A double-sided light-emitting optoelectronic semiconductor module

Abstract

This invention relates to the field of semiconductor lighting technology, specifically to a double-sided light-emitting optoelectronic semiconductor module, comprising: a mounting frame, wherein a fixing frame is fixedly connected inside the mounting frame, and a plurality of ceramic substrates are disposed inside the fixing frame; a plurality of conductive holes, each of which is formed on one side of the ceramic substrates; and a fixing component disposed inside the fixing frame. When the mounting frame is placed in a suitable position, the fixing component is used to fix the ceramic substrates inside the fixing frame, allowing the operator to fix the advertisement to be displayed on the front and back sides of the mounting frame. When the ceramic substrates are powered on, the light-emitting units on the front and back sides of the ceramic substrates emit light, illuminating the advertisement fixed inside the mounting frame, thus meeting the modern demand for double-sided visualization. Simultaneously, it can illuminate or display both the front and back sides of the mounting frame, improving the lighting effect within the mounting frame.

Description

Technical Field

[0001] This invention relates to the field of semiconductor lighting technology, specifically to a double-sided light-emitting optoelectronic semiconductor module. Background Technology

[0002] Optoelectronic semiconductor modules are electronic components that integrate light-emitting units, driving circuits, and heat dissipation structures, and are widely used in lighting, display, indication, and communication fields. With the maturity of LED technology, modules have evolved from the traditional single-sided light-emitting structure into various forms. Among them, "double-sided light-emitting modules," which can simultaneously achieve light output in both forward and reverse directions, are particularly suitable for transparent displays, double-sided light boxes, urban landscape lighting, and vehicle information screens. These modules typically include light-emitting chips, light guide layers, circuit boards, heat dissipation units, and housing structures. Some also integrate intelligent control systems to achieve dynamic dimming and independent zone control. Patent document CN117650207A discloses a semiconductor light-emitting chip. This component includes, from bottom to top, a substrate, a first conductivity type semiconductor, an active layer, an electron blocking layer, and a second conductivity type semiconductor. This semiconductor light-emitting chip improves the photoelectric conversion efficiency degradation problem under high current effects by controlling the lattice constant gradient, separation energy gradient, and bulk modulus gradient of the semiconductor light-emitting chip. Furthermore, by controlling the effective mass gradient of heavy holes, the effective density of states gradient of the valence band, the saturated electron drift velocity gradient, and the longitudinal sound velocity gradient of the semiconductor light-emitting chip, as well as the electron and hole wave function distribution of the quantum well, it enhances the wave function-to-electrical conversion efficiency (WPE) of the quantum well. This improves the light-emitting efficiency of the semiconductor chip while reducing the photoelectric conversion efficiency degradation rate.

[0003] In practical use, the above-mentioned devices are mostly single-sided light-emitting structures, which can only achieve illumination or display effects in a single direction and cannot meet the modern demand for double-sided visualization. To solve the above problems, a double-sided light-emitting optoelectronic semiconductor module is proposed. Summary of the Invention

[0004] To address the aforementioned issues, a double-sided light-emitting optoelectronic semiconductor module is provided. This module uses a ceramic substrate, conductive holes, and optoelectronic semiconductor light-emitting units to illuminate both the front and back sides of the mounting frame, thereby meeting modern demands for double-sided visualization.

[0005] To address the above problems, this invention provides a double-sided light-emitting optoelectronic semiconductor module, comprising: The mounting frame has a fixed frame inside it, and the fixed frame has several ceramic substrates inside it. A plurality of conductive holes are provided, all of which are formed on one side of the ceramic substrate, and photoelectric semiconductor light-emitting units are fixedly connected to both the left and right sides of the ceramic substrate. A fixing component is disposed inside the fixing frame and is used to fix the ceramic substrate; A cooling component is disposed inside the fixed frame and is used to cool the ceramic substrate.

