A device and method for monitoring whether a wafer is in contact with a hot plate.

Abstract

This application relates to the field of semiconductor manufacturing technology and discloses a device and method for monitoring whether a wafer is in contact with a hot plate. The device includes a hot plate, an air pipe, and a pressure gauge. The hot plate has at least one through hole. One end of the air pipe is connected to the through hole, and the other end of the air pipe is connected to the pressure gauge. The pressure gauge is configured to collect the pressure fluctuation value of the wafer acting on the hot plate through the air pipe and the through hole when the wafer descends toward the hot plate until it contacts and / or is in contact with the hot plate. The number of air pipes is the same as the number of through holes. In the embodiment of this application, through holes are provided on the hot plate, and the pressure fluctuation value collected by the air pipe from the through hole is collected by the pressure gauge. Then, the pressure fluctuation value is used to monitor whether the wafer is in contact with the hot plate, thereby conveniently and effectively monitoring whether the degree of contact between the wafer and the hot plate meets the standard. On this basis, the uniformity of wafer baking is ensured.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and provides an apparatus and method for monitoring whether a wafer and a hot plate are in contact. Background Technology

[0002] In semiconductor manufacturing, the hot plate baking process of the coating and developing equipment is a key step in the photolithography process. The wafer needs to be baked at high temperature (e.g., 100°C ~ 250°C), and the baking accuracy directly affects the process parameters (e.g., film thickness, line width, pattern geometry, etc.).

[0003] Hot plates are mainly used for pre-baking (Soft Bake, SB) after photoresist coating and post-baking (Post Exposure Bake, PEB) after photolithography exposure. Their core functions include: 1) Solvent evaporation: Heating (e.g., 90°C-150°C) evaporates the solvent in the photoresist, forming a uniform film thickness and solidifying the film; 2) Chemical reaction control: After the photoresist is exposed in the photolithography machine, baking triggers the chemical amplification reaction of the exposed product, directly affecting the resolution and morphology of the developed pattern; 3) Stress relief: Relieves the stress in the photoresist by raising and lowering the temperature.

[0004] Currently, mainstream equipment uses the heating and cooling profiles of the hot plate to verify whether the wafer and the hot plate are in contact. (See the heating and cooling profiles mentioned above.) Figure 1 As shown, because the hot plate has a higher temperature and the wafer has a lower temperature, when the wafer descends and comes into contact with the hot plate, the temperature at the point where the wafer contacts the hot plate drops rapidly, forming a U-shaped cooling zone. When the wafer and the hot plate are fully in contact, the area corresponding to this U-shaped cooling zone is at its maximum, and the temperature of the hot plate corresponding to the U-shaped cooling zone drops to its minimum. For example, see [reference needed]. Figure 2 As shown, when the wafer and the hot plate are fully bonded, the temperature corresponding to the U-shaped cooling zone reaches its lowest point of 99.2°C. When the wafer and the hot plate are not fully bonded, the temperature corresponding to the U-shaped cooling zone is 99.8°C, which obviously does not reach the aforementioned lowest point.

[0005] It should be noted that various factors during the manufacturing process can cause the wafer and the hotplate to not fully bond. (See [link to relevant documentation]). Figure 3 As shown, hot plates typically have multiple limiting blocks to define the wafer's placement position. However, during the wafer's descent, one end of the wafer may directly contact the top of a limiting block, while the other end remains on the hot plate. This results in the wafer being positioned with one end higher than the other, preventing complete contact between the wafer and the hot plate. See also... Figure 4As shown, during the manufacturing process, stains inevitably appear on the surface of the hot plate. These stains protrude from the surface of the hot plate. When the wafer descends to the surface of the hot plate, the wafer will first adhere to the aforementioned stains. This will cause the wafer at the location corresponding to the stains to not be completely adhered to the hot plate.

[0006] In the current monitoring process, the area of ​​the U-shaped cooling zone is first calculated. Then, it is determined whether the temperature of the hot plate at the point where the wafer and the hot plate are attached has dropped to the lowest point. If the U-shaped area is smaller than the set threshold, the temperature will not drop to the minimum. In this case, the host computer issues an early warning, indicating that the wafer and the hot plate are not attached. Summary of the Invention

[0007] This application provides an apparatus and method for monitoring whether a wafer and a hot plate are in contact, which monitors whether the wafer and the hot plate are in contact based on pressure fluctuation values, thereby conveniently and effectively monitoring whether the degree of contact between the wafer and the hot plate meets the standard.

