Wafer clamping and positioning mechanism of plasma etching machine

Abstract

This invention relates to the field of plasma etching equipment technology, specifically disclosing a wafer clamping and positioning mechanism for a plasma etching machine. The mechanism includes a main unit with a clamping seat on its upper side for holding the wafer. A movable frame is rotatably connected to the inner side of the clamping seat. A ceramic plate for placing the wafer is fixedly connected to the center of the outer surface of the clamping seat. A negative pressure component is disposed inside the ceramic plate for adsorbing and fixing the wafer. By setting the clamping component, the clamping plate contacts the sidewall of the wafer, which can limit the wafer in the horizontal direction, reducing the risk of wafer displacement and wobbling during etching. The downward pressure component on the surface of the clamping plate can apply a certain pressure downward at the edge of the wafer in the vertical direction, thereby reducing the probability of edge warping deformation during etching, and further improving the wafer etching accuracy.

Description

Technical Field

[0001] This invention relates to the field of plasma etching equipment technology, and in particular to a wafer clamping and positioning mechanism for a plasma etching machine. Background Technology

[0002] Plasma etching machines are devices that use plasma to perform fine processing on materials. They use radio frequency power to excite gas to form plasma, and the ionized ions bombard the material surface under the acceleration of an electric field, achieving etching through physical sputtering or chemical reaction. They are widely used in semiconductor manufacturing, microelectromechanical systems, optoelectronic devices and other fields.

[0003] In the wafer etching process, clamping devices are often used to clamp and position the wafers in order to ensure processing accuracy. For example, Chinese patent application CN116454014B discloses a wafer clamping device. By adding fixed limiting components, the clamping device can clamp wafers of more specifications. It makes different groups of trays at different heights, and makes the trays away from the rotating limiting block higher. With the corresponding height of the tray, it can stably support the wafer and avoid interference from other groups of fixed limiting components. Existing wafer clamping devices use three sets of limiting blocks to contact the wafer sidewalls to clamp and position the wafer. However, when the wafer is etched by a plasma etching machine, the plasma bombards the wafer surface. Since the back of the wafer is suspended, the wafer is prone to deformation under the impact of the plasma. This not only affects the wafer processing accuracy but also increases the risk of wafer displacement, which in turn has an adverse effect on the wafer clamping accuracy. Summary of the Invention

[0004] The purpose of this invention is to provide a wafer clamping and positioning mechanism for a plasma etching machine, which applies a certain pressure downward at the edge of the wafer in the vertical direction, thereby reducing the probability of edge warping deformation of the wafer during the etching process, and solving the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a wafer clamping and positioning mechanism for a plasma etching machine, comprising a main unit, a clamping seat for clamping a wafer is provided on the upper side of the main unit, a movable frame is rotatably connected to the inner side of the clamping seat, a ceramic plate for placing a wafer is fixedly connected to the middle of the outer surface of the clamping seat, a negative pressure component is provided on the inner side of the ceramic plate, the negative pressure component is used to adsorb and fix the wafer, and a clamping component is provided on the upper side of the movable frame; The clamping assembly is used to clamp and fix the wafer. The clamping assembly includes a drive disk fixedly connected to the upper outer surface of the movable frame. A clamping plate is slidably connected to the upper outer surface of the clamping seat. A pressing component for pressing the wafer is provided on the outer surface of the clamping plate. A traction part is provided between the drive disk and the clamping plate. The drive disk drives the clamping plate to move linearly through the traction part.

[0006] Preferably, the inner side of the clamping seat is hollow, and the traction part includes a traction groove that extends through the outer surface of the clamping seat. A connecting block is slidably connected to the inner side of the traction groove. The connecting block is fixedly connected to the outer surface of the clamping plate. A driving block is fixedly connected to the lower outer surface of the connecting block. A driving groove is extended through the lower outer surface of the driving block. The driving block is rotatably connected to the driving disk through the driving groove.

[0007] Preferably, the number of the traction groove, the drive block and the clamping plate are all several groups and arranged in a ring array. The outer surface of the clamping plate is circular and contacts the sidewall of the wafer. The outer surface of the drive disk has a spiral structure.