[0006] As a further supplement to this application, the fixing component includes: A plurality of fixing slots are provided, all of which are formed on one side of the fixing frame. The ceramic substrate is movably fitted together with the fixing slots, and a fixing plate is provided inside the fixing slots. A plurality of positioning holes are provided, all of which are formed on one side of the ceramic substrate. Two positioning rods are fixedly connected to one side of the fixing plate, and the positioning rods are movably sleeved together with the positioning holes. A positioning element is disposed inside the fixing groove and is used to position the fixing plate.

[0007] As a further supplement to this application, the positioning element includes: Two positioning slots are provided, both of which are opened on the left and right sides inside the fixed slot. Positioning plates are fixedly connected to the left and right sides of the fixed plate, and the positioning plates are movably sleeved together with the positioning slots. A thermally conductive pad is fixedly connected to one side inside the fixing groove, and the thermally conductive pad is attached to the ceramic substrate.

[0008] As a further supplement to this application, an adjustment groove is provided on one side of the positioning groove, and a spring is fixedly connected to one side of the adjustment groove. One side of the spring is fixedly connected to one side of the positioning plate. Placement grooves are provided on both the front and rear sides of the mounting frame. A placement frame is movably fitted inside the placement groove, and an advertising film is fixedly connected inside the placement frame.

[0009] As a further supplement to this application, the temperature-conducting pad has two through holes on one side, the positioning rod is movably sleeved with the through holes, and the fixing groove has two mounting holes on one side, with a magnet fixedly connected inside the mounting hole, and the magnet is magnetically attracted to the positioning rod.

[0010] As a further supplement to this application, the cooling component includes: Several fixing rods are fixedly connected inside the fixing frame, and temperature-conducting blocks are fixedly connected to both the left and right sides of the fixing rods; A cooling pad is fixedly connected to one side of the temperature-conducting block, and one side of the cooling pad is attached to one side of the ceramic substrate. A heat sink is disposed on the top surface of the mounting frame and is used to cool the mounting frame.

[0011] As a further supplement to this application, the heat sink includes: Two cooling plates are fixedly connected to the top and bottom surfaces of the mounting frame, respectively, and heat dissipation fins are fixedly connected to the top surface of the cooling plates.

[0012] As a further supplement to this application, a sealing gasket is fixedly connected to one side of the placement frame, and several fixing holes are opened on both the left and right sides of the mounting frame. Bolts are installed inside the fixing holes. Several mounting grooves are opened on both the left and right sides of the placement frame. The bolts are threadedly connected to the mounting grooves. A handle is fixedly connected to one side of the fixing plate.

[0013] The advantages of this invention compared to the prior art are: 1. This application, by setting up an installation frame, allows workers to place the frame in a suitable position and then use fixing components to secure the ceramic substrate inside the frame. Workers can then fix the advertisement to be displayed on the front and back sides of the frame. When the ceramic substrate is powered on, the photoelectric semiconductor light-emitting units on the front and back sides of the ceramic substrate emit light, illuminating the advertisement fixed inside the frame. This meets the modern demand for double-sided visualization and can simultaneously illuminate or display both sides of the frame, improving the lighting effect within the frame. By setting up positioning rods, when workers movably fit the positioning rods into the positioning holes, the positioning rods can position the ceramic substrate, thus fixing the ceramic substrate inside the fixing groove. Furthermore, if the ceramic substrate is accidentally damaged, it can be quickly disassembled and replaced, avoiding localized poor lighting.

[0014] 2. This application incorporates a placement frame. When workers fix the advertising film inside the placement frame, and then fix the placement frame inside the placement slot, it facilitates subsequent lighting display of the advertising film. A spring is incorporated; since one end of the spring is fixedly connected to one side of the positioning plate, when the fixing plate moves, the positioning plate can move one end of the spring, causing the spring to be under tension. When the fixing plate is no longer under tension, the spring's tension, through the positioning plate, can move the fixing plate back into the fixing slot. A magnet is incorporated; when the fixing plate is movably fitted inside the fixing slot, the magnet can magnetically attract the positioning rod, facilitating subsequent positioning of the fixing plate and preventing it from moving arbitrarily.

