Chip angle adjustment method, device and medium
By adjusting the target area in the wafer to include data detection points, the complexity and accuracy issues of chip angle measurement in the prior art are solved, achieving efficient and accurate chip angle measurement and leveling.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SKYVERSE TECH CO LTD
- Filing Date
- 2026-05-06
- Publication Date
- 2026-07-31
AI Technical Summary
In the existing technology, chip angle measurement equipment is complex, cumbersome to operate, costly and inefficient, making it difficult to guarantee the accuracy and consistency of the calculation results. In addition, there is the problem that the data acquisition point falls into the cutting channel area or other chip areas.
By identifying the chip under test and the test point from the wafer, it is determined whether the target area exceeds the chip area. If it does, the target area is adjusted to be within the chip area. Then, n data detection points located in the updated target area are selected for three-dimensional coordinate acquisition and fitting plane angle calculation.
This improves the accuracy of angle measurement and chip leveling, ensuring that data detection points are located within the chip area and guaranteeing the accuracy and consistency of the fitted plane angle.
Smart Images
Figure CN122497326A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of chip measurement, and in particular to a chip angle adjustment method, apparatus and medium. Background Technology
[0002] In precision manufacturing, such as the production of semiconductor chips, it is often necessary to precisely calculate and adjust the angles of various planes. Taking wafer leveling as an example, the surface flatness and tilt angle of the wafer directly affect the quality of chip bonding and the precision of subsequent photolithography processes.
[0003] In related technologies, the calculation of planar angles often suffers from problems such as complex testing equipment, cumbersome operation, high cost, and low efficiency. Some methods require additional high-precision testing instruments, increasing equipment costs; others require complex structural disassembly and assembly or coordinate transformation during the testing process, affecting work efficiency and making it difficult to guarantee the accuracy and consistency of the calculation results, thus affecting the quality of subsequent processes. Furthermore, the wafer planar area is relatively large, while the chip area where the test point is located is relatively small. If the area calculated by fitting the plane is too large, it will cause unevenness in the chip area where the test point is located after leveling. Therefore, providing an accurate chip angle measurement method has become an urgent technical problem to be solved. Summary of the Invention
[0004] In view of this, the purpose of this application is to provide a chip angle adjustment method, apparatus, and medium, which greatly improves the accuracy of angle measurement and chip leveling. The specific solution is as follows: On the one hand, this application provides a chip angle adjustment method, including: Identify the chip under test (DUT) from the wafer, and the test points located on the DUT; Based on the location of the test point and the preset region parameters, determine whether the target region with the test point as the region center and the region parameters satisfying the preset region parameters exceeds the chip region of the chip under test. If so, then, based on the constraint of at least one target edge in the chip region that is closest to the point to be tested, determine the updated target region located in the chip region that satisfies the preset region parameters, and the target positions of n data detection points located on the contour edge of the updated target region; Based on the target location, coordinates of n data detection points are collected to obtain the three-dimensional coordinates of the n data detection points in the chip under test, where n is an integer greater than 1; Based on the n three-dimensional coordinates, the angle between the fitting plane containing the n data detection points and the preset reference plane is determined, and the chip under test is adjusted based on the angle.
[0005] In another aspect, embodiments of this application also provide a chip angle adjustment device, including: The first determining unit is used to determine the chip under test from the wafer, and the test point located in the chip under test; The judgment unit is used to determine, based on the position of the test point and the preset region parameters, whether the target region with the test point as the region center and the region parameters satisfying the preset region parameters exceeds the chip region of the chip under test. The second determining unit is used to determine, if so, an updated target region that is located within the chip region and satisfies the preset region parameters, and the target positions of n data detection points located on the contour edge of the updated target region, based on at least one target edge in the chip region that is closest to the point to be tested; The acquisition unit is used to acquire the coordinates of n data detection points based on the target position, and obtain the three-dimensional coordinates of the n data detection points in the chip under test, where n is an integer greater than 1; The third determining unit is used to determine the angle between the fitting plane containing the n data detection points and the preset reference plane based on the n three-dimensional coordinates, and to adjust the chip under test based on the angle.
[0006] In another aspect, embodiments of this application provide a computer device, the computer device including a processor and a memory: The memory is used to store program code and transmit the program code to the processor; The processor is used to execute the methods described above according to the instructions in the program code.
[0007] In another aspect, embodiments of this application provide a computer-readable storage medium for storing a computer program for performing the methods described above.