[0008] Preferably, a drive assembly is provided on the outside of the movable frame. The drive assembly includes a motor fixedly connected to the inner surface of the main unit. A rotating shaft is fixedly connected to the upper end of the motor output shaft. The rotating shaft passes through to the upper side of the main unit and is rotatably connected to the main unit. A pull rod is fixedly connected to the outer surface of the rotating shaft. The pull rod is fixedly connected to the movable frame on the side away from the rotating shaft. There are two sets of pull rods, which are symmetrically distributed.

[0009] Preferably, a fixed base is fixedly connected to the lower outer surface of the ceramic plate, a rotating sleeve is rotatably connected to the upper side of the outer surface of the rotating shaft, the outer surface of the rotating sleeve is rotatably connected to the fixed base, a support base is fixedly connected to the lower outer surface of the clamping base, and the lower end of the support base is fixedly connected to the upper outer surface of the main unit.

[0010] Preferably, the adsorption assembly includes a gas storage cavity embedded in the inner side of a ceramic plate, a mesh is formed through the upper outer surface of the ceramic plate, the mesh is arranged in several groups in a ring array, the upper outer surface of the ceramic plate is in contact with the lower surface of the wafer, a gas guide cavity is embedded in the inner side of the fixing seat, the inner side of the gas guide cavity is connected to the inside of the gas storage cavity, and a conduit is embedded in the inner side of the fixing seat.

[0011] Preferably, a piston chamber is embedded in the inner side of the drive block, a piston plate is slidably connected to the inner surface of the piston chamber, a movable tube is fixedly connected to the outer surface of the piston plate, an adjusting valve is fixedly connected to the end of the movable tube away from the piston plate, the movable tube is connected to the inside of the guide tube through the adjusting valve, and a through hole is opened on the outer surface of the movable tube near the piston plate.

[0012] Preferably, the pressing component includes an embedded movable groove on the outer surface of the clamping plate, a guide block slidably connected to the inner side of the movable groove, the outer surface of the guide block having a trapezoidal structure, a pressure plate fixedly connected to the upper outer surface of the guide block, an elastic band fixedly connected to the upper outer surface of the pressure plate, and the upper end of the elastic band fixedly connected to the upper side of the inner surface of the movable groove.

[0013] Preferably, an installation groove is embedded in the upper outer surface of the ceramic plate, and a sealing sleeve is fixedly connected to the inner surface of the installation groove. The sealing sleeve has an arc-shaped cross-section, and a push rod is fixedly connected to the upper outer surface of the sealing sleeve. The push rod and the upper end of the sealing sleeve are in contact with the lower outer surface of the wafer. The sealing sleeve is made of elastic material, and both the sealing sleeve and the installation groove are distributed in a ring shape.

[0014] Preferably, the outer surface of the lower end of the pressure plate is in contact with the upper side of the outer surface of the wafer, the outer surface of the guide block is in contact with the sidewall of the wafer, and the upper side of the host is hinged with an organic cover.

[0015] Compared with the prior art, the beneficial effects of the present invention are: 1. This solution uses a clamping assembly that contacts the wafer sidewall with a clamping plate to limit the wafer in the horizontal direction, reducing the risk of wafer displacement and wobbling during etching. The downward pressure assembly on the surface of the clamping plate applies a certain pressure to the edge of the wafer in the vertical direction, thereby reducing the probability of edge warping and deformation during etching, and further improving the wafer etching accuracy. 2. This solution uses a pressing component and several sets of pressure plates to press and limit the edge of the wafer, thereby limiting the wafer in the vertical direction and maintaining stable contact between the wafer and the ceramic plate surface. This further improves the clamping stability of the wafer and effectively ensures the wafer etching accuracy. 3. This solution uses an adsorption component to apply negative gas pressure to the wafer, thereby stabilizing its position and reducing the probability of wafer displacement during etching. This ensures the quality of wafer etching. The uniformly distributed mesh ensures even stress distribution across the wafer, effectively reducing the risk of deformation when the wafer is adsorbed. Attached Figure Description

[0016] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a right view of the overall structure of the present invention; Figure 3 For the present invention Figure 2 Sectional view of the structure along the AA direction; Figure 4 This is a schematic diagram of the drive disk and drive block structure of the present invention; Figure 5 For the present invention Figure 4 Enlarged view of point B in the middle; Figure 6 For the present invention Figure 3 Enlarged view of point C in the middle; Figure 7 For the present invention Figure 3 Enlarged view of point D; Figure 8 For the present invention Figure 3 Enlarged view of point E in the middle; Figure 9 For the present invention Figure 3 Enlarged diagram of point F in the middle.