[0015] 3. This application incorporates a cooling pad. Since one side of the cooling pad is attached to one side of the ceramic substrate, the temperature of the ceramic substrate during operation can be transferred to the upper fixing rod through the cooling pad and the heat-conducting block. At this time, the temperature on the fixing rod can be transferred to the mounting frame through the fixing frame, which facilitates the subsequent cooling of the ceramic substrate, thereby improving the service life of the ceramic substrate and preventing the ceramic substrate from working at high temperatures for a long time. By incorporating bolts, after the operator places the placement frame inside the placement slot, the bolts are then threaded together with the mounting slot, allowing the placement frame to be fixed inside the placement slot. This enables the placement frame to be fixed or disassembled. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the three-dimensional structure of a double-sided light-emitting optoelectronic semiconductor module.

[0017] Figure 2 This is a schematic diagram of the fixed frame structure of a double-sided light-emitting optoelectronic semiconductor module.

[0018] Figure 3 This is a schematic diagram of a ceramic substrate structure for a double-sided light-emitting optoelectronic semiconductor module.

[0019] Figure 4 It is a double-sided light-emitting optoelectronic semiconductor module. Figure 2 A magnified schematic diagram of part A in the diagram.

[0020] Figure 5 This is a schematic diagram of the fixed plate structure of a double-sided light-emitting optoelectronic semiconductor module.

[0021] Figure 6 This is a schematic diagram of the fixing rod structure of a double-sided light-emitting optoelectronic semiconductor module.

[0022] Figure 7 This is a schematic diagram of the placement frame structure for a double-sided light-emitting optoelectronic semiconductor module.

[0023] The following are the labels in the diagram: 1. Mounting frame; 2. Fixing frame; 3. Ceramic substrate; 4. Conductive hole; 5. Optoelectronic semiconductor light-emitting unit; 6. Fixing groove; 7. Fixing plate; 8. Positioning hole; 9. Positioning rod; 10. Positioning groove; 11. Positioning plate; 12. Temperature-conducting pad; 13. Adjustment groove; 14. Spring; 15. Through hole; 16. Mounting hole; 17. Magnet; 18. Placement groove; 19. Placement frame; 20. Advertising film; 21. Fixing rod; 22. Temperature-conducting block; 23. Cooling pad; 24. Fixing hole; 25. Bolt; 26. Mounting groove; 27. Cooling plate; 28. Heat dissipation fins; 29. ​​Sealing gasket; 30. Handle. Detailed Implementation

[0024] To further understand the features, technical means, and specific objectives and functions achieved by the present invention, the present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments.

[0025] See Figure 1 - Figure 7 As shown, a double-sided light-emitting optoelectronic semiconductor module includes: a mounting frame 1, a fixing frame 2 fixedly connected inside the mounting frame 1, a plurality of ceramic substrates 3 disposed inside the fixing frame 2, a plurality of conductive holes 4 opened on one side of the ceramic substrates 3, optoelectronic semiconductor light-emitting units 5 fixedly connected to both sides of the ceramic substrates 3, a fixing component disposed inside the fixing frame 2 for fixing the ceramic substrates 3, and a cooling component disposed inside the fixing frame 2 for cooling the ceramic substrates 3; In this system, by setting up an installation frame 1, after the staff places the installation frame 1 in a suitable position, the ceramic substrate 3 is fixed inside the fixing frame 2 using fixing components. The staff then fixes the advertisement to be displayed on the front and back sides of the installation frame 1. When the ceramic substrate 3 is powered on, the photoelectric semiconductor light-emitting units 5 on the front and back sides of the ceramic substrate 3 emit light, which can illuminate the advertisement fixed inside the installation frame 1, thereby meeting the modern demand for double-sided visualization. At the same time, it can illuminate or display both the front and back sides of the installation frame 1, improving the lighting effect inside the installation frame 1.