[0008] The specific technical solution provided in this application is as follows: In a first aspect, embodiments of this application provide a device for monitoring whether a wafer is in contact with a hot plate, comprising: a hot plate, an air pipe, and a pressure gauge; At least one through hole is provided on the hot plate. One end of the air pipe is connected to the through hole, and the other end of the air pipe is connected to a pressure gauge. The pressure gauge is configured to collect the pressure fluctuation value of the wafer acting on the hot plate through the air pipe and the through hole when the wafer descends toward the hot plate until it contacts and / or adheres to the hot plate. The number of air pipes is the same as the number of through holes.

[0009] Optionally, the above-mentioned device further includes: a host computer; The host computer is electrically connected to the pressure gauge and is configured to receive the pressure fluctuation values ​​collected by the pressure gauge, and monitor whether the wafer and the hot plate are in contact based on the pressure fluctuation values.

[0010] Optionally, the orthographic projection of the wafer onto the hot plate covers each via.

[0011] Alternatively, all tracheae may be of equal length.

[0012] Optionally, it also includes: connecting pipe fittings, the number of which is the same as the number of through holes; One end of the connecting fitting is connected to the through hole, and the other end of the connecting fitting is connected to the air pipe.

[0013] Secondly, embodiments of this application also provide a monitoring method for a device for monitoring whether a wafer and a hot plate are in contact, applying any one of the first aspects, and applied to a host computer, comprising: During the acquisition period, the pressure fluctuation value collected by the pressure gauge is obtained. The pressure fluctuation value is the pressure difference collected by the pressure gauge through the through hole and the air tube when the wafer descends at a preset speed until it contacts and / or adheres to the hot plate. Compare the pressure fluctuation value with a preset pressure reference value, wherein the pressure reference value is used to characterize the pressure supplied to the pressure gauge through the through hole and the air pipe when the wafer is lowered at a preset speed until it is fully in contact with the hot plate; If the pressure fluctuation value is less than the pressure reference value, it is determined that the wafer and the hot plate are not fully bonded, and an early warning is issued.

[0014] Optionally, pressure fluctuation values ​​collected by the pressure gauge during the data collection period are acquired, including: Determine the first duration for which the wafer descends at a preset speed until it contacts and / or adheres to the hot plate; The data collection period is obtained based on the first duration and the preset error duration; The pressure gauge acquires a first pressure value and a second pressure value during the acquisition period, and determines the pressure fluctuation value based on the first pressure value and the second pressure value. The first pressure value represents the minimum pressure value acquired by the pressure gauge during the acquisition period, and the second pressure value represents the maximum pressure value acquired by the pressure gauge during the acquisition period.

[0015] Optionally, the pressure fluctuation value is obtained in the following way: If the pressure gauge has only one port for connecting the air tubes, then each air tube is connected to its respective first end of the connector, and the second end of the connector is connected to the port. The pressure gauge accumulates the pressures from the multiple gas pressures in the connector to obtain the pressure fluctuation value; or If the pressure gauge has at least two ports for connecting to the air tubes, then each air tube is connected to each port in a one-to-one correspondence. The pressure gauge accumulates the gas pressure in each air tube to obtain the pressure fluctuation value.

[0016] Thirdly, a host computer includes: Memory, used to store executable instructions; A processor for reading and executing executable instructions stored in memory to implement the method as described in any of the second aspects.

[0017] Fourthly, a computer-readable storage medium, when instructions in the storage medium are executed by a processor, enables the processor to perform the method described in any of the second aspects above.