[0018] Explanation of reference numerals in the attached figures: 11. Main unit; 12. Clamping seat; 13. Traction groove; 14. Motor; 15. Support seat; 16. Movable frame; 17. Drive plate; 18. Drive block; 19. Drive groove; 20. Clamping plate; 21. Connecting block; 22. Movable tube; 23. Wafer; 24. Rotating shaft; 25. Rotating sleeve; 26. Fixed seat; 27. Ceramic plate; 28. Air guide chamber; 29. ​​Regulating valve; 30. Conduit; 31. Air storage chamber; 32. Mesh; 33. Mounting groove; 34. Top rod; 35. Sealing sleeve; 36. Piston chamber; 37. Piston plate; 38. Through hole; 39. Movable groove; 40. Guide block; 41. Pressure plate; 42. Elastic band; 43. Pull rod. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] Please see Figures 1 to 9 The present invention provides a technical solution: A wafer clamping and positioning mechanism for a plasma etching machine includes a main unit 11. A clamping seat 12 for clamping a wafer 23 is provided on the upper side of the main unit 11. A movable frame 16 is rotatably connected to the inner side of the clamping seat 12. A ceramic plate 27 for placing the wafer 23 is fixedly connected to the middle of the outer surface of the clamping seat 12. A negative pressure component is provided on the inner side of the ceramic plate 27. The negative pressure component is used to adsorb and fix the wafer 23. A clamping component is provided on the upper side of the movable frame 16. The clamping assembly is used to clamp and fix the wafer 23. The clamping assembly includes a drive disk 17 fixedly connected to the upper outer surface of the movable frame 16. A clamping plate 20 is slidably connected to the upper outer surface of the clamping base 12. A pressing component for pressing the wafer 23 is provided on the outer surface of the clamping plate 20. A traction part is provided between the drive disk 17 and the clamping plate 20. The drive disk 17 drives the clamping plate 20 to move linearly through the traction part.

[0021] The traction unit includes a traction groove 13 that extends through the outer surface of the clamping seat 12. A connecting block 21 is slidably connected to the inner side of the traction groove 13. The connecting block 21 is fixedly connected to the outer surface of the clamping plate 20. A driving block 18 is fixedly connected to the lower outer surface of the connecting block 21. A driving groove 19 extends through the lower outer surface of the driving block 18. The driving block 18 is rotatably connected to the driving disk 17 through the driving groove 19.

[0022] The number of traction grooves 13, driving blocks 18 and clamping plates 20 are all in several groups and are arranged in a ring array. The outer surface of clamping plate 20 is ring-shaped and the outer surface of clamping plate 20 is in contact with the sidewall of wafer 23.

[0023] By adopting the above technical solution, the host 11 is the core structure of the plasma etching machine. It generates high-density plasma and combines physical bombardment with chemical reaction to achieve etching of the wafer 23. In order to ensure the processing accuracy of the wafer 23, a clamping mechanism is required to clamp and position the wafer 23. During the etching process, the wafer 23 is placed on the surface of the ceramic plate 27 in the middle of the clamping seat 12. The ceramic plate 27 has good high temperature resistance and heat insulation effect, which can effectively meet the etching requirements of the wafer 23. The clamping seat 12 is hollow inside to support the rotation of the movable frame 16. After the wafer 23 is placed, the movable frame 16 is driven to rotate by external force. During the rotation of the movable frame 16, the drive disk 17 will move synchronously. The outer surface of the drive disk 17 has a spiral structure. During the rotation, it will rotate and contact the drive block 18 through the drive groove 19. The traction groove 13 can limit the connection block 21, so that the connection block 21 can only slide linearly. The rotating drive block 18 of the moving disk 17 slides along the traction groove 13 under the traction action of the connecting block 21. The drive disk 17 drives several sets of drive blocks 18 to move synchronously, so that the drive blocks 18 drive the clamping plate 20 to move synchronously towards the wafer 23. The pitch of the drive disk 17 remains stable, so that the moving speed of each set of drive blocks 18 remains stable. Through the contact between the clamping plates 20 distributed in a ring array and the surface of the wafer 23, the position of the wafer 23 can be pushed, so that the center of the wafer 23 coincides with the center of the clamping seat 12, thereby realizing the automatic positioning of the wafer 23 without the need for manual control of the placement position of the wafer 23. This can reduce the difficulty of placing the wafer 23 to a certain extent and help improve the processing efficiency of the wafer 23. By controlling the movement of the clamping plate 20 by different distances, it can play a good clamping role for wafers 23 of different diameters, thereby effectively improving the functionality and flexibility of the clamping device. The outer surface of the clamping plate 20 is arc-shaped, which can reduce the contact area with the sidewall of the wafer 23 to a certain extent, thereby reducing the interference of the clamping structure on the etching process of the wafer 23. By contacting the sidewall of the wafer 23, the clamping plate 20 can limit the wafer 23 in the horizontal direction, thereby reducing the risk of the wafer 23 shifting and shaking during the etching process. The pressing component on the surface of the clamping plate 20 can apply a certain pressure to the edge of the wafer 23 in the vertical direction, thereby reducing the probability of edge warping deformation of the wafer 23 during the etching process, and further improving the etching accuracy of the wafer 23. After the etching of wafer 23 is completed, the operator controls motor 14 to rotate in the opposite direction. At this time, drive disk 17 will drive drive block 18 and clamping plate 20 to move in the opposite direction, thereby causing clamping plate 20 to disengage from the side wall of wafer 23, thus releasing the clamping limit on wafer 23.

