Carrier device and semiconductor apparatus

Abstract

This application discloses a carrier device and semiconductor equipment, relating to the semiconductor field. The carrier device includes: a carrier body, a base, and a rotating air-float assembly; the carrier body has a first mounting groove and a second mounting groove, arranged along the centerline of the carrier device and connected through a through hole; the base is disposed in the first mounting groove; the rotating air-float assembly includes an air-float part and a rotating part, the air-float part being connected to the base, at least a portion of the air-float part being located in the second mounting groove, and the rotating part being located in the second mounting groove and connected to the air-float part. This application can solve problems such as particulate contamination caused by gas carrying detached growth layers to the wafer surface.

Description

Technical Field

[0001] This application belongs to the field of semiconductor technology, specifically relating to a carrier device and semiconductor equipment. Background Technology

[0002] Currently, horizontal hot-wall silicon carbide epitaxial equipment has become a key piece of equipment for silicon carbide epitaxy due to its advantages such as high epitaxial quality and fast growth rate. This equipment utilizes an air-floating rotation device to support and drive the tray and the wafer it carries, enabling lifting and rotation. However, the edge surfaces of the air-floating rotation device and the back edge surface of the tray can contact the growth source. As the epitaxial process continues, a growth layer forms on these surfaces. Simultaneously, this growth layer is prone to detachment during rotation and is easily carried to the wafer surface by the rotating gas, air-floating gas, and growth source carrier gas, thus affecting the quality of the silicon carbide epitaxy.

[0003] The current approach involves removing the growth layer through grinding, wiping, and blowing during maintenance of the process chamber to ensure the quality of silicon carbide epitaxy. However, during an epitaxial growth cycle, some growth layer still detaches and is carried to the wafer surface by gas, causing particulate contamination and affecting the quality of silicon carbide epitaxy. Summary of the Invention

[0004] The purpose of this application is to provide a carrier device and semiconductor equipment that can solve problems such as particulate contamination caused by gas carrying the detached growth layer to the wafer surface.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows: This application provides a support device, including: a support body, a base, and a rotating air flotation assembly; The supporting body is provided with a first mounting groove and a second mounting groove, which are arranged along the center line of the supporting device and are connected by a through hole. The base is disposed in the first mounting groove and is used to support the pallet; The rotating air flotation assembly includes an air flotation part and a rotating part. The air flotation part is connected to the base (20). At least a portion of the air flotation part is located in the second mounting groove (12). The rotating part is located in the second mounting groove (12) and is connected to the air flotation part.

[0006] This application also provides a semiconductor device, including the aforementioned carrier device.

[0007] In this embodiment, air pressure can be provided to at least a portion of the air-bearing part located in the second mounting groove, causing the air-bearing part to move along the centerline of the bearing device, and the air-bearing part drives the base and the pallet it carries to move synchronously, thereby realizing the air-bearing of the pallet; air pressure can be provided to the rotating part located in the second mounting groove, causing the rotating part to rotate around the centerline, and driving the air-bearing part to rotate, and the air-bearing part drives the base to rotate synchronously, thereby realizing the rotation of the pallet. Compared to related technologies, in this embodiment, both the flotation gas and the rotating gas are introduced into the second mounting groove, separated from the base and the tray it supports located in the first mounting groove. This prevents the flotation gas and the rotating gas from entering the process environment of the base and tray, eliminating the need for guide gaps between the edges of the base and the supporting body, and between the edges of the tray and the supporting body. This effectively reduces the probability of the base and tray forming a growth layer. Furthermore, even if a growth layer forms on the base and tray, the flotation gas and the rotating gas will not pass through the process environment of the base and tray, and therefore will not come into contact with the growth layer. This prevents airflow impact on the growth layer, making it less prone to detachment. Even if the growth layer does detach, it will not be carried to the wafer surface by the flotation gas and the rotating gas. Therefore, this embodiment effectively solves the problem of particulate contamination caused by gas carrying the detached growth layer to the wafer surface, thus affecting process quality. In addition, in the embodiments of this application, the air-floating gas and the rotating gas will not flow through the area where the base is located (i.e., the first mounting groove), thereby effectively preventing the air-floating gas and the rotating gas from carrying away some of the heat from the base and affecting the temperature field distribution of the wafer surface growth, thus ensuring the uniformity of the temperature field on the wafer surface. Attached Figure Description

[0008] Figure 1 This is a schematic diagram of a load-bearing device in related technologies; Figure 2 This is a schematic diagram of the first state of the carrier device disclosed in the embodiments of this application; Figure 3 This is a schematic diagram of the second state of the carrier device disclosed in the embodiments of this application; Figure 4 This is a schematic diagram of another form of carrier device disclosed in the embodiments of this application; Figure 5 This is a first partial schematic diagram of the carrier device disclosed in the embodiments of this application; Figure 6 This is a second partial schematic diagram of the carrier device disclosed in the embodiments of this application; Figure 7 This is a schematic diagram of the support member disclosed in the embodiments of this application; Figure 8 This is a schematic diagram of the base disclosed in an embodiment of this application; Figure 9This is a third partial schematic diagram of the carrier device disclosed in the embodiments of this application; Figure 10 This is a schematic diagram of the fan blade structure disclosed in the embodiments of this application; Figure 11 This is a schematic diagram of fan blades with different blade forms disclosed in the embodiments of this application.