[0018] The beneficial effects of this application are as follows: In summary, this application provides an apparatus and method for monitoring whether a wafer is in contact with a hot plate. The apparatus includes a hot plate, an air pipe, and a pressure gauge. The hot plate has at least one through hole. One end of the air pipe is connected to the through hole, and the other end is connected to the pressure gauge. The pressure gauge is configured to collect the pressure fluctuation value of the wafer acting on the hot plate through the air pipe and the through hole when the wafer descends toward the hot plate until it contacts and / or adheres to the hot plate. The number of air pipes is the same as the number of through holes. In this application, through holes are provided on the hot plate, and the pressure fluctuation value collected by the air pipes from the through holes is collected by the pressure gauge. The pressure fluctuation value is then used to monitor whether the wafer is in contact with the hot plate. Thus, during the process of the wafer descending and adhering to the hot plate, the degree of adhesion between the wafer and the hot plate is conveniently and effectively monitored, thereby ensuring the uniformity of wafer baking.

[0019] Other features and advantages of this application will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the application. The objectives and other advantages of this application may be realized and obtained by means of the structures particularly pointed out in the written description, claims, and drawings. Attached Figure Description

[0020] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a schematic diagram of a temperature rise and fall curve in a related technology; Figure 2 This is a schematic diagram showing the area and temperature corresponding to a U-shaped cooling zone in a related technology; Figure 3 This is a schematic diagram illustrating how the wafer and the hot plate are not fully bonded due to the limiting block in a related technology. Figure 4 This is a schematic diagram illustrating how contaminants can cause incomplete bonding between the wafer and the heatsink in related technologies. Figure 5 This is a schematic diagram of a through hole provided on a hot plate in an embodiment of this application; Figure 6 This is a schematic diagram of another embodiment of the present application in which a through hole is provided on the hot plate; Figure 7 This is a schematic diagram of the first device for monitoring whether a wafer and a hot plate are in contact, as described in the embodiments of this application. Figure 8 This is a schematic diagram of a second type of device for monitoring whether a wafer and a hot plate are in contact, as described in the embodiments of this application. Figure 9This is a schematic diagram of a third type of device for monitoring whether a wafer and a hot plate are in contact, as described in the embodiments of this application. Figure 10 This is a schematic diagram of the fourth type of device for monitoring whether the wafer and the hot plate are in contact, as described in the embodiments of this application; Figure 11 This is a flowchart illustrating a monitoring method in an embodiment of this application; Figure 12 This is a schematic diagram of a process in which a host computer acquires the pressure fluctuation value received by a pressure gauge in an embodiment of this application; Figure 13 This is a schematic diagram of the physical architecture of the host computer in the embodiments of this application. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings of the embodiments of this application. Obviously, the described embodiments are only some embodiments of the technical solutions of this application, and not all embodiments. Based on the embodiments recorded in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the technical solutions of this application.

[0022] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in sequences other than those illustrated or described herein.

[0023] The preferred embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0024] This application provides a device for monitoring whether a wafer is in contact with a hot plate, comprising: a hot plate, an air pipe, and a pressure gauge.

[0025] Unlike related technologies, the hot plate in this application embodiment is provided with at least one through hole. Exemplarily, the number of through holes is two, three, or four. Typically, the diameter of each through hole is approximately 1 mm. Figure 7 As shown, the aforementioned through hole is a through hole that penetrates the hot plate along the first direction F1.

[0026] See Figure 5 As shown, two through holes, a1 and b1, are provided on the hot plate. For example, both through holes a1 and b1 are 0.8 mm in diameter, and they are symmetrical about the center of the hot plate.

[0027] See Figure 6As shown, three through holes, a2, b2 and c2, are provided on the hot plate. For example, the through holes a2, b2 and c2 are all 0.9mm, and the distances from the through holes a2, b2 and c2 to the center of the hot plate are all equal.

[0028] In this embodiment, in addition to the through holes on the hot plate, an air pipe is also provided on the side of the hot plate away from the wafer. It should be noted that the number of air pipes is the same as the number of through holes. One end of the air pipe is connected to the through hole, and the other end of the air pipe is connected to a pressure gauge.

[0029] See Figure 7 As shown, when through holes c1 and d1 are provided on the hot plate, air pipes A11 and B11 are provided on the side of the hot plate away from the wafer. One end of air pipe A11 is connected to through hole c1, and the other end of air pipe A11 is connected to a pressure gauge. One end of air pipe B11 is connected to through hole d1, and the other end of air pipe B11 is connected to a pressure gauge. For example, the air pipes are made of high-temperature resistant PFA tubing.

