Droplet placement apparatus, droplet placement method, and display device manufacturing method

Abstract

This application relates to a droplet placement apparatus, a droplet placement method, and a method for manufacturing a display device. Some embodiments of the droplet placement apparatus include: a substrate holder configured to hold a plurality of substrates spaced apart from each other; a discharge head configured to discharge droplets; a scanning mechanism configured to move the substrate holder relative to the discharge head to continuously scan a region comprising the plurality of substrates relative to the discharge head; an alignment measuring device configured to measure an alignment error of the plurality of substrates held by the substrate holder; and a controller configured to control the discharge head and the scanning mechanism based on the alignment error measured using the alignment measuring device to deliver droplets to a plurality of target locations on the respective substrates during a period in which the region is continuously scanned by the scanning mechanism.

Description

Technical Field

[0001] This disclosure relates to a droplet placement device, a droplet placement method, and a method for manufacturing a display device. Background Technology

[0002] Patterning on substrates has been attempted using a droplet placement device that supplies liquid material for functional elements as droplets onto the substrate via inkjet printing. Patterning using this droplet placement device offers advantages such as high material utilization efficiency due to on-demand patterning, relatively compact manufacturing equipment due to non-vacuum processing, and the ability to rapidly coat large areas. The droplet placement device can be used, for example, to manufacture display devices such as flat panel displays. These display devices can be, for example, those using organic electroluminescent (EL) elements (OLEDs). Since organic EL materials used to form OLEDs are expensive, it is advantageous to use a droplet placement device that can rapidly coat large areas of material with high material utilization efficiency. In the manufacturing process of organic EL elements, light-emitting element sections can be manufactured after the formation of thin-film transistor (TFT) elements and then by dicing a substrate into multiple sections. It is desirable to process even such diced substrates with high productivity.

[0003] Japanese Patent 4876993 discloses a method for coating functional droplets onto two workpieces. According to this method, a process of coating functional droplets with an even number of scans is performed on one workpiece, and then a process of coating functional droplets with an even number of scans is performed on the other workpiece.

[0004] The problem with the method described in Japanese Patent 4876993 is that it is inefficient because the processing is performed on one workpiece and then the processing on another workpiece is started. Summary of the Invention

[0005] Embodiments of this disclosure provide techniques that facilitate improving the efficiency of a process for placing droplets onto two spaced-apart substrates.

[0006] A first aspect of this disclosure provides a droplet placement apparatus, comprising: a substrate holder configured to hold a plurality of substrates spaced apart from each other; a discharge head configured to discharge a droplet; a scanning mechanism configured to move the substrate holder relative to the discharge head to continuously scan a region comprising the plurality of substrates relative to the discharge head; an alignment measuring device configured to measure an alignment error of the plurality of substrates held by the substrate holder; and a controller configured to control the discharge head and the scanning mechanism based on the alignment error measured using the alignment measuring device, so as to deliver a droplet to a plurality of target locations on the respective substrates during a period in which the region is continuously scanned by the scanning mechanism.

[0007] A second aspect of this disclosure provides a droplet placement method comprising: measuring an alignment error of a plurality of substrates held by a substrate holder; and controlling the discharge of a droplet from a discharge head based on the measured alignment error, thereby providing the droplet to a plurality of target locations on each substrate while continuously scanning a region comprising the plurality of substrates spaced apart from each other.

[0008] A third aspect of this disclosure provides a method for manufacturing a display device, comprising: placing droplets onto various substrates using a droplet placement apparatus as defined in the first aspect of this disclosure; and processing each substrate on which droplet placement has been performed, thereby obtaining a display device.

[0009] The features of various embodiments will become apparent from the following description of embodiments with reference to the accompanying drawings. The following description of the embodiments is given by way of example. Attached Figure Description

[0010] Figure 1 This is a schematic view illustrating the construction of a manufacturing apparatus according to the first embodiment.

[0011] Figure 2 This is a schematic view illustrating the construction of the droplet placement device according to the first embodiment.

[0012] Figure 3 This is a schematic diagram of the substrate stage of the droplet placement device according to the first embodiment when viewed from above.

[0013] Figure 4 This is a functional block diagram of the stage controller of the droplet placement device according to the first embodiment.

[0014] Figure 5 This is a functional block diagram of the controller according to the first embodiment.

[0015] Figure 6 This is a flowchart illustrating the operation sequence of the droplet placement device according to the first embodiment.

[0016] Figure 7 This is a flowchart illustrating the measurement sequence according to the first embodiment.

[0017] Figure 8 This is a flowchart illustrating the discharge preparation sequence according to the first embodiment.

[0018] Figure 9 This is a schematic view illustrating the operation of the substrate stage during droplet placement processing according to the droplet placement apparatus of the first embodiment.

[0019] Figure 10 This is a schematic view illustrating the operation of the substrate stage during droplet placement processing according to the droplet placement apparatus of the first embodiment.

[0020] Figures 11A to 11C This is a view illustrating the operation of the substrate stage in a measurement sequence according to the first embodiment.

[0021] Figure 12A and Figure 12B This is a view used to explain the process of reflecting alignment calculation results in each pixel in the droplet placement device according to the first embodiment.

[0022] Figures 13A to 13C This is a view illustrating the relationship between the alignment error in the X-axis direction (non-scanning direction) and the use of the nozzle in the droplet placement device according to the first embodiment.

[0023] Figure 14 This is a schematic diagram of the substrate stage of the droplet placement device according to the first embodiment when viewed from above.

[0024] Figure 15 This is a schematic view illustrating the operation of the substrate stage during droplet placement processing according to the droplet placement apparatus of the first embodiment.

[0025] Figure 16 This is a functional block diagram of the controller according to the second embodiment.

[0026] Figure 17 This is a view schematically illustrating the operation of the substrate stage during a droplet placement process performed by the droplet placement apparatus according to the second embodiment.

[0027] Figure 18 This is a view illustrating the shift components SX and SY of the alignment error.

[0028] Figure 19 This is a view illustrating the shift component Sθ of the alignment error.

[0029] Figure 20 This is a view illustrating the magnification component MX of the alignment error.

[0030] Figure 21 This is a view illustrating the magnification component MY of the alignment error.

[0031] Figure 22 This is a view illustrating the deformation component DR of the alignment error.

[0032] Figure 23 This is a view illustrating the deformation component Yaw of the alignment error. Detailed Implementation

[0033] In the following, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments are not intended to limit the scope of the claims. Several features are described in the embodiments, but not all of these features are necessary, and multiple such features may be suitably combined. Furthermore, in the drawings, the same reference numerals are given to the same or similar constructions, and redundant descriptions are omitted.

[0034] In the following description, the ordinal numbers attached to terms representing elements such as components or data (such as the first substrate and the second substrate) are used only to distinguish multiple elements from each other and do not represent order or superiority, unless otherwise expressly specified.

[0035] In the manufacturing process of organic EL displays (OLED displays), large substrates, such as G6 substrates (1,850 mm × 1,500 mm) or G8 substrates (2,500 mm × 2,200 mm), are available. The substrate can be appropriately selected from glass substrates, plastic substrates, etc., depending on the target article to be manufactured. The substrate is typically a plate-shaped component, but its form is not limited to a specific form, as long as the component can be used as a substrate, and the component can be, for example, a deformable film. In the manufacturing of OLED display devices, for purposes such as improving panel manufacturing efficiency and yield, G6 or G8 substrates can be segmented and processed during the manufacturing process.

