

[0041] Example 1

[0042] In traditional LED chip transfer technology, such as Figures 1 to 3 As shown, a first carrier substrate 3 is provided, and multiple red LED chips 31 arranged in an array on the first carrier substrate 3 are selectively transferred to a preset position on the target substrate 6 by a transfer head 2, resulting in... Figure 3 The target substrate 6 is shown.

[0043] like Figures 4 to 6 As shown, similarly, a second carrier substrate 4 is provided, and multiple green LED chips 41 arranged in an array on the second carrier substrate 4 are selectively transferred to a preset position on the target substrate 6 by the transfer head 2, resulting in the following... Figure 6 The target substrate 6 is shown.

[0044] like Figures 7 to 9 As shown, similarly, a third carrier substrate 5 is provided, and multiple blue LED chips 51 arranged in an array on the third carrier substrate 5 are selectively transferred to a preset position on the target substrate 6 by the transfer head 2, resulting in the following... Figure 9 The target substrate 6 is shown.

[0045] On the target substrate 6, a blue LED chip 51 is adjacent to a green LED chip 41, and a green LED chip 41 is located between a red LED chip 31 and a blue LED chip 51.

[0046] As can be seen from the above, the red LED chip 31, green LED chip 41 and blue LED chip 51 need to be transferred three times by the transfer head 2 to achieve the mixed array of the red LED chip 31, green LED chip 41 and blue LED chip 51 on the target substrate 6. The transfer efficiency is low, which affects the production cycle and reduces the production efficiency.

[0047] To solve the above technical problems, such as Figure 10 As shown, this application embodiment provides a mixing transfer head 1 for picking up and mixing multi-color LED chips. The LED chips to be mixed have N color types. The mixing transfer head 1 includes a support shaft 11 and a transfer array 12 sleeved on the support shaft 11. The transfer array 12 includes at least N transfer surfaces 121 arranged in a ring array with the axis of the support shaft 11 as the center. The transfer surfaces 121 include a plurality of transfer cut surfaces 1223 stacked along the axial direction of the support shaft 11. The transfer cut surfaces 1223 are used to pick up single-color LED chips. The single-color LED chips are arranged in a linear interval on the transfer cut surfaces 1223. The transfer cut surfaces 1223 can be angularly displaced around the axis of the support shaft 11 to adjust the spatial arrangement of the single-color LED chips on the transfer cut surfaces 1223, forming a mixed arrangement of multi-color LED chips on the transfer surfaces 121.

[0048] It should be noted that the multi-color LED chips in this embodiment refer to red LED chip 31, green LED chip 41, and blue LED chip 51, that is, N is 3. The mixing and transfer head 1 is used for picking up and mixing the red LED chip 31, green LED chip 41, and blue LED chip 51. Therefore, in this embodiment, at least 3M transfer surfaces are provided, and the included angle between the centers of two adjacent transfer surfaces 121 is 60 / M degrees. M is a positive integer, that is, the number of transfer surfaces can be 3, 6, etc. In this embodiment, the structure of the mixing and transfer head 1 is described in detail using 3 transfer surfaces 121 as an example, wherein the included angle between the centers of two adjacent transfer surfaces 121 in the 3 transfer surfaces 121 is 60 degrees.

[0049] In other possible embodiments, the mixing and transfer head 1 is used for picking up and mixing any two of the red LED chip 31, green LED chip 41, and blue LED chip 51. Of course, the multi-color LED chips are not limited to red LED chip 31, green LED chip 41, and blue LED chip 51; other colored LED chips, such as white LED chips and yellow LED chips, can also be used, and the mixing and transfer head 1 in this embodiment can be applied to all of them.

[0050] In addition, in this embodiment, a transfer array 12 is provided on the support shaft. In other embodiments, multiple transfer arrays 12 can be provided along the axial direction of the support shaft 11. Multiple transfer arrays 12 can simultaneously pick up and mix multi-color LED chips to further improve transfer efficiency.

[0051] During the pickup and mixing of red LED chips 31, green LED chips 41, and blue LED chips 51, the three transfer surfaces 121 of the mixing transfer head 1 are sequentially aligned with the three sets of carrier substrates carrying the red LED chips 31, green LED chips 41, and blue LED chips 51, namely the first carrier substrate 3, the second carrier substrate 4, and the third carrier substrate 5, with each transfer facet 1223 aligned with the monochromatic LED chip on the carrier substrate. The transfer surface 121 is controlled to approach and contact the carrier substrate to pick up the LED chip from the carrier substrate. Figure 11 As shown, the three transfer surfaces 121 respectively pick up the red LED chip 31, the green LED chip 41, and the blue LED chip 51. Figure 11 In the diagram, red indicates red LED chip 31, and green indicates green LED chip 41. Then, the transfer surface 1223 is controlled to rotate relative to the axis of the support shaft 11, adjusting the spatial arrangement of the single-color LED chips on the transfer surface 1223 to form a mixed arrangement of three-color LED chips on the transfer surface 121, as shown in the diagram. Figure 12 As shown.