[0008] This application provides a chip angle adjustment method, apparatus, and medium to determine the chip under test (DUT) and the test point located within the DUT from a wafer. To accurately measure the planar angle of the area where the test point is located, n data detection points need to be selected around the test point for planar fitting to obtain the planar angle. To prevent the n data detection points from falling into the dicing area or other chips, this application, based on the test point's position and preset area parameters, determines whether a target area centered on the test point and whose area parameters satisfy the preset area parameters exceeds the chip area of the DUT. If so, it indicates that if data detection points are collected within the target area, the data collection points may fall into the dicing area or other chips. Therefore, the target area needs to be adjusted to ensure it is completely within the chip area. That is, using at least one target edge closest to the test point in the test area as a constraint, an updated target area is determined that is within the chip area and satisfies the preset area parameters, along with the target positions of the n data detection points located on the contour edge of the updated target area. This ensures that all n data detection points are within the chip area of the DUT, and that the data detection points are sufficiently accurate. Furthermore, coordinates of n data detection points are acquired based on the target location to obtain the three-dimensional coordinates of the n data detection points in the chip under test. Based on the n three-dimensional coordinates, the angle of the fitting plane containing the n data detection points relative to the preset reference plane is determined, and the chip under test is adjusted based on the angle. In summary, this application pre-determines whether the target area where the n data detection points are located is completely within the chip area. If not, the target area is moved into the chip area to obtain an updated target area. Data detection points are then acquired within the updated target area for angle measurement. Thus, regardless of the location of the test point on the chip under test, especially when it is located in the edge area of the chip under test, accurate points can be acquired for fitting, greatly improving the accuracy of angle measurement and chip leveling. Attached Figure Description
[0009] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0010] Figure 1 A schematic flowchart of a chip angle adjustment method provided in an embodiment of this application is shown; Figure 2 A top view of a wafer provided in an embodiment of this application is shown; Figure 3This illustration shows a schematic diagram of a target area extending beyond the chip area, as provided in an embodiment of this application. Figure 4 This illustration shows a schematic diagram of an adjusted update target area that does not exceed the chip area, provided by an embodiment of this application. Figure 5 This illustration shows a schematic diagram of an update target region that is not tangent to the outline edge of the chip under test, according to an embodiment of this application. Figure 6 This illustration shows another example of a target region extending beyond the chip region, provided by an embodiment of this application. Figure 7 This illustration shows a schematic diagram of an adjusted update target area that does not exceed the chip area, provided by an embodiment of this application. Figure 8 This illustration shows a target area that does not extend beyond the chip area, according to an embodiment of this application. Figure 9 This illustration shows a schematic diagram of a scaled-down update target region located within a chip region, according to an embodiment of this application. Figure 10 This illustration shows a schematic diagram of a data collection and detection point in an overlapping area according to an embodiment of this application; Figure 11 This illustration shows a schematic diagram of the distribution of data detection points according to an embodiment of this application; Figure 12 This illustration shows a schematic diagram of the three-dimensional coordinates of a data detection point provided in an embodiment of this application; Figure 13 A structural block diagram of a chip angle adjustment device provided in an embodiment of this application; Figure 14 This is a structural diagram of a computer device provided in an embodiment of this application.
[0011] Reference numerals: Wafer 100, Chip 101, Chip under Test 1011, Cutting Track Area 102, Target Area 103, Updated Target Area 104, Overlapping Area 105. Detailed Implementation
[0012] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings.
[0013] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0014] Secondly, this application provides a detailed description in conjunction with schematic diagrams. When detailing the embodiments of this application, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not adhering to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of this application. In addition, actual fabrication should include three-dimensional spatial dimensions of length, width, and depth.
[0015] As described in the background section, current methods for measuring the angle of a chip's plane suffer from problems such as complex testing equipment, cumbersome operation, high cost, low efficiency, and insufficient accuracy. Specifically, a wafer typically contains multiple dies, with dicing lines separating adjacent dies. When measuring the angle of a single chip's plane, the actual manufacturing process differs between the chip's location and the dicing line area. Furthermore, the consistency of the manufacturing processes varies between different chips. If the data required for angle measurement falls within the dicing line area or other chip areas, the collected data will be inaccurate, leading to a significant deviation from the true angle and resulting in low accuracy in angle measurement.
[0016] Based on the above technical problems, this application provides a chip angle adjustment method, apparatus, and medium to determine the chip under test (DUT) and the test point located within the DUT from a wafer. To accurately measure the planar angle of the area where the test point is located, n data detection points need to be selected around the test point for planar fitting to obtain the planar angle. To prevent the n data detection points from falling into the dicing area or other chips, this application, based on the test point's position and preset area parameters, determines whether a target area centered on the test point and whose area parameters satisfy the preset area parameters exceeds the chip area of the DUT. If so, it indicates that if data detection points are collected within the target area, the data collection points may fall into the dicing area or other chips. Therefore, the target area needs to be adjusted to ensure it is completely within the chip area. That is, using at least one target edge closest to the test point in the test area as a constraint, an updated target area is determined that is within the chip area and satisfies the preset area parameters, along with the target positions of the n data detection points located on the contour edge of the updated target area. This ensures that all n data detection points are within the chip area of the DUT, and that the data detection points are sufficiently accurate. Furthermore, coordinates of n data detection points are acquired based on the target location to obtain the three-dimensional coordinates of the n data detection points in the chip under test. Based on the n three-dimensional coordinates, the angle of the fitting plane containing the n data detection points relative to the preset reference plane is determined, and the chip under test is adjusted based on the angle. In summary, this application pre-determines whether the target area where the n data detection points are located is completely within the chip area. If not, the target area is moved into the chip area to obtain an updated target area. Data detection points are then acquired within the updated target area for angle measurement. Thus, regardless of the location of the test point on the chip under test, especially when it is located in the edge area of the chip under test, accurate points can be acquired for fitting, greatly improving the accuracy of angle measurement and chip leveling.
[0017] For ease of understanding, the following detailed description, in conjunction with the accompanying drawings, provides a chip angle adjustment method, apparatus, device, and medium according to embodiments of this application.
[0018] refer to Figure 1 The diagram shown is a flowchart of a chip angle adjustment method provided in an embodiment of this application. The method may include the following steps.
[0019] S101, Identify the chip under test (DUT) and the test points located on the DUT from the wafer.
[0020] For example, refer to Figure 2As shown, a wafer 100 includes multiple independent chips 101. When processing a single chip 101 in the wafer 100, it is necessary to ensure that the angle of the chip 101 meets the requirements. For example, the chip 101 needs to be placed horizontally, vertically, or tilted at a fixed angle. Therefore, it is necessary to measure the planar angle of the single chip 101 in the wafer 100 in order to accurately adjust the angle of the chip 101.
[0021] Furthermore, since the size of wafer 100 is much larger than that of chip 101, wafer 100 is prone to warping or localized unevenness during the manufacturing process. This can cause the plane containing individual chips 101 on wafer 100 to tilt. Even if the entire wafer 100 is leveled, the local area containing individual chips 101 is not actually leveled, which still affects the accuracy of measuring the high aspect ratio etched structure in individual chips 101. Therefore, it is necessary to precisely adjust the tilt angle of individual chips 101.