[0009] Explanation of reference numerals in the attached figures: 001-Upper heating element; 002-Lower heating element; 003-Tray; 004-Base; 005-Upstream protective element; 006-Downstream protective element; 007-Shaft; M1-First air passage; M2-Second air passage; N-Gap; 01-Bearing device; 10-Bearing body; 11-First mounting slot; 12-Second mounting slot; 121-First assembly slot; 122-Sinking groove; 13-Third mounting slot; 14-Fourth mounting slot; 15-First air intake; 16-Second air intake; 17-First exhaust duct; 18-Second exhaust duct; 19-Through hole; 20-Base; 30 - Rotary air flotation assembly; 31 - Support shaft; 311 - First threaded section; 312 - Second threaded section; 32 - Fan blade; 321 - Blade; 33 - Connecting rod; 331 - Protrusion; 332 - Second assembly slot; 40-pallets; 50 - Support component; 51 - Shaft hole; 60 - Protective component; 61 - First protective element; 62 - Second protective element; 021 - First heating element; 022 - Second heating element. Detailed Implementation

[0010] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0011] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0012] The embodiments of this application will be described in detail below with reference to the accompanying drawings and specific examples and application scenarios.

[0013] refer to Figure 1 A supporting device is proposed in the related technology, which includes a tray 003, a base 004, an upper heating element 001, a lower heating element 002, an upstream protective element 005, and a downstream protective element 006. The tray 003 is used to support the wafer and is disposed on the base 004. A rotating shaft 007 is connected to the base 004, serving to support and rotate the base 004. An inclined guide groove is provided on the back of the base 004. Airflow flows into the inclined guide groove through the first air channel M1 and flows outwards, simultaneously driving the base 004 to rotate, thereby causing the tray 003 and the wafer it supports to rotate. Additionally, gas flows through the second air channel M2 to the gap N, pushing the base 004 and the tray 003, causing them to float.

[0014] In order to enable airflow output, there are large gaps N between the edge of the tray 003 and the upstream and downstream protective components 005 and 006, and between the edge of the base 004 and the upstream and downstream protective components 005 and 006, respectively. Rotating air and air flotation air can be discharged through the gaps N.

[0015] However, during the silicon carbide epitaxial growth process, the growth source also enters the void N and forms silicon carbide growth layers at the back edge of tray 003 and the edge surface of base 004, respectively. Furthermore, as the airflow passes through the location of the growth layer, the growth layer is prone to loosening and falling off. The fallen growth layer is carried to the wafer surface by the airflow, affecting the wafer growth quality.

[0016] Based on the above, this application discloses a novel support device 01 to at least solve the aforementioned technical problems. (Reference) Figures 2 to 11 The disclosed support device 01 includes a support body 10, a base 20, and a rotating air flotation assembly 30.

[0017] The supporting body 10 is the basic component of the supporting device 01, providing an installation base for the base 20 and the rotating air flotation assembly 30. In some embodiments, the supporting body 10 is provided with a first mounting groove 11 and a second mounting groove 12, and the first mounting groove 11 and the second mounting groove 12 are arranged along the centerline direction of the supporting device 01. In actual working conditions, the centerline direction of the supporting device 01 can be vertical, in which case the first mounting groove 11 can be located above the second mounting groove 12. Of course, in other working conditions, the centerline direction can also be other directions, which are not specifically limited here.

[0018] The base 20 is disposed in the first mounting groove 11 to accommodate the base 20. Additionally, the base 20 supports the tray 40, which in turn supports the wafer. Thus, during the movement of the base 20, the tray 40 and the wafer it supports can move synchronously to meet process requirements. At least a portion of the rotating air flotation assembly 30 can be disposed in the second mounting groove 12. Therefore, by providing the first mounting groove 11 and the second mounting groove 12, mounting space can be provided for the base 20 and the rotating air flotation assembly 30.

[0019] To ensure that the rotating air flotation assembly 30 can be connected to the base 20 to drive the base 20 to rotate and float, the first mounting groove 11 and the second mounting groove 12 can be connected through the through hole 19 so that at least a portion of the rotating air flotation assembly 30 can extend into the first mounting groove 11 and be connected to the base 20.