[0052] like Figure 10 and Figure 13 As shown, the transfer array 12 includes multiple transfer components 122 stacked along the axial direction of the support shaft 11. The number of transfer components 122 is set according to actual needs. Each transfer component 122 includes a transfer block 1221 and a transfer ring 1222 connected to the transfer block 1221 and coaxially sleeved on the support shaft 11. The end face of the transfer block 1221 facing away from the transfer ring 1222 forms a transfer cut surface 1223. In this embodiment, three transfer blocks 1221 are provided on one transfer ring 1222. The transfer blocks 1221 and the transfer ring 1222 can be designed as an integral part or separately. The end face of the transfer block 1221 serves as the transfer cut surface 1223 that directly contacts the LED chip, used to directly adsorb the monochrome LED chip. The gripping stability can be enhanced through surface microstructure design, such as contoured grooves, electrostatic adsorption coatings, or phase change material coatings.

[0053] When using contoured grooves, micro-grooves, such as rectangular or circular recesses, that match the shape of the LED chip are engraved on the transfer facet 1223. When the LED chip is placed on it, the edge of the groove and the outline of the LED chip form a mechanical interlock, increasing the contact area and dispersing local stress. At the same time, vacuum micropores can be designed inside the groove, and adsorption is assisted by an external negative pressure system, forming a dual adsorption mechanism of mechanical and gas pressure.

[0054] When using an electrostatic adsorption coating, a dielectric material, such as polyimide or zinc oxide, is coated on the transfer section 1223 surface, integrating microcircuit electrodes. When a low-voltage DC current (typically 1-10V) is applied, the coating generates an electrostatic field, inducing charge polarization on the LED chip surface, thereby forming an electrostatic adsorption force (Coulomb force). After the power is turned off, the adsorption force disappears, achieving lossless release of the LED chip.

[0055] When using a phase change material coating, a thermosensitive polymer coating, such as a paraffin-based or polymer gel, is applied to the transfer section 1223 surface. This coating is solid at room temperature, providing weak adhesion. Heating softens or liquefies the coating, increasing its viscosity and filling the micro-gaps on the LED chip surface, forming a temporary bond. Cooling solidifies the material, increasing its adhesion; reheating releases the LED chip.

[0056] It should be noted that the width of the transfer section 1223 is designed according to the LED chip size, the number of LED chips to be picked up, and the LED chip array arrangement. Its width is greater than or equal to the width or length of the LED chip, and its length is greater than the total length of all LED chips after being arranged in the preset array arrangement.

[0057] In addition, a lubricant is provided between the micro gaps between adjacent transfer members 122, that is, a lubricant is coated on the opposing surfaces of adjacent transfer members 122 to reduce the friction between them, so that the transfer members 122 can rotate smoothly relative to each other without adjusting the distance between them.

[0058] It should be noted that the transfer surface 1223 can be set as a plane. A planar surface has a large contact area with the LED chip, resulting in stable LED chip adsorption, high compatibility, and suitability for imprint transfer, i.e., direct press-type pickup. In another embodiment, the transfer surface 1223 can be set as an arc surface. Designing the transfer surface 1223 as an arc surface enables roller printing transfer, i.e., rolling contact pickup. Imprint transfer and roller printing transfer technologies can be implemented using existing technologies, and will not be elaborated further here.

[0059] Furthermore, the multiple transfer components 122 are divided into N types according to the required mixed LED chip types, and the N types of transfer components 122 are distributed alternately at intervals along the axial direction of the support shaft 11. The transfer array 12 also includes N connecting rods 123, which are parallel to the axis of the support shaft 11 and are circumferentially arranged around the periphery of the support shaft 11. Each type of transfer component 122 is fixedly disposed in one of the N connecting rods 123.