[0022] In practical applications, when measuring chip 101 using a small-angle X-ray scattering (SAXS) system, it is necessary to ensure that chip 101 is leveled, that is, the X-rays are perpendicular to the local plane where the measurement point of chip 101 is located, meaning that the X-rays can be incident perpendicularly to the measurement point. As an example, the small-angle X-ray scattering system can be a transmission small-angle X-ray scattering (T-SAXS) system or a grazing-incidence small-angle X-ray scattering (GI-SAXS) system. Of course, this application is not limited to scenarios where measurements are performed using a small-angle X-ray scattering system; it is also applicable in other scenarios where the angle of chip 101 needs to be adjusted, such as etching chip 101.
[0023] The chip under test (DUT) 1011 refers to the chip whose angle needs to be measured in order to adjust it to a suitable angle, such as for leveling. The DUT 1011 can be any chip in the wafer 100. The DUT 1011 has a test point, which can be a pre-specified point. Subsequently, the angle of the area containing the test point needs to be measured to obtain the tilt angle of the DUT 1011. In practical applications, the lower left corner of the DUT 1011 can be used as the starting point, and a pre-specified point within the DUT 1011 can be used as the test point, with the coordinates of that point used as the test point coordinates (X0, Y0).
[0024] refer to Figure 2The diagram shows a top view of a wafer according to an embodiment of this application. The wafer 100 has multiple distributed chips 101, each square region representing one chip 101. Adjacent chips 101 are separated by dicing channels 102 for chip separation. The test point is a point within the chip 101 to be tested.
[0025] S102, based on the location of the test point and the preset region parameters, determine whether the target region 103, with the test point as the region center and the region parameters satisfying the preset region parameters, exceeds the chip region of the chip 1011 under test.
[0026] In order to calculate the angle of the area where the test point is located, it is necessary to collect multiple data detection points around the test point so that the area where the test point is located can be fitted with a plane based on multiple data detection points. The angle of the fitted plane can then be used as the angle of the area where the test point is located.
[0027] The test point location is used to identify the specific location of the test point in the chip under test 1011. The test point location can be represented by the coordinates (X0, Y0) of the test point relative to the starting point, or by the distance of the test point from each contour edge of the chip under test 1011.
[0028] The preset region parameters refer to the pre-defined region parameters of the target region 103. The target region 103 refers to the region composed of multiple data detection points. That is, the distribution of multiple data detection points can be known through the target region 103. Furthermore, the target region 103 uses the point to be measured as its center. The shape of the target region 103 is not limited here; it can be a circular region, a square region, or any other arbitrary shape. For example, refer to... Figure 3 As shown, when the target area 103 is a circular area, the preset area parameter is the radius of the circle, for example, 1mm; when the target area 103 is a square area, the preset area parameter is the length and width of the square.
[0029] Since the location of the test point can indicate the location of the test point in the chip under test 1011, and the preset area parameters can indicate the size of the target area 103, the approximate location of the target area 103 in the wafer 100 can be determined based on the two, that is, it can be used to determine whether the target area 103 exceeds the chip area where the chip under test 1011 is located.
[0030] In one possible implementation, S102, based on the position of the test point and the preset region parameters, it is determined whether the target region 103, with the test point as the region center and the region parameters satisfying the preset region parameters, exceeds the chip region of the chip under test 1011. Specifically, this can be done by obtaining the two-dimensional coordinates of the test point in the plane where the chip under test 1011 is located; determining the distance between the contour edge of the chip under test 1011 and the test point based on the two-dimensional coordinates and the plane dimensions of the chip under test 1011; and determining whether the distance is less than the preset region parameters.
[0031] In other words, the two-dimensional coordinates (X0, Y0) of the test point within the plane of the chip under test 1011 can be obtained first. These two-dimensional coordinates represent the coordinates of the test point relative to the lower left corner of the chip under test 1011. Based on these two-dimensional coordinates and the planar dimensions of the chip under test 1011, the distance between the test point and the contour edge of the chip under test 1011 can be determined. By determining whether this distance is less than a preset area parameter, it is possible to determine whether the target area 103 exceeds the chip area.
[0032] As an example, refer to Figure 3 The diagram shown is a schematic representation of a target area extending beyond the chip area according to an embodiment of this application. The planar dimension of the chip 1011 under test is 3mm. With a distance of 5mm and the two-dimensional coordinates of the test point being (1.8, 4.2), the two closest contour edges of the test point to the chip 1011 under test are 1.2mm (distance from the right contour edge) and 0.8mm (distance from the top contour edge). If the preset area parameter is a radius r=1mm, since 0.8mm is less than 1mm, this indicates that the target area 103 exceeds the top contour edge of the chip 1011 under test, meaning that the data detection point is likely to fall into the cutting channel area or the area where other chips are located.
[0033] In summary, by comparing the distance between the test point and the contour edge of the chip under test 1011 with the preset region parameters of the target region 103, it can be determined whether the target region 103 exceeds the chip region of the chip under test 1011. This allows for a more accurate determination of whether the target region 103 exceeds the chip region. Moreover, this method is simpler and more convenient, requiring only a brief calculation, which greatly improves the accuracy and efficiency of angle measurement.
[0034] S103, if so, then using the nearest target edge in the chip region to the point to be measured as a constraint, determine the updated target region 104 located in the chip region and satisfying the preset region parameters, and the target positions of n data detection points located on the contour edge of the updated target region 104.
[0035] If the target area 103 is located outside the chip area of the chip under test 1011, such as in the cutting channel area or the chip area of other chips, the target area 103 needs to be readjusted so that the adjusted target area 103 (i.e., the updated target area 104) can be located within the chip area of the chip under test 1011, so as to ensure that the data detection point can accurately reflect the position of the points around the test point, thereby making the fitting plane more accurate.
