Perovskite module packaging structure and preparation method

Abstract

This application provides a perovskite module encapsulation structure and fabrication method, relating to the field of photovoltaic device technology. The perovskite module encapsulation structure includes: a substrate, the first surface of which is divided into an effective area and a clearing area surrounding the effective area; a perovskite module disposed on the effective area of ​​the substrate and completely covering it; an encapsulating film disposed on the clearing area of ​​the substrate and covering the sides and the surface of the perovskite module facing away from the substrate, the portion of the encapsulating film corresponding to the clearing area being an unshielded encapsulating film area; a sealing film disposed on the clearing area and surrounding the encapsulating film; a cover plate disposed on the surface of the encapsulating film and the sealing film facing away from the substrate; and a radiation protection film disposed on the substrate, completely shielding the unshielded encapsulating film area in the thickness direction of the perovskite module encapsulation structure. This encapsulation structure improves the protection capability of the edge-exposed encapsulating film while also meeting the requirements for lightweight encapsulation, light-receiving efficiency, and flexible deployment.

Description

Technical Field

[0001] This application relates to the field of photovoltaic device technology, and more specifically, to a perovskite module packaging structure and preparation method. Background Technology

[0002] In the commercial aerospace sector, perovskite photovoltaic modules, with their high specific power, lightweight design, and excellent flexibility, have been widely used in aerospace platforms such as satellite solar panels and rocket upper stages. Their core function is to achieve efficient conversion of solar energy into electrical energy, providing energy security for the continuous and stable operation of spacecraft in orbit. Packaging reliability, as a key performance indicator for the engineering application of perovskite modules, directly determines their on-orbit service life and energy output stability, and is one of the core technological bottlenecks restricting the large-scale deployment of perovskite modules in commercial aerospace.

[0003] Currently, the industry commonly uses a combination of butyl rubber and encapsulating film for perovskite modules. The standard process is as follows: edge cleaning of the module → application of butyl rubber around the edges → laying of the encapsulating film in the middle area → vacuum hot pressing and curing. Among these, edge cleaning is a crucial preliminary step to ensure the reliability of the encapsulation. It usually uses laser scribing to completely remove the functional film layer in the edge area of ​​the module.

[0004] After edge cleaning, there is a clear structural difference between the module edge and the central effective power generation area: the encapsulation film of the central power generation area is covered by multiple layers of functional film, which can effectively resist space radiation; while the butyl rubber and part of the encapsulation film in the edge cleaning area are directly exposed to the extreme radiation environment in space, which is prone to significant radiation aging failure, thereby destroying the integrity of the module encapsulation and seriously affecting its performance stability and reliability during its on-orbit service.

[0005] In existing technologies, radiation protection for perovskite modules is mostly achieved by encapsulating them with radiation-resistant materials. This not only significantly increases the module's weight and degrades its flexible deployment performance, but also has obvious shortcomings in terms of packaging process compatibility and engineering feasibility, making it difficult to meet the application requirements of mass production and high-efficiency manufacturing of perovskite modules for commercial aerospace. Summary of the Invention

[0006] The purpose of this application is to address the shortcomings of the prior art by providing a perovskite module encapsulation structure and preparation method that can precisely protect the exposed adhesive film after edge cleaning, effectively resist space radiation, delay the aging and failure of the adhesive film, and ensure the performance stability and reliability of the perovskite module during its on-orbit service. At the same time, it takes into account the module's lightweight design, encapsulation process compatibility, and engineering feasibility, adapting to the needs of different application scenarios such as commercial aerospace low-Earth orbit constellations, high-Earth orbit satellites, and deep space exploration.

[0007] To achieve the above objectives, the technical solutions adopted in the embodiments of this application are as follows: One aspect of this application provides a perovskite module encapsulation structure, comprising: a substrate having a first surface and a second surface opposite to each other, the first surface being divided into an effective area and a clearing area surrounding the effective area; a perovskite module disposed on the effective area of ​​the substrate and completely covering the effective area; an encapsulating film disposed on the clearing area of ​​the substrate and covering the side surface of the perovskite module and the surface facing away from the substrate, the portion of the encapsulating film corresponding to the clearing area being an unshielded encapsulating film area; a sealing film disposed on the clearing area and surrounding the encapsulating film; a cover plate disposed on the surface of the encapsulating film and the sealing film facing away from the substrate; and a radiation protection film disposed on the substrate, completely shielding the unshielded encapsulating film area in the thickness direction of the perovskite module encapsulation structure and at least partially exposing the perovskite module.

[0008] Optionally, the radiation-resistant protective film may also completely block the sealant film in the thickness direction.

[0009] Optionally, the radiation protection film is disposed between the substrate and the unshielded encapsulation film area; or, the radiation protection film covers the area on the second surface corresponding to the edge clearing area; or, the radiation protection film covers the area on the second surface corresponding to the edge clearing area, the area on the cover plate facing away from the substrate corresponding to the edge clearing area, and the side of the perovskite module encapsulation structure.

[0010] Another aspect of this application provides a method for preparing a perovskite module encapsulation structure, comprising: providing a substrate and preparing a perovskite module on a first surface of the substrate, wherein the first surface is divided into an effective area and a clearing area surrounding the effective area, and the perovskite module completely covers the effective area; forming an encapsulating film and a sealing film on the clearing area, wherein the encapsulating film covers the side surface of the perovskite module and the surface away from the substrate, the portion of the encapsulating film corresponding to the clearing area is an unshielded encapsulating film area, and the sealing film surrounds the encapsulating film; laying a cover plate on the surface of the encapsulating film and the sealing film away from the substrate; before or after forming the encapsulating film, forming a radiation protection film on the substrate in the area corresponding to the clearing area, wherein the radiation protection film completely blocks the unshielded encapsulating film area in the thickness direction of the perovskite module encapsulation structure and exposes at least a portion of the perovskite module.