[0020] Specifically, the through hole 19 can be formed in the bottom wall of the first mounting groove 11 to connect the first mounting groove 11 and the second mounting groove 12.

[0021] The rotating air flotation assembly 30 includes an air flotation section that is rotatably disposed through the through hole 19 to ensure that the air flotation section can rotate and move relative to the through hole 19, thereby realizing the rotation and air flotation of the base 20. Optionally, the first end of the air flotation section is located in the first mounting groove 11 and connected to the base 20, and the second end of the air flotation section is located in the second mounting groove 12.

[0022] To ensure airtightness at the through hole 19, the connection between the air flotation part and the through hole 19 can be sealed. Optionally, a sealing element, such as a sealing ring or a sealing gasket, can be provided at the connection between the air flotation part and the through hole 19. Of course, other sealing methods are also possible, and no specific limitation is made here.

[0023] Based on the above settings, the sealing between the first mounting groove 11 and the second mounting groove 12 can be achieved to prevent gas from flowing freely between the first mounting groove 11 and the second mounting groove 12.

[0024] To achieve the air buoyancy effect of the base 20, a force along the centerline direction can be applied to at least a portion of the rotating air buoyancy component 30, so that the base 20 is moved by the rotating air buoyancy component 30 to achieve the air buoyancy effect of the base 20.

[0025] Based on the above configuration, gas can be introduced into the second mounting slot 12, so that the pressure of the gas causes the rotating air flotation component 30 to move the base 20, thereby achieving the air flotation effect of the base 20. The gas can be either an air flotation gas or a rotating gas.

[0026] In some embodiments, the rotating air flotation assembly 30 may include an air flotation section and a rotating section. The air flotation section is connected to the base 20, and at least a portion of the air flotation section is located within the second mounting groove 12. The rotating section is located within the second mounting groove 12 and connected to the air flotation section. Therefore, when air flotation gas is introduced into the second mounting groove 12, the air flotation gas acts on the air flotation section, causing it to move along the centerline and synchronously move the base 20, thus achieving the air flotation effect of the base 20. When rotating gas is introduced into the second mounting groove 12, the rotating gas acts on the rotating section, causing it to rotate around the centerline, and the rotating section drives the air flotation section to rotate, ultimately causing the air flotation section to rotate the base 20.

[0027] Based on the above configuration, this embodiment of the application can provide air pressure to at least a portion of the air-bearing part located in the second mounting groove 12, causing the air-bearing part to move along the center line of the bearing device 01, and the air-bearing part drives the base 20 and the tray 40 it carries to move synchronously, thereby realizing the air-bearing of the tray 40; it can also provide air pressure to the rotating part located in the second mounting groove 12, causing the rotating part to rotate around the center line, and driving the air-bearing part to rotate, and the air-bearing part drives the base 20 to rotate synchronously, thereby realizing the rotation of the tray 40.

[0028] Compared to related technologies, in this embodiment, both the flotation gas and the rotating gas are introduced into the second mounting groove 12, which is separated from the base 20 and the tray 40 it carries in the first mounting groove 11. This prevents the flotation gas and the rotating gas from entering the process environment of the base 20 and the tray 40. As a result, it is not necessary to reserve a flow guide gap between the edge of the base 20 and the supporting body 10, or between the edge of the tray 40 and the supporting body 10, thereby effectively reducing the probability of the base 20 and the tray 40 forming a generation layer.

[0029] Furthermore, even though the substrate 20 and tray 40 form a growth layer, the air-floating gas and rotating gas do not pass through the process environment of the substrate 20 and tray 40, and therefore do not come into contact with the growth layer. This prevents airflow impact on the growth layer, making it less prone to detachment. Even if the growth layer does detach, it will not be carried to the wafer surface by the air-floating gas and rotating gas. Therefore, the embodiments of this application can effectively solve the problem of particulate contamination caused by gas carrying the growth layer to the wafer surface after detachment, thus affecting process quality.

[0030] In this embodiment, the air-floating gas and rotating gas will not flow through the area where the base 20 is located (i.e., the first mounting groove 11), thereby effectively preventing the air-floating gas and rotating gas from carrying away some of the heat from the base 20 and affecting the temperature field distribution of the wafer surface growth, thus ensuring the uniformity of the temperature field on the wafer surface.

[0031] In some embodiments, the air-bearing part may include a support shaft 31, and the rotating part may include a fan blade 32. The support shaft 31 is rotatably inserted through the through hole 19, with its first end located in the first mounting groove 11 and connected to the base 20; the second end of the support shaft 31 is located in the second mounting groove 12. Optionally, the diameter of the support shaft 31 can range from 0.3 mm to 30 mm. Furthermore, the support shaft 31 may be made of graphite.