[0024] Specifically, such as Figure 3 and Figure 6 As shown, a drive assembly is provided on the outside of the movable frame 16. The drive assembly includes a motor 14 fixedly connected to the inner surface of the main unit 11. A rotating shaft 24 is fixedly connected to the upper end of the output shaft of the motor 14. The rotating shaft 24 passes through to the upper side of the main unit 11 and is rotatably connected to the main unit 11. A pull rod 43 is fixedly connected to the outer surface of the rotating shaft 24. The side of the pull rod 43 away from the rotating shaft 24 is fixedly connected to the movable frame 16. There are two sets of pull rods 43, which are symmetrically distributed.

[0025] A fixed base 26 is fixedly connected to the lower outer surface of the ceramic plate 27. A rotating sleeve 25 is rotatably connected to the upper side of the outer surface of the rotating shaft 24. The outer surface of the rotating sleeve 25 is rotatably connected to the fixed base 26. A support base 15 is fixedly connected to the lower outer surface of the clamping base 12. The lower end of the support base 15 is fixedly connected to the upper outer surface of the main unit 11.

[0026] By adopting the above technical solution, the host 11 supports the clamping seat 12 through the support seat 15, so that the position of the support seat 15 remains stable. When the drive component is working, the motor 14 is electrically operated, and the output shaft of the motor 14 will drive the rotating shaft 24 to rotate synchronously. During the rotation of the rotating shaft 24, the movable frame 16 will be driven to rotate synchronously through the pull rod 43. During the movement of the movable frame 16, the drive disk 17 will move synchronously. The rotation of the drive disk 17 can drive the drive block 18 and the clamping plate 20 to slide at a uniform speed, so that the outer surface of the clamping plate 20 can make stable contact with the side wall of the wafer 23. This can reduce the risk of deformation and damage to the wafer 23 due to excessive compression to a certain extent. The fixed seat 26 is rotatably connected to the rotating shaft 24 through the rotating sleeve 25. During the rotation of the rotating shaft 24, the fixed seat 26 can always remain stable.

[0027] Specifically, such as Figure 3 , Figure 6 , Figure 7 and Figure 8 As shown, the adsorption assembly includes a gas storage cavity 31 embedded inside the ceramic plate 27, a mesh 32 extending through the upper outer surface of the ceramic plate 27, the upper outer surface of the ceramic plate 27 being in contact with the lower surface of the wafer 23, a gas guide cavity 28 embedded inside the fixing base 26, the inside of the gas guide cavity 28 being connected to the inside of the gas storage cavity 31, and a conduit 30 embedded inside the fixing base 26.

[0028] A piston chamber 36 is embedded in the inner side of the drive block 18. A piston plate 37 is slidably connected to the inner surface of the piston chamber 36. A movable tube 22 is fixedly connected to the outer surface of the piston plate 37. A regulating valve 29 is fixedly connected to the end of the movable tube 22 away from the piston plate 37. The movable tube 22 is connected to the inside of the guide tube 30 through the regulating valve 29. A through hole 38 is opened through the outer surface of the movable tube 22 near the piston plate 37.