[0011] Optionally, the method includes: providing a substrate and preparing a perovskite module on a first surface of the substrate, wherein the first surface is divided into an effective area and a clearing area surrounding the effective area, and the perovskite module completely covers the effective area; laying a sealant around the edges of the clearing area to form a sealant film on the clearing area; forming a radiation protection film on the clearing area, wherein one side of the radiation protection film is adhered to the side of the perovskite module and the other side is adhered to the side of the sealant film; laying an encapsulating agent on the radiation protection film, ensuring that the encapsulating agent completely fills the area enclosed by the sealant film to form an encapsulating film, wherein the encapsulating film covers the side of the perovskite module and the surface facing away from the substrate, and the surfaces of the encapsulating film and the sealant film facing away from the substrate are flush; and laying a cover plate on the surfaces of the encapsulating film and the sealant film facing away from the substrate.

[0012] Optionally, before forming the radiation-resistant protective film on the edge cleaning area, the method further includes: preparing surface-modified nano-cerium dioxide powder and graphene oxide dispersion; uniformly mixing the nano-cerium dioxide powder and graphene oxide dispersion with a polyamic acid solution; uniformly casting the mixed solution onto a glass substrate and drying it in an oven; and peeling off the glass substrate after cooling to room temperature to obtain the radiation-resistant protective film; forming the radiation-resistant protective film on the edge cleaning area includes: laying the radiation-resistant protective film on the edge cleaning area.

[0013] Optionally, forming a radiation-resistant protective film on the substrate in the corresponding area of ​​the clearing zone includes: depositing radiation-resistant material on the substrate in the corresponding area of ​​the clearing zone using a physical deposition method to form a radiation-resistant protective film.

[0014] Optionally, forming an anti-radiation protective film on the substrate in the corresponding area of ​​the cleaned edge area includes: applying an adhesive to the substrate in the corresponding area of ​​the cleaned edge area and pre-curing the adhesive to form an adhesive layer; cutting the anti-radiation protective film into a preset shape and pasting it onto the adhesive layer.

[0015] Optionally, the adhesive is also applied to the area on the cover plate facing away from the substrate, corresponding to the clearing area, and to the sides of the perovskite module encapsulation structure.

[0016] Optionally, the radiation-resistant protective film is a radiation-resistant flexible resin film, a fluorinated modified hydrogenated nitrile rubber film, or a perfluoroether rubber film.

[0017] The beneficial effects of this application include: This application provides a perovskite module encapsulation structure, comprising: a substrate having a first surface and a second surface opposite to each other, the first surface being divided into an effective area and a clearing area surrounding the effective area; a perovskite module disposed on the effective area of ​​the substrate and completely covering the effective area; an encapsulating film disposed on the clearing area of ​​the substrate and covering the side surface of the perovskite module and the surface facing away from the substrate, the portion of the encapsulating film corresponding to the clearing area being an unshielded encapsulating film area; a sealing film disposed on the clearing area and surrounding the encapsulating film; a cover plate disposed on the surface of the encapsulating film and the sealing film facing away from the substrate; and a radiation protection film disposed on the substrate, completely shielding the unshielded encapsulating film area in the thickness direction of the perovskite module encapsulation structure and at least partially exposing the perovskite module. This perovskite module encapsulation structure concentrates the radiation protection film in the most protected position, which not only enhances the protection against space radiation such as ultraviolet rays, high-energy electrons, protons and gamma rays on the exposed edge encapsulation film, but also takes into account the requirements of lightweight encapsulation, light-receiving efficiency and flexible deployment, thereby improving the overall encapsulation integrity and reducing the risk of space medium intrusion.

[0018] This application also provides a method for preparing a perovskite module encapsulation structure, comprising: providing a substrate and preparing a perovskite module on a first surface of the substrate, wherein the first surface is divided into an effective area and a clearing area surrounding the effective area, and the perovskite module completely covers the effective area; forming an encapsulating film and a sealing film on the clearing area, wherein the encapsulating film covers the side surface of the perovskite module and the surface away from the substrate, the portion of the encapsulating film corresponding to the clearing area is an unshielded encapsulating film area, and the sealing film surrounds the encapsulating film; laying a cover plate on the surface of the encapsulating film and the sealing film away from the substrate; before or after forming the encapsulating film, forming a radiation protection film on the substrate in the area corresponding to the clearing area, wherein the radiation protection film completely blocks the unshielded encapsulating film area in the thickness direction of the perovskite module encapsulation structure and exposes at least part of the perovskite module. This preparation method, through the rational arrangement of the process sequence, unifies the protective effect, production line compatibility, and engineering feasibility. It can significantly improve the radiation resistance of the packaging structure edge without fundamentally reconstructing the original perovskite module packaging system, thus making it more suitable for high-efficiency, mass production scenarios in commercial aerospace. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1This is one of the structural schematic diagrams of the perovskite module packaging structure provided in the embodiments of this application; Figure 2 This is a second schematic diagram of the perovskite module packaging structure provided in the embodiments of this application; Figure 3 This is the third schematic diagram of the perovskite module packaging structure provided in the embodiments of this application; Figure 4 This is one of the flowcharts for the fabrication method of the perovskite module packaging structure provided in the embodiments of this application; Figure 5 This is one of the schematic diagrams illustrating the fabrication process of the perovskite module packaging structure provided in the embodiments of this application; Figure 6 This is the second schematic diagram illustrating the fabrication process of the perovskite module packaging structure provided in the embodiments of this application. Figure 7 A second flowchart illustrating the fabrication method of the perovskite module encapsulation structure provided in the embodiments of this application; Figure 8 The third schematic diagram illustrates the fabrication process of the perovskite module packaging structure provided in the embodiments of this application.

[0021] Icons: 10-Perovskite module packaging structure; 11-Substrate; 111-First surface; 1111-Effective area; 1112-Clearing area; 112-Second surface; 12-Perovskite module; 121-Transparent conductive oxide layer; 122-Hole transport layer; 123-Perovskite layer; 124-Electron transport layer; 125-Metal layer; 13-Encapsulation film; 131-Unobstructed encapsulation film area; 14-Sealing film; 15-Cover plate; 16-Radiation protection film. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0023] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. It should be noted that, unless otherwise specified, the various features in the embodiments of this application can be combined with each other, and the combined embodiments are still within the protection scope of this application.