[0026] The fixing component includes several fixing slots 6, all of which are opened on one side of the fixing frame 2. The ceramic substrate 3 is movably fitted together with the fixing slots 6. A fixing plate 7 is provided inside the fixing slot 6. Several positioning holes 8 are opened on one side of the ceramic substrate 3. Two positioning rods 9 are fixedly connected to one side of the fixing plate 7. The positioning rods 9 are movably fitted together with the positioning holes 8. A positioning element is provided inside the fixing slot 6 for positioning the fixing plate 7. The positioning rod 9 is designed so that when the staff moves the positioning rod 9 and the positioning hole 8 together, the positioning rod 9 can position the ceramic substrate 3, thereby fixing the ceramic substrate 3 inside the fixing groove 6. At the same time, if the ceramic substrate 3 is accidentally damaged, it can be quickly disassembled and replaced to avoid poor local lighting.

[0027] The positioning component includes two positioning grooves 10, both of which are opened on the left and right sides inside the fixing groove 6. Positioning plates 11 are fixedly connected to both sides of the fixing plate 7. The positioning plates 11 are movably fitted together with the positioning grooves 10. A temperature conductive pad 12 is fixedly connected to one side inside the fixing groove 6. The temperature conductive pad 12 is attached to the ceramic substrate 3. By setting a thermal conductive pad 12, since the thermal conductive pad 12 is attached to the ceramic substrate 3, the temperature generated at the upper and lower ends of the ceramic substrate 3 during operation can be transferred to the fixing frame 2 through the thermal conductive pad 12, which facilitates the subsequent cooling of the ceramic substrate 3 and improves the service life of the ceramic substrate 3.

[0028] An adjustment groove 13 is provided on one side inside the positioning groove 10. A spring 14 is fixedly connected to one side inside the adjustment groove 13. One side of the spring 14 is fixedly connected to one side of the positioning plate 11. Placement grooves 18 are provided on both the front and rear sides of the mounting frame 1. A placement frame 19 is movably fitted inside the placement groove 18. An advertising film 20 is fixedly connected inside the placement frame 19. The system includes a placement frame 19. When the staff fixes the advertising film 20 inside the placement frame 19, and then fixes the placement frame 19 inside the placement slot 18, it facilitates the lighting display of the advertising film 20 later. The system also includes a spring 14. Since one end of the spring 14 is fixedly connected to one side of the positioning plate 11, when the fixing plate 7 moves, the positioning plate 11 can drive one end of the spring 14 to move, causing the spring 14 to be under tension. When the fixing plate 7 is no longer under tension, the tension of the spring 14 can drive the fixing plate 7 to move through the positioning plate 11, allowing the fixing plate 7 to move back into the fixing slot 6, thus facilitating the adjustment of the position of the fixing plate 7 later.

[0029] Two through holes 15 are provided on one side of the temperature conducting pad 12. The positioning rod 9 is movably sleeved with the through holes 15. Two mounting holes 16 are provided on one side of the fixing groove 6. A magnet 17 is fixedly connected inside the mounting hole 16. The magnet 17 is magnetically attracted to the positioning rod 9. In this design, by setting a magnet 17, when the fixing plate 7 is movably fitted inside the fixing groove 6, the magnet 17 can be magnetically attracted to the positioning rod 9, which facilitates the positioning of the fixing plate 7 in the later stage and prevents the fixing plate 7 from moving at will.

[0030] The cooling component includes several fixing rods 21, which are all fixedly connected inside the fixing frame 2. Temperature conducting blocks 22 are fixedly connected to both the left and right sides of the fixing rods 21. A cooling pad 23 is fixedly connected to one side of the temperature conducting block 22. One side of the cooling pad 23 is attached to one side of the ceramic substrate 3. A heat dissipation component is provided on the top surface of the mounting frame 1 for cooling the mounting frame 1. By setting a cooling pad 23, since one side of the cooling pad 23 is attached to one side of the ceramic substrate 3, the temperature of the ceramic substrate 3 during operation can be transferred to the upper fixing rod 21 through the cooling pad 23 and the heat-conducting block 22. At this time, the temperature on the fixing rod 21 can be transferred to the mounting frame 1 through the fixing frame 2, which facilitates the cooling of the ceramic substrate 3 in the later stage, thereby improving the service life of the ceramic substrate 3 and preventing the ceramic substrate 3 from working at high temperature for a long time.