[0060] In this example, there are three types of LED chips, therefore, as Figure 12 As shown, the transfer element 122 includes a plurality of first transfer elements 122a, second transfer elements 122b, and third transfer elements 122c that are alternately spaced along the axial direction of the support shaft 11. The transfer array 12 also includes three connecting rods 123, which are parallel to the axis of the support shaft 11 and circumferentially arranged around the periphery of the support shaft 11. The first transfer element 122a, second transfer element 122b, and third transfer element 122c are respectively fixedly mounted on one of the three connecting rods 123. Figure 12 As shown, the first transfer element 122a is used to adsorb the red LED chip, the second transfer element 122b is used to adsorb the green LED chip, and the third transfer element 122c is used to adsorb the blue LED chip.

[0061] Multiple alternating first transfer components 122a, second transfer component 122b, and third transfer component 122c are mechanically linked through different connecting rods 123. Each transfer component 122 can be independently controlled for angular or linear displacement, while synchronous action is achieved through the rigid transmission of the connecting rods 123. The first transfer component 122a, second transfer component 122b, and third transfer component 122c process LED chips of different colors respectively, and the synchronous drive of the connecting rods enables the simultaneous pickup and mixing of multi-color chips.

[0062] Furthermore, the transfer array 12 also includes N support rings 124 coaxially sleeved around the support shaft 11, at least N-1 support rings 124 can rotate around the support shaft 11, and N connecting rods 124 are respectively connected to the N support rings 124.

[0063] like Figure 14As shown, in this embodiment, the transfer array 12 further includes three support rings 124 coaxially sleeved around the outer periphery of the support shaft 11. At least two support rings 124 are rotatable around the support shaft 11, and three connecting rods 123 are respectively connected to the three support rings 124. By rotating independently relative to each support ring 124, the position of the transfer component 122 mounted on the connecting rod 123 can be adjusted. Each support ring 124 can be relatively independently controlled in terms of angular displacement, and the transfer component 122 can move synchronously through the rigid transmission of the connecting rod 123.

[0064] It should be noted that in this embodiment, one support ring 124 is fixedly sleeved on the support shaft 11 and is connected to the first transfer member 122a via a connecting rod 123. That is, the position of the first transfer member 122a is relatively fixed. The other two support rings 124 can rotate around the support shaft 11 and are respectively connected to the second transfer member 122b and the third transfer member 122c via connecting rods 123. That is, the second transfer member 122b and the third transfer member 122c can rotate around the axis of the support shaft 11. During mixed weaving, the first transfer member 122a remains stationary, that is, the transfer section 1223 of the first transfer member 122a remains stationary. The second transfer member 122b rotates 60 degrees, and the third transfer member 122c rotates 120 degrees, achieving the following... Figure 12 The three-color LED chips shown are arranged in a mixed pattern on the transfer surface.

[0065] It should be noted that the support ring 124 can be driven by a ring motor. Specifically, the stator of the ring motor is fixed on the support shaft 11, and the rotor is rigidly connected to the support ring 124. The ring motor enables high-precision rotation of the support ring 124. Therefore, by setting two ring motors, the second transfer member 122b and the third transfer member 122c can be driven to rotate with high precision at a preset angle. Furthermore, to ensure the alignment of the transfer surfaces, additional limiting components can be configured to mechanically limit the movement at the end of the rotation of the transfer block 1221, achieving high-precision alignment of the transfer surfaces 1223.

[0066] In another possible embodiment, the transfer array 12 further includes support rings 124 coaxially sleeved around the outer periphery of the support shaft 11 and corresponding one-to-one with the transfer members 122. At most one support ring 124 is fixed to the support shaft 11, while the remaining support rings 124 can rotate around the support shaft 11. The transfer rings 1222 are connected one-to-one with the support rings 124, meaning that each transfer member 122 can rotate independently. Similarly, the support rings 124 can be driven by a ring motor. By setting a ring motor corresponding one-to-one with the transfer members 122, the independent rotation of each transfer member 122 can be achieved. The rotatable support rings 124 directly drive the independent angular displacement of the transfer members, flexibly adjusting the spatial arrangement of each layer of chips. Each transfer member 122 can independently adjust its circumferential angular displacement, realizing the multi-color mixed arrangement of LED chips in a ring space, eliminating the need for multiple step-by-step transfers and significantly reducing cumulative errors.

[0067] like Figure 15 As shown, in other possible embodiments, a spacing adjustment structure is provided on the support shaft 11, and the spacing between the transfer members can be adjusted by the spacing adjustment mechanism. When rotating the transfer member 122, the spacing between adjacent transfer members 122 is first increased by the spacing adjustment mechanism, and then the transfer member 122 is driven to rotate to achieve the mixing of multi-color LED chips. After the mixing is completed, the spacing is restored by the spacing adjustment mechanism. It should be noted that the spacing adjustment mechanism can use existing technology, that is, existing mechanical adjustment mechanisms, which will not be described in detail here.