[0032] Furthermore, the fan blade 32 is disposed on the support shaft 31 and located in the second mounting groove 12. Thus, by applying a force to the fan blade 32, the support shaft 31 can be rotated, and ultimately the support shaft 31 will drive the base 20 to rotate. For example, the fan blade 32 can be made of graphite material.

[0033] In some preferred embodiments, the air-float part is the support shaft 31, and the rotating part is the fan blade 32.

[0034] To facilitate the transmission of the air-float gas, the supporting body 10 may also be provided with a first air inlet 15, which provides air pressure to the second end of the support shaft 31 so as to drive the base 20 to air float through the support shaft 31.

[0035] Optionally, the outlet of the first air intake duct 15 can be connected to the second mounting groove 12. For example, the outlet can be located on the side wall of the second mounting groove 12. Alternatively, other structures (such as grooves) can be used to achieve indirect communication between the first air intake duct 15 and the second mounting groove 12. Based on this configuration, air-floating gas can be introduced into the second mounting groove 12 through the first air intake duct 15. The air-floating gas acts on the second end of the support shaft 31, causing the support shaft 31 to move along the centerline. Ultimately, the support shaft 31 drives the base 20 to move, thus achieving the air-floating effect of the base 20. For example, the diameter of the first air intake duct 15 can range from 0.2 mm to 15 mm.

[0036] It should be noted that the air flotation gas output from the first air intake duct 15 can directly act on the end face of the second end of the support shaft 31 along the center line direction. Of course, it can also act on other components and other components act on the second end of the support shaft 31 to make the support shaft 31 move along the center line direction. As long as the support shaft 31 can move along the center line direction, the specific implementation is not limited.

[0037] In addition, the supporting body 10 may also be provided with a second air intake 16, which is used to provide air pressure to the fan blade 32 so as to drive the base 20 to rotate through the fan blade 32 and the support shaft 31.

[0038] Specifically, the outlet of the second air intake duct 16 is connected to the second mounting groove 12. For example, the outlet of the second air intake duct 16 can be located on the side wall of the second mounting groove 12. In this way, during the process, rotating gas can be introduced into the second mounting groove 12 through the second air intake duct 16. The rotating gas acts on the fan blade 32, causing the fan blade 32 to rotate. The fan blade 32 then drives the support shaft 31 to rotate, and finally the support shaft 31 drives the base 20 to rotate. For example, the diameter of the second air intake duct 16 can be in the range of 0.2mm to 15mm.

[0039] In some embodiments, the outlet of the second air intake 16 may be positioned opposite to the fan blade 32 to apply force to the blades 321 of the fan blade 32 through airflow.

[0040] Of course, to prevent excessive air pressure in the second mounting groove 12, the second mounting groove 12 may be provided with an air outlet so that the air flotation gas and rotating gas in the second mounting groove 12 can be discharged through the air outlet.

[0041] Optionally, both the flotation gas and the rotating gas can be argon, hydrogen, nitrogen, etc., and of course, other forms are also possible, without specific limitations here.

[0042] Based on the above configuration, the first air intake duct 15 can provide air pressure to the second end of the support shaft 31 located in the second mounting groove 12, causing the support shaft 31 to move along the center line of the bearing device 01, and the support shaft 31 drives the base 20 and the tray 40 it carries to move synchronously, thereby realizing the air buoyancy of the tray 40; the second air intake duct 16 can provide air pressure to the fan blade 32 located in the second mounting groove 12, causing the fan blade 32 to rotate around the center line, and driving the support shaft 31 to rotate, and the support shaft 31 drives the base 20 to rotate synchronously, thereby realizing the rotation of the tray 40.

[0043] To ensure the installation stability of the support shaft 31, such as Figure 2 and Figure 3As shown, a third mounting groove 13 can be provided on the bottom wall of the second mounting groove 12 away from the first mounting groove 11. The second end of the support shaft 31 is located in the third mounting groove 13. In this way, the side wall of the third mounting groove 13 can play a radial limiting role on the second end of the support shaft 31 to prevent the support shaft 31 from moving or tilting in the radial direction at will, thus ensuring the stability of the support shaft 31.

[0044] In addition, since the support shaft 31 can move along the center line, the second end of the support shaft 31 can move in the third mounting groove 13. In this way, during the movement of the support shaft 31 along the center line, the second end can always be kept in the third mounting groove 13 and will not be pulled out, thereby ensuring the limiting effect of the support shaft 31.

[0045] In order to enable the air-floating gas delivered by the first air intake duct 15 to act on the second end of the support shaft 31, in this embodiment of the application, the outlet of the first air intake duct 15 can be located on the bottom wall of the third mounting groove 13 and positioned opposite to the second end of the support shaft 31. In this way, air-floating gas can be introduced into the third mounting groove 13 through the outlet of the first air intake duct 15, and the air-floating gas can act on the end face of the second end along the center line direction, thereby exerting a thrust on the support shaft 31, enabling the support shaft 31 and the base 20 to move along the center line direction to achieve the air-floating effect of the base 20.