[0031] The heat dissipation component includes two cooling plates 27, which are fixedly connected to the top and bottom surfaces of the mounting frame 1 respectively. The top surface of the cooling plate 27 is fixedly connected with heat dissipation fins 28. In this design, by setting heat dissipation fins 28, the temperature on the mounting frame 1 can be transferred to several heat dissipation fins 28 through the cooling plate 27, thereby improving the heat dissipation efficiency of the mounting frame 1.

[0032] A sealing gasket 29 is fixedly connected to one side of the placement frame 19. Several fixing holes 24 are opened on both the left and right sides of the mounting frame 1. Bolts 25 are installed inside the fixing holes 24. Several mounting grooves 26 are opened on both the left and right sides of the placement frame 19. The inner wall of the mounting groove 26 is threaded. The bolts 25 are threaded together with the mounting groove 26. A handle 30 is fixedly connected to one side of the fixing plate 7. By setting bolts 25, after the staff places the placement frame 19 inside the placement groove 18, the bolts 25 are then threaded together with the mounting groove 26, so that the placement frame 19 can be fixed inside the placement groove 18, thereby allowing the placement frame 19 to be fixed or disassembled.

[0033] In use, by setting up the mounting frame 1, after the staff places the mounting frame 1 in a suitable position, the ceramic substrate 3 is fixed inside the fixing frame 2 using fixing components. The staff then fixes the advertisement to be displayed on the front and back sides of the mounting frame 1. When the ceramic substrate 3 is powered on, the photoelectric semiconductor light-emitting units 5 on the front and back sides of the ceramic substrate 3 emit light, which can illuminate the advertisement fixed inside the mounting frame 1, thereby meeting the modern demand for double-sided visualization. At the same time, it can illuminate or display both the front and back sides of the mounting frame 1, improving the lighting effect inside the mounting frame 1. By setting up the positioning rod 9, when the staff movably fits the positioning rod 9 with the positioning hole 8, the positioning rod 9 can position the ceramic substrate 3, thereby fixing the ceramic substrate 3 inside the fixing groove 6. At the same time, if the ceramic substrate 3 is accidentally damaged, it can be quickly disassembled and replaced to avoid poor local lighting. By setting up a placement frame 19, when the staff fixes the advertising film 20 inside the placement frame 19, and then fixes the placement frame 19 inside the placement slot 18, it is convenient to illuminate and display the advertising film 20 later. By setting up a spring 14, since one end of the spring 14 is fixedly connected to one side of the positioning plate 11, when the fixing plate 7 moves, the positioning plate 11 can drive one end of the spring 14 to move, so that the spring 14 is subjected to tension. When the fixing plate 7 is no longer under the force of movement, the tension of the spring 14 can drive the fixing plate 7 to move through the positioning plate 11, so that the fixing plate 7 can move back into the fixing slot 6. By setting up a magnet 17, when the fixing plate 7 is movably fitted inside the fixing slot 6, the magnet 17 can be magnetically attracted to the positioning rod 9, which is convenient for later fixing. The fixed plate 7 is positioned to prevent it from moving arbitrarily. By setting a cooling pad 23, one side of the cooling pad 23 is attached to one side of the ceramic substrate 3, so that the temperature of the ceramic substrate 3 during operation can be transferred to the upper fixed rod 21 through the cooling pad 23 and the heat-conducting block 22. At this time, the temperature on the fixed rod 21 can be transferred to the mounting frame 1 through the fixed frame 2, which facilitates the cooling of the ceramic substrate 3 in the later stage, thereby improving the service life of the ceramic substrate 3 and preventing the ceramic substrate 3 from working at high temperature for a long time. By setting a bolt 25, when the operator places the placement frame 19 inside the placement groove 18, the bolt 25 is threaded together with the mounting groove 26, so that the placement frame 19 can be fixed inside the placement groove 18, thereby fixing or removing the placement frame 19.

[0034] The above embodiments only illustrate one or more implementations of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of the present invention should be determined by the appended claims.