[0024] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0025] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this application is in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0026] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0027] Please refer to Figure 1 and Figure 2 This application provides a perovskite module encapsulation structure 10, comprising: a substrate 11 having a first surface 111 and a second surface 112 opposite to each other, the first surface 111 being divided into an effective area 1111 and a clearing area 1112 surrounding the effective area 1111; a perovskite module 12 disposed on the effective area 1111 of the substrate 11 and completely covering the effective area 1111; and an encapsulating film 13 disposed on the clearing area 1112 of the substrate 11 and covering the sides and opposite sides of the perovskite module 12. On the surface of the base 11, the portion corresponding to the encapsulating film 13 and the edge clearing area 1112 is an unshielded encapsulating film area 131; a sealing film 14 is disposed on the edge clearing area 1112 and surrounds the encapsulating film 13; a cover plate 15 is disposed on the surface of the encapsulating film 13 and the sealing film 14 facing away from the base 11; an anti-radiation protective film 16 is disposed on the base 11, which completely covers the unshielded encapsulating film area 131 in the thickness direction of the perovskite module encapsulation structure 10 and exposes at least part of the perovskite module 12.

[0028] The encapsulation structure uses a substrate 11 as its support. The substrate 11 has a first surface 111 and a second surface 112 arranged opposite to each other. The first surface 111 is used to form the perovskite module 12 and is divided into an effective area 1111 and a clearing area 1112 surrounding the effective area 1111. Here, the "effective area 1111" refers to the area that actually carries the functional films such as the transparent conductive oxide layer 121, hole transport layer 122, perovskite layer 123, electron transport layer 124, and metal layer 125 and undertakes the photoelectric conversion function. The "clearing area 1112" is the encapsulation functional area formed after the edge functional films are removed by laser scribing or a similar film removal process. Its essence is to reduce the risk of edge leakage and reserve process space for subsequent sealing and lamination. A perovskite module 12 is disposed on and completely covers the effective area 1111. An encapsulating film 13 is disposed on the edge-cleaning area 1112 and further covers the sides of the perovskite module 12 and the surface facing away from the substrate 11. A sealing film 14 is disposed on the edge-cleaning area 1112 and surrounds the encapsulating film 13 to form an outer sealing ring. A cover plate 15, as a protective cover, is disposed on the surface of the encapsulating film 13 and the sealing film 14 facing away from the substrate 11, thereby forming a complete encapsulation system. The encapsulating film 13 can be a POE film (polyolefin elastomer film), and the sealing film 14 can be butyl rubber, modified butyl rubber, or other colloids suitable for edge sealing in aerospace encapsulation.

[0029] Since the encapsulating film 13 is not shielded by the functional film layer in the edge clearing area 1112, this part constitutes the unshielded encapsulating film area 131. This area is the weakest part most susceptible to direct exposure to space radiation and most prone to aging and failure. Therefore, the perovskite module encapsulation structure 10 provided in this embodiment of the application has an anti-radiation protective film 16 on the substrate 11, which completely shields the unshielded encapsulating film area 131 in the thickness direction, while at least partially exposing the perovskite module 12. Here, "at least partially exposed" means that the anti-radiation protective film 16 does not completely cover the entire effective power generation area, but rather, in order to fully protect the encapsulating film 13 exposed in the edge clearing area 1112, it provides small-area shielding for the perovskite module 12 adjacent to the encapsulating film 13, thereby avoiding a significant impact on the light-receiving area.

[0030] The perovskite module encapsulation structure 10 described above places the radiation protection film 16 in the most protected position, which not only improves the protection capability against space radiation such as ultraviolet rays, high-energy electrons, protons and gamma rays on the edge-exposed encapsulation film 13, but also takes into account the requirements of lightweight encapsulation, light-receiving efficiency and flexible deployment, thereby improving the overall encapsulation integrity and reducing the risk of space medium intrusion.

[0031] Alternatively, please refer to Figure 2 and Figure 3 The radiation-resistant protective film 16 also completely blocks the sealing film 14 in the thickness direction.

[0032] In the encapsulation structure, the sealing film 14 serves to seal the edges, block moisture, and improve overall airtightness. However, since it is also located at the edge of the encapsulation structure, it is often in a high-risk area for space radiation, atomic oxygen erosion, and thermal cycling stress. The encapsulation structure provided in this application embodiment further completely shields the sealing film 14 in the thickness direction by the radiation-resistant protective film 16, achieving a dual edge protection system that simultaneously protects the edge encapsulation film 13 and the outer sealing film 14. This ensures that both the outermost sealing ring and the unshielded encapsulation film area 131 on the inner side of the encapsulation structure are effectively protected, more effectively mitigating the problems of embrittlement, cracking, debonding, and sealing performance degradation of the sealant under long-term radiation, thereby reducing the risk of moisture intrusion, atomic oxygen erosion, and interlayer debonding caused by edge seal failure. For commercial aerospace perovskite modules 12 that operate in orbit for a long time, especially in low-orbit atomic oxygen environments and high-irradiation environments, this can further improve the reliability of edge encapsulation, enabling the encapsulation structure to maintain good encapsulation integrity and electrical performance stability after long-term service.

[0033] The following are three optional configurations for the radiation protection film 16: Alternatively, please refer to Figure 1 An anti-radiation protective film 16 is disposed between the substrate 11 and the unshielded encapsulation film area 131.

[0034] That is, before the encapsulating film 13 is formed, the radiation protection film 16 is pre-arranged at the corresponding position in the edge clearing area 1112, making it a built-in protective structure sandwiched between the substrate 11 and the subsequent encapsulating film 13. This form is advantageous for achieving protection of the unobstructed encapsulating film area 131 without changing the outer surface contour of the encapsulation structure. It is particularly suitable for collaboration with existing lamination processes, and the film layer position is stable and the appearance is flat.