[0046] To prevent excessive air pressure within the third mounting groove 13, a gap may be provided between the outer peripheral wall of the second end of the support shaft 31 and the side wall of the third mounting groove 13. This gap communicates with the second mounting groove 12, allowing the flotation gas acting on the second end to flow into the second mounting groove 12 through the gap and be discharged through the outlet of the second mounting groove 12. It should be noted that controlling the flow rate of the flotation gas allows for control of the thrust applied to the support shaft 31, preventing excessive or insufficient thrust and ensuring smooth movement of the support shaft 31.

[0047] Continue to refer to Figure 2 and Figure 3 In some embodiments, the supporting body 10 may also be provided with a first exhaust duct 17, the inlet of which is located on the side wall of the third mounting groove 13 and communicates with the gap. Based on this arrangement, the air-floating gas introduced into the second end and the third mounting groove 13 via the second air inlet duct 16 can flow through the gap to the first exhaust duct 17 and finally be discharged from the first exhaust duct 17, thereby preventing the air pressure in the third mounting groove 13 from becoming too high.

[0048] Optionally, the air inlet of the first exhaust duct 17 can be located near the opening of the third mounting groove 13. This allows for a greater movement distance for the support shaft 31 within the third mounting groove 13, thereby ensuring that the base 20 and the tray 40 it supports have a greater air buoyancy height.

[0049] In other embodiments, the outer peripheral wall of the second end of the support shaft 31 can also be in close contact with the side wall of the third mounting groove 13. In this case, the second end can be regarded as a piston. When the second air intake 16 introduces air flotation gas into the third mounting groove 13, it pushes the support shaft 31 to move until the second end moves to the position where the outlet of the first exhaust duct 17 is exposed. At this time, the air flotation gas is discharged through the first exhaust duct 17.

[0050] The air flotation process in this embodiment is as follows: when it is necessary to pick up or put down the tray 40, the air flotation gas can be delivered to the third mounting groove 13 through the first air inlet 15 and push the support shaft 31 to move, so that the base 20 and the tray 40 it carries can be lifted to a preset position through the support shaft 31. At the same time, the air flotation gas is discharged from the third mounting groove 13, thereby realizing the air flotation effect of the base 20 and the tray 40, so as to facilitate the robot to pick up or put down the tray 40 and effectively prevent the robot from touching other structural components.

[0051] Optionally, the carrying device 01 may also include a protective component 60. When the base 20 and the tray 40 are in an air-floating state, the tray 40 is higher than the upper surface of the protective component 60, which facilitates the robot arm to pick up and put down the tray 40 and avoids the robot arm from touching the protective component 60.

[0052] refer to Figure 4 In some embodiments, the rotating air flotation assembly 30 may also include a connecting rod 33, which can transmit the force applied by the air flotation gas to the support shaft 31, causing the support shaft 31 to move along the centerline direction, thereby achieving the air flotation effect of the base 20 and the tray 40.

[0053] The connecting rod 33 is located in the second mounting groove 12, with one end connected to the second end of the support shaft 31 and the other end corresponding to the outlet of the first air intake duct 15. The portion between the two ends of the connecting rod 33 is rotatably connected to the bottom wall of the second mounting groove 12. Based on this configuration, the connecting rod 33 can be considered as a lever. During the air intake process of the first air intake duct 15, the air-floating gas acts on the other end of the connecting rod 33, causing the connecting rod 33 to rotate relative to the bottom wall of the second mounting groove 12. At the same time, one end of the connecting rod 33 applies a force to the second end of the support shaft 31, enabling the support shaft 31 to move along the centerline direction. The support shaft 31 then drives the base 20 and the tray 40 it carries to move synchronously, thereby achieving the air-floating effect of the base 20 and the tray 40.

[0054] In addition, the part of the connecting rod 33 that is rotatably connected to the bottom wall of the second mounting groove 12 can change its position in the extension direction of the connecting rod 33, that is, adjust the position of the support point of the lever, so that the force at both ends of the connecting rod 33 can be changed accordingly.

[0055] Specifically, when the support point moves towards one end of the connecting rod 33, the lever arm of the air-floating gas acting on the other end of the connecting rod 33 increases. Thus, when the same force is applied to the second end of the support shaft 31 from one end of the connecting rod 33, the force exerted by the air-floating gas on the other end of the connecting rod 33 can be reduced, thereby correspondingly reducing the flow rate or velocity of the air-floating gas. Conversely, when the support point moves towards the other end of the connecting rod, the flow rate or velocity of the air-floating gas can be correspondingly reduced. Therefore, the flow rate or velocity of the air-floating gas can be adjusted to adapt to different operating conditions.