[0030] It should be noted that the orthogonal projection of the wafer onto the hot plate covers all the vias.

[0031] During implementation, the wafer descends toward the hot plate under the action of the lifting pin. When the wafer is in contact with the hot plate, the wafer will generate gas pressure on the through holes. In this embodiment, in order to collect effective gas pressure through the gas pipe, that is, when the wafer is directly above the hot plate, the orthogonal projection of the wafer on the hot plate during the descent process should cover each through hole.

[0032] Furthermore, to ensure the pressure gauge obtains effective pressure fluctuation values, all the aforementioned air tubes are of equal length. During implementation, when the pressure gauge has only one port for connecting the air tubes, to collect the gas pressure generated on each via at the same moment the wafer contacts and covers the hot plate, the distance between the pressure gauge and each via is equal, and the length of each air tube is also equal. This ensures that the gas pressure generated on each via at the moment the wafer contacts and adheres to the hot plate is equal, and the pressure is then transmitted to the pressure gauge via air tubes of equal length. The pressure gauge can then obtain the most accurate pressure fluctuation value, and based on this, can accurately determine whether each part of the wafer is completely adhered to the hot plate.

[0033] See Figure 7As shown, when through holes c1 and d1 are provided on the hot plate, gas pipes A11 and B11 are provided on the side of the hot plate away from the wafer. One end of gas pipe A11 is connected to through hole c1, and the other end of gas pipe A11 is connected to a pressure gauge. One end of gas pipe B11 is connected to through hole d1, and the other end of gas pipe B11 is connected to a pressure gauge. The pressure gauge is located directly below the center of the hot plate. The lengths of gas pipes A11 and B11 are equal, and through holes c1 and d1 are symmetrical about the center. In this way, during the process of the wafer contacting and bonding with the hot plate, the gas pressure 1 generated by through hole c1 is provided to the port of the pressure gauge through gas pipe A11, and at the same time, the gas pressure 2 generated by through hole d1 is provided to the port of the pressure gauge through gas pipe B11.

[0034] During implementation, the pressure gauge is configured to collect the pressure fluctuation value of the wafer acting on the through hole through the air tube as the wafer descends toward the hot plate.

[0035] For example, see Figure 7 As shown, when through holes c1 and d1 are provided on the hot plate, gas pipes A11 and B11 are provided on the side of the hot plate away from the wafer. One end of gas pipe A11 is connected to through hole c1, and the other end of gas pipe A11 is connected to a pressure gauge. One end of gas pipe B11 is connected to through hole d1, and the other end of gas pipe B11 is connected to a pressure gauge. The pressure gauge is located directly below the center of the hot plate. The lengths of gas pipes A11 and B11 are equal, and through holes c1 and d1 are symmetrical about the center. In this way, during the process of the wafer contacting and adhering to the hot plate, the gas pressure 1 generated by through hole c1 is provided to the port of the pressure gauge through gas pipe A11, and at the same time, the gas pressure 2 generated by through hole d1 is provided to the port of the pressure gauge through gas pipe B11. Then, the pressure gauge accumulates the gas pressure 1 and gas pressure 2 to obtain the pressure fluctuation value.

[0036] For example, see Figure 8As shown, when through holes c2, d2, and e2 are provided on the hot plate, air pipes A21, B21, and C21 are provided on the side of the hot plate away from the wafer. One end of air pipe A21 is connected to through hole c2, and the other end of air pipe A21 is connected to a pressure gauge. One end of air pipe B21 is connected to through hole d2, and the other end of air pipe B21 is connected to a pressure gauge. The pressure gauge is located directly below the center of the hot plate. The lengths of air pipes A21, B21, and C21 are equal. Through hole c2... The distances from through-holes d2 and e2 to the center of the circle are equal. Thus, during the process of the wafer contacting and bonding with the hot plate, the gas pressure 1 generated by through-hole c2 is supplied to the port of the pressure gauge via gas pipe A21. At the same time, the gas pressure 2 generated by through-hole d2 is supplied to the port of the pressure gauge via gas pipe B21. Meanwhile, the gas pressure 3 generated by through-hole e2 is supplied to the port of the pressure gauge via gas pipe C21. Afterwards, the pressure gauge accumulates the above gas pressures 1, 2 and 3 to obtain the pressure fluctuation value.