[0035] Alternatively, please refer to Figure 2 The radiation-resistant protective film 16 covers the area on the second surface 112 of the substrate 11 that corresponds to the clearing area 1112.

[0036] That is, an anti-radiation protective film 16 is provided on the second surface 112 of the substrate 11, in the area corresponding to the projection of the clearing area 1112, to obtain a rear external protective structure. This type of process is flexible and facilitates the radiation resistance enhancement of modules that have already undergone conventional packaging.

[0037] Alternatively, please refer to Figure 3 The radiation-resistant protective film 16 covers the area on the second surface 112 corresponding to the edge clearing area 1112, the area on the surface of the cover plate 15 opposite to the substrate 11 corresponding to the edge clearing area 1112, and the side of the perovskite module encapsulation structure 10.

[0038] That is, radiation protection films 16 are simultaneously provided on the area corresponding to the cleaning area 1112 on the second surface 112 of the substrate 11, the area corresponding to the cleaning area 1112 on the surface of the cover plate 15 opposite to the substrate 11, and the side of the encapsulation structure, thereby forming a wrap-around protective structure around the edge of the encapsulation structure. This method can not only protect the exposed encapsulation film 13 of the top cleaning area 1112, but also protect the sealing film 14 at the side walls and edge corners, making it suitable for high reliability scenarios.

[0039] This embodiment also provides a method for preparing a perovskite module packaging structure; please refer to [reference needed]. Figure 4 ,include: S100: Provide a substrate and prepare a perovskite module on a first surface of the substrate, wherein the first surface is divided into an effective area and a clearing area surrounding the effective area, and the perovskite module completely covers the effective area.

[0040] S200: An encapsulating film and a sealing film are formed on the edge clearing area. The encapsulating film covers the side of the perovskite module and the surface away from the substrate. The part of the encapsulating film corresponding to the edge clearing area is an unobstructed encapsulating film area. The sealing film surrounds the encapsulating film.

[0041] S300: A cover plate is laid on the surface of the encapsulating film and sealing film facing away from the substrate.

[0042] S400: Before or after forming the encapsulating film, an anti-radiation protective film is formed on the substrate in the corresponding area of ​​the clearing area, wherein the anti-radiation protective film completely blocks the unshielded encapsulating film area in the thickness direction of the perovskite module encapsulation structure and exposes at least part of the perovskite module.

[0043] Please refer to the reference. Figure 5 , Figure 6 and Figure 1A substrate 11 is used as a support carrier, and the substrate 11 can be selected from low-iron tempered glass, high borosilicate glass, etc. An effective region 1111 and a clearing region 1112 surrounding the effective region 1111 are defined on the first surface 111 of the substrate 11. A perovskite module 12 is completely fabricated on the effective region 1111, so that the perovskite module 12 only covers the effective region 1111, and the clearing region 1112 is uncovered. The perovskite module 12 may include a transparent conductive oxide layer 121, a hole transport layer 122, a perovskite layer 123, an electron transport layer 124, and a metal layer 125 sequentially stacked on the substrate 11. Subsequently, an encapsulating film 13 and a sealing film 14 are formed on the clearing region 1112, so that the encapsulating film 13 covers the sides of the perovskite module 12 and its surface facing away from the substrate 11, while the sealing film 14 surrounds the encapsulating film 13, and a cover plate 15 is laid on top, thereby forming a complete laminated encapsulation system. The cover plate 15 can be made of polyimide (PI) film, ultra-thin quartz glass, etc. After all the structures are laid out, the encapsulation can be completed by lamination using a laminator.

[0044] The most crucial step in this method is to form a radiation-resistant protective film 16 on the substrate 11 in the area corresponding to the edge clearing region 1112 before or after forming the encapsulating film 13. This film completely blocks the unshielded encapsulating film area 131 in the thickness direction, while at least partially exposing the perovskite module 12. This method is not simply adding a protective step, but rather organically integrating the protective step with the edge clearing, dispensing, film laying, cover plate laying 15, and lamination processes in the perovskite module 12 encapsulation process. This ensures that the protective film is always positioned around the truly vulnerable area, the unshielded encapsulating film area 131. By rationally arranging the process sequence, the protective effect, production line compatibility, and engineering feasibility are unified. This significantly improves the radiation resistance of the encapsulation structure edges without fundamentally reconstructing the original perovskite module 12 encapsulation system, making it more suitable for high-efficiency, mass production scenarios in commercial aerospace.

[0045] Alternatively, please refer to Figure 7 The preparation method includes: S100: Provide a substrate and prepare a perovskite module on a first surface of the substrate, wherein the first surface is divided into an effective area and a clearing area surrounding the effective area, and the perovskite module completely covers the effective area.

[0046] S210: Apply the sealant to the perimeter of the cleaning area to form a sealant film on the cleaning area.

[0047] S410: An anti-radiation protective film is formed on the edge clearing area, wherein one side of the anti-radiation protective film is bonded to the side of the perovskite module and the other side is bonded to the side of the sealant film.

[0048] S220: The encapsulating colloid is laid on the radiation-resistant protective film, and the encapsulating colloid is ensured to completely fill the area enclosed by the sealing film to form an encapsulating film, wherein the encapsulating film covers the sides and the surface away from the substrate of the perovskite module, and the surfaces of the encapsulating film and the sealing film away from the substrate are flush.

[0049] S300: A cover plate is laid on the surface of the encapsulating film and sealing film facing away from the substrate.

[0050] Please refer to the reference. Figure 5 , Figure 8 and Figure 1 The preparation method in this embodiment is a built-in sandwich process path of "first forming a sealing film 14, then laying an anti-radiation protective film 16 on the edge cleaning area 1112, and then forming an encapsulation film 13". Specifically, after preparing the substrate 11 and the perovskite module 12 on it, the sealing colloid is first laid on the periphery of the edge cleaning area 1112 to form a sealing film 14, and then an anti-radiation protective film 16 is formed on the edge cleaning area 1112. One side of the anti-radiation protective film 16 is attached to the side of the perovskite module 12, and the other side is attached to the side of the sealing film 14. That is to say, the anti-radiation protective film 16 is arranged in the transition area between the perovskite module 12 and the outer sealing film 14, forming a transverse bridging layer. It should be noted that the anti-radiation protective film 16 can be prepared in advance and then laid on the surface of the substrate 11, or it can be formed directly on the surface of the substrate 11 by physical deposition or other methods.