[0029] By adopting the above technical solution, the air guide cavity 28 inside the fixed base 26 is connected to the air storage cavity 31 inside the ceramic plate 27, thereby ensuring normal air flow. After the wafer 23 is placed on the upper side of the ceramic plate 27, the control clamping plate 20 first clamps and positions the wafer 23. When the drive disk 17 drives the drive block 18 to move towards the wafer 23, the piston plate 37 will slide away from the wafer 23 inside the piston cavity 36. The piston plate 37 divides the internal space of the piston cavity 36 into two groups. As the piston plate 37 gradually moves, the gas pressure inside the piston cavity 36 near the movable tube 22 will gradually decrease. The movable tube 22 is hollow and connected to the inside of the piston cavity 36 through the through hole 38. At this time, the air storage cavity 31 and Under negative pressure, the gas inside the gas guide chamber 28 is drawn into the piston chamber 36 through the conduit 30 and regulating valve 29, causing a certain negative pressure to be generated inside the gas storage chamber 31. The wafer 23 is adsorbed onto the surface of the ceramic plate 27 through the mesh 32 on the surface of the ceramic plate 27. The negative pressure of the gas can adsorb the wafer 23, thereby keeping the position of the wafer 23 stable. This helps to further reduce the probability of the wafer 23 shifting during the etching process, thus ensuring the etching quality of the wafer 23. The mesh 32 consists of several groups and is distributed in a ring array. The uniformly distributed mesh 32 can make the force on all parts of the wafer 23 uniform, thereby effectively reducing the risk of deformation of the wafer 23 when it is adsorbed.

[0030] Specifically, such as Figure 9 As shown, the pressing component includes an embedded movable groove 39 on the outer surface of the clamping plate 20. A guide block 40 is slidably connected to the inner side of the movable groove 39. The outer surface of the guide block 40 has a trapezoidal structure. A pressure plate 41 is fixedly connected to the upper outer surface of the guide block 40. An elastic band 42 is fixedly connected to the upper outer surface of the pressure plate 41. The upper end of the elastic band 42 is fixedly connected to the upper side of the inner surface of the movable groove 39.

[0031] The lower outer surface of the pressure plate 41 contacts the upper side of the outer surface of the wafer 23, the outer surface of the guide block 40 contacts the side wall of the wafer 23, and the main unit 11 is hinged to the upper side of the cover.

[0032] By adopting the above technical solution, the clamping plate 20 slides to support the guide block 40 through the movable groove 39. The movable groove 39 applies a certain traction force to the guide block 40 through the elastic band 42. When the clamping plate 20 moves towards the wafer 23, the guide block 40 on the surface of the clamping plate 20 will contact the side wall of the wafer 23. The outer surface of the guide block 40 is inclined, and a certain extrusion force will be generated between the guide block 40 and the wafer 23. At this time, the guide block 40 will move downward along the interior of the movable groove 39 under the action of the extrusion force. During the movement, the guide block 40 will drive the pressure plate 41 to move synchronously, so that the lower surface of the pressure plate 41 contacts the edge of the wafer 23. By setting several sets of pressure plates 41 to press and limit the edge of the wafer 23, the wafer 23 can be limited in the vertical direction, so that the wafer 23 and the surface of the ceramic plate 27 are in stable contact, thereby further improving the clamping stability of the wafer 23 and effectively ensuring the etching accuracy of the wafer 23.

[0033] Specifically, such as Figure 7 As shown, an installation groove 33 is embedded in the upper outer surface of the ceramic plate 27. A sealing sleeve 35 is fixedly connected to the inner surface of the installation groove 33. The sealing sleeve 35 has an arc-shaped cross section. A push rod 34 is fixedly connected to the upper outer surface of the sealing sleeve 35. The upper ends of the push rod 34 and the sealing sleeve 35 are in contact with the lower outer surface of the wafer 23. The sealing sleeve 35 is made of elastic material. The sealing sleeve 35 and the installation groove 33 are both distributed in a ring shape.