[0037] Additionally, it should be noted that the reference... Figure 7 and Figure 8 As shown, to make the connection between the through-hole and the air tube more secure, the device further includes connecting fittings, the number of which is the same as the number of through-holes. One end of the connecting fitting is connected to the through-hole, and the other end is connected to the air tube. For example, the connecting fittings are made of metal.

[0038] For example, see Figure 7 As shown, when the hot plate includes two through holes, c1 and d1, the corresponding connecting fittings include connecting fitting 11 and connecting fitting 12. One end of connecting fitting 11 is connected to through hole c1, and the other end of connecting fitting 11 is connected to air pipe A11. One end of connecting fitting 12 is connected to through hole d1, and the other end of connecting fitting 12 is connected to air pipe B11.

[0039] For example, see Figure 8 As shown, when the hot plate includes three through holes c2, d2, and e2, the corresponding connecting fittings include connecting fitting 21, connecting fitting 22, and connecting fitting 23. One end of connecting fitting 21 is connected to through hole c2, and the other end is connected to air pipe A21. One end of connecting fitting 22 is connected to through hole d2, and the other end is connected to air pipe B21. One end of connecting fitting 23 is connected to through hole e2, and the other end is connected to air pipe C21.

[0040] In addition, the aforementioned device for monitoring whether the wafer and the hot plate are in contact also includes: a host computer, which is electrically connected to a pressure gauge and configured to receive pressure fluctuation values ​​collected by the pressure gauge and monitor whether the wafer and the hot plate are in contact based on the pressure fluctuation values.

[0041] See Figure 9 and Figure 10 As shown, the pressure gauge is electrically connected to the host computer via signal lines.

[0042] During implementation, after receiving the pressure fluctuation value collected by the pressure gauge, the host computer compares the pressure fluctuation value with the pressure reference value. If the pressure fluctuation value is greater than or equal to the pressure reference value, it determines that the wafer and the hot plate are fully bonded. Conversely, if the pressure fluctuation value is less than the pressure reference value, it determines that the wafer and the hot plate are not fully bonded.

[0043] Based on the same inventive concept, see [reference] Figure 11 As shown in the embodiments of this application, the implementation of a monitoring method using the above-mentioned device for monitoring whether the wafer and the hot plate are in contact is mainly executed on the host computer side, which will be described in detail below.

[0044] Step 201: Acquire the pressure fluctuation value collected by the pressure gauge during the acquisition time period, wherein the pressure fluctuation value is the pressure difference collected by the pressure gauge through the through hole and the air pipe when the wafer descends at a preset speed until it contacts and / or adheres to the hot plate.

[0045] Because a controller is installed on the hot plate, which is electrically connected to the host computer, when the temperature of the hot plate reaches the preset baking temperature, the controller will send a signal to the host computer to start descending, and at the same time, the lifting pin drags the wafer to begin descending toward the hot plate.

[0046] See Figure 12 As shown, the acquisition of pressure fluctuation values ​​collected by the pressure gauge during the aforementioned data acquisition period, specifically includes: Step 2011: Determine the first duration for which the wafer descends at a preset speed until it contacts and / or adheres to the hot plate.

[0047] Considering that the process of the lifting pin dragging the wafer toward the hot plate takes a certain amount of time, a preset speed is set for the lifting pin during the manufacturing of the same type of wafer. It should be noted that the preset speed can be flexibly adjusted according to the actual use scenario. In this way, the lifting pin can drive the wafer toward the hot plate at the preset speed.

[0048] After the wafer begins to descend, the time from the start of descent to the point where the wafer contacts and / or adheres to the hot plate is monitored. It should be noted that, considering that the wafer may come into contact with the limiting block or a smudge when it descends to the surface of the hot plate, thus failing to adhere completely to the hot plate, the aforementioned time can be the range from the start of descent to complete adhesion to the hot plate, or it can be the range from the start of descent to when a portion of the wafer contacts the hot plate while another portion adheres to the hot plate.