[0051] Subsequently, the encapsulating colloid is laid on the radiation-resistant protective film 16, so that the encapsulating colloid completely fills the area enclosed by the sealing film 14 to form the encapsulating film 13, and the upper surfaces of the encapsulating film 13 and the sealing film 14 are flush. The upper surfaces of the encapsulating film 13 and the sealing film 14 can be made flush by performing a surface planarization treatment on their upper surfaces. Finally, a cover plate 15 is laid on the encapsulating film 13 and the sealing film 14.

[0052] The significance of this process arrangement lies in the fact that the radiation-resistant protective film 16 is not simply stacked in the structure, but rather participates in the construction of the entire encapsulation structure as a directional functional layer within the edge clearing area 1112, with its position precisely below the unshielded encapsulation film area 131. In this way, when space radiation is incident along the thickness direction, the protective film can preferentially withstand or weaken the radiation energy, reducing the direct effect of radiation on the encapsulation film 13, while also improving the interface transition state between the encapsulation film 13 and adjacent areas. Since the radiation-resistant protective film 16 forms a bond with both the sides of the perovskite module 12 and the sealing film 14, it can also improve the continuity and integrity of the interface within the edge clearing area 1112 to a certain extent, reducing the risk of local voids, stress concentration, and radiation-induced interface debonding. This solution achieves precise protection of the most sensitive area of ​​the encapsulation film 13 without additionally occupying the effective light-receiving area, making it particularly suitable for commercial aerospace module encapsulation scenarios that balance lightweight design and production line compatibility.

[0053] Furthermore, before forming a radiation-resistant protective film on the cleared area, the method also includes: S510: Preparation of surface-modified nano-cerium dioxide powder and graphene oxide dispersion.

[0054] S520: Mix nano-cerium dioxide powder and graphene oxide dispersion with polyamic acid solution uniformly.

[0055] S530: The mixed solution is uniformly cast onto a glass substrate and then dried in an oven.

[0056] S540: After cooling to room temperature, peel off the glass substrate to obtain a radiation-resistant protective film.

[0057] The formation of a radiation-resistant protective film in the cleared area includes: S411: Lay the radiation-resistant protective film on the cleared area.

[0058] The key to this embodiment is: pre-preparing an anti-radiation protective film 16, and then directly laying the prepared anti-radiation protective film 16 on the cleared edge area 1112 of the first surface 111 of the substrate 11. The laying of the film material must ensure that the film material is completely adhered to the substrate 11 and the transparent conductive oxide layer 121, without bubbles or wrinkles.

[0059] The specific preparation method of the radiation-resistant protective film 16 is as follows: Surface-modified nano-cerium dioxide powder and graphene oxide dispersion are uniformly mixed with a polyamic acid solution, cast into a film, and then heat-treated. After cooling to room temperature, the obtained radiation-resistant protective film 16 is peeled off from the glass substrate. Here, nano-cerium dioxide has good free radical scavenging ability and radiation stability, while graphene oxide is beneficial for improving the shielding performance, structural stability, and interface strengthening ability of the film layer. Both are dispersed together in the polyamic acid system, and after casting and subsequent heat treatment, a composite protective film with polyimide matrix as the main component and both radiation resistance and flexibility can be formed.

[0060] The advantages of using this pre-fabricated membrane are twofold. First, it allows for individual control over thickness, uniformity, nanofiller dispersion, and membrane surface flatness during the membrane preparation stage, ensuring final encapsulation quality at a lower cost. Second, the nano-cerium dioxide and graphene oxide in the membrane efficiently capture free radicals generated by space irradiation, preventing the molecular chains of the encapsulating film 13 from breaking down or cross-linking. Simultaneously, the radiation-resistant protective membrane 16 also possesses a certain degree of airtightness, helping to block harmful media such as space vapor and atomic oxygen, further delaying the aging of the encapsulating film 13 and protecting the perovskite layer 123 from harmful media corrosion. Compared to simply relying on heavy outer coating materials to improve radiation resistance, this solution utilizes a composite functional membrane to precisely reinforce exposed edge areas, which is more conducive to maintaining the overall lightweight characteristics and flexible adaptability of the encapsulation structure. Furthermore, since the membrane is laid before encapsulation, it can be better integrated into the existing mature process of "edge cleaning—dispensing—film laying—lamination," reducing reliance on new specialized equipment and improving the operability of engineering implementation. For commercial space applications, this combination of materials and processes not only meets edge protection requirements but also ensures mass production consistency and reliability in space operations.

[0061] However, since the radiation protection film 16 in this embodiment does not protect the sealant film 14, the sealant film 14 is preferably made of aerospace-grade modified butyl rubber (fluororubber blend modification, radiation resistant type), which can be laid on the periphery of the substrate 11 by dispensing process, with a dispensing width ≥10mm.

[0062] After the membrane material is laid, the laid structure can be placed in a vacuum laminator, with the vacuum level set to ≤10. - The hot pressing temperature is 120~140℃, the hot pressing pressure is 0.3~0.4MPa, the hot pressing time is 4~10min, and a gradient heating method (5℃ / min) is adopted to avoid local thermal stress causing the film layer to debond or generate bubbles, thus completing the encapsulation.

[0063] Optionally, the radiation-resistant protective film 16 has a thickness of 5μm~30μm and a surface density of ≤30g / m², which meets the lightweight requirements of commercial aerospace modules.

[0064] Radiation-resistant protective film 16 meets the following core performance indicators: Resistant to full-spectrum space radiation: withstands electron doses of 100keV~1MeV ≥10¹ 5 e / cm², resistant to 1~100MeV proton irradiation dose ≥10¹²p / cm², resistant to 100~400nm ultraviolet irradiation.