[0036] Figure 1 The structure of the manufacturing apparatus 100 according to the first embodiment is schematically shown. Figure 1 The manufacturing apparatus 100 shown can be used, for example, to manufacture display devices such as organic EL display devices. The manufacturing apparatus 100 may include, for example, a pretreatment apparatus 21, a substrate transfer robot 23, a substrate transfer path 24, a droplet placement apparatus 1, and a post-processing apparatus 22. Substrates 2A and 2B are intermediate products of the display device manufactured or processed by the manufacturing apparatus 100, and may be substrates obtained, for example, by splitting a G6 or G8 substrate in half. Substrates 2A and 2B can be transferred between the pretreatment apparatus 21, the substrate transfer robot 23, the droplet placement apparatus 1, and the post-processing apparatus 22 via the substrate transfer path 24. When manufacturing an organic EL display, the pretreatment apparatus 21 may be a vapor deposition apparatus for forming an organic layer, the droplet placement apparatus 1 may be a sealing apparatus for forming a sealing layer, and the post-processing apparatus 22 may be a UV curing apparatus or a CVD apparatus, but they are not limited to these examples.

[0037] The preprocessing unit 21 can be configured to divide a substrate into multiple substrates (in this example, two substrates 2A and 2B) and process each substrate 2A and 2B. The divided substrates 2A and 2B can also be supplied to the preprocessing unit 21, and processed by the preprocessing unit 21. Substrate 2A and 2B are examples of multiple substrates and will also be referred to hereinafter as multiple substrates 2A and 2B. The substrates 2A and 2B processed by the preprocessing unit 21 can be mounted on the hand 23A of the substrate transfer robot 23. The spacing between substrates 2A and 2B on the hand 23A can be adjusted in the preprocessing unit 21 to be equal to the spacing between substrate chuck 8A and substrate chuck 8B (described later). The substrate transfer robot 23 can load substrates 2A and 2B into the droplet placement device 1 in a single operation, and the droplet placement device 1 can place droplets on each substrate 2A and 2B. Substrates 2A and 2B processed in the droplet placement device 1 can be unloaded from the droplet placement device 1 by the substrate transfer robot 23 in a single operation and can be loaded into the post-processing device 22. Note that the pre-processing device 21, the substrate transfer robot 23, the droplet placement device 1 and the post-processing device 22 can communicate with each other via a communication channel (not shown), and communicate operation information, the transfer timing of each substrate and information about each substrate.

[0038] Figure 2 The structure of the droplet placement device 1 is schematically shown. In this specification and accompanying drawings, orientation is represented in the XYZ coordinate system, wherein a plane parallel to the planes on which the substrates 2A and 2B are arranged is defined as the XY plane, as shown below. Figure 2 As shown. The droplet placement device 1 may include a substrate stage (substrate holder) 3 that holds a plurality of substrates 2A and 2B. The substrate stage 3 may include a plurality of substrate chucks 8A and 8B that hold the plurality of substrates 2A and 2B respectively. Substrates 2A and 2B may each have pixel array regions 201A and 201B. Pixel array regions 201A and 201B are regions that form a plurality of pixels. The droplet placement device 1 may be configured to place a plurality of droplets in each pixel array region 201A and 201B. The plurality of droplets may be placed separately from each other, at least two droplets may be placed together, or the plurality of droplets may be placed to form a liquid film.

[0039] The droplet placement device 1 may include: a discharge head 5 that discharges droplets 4 of ink (liquid material) to place the droplets at multiple target locations on various substrates 2A and 2B; an ink supply system 6 that supplies ink to the discharge head 5; and an ink reservoir 7 that stores ink. The discharge head 5 may include, for example, multiple nozzles arranged in a two-dimensional manner in the X-axis and Y-axis directions. The discharge of droplets 4 from the nozzles of the discharge head 5 can be individually controlled to place droplets 4 at multiple target locations in the pixel array region 201A of substrate 2A and the pixel array region 201B of substrate 2B.

[0040] The droplet placement device 1 may include a scanning mechanism 14 that moves the substrate stage 3 relative to the discharge head 5 to continuously scan the substrate stage 3 relative to the discharge head 5. The substrate stage 3 is configured to hold a plurality of substrates 2A and 2B via a plurality of substrate chucks 8A and 8B. The substrate stage 3 is continuously scanned relative to the discharge head 5, thereby continuously scanning the area comprising the plurality of substrates 2A and 2B relative to the discharge head 5. Therefore, the scanning mechanism 14 can be understood as a mechanism that moves the substrate stage 3 relative to the discharge head 5 to continuously scan the area comprising the plurality of substrates 2A and 2B relative to the discharge head 5. Instead of moving the substrate stage 3, the discharge head 5 can be moved to continuously scan the substrate stage 3 relative to the discharge head 5.

[0041] When substrates 2A and 2B are mounted on substrate chucks 8A and 8B on substrate stage 3, corresponding alignment errors may occur. After substrates 2A and 2B undergo various manufacturing processes, shape deformation may occur in substrates 2A and 2B in the X-axis and Y-axis directions. Note that even shape deformation of substrates 2A and 2B will still result in alignment errors when substrates 2A and 2B are mounted on substrate chucks 8A and 8B. In this specification, the error in the ideal position and ideal shape of substrates 2A and 2B relative to the substrates when mounted on substrate chucks 8A and 8B will be expressed as alignment error. The droplet placement apparatus 1 may include an alignment measuring device 9 for measuring the alignment error of substrates 2A and 2B. The alignment measuring device 9 may include a low-magnification optical system with a wide field of view for detecting alignment marks, and a high-magnification optical system with a narrow field of view for detecting alignment marks. To simultaneously or in parallel measure the marks of each substrate 2A and 2B, or multiple marks of each substrate, the droplet placement apparatus 1 may include multiple alignment measuring devices 9.

[0042] Because substrates 2A and 2B may have thickness variations, the supply position (landing position) of the droplet 4 on substrates 2A and 2B will vary due to these thickness variations. Therefore, the droplet placement device 1 may include a height sensor 10 to measure the position (height) of substrates 2A and 2B in the Z-axis direction. The results (alignment error and height) measured by the alignment measuring device 9 and the height sensor 10 can be stored in the controller 11. When substrates 2A and 2B are referred to as substrate 2 without distinction, they will be referred to as pixel array regions 201 and 201B without distinction.

[0043] The controller 11 can generate discharge control information for controlling the discharge of droplets 4 to said multiple target locations (the locations where droplets should be placed) based, for example, on a patterned image representing a pixel array region 201 of the substrate 2. The patterned image is, for example, a two-dimensional array of data where each target location is "1" and the remaining locations are "0". The discharge control information may include an image where each pixel corresponds to a supplyable droplet coordinate, for example, a two-dimensional array of data where each target location is "1" and the remaining locations are "0". The controller 11 can control the discharge head 5 and the scanning mechanism 14 to supply droplets 4 to the multiple target locations on the respective substrates 2A and 2B.

[0044] The scanning mechanism 14 can control the substrate stage 3 about the X-axis, Y-axis, Z-axis, and θ-axis. Here, the θ-axis is rotation about the Z-axis. Rotation, as used below, refers to rotation about the θ-axis. The droplet placement device 1 may include a stage controller 12 operating under the control of the controller 11, and the stage controller 12 can control the substrate stage 3 about the X-axis, Y-axis, Z-axis, and θ-axis. The stage controller 12 can be considered part of the controller 11. The controller 11 or the stage controller 12 can control the discharge head 5 and the scanning mechanism 14 during a period of continuous scanning of the substrate stage 3 by the scanning mechanism 14 to provide droplets 4 to multiple target locations on the respective substrates 2A and 2B. This period includes, for example, an acceleration period, a constant speed period following the acceleration period, and a deceleration period following the constant speed period.

