Novel semiconductor pasting mechanism

Abstract

This invention discloses a novel semiconductor film-applying mechanism, comprising a substrate, on which are mounted a first traction shaft, a second traction shaft, a left fixed plate, a right fixed plate, a right film suction mechanism, and multiple sets of driving mechanisms. Limiting wheels on the first and second traction shafts form a film transport track. The first driving mechanism on the left fixed plate connects to a main suction cup, a rotating base, and a left pressure roller. The rotating base houses the left suction cup. The third driving mechanism on the right fixed plate connects to a right pressure roller with a cylindrical heater. The second driving mechanism on the substrate carries a slidably replaceable L-shaped cutter. Limiting grooves are provided at the bottom of the left and right suction cups. This invention uses limiting grooves to prevent film deviation during transport and protect the cutter. The rotating base adjusts the film-applying angle for pre-applying, and the heated pressure roller completes tight film adhesion. The cutter can be quickly replaced, and film cutting is convenient. The overall process achieves automated and precise semiconductor film application, with a simplified structure, fewer parts, lower cost, and better film-applying effect.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing equipment technology, and in particular to a novel semiconductor film application mechanism. Background Technology

[0002] In the manufacturing process of semiconductor wafers, the film lamination process is crucial to ensure that the surface of the semiconductor wafers is not scratched or contaminated. High requirements are placed on the lamination accuracy, tightness, and cutting effect. Existing semiconductor film lamination mechanisms have several technical shortcomings in practical applications: First, the film is prone to deviation during transport, leading to misalignment of the film lamination position and affecting the processing quality of the semiconductor wafers. Second, the lack of a reasonable film lamination angle adjustment structure during the lamination process makes it easy for air bubbles to form when the film is bonded to the wafer surface, resulting in poor adhesion and subsequent film detachment. Third, the film cutting blades are mostly fixed structures, which not only make the cutting operation cumbersome but also expose the blade heads, making them susceptible to damage from impacts. Furthermore, the blade specifications are limited and cannot adapt to the cutting needs of films of different widths. Fourth, the pressure rollers lack heating functions, resulting in poor thermal bonding between the film and the semiconductor wafer surface, further reducing the tightness of the lamination. Fifth, existing film lamination mechanisms are often complex in design, requiring numerous operations, which affects lamination accuracy and increases costs.

[0003] To address the aforementioned issues, this invention features a simplified design, significantly reduces the number of components used, and greatly improves film application efficiency, thus meeting the semiconductor manufacturing industry's production needs for automated, precise, and efficient film application processes. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies and provide a novel semiconductor film-applying mechanism. This mechanism solves the problems of complex structures, film misalignment, poor adhesion, cumbersome film cutting, and easy damage to cutting tools associated with traditional film-applying mechanisms. It achieves precise delivery, tight adhesion, and convenient film cutting for semiconductor film application. This technical solution features a simplified design, significantly reduces the number of components, and greatly improves film-applying efficiency, meeting the semiconductor manufacturing industry's production needs for automated, precise, and efficient film-applying processes.

[0005] Technical solution: A novel semiconductor film-applying mechanism, characterized in that it includes a substrate, on which a first traction shaft, a scale, a second traction shaft, a second drive mechanism, a left fixing plate, a right fixing plate, and a right film-suction mechanism are disposed. The first traction shaft is provided with two first limiting wheels, and the second traction shaft is provided with two second limiting wheels. The first limiting wheels and the second limiting wheels form a film conveying track. The bottom of the right film-suction mechanism is provided with a right suction cup, and the right film-suction mechanism is fixed to the substrate by a fixing seat. The linear guide rail on the right fixed plate is connected to the third drive mechanism via the second linear guide rail slider. The third drive mechanism is connected to the second cylinder. The third drive mechanism includes a right pressure roller plate. A heat insulation plate is provided at the lower end of the right pressure roller plate. A right pressure roller is provided at the lower end of the heat insulation plate. A cylindrical heater is connected to the right pressure roller. The linear guide rail on the left fixed plate is connected to the first driving mechanism through the first linear guide rail slider. The first driving mechanism is connected to the first cylinder. The first driving mechanism is fixedly provided with the left fixed plate. The bottom of the left fixed plate is provided with a main suction cup. Two roller fixing seats are fixedly provided on the right side of the left fixed plate. The roller fixing seats are connected to the rotating base and the left pressure roller through the rotating shaft. The rotating base is provided with the left suction cup. The second drive mechanism is equipped with a film cutting mechanism fixing plate and a drive cylinder. The bottom of the film cutting mechanism fixing plate is equipped with a linear guide rail. The drive cylinder drives the cutting blade to run on the linear guide rail. The cutting blade is equipped with a blade changing handle and a blade mounting seat.