[0065] Interfacial adhesion performance: The interfacial adhesion to the metal layer 125 and the encapsulating film 13 is ≥1.5N / cm, and the adhesion retention rate is ≥70% after 1000 cycles of thermal cycling at -180℃~150℃.

[0066] Vacuum escape characteristics: Total mass loss (TML) ≤5%, volatile condensate (CVCM) ≤0.1%, no low molecular weight volatiles affecting module performance.

[0067] Compatibility requirements: It must not chemically react with the functional layers of the perovskite module 12, and must not release harmful ions.

[0068] Alternatively, the more specific preparation process of the radiation-resistant protective film 16 is as follows: Pretreatment of nano-cerium dioxide: Take high-purity nano-cerium dioxide powder with a particle size ≤50nm, add an appropriate amount of anhydrous ethanol, add 0.5%~1% (relative to the mass of cerium dioxide) of silane coupling agent (such as KH550), and ultrasonically disperse for 30~60min (ultrasonic power 200~300W). Then place it in an oven at 80~100℃ to dry, remove the ethanol, and obtain surface-modified nano-cerium dioxide powder (to avoid particle agglomeration and improve compatibility with PI matrix).

[0069] Graphene oxide pretreatment: Take graphene oxide powder, add N,N-dimethylformamide (DMF) solvent, and ultrasonically disperse for 20~40 min (ultrasonic power 200W) to form a uniform graphene oxide dispersion with a concentration of 0.5~1 mg / mL, for later use (to break up graphene oxide sheet agglomeration and ensure uniform dispersion).

[0070] Preparation of the blend system: Take high-purity PI precursor (polyamic acid PAA), add DMF solvent, and stir to dissolve until a uniform and transparent solution is formed; add 1%~2% of the mass of PI precursor, respectively, the pretreated nano-cerium dioxide powder and graphene oxide dispersion (the mass ratio of cerium dioxide to graphene oxide can be adjusted from 1:1 to 2:1 to suit different radiation resistance requirements), add an appropriate amount of dispersant (such as polyethylene glycol PEG-2000), and use a combination of "ultrasonic dispersion + mechanical stirring": first ultrasonically disperse for 40~60 min, then mechanically stir for 2~3 h (stirring speed 300~500 r / min) to ensure that nano-cerium dioxide and graphene oxide are uniformly dispersed in the PAA solution without obvious agglomeration particles.

[0071] Casting and Doping Curing: The above-mentioned blended solution was uniformly cast onto a clean glass substrate using a casting machine, with the casting thickness controlled at 15~30μm (to meet the final PI film thickness requirement of 10~20μm). The substrate was then dried in an oven using a gradient heating method: 60℃ for 1h (solvent removal) → 120℃ for 1h (further impurity removal) → 200~250℃ for 2h (thermal imidization, promoting PAA conversion to PI), simultaneously achieving uniform doping and fixation of nano-cerium dioxide and graphene oxide in the PI film. After cooling to room temperature, the glass substrate was peeled off to obtain a 10~20μm thick modified PI composite film with uniformly dispersed nano-cerium dioxide and graphene oxide, i.e., radiation-resistant protective film 16.

[0072] The perovskite module packaging structure 10 using the radiation-resistant protective film 16 underwent space irradiation simulation testing (Electronics 10¹). 5 After e / cm² + proton 10¹²p / cm² + UV 1000h, the encapsulating film 13 showed no embrittlement or debonding, with an adhesion retention rate of 85%; the perovskite module 12 retained a photoelectric conversion efficiency of over 90%; after thermal cycling (-180℃~150℃, 1000 cycles), there was no interlayer debonding, and the performance showed no significant degradation.

[0073] Optionally, forming a radiation-resistant protective film on the substrate in the corresponding area of ​​the clearing zone includes: S420: Radiation-resistant protective material is deposited on the substrate in the corresponding area of ​​the clearing zone using physical deposition to form a radiation-resistant protective film.

[0074] Please refer to Figure 2 or Figure 8Another method for forming a radiation-resistant protective film 16 on the substrate 11 is physical deposition. Here, "physical deposition" can encompass processes suitable for forming thin functional layers in localized areas, such as atomic layer deposition, magnetron sputtering, and vacuum evaporation. Compared to pre-laid films, physically deposited protective films are typically thinner and denser, and easier to achieve precise patterned coverage in localized areas, making them particularly suitable for high-precision, low-weight-increase protection of the unobstructed encapsulation film area 131. The radiation-resistant protective film 16 formed through this method can provide protection against ultraviolet radiation, high-energy particles, and other space environment factors without significantly increasing the module's thickness and weight. Furthermore, the dense and continuous film layer helps to further reduce the risk of moisture and active media penetrating inward through the clearing area 1112. The physical deposition process can also control the deposition range, deposition thickness, and film composition to ensure that the radiation-resistant protective film 16 is essentially confined to the area corresponding to the clearing area 1112, thereby avoiding excessive shading of the effective power generation area. This solution is suitable for commercial aerospace modules that require stricter weight control, higher flatness requirements, or higher edge protection precision. It can directly utilize local deposition processes to construct radiation-resistant protective films 16, thereby improving the long-term service capability of edge packaging while maintaining the module's specific power and assembly adaptability.

[0075] More specifically, a mask is placed above the area where the radiation-resistant protective film 16 needs to be formed to precisely define the deposition range of the radiation-resistant protective film 16 and avoid deposition in unnecessary areas. The deposition temperature is then set to 80~120℃ and the deposition pressure to 10. - ³~10 - 5 Pa was used to prepare an Al2O3 layer (30-120 nm thick) using trimethylaluminum (TMA) and water as precursors. After the Al2O3 layer was deposited, keeping the mask in place, a SiO2 layer (20-80 nm thick) was deposited on the surface of the Al2O3 layer using silane (SiH4) and oxygen as precursors, forming an Al2O3 / SiO2 composite radiation-resistant film. After deposition, the mask was removed.