[0034] By adopting the above technical solution, the mounting groove 33 on the surface of the ceramic plate 27 is used to place the sealing sleeve 35. After the wafer 23 is placed on the surface of the ceramic plate 27, the push rod 34 on the surface of the sealing sleeve 35 will contact the lower surface of the wafer 23. At this time, the push rod 34 will press the sealing sleeve 35 downward under the gravity of the wafer 23, thereby causing the sealing sleeve 35 to undergo elastic deformation to increase the bending arc of the sealing sleeve 35. At this time, both ends of the sealing sleeve 35 will contact the lower surface of the wafer 23. The sealing sleeve 35 is in the shape of a ring and can seal the wafer 23 and the ceramic plate 27, thereby reducing the risk of gas leakage between the ceramic plate 27 and the wafer 23. This helps to further improve the adsorption and fixation effect of the adsorption component on the wafer 23, thereby improving the clamping stability of the wafer 23.

[0035] Working principle: During the etching process of wafer 23, wafer 23 is placed on the surface of ceramic plate 27 in the middle of clamping base 12. The rotating shaft 24 drives the movable frame 16 to rotate synchronously through the pull rod 43. During the movement of the movable frame 16, the driving disk 17 moves synchronously. The driving block 18 is in rotational contact with the driving block 18 through the driving groove 19. Under the traction of the connecting block 21, the driving block 18 slides along the traction groove 13. The driving disk 17 drives several sets of driving blocks 18 to move synchronously, so that the driving blocks 18 drive the clamping plate 20 to move synchronously towards wafer 23. Through the contact between the clamping plate 20 and the side wall of wafer 23, the wafer 23 can be limited in the horizontal direction. When the driving disk 17 drives the driving block 18 to move towards one side of wafer 23, the piston plate 37 slides away from wafer 23 inside the piston chamber 36. Under the action of negative pressure, the gas inside the gas storage chamber 31 and the gas guide chamber 28 is drawn into the piston chamber through the conduit 30 and the regulating valve 29. Inside the gas storage chamber 31, a certain negative pressure is generated. The wafer 23 is adsorbed onto the surface of the ceramic plate 27 through the mesh 32 on the surface of the ceramic plate 27. The negative pressure of the gas can adsorb the wafer 23. The two ends of the sealing sleeve 35 will contact the lower surface of the wafer 23. The sealing sleeve 35 is circular and can seal the wafer 23 and the ceramic plate 27, thereby reducing the risk of gas leakage between the ceramic plate 27 and the wafer 23. This helps to further improve the adsorption and fixation effect of the adsorption component on the wafer 23. When the clamping plate 20 moves towards the wafer 23, the guide block 40 on the surface of the clamping plate 20 will contact the side wall of the wafer 23. During the movement, the guide block 40 will drive the pressure plate 41 to move synchronously, so that the lower surface of the pressure plate 41 contacts the edge of the wafer 23. By setting several sets of pressure plates 41 to press and limit the edge of the wafer 23, the wafer 23 can be limited in the vertical direction.

[0036] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer clamping and positioning mechanism for a plasma etching machine, comprising a main unit (11), characterized in that: The host (11) is provided with a clamping seat (12) for clamping the wafer (23) on the upper side. The clamping seat (12) is rotatably connected to a movable frame (16) on the inner side. A ceramic plate (27) for placing the wafer (23) is fixedly connected to the middle of the outer surface of the clamping seat (12). A negative pressure component is provided on the inner side of the ceramic plate (27). The negative pressure component is used to adsorb and fix the wafer (23). The movable frame (16) is provided with a clamping component on the upper side. The clamping assembly is used to clamp and fix the wafer (23). The clamping assembly includes a drive disk (17) fixedly connected to the upper outer surface of the movable frame (16). A clamping plate (20) is slidably connected to the upper outer surface of the clamping seat (12). A pressing component for pressing the wafer (23) is provided on the outer surface of the clamping plate (20). A traction part is provided between the drive disk (17) and the clamping plate (20). The drive disk (17) drives the clamping plate (20) to move linearly through the traction part.

2. The wafer clamping and positioning mechanism for a plasma etching machine according to claim 1, characterized in that: The inner side of the clamping seat (12) is hollow. The traction part includes a traction groove (13) that runs through the outer surface of the clamping seat (12). A connecting block (21) is slidably connected to the inner side of the traction groove (13). The connecting block (21) is fixedly connected to the outer surface of the clamping plate (20). A driving block (18) is fixedly connected to the lower outer surface of the connecting block (21). A driving groove (19) runs through the lower outer surface of the driving block (18). The driving block (18) is rotatably connected to the driving disk (17) through the driving groove (19).