[0056] Continue to refer to Figure 4 In some embodiments, the side wall of the second mounting groove 12 may be provided with a fourth mounting groove 14, and the other end of the connecting rod 33 is located in the fourth mounting groove 14. The outlet of the first air inlet 15 is connected to the fourth mounting groove 14. In this way, air-floating gas can be introduced into the fourth mounting groove 14 through the first air inlet 15, so that the air-floating gas acts on the other end of the connecting rod 33, thereby driving the support shaft 31, the base 20 and the tray 40 to move through the rotation of the connecting rod 33, so as to achieve the air-floating effect of the base 20 and the tray 40.

[0057] For example, the other end of the connecting rod 33 may be provided with a spherical structure. By providing the spherical structure, the contact area between the other end of the connecting rod 33 and the side wall of the fourth mounting groove 14 can be reduced, thereby reducing the contact friction resistance and making the connecting rod 33 easier to rotate.

[0058] To prevent excessive air pressure in the fourth mounting slot 14, the supporting body 10 can also be provided with a second exhaust channel 18. The inlet of the second exhaust channel 18 is set towards the fourth mounting slot 14, and the outlet of the second exhaust channel 18 is set towards the second mounting slot 12. In this way, the second mounting slot 12 and the fourth mounting slot 14 can be connected through the second exhaust channel 18, so that the air flotation gas acting on the other end of the connecting rod 33 in the fourth mounting slot 14 can flow through the second exhaust channel 18 to the second mounting slot 12, and finally be discharged through the air outlet of the second mounting slot 12.

[0059] It should be noted that the other end of the connecting rod 33 can have a gap or be tightly connected to the side wall of the fourth mounting groove 14, as long as the connecting rod 33 can rotate under the action of the air flotation gas.

[0060] To achieve the rotatable connection between the connecting rod 33 and the bottom wall of the second mounting groove 12, one of the bottom wall of the second mounting groove 12 and the connecting rod 33 may be provided with a first mounting groove 121, and the other may be provided with a protrusion 331, and the protrusion 331 rotatably engages with the first mounting groove 121. In this way, the connecting rod 33 can be smoothly rotated relative to the bottom wall of the second mounting groove 12.

[0061] In other embodiments, the bottom wall or side wall of the second mounting groove 12 may also be provided with a pivot, and the connecting rod 33 is rotatably connected to the pivot to ensure the smooth rotation of the connecting rod 33.

[0062] To prevent motion interference between the connecting rod 33 and the support shaft 31, in some embodiments, one end of the connecting rod 33 may be provided with a second mounting groove 332, and the second end of the support shaft 31 may be provided in the second mounting groove 332. In this way, the second end of the connecting rod 33 can be radially limited by the side wall of the second mounting groove 332 to prevent the second end from disengaging from the connecting rod 33. At the same time, the second end of the support shaft 31 can also rotate in the second mounting groove 332, thereby accommodating both the movement of the support shaft 31 along the centerline and the rotation of the connecting rod 33 relative to the bottom wall of the second mounting groove 12, ensuring that no motion interference occurs between the support shaft 31 and the connecting rod 33.

[0063] In other embodiments, one end of the connecting rod 33 can be rotatably connected to the second end of the support shaft 31 to ensure that there is no motion interference between the support shaft 31 and the connecting rod 33. Exemplarily, the rotatable connection can be a shaft connection, a ball joint connection, a pin connection, etc.

[0064] refer to Figures 5 to 10 In some embodiments, the supporting device 01 may further include a support member 50, which has a shaft hole 51 through which the support shaft 31 rotatably and movablely passes. The support member 50 is also located in the through hole 19 for abutting against the base 20. Based on this, the support member 50 can support the base 20, and the shaft hole 51 ensures that the support shaft 31 can pass through it. Furthermore, the wall of the shaft hole 51 can also provide radial restraint for the support shaft 31.

[0065] In other embodiments, the support member 50 may also be disposed on the bottom wall of the second mounting groove 12 for abutting against the fan blade 32. Based on this, the support member 50 can support the fan blade 32, and the shaft hole 51 can ensure that the support shaft 31 can pass through the support member 50. Furthermore, the hole wall of the shaft hole 51 can also provide radial restraint for the support shaft 31.

[0066] Optionally, the support member 50 can be a circular rotating sheath; of course, it can also be in other forms, which are not specifically limited here. In addition, the support member 50 can be made of graphite material to improve wear resistance while ensuring strength.

[0067] To enable the installation of the support member 50, a recess 122 can be provided at the through hole 19, and at least part of the support member 50 is embedded in the recess 122 to ensure the installation stability of the support member 50.

[0068] Similarly, the bottom wall of the second mounting groove 12 may be provided with a recess 122, and at least part of the support member 50 is embedded in the recess 122 to ensure the installation stability of the support member 50.