[0006] As a further embodiment of the present invention, a cutting blade is provided between the left and right suction cups for cutting the film after the film is applied. The bottom of both the left and right suction cups is provided with a limiting groove to prevent the film from deviating during operation. At the same time, the setting of the limiting groove can prevent the blade head of the cutting blade from being exposed, thus achieving the functions of safety and protection. The cutting blade is L-shaped for easy film cutting and replacement.

[0007] As a further aspect of the present invention, in the initial state of the rotating base, the membrane, the bottom surface of the main suction cup, and the bottom surface of the left suction cup are on the same plane, and the main suction cup and the left suction cup are in the membrane suction state. At this time, the left pressure roller does not contact the membrane.

[0008] As a further embodiment of the present invention, the first driving mechanism drives the left pressure roller to press down on the strip, while the rotating base rotates counterclockwise at the same time, and the left suction cup is lifted accordingly. The left suction cup and the surface of the strip form a film-applying angle, which facilitates film application. At this time, the strip moves to the left until the rightmost end is directly below the left pressure roller, thus completing the pre-applying of film.

[0009] As a further embodiment of the present invention, a cutting blade for cutting the film is provided at the middle position between the left and right suction cups, and the cutting blade can be replaced with different blade specifications.

[0010] As a further aspect of the present invention, after the film strip is pre-applied, it continues to move to the right until the rightmost end is directly below the right pressure roller. At this time, the right pressure roller presses down on the film strip, and the film strip continues to move to the right. The left pressure roller is lifted until the leftmost side of the film strip moves directly below the cutting blade. At this time, the main suction cup, the left suction cup, and the right suction cup simultaneously hold the film, and the cutting blade cuts the film. The film strip continues to move to the right to complete the film application. The right pressure roller is lifted, and the right suction cup releases the vacuum.

[0011] As a further aspect of the present invention, the scale adjusts the position of the first limiting wheel and the second limiting wheel to adjust the conveying channel of the membrane. The scale has a centrally symmetrical structure, and the center line of the membrane width direction coincides with the center line of the scale.

[0012] Compared with the prior art, the novel semiconductor film bonding mechanism provided by the present invention achieves at least the following beneficial effects: This invention forms a directional conveying track for the film by using a first limiting wheel on the first traction shaft and a second limiting wheel on the second traction shaft. Combined with the limiting grooves at the bottom of the left and right suction cups, it achieves double anti-deviation during the film conveying process, effectively avoiding film offset errors caused by film deviation and improving film application accuracy. At the same time, the limiting grooves can house the cutting blade head, preventing the blade head from being exposed and damaged by collisions, extending the blade's service life, and also playing a safety and protection role.

[0013] This invention features a movable rotating base. By rotating the base counterclockwise, the angle between the left suction cup and the film application surface can be adjusted, enabling pre-application of the film to the film strip. This effectively avoids the generation of air bubbles during the application process, laying the foundation for subsequent tight bonding and solving the problem of poor bonding in traditional film application mechanisms.