[0049] In this embodiment of the application, the aforementioned duration is referred to as the first duration. In specific implementation, the length of time represented by the first duration is usually related to the preset speed. When multiple wafers of the same type are at the same preset speed, the longest of the multiple measured first durations is referred to as the first duration. For example, the first duration can be 1.5 seconds, 2 seconds, etc.

[0050] Step 2012: Obtain the collection time period based on the first duration and the preset error duration.

[0051] Considering that in actual manufacturing processes, the time it takes for different wafers to descend and contact / or adhere to the hot plate may vary. For example, some wafers may land on the limiting block or stains before reaching the hot plate surface, while other parts of the wafer may wobble, thus increasing the time required for the wafer to adhere to the hot plate. Therefore, to ensure that the pressure gauge can collect effective pressure values, an error time interval needs to be preset during implementation. For example, the error time interval could be 1 second, 1.5 seconds, etc. The preset error time interval is then added together to obtain a time period, i.e., the data collection time interval.

[0052] Step 2013: Acquire the first pressure value and the second pressure value collected by the pressure gauge during the collection period, and determine the pressure fluctuation value based on the first pressure value and the second pressure value. The first pressure value represents the minimum pressure value acquired by the pressure gauge during the collection period, and the second pressure value represents the maximum pressure value acquired by the pressure gauge during the collection period.

[0053] Considering that the gas pressure generated by the wafer against the via is essentially zero during the initial and subsequent descent of the wafer, the pressure gauge will register the minimum pressure value. Furthermore, considering that in some cases the wafer can completely adhere to the hot plate surface after descent, while in others, due to the presence of limiting blocks or contaminants, it may not completely adhere, resulting in a situation where one part of the wafer is in contact with the hot plate while another part is adhered to it, it can be concluded that the wafer generates corresponding gas pressure through the via when in contact with, partially adhering to, or adhering to the hot plate. This gas pressure is further supplied to the pressure gauge through the via and gas tube, and converted into a pressure value, but the magnitude of the pressure value will vary. Assume that when the wafer first begins to descend, the pressure gauge registers a pressure of 0V. When the wafer contacts the hot plate (assuming it's fully overlapped with the top of the limiting block), the gas pressure through the via is relatively low. When the wafer partially contacts the hot plate (assuming a portion of the wafer lands on a stain on the hot plate), the gas pressure through the via becomes higher. When the wafer is fully contacted with the hot plate (i.e., the entire wafer is attached to the hot plate), the gas pressure through the via becomes even higher. Compared to when the wafer first begins to descend, the pressure value registered by the pressure gauge will fluctuate, meaning the pressure value will fluctuate from 0V to a lower value, from 0V to a higher value, or from 0V to an even higher value.

[0054] During the implementation process, the pressure value collected by the pressure gauge at the beginning of the wafer's descent and during the descent, i.e., the minimum pressure value obtained within the collection period, is called the first pressure value. The pressure value collected by the pressure gauge when the wafer is in contact with the hot plate, partially attached, or fully attached, i.e., the maximum pressure value obtained within the collection period, is called the second pressure value. The difference between the second pressure value and the first pressure value is the pressure fluctuation value.

[0055] It should be noted that the pressure fluctuation value is obtained in the following way: Case (1): If the pressure gauge is used to connect to one port of the air tube, then each air tube is connected to the first end of the connector, and the second end of the connector is connected to the port. The pressure gauge accumulates the multiple gas pressures in the connector to obtain the pressure fluctuation value; or Considering the variety of pressure gauges, when a pressure gauge has only one port for connecting air tubes, each air tube is connected to the pressure gauge via a connector. It should be noted that the connector includes multiple first ends and one second end. That is, after one end of each air tube is connected to the through-hole, the other end of each air tube is then connected to each of the first ends of the connector. For example, the connector can be a tee. The total number of ports on the connector is one more than the total number of air tubes. Each first end of the connector is connected to each air tube in a one-to-one correspondence, and one second end of the connector is used to connect to the port of the pressure gauge.