[0069] For example, the sink 122 can be a trapezoidal groove in the longitudinal section, which can limit the support member 50 in both the center line direction and the radial direction.

[0070] like Figure 7 As shown in b), in some embodiments, the support member 50 can be a cylindrical structure with a uniform outer diameter. For example, the support member 50 can be a cylindrical structure. Therefore, when installing the support member 50, the entire cylindrical structure or a portion of the cylindrical structure can be installed into the settling tank 122.

[0071] like Figure 7 As shown in a), in some embodiments, the support member 50 may also be a cylindrical structure comprising multiple cylindrical segments with non-uniform outer diameters. For example, the support member 50 may include a first cylindrical segment and a second cylindrical segment, wherein the outer diameter of the first cylindrical segment is larger than the outer diameter of the second cylindrical segment, and their inner diameters are equal. Based on this, when installing the support member 50, the second cylindrical segment can be installed into the sink 122, while the first cylindrical segment supports the base 20 or the blade 321.

[0072] Based on the above configuration, designing the support member 50 as a cylindrical structure can reduce the contact area between the support member 50 and the base 20 or the fan blade 32, thereby reducing the frictional resistance of the support member 50 to the rotation of the base 20 or the fan blade 32.

[0073] For example, when the support member 50 is a cylindrical structure with a constant diameter, the thickness of the cylindrical structure can be 0.2mm to 5mm; in addition, the inner diameter of the cylindrical structure can be 3mm to 15mm to accommodate the diameter of the support shaft 31, the outer diameter of the cylindrical structure can be 5mm to 25mm, and the height of the cylindrical structure can be 0.5mm to 20mm.

[0074] When the support member 50 is a cylindrical structure comprising multiple cylindrical sections with non-uniform outer diameters, the thickness of the first cylindrical section can range from 0.2mm to 5mm, the inner diameter of the second cylindrical section can range from 3mm to 15mm to accommodate the diameter of the support shaft 31, the outer diameter of the cylindrical structure can range from 5mm to 25mm, and the height of the cylindrical structure can range from 0.5mm to 30mm.

[0075] In some embodiments, the outer wall of the support shaft 31 is sealed to the inner wall of the through hole 19 to prevent gas in the second mounting groove 12 from flowing into the first mounting groove 11 through the gap between the support shaft 31 and the through hole 19, which would cause process quality problems and temperature field uniformity problems.

[0076] For example, a sealing material, such as oil or grease, can be filled between the support shaft 31 and the through hole 19; of course, a sealing ring or other structure can also be provided.

[0077] In other embodiments, when the support device 01 further includes a support member 50, since the support member 50 is assembled with the through hole 19, the outer wall of the support member 50 is sealed to the inner wall of the through hole 19, so as to prevent gas in the second mounting groove 12 from flowing into the first mounting groove 11 through the gap between the support member 50 and the through hole 19, which would cause process quality problems and temperature field uniformity problems.

[0078] For example, a sealing material, such as oil or grease, can be filled between the support member 50 and the through hole 19; of course, a sealing ring or other structure can also be provided.

[0079] In addition, the outer wall of the support shaft 31 is sealed to the inner wall of the shaft hole 51 to prevent gas in the second mounting groove 12 from flowing into the first mounting groove 11 through the gap between the support shaft 31 and the shaft hole 51, which would cause process quality problems and temperature field uniformity problems.

[0080] For example, a sealing material, such as oil or grease, can be filled between the support shaft 31 and the shaft hole 51; of course, a sealing ring or other structure can also be provided.

[0081] refer to Figures 2 to 6 In some embodiments, the support device 01 may also include a protective component 60, which is disposed on the support body 10 and surrounds the first mounting groove 11. Thus, the protective component 60 can provide a certain degree of protection for the surface of the support body 10.

[0082] Optionally, the edges of the base 20 and the tray 40 may have a certain gap between them and the protective component 60. The gap may be in the range of 0.1mm to 2mm to ensure that the base 20 and the tray 40 are not interfered with by the protective component 60 when they rotate.

[0083] Of course, there can be a certain gap between the edges of the base 20 and the pallet 40 and the supporting body 10. The gap can be 0.1mm to 2mm to ensure that the base 20 and the pallet 40 are not disturbed by the supporting body 10 when they rotate.

[0084] Optionally, the protective assembly 60 may include a first protective member 61 and a second protective member 62, wherein the first protective member 61 may be located upstream of the base 20 and the tray 40 along the air intake direction, and the second protective member 62 may be located downstream of the base 20 and the tray 40 along the air intake direction. Exemplarily, both the first protective member 61 and the second protective member 62 may be semi-annular structures to surround and cover the surface of the support body 10 located around the base 20 and the tray 40.