[0045] The droplet placement device 1 may include an interface 13. Interface 13 can be understood as a unit that manages operational information for the droplet placement device 1. Upon receiving operation information from the pretreatment device 21, a higher-level control device (not shown), etc., interface 13 can send the operation information to the controller 11. In response to the operation information received from the pretreatment device 21, the higher-level control device (not shown), etc., interface 13 can instruct the controller 11 to begin operation. Interface 13 may have the function of receiving information indicating the placement positions of multiple droplets placed on substrates 2A and 2B, as well as information regarding the alignment of substrates 2A and 2B, or editing such information.

[0046] Figure 3 This is a schematic diagram of the substrate stage 3 as viewed from the top. Figure 3 Substrates 2A and 2B are shown mounted on substrate chucks 8A and 8B. Substrate 2A has a pixel array region 201A and an alignment mark 202A. Substrate 2B has a pixel array region 201B and an alignment mark 202B. Pixel array regions 201A and 201B have multiple pixels, and each pixel may have sub-pixels, such as R, G, and B sub-pixels. At least one of the multiple substrates 2A and 2B may have multiple pixel array regions arranged spaced apart from each other.

[0047] Figure 3 The diagram schematically illustrates the state in which the substrate stage 3 is scanned along the positive Y-axis. Position 203A on substrate 2A is the position where droplets are placed, coated, or ejected into pixel array region 201A. Position 203B on substrate 2B is the position where droplets are placed, coated, or ejected into pixel array region 201B. When the substrate stage 3 is scanned along the negative Y-axis, positions 203A and 203B change to other positions.

[0048] exist Figure 3 In the example shown, four alignment marks 202A are provided on substrate 2A, and four alignment marks 202B are provided on substrate 2B. However, only two or more alignment marks need to be provided on each substrate. Of course, more alignment marks can be provided to measure the deformation of the substrate with higher accuracy. When four alignment marks are provided on each substrate, the displacement components SX, SY, and Sθ; the magnification components MX and MY; and the deformation components DR and Yaw can be measured as alignment errors.

[0049] Reference Figures 18 to 23 To explain the components of alignment error. In Figures 18 to 23 In the diagram, dashed lines represent ideal shapes, while solid lines represent shapes with alignment errors. Figure 18 The shift components SX and SY are illustrated. Figure 19 The shift component Sθ is illustrated. Figure 20 The scaling factor MX is illustrated. Figure 21 The multiplier component MY is shown as an example. Figure 22 The deformation component DR is illustrated. Figure 23 The deformation component Yaw is illustrated.

[0050] Figure 4This is a functional block diagram of the stage controller 12. The stage controller 12 controls the substrate stage 3 by controlling the scanning mechanism 14. The stage controller 12 may consist of one or more processors. The measurement device signal 310 is a signal provided from a measurement device (not shown), such as a laser interferometer or encoder, and is, for example, a pulse signal corresponding to the position of the substrate stage 3. The measurement device signal 310 may include multiple signals for the various axes of the substrate stage 3.

[0051] The measurement controller 330 can, for example, count the pulses of the measurement device signal 310, convert them into a stage position 320 representing the position of the substrate stage 3, and provide the stage position 320 to the control calculator 331 and the comparator 333 at predetermined intervals. The control calculator 331 can perform compensation calculations based on the deviation between the target drive position 302 and the current stage position 320, generate a control output 321, and provide it to the motor driver 332. The compensation calculation is, for example, a PID calculation. The motor driver 332 generates a motor current 311 for driving the motor of the scanning mechanism 14 based on the control output 321, and supplies the motor current 311 to the motor. The motor is, for example, a servo motor. With this configuration, feedback control of the substrate stage 3 can be achieved.

[0052] Comparator 333 is a device for monitoring the position of the substrate stage 3. Comparator 333 compares the current stage position 320 with a first discharge start position 301A and a second discharge start position 301B provided by controller 11. When stage position 320 and the first discharge start position 301A coincide, comparator 333 outputs a discharge start signal (first discharge start signal) 300. Additionally, when stage position 320 and the second discharge start position 301B coincide, comparator 333 outputs a discharge start signal (second discharge start signal) 300. Figure 3 In the example, comparator 333 outputs a discharge start signal 300 in response to a coincidence between stage position 320 and the first discharge start position 301A, and then comparator 333 outputs a discharge start signal 300 in response to a coincidence between stage position 320 and the second discharge start position 301B. Outputting the discharge start signal 300 can mean that the level of the signal line used to transmit the discharge start signal 300 becomes an active level. Alternatively, outputting the discharge start signal 300 can mean that a command is output to the signal line used to transmit the discharge start signal 300.

[0053] Figure 5 This is a functional block diagram of controller 11. Controller 11 can consist of one or more processors. Job data 363 and job start signal 360 are provided from interface 13. Upon receiving job start signal 360, sequence controller 340 begins processing the sequence. (See later...) Figure 6The flowchart describes the operation of the sequence controller 340.

[0054] Image processor 341 acquires images generated by capturing alignment marks 202A and 202B respectively disposed on substrates 2A and 2B using alignment measuring device 9. Then, image processor 341 calculates the displacement of alignment marks 202A and 202B relative to their reference positions based on pre-recorded feature point information. The process of calculating the alignment mark displacement may include coarse measurement processing (predicted amount) using a low-magnification optical system of alignment measuring device 9, and may include fine detection processing (fine measurement) using a high-magnification optical system.

[0055] The alignment calculator 343 calculates multiple components of the alignment error of substrates 2A and 2B based on the displacement of each alignment mark calculated by the image processor 341. These multiple components may be displacement components SX, SY, and Sθ, magnification components MX and MY, and deformation components DR and Yaw. The multiple components of the alignment error calculated by the alignment calculator 343 are stored in a storage device as an alignment calculation result 353.

[0056] The original image generator 342 generates a discharge pattern original image 350 as the original image for controlling the discharge of droplets from the discharge head 5. More specifically, the original image generator 342 converts data in units of length (e.g., the size or resolution of the pixel array region 201A or 201B specified by the job data 363) into data in units of time with respect to the discharge timing of each droplet. That is, the original image generator 342 generates data about the time obtained by dividing the placement position (landing position) of each droplet by the scanning speed. The generated data may include discharge frequency, inter-discharge delay, etc., and may also include waveform data representing the waveform of the drive element supplied to each nozzle of the discharge head 5 during droplet discharge. This data is stored in a storage device as the discharge pattern original image 350. Note that the data generated by the original image generator 342 is discharge timing data representing the ideal pixel array region shape (excluding substrate placement errors, substrate deformation caused by processing, etc.).

[0057] The discharge image generator 344 converts the original discharge pattern image 350, used as the discharge timing for each pixel array region, into the discharge timing for each substrate, and corrects the discharge timing for each substrate based on the alignment calculation result 353. The correction based on the alignment calculation result 353 can be performed on a per-pixel or per-pixel group basis. Alignment errors for each pixel in the Y-axis direction (used as the scanning direction) can be corrected by adjusting the discharge timing, and alignment errors in the X-axis direction (used as the non-scanning direction) can be corrected by selecting the position of the substrate stage 3 in the X-axis direction and / or the nozzle of the discharge head 5. The discharge image generator 344 generates a first discharge pattern image 351 for the first substrate 2A and a second discharge pattern image 352 for the second substrate 2B, and stores them in a storage device. (See later for reference.) Figure 12A and Figure 12B Describe the details of the output image generator 344.