[0076] The Al2O3 / SiO2 radiation-resistant film prepared by physical deposition is dense, pinhole-free, has high bond energy, and strong interfacial adhesion. Combined with a mask, it achieves precise localized protection for the encapsulation film 13 and the sealing film 14, completely covering both. The film layer effectively scatters and attenuates high-energy electrons and protons in the space environment through lattice scattering and energy loss. Utilizing the wide bandgap structure of Al2O3 and SiO2, it absorbs ultraviolet radiation across the entire wavelength range, blocking high-energy particles and ultraviolet light from directly affecting the organic film. This inhibits radiation aging, embrittlement, and degradation of the encapsulation film 13 and the sealing film 14 from the source, reducing radiation damage to the perovskite layer 123 and improving the module's operational stability and service life in the space environment.

[0077] Optionally, forming a radiation-resistant protective film on the substrate in the corresponding area of ​​the clearing zone includes: S430: Apply adhesive to the substrate in the corresponding area of ​​the cleaned edge area and pre-cure the adhesive to form an adhesive layer.

[0078] S440: Cut the radiation protection film into the preset shape and attach it to the adhesive layer.

[0079] Please refer to Figure 2 The third method for forming the radiation-resistant protective film 16 on the substrate 11 involves pre-preparing the radiation-resistant protective film 16 or selecting a commercially available radiation-resistant film layer and bonding it to the corresponding area of ​​the substrate 11. The core of this approach is that it allows for external localized protection enhancement of the encapsulated structure without altering the internal layered structure of the original encapsulation structure, making it particularly suitable for compatibility with existing production lines and encapsulation structures. By pre-cutting the shape of the radiation-resistant protective film 16 and defining the bonding area, the radiation-resistant protective film 16 can cover only the exposed adhesive area corresponding to the clearing area 1112, while keeping the effective power generation area exposed, thus avoiding unnecessary light shading and material waste. The pre-cured adhesive layer helps control adhesive flow, preventing problems such as excess adhesive, wrinkles, localized accumulation, or contamination of the effective area 1111 on the module surface, improving the appearance and smoothness of the finished product. This method of applying a protective film after encapsulation has a significant advantage: it allows for flexible selection of the type, thickness, and coverage of the protective film material based on different orbital irradiance intensities, mission lifespan requirements, and cost budgets, enabling modular and scalable process configurations. For commercial aerospace mass production, this solution does not require reintroducing complex interlayer structures within the module; only surface treatment and attachment steps after encapsulation are needed to achieve enhanced protection. Therefore, it has good manufacturing cycle adaptability and engineering feasibility, enabling direct protection of exposed adhesive film areas at the edges with minimal process modifications, improving the reliability of encapsulated edges during space service, while reducing overall manufacturing complexity and process changeover costs.

[0080] Alternatively, please refer to Figure 3 The adhesive is also applied to the surface of the cover plate 15 opposite to the substrate 11, corresponding to the clearing area 1112, and to the side of the perovskite module encapsulation structure 10.

[0081] In other words, the protective film is not only applied to one outer surface of the module, but extends across the edge corners, from the base 11 side and sidewalls to the corresponding area of ​​the cover plate 15 edge, thus forming a continuous covering layer around the module edge. Since irradiation, atomic oxygen, and thermal cycling stress in the actual space environment do not act in a single direction, edge corners and sidewalls are often high-risk areas for seal failure, interface cracking, and media intrusion. Therefore, localized protection of only a single plane may still leave weak points in some high-reliability scenarios. This solution further extends the coverage of the adhesive layer and protective film to the entire outer perimeter of the edge, which can better suppress the aging and failure of the exposed adhesive film and sealing film 14 due to direct exposure to the space environment. It also helps reduce the risk of interface lifting and debonding caused by thermal stress concentration at corners. For applications in low-Earth orbit environments where atomic oxygen is more active, or where mission life is longer and orbital thermal cycling is more frequent, this encapsulated external protection method can provide stronger protection for the encapsulation structure, thereby further improving the lifespan and reliability of the encapsulation structure.

[0082] Optionally, the radiation-resistant protective film 16 is a radiation-resistant flexible resin film, a fluorinated modified hydrogenated nitrile rubber film, or a perfluoroether rubber film.

[0083] Radiation-resistant flexible resin films typically combine good flexibility, low weight gain, and certain radiation stability, making them suitable for providing basic protection while maintaining module flatness and flexibility. Fluorine-modified hydrogenated nitrile rubber films offer excellent weather resistance, radiation resistance, and mechanical flexibility, making them suitable for applications where both adhesion compatibility and edge coverage reliability are important. Perfluoroether rubber films offer superior resistance to extreme environments, chemical corrosion, and long-term stability, making them suitable for demanding aerospace service conditions.

[0084] When the radiation-resistant protective film 16 uses a radiation-resistant flexible resin film, the film thickness can be selected from 20μm to 50μm, possessing good flexibility and adhesion, and can be adapted to flexible / rigid perovskite modules 12, while meeting the lightweight requirements (area density ≤50g / m²). The radiation-resistant flexible resin film can meet the following core performance indicators: Radiation resistance: Withstands electron radiation doses of 100keV~1MeV ≥10¹ 5 e / cm², tolerance to 1~100MeV proton irradiation dose ≥10¹²p / cm², tolerance to gamma ray dose ≥10 6 No embrittlement or pulverization was observed after 1000h of Gy irradiation with 100~400nm ultraviolet light.

[0085] Resistance to atomic oxygen (for low orbit applications): After an atomic oxygen flux of 10²¹atoms / cm², there is no obvious surface erosion and the thickness loss is ≤5%.

[0086] Adhesion compatibility: The interfacial adhesion with butyl rubber, POE film, and encapsulation material cover plate 15 / substrate 11 is ≥1.8N / cm, and the adhesion retention rate is ≥75% after 1000 cycles of thermal cycling at -180℃~150℃.