[0014] The right pressure roller connected to the cylindrical heater of the present invention can heat the pressure roller and achieve tight bonding between the film and the surface of the semiconductor strip using the principle of hot pressing, thereby further improving the adhesion of the film, preventing the film from falling off later, and meeting the film protection requirements of semiconductor strips.

[0015] The cutting blade of this invention has an L-shaped structure, which makes film cutting operation convenient. The cutting blade can be quickly disassembled and assembled through the blade change handle and the blade mounting base. Different blade specifications can be replaced according to the film specifications, which has strong adaptability. At the same time, the drive cylinder can drive the cutting blade to slide along the linear guide rail to realize automated film cutting, replace manual operation, and improve film cutting efficiency and cutting accuracy.

[0016] The invention features a simple and compact overall structure. The various mechanisms work together to achieve integrated automated operation of film delivery, pre-applying film, hot pressing, and film cutting, which greatly improves the overall efficiency of semiconductor film application. Furthermore, each component is modularly designed, making operation and maintenance convenient. It is adaptable to the film application needs of semiconductor strips of different specifications and has high industrial application value. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with their description, serve to explain the principles of the invention. The drawings do not constitute any limitation on the invention, and those skilled in the art can obtain other drawings based on the following drawings without any inventive effort.

[0018] Figure 1 is a schematic diagram of the overall structure of the novel semiconductor film bonding mechanism of the present invention; Figure 2 is a front view of the film application station of the present invention; Figure 3 is a detailed structural schematic diagram of the first driving mechanism of the present invention; Figure 4 is a detailed structural schematic diagram of the third driving mechanism of the present invention; Figure 5 is a schematic diagram of the connection structure between the second driving mechanism and the cutting blade of the present invention; Figure 6 is a detailed structural schematic diagram of the right suction film mechanism of the present invention; Figure 7 is a schematic diagram of the initial state of film application of the strip of the present invention; Figure 8 is a schematic diagram of the pre-applied film structure of the present invention; Figure 9 is an enlarged structural schematic diagram of the pre-applied film of the present invention; Figure 10 is a schematic diagram of the structure after the pre-film is applied according to the present invention; Figure 11 is a schematic diagram of the film-adhesive rightward shift structure of the present invention; Figure 12 is a schematic diagram of the right pressure roller pressing down in this invention; Figure 13 is a schematic diagram of the structure of the right pressure roller pressing down on the film separately according to the present invention; Figure 14 is a schematic diagram of the film cutting position of the present invention; The components include: 1. Substrate; 2. First driving mechanism; 3. Second driving mechanism; 4. Third driving mechanism; 5. Right fixed plate; 6. First limiting wheel; 7. Film; 8. First traction shaft; 9. Scale; 10. Second limiting wheel; 11. Second traction shaft; 12. First cylinder; 13. Second cylinder; 14. Right film suction mechanism; 141. Right suction cup; 142. Limiting groove; 143. Fixed base; 15. Left fixed plate; 21. Main film suction mechanism; 211. Main suction cup; 22. Left pressure roller; 23. Rotating base; 231. Left suction cup; 232. Rotating shaft; 24. First linear guide slider. 31. Film cutting mechanism fixing plate; 32. Drive cylinder; 33. Linear guide rail; 34. Blade changing handle; 35. Blade mounting base; 36. Cutting blade; 41. Right pressure roller plate; 42. Heat insulation plate; 43. Second linear guide rail slider; 44. Right pressure roller; 45. Cylindrical heater; 46. Sheet. Detailed Implementation

[0019] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention.

[0020] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.