[0058] The discharge controller 345 supplies a discharge control signal 362 to the discharge head 5. The discharge controller 345 generates the discharge control signal 362 based on a first discharge pattern image 351 for the first substrate 2A and a second discharge pattern image 352 for the second substrate 2B. According to the discharge start signal 300, the discharge controller 345 can switch between generating the discharge control signal 362 based on the first discharge pattern image 351 for the first substrate 2A and the second discharge pattern image 352 for the second substrate 2B. When the substrate stage 3 is scanned along the Y-axis in the positive direction, as... Figure 3 As illustrated, droplets are applied (printed) sequentially on substrates 2A and 2B. Based on the discharge start signal 300, the discharge controller 345 switches from a first discharge pattern image 351 for the first substrate 2A to a second discharge pattern image 352 for the second substrate 2B. Conversely, when the scanning direction is along the negative Y-axis, droplets are applied (printed) sequentially on substrates 2B and 2A. Based on the discharge start signal 300, the discharge controller 345 switches from the second discharge pattern image 352 for the second substrate 2B to the first discharge pattern image 351 for the first substrate 2A. (See later...) Figure 10 A detailed example explaining the switching process.

[0059] Figure 6This is a flowchart illustrating the operation sequence of the droplet placement device 1. This operation sequence is controlled by a sequence controller 340. In step S1-1, the sequence controller 340 receives job data 363 and a job start signal 360 from interface 13, and the sequence controller 340 starts the job in response to them. In step S1-2, the sequence controller 340 instructs the original image generator 342 to generate an original image 350 of the discharge pattern. Based on the job data 363, the sequence controller 340 sets the number of scans required to complete the placement of droplets onto substrates 2A and 2B. When the number of scans is multiple, the sequence controller 340 controls the discharge head 5 and the scanning mechanism 14 to complete the discharge of droplets from multiple substrates 2A and 2B through multiple scans by the scanning mechanism 14.

[0060] In steps S1-3, the sequence controller 340 controls the substrate transfer robot 23 to load substrates 2A and 2B into the droplet placement device 1. In one example, substrates 2A and 2B are held by the hand 23A of the substrate transfer robot 23 at the same Y-axis spacing as the substrate chucks 8A and 8B, and are transferred to the substrate chucks 8A and 8B via a substrate transfer mechanism (not shown). When transferring substrates 2A and 2B, corresponding placement errors occur for each substrate 2A and 2B, therefore, alignment errors need to be corrected for each substrate 2A and 2B.

[0061] In steps S1-4, the sequence controller 340 uses the height sensor 10 to measure the heights of substrates 2A and 2B. In one example, the sequence controller 340 uses the height sensor 10 to measure the heights of substrates 2A and 2B at measurement positions set by the job data 363. Note that the height of each substrate 2 can also be measured at multiple measurement positions, and the average of the obtained measurements can be set as the height of substrate 2.

[0062] When measuring the heights of individual substrates 2A and 2B at a single measurement location, the positional correction amount of substrates 2A and 2B in the Z-axis direction can be obtained using the following equation. Let H be the ideal height of substrates 2A and 2B as expected by the height sensor 10, Ha be the actual height measurement of substrate 2A by the height sensor 10, Hb be the height measurement of substrate 2B, and vd be the velocity of droplet 4. Then, the correction amount dZa of substrate 2A in the Z-axis direction of the substrate stage 3 is given by the following formula:

[0063] .

[0064] If a height difference exists between substrates 2A and 2B when correcting the amount of correction of substrate 2A in the Z-axis direction along the substrate stage 3, the height of substrate 2B is corrected by adjusting the delay time of the discharge timing of droplet 4 from discharge head 5 based on the height difference between substrates 2A and 2B. The correction delay time DelayZb of substrate 2B in the Z-axis direction is given by the following formula:

[0065] .

[0066] The calculation results can be provided to the alignment calculator 343 so that the alignment error components of other axes can be corrected together.

[0067] In steps S1-5, the sequence controller 340 executes a sequence of measurements of the alignment errors of substrates 2A and 2B. (See later...) Figure 7 The flowchart explains the details of the alignment error measurement sequence. In steps S1-6, the sequence controller 340 performs droplet ejection preparation on substrates 2A and 2B. (See below for further details.) Figure 8 The details of this process will be explained below. In steps S1-7, the sequence controller 340 performs droplet ejection (positioning) processing on substrates 2A and 2B. (See below for further details.) Figure 8 and Figure 9 The details of this process are explained below. In steps S1-8, the sequence controller 340 determines whether the scan for the number of scans set in step S1-2 has ended. If the scan has not ended, the sequence controller 340 repeats steps S1-6 and S1-7; if the scan has ended, the sequence controller 340 proceeds to step S1-9.

[0068] In steps S1-9, the sequence controller 340 controls the substrate transfer robot 23 to unload substrates 2A and 2B from the droplet placement device 1. The unloaded substrates 2A and 2B are then transferred by the substrate transfer robot 23 to the post-processing device 22.

[0069] In steps S1-10, the sequence controller 340 determines whether the process specified by the job data has been completed. If the process has not been completed, the sequence controller 340 returns to step S1-3; if the process has been completed, the sequence controller 340 proceeds to step S-11 to terminate the job.

[0070] Reference Figure 7Explanation of the alignment error measurement sequence (steps S1-5). The alignment error measurement sequence can be executed by the sequence controller 340 using the image processor 341 and alignment calculator 343 of the controller 11. In step S2-1, the sequence controller 340 performs a coarse measurement process (predictive amount) using the low-magnification optical system of the alignment measuring device 9. In the coarse measurement process, firstly, the sequence controller 340 moves the substrate stage 3 to a position where the alignment mark 202A of the substrate 2A can be observed by the alignment measuring device 9. At this time, the placement error of the substrate 2A when mounted on the substrate stage 3 is not considered. Therefore, the sequence controller 340 uses the low-magnification optical system of the alignment measuring device 9 to capture images of the alignment mark 202A over a wide range on the substrate 2A. The image processor 341 processes the captured images to calculate the displacement of the substrate 2A. Furthermore, the sequence controller 340 corrects the position of the substrate stage 3 about the X-axis, Y-axis, and θ-axis based on the calculated displacement. The substrate stage 3 is driven by setting the target drive position 302 for the stage controller 12. As a result, the alignment mark 202A can be observed by the high-magnification optical system of the alignment measuring device 9.

[0071] In step S2-2, the sequence controller 340 performs a fine measurement process (fine measurement) using the high-magnification optical system of the alignment measuring device 9. In the fine measurement process, the sequence controller 340 captures the alignment marks 202A of the substrate 2A using the high-magnification optical system of the alignment measuring device 9, and the image processor 341 calculates the precise value of the displacement of each alignment mark of the substrate 2A based on the captured image.

[0072] In step S2-3, the sequence controller 340 performs a fine measurement process (fine measurement) on the substrate 2B using the high-magnification optical system of the alignment measurement device 9. More specifically, first, the sequence controller 340 moves the substrate stage 3 to a position where the alignment marks 202B of the substrate 2B can be observed by the alignment measurement device 9. Then, the sequence controller 340 captures images of the alignment marks 202B of the substrate 2B using the high-magnification optical system of the alignment measurement device 9, and the image processor 341 calculates the precise value of the displacement of each alignment mark of the substrate 2B based on the captured images. Note that when the droplet placement device 1 includes multiple alignment measurement devices so that the alignment marks 202A and 202B of the substrates 2A and 2B can be observed simultaneously, steps S2-2 and S2-3 can be executed in parallel.

[0073] In step S2-4, the sequence controller 340 determines the result of the image processing performed by the image processor 341 in the fine measurement process of step S2-3. If the result of the image processing is good, that is, if the displacement of the alignment mark 202B of the substrate 2B has been properly measured, the sequence controller 340 proceeds to step S2-8; if it is bad, it proceeds to step S2-5. The reason why the displacement of the alignment mark 202B of the substrate 2B has not been properly measured is that the displacement of the substrate 2B relative to the substrate 2A is too large and the alignment mark 202B does not fall within the field of view (image capture range) of the high-magnification optical system.