[0036] Based on this, at least one target edge of the region to be tested can be used as a constraint. The target edge refers to the contour edge in the chip region that is closest to the point to be tested. With the constraint of not exceeding the target edge, a new target region 103 is determined within the chip region and satisfies the preset region range; this is the updated target region 104. Furthermore, multiple points located on the contour edge of the updated target region 104 are used as data detection points. In other words, the target position of the data detection point is the position on the contour edge of the updated target region 104.
[0037] As an example, see reference Figure 4 The diagram shown illustrates an adjusted update target area that does not exceed the chip area, as provided in an embodiment of this application. The update target area 104 and target area 103 have the same area parameters, meaning their radii are equal to the preset area parameters and the circle sizes are the same. The main difference is that the adjusted update target area 104 is positioned further inwards, and its boundary does not exceed the chip area of the chip under test 1011. In other words, referring to... Figure 3 and Figure 4 By shifting the target area 103 downwards by a certain distance, the updated target area 104 located inside the chip under test 1011 can be obtained. Figure 4 The leveling center in the text refers to the center of the updated target area 104. In this case, the leveling center is no longer the point to be measured (e.g., Figure 3 The two no longer overlap. Figure 4 The diagram also shows eight data detection points located on the circle, which are used to subsequently determine the fitting plane.
[0038] The number of data detection points, n, is not limited here; it can be 4, 8, 7, etc. The number n can fall within a certain range to avoid insufficient data detection points causing them to be located in abnormal areas, significantly impacting angle calculations. Furthermore, setting a larger number of data detection points ensures that even after removing abnormal data detection points, the remaining data detection points can still calculate relatively accurate planar angles. For example, refer to... Figure 11 The diagram shown is a schematic representation of the distribution of data detection points provided in an embodiment of this application, illustrating eight data detection points surrounding the point to be tested.
[0039] S104: Based on the target position, coordinates of n data detection points are acquired to obtain the three-dimensional coordinates of the n data detection points in the chip under test 1011, where n is an integer greater than 1.
[0040] Specifically, after determining the target location of the data detection point, the three-dimensional coordinates of the data detection point in the chip under test 1011 can be collected based on the target location, so as to calculate the fitting plane based on the three-dimensional coordinates, and then obtain the angle of the area where the test point is located.
[0041] In one possible implementation, S103, determining the target positions of n data detection points located on the contour edge of the updated target region 104 can specifically involve obtaining the center position of the region center of the updated target region; obtaining the relative positional relationship between the center position and the target positions of the data detection points from the database; and determining the target positions of the n data detection points located on the contour edge of the updated target region based on the relative positional relationship and the center position. Then, in S104, the coordinates of the n data detection points are acquired based on the target positions to obtain the three-dimensional coordinates of the n data detection points in the chip under test 1011. Specifically, the measuring device is controlled to move accordingly based on the target positions to obtain the three-dimensional coordinates of the n data detection points in the chip under test 1011.
[0042] In other words, after determining the target area 104, the location of the area's center (i.e., the leveling center) can be obtained. Specifically, the two-dimensional coordinates of the leveling center can be calculated using the dimensions of the chip under test 1011, the location of the test point, and preset area parameters. Next, the relative positional relationships pre-stored in the database are read. These relative positional relationships refer to the relative positional relationships between the leveling center and the data acquisition points, and may include, for example, the distance between them (i.e., preset area parameters) and their relative orientation. Then, based on the relative positional relationships and the center location of the leveling center, the positions of the points on the contour edge of the target area 104 can be calculated, thus obtaining the target positions of n data detection points.
[0043] Furthermore, when acquiring the three-dimensional coordinates of the data detection point, the measuring device can be moved according to the target position (e.g., two-dimensional coordinates) to read the current coordinates of the measuring device in the XY direction and the reading of the Z-direction sensor in the measuring device, thereby obtaining the three-dimensional coordinates of the data detection point. The measuring device can be a motion table with the Z-direction sensor mounted on it, having XYZ degrees of freedom.
[0044] In summary, this method can improve the accuracy of acquiring the three-dimensional coordinates of data detection points and improve the accuracy of angle calculation.
[0045] S105: Based on n three-dimensional coordinates, determine the angle between the fitting plane containing the n data detection points and the preset reference plane, and adjust the chip 1011 under test based on the angle.
[0046] The fitting plane refers to the plane containing n data detection points. It can also be considered as a plane obtained by fitting the region containing the test points. The angle of the fitting plane is the angle of the region containing the test points. Based on the three-dimensional coordinates of each data detection point, fitting calculations can be performed to obtain the plane expression of the fitting plane. Then, based on the plane expression, the angle of the fitting plane relative to the preset reference plane can be calculated.
[0047] The preset reference plane is the theoretically required plane. It refers to a pre-defined plane used as a reference for the fitted plane. For example, the preset reference plane can be a horizontal, vertical, or inclined plane, selected based on actual process requirements. For instance, the plane containing the wafer perpendicular to the incident X-ray can be used as the preset reference plane. For ease of explanation, a horizontal plane will be used as an example in the following description.
[0048] In practical applications, fitting methods can include the least squares method. As an example, the plane equation of the fitted plane can be obtained by the least squares method as Z = AX + BY + C, where A and B are fitting coefficients and C is the fitting constant.
[0049] As an example, taking a data detection point of 8 points as an example, the process of plane fitting and angle adjustment is explained. (Refer to...) Figure 12 The diagram shown is a schematic representation of the three-dimensional coordinates of a data detection point provided in an embodiment of this application.