[0056] During implementation, each gas tube supplies gas pressure to the connector, which then supplies each gas pressure to the pressure gauge. The pressure gauge then sums up the gas pressures to obtain the pressure fluctuation value.

[0057] For example, when there are two tracheas, one port on the pressure gauge, and three ports on the connector (two of which are first ends and the remaining one is the second end, each first end is connected to a trachea and the second end is connected to a port on the pressure gauge), and the gas pressure in each trachea is 3 Pa, the pressure gauge adds the gas pressures in the three tracheas to obtain a pressure fluctuation value of 9 Pa.

[0058] Case (2): If the pressure gauge is used to connect to at least two ports of the air tube, then each air tube is connected to each port in a corresponding manner, and the pressure gauge accumulates the gas pressure in each air tube to obtain the pressure fluctuation value.

[0059] When the pressure gauge has multiple ports for connecting air tubes (at least two), each air tube is directly connected to one port of the pressure gauge. That is, after one end of each air tube is connected to the through-hole, the other end of each air tube is then connected to one port of the pressure gauge.

[0060] During implementation, each gas tube supplies gas pressure to the pressure gauge through different ports. The pressure gauge then sums up the gas pressures to obtain the pressure fluctuation value.

[0061] For example, when there are two tracheas and two ports on the pressure gauge, and the gas pressure in each trachea is 5 Pa, the pressure gauge adds the gas pressures in the two tracheas together to obtain a pressure fluctuation value of 10 Pa.

[0062] Step 202: Compare the pressure fluctuation value with the preset pressure reference value, wherein the pressure reference value is used to characterize the pressure supplied to the pressure gauge through the through hole and the gas pipe when the wafer is lowered at a preset speed until it is fully in contact with the hot plate.

[0063] During implementation, after acquiring the pressure fluctuation value, the host computer compares the pressure fluctuation value with a preset pressure reference value. It should be noted that the aforementioned pressure reference value is a standard value measured by a device that monitors whether the wafer and the hot plate are in contact, for wafers of the same type. That is, during the manufacturing process, when the wafer of the same type descends at a preset speed until it is completely in contact with the hot plate, the pressure is supplied to the pressure gauge through the through-hole and the air pipe.

[0064] Step 203: If the pressure fluctuation value is less than the pressure reference value, it is determined that the wafer and the hot plate are not fully bonded, and an early warning is issued.

[0065] During implementation, if the host computer determines, after comparison, that the pressure fluctuation value is greater than or equal to the pressure reference value, it indicates that the wafer and the hot plate are fully bonded. For example, if the pressure reference value is 8 Pa and the pressure fluctuation value is 10 Pa, this indicates that the gas pressure generated during the bonding process between the wafer and the hot plate is relatively high, all through-holes are completely covered by the wafer, the wafer and the hot plate are fully bonded, and the manufacturing process can continue.

[0066] During implementation, if the host computer determines, after comparison, that the pressure fluctuation value is less than the pressure reference value, it indicates that the wafer and the hot plate are not fully bonded. For example, if the pressure reference value is 8 Pa and the pressure fluctuation value is 7 Pa, this means that the gas pressure generated during the bonding process between the wafer and the hot plate is relatively low, some vias are not completely covered by the wafer, and the wafer and the hot plate are not fully bonded. In this case, the host computer issues an early warning, and the manufacturing process needs to be paused.

[0067] Based on the same inventive concept, see [reference] Figure 13 As shown, this application embodiment provides a host computer, including: a memory 1301 for storing executable instructions; and a processor 1302 for reading and executing the executable instructions stored in the memory, and executing any of the methods described in the second aspect above.

[0068] Based on the same inventive concept, embodiments of this application provide a computer-readable storage medium that, when the instructions in the storage medium are executed by a processor, enables the processor to perform the method described in any of the second aspects above.