[0074] In steps S2-5, the sequence controller 340 performs a coarse measurement (predictive measurement) of the alignment mark 202B on the substrate 2B using the low-magnification optical system of the alignment measurement device 9. More specifically, the sequence controller 340 uses the low-magnification optical system of the alignment measurement device 9 to photograph the alignment mark 202B on the substrate 2B. The image processor 341 processes the photographed image to calculate the displacement of the substrate 2B. Furthermore, the sequence controller 340 corrects the position of the substrate stage 3 about the X-axis, Y-axis, and θ-axis based on the calculated displacement. Therefore, the alignment mark 202B can be observed by the high-magnification optical system of the alignment measurement device 9.

[0075] In steps S2-6, the sequence controller 340 performs a fine measurement process (fine measurement) on the alignment marks 202B of the substrate 2B using the high-magnification optical system of the alignment measuring device 9. In the fine measurement process, the sequence controller 340 captures images of the alignment marks 202B of the substrate 2B using the high-magnification optical system of the alignment measuring device 9, and the image processor 341 calculates the precise value of the displacement of each alignment mark of the substrate 2B based on the captured images.

[0076] In step S2-7, the sequence controller 340 calculates the relative positions of substrates 2A and 2B. Since the substrate stage 3 is driven in step S2-5, the calculated displacement amount of substrate 2A obtained in step S2-2 changes. Therefore, it is necessary to subtract an amount equivalent to the amount by which the substrate stage 3 is driven in step S2-5 from the calculated displacement amount of substrate 2A obtained in step S2-2. The following will refer to... Figures 11A to 11C Explain the details of this process.

[0077] In steps S2-8, the sequence controller 340 uses the alignment calculator 343 to calculate the individual components of the alignment error of substrates 2A and 2B. Here, it is assumed that the alignment calculator 343 calculates the displacement components SX, SY and Sθ, the magnification components MX and MY, and the deformation component DR as components of the alignment error (linear displacement components). Let (x, y) be the measurement result of the position of the alignment mark 202, and (dx, dy) be the displacement of the alignment mark 202 relative to the ideal position, and establish the model given by the following equations (1) and (2):

[0078] (1)

[0079] (2)

[0080] For this model, if alignment marks 202 are measured at at least three points, six equations with linear shift components as variables are obtained. These equations can be solved as a simultaneous equation to obtain the linear shift components. If there are more than four alignment mark measurement points, the linear shift components can be calculated using the least mean square method. These calculations are performed for each substrate 2A and 2B, and the linear shift components SX, SY, Sθ, MX, MY, and DR are stored in a storage device as alignment calculation results 353 for each substrate 2A and 2B.

[0081] Note that the substrate 2B is corrected based on the correction delay time DelayZb of the substrate 2B in the Z-axis direction obtained in steps S1-4.

[0082] In steps S2-9, the sequence controller 340 calculates the first discharge start position 301A and the second discharge start position 301B. Let Pa and Pb be the values ​​when Pa and Pb are respectively ... Figure 3 The positions 203A and 203B shown correspond to the predetermined positions of the discharge head 5 in the Y-axis direction, respectively. The position of the substrate stage 3 when the discharge start signal 300 is issued is obtained by adding SYa and SYb (i.e., SY calculated according to equation (1) for each substrate 2A and 2B) to Pa and Pb, and can be given by the following equation:

[0083] The first row starts at position 301A = Pa + SYa.

[0084] The second discharge begins at position 301B = Pb + SYb.

[0085] The first discharge start position 301A and the second discharge start position 301B are set in the comparator 333 of the stage controller 12.

[0086] The following will refer to Figure 8Explanation of the droplet discharge preparation sequence (steps S1-6). In step S3-1, the sequence controller 340 moves the substrate stage 3 to the scan start position. The scan start position is... Figure 9 The example shown is scan start position 404. In step S3-2, the sequence controller 340 uses the ejection pattern generator 344 to generate an ejection pattern image 351 for the first substrate 2A and an ejection pattern image 352 for the second substrate 2B based on the original ejection pattern image 350 and the alignment calculation result 353. (See below for further details.) Figure 12A and Figure 12B Describe the method for generating the pattern image. Steps S3-1 and S3-2 can be executed in parallel to shorten the processing time.

[0087] Figure 9 The operation of the substrate stage 3 is schematically illustrated in a droplet placement process (printing process) where droplets are placed onto substrates 2A and 2B. Figure 9 In the attached drawing, reference numeral 901 indicates the speed curve of the substrate stage 3, and reference numeral 902 schematically represents the movement of the substrate stage 3. The substrate stage 3 is continuously scanned from the scan start position 404 to the scan end position 405. Figure 9 In this example, the substrate stage 3 is scanned in the positive direction along the Y-axis. The period during which the substrate stage 3 is continuously scanned from the scan start position 404 to the scan end position 405 includes an acceleration period 402, a constant speed period 406 following the acceleration period 402, and a deceleration period 403 following the constant speed period 406. During the constant speed period 406, the controller 11 can control the discharge head 5 and the scanning mechanism 14 to provide droplets to each substrate 2A and 2B. The controller 11 can move the substrate stage 3 along a straight line (parallel to the Y-axis) during the period during which the substrate stage 3 is continuously scanned from the scan start position 404 to the scan end position 405.

[0088] The acceleration distance 400 is the distance the substrate stage 3 moves during the acceleration period 402. Let V be the scanning speed, which is the speed of the substrate stage 3 during the constant speed period 406, and A be the acceleration of the substrate stage 3 during the acceleration period 402. Then the acceleration distance 400 can be given by the following equation:

[0089] Acceleration distance 400 .

[0090] Similarly, a deceleration distance of 401 can also be obtained.

[0091] When the scanning direction is reversed, that is, when the substrate stage 3 operates in the negative direction along the Y-axis, simply interchange the deceleration distance 401 and the acceleration distance 400.

[0092] When scanning begins at time 0, the speed of the substrate stage 3 reaches a predetermined scanning speed V after an acceleration period 402. At the end of the constant speed period 406, deceleration begins, and the substrate stage 3 stops after a deceleration period 403. For example, the acceleration period 402 can be obtained based on the relationship between the scanning speed V and the acceleration A as follows. Assuming the acceleration A is constant, the acceleration period 402 can be given by the following equation:

[0093] Acceleration period 402 = V / A.

[0094] Similarly, the deceleration period 403 can also be obtained.

[0095] The control calculator 331 of the stage controller 12 controls the drive of the substrate stage 3 through the above-mentioned drive mode.

[0096] Figure 10 This is a schematic view illustrating the control performed on the substrate stage 3 by the discharge controller 345 via the controller 11. Figure 10 In the accompanying drawings, reference numeral 1001 indicates the relative positional relationship between substrates 2A and 2B mounted on the substrate stage 3 and the discharge head 5. The discharge head 5 is positioned relative to the substrate stage 3 in... Figure 10 The components move downwards relative to each other to place (print) droplets in the order of substrates 2A and 2B. Droplet discharge to substrate 2A begins at a first discharge start position 301A, and droplet discharge to substrate 2B begins at a second discharge start position 301B. The first discharge start position 301A and the second discharge start position 301B are set in steps S2-9.

[0097] exist Figure 10 In the attached drawing, reference numeral 1002 indicates the discharge start signal 300. The activation of the discharge start signal 300 is indicated by pulses 1 and 2. Pulses 1 and 2 are generated by comparator 333. Pulse 1 is emitted (generated) when the substrate stage 3 reaches the first discharge start position 301A, and pulse 2 is emitted (generated) when the substrate stage 3 reaches the second discharge start position 301B. Note that pulses 1 and 2 are emitted (generated) when the substrate stage 3 reaches the second discharge start position 301B. Figure 10 The signal is shown as an output to a single signal line, but it can also be transmitted to various different signal lines.