3. The wafer clamping and positioning mechanism for a plasma etching machine according to claim 2, characterized in that: The number of the traction groove (13), the drive block (18) and the clamping plate (20) are all in several groups and arranged in a ring array. The outer surface of the clamping plate (20) is in a ring shape and the outer surface of the clamping plate (20) is in contact with the side wall of the wafer (23). The outer surface of the drive disk (17) is in a spiral structure.

4. The wafer clamping and positioning mechanism for a plasma etching machine according to claim 3, characterized in that: A drive assembly is provided on the outside of the movable frame (16). The drive assembly includes a motor (14) fixedly connected to the inner surface of the host (11). A rotating shaft (24) is fixedly connected to the upper end of the output shaft of the motor (14). The rotating shaft (24) passes through to the upper side of the host (11) and is rotatably connected to the host (11). A pull rod (43) is fixedly connected to the outer surface of the rotating shaft (24). The pull rod (43) is fixedly connected to the movable frame (16) on the side away from the rotating shaft (24). There are two sets of pull rods (43) and they are symmetrically distributed.

5. The wafer clamping and positioning mechanism for a plasma etching machine according to claim 4, characterized in that: A fixed base (26) is fixedly connected to the lower outer surface of the ceramic plate (27), and a rotating sleeve (25) is rotatably connected to the upper side of the outer surface of the rotating shaft (24). The outer surface of the rotating sleeve (25) is rotatably connected to the fixed base (26). A support base (15) is fixedly connected to the lower outer surface of the clamping seat (12), and the lower end of the support base (15) is fixedly connected to the upper outer surface of the host (11).

6. The wafer clamping and positioning mechanism for a plasma etching machine according to claim 5, characterized in that: The adsorption assembly includes a gas storage cavity (31) embedded inside a ceramic plate (27). A mesh (32) is formed through the upper outer surface of the ceramic plate (27). The mesh (32) consists of several groups arranged in a ring array. The upper outer surface of the ceramic plate (27) is in contact with the lower surface of the wafer (23). A gas guide cavity (28) is embedded inside the fixing seat (26). The inside of the gas guide cavity (28) is connected to the inside of the gas storage cavity (31). A conduit (30) is embedded inside the fixing seat (26).

7. A wafer clamping and positioning mechanism for a plasma etching machine according to claim 6, characterized in that: The drive block (18) has a piston chamber (36) embedded inside. A piston plate (37) is slidably connected to the inner surface of the piston chamber (36). A movable tube (22) is fixedly connected to the outer surface of the piston plate (37). A regulating valve (29) is fixedly connected to the end of the movable tube (22) away from the piston plate (37). The movable tube (22) is connected to the inside of the guide tube (30) through the regulating valve (29). A through hole (38) is opened through the outer surface of the movable tube (22) near the piston plate (37).

8. A wafer clamping and positioning mechanism for a plasma etching machine according to claim 7, characterized in that: The pressing component includes an embedded movable groove (39) on the outer surface of the clamping plate (20). A guide block (40) is slidably connected to the inner side of the movable groove (39). The outer surface of the guide block (40) has a trapezoidal structure. A pressure plate (41) is fixedly connected to the upper outer surface of the guide block (40). An elastic band (42) is fixedly connected to the upper outer surface of the pressure plate (41). The upper end of the elastic band (42) is fixedly connected to the upper side of the inner surface of the movable groove (39).

9. A wafer clamping and positioning mechanism for a plasma etching machine according to claim 8, characterized in that: An installation groove (33) is embedded in the upper outer surface of the ceramic plate (27). A sealing sleeve (35) is fixedly connected to the inner surface of the installation groove (33). The sealing sleeve (35) has an arc-shaped cross section. A push rod (34) is fixedly connected to the upper outer surface of the sealing sleeve (35). The upper ends of the push rod (34) and the sealing sleeve (35) are in contact with the lower outer surface of the wafer (23). The sealing sleeve (35) is made of elastic material. The sealing sleeve (35) and the installation groove (33) are both distributed in a ring shape.

10. A wafer clamping and positioning mechanism for a plasma etching machine according to claim 9, characterized in that: The lower outer surface of the pressure plate (41) is in contact with the upper side of the outer surface of the wafer (23), the outer surface of the guide block (40) is in contact with the side wall of the wafer (23), and the upper side of the host (11) is hinged with an organic cover.

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