[0050] If the preset reference plane is the xy plane, the inclination of the fitting plane relative to the x-axis can be represented by coefficient B, and the inclination relative to the y-axis can be represented by coefficient A. The corresponding angle values are then calculated based on these inclinations. Fitting calculations are performed on 8 data detection points, yielding fitting coefficients A = -0.020233°, B = -0.008137°, and a fitting constant C = -0.530974mm in the fitting equation. The calculated plane angles are as follows: the angle of the fitting plane relative to the preset reference plane in the x-direction is DeltaRX = -0.020233°; the angle of the fitting plane relative to the preset reference plane in the y-direction is DeltaRY = -0.008137°; and the offset of the fitting plane relative to the preset reference plane in the z-direction is DeltaTZ = -0.530974mm. After obtaining the plane angle, by adjusting the offsets RX and RY of the sample stage supporting the wafer 100 in the x and y directions, the fitting plane can reach the position of the preset reference plane, where counterclockwise rotation of RX / RY is positive and clockwise rotation is negative.
[0051] In summary, to prevent n data detection points from falling into the cutting channel area or other chip areas, this application, based on the position of the test point and preset region parameters, determines whether the target region 103, with the test point as the region center and the region parameters satisfying the preset region parameters, exceeds the chip area of the chip under test 1011. If so, it indicates that if data detection points are collected within the target region 103, there is a high possibility that the data collection points will fall into the cutting channel area or other chip areas. Therefore, it is necessary to adjust the target region 103 to ensure that it is completely within the chip area. That is, using at least one target edge in the region of the test point that is closest to the test point as a constraint, an updated target region 104 that is within the chip area and satisfies the preset region parameters is determined, along with the target positions of n data detection points located on the contour edge of the updated target region 104. This ensures that all n data detection points are within the chip area of the chip under test 1011, and that the data detection points are sufficiently accurate. Furthermore, coordinates of n data detection points are acquired based on the target location to obtain the three-dimensional coordinates of the n data detection points in the chip under test 1011. Based on the n three-dimensional coordinates, the angle of the fitting plane containing the n data detection points relative to the preset reference plane is determined, and the chip under test 1011 is adjusted based on the angle. In summary, this application pre-determines whether the target area 103 where the n data detection points are located is completely within the chip area. If not, the target area 103 is moved into the chip area to obtain an updated target area 104. Data detection points are then acquired within the updated target area 104 for angle measurement. Thus, regardless of the location of the test point in the chip under test 1011, especially when it is located in the edge area of the chip under test 1011, accurate points can be acquired for fitting, greatly improving the accuracy of angle measurement and chip leveling.
[0052] To reduce the complexity of determining the location of data detection points, in one possible implementation, S103, using at least one target edge in the chip region closest to the point to be tested as a constraint, an updated target region 104 located within the chip region and satisfying preset region parameters, and the target locations of n data detection points located on the contour edge of the updated target region 104 are determined. Specifically, using at least one target edge in the chip region closest to the point to be tested as a tangent, the updated target region 104 containing a circle located within the chip region and satisfying preset region parameters, and the target locations of n data detection points located on the contour edge of the circle are determined, with the distance between the center of the updated target region and the point to be tested being minimized.
[0053] In other words, while ensuring that the adjusted update target area 104 is located within the chip area of the chip under test 1011, to avoid the update target area 104 being too close to the center of the chip area, causing the n data detection points on the contour edge of the update target area 104 to deviate from the test point, and to avoid the determination of the positions of the n data detection points being too complicated, this application, when determining the circular update target area 104, can use at least one target edge in the chip area as the tangent of the circle that satisfies the preset area parameters. However, since there may be multiple such circles, to ensure that the data detection points are close enough to the test point, the circle whose center is closest to the test point can be selected as the update target area 104, thereby achieving rapid and accurate determination of the update target area 104, and thus achieving rapid acquisition of the positions of the n data detection points.
[0054] As an example, you can continue to refer to Figure 4 As shown, the updated target area 104 is tangent to the target edge above, and the center of the updated target area 104 (i.e., the leveling center) is the closest to the point to be measured compared to other circles, so the updated target area 104 will be more accurate. Figure 4 The updated target region 104 in the text can be considered as... Figure 3 The target region 103 was obtained by shifting it downwards.
[0055] In summary, by ensuring that the adjusted circular update target region 104 is tangent to the contour edge of the chip region of the chip under test 1011, and that its center is closest to the test point, the update target region 104 precisely meets the data acquisition requirements within the chip region. The data detection points are also closest to the test point, and determining their positions is simpler, significantly improving the efficiency and accuracy of chip angle determination. Furthermore, since the update target region 104 is circular, the distances between each data detection point and the test point are consistent, ensuring that the data detection points accurately reflect the positional distribution of points around the test point, resulting in a more precise fitting plane.
[0056] In other possible implementations, the adjusted updated target region 104 can also be tangent to the contour edge of the chip under test 1011, but located inside the contour edge. This further ensures that the updated target region 104 is located within the chip under test 1011, avoiding the situation where the calculated updated target region 104 actually exceeds the chip area of the chip under test 1011 due to process errors. This further improves the accuracy of the data detection points and further prevents the data detection points from falling into the dicing area or other chip areas.
[0057] For example, please refer to Figure 5The diagram shown is a schematic of an update target area that is not tangent to the outline edge of the chip under test according to an embodiment of this application, that is, the update target area 104 is completely located inside the chip under test 1011.
[0058] To further improve the accuracy of angle measurement of the chip 1011 under test, in one possible implementation, S103, using at least one target edge in the chip region closest to the point to be measured as a tangent, the updated target region 104 containing the circle that satisfies the preset region parameters, and the target positions of n data detection points located on the contour edge of the circle are determined. Specifically, using the two target edges in the chip region closest to the point to be measured as tangents, the updated target region 104 containing the circle that is located in the chip region and satisfies the preset region parameters, and the target positions of n data detection points located on the contour edge of the circle are determined.
[0059] To ensure that the adjusted target region 104 is located within the chip region and is as close as possible to the original target region 103, thereby guaranteeing that the n data detection points are as close as possible to the test point, this application uses the two contour edges (i.e., the two target edges) of the chip under test 1011 closest to the test point as the two tangents of the circular target region 104. Based on these two tangents and the radius, the expression for the target region 104 is determined, enabling the rapid and accurate determination of the target region 104 and the n data detection points closer to the test point.