[0098] exist Figure 10In the accompanying drawings, reference numeral 1003 schematically represents a first discharge pattern image 351 for the first substrate 2A and a second discharge pattern image 352 for the second substrate 2B. The first discharge pattern image 351 for the first substrate 2A is first discharge control information for controlling the discharge of droplets from the discharge head 5. The second discharge pattern image 352 for the second substrate 2B is second discharge control information for controlling the discharge of droplets from the discharge head 5. When pulse 1 is issued, droplets are discharged from the discharge head 5 according to the first discharge pattern image 351 for the first substrate 2A. Subsequently, the substrate stage 3 advances, and when pulse 2 is issued, droplets are discharged from the discharge head 5 according to the second discharge pattern image 352 for the second substrate 2B. The discharge controller 345 outputs a discharge control signal 362 based on the discharge pattern images 351 and 352. Then, the discharge of droplets from the discharge head 5 is controlled according to the alignment errors of the multiple substrates 2A and 2B to provide droplets to multiple target positions on each substrate 2A and 2B.

[0099] like Figure 9 and Figure 10 As illustrated, the period during which regions including multiple substrates 2A and 2B are continuously scanned relative to the discharge head 5 may include a first period of scanning the first substrate 2A by the scanning mechanism 14, and may include a second period of scanning the second substrate 2B by the scanning mechanism 14. This control allows for efficient placement of droplets onto the multiple substrates 2A and 2B, thereby increasing throughput. The controller 11 (discharge image generator 344) can generate first discharge control information for controlling the discharge of droplets to multiple target locations on the first substrate 2A, and can generate second discharge control information for controlling the discharge of droplets to multiple target locations on the second substrate 2B. The controller 11 (discharge controller 345) can control the discharge head 5 based on the first discharge control information during the first period, and can control the discharge head 5 based on the second discharge control information during the second period.

[0100] The controller 11 or the stage controller 12 can generate a first discharge start signal 300 indicating the start of droplet discharge to the first substrate 2A, and can generate a second discharge start signal 300 indicating the start of droplet discharge to the second substrate 2B. The discharge head 5 can start discharging droplets to the first substrate 2A based on the first discharge start signal 300, and can start discharging droplets to the second substrate 2B based on the second discharge start signal 300. Alternatively, the controller 11 or the stage controller 12 can control the discharge head 5 to adjust the start timing of droplet discharge to the first substrate 2A according to the alignment error of the first substrate 2A. Furthermore, the controller 11 or the stage controller 12 can control the discharge head 5 to adjust the start timing of droplet discharge to the second substrate 2B according to the alignment error of the second substrate 2B.

[0101] Figures 11A to 11C This is a view showing the relationship between the alignment marks on substrates 2A and 2B and the substrate stage 3. Figures 11A to 11C The rotational error about the θ axis is shown between substrates 2A and 2B. Figure 11A It shows Figure 7 The state where step S2-1 has been completed. Figure 11A In this state, the substrate stage 3 is driven around the θ axis (i.e., driven to rotate), so that the pixel array region 201A of the substrate 2A has no rotation error in the scanning direction.

[0102] Figure 11B It shows Figure 7 The state where steps S2-5 have been completed. Figure 11B In this state, the substrate stage 3 is driven (i.e., driven to rotate) around the θ axis, so that the pixel array region 201B of the substrate 2B has no rotational error in the scanning direction. Here, focus is on the upper right alignment mark of the substrate 2A, which moves from position a1 to position a2.

[0103] Figure 11C The change from position a1 to position a2 caused by the rotation of the substrate stage 3 is shown. Let θb be the amount of drive (rotation) of the substrate stage 3 around the θ axis in step S2-5, then the displacement (δx, δy) of the alignment mark from the state at position a1 to the state at position a2 can be obtained. Using this, the relative positions of substrates 2A and 2B can be calculated in step S2-7.

[0104] Figure 12A and Figure 12B This is a view used to illustrate the process of reflecting the alignment calculation result 353 in each pixel. Figure 12A This is a view showing the pixel array region 201A or 201B and the position of each pixel. (Example) Figure 12B As shown, each pixel includes R, G, and B sub-pixels. Figure 12B yes Figure 12A A magnified view of the area. Here, position G1 is the predicted landing position before alignment error correction, and position G2 is the target landing position. By correcting the alignment error (dxi, dyj), the droplet can be placed at the target landing position.

[0105] The method for calculating pixel alignment error will be explained below. Figure 12AIn the equation (1), (x1, y1) are the coordinates of the top-left pixel of the pixel array region 201, (xn, ym) are the coordinates of the bottom-right pixel of the pixel array region 201, and (xi, yj) are the coordinates of any pixel. The alignment error (dxi, dyj) at any coordinate (xi, yj) can be obtained by substituting the coordinates (xi, yj) and the alignment calculation results 353 (SX, SY, Sθ, MX, MY, and DR) into equations (1) and (2). The equations after substitution are as follows:

[0106] (3)

[0107] (4)

[0108] Here, the alignment error dyj in the scanning direction (Y-axis direction) can be adjusted by the timing of the discharge of droplet 4, simply by converting the alignment error into a time-unit delay value. Let Dj be the delay time of the pixel coordinates (xi, yj). Since the substrate stage 3 is driven at a scanning speed V, the delay time Dj is given by equation (5):

[0109] (5)

[0110] The value of Dj is equivalent to the integral of the delay time between the pixel at coordinates (xi, y1) and the pixel at coordinates (xi, yj) during the scanning period. In actual correction, the delay time needs to be adjusted between each pixel in the Y-axis direction. Therefore, let ΔDj be the delay time between the pixel at coordinates (xi, yj-1) and the pixel at coordinates (xi, yj), then ΔDj is given by equation (6):

[0111] (6)

[0112] Based on ΔDj, the delay time between each pixel can be set.

[0113] Calculating the delay time for each pixel individually would greatly increase the computational load, and the extended computation time would affect the cycle time. Therefore, it is also possible to calculate the alignment error dyj for each group of predetermined number of pixels, and calculate the delay time ΔDj based on this error.

[0114] Figures 13A to 13C The relationship between alignment error in the X-axis direction (non-scanning direction) and the use of the nozzle is shown. Figures 13A to 13C In the diagram, shaded circles represent discharge nozzles that discharge droplets among the multiple nozzles of discharge head 5, and blank circles represent non-discharge nozzles that do not discharge droplets among the multiple nozzles of discharge head 5. It is assumed that the nozzles are numbered sequentially from first to last. The nozzles are arranged at a spacing NP along the X-axis.

[0115] Figure 13A An example is shown illustrating the allocation of discharge nozzles and non-discharge nozzles based on the original discharge pattern image 350. Based on the original discharge pattern image 350, the nozzle spacing is NP, and droplets are discharged from nozzles corresponding to the width W of the pixel array region in the X-axis direction. Figure 13A In the diagram, Nl is the nozzle number at the left end of the discharge nozzle group, and Nr is the nozzle number at the right end of the discharge nozzle group.

[0116] Figure 13B An example is illustrated by assigning discharge nozzles and non-discharge nozzles according to a first discharge pattern image 351 for a first substrate 2A. Figure 7 In steps S2-8, the alignment error of the first substrate 2A in the X-axis direction, i.e., the displacement component SXa, is obtained. Here, Figure 13B In this context, α represents the number of discharge nozzles that have shifted due to alignment errors along the X-axis. α can be given by the following equation:

[0117] (Round down to the nearest integer).

[0118] For example, when SXa is in the negative direction, the discharge nozzles according to the discharge pattern image 351 for the first substrate 2A are the Nl-α nozzles to the Nr-α nozzles.