[0021] Techniques, methods, and apparatus known to those skilled in the art may not be discussed in detail; however, where appropriate, such techniques, methods, and apparatus should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0022] See the attached instruction manual. Figure 1-14 A novel semiconductor film-applying mechanism is characterized by comprising a substrate 1, on which a first traction shaft 8, a scale 9, a second traction shaft 11, a second drive mechanism 3, a left fixing plate 15, a right fixing plate 5, and a right film-suction mechanism 14 are disposed. The first traction shaft 8 is provided with two first limiting wheels 6, and the second traction shaft 11 is provided with two second limiting wheels 10. The first limiting wheels 6 and the second limiting wheels 10 form a conveying track for the film 7. The right film-suction mechanism 14 is provided with a right suction cup 141 at its bottom, and the right film-suction mechanism 14 is fixed to the substrate 1 by a fixing seat 143. The linear guide rail on the right fixed plate 5 is connected to the third drive mechanism 4 via the second linear guide rail slider 43. The third drive mechanism 4 is connected to the second cylinder 13. The third drive mechanism 4 includes a right pressure roller plate 41. A heat insulation plate 42 is provided at the lower end of the right pressure roller plate 41. A right pressure roller 44 is provided at the lower end of the heat insulation plate 42. A cylindrical heater 45 is connected to the right pressure roller 44. The linear guide rail on the left fixed plate 15 is connected to the first driving mechanism 2 through the first linear guide rail slider 24. The first driving mechanism 2 is connected to the first cylinder 12. The first driving mechanism 2 is fixedly provided with the left fixed plate 21. The bottom of the left fixed plate 21 is provided with the main suction cup 211. Two roller fixing seats 25 are fixedly provided on the right side of the left fixed plate 21. The roller fixing seats 25 are connected to the rotating base 23 and the left pressure roller 22 through the rotating shaft 232. The rotating base 23 is provided with the left suction cup 231. The second drive mechanism 3 is provided with a film cutting mechanism fixing plate 31 and a drive cylinder 32. The bottom of the film cutting mechanism fixing plate 31 is provided with a linear guide rail 33. The drive cylinder 32 drives the cutting blade 36 to run on the linear guide rail 33. The cutting blade 36 is provided with a blade changing handle 34 and a blade mounting seat 35.

[0023] A cutting blade 36 is provided between the left suction cup 231 and the right suction cup 141 for cutting the film after it is applied. The bottom of both the left suction cup 231 and the right suction cup 141 is provided with a limiting groove 142. The limiting groove 142 prevents the film from deviating during operation. At the same time, the setting of the limiting groove 142 can prevent the blade head of the cutting blade 36 from being exposed, thus achieving a safety and protection function. The cutting blade 36 is L-shaped, which is convenient for cutting the film and easy to replace.

[0024] In the initial state of the rotating base 23, the membrane 7, the bottom surface of the main suction cup 211 and the bottom surface of the left suction cup 231 are on the same plane, and the main suction cup 211 and the left suction cup 231 are in the membrane suction state. At this time, the left pressure roller 22 is not in contact with the membrane.

[0025] The first drive mechanism 2 drives the left pressure roller 22 to press down on the strip 46. At the same time, the rotating base 23 rotates counterclockwise, and the left suction cup 231 is lifted up. The left suction cup 231 and the surface of the strip 46 form a film-applying angle, which facilitates film application. At this time, the strip 46 moves to the left until the rightmost end is directly below the left pressure roller 22, completing the pre-applying of film.

[0026] A cutting blade 36 for cutting the film is provided at the middle position between the left suction cup 231 and the right suction cup 141. The cutting blade 36 can be replaced with different blade specifications.

[0027] After the film strip 46 completes the pre-applied film, it continues to move to the right until the rightmost end is directly below the right pressure roller 44. At this time, the right pressure roller 44 presses down on the film strip, and the film strip 46 continues to move to the right. The left pressure roller 22 is raised until the leftmost side of the film strip 46 moves directly below the cutting blade 36. At this time, the main suction cup 211, the left suction cup 231 and the right suction cup 141 simultaneously pick up the film, and the cutting blade 36 cuts the film. The film strip 46 continues to move to the right to complete the film application. The right pressure roller 44 is raised, and the vacuum of the right suction cup is released.