[0068] In another possible embodiment, the transfer block 1221 and the transfer ring 1222 are designed as separate units. A pushing mechanism is provided between the transfer block 1221 and the transfer ring 1222. The pushing mechanism enables the transfer block to move radially along the support shaft 11, thereby controlling the protrusion or depression of the transfer surface 1223. It should be noted that the pushing mechanism can use existing technology, i.e., existing mechanical pushing mechanisms, which will not be described in detail here.

[0069] In this embodiment, the hybrid transfer head 1, through its innovative design of a ring-shaped three-dimensional array and rotatable stacked facets, significantly overcomes the spatial bottlenecks and efficiency shortcomings of traditional planar transfer schemes. It balances hybrid flexibility, transfer accuracy, and mass production yield adaptability, meeting the industrial demands for mass transfer of multi-color Mini / Micro LED chips. The hybrid transfer head 1 constructs a three-dimensional transfer architecture around the support axis 11. Through circumferential angular displacement adjustment of the transfer facets 1223, it achieves dynamic spatial reconstruction of the monochrome LED chips, solving the problem that traditional planar transfer heads cannot flexibly adapt to complex multi-color hybrid layouts. Simultaneously, it combines the picking and hybridization of multiple monochrome chips into a single operation, reducing the accumulated alignment errors and chip damage risks caused by traditional step-by-step transfer, while improving chip transfer efficiency. Example 2

[0070] This embodiment provides a mass transfer device, including at least one of the aforementioned mixing transfer heads 1. Additionally, it includes a control unit that controls the mechanical movements of the transfer heads. It should be noted that the control unit can employ existing technology, such as a PLC or industrial control system, and will not be elaborated further here. Example 3

[0071] like Figure 16 As shown, this embodiment provides a mass transfer method applied to the aforementioned mass transfer device to achieve the transfer of three-color LED chips. The method includes the following steps: S10 provides three sets of monochrome LED chip carrier substrates (first carrier substrate, second carrier substrate, and third carrier substrate), with multiple red LED chips, green LED chips, and blue LED chips arrayed on one side of each of the three carrier substrates.

[0072] S20, the transfer surface of the mixed-lay transfer head is aligned with the three sets of carrier substrates respectively, and each transfer cut surface is aligned with the monochrome LED chip on the carrier substrate, and the transfer surface is controlled to pick up the monochrome LED chip from the carrier substrate.

[0073] S30 controls the relative rotation of the transfer cut surface around the axis of the support shaft, adjusting the spatial arrangement of the monochrome LED chips on the transfer cut surface to form a mixed arrangement of three-color LED chips on the transfer surface.

[0074] S40, providing a target substrate, placing the multiple transfer surfaces after mixing and assembling against the corresponding multiple target substrates respectively, or placing the multiple transfer surfaces after mixing and assembling against multiple corresponding positions on a target substrate, and transferring the mixed and assembling LED chips to the target substrate.

[0075] Furthermore, the process of arranging the three-color LED chips in a mixed configuration on the transfer surface may also include the following steps: Before controlling the relative rotation of the transfer surfaces around the axis of the support shaft, adjust and increase the spacing between the transfer surfaces; After controlling the relative rotation of the transfer surfaces around the axis of the support shaft, adjust to reduce the spacing between the transfer surfaces.

[0076] like Figure 17 As shown, this embodiment also provides another mass transfer method, applied to the above-mentioned mass transfer device, to realize the transfer of three-color LED chips. The method includes the following steps: S50 provides three sets of monochrome LED chip carrier substrates (first carrier substrate, second carrier substrate, and third carrier substrate), with multiple red LED chips, green LED chips, and blue LED chips arrayed on one side of each of the three carrier substrates.

[0077] S60, each transfer surface has three transfer facets: an R transfer facet, a G transfer facet, and a B transfer facet. One transfer facet of the mixing transfer head is aligned with each of the three carrier substrates. When aligning with the first carrier substrate, the R transfer facet is driven to bulge outwards and aligned with the red LED chip on the first carrier substrate, and the R transfer facet is controlled to pick up the red LED chip from the first carrier substrate. When aligning with the second carrier substrate, the G transfer facet is driven to bulge outwards and aligned with the green LED chip on the second carrier substrate, and the G transfer facet is controlled to pick up the green LED chip from the second carrier substrate. When aligning with the third carrier substrate, the B transfer facet is driven to bulge outwards and aligned with the blue LED chip on the third carrier substrate, and the B transfer facet is controlled to pick up the green LED chip from the third carrier substrate. After three repetitions, the transfer facets achieve sequential mixing of the three-color LED chips. The other transfer facets achieve sequential mixing of the three-color LED chips in the same way.