[0060] As an example, refer to Figure 6 The diagram shown illustrates another instance of a target region extending beyond the chip region, as provided in this embodiment of the application. The circular target region 103 extends beyond the upper and right contour edges of the chip under test 1011. (See reference...) Figure 7 As shown, this is a schematic diagram of an adjusted update target area that does not exceed the chip area provided in an embodiment of this application. The update target area 104 is tangent to the upper contour edge and the right contour edge of the chip under test 1011, so that multiple data detection points located on the circle are relatively close to the test point.
[0061] In summary, by setting the circular update target area 104 to be tangent to the two nearest contour edges of the chip under test 1011, not only can the determination complexity of the expression of the update target area 104 be further reduced, but also multiple data detection points can be made closer to the test point as much as possible, which can accurately reflect the distribution of points around the test point, thereby improving the accuracy of angle measurement of the chip under test 1011.
[0062] In one possible implementation, the method may further include determining the target positions of n data detection points located on the contour edge of the target region 103 if the target region 103 does not exceed the chip region.
[0063] In other words, if the target area 103 centered on the test point does not exceed the chip area but is located inside the chip area, it means that the data detection point collected on the outline of the target area 103 will not fall into the cutting channel area or other chips. Therefore, it can be determined that the data detection point is located on the outline edge of the target area 103, that is, the target position of the data detection point is the position on the boundary of the target area 103.
[0064] As an example, refer to Figure 8 The diagram shown is a schematic diagram of a target area that does not exceed the chip area according to an embodiment of this application. The circular target area 103 is located inside the chip under test 1011, and the eight data detection points are located on the circle.
[0065] In summary, if the target area 103 is located within the chip under test 1011, multiple data detection points can be directly determined on the boundary of the target area 103, thereby enabling rapid determination of data detection points and improving angle measurement efficiency.
[0066] To avoid the target area 104 being excessively deviated from the test point, causing the data detection point to fail to accurately reflect the distribution around the test point, in one possible implementation, the method may further include: if the distance between the center of the target area 104 and the test point meets the deviation condition, the preset area parameter is reduced within the preset range of the area parameter, and the step of determining the target area 104 located within the chip area and meeting the preset area parameter is repeated.
[0067] Among them, the deviation condition refers to the pre-set condition that needs to be met when the updated target area 104 deviates from the point to be measured. The deviation condition can be specifically that the distance between the center of the updated target area 104 and the point to be measured is greater than a preset distance.
[0068] If the distance between the center of the updated target area 104 and the point to be measured meets the deviation condition, it means that the distance between the two is too large. It is considered that the updated target area 104 deviates from the point to be measured, which means that the adjusted updated target area 104 is not suitable for selecting data detection points and the updated target area 104 needs to be redefined.
[0069] At this time, the preset area parameter can be reduced within the preset range of the area parameter. That is, by reducing the size of the update target area 104, the update target area 104 can be located within the chip area of the chip under test 1011, thereby preventing the data detection point from falling into the cutting channel area or other chips.
[0070] The preset range of region parameters can be a pre-defined range within which the region parameters lie, specifically determined based on the dimensions of the chip under test (CUT) 1011. Since high aspect ratio etched structure measurement equipment focuses on the local flatness of the area under test, if the preset range of region parameters is too large, the area for fitting the plane calculation will be too large, increasing the impact of wafer 100 warpage and bending. This can lead to local unevenness at the test point after plane leveling, causing the calculated plane to deviate from the plane angle of the test point. Conversely, if the preset range of region parameters is too small, the selected plane area will be too small, and fluctuations in plane height will result in poor angular accuracy in the plane calculation. Therefore, the preset range of region parameters can be determined based on the dimensions of the CUT 1011.
[0071] As an example, with the length and width of the chip under test 1011 being 5mm and 3mm respectively, the preset range of the area parameters can be 0.8~1.3mm, and the preset area parameters can be adjusted from the original 1.1mm to 1mm.
[0072] As an example, refer to Figure 9 The diagram shown is a schematic representation of a scaled-down update target region located within a chip region, according to an embodiment of this application. (Combined with...) Figure 6 The radius of the updated target region 104 is smaller than that of the target region 103, that is, the preset region parameter is reduced, so that the updated target region 104 can be located inside the chip under test 1011.
[0073] In summary, if adjusting the position of the target area 103 to make the data detection point located within the chip under test 1011 without adjusting the preset area parameters results in the data detection point being excessively deviated from the test point, this application can reduce the preset area parameters. This ensures that the data detection point is located within the chip under test 1011, and that the data detection point can accurately reflect the distribution of points around the test point, avoiding the data detection point being too far from the test point, which would cause the angle of the fitting plane to not accurately reflect the angle of the area where the test point is located.
[0074] To avoid excessive deviation of the updated target region 104 from the test point, in one possible implementation, the method may further include: if the distance between the center of the updated target region 104 and the test point meets the deviation condition, determining the overlapping region where the target region 103 overlaps with the chip region; determining n data detection points located on the contour edge of the overlapping region, wherein the n data detection points are used to determine the angle of the fitting plane relative to the preset reference plane.
[0075] In other words, when it is determined that the target area 104 deviates excessively from the test point, a portion of the target area 103 located within the chip area can be identified and treated as an overlapping area. Then, multiple data detection points are collected along the contour edge of the overlapping area to calculate the angle of the fitting plane.
[0076] As an example, refer to Figure 10 The diagram shown is a schematic diagram of collecting data detection points in an overlapping area according to an embodiment of this application. The overlapping area 105 is a gray-filled area, and the 8 data detection points are located on the outline edge of the overlapping area 105.