[0087] Vacuum escape characteristics: Total mass loss (TML) ≤5%, volatile condensate (CVCM) ≤0.1%.

[0088] When the anti-radiation protective film 16 is made of fluorine-modified hydrogenated nitrile rubber film, optionally, 0.5%~1% (by mass) of nano carbon black and 1%~2% of nano La2O3 are added to the fluorine-modified hydrogenated nitrile rubber film to improve the anti-radiation performance and anti-oxidation performance; the adhesive layer uses aerospace-grade low-emission silane adhesive with a thickness of 5~10μm to ensure that the anti-radiation film is tightly bonded to the module surface and there is no risk of debonding.

[0089] It should be understood that although the steps in the flowchart of this application are shown sequentially as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowchart may include multiple steps or multiple stages, which are not necessarily completed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages in other steps.

[0090] The above description is merely an optional embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A perovskite module package structure, characterized in that, include: The substrate has a first surface and a second surface opposite to each other, the first surface being divided into an effective area and a clearing area surrounding the effective area; A perovskite module is disposed on the effective region of the substrate and completely covers the effective region; An encapsulating film is disposed on the edge clearing area of ​​the substrate and covers the side and the surface of the perovskite module away from the substrate. The portion of the encapsulating film corresponding to the edge clearing area is an unobstructed encapsulating film area. A sealing film is disposed on the cleaned area and surrounds the encapsulation film; A cover plate is disposed on the surface of the encapsulating film and the sealing film facing away from the substrate; An anti-radiation protective film is disposed on the substrate, which completely blocks the unshielded encapsulation film area in the thickness direction of the perovskite module encapsulation structure and exposes at least part of the perovskite module.

2. The perovskite module packaging structure as described in claim 1, characterized in that, The radiation-resistant protective film also completely blocks the sealant film in the thickness direction.

3. The perovskite module packaging structure as described in claim 1, characterized in that, The radiation protection film is disposed between the substrate and the unobstructed encapsulating film area; Alternatively, the radiation-resistant protective film covers the area on the second surface corresponding to the edge-clearing area; Alternatively, the perovskite module packaging structure may further include the radiation-resistant protective film covering the area on the second surface corresponding to the edge clearing area, the cover plate on the surface away from the substrate corresponding to the edge clearing area, and the side of the perovskite module packaging structure.

4. A method for preparing a perovskite module packaging structure, characterized in that, include: A substrate is provided, and a perovskite module is prepared on a first surface of the substrate, wherein the first surface is divided into an effective area and a clearing area surrounding the effective area, and the perovskite module completely covers the effective area; An encapsulating film and a sealing film are formed on the edge clearing area, wherein the encapsulating film covers the side and the surface away from the substrate of the perovskite module, the portion of the encapsulating film corresponding to the edge clearing area is an unobstructed encapsulating film area, and the sealing film surrounds the encapsulating film. A cover plate is laid on the surface of the encapsulating film and the sealing film facing away from the substrate; Before or after forming the encapsulating film, an anti-radiation protective film is formed on the substrate in the area corresponding to the edge clearing area, wherein the anti-radiation protective film completely blocks the unshielded encapsulating film area in the thickness direction of the perovskite module encapsulation structure and exposes at least part of the perovskite module.

5. The method for preparing the perovskite module packaging structure as described in claim 4, characterized in that, include: A substrate is provided, and a perovskite module is prepared on a first surface of the substrate, wherein the first surface is divided into an effective area and a clearing area surrounding the effective area, and the perovskite module completely covers the effective area; The sealant is applied to the perimeter of the cleaning area to form a sealant film on the cleaning area; An anti-radiation protective film is formed on the cleared area, wherein one side of the anti-radiation protective film is attached to the side of the perovskite module and the other side is attached to the side of the sealant film; An encapsulating colloid is laid on the radiation-resistant protective film, and the encapsulating colloid is ensured to completely fill the area enclosed by the sealing film to form an encapsulating film, wherein the encapsulating film covers the side surface of the perovskite module and the surface away from the substrate, and the surfaces of the encapsulating film and the sealing film away from the substrate are flush. A cover plate is laid on the surface of the encapsulating film and the sealing film facing away from the substrate.

6. The method for preparing the perovskite module packaging structure as described in claim 5, characterized in that, Before forming the radiation-resistant protective film on the cleared area, the method further includes: Preparation of surface-modified nano-cerium dioxide powder and graphene oxide dispersion; The nano-cerium dioxide powder and graphene oxide dispersion were uniformly mixed with the polyamic acid solution; The mixed solution is uniformly cast onto a glass substrate and then placed in an oven to dry. After cooling to room temperature, the glass substrate is peeled off to obtain a radiation-resistant protective film; The formation of the radiation-resistant protective film on the clearing area includes: The radiation-resistant protective film is laid on the cleaned area.

7. The method for preparing the perovskite module packaging structure as described in claim 4, characterized in that, The step of forming an anti-radiation protective film on the substrate in the corresponding area of ​​the edge clearing zone includes: Radiation-resistant material is deposited on the substrate in the corresponding area of ​​the clearing zone using physical deposition to form a radiation-resistant film.

8. The method for preparing the perovskite module packaging structure as described in claim 4, characterized in that, The step of forming an anti-radiation protective film on the substrate in the corresponding area of ​​the edge clearing zone includes: The adhesive is applied to the substrate in the corresponding area of ​​the cleaned edge area, and the adhesive is pre-cured to form an adhesive layer; The radiation-resistant protective film is cut into a preset shape and then pasted onto the adhesive layer.

9. The method for preparing the perovskite module packaging structure as described in claim 8, characterized in that, The adhesive is also applied to the area corresponding to the clearing zone on the surface of the cover plate away from the substrate, and to the side of the perovskite module encapsulation structure.

10. The method for preparing the perovskite module packaging structure as described in claim 8, characterized in that, The radiation-resistant protective film is a radiation-resistant flexible resin film, a fluorinated modified hydrogenated nitrile rubber film, or a perfluoroether rubber film.

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