[0078] S70 provides a target substrate, and places the multiple transfer surfaces after mixing and assembling onto the corresponding multiple target substrates, or places the multiple transfer surfaces after mixing and assembling onto multiple corresponding positions on a target substrate, and transfers the mixed LED chips to the target substrate.

[0079] Furthermore, step S60 may also include the following steps: Before the R transfer surface convexes out relatively, adjust and increase the spacing between the transfer surfaces; After controlling the B transfer surface to pick up the green LED chip from the third carrier substrate, adjust and reduce the spacing between the transfer surfaces.

[0080] In the description of this invention, it should be understood that terms such as "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0081] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0082] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A hybrid transfer head for pick-and-hybridization of multi-color LED chips, the light color types of LED chips that need to be hybridized are N, characterized in that, The system includes a support shaft and a transfer array sleeved on the support shaft. The transfer array includes at least N transfer surfaces arranged in a ring around the axis of the support shaft. Each transfer surface includes multiple transfer cut surfaces stacked along the axial direction of the support shaft. The transfer cut surfaces are used to pick up monochrome LED chips. The transfer cut surfaces can be angularly displaced around the axis of the support shaft to adjust the spatial arrangement of the monochrome LED chips on the transfer cut surfaces, thereby forming a mixed arrangement of multicolor LED chips on the transfer surfaces.

2. The hybrid transfer head of claim 1, wherein, The transfer array includes a plurality of transfer components stacked along the axial direction of the support shaft. Each transfer component includes a transfer block and a transfer ring connected to the transfer block and coaxially sleeved on the support shaft. The end face of the transfer block facing away from the transfer ring forms the transfer cross-section.

3. The hybrid transfer head of claim 2, wherein, The transfer components include N types of transfer components that are alternately distributed at intervals along the axial direction of the support shaft. The transfer array also includes N connecting rods. The N connecting rods are parallel to the axis of the support shaft and are arranged circumferentially around the support shaft. Each type of transfer component is fixedly mounted on one of the N connecting rods.

4. The hybrid transfer head of claim 3, wherein, The transfer array further includes N support rings coaxially sleeved around the outer periphery of the support shaft, at least N-1 of the support rings being rotatable around the support shaft, and each of the connecting rods being connected to one of the support rings respectively.

5. The hybrid transfer head of claim 2, wherein, The transfer array further includes support rings coaxially sleeved on the outer periphery of the support shaft and corresponding one-to-one with the transfer member. At most one of the support rings is fixed on the support shaft, and the remaining support rings can rotate around the support shaft. The transfer rings are connected one-to-one with the support rings.

6. The hybrid transfer head of claim 1, wherein, The transfer section is a plane.

7. The hybrid transfer head of claim 1, wherein, The transfer surface is an arc surface.

8. A mass transfer device characterized by, Includes at least one hybrid transfer head as described in claims 1 to 7.

9. A mass transfer method applied to the mass transfer device of claim 8, characterized in that, The method is applied to the transfer of three-color LED chips, and the method includes: Three sets of monochrome LED chip carrier substrates are provided, and multiple red LED chips, green LED chips and blue LED chips are respectively arrayed on one side of the three sets of carrier substrates; The transfer surface of the hybrid transfer head is aligned with the three sets of carrier substrates respectively, and each transfer surface is aligned with the monochrome LED chip on the carrier substrate, and the transfer surface is controlled to pick up the monochrome LED chip from the carrier substrate. Control the relative rotation of the transfer cut surface around the axis of the support shaft, adjust the spatial arrangement of the monochrome LED chips on the transfer cut surface, and form a mixed arrangement of tricolor LED chips on the transfer surface; A target substrate is provided, and the multiple transfer surfaces after mixing are respectively placed opposite to the multiple target substrates, or the multiple transfer surfaces after mixing are placed opposite to multiple corresponding positions on a target substrate, so as to transfer the mixed LED chips to the target substrate.

10. The mass transfer method of claim 9, wherein, The method of forming the three-color LED chips by mixing and arranging them on the transfer surface also includes: Before controlling the relative rotation of the transfer surfaces about the axis of the support shaft, adjust and increase the spacing between the transfer surfaces; After controlling the transfer surfaces to rotate relative to each other about the axis of the support shaft, the spacing between the transfer surfaces is adjusted to decrease.

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