[0077] In summary, by collecting data detection points only on a portion of the target area 103 within the chip area, the target area 103 can be scaled or moved, greatly reducing the difficulty of data detection point collection and improving collection efficiency.
[0078] Next, a general example of the chip angle adjustment method provided in this application will be given.
[0079] First, determine the preset coordinate system and reference plane: take the test point of the chip under test 1011 as the origin of the coordinate system, establish a three-dimensional rectangular coordinate system, in which the XY plane is the preset reference plane, and the Z axis is perpendicular to the XY plane.
[0080] Selecting data detection points: When the leveling area (i.e., target area 103) does not exceed the chip area of the chip under test 1011, take the test point as the center and select 8 points evenly distributed on a circle with a radius of 1mm as data detection points; when the leveling area exceeds the chip area, adjust the leveling center (i.e., the center of the target area 103) to ensure that the leveling area does not exceed the chip area and the new leveling center is as close as possible to the test point, thus obtaining the updated target area 104, and select 8 points evenly distributed on a circle with a radius of 1mm as data detection points.
[0081] Obtain the three-dimensional coordinates of the data detection point: Obtain the XY coordinates of the data detection point and the plane height collected by the Z-axis sensor to obtain the three-dimensional coordinates.
[0082] Fitting the plane equation: Substitute the X, Y, and Z coordinates of all the data detection points into the fitting algorithm (such as the least squares method) to obtain the fitting plane equation Z=AX+BY+C.
[0083] Calculate the plane angle: Based on the coefficients A and B in the fitted plane equation, calculate the inclination of the fitted plane relative to the X and Y axes. Using trigonometric relationships, calculate the corresponding angle value from the inclination, thus obtaining the angle of the area where the test point is located relative to the reference plane.
[0084] In summary, this application selects multiple detection points that are not on the same straight line to fit a plane equation and then calculates the plane angle. This eliminates the need for complex detection equipment, reducing costs. The operation process is simple, requiring no complex structural disassembly and assembly, thus improving the efficiency of plane angle calculation. Fitting calculations based on multiple detection points improves the accuracy of plane angle calculations, ensuring the quality of subsequent related processes (such as chip bonding and photolithography).
[0085] Based on the above chip angle adjustment method, this application embodiment also provides a chip angle adjustment device, referencing... Figure 13 The diagram shown is a structural block diagram of a chip angle adjustment device provided in an embodiment of this application. The chip angle adjustment 200 may include: The first determining unit 201 is used to determine the chip under test from the wafer, and the test point located in the chip under test; The judgment unit 202 is used to determine, based on the position of the test point and the preset region parameters, whether the target region with the test point as the region center and the region parameters satisfying the preset region parameters exceeds the chip region of the chip under test. The second determining unit 203 is used to determine, if yes, an updated target region that is located within the chip region and satisfies the preset region parameters, and the target positions of n data detection points located on the contour edge of the updated target region, based on at least one target edge in the chip region that is closest to the point to be tested. The acquisition unit 204 is used to acquire the coordinates of n data detection points based on the target position, and obtain the three-dimensional coordinates of the n data detection points in the chip under test, where n is an integer greater than 1; The third determining unit 205 is used to determine the angle between the fitting plane where the n data detection points are located and the preset reference plane based on the n three-dimensional coordinates, and to adjust the chip under test based on the angle.
[0086] In one possible implementation, the second determining unit 203 is configured to: Using at least one target edge in the chip region that is closest to the point to be tested as a tangent, determine the updated target region where the circle located in the chip region and satisfying the preset region parameters is located, and the target positions of n data detection points located on the contour edge of the circle, wherein the distance between the center of the updated target region and the point to be tested is minimized.
[0087] In one possible implementation, the second determining unit 203 is configured to: Using the two target edges in the chip region closest to the point to be tested as tangents, determine the updated target region where the circle located in the chip region and satisfying the preset region parameters is located, and the target positions of the n data detection points located on the contour edge of the circle.
[0088] In one possible implementation, the determination unit 202 is used for: Based on the two-dimensional coordinates and the planar dimensions of the chip under test, the distance between the contour edge of the chip under test and the test point is determined; Determine whether the distance is less than the preset area parameter.
[0089] In one possible implementation, the device further includes: The adjustment unit is used to adjust the preset region parameter within a preset range if the distance between the center of the updated target region and the test point meets the deviation condition, and to repeatedly execute the step of determining the updated target region located within the chip region and meeting the preset region parameter.
[0090] In one possible implementation, the device further includes: The fourth determining unit is used to determine the target positions of n data detection points located on the contour edge of the target area if the target area does not exceed the chip area.
[0091] In one possible implementation, the second determining unit 203 is used for: Obtain the center position of the region center of the target region to be updated; Obtain the relative positional relationship between the center location and the target location of the data detection point from the database; Based on the relative positional relationship and the center position, determine the target positions of n data detection points located on the contour edge of the updated target region; The step of acquiring the coordinates of n data detection points based on the target location to obtain the three-dimensional coordinates of the n data detection points in the chip under test includes: Based on the target position, the control measuring device moves accordingly to obtain the three-dimensional coordinates of n data detection points in the chip under test.
[0092] In one possible implementation, the device further includes a fifth determining unit, configured to: If the distance between the center of the updated target area and the point to be measured meets the deviation condition, the overlapping area where the target area and the chip area overlap is determined; n data detection points are determined on the contour edge of the overlapping region, and the n data detection points are used to determine the angle of the fitting plane relative to the preset reference plane.
[0093] In another aspect, embodiments of this application provide a computer device, with reference to Figure 14 The diagram shown is a structural diagram of a computer device provided in an embodiment of this application. The computer device includes a processor 310 and a memory 320. The memory 320 is used to store program code and transmit the program code to the processor 310; The processor 310 is used to execute the method provided in the above embodiments according to the instructions in the program code.
[0094] The computer device may include a terminal device or a server, and the aforementioned apparatus may be configured in the computer device.