[0028] The scale 9 adjusts the position of the first limiting wheel 6 and the second limiting wheel 10 to adjust the conveying channel of the membrane 7. The scale 9 has a centrally symmetrical structure, and the center line of the membrane 7 in the width direction coincides with the center line of the scale 9.

[0029] Working principle: S1: Initial state: The rotating base 23 is in the horizontal initial position. The membrane 7 passes through the conveying track formed by the first limiting wheel 6 and the second limiting wheel 10, and passes through the limiting groove 142 at the bottom of the left suction cup 231 and the right suction cup 141. At this time, the bottom surface of the membrane 7, the bottom surface of the main suction cup 211 and the bottom surface of the left suction cup 231 are on the same plane. The main suction cup 211 and the left suction cup 231 start vacuum adsorption to adsorb and fix the membrane 7. The left pressure roller 22 is in the raised state and does not contact the membrane 7. At this time, the rightmost end of the strip 46 is directly below the cutting blade 36.

[0030] S2: Pre-applying film operation: The first drive mechanism 2 drives the left pressure roller 22 to press down on the strip 46, and the rotating base 23 rotates counterclockwise at the same time. The left suction cup 231 is lifted accordingly. At this time, the left suction cup 231 and the surface of the strip 46 form a reasonable film application angle to avoid the generation of film bubbles. The strip 46 is controlled to move slowly to the left until the rightmost end of the strip 46 is directly below the left pressure roller 22. The left pressure roller 22 moves with the strip 46 to realize the pre-applying film 7 to the surface of the strip 46, thus completing the pre-applying film process.

[0031] S3: Hot pressing operation: After the strip 46 completes the pre-applied film, it continues to move slowly to the right until the rightmost end of the strip 46 is directly below the right pressure roller 44; the second cylinder 13 drives the third drive mechanism 4 to move downward, causing the right pressure roller 44 to press down on the strip 46, and the cylindrical heater 45 heats the right pressure roller 44, and the right pressure roller 44 presses the film 7 tightly onto the surface of the strip 46 by hot pressing; at the same time, the first cylinder 12 drives the first drive mechanism 2 to move upward, and the left pressure roller 22 is lifted to release the pressing on the strip 46.

[0032] S4: Film Cutting and Finished Product Output: The film strip 46 continues to move to the right until the leftmost part of the film strip 46 moves directly below the cutting blade 36. At this time, the main suction cup 211, the left suction cup 231, and the right suction cup 141 simultaneously activate vacuum adsorption to adsorb and fix the two ends of the film 7 at the cutting position. The drive cylinder 32 drives the cutting blade 36 to slide along the linear guide rail 33 to precisely cut the film 7. After the cutting is completed, the film strip 46 continues to move to the right to complete the entire film application process. The second cylinder 13 drives the third drive mechanism 4 to move upward, the right pressure roller 44 is lifted, the vacuum of the right suction cup 141 is released, and the film strip 46 after film application enters the next process. This film application action is completed, the mechanism returns to the initial state, and it is ready for the next film application action.