[0119] Figure 13C An example is illustrated by assigning discharge nozzles and non-discharge nozzles according to a second discharge pattern image 352 for a second substrate 2B. Figure 7 In steps S2-8, the alignment error of the second substrate 2B in the X-axis direction, i.e., the displacement component SXb, is obtained. Here, Figure 13C In this context, β represents the number of discharge nozzles that have shifted due to alignment error in the X-axis direction. β can be given by the following equation:

[0120] (Round down to the nearest integer).

[0121] For example, when SXb is in the positive direction, the discharge nozzles according to the discharge pattern image 352 for the second substrate 2B are the N1+β nozzles to the Nr+β nozzles.

[0122] As described above, the controller 11 can control the timing of droplet discharge from the discharge head 5 based on the alignment errors of each substrate 2A and 2B in the scanning direction of the scanning mechanism 14. Based on the alignment errors of the multiple substrates 2A and 2B in the non-scanning directions orthogonal to the scanning direction of the scanning mechanism 14, the controller 11 can correct the image (discharge pattern image) used to control the discharge of droplets from the discharge head 5. Furthermore, based on the alignment errors of the multiple substrates 2A and 2B about axes orthogonal to the scanning and non-scanning directions, the controller 11 can correct the image (discharge pattern image) used to control the discharge of droplets from the discharge head 5.

[0123] Although each substrate 2 has one pixel array region in the example above, at least one of the multiple substrates 2A and 2B may have multiple pixel array regions (in other words, regions where the droplet should be placed). In this case, during the period when the droplet is discharged onto the substrate having multiple pixel array regions, the controller 11 may control the discharge head 5 based on multiple discharge control information for controlling the discharge of the droplet to each pixel array region.

[0124] In the example above, the substrate stage 3 is not rotated around the θ axis during the scanning period for placing droplets onto the multiple substrates 2A and 2B. However, to reduce alignment errors, the substrate stage 3 can be rotated around the θ axis during the scanning period for placing droplets onto the multiple substrates 2A and 2B. For example, after the droplets are ejected to multiple target positions on the first substrate 2A, the controller 11 can rotate the substrate stage 3 according to the rotation error of the second substrate 2B before ejecting the droplets to multiple target positions on the second substrate 2B.

[0125] Furthermore, after rotating the substrate stage 3 to correct the rotational error of the first substrate 2A, the controller 11 can discharge droplets to multiple target positions on the first substrate 2A. Then, after rotating the substrate stage 3 to correct the rotational error of the second substrate 2B, the controller 11 can discharge droplets to multiple target positions on the second substrate 2B.

[0126] The following will illustrate an example of the substrate stage 3 being scanned in the negative direction along the Y-axis. Figure 14 The scanning direction of the substrate stage 3 is shown. Figure 3 Examples with opposite scanning directions. Figure 14 In the example, position 204A on substrate 2A is the position where droplets are placed, coated, or discharged into pixel array region 201A. Position 204B on substrate 2B is the position where droplets are placed, coated, or discharged into pixel array region 201B.

[0127] Figure 15This is a schematic view illustrating the control performed by the discharge controller 345 of the controller 11 on the substrate stage 3. Figure 15 In the accompanying drawings, reference numeral 1501 indicates the relative positional relationship between substrates 2A and 2B mounted on the substrate stage 3 and the discharge head 5. For convenience, substrate 2B will be referred to as the first substrate, and substrate 2A will be referred to as the second substrate. Figure 15 The discharge head 5 moves upward relative to the substrate stage 3 to place (print) droplets in the order of substrate 2B and substrate 2A. Droplets are discharged to the first substrate 2B starting at the first discharge start position 301B, and droplets are discharged to the second substrate 2A starting at the second discharge start position 301A. The first discharge start position 301B and the second discharge start position 301A are set in steps S2-9.

[0128] exist Figure 15 In the attached drawing, reference numeral 1502 indicates the discharge start signal 300. The activation of the discharge start signal 300 is indicated by pulses 1 and 2. Pulses 1 and 2 are generated by comparator 333. Pulse 1 is emitted (generated) when the substrate stage 3 reaches the first discharge start position 301B, and pulse 2 is emitted (generated) when the substrate stage 3 reaches the second discharge start position 301A. Note that pulses 1 and 2 are emitted (generated) when the substrate stage 3 reaches the second discharge start position 301A. Figure 15 The signal is shown as an output to one signal line, but it can also be transmitted to various different signal lines. The discharge controller 345 determines the relationship between pulse 1, pulse 2 and the discharge pattern images 351 and 352 based on the scanning direction of the substrate stage 3.

[0129] exist Figure 15 In the accompanying drawings, reference numeral 1503 schematically represents a first discharge pattern image 352 for the first substrate 2B and a second discharge pattern image 351 for the second substrate 2A. The first discharge pattern image 352 for the first substrate 2B is first discharge control information for controlling the discharge of droplets from the discharge head 5. The second discharge pattern image 351 for the second substrate 2A is second discharge control information for controlling the discharge of droplets from the discharge head 5. When pulse 1 is issued, droplets are discharged from the discharge head 5 according to the first discharge pattern image 352 for the first substrate 2B. Subsequently, the substrate stage 3 advances, and when pulse 2 is issued, droplets are discharged from the discharge head 5 according to the second discharge pattern image 351 for the second substrate 2A. The discharge controller 345 outputs a discharge control signal 362 based on the discharge pattern images 352 and 351.

[0130] The second embodiment will now be described. Matters not mentioned in the second embodiment can be followed in the first embodiment. Figure 16This is a functional block diagram of the controller 11 of the droplet placement device 1 according to the second embodiment. The sequence controller 340, image processor 341, original image generator 342, alignment calculator 343, discharge pattern original image 350, discharge pattern image for the first substrate, discharge pattern image for the second substrate 352, and alignment calculation result 353 are similar to those in the first embodiment.

[0131] The discharge image generator 346 generates a composite discharge pattern image 354 as an image for controlling the discharge of droplets to multiple target positions on each substrate 2A and 2B. The discharge image generator 346 generates a first discharge pattern image 351 for controlling the discharge of droplets to multiple target positions on the first substrate 2A based on alignment errors. Furthermore, the discharge image generator 346 generates a second discharge pattern image 352 for controlling the discharge of droplets to multiple target positions on the second substrate 2B based on alignment errors. The discharge image generator 346 further generates the composite discharge pattern image 354 by combining the first discharge pattern image 351 and the second discharge pattern image 352. The discharge controller 345 supplies a discharge control signal 362 to the discharge head 5 based on the composite discharge pattern image 354. Based on a discharge start signal 300, the discharge controller 345 supplies the discharge control signal 362 to the discharge head 5 to place droplets at all target positions on each substrate 2A and 2B.

[0132] Figure 17 This is a schematic view illustrating the control of the substrate stage 3 by the discharge controller 345 of the controller 11. Figure 17 In the accompanying drawing, reference numeral 1701 indicates the relative positional relationship between substrates 2A and 2B mounted on substrate stage 3 and discharge head 5. Discharge head 5 relative to substrate stage 3... Figure 17 The droplets are moved downwards relative to each other to place (print) droplets in the order of substrate 2A and substrate 2B.