Claims

1. A double-sided light-emitting optoelectronic semiconductor module, characterized in that, include: Mounting frame (1), with a fixing frame (2) fixedly connected inside the mounting frame (1), and a number of ceramic substrates (3) disposed inside the fixing frame (2). A plurality of conductive holes (4) are provided on one side of the ceramic substrate (3), and photoelectric semiconductor light-emitting units (5) are fixedly connected to both the left and right sides of the ceramic substrate (3). A fixing component is disposed inside the fixing frame (2) for fixing the ceramic substrate (3); A cooling component is disposed inside the fixed frame (2) and is used to cool the ceramic substrate (3).

2. The double-sided light-emitting optoelectronic semiconductor module according to claim 1, characterized in that, The fixing component includes: A plurality of fixing slots (6) are provided on one side of the fixing frame (2), the ceramic substrate (3) is movably fitted together with the fixing slots (6), and a fixing plate (7) is provided inside the fixing slots (6). A plurality of positioning holes (8) are provided on one side of the ceramic substrate (3), and two positioning rods (9) are fixedly connected to one side of the fixing plate (7). The positioning rods (9) are movably sleeved together with the positioning holes (8). A positioning element is disposed inside the fixing groove (6) for positioning the fixing plate (7).

3. A double-sided light-emitting optoelectronic semiconductor module according to claim 2, characterized in that, The positioning element includes: Two positioning slots (10) are provided on the left and right sides inside the fixed slot (6). Positioning plates (11) are fixedly connected to the left and right sides of the fixed plate (7). The positioning plates (11) are movably sleeved together with the positioning slots (10). The temperature-conducting pad (12) is fixedly connected to one side inside the fixing groove (6) and is attached to the ceramic substrate (3).

4. A double-sided light-emitting optoelectronic semiconductor module according to claim 3, characterized in that, An adjustment groove (13) is provided on one side inside the positioning groove (10). A spring (14) is fixedly connected to one side inside the adjustment groove (13). One side of the spring (14) is fixedly connected to one side of the positioning plate (11). Placement grooves (18) are provided on both the front and rear sides of the mounting frame (1). A placement frame (19) is movably fitted inside the placement groove (18). An advertising film (20) is fixedly connected inside the placement frame (19).

5. A double-sided light-emitting optoelectronic semiconductor module according to claim 3, characterized in that, Two through holes (15) are opened on one side of the thermal pad (12). The positioning rod (9) is movably sleeved with the through holes (15). Two mounting holes (16) are opened on one side of the fixing groove (6). A magnet (17) is fixedly connected inside the mounting hole (16). The magnet (17) is magnetically attracted to the positioning rod (9).

6. A double-sided light-emitting optoelectronic semiconductor module according to claim 1, characterized in that, The cooling component includes: Several fixing rods (21) are fixedly connected inside the fixing frame (2), and temperature-conducting blocks (22) are fixedly connected to the left and right sides of the fixing rods (21). Cooling pad (23), the cooling pad (23) is fixedly connected to one side of the temperature conducting block (22), and one side of the cooling pad (23) is attached to one side of the ceramic substrate (3); A heat sink is disposed on the top surface of the mounting frame (1) for cooling the mounting frame (1).

7. A double-sided light-emitting optoelectronic semiconductor module according to claim 6, characterized in that, The heat sink includes: Two cooling plates (27) are fixedly connected to the top and bottom surfaces of the mounting frame (1), respectively. The top surface of the cooling plate (27) is fixedly connected with heat dissipation fins (28).

8. A double-sided light-emitting optoelectronic semiconductor module according to claim 4, characterized in that, A sealing gasket (29) is fixedly connected to one side of the placement frame (19). Several fixing holes (24) are opened on both the left and right sides of the mounting frame (1). Bolts (25) are installed inside the fixing holes (24). Several mounting grooves (26) are opened on both the left and right sides of the placement frame (19). The bolts (25) are threaded together with the mounting grooves (26). A handle (30) is fixedly connected to one side of the fixing plate (7).

Images