[0069] In summary, this application provides an apparatus and method for monitoring whether a wafer is in contact with a hot plate. The apparatus includes a hot plate, an air pipe, and a pressure gauge. The hot plate has at least one through hole. One end of the air pipe is connected to the through hole, and the other end is connected to the pressure gauge. The pressure gauge is configured to collect the pressure fluctuation value of the wafer acting on the hot plate through the air pipe and the through hole when the wafer descends toward the hot plate until it contacts and / or adheres to the hot plate. The number of air pipes is the same as the number of through holes. In this application, through holes are provided on the hot plate, and the pressure fluctuation value collected by the air pipes from the through holes is collected by the pressure gauge. The pressure fluctuation value is then used to monitor whether the wafer is in contact with the hot plate. Thus, during the process of the wafer descending and adhering to the hot plate, the degree of adhesion between the wafer and the hot plate is conveniently and effectively monitored, thereby ensuring the uniformity of wafer baking.

[0070] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program product systems. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product system implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0071] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program product systems according to this application. It should be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart illustrations. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0072] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0073] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0074] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A device for monitoring whether a wafer and a hot plate are in contact, characterized in that, include: Hot plate, tubing, and pressure gauge; The hot plate is provided with at least one through hole, one end of the air pipe is connected to the through hole, and the other end of the air pipe is connected to the pressure gauge. The pressure gauge is configured to collect the pressure fluctuation value of the wafer acting on the hot plate through the air pipe and the through hole when the wafer descends toward the hot plate until it contacts and / or adheres to the hot plate. The number of air pipes is the same as the number of through holes.

2. The apparatus of claim 1, wherein, Also includes: Host computer; The host computer is electrically connected to the pressure gauge and is configured to receive the pressure fluctuation value collected by the pressure gauge, and monitor whether the wafer and the hot plate are in contact based on the pressure fluctuation value.

3. The apparatus of claim 1, wherein, The orthographic projection of the wafer onto the hot plate covers each of the vias.

4. The apparatus of claim 1, wherein, All of the tracheae are of equal length.

5. The apparatus of claim 1, wherein, Also includes: Connecting pipe fittings, wherein the number of connecting pipe fittings is the same as the number of through holes; One end of the connecting pipe is connected to the through hole, and the other end of the connecting pipe is connected to the air pipe.

6. A monitoring method using the apparatus for monitoring whether a wafer and a hot plate are attached according to any one of claims 1 to 5, characterized by, Applications in host computers include: The pressure fluctuation value collected by the pressure gauge during the collection period is obtained, wherein the pressure fluctuation value is the pressure difference collected by the pressure gauge through the through hole and the air pipe when the wafer descends at a preset speed until it contacts and / or adheres to the hot plate; The pressure fluctuation value is compared with a preset pressure reference value, wherein the pressure reference value is used to characterize the pressure fluctuation value provided to the pressure gauge through the through hole and the air pipe when the wafer is lowered at the preset speed until it is fully in contact with the hot plate; If the pressure fluctuation value is less than the pressure reference value, it is determined that the wafer and the hot plate are not fully bonded, and an early warning is issued.

7. The method of claim 6, wherein, The step of acquiring the pressure fluctuation value collected by the pressure gauge during the acquisition period includes: Determine the first duration for which the wafer descends at the preset speed until it contacts and / or adheres to the hot plate; The collection time period is obtained based on the first duration and the preset error duration; During the data collection period, a first pressure value and a second pressure value are acquired by the pressure gauge, and a pressure fluctuation value is determined based on the first pressure value and the second pressure value. The first pressure value represents the minimum pressure value acquired by the pressure gauge during the data collection period, and the second pressure value represents the maximum pressure value acquired by the pressure gauge during the data collection period.

8. The method of claim 7, wherein, The pressure fluctuation value is obtained in the following way: If the pressure gauge is used to connect to one port of the air tube, then each air tube is connected to each first end of the connector, the second end of the connector is connected to the port, and the pressure gauge accumulates the multiple gas pressures in the connector to obtain the pressure fluctuation value. or If the pressure gauge is used to connect to at least two ports of the air tubes, then each air tube is connected to each port in a one-to-one correspondence, and the pressure gauge accumulates the gas pressure in each air tube to obtain the pressure fluctuation value.

9. A host computer, characterized by include: Memory, used to store executable instructions; A processor for reading and executing executable instructions stored in the memory to implement the method as described in any one of claims 6 to 8.

10. A computer-readable storage medium, characterized in that, When the instructions in the storage medium are executed by the processor, the processor is able to perform the method as described in any one of claims 6 to 8.

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