[0133] exist Figure 17 In the accompanying drawing, reference numeral 1702 denotes the discharge start signal 300. In the second embodiment, unlike the first embodiment, the discharge start signal 300 provides only pulse 1 as a single start trigger to scan an area comprising multiple substrates 2A and 2B. Pulse 1 is emitted when the pixel array region of the first substrate 2A reaches the start position 301A. Figure 17In the figure, reference numeral 1703 denotes the composite discharge pattern image 354. In the composite discharge pattern image 354, the discharge pattern image 351 for the first substrate 2A is mapped according to the alignment error of the first substrate 2A to reduce the influence of the alignment error. Additionally, in the composite discharge pattern image 354, the discharge pattern image 352 for the second substrate 2B is mapped according to the alignment error of the second substrate 2B to reduce the influence of the alignment error. The composite discharge pattern image 354 represents the pattern of droplets to be discharged from the nozzle of the discharge head 5 at each moment. In the composite discharge pattern image 354, a delay tab corresponding to the interval between the first discharge pattern image 351 and the second discharge pattern image 352 is set between them. The delay tab can be given by the following equation:

[0134] ,

[0135] Where L is the distance between the centers of substrates 2A and 2B, V is the scanning speed of substrate stage 3, and Wa and Wb are the dimensions of substrates 2A and 2B in the Y-axis direction. When pulse 1 of the discharge start signal 300 is issued while driving substrate stage 3, droplets are discharged from discharge head 5 according to discharge control signal 362 that conforms to the composite discharge pattern image 354. Then, printing is performed according to the alignment shift on substrates 2A and 2B. Droplets are placed at multiple target positions on each substrate 2A and 2B to reduce the influence of alignment errors on substrates 2A and 2B.

[0136] A method for manufacturing a display device using a droplet placement apparatus 1 will be described. The display device manufacturing method may include a droplet placement step of placing droplets onto various substrates using the droplet placement apparatus 1, and a processing step of processing each substrate that has undergone the droplet placement step to obtain the display device. The processing step may include, for example, a step of forming a top electrode, a step of forming a wiring pattern, a sealing step, etc. The manufacturing method may include a circuit formation step of forming circuits such as driving circuits on each substrate prior to the droplet placement step.

[0137] Although exemplary embodiments have been described in this disclosure, it should be understood that some embodiments are not limited to the disclosed exemplary embodiments. The scope of the following claims should be given the broadest interpretation in order to cover all variations and equivalent structures and functions.

Claims

1. A droplet placement device, comprising: A substrate holder configured to hold multiple substrates spaced apart from each other; The discharge head is configured to discharge droplets; A scanning mechanism is configured to move a substrate holder relative to a discharge head to continuously scan a region including the plurality of substrates relative to the discharge head; An alignment measuring device is configured to measure the alignment error of the plurality of substrates held by a substrate holder; as well as The controller is configured to control the discharge head and scanning mechanism based on the alignment error measured using an alignment measuring device, so as to deliver droplets to multiple target locations on each substrate during a period of time when the area is continuously scanned by the scanning mechanism.

2. The droplet placement device according to claim 1, wherein The plurality of substrates includes a first substrate and a second substrate. The time period includes a first time period during which the scanning mechanism scans the first substrate, and a second time period during which the scanning mechanism scans the second substrate. The controller generates first discharge control information for controlling the discharge of droplets to multiple target locations on the first substrate, and generates second discharge control information for controlling the discharge of droplets to multiple target locations on the second substrate. In the first time period, the controller controls the discharge head based on the first discharge control information, and in the second time period, it controls the discharge head based on the second discharge control information.

3. The droplet placement device according to claim 2, wherein The controller generates a first discharge start signal indicating the start of droplet discharge to the first substrate, and generates a second discharge start signal indicating the start of droplet discharge to the second substrate. The discharge head starts discharging droplets onto the first substrate based on a first discharge start signal, and starts discharging droplets onto the second substrate based on a second discharge start signal.

4. The droplet placement device according to claim 1, wherein, The plurality of substrates includes a first substrate and a second substrate. The controller generates an image for controlling the discharge of droplets to multiple target locations on the first substrate and multiple target locations on the second substrate. The controller controls the discharge head based on a single image during the specified time period.

5. The droplet placement device of claim 4, wherein, The controller generates the image by combining a first discharge pattern image for controlling the discharge of droplets to multiple target positions on the first substrate based on the alignment error of the first substrate and a second discharge pattern image for controlling the discharge of droplets to multiple target positions on the second substrate based on the alignment error of the second substrate.

6. The droplet placement device according to claim 5, wherein, The controller generates a discharge start signal indicating the start of droplet discharge onto the first substrate, and The discharge head controls the discharge of droplets onto the first and second substrates based on the discharge start signal and the image.

7. The droplet placement apparatus of claim 1, wherein, The controller controls the timing of the droplet discharge from the discharge head based on the alignment error of each of the plurality of substrates in the scanning direction of the scanning mechanism.

8. The droplet placement apparatus of claim 1, wherein, The controller corrects the image used to control the discharge of droplets from the discharge head based on each alignment error of the plurality of substrates in a non-scanning direction orthogonal to the scanning direction of the scanning mechanism.

9. The droplet placement apparatus of claim 1, wherein, The controller corrects the image used to control the discharge of droplets from the discharge head based on the rotational error of each of the plurality of substrates.

10. The droplet placement device according to claim 1, wherein The controller controls the timing of droplet discharge from the discharge head based on the alignment error of each of the plurality of substrates in the scanning direction of the scanning mechanism. The controller corrects the image used to control the discharge of droplets from the discharge head based on each alignment error of the plurality of substrates in a non-scanning direction orthogonal to the scanning direction of the scanning mechanism. The controller corrects the image used to control the discharge of droplets from the discharge head based on each alignment error of the plurality of substrates about an axis orthogonal to the scanning direction and the non-scanning direction.

11. The droplet placement device according to claim 1, wherein, The time period includes an acceleration period, a constant speed period following the acceleration period, and a deceleration period following the constant speed period. The controller controls the discharge head and scanning mechanism during the constant speed period to provide droplets to each substrate.

12. The droplet placement device of claim 11, wherein, During the specified time period, the controller causes the substrate holder to move relative to the discharge head in a straight line.

13. The droplet placement device according to claim 1, wherein At least one of the plurality of substrates has a plurality of regions, and During the period when droplets are discharged to the at least one substrate, the controller controls the discharge head based on multiple discharge control messages for controlling the discharge of droplets to various regions.

14. The droplet placement apparatus of claim 1, wherein, The controller controls the discharge head and the scanning mechanism to discharge droplets to the multiple substrates through multiple scans by the scanning mechanism.

15. The droplet placement device according to claim 1, in, The controller generates discharge control information based on the direction in which the substrate holder moves relative to the discharge head via the scanning mechanism, for controlling the discharge of droplets to multiple target locations on each substrate. The controller controls the discharge head based on discharge control information during the specified time period.

16. The droplet placement device according to claim 2, wherein, After discharging droplets to multiple target locations on the first substrate, the controller rotates the substrate holder according to the rotational error of the second substrate before discharging droplets to multiple target locations on the second substrate.

17. The droplet placement apparatus of claim 2, wherein, After rotating the substrate holder to correct the rotation error of the first substrate, the controller performs the discharge of droplets to multiple target locations on the first substrate, and after rotating the substrate holder to correct the rotation error of the second substrate, it performs the discharge of droplets to multiple target locations on the second substrate.

18. The droplet placement apparatus of claim 2, wherein, The controller controls the discharge head to adjust the start timing of discharging droplets onto the first substrate based on the alignment error of the first substrate, and adjusts the start timing of discharging droplets onto the second substrate based on the alignment error of the second substrate.

19. A method for placing a liquid droplet, comprising: Measure the alignment error of multiple substrates held by a substrate holder; as well as The discharge of droplets from the discharge head is controlled based on the alignment error in the measurement, so as to deliver droplets to multiple target locations on each substrate while continuously scanning regions including the plurality of substrates spaced apart from each other.

20. A method for manufacturing a display device, comprising: Droplets are placed onto the respective substrates using the droplet placement device as defined in any one of claims 1 to 18; as well as Each substrate that has undergone droplet placement is processed to obtain a display device.

Images