[0033] While specific embodiments of the invention have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of the invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A novel semiconductor film bonding mechanism, characterized in that, The system includes a substrate (1), on which a first traction shaft (8), a scale (9), a second traction shaft (11), a second drive mechanism (3), a left fixing plate (15), a right fixing plate (5), and a right film suction mechanism (14) are provided. The first traction shaft (8) is provided with two first limiting wheels (6), and the second traction shaft (11) is provided with two second limiting wheels (10). The first limiting wheels (6) and the second limiting wheels (10) form a conveying track for the film (7). The right film suction mechanism (14) is provided with a right suction cup (141) at its bottom. The right film suction mechanism (14) is fixed to the substrate (1) by a fixing seat (143). The linear guide rail on the right fixed plate (5) is connected to the third drive mechanism (4) via the second linear guide rail slider (43). The third drive mechanism (4) is connected to the second cylinder (13). The third drive mechanism (4) includes a right pressure roller plate (41). A heat insulation plate (42) is provided at the lower end of the right pressure roller plate (41). A right pressure roller (44) is provided at the lower end of the heat insulation plate (42). A cylindrical heater (45) is connected to the right pressure roller (44). The linear guide rail on the left fixed plate (15) is connected to the first driving mechanism (2) through the first linear guide rail slider (24). The first driving mechanism (2) is connected to the first cylinder (12). The first driving mechanism (2) is fixedly provided with a left fixed plate (21). The bottom of the left fixed plate (21) is provided with a main suction cup (211). Two roller fixing seats (25) are fixedly provided on the right side of the left fixed plate (21). The roller fixing seats (25) are connected to the rotating base (23) and the left pressure roller (22) through the rotating shaft (232). The rotating base (23) is provided with a left suction cup (231). The second drive mechanism (3) is provided with a film cutting mechanism fixing plate (31) and a drive cylinder (32). The bottom of the film cutting mechanism fixing plate (31) is provided with a linear guide rail (33). The drive cylinder (32) drives the cutting blade (36) to run on the linear guide rail (33). The cutting blade (36) is provided with a blade changing handle (34) and a blade mounting seat (35).

2. The novel semiconductor film bonding mechanism according to claim 1, characterized in that, A cutting blade (36) is provided between the left suction cup (231) and the right suction cup (141) for cutting the film after the film is applied. A limiting groove (142) is provided at the bottom of both the left suction cup (231) and the right suction cup (141). The limiting groove (142) prevents the film from deviating during operation. At the same time, the setting of the limiting groove (142) can prevent the blade head of the cutting blade (36) from being exposed, thus achieving the functions of safety and protection. The cutting blade (36) is L-shaped, which is convenient for cutting the film and easy to replace.

3. The novel semiconductor film bonding mechanism according to claim 1, characterized in that, In the initial state of the rotating base (23), the membrane (7), the bottom surface of the main suction cup (211) and the bottom surface of the left suction cup (231) are on the same plane, and the main suction cup (211) and the left suction cup (231) are in the membrane suction state. At this time, the left pressure roller (22) does not contact the membrane.

4. The novel semiconductor film bonding mechanism according to claim 1, characterized in that, The first driving mechanism (2) drives the left pressure roller (22) to press down on the strip (46), and the rotating base (23) rotates counterclockwise at the same time. The left suction cup (231) is lifted up accordingly. The left suction cup (231) and the surface of the strip (46) form a film-applying angle, which facilitates film application. At this time, the strip (46) moves to the left until the rightmost end is directly below the left pressure roller (22), completing the pre-applying of film.

5. The novel semiconductor film bonding mechanism according to claim 1, characterized in that, A cutting blade (36) for cutting the film is provided at the middle position between the left suction cup (231) and the right suction cup (141). The cutting blade (36) can be replaced with different blade specifications.

6. The novel semiconductor film bonding mechanism according to claim 4, characterized in that, After the strip (46) completes the pre-applied film, it continues to move to the right until the rightmost end is directly below the right pressure roller (44). At this time, the right pressure roller (44) presses down on the strip, and the strip (46) continues to move to the right. The left pressure roller (22) lifts up until the leftmost side of the strip (46) moves directly below the cutting blade (36). At this time, the main suction cup (211), the left suction cup (231), and the right suction cup (141) simultaneously suck up the film, and the cutting blade (36) cuts the film. The strip (46) continues to move to the right to complete the film application. The right pressure roller (44) lifts up, and the right suction cup releases the vacuum.

7. The novel semiconductor film bonding mechanism according to claim 1, characterized in that, The scale (9) adjusts the position of the first limiting wheel (6) and the second limiting wheel (10) to adjust the conveying channel of the membrane (7). The scale (9) has a centrally symmetrical structure, and the center line of the membrane (7) in the width direction coincides with the center line of the scale (9).

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