[0095] In another aspect, embodiments of this application also provide a storage medium for storing a computer program for executing the methods provided in the above embodiments.
[0096] Those skilled in the art will understand that all or part of the steps of the above method embodiments can be implemented by program instructions in hardware. The aforementioned program can be stored in a computer-readable storage medium. When the program is executed, it performs the steps of the above method embodiments. The aforementioned storage medium can be at least one of the following media: read-only memory (ROM), RAM, magnetic disk, or optical disk, etc., and other media capable of storing program code.
[0097] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.
[0098] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on its differences from other embodiments. In particular, the apparatus embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions of the method embodiments.
[0099] The above description is merely a preferred embodiment of this application. Although this application has disclosed preferred embodiments above, it is not intended to limit this application. Any person skilled in the art can make many possible variations and modifications to the technical solutions of this application using the methods and techniques disclosed above, or modify them into equivalent embodiments with equivalent changes, without departing from the scope of the technical solutions of this application. Therefore, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this application without departing from the content of the technical solutions of this application shall still fall within the protection scope of the technical solutions of this application.
Claims
1. A chip angle adjustment method characterized by comprising: include: Identify the chip under test (DUT) from the wafer, and the test points located on the DUT; Based on the location of the test point and the preset region parameters, determine whether the target region with the test point as the region center and the region parameters satisfying the preset region parameters exceeds the chip region of the chip under test. If so, then, based on the constraint of at least one target edge in the chip region that is closest to the point to be tested, determine the updated target region located in the chip region that satisfies the preset region parameters, and the target positions of n data detection points located on the contour edge of the updated target region; Based on the target location, coordinates of n data detection points are collected to obtain the three-dimensional coordinates of the n data detection points in the chip under test, where n is an integer greater than 1; Based on the n three-dimensional coordinates, the angle between the fitting plane containing the n data detection points and the preset reference plane is determined, and the chip under test is adjusted based on the angle.
2. The method according to claim 1, characterized in that, The step of determining an updated target region that is located within the chip region and satisfies the preset region parameters, and the target positions of n data detection points located on the contour edge of the updated target region, is constrained by at least one target edge in the chip region that is closest to the point to be tested. This includes: Using at least one target edge in the chip region that is closest to the point to be tested as a tangent, determine the updated target region where the circle located in the chip region and satisfying the preset region parameters is located, and the target positions of n data detection points located on the contour edge of the circle, wherein the distance between the center of the updated target region and the point to be tested is minimized.
3. The method according to claim 2, characterized in that, The step of determining the updated target region containing the circle satisfying the preset region parameters, and the target positions of the n data detection points located on the contour edge of the circle, by using at least one target edge in the chip region closest to the point to be tested as a tangent, includes: Using the two target edges in the chip region closest to the point to be tested as tangents, determine the updated target region where the circle located in the chip region and satisfying the preset region parameters is located, and the target positions of the n data detection points located on the contour edge of the circle.
4. The method according to claim 1, characterized in that, The step of determining whether a target region centered on the test point and satisfying the preset region parameters, based on the test point's location and preset region parameters, exceeds the chip region of the chip under test includes: Obtain the two-dimensional coordinates of the point to be tested in the plane of the chip under test; Based on the two-dimensional coordinates and the planar dimensions of the chip under test, the distance between the contour edge of the chip under test and the test point is determined; Determine whether the distance is less than the preset area parameter.
5. The method according to any one of claims 1-4, characterized in that, The method further includes: If the distance between the center of the updated target area and the point to be measured meets the deviation condition, the preset area parameter is reduced within the preset range of the area parameter, and the step of determining the updated target area located within the chip area and meeting the preset area parameter is repeated.
6. The method according to any one of claims 1-4, characterized in that, The method further includes: If the target area does not exceed the chip area, determine the target positions of n data detection points located on the contour edge of the target area.
7. The method according to any one of claims 1-4, characterized in that, Determining the target positions of n data detection points located on the contour edge of the updated target region includes: Obtain the center position of the region center of the updated target region; obtain the relative positional relationship between the center position and the target position of the data detection point from the database; Based on the relative positional relationship and the center position, determine the target positions of n data detection points located on the contour edge of the updated target region; The step of acquiring the coordinates of n data detection points based on the target location to obtain the three-dimensional coordinates of the n data detection points in the chip under test includes: Based on the target position, the control measuring device moves accordingly to obtain the three-dimensional coordinates of n data detection points in the chip under test.
8. The method according to any one of claims 1-4, characterized in that, The method further includes: If the distance between the center of the updated target area and the point to be measured meets the deviation condition, the overlapping area where the target area and the chip area overlap is determined; n data detection points are determined on the contour edge of the overlapping region, and the n data detection points are used to determine the angle of the fitting plane relative to the preset reference plane.
9. A chip angle adjustment device, characterized in that, include: The first determining unit is used to determine the chip under test from the wafer, and the test point located in the chip under test; The judgment unit is used to determine, based on the position of the test point and the preset region parameters, whether the target region with the test point as the region center and the region parameters satisfying the preset region parameters exceeds the chip region of the chip under test. The second determining unit is used to determine, if so, an updated target region that is located within the chip region and satisfies the preset region parameters, and the target positions of n data detection points located on the contour edge of the updated target region, based on at least one target edge in the chip region that is closest to the point to be tested; The acquisition unit is used to acquire the coordinates of n data detection points based on the target position, and obtain the three-dimensional coordinates of the n data detection points in the chip under test, where n is an integer greater than 1; The third determining unit is used to determine the angle between the fitting plane containing the n data detection points and the preset reference plane based on the n three-dimensional coordinates, and to adjust the chip under test based on the angle.
10. A computer-readable storage medium, characterized in that, The computer-readable storage medium is used to store a computer program for performing the method according to any one of claims 1-8.