[0085] The surface of the protective component 60 facing away from the support body 10 can be lower than the end face of the tray 40 facing away from the base 20. For example, the height difference can range from 0.1mm to 5mm, and the specific height difference can be set according to the actual working conditions. In this way, the surface of the protective component 60 facing away from the support body 10 can be slightly lower than the surface of the tray 40 facing away from the base 20. Compared with a larger difference, this can help reduce the probability of process gas entering the gap between the base 20 and the tray 40 and the support body 10 and the protective component 60, thereby reducing the growth layer in the gap.

[0086] Furthermore, the surface of the protective component 60 facing away from the support body 10 can be higher than the end face of the base 20 facing the tray 40. Compared to the situation where the surface of the protective component 60 facing away from the support body 10 is lower than the end face of the base 20 facing the tray 40, this effectively blocks process gases from flowing through the gap between the protective component 60 and the base 20, thereby further reducing the probability of a growth layer forming in the gap. It also effectively blocks air-floating gases and rotating gases from blowing towards the wafer through the gap, thus effectively preventing particle contamination of the wafer surface and eliminating contamination of the wafer epitaxial growth caused by particles brought by the airflow from the base 20.

[0087] Similarly, the surface of the protective component 60 facing away from the support body 10 can be higher than the end face of the tray 40 facing the base 20. Compared to the method where the surface of the protective component 60 facing away from the support body 10 is higher than the end face of the tray 40 facing the base 20, this effectively blocks process gases from flowing through the gap between the protective component 60 and the tray 40, thereby further reducing the probability of a growth layer forming in the gap. Of course, it also effectively blocks air-floating gases and rotating gases from blowing towards the wafer through the gap, thus effectively preventing particle contamination of the wafer surface and eliminating contamination of the wafer epitaxial growth caused by particles brought by the airflow from the tray 40.

[0088] refer to Figure 11In some embodiments, the fan blade 32 may include a plurality of blades 321 arranged circumferentially, each blade 321 being a straight blade or a curved blade. For example, Figure 11 As shown in b), straight blades facilitate the processing and manufacturing of fan blade 32; as Figure 11 As shown in a), the curved blades can facilitate airflow and promote the rotation of the fan blade 32. For example, the number of blades 321 can be 3 to 8, and of course, other numbers are also possible. The specific number can be set according to the actual working conditions.

[0089] refer to Figures 2 to 6 , Figure 9 In some embodiments, the support shaft 31 may be provided with a first threaded section 311, and the base 20 and the support shaft 31 are connected through the first threaded section 311 to facilitate the assembly and disassembly of the base 20 and the support shaft 31.

[0090] Furthermore, the thread direction of the first threaded section 311 is consistent with the rotation direction of the base 20, that is, the rotation direction of the base 20 is consistent with the direction of screwing the base 20 on the support shaft 31. In this way, during the process of rotating the base 20 by the support shaft 31, the base 20 is prevented from rotating relative to the support shaft 31 and falling off.

[0091] In some embodiments, the support shaft 31 may be provided with a second threaded section 312, and the fan blade 32 and the support shaft 31 are connected through the second threaded section 312 to facilitate the assembly and disassembly of the fan blade 32 and the support shaft 31.

[0092] Furthermore, the thread direction of the second threaded section 312 is consistent with the rotation direction of the fan blade 32, that is, the rotation direction of the fan blade 32 is consistent with the direction of screwing the fan blade 32 on the support shaft 31. In this way, during the process of rotating the fan blade 32 driven by the support shaft 31, the fan blade 32 is prevented from rotating relative to the support shaft 31 and falling off.

[0093] Based on the aforementioned carrier device 01, this application also discloses a semiconductor device, which includes the aforementioned carrier device 01. The semiconductor device can be a silicon carbide epitaxial device, such as a horizontal hot-wall silicon carbide epitaxial device.

[0094] refer to Figure 2 In some embodiments, the semiconductor device may include a first heating element 021 and a second heating element 022, which are used to maintain the required temperature during the process. The first heating element 021 and the second heating element 022 may be arranged vertically at intervals.

[0095] For example, both the first heating element 021 and the second heating element 022 can be induction heating elements; of course, they can also be other forms, which are not specifically limited here. In addition, the first heating element 021 and the second heating element 022 can be made of graphite material.

[0096] In this embodiment, the second heating component 022 can serve as a support body 10 to provide an installation foundation for the base 20, the rotating air flotation assembly 30, etc., and can provide the required heat.

[0097] In summary, the embodiments of this application can alleviate the problem of particle shedding from the base 20 and tray 40 during the process and being carried to the wafer surface, causing wafer surface contamination, and can also alleviate the problem of uneven temperature field on the wafer surface caused by the air flotation gas and rotating gas carrying away some of the heat from the base 20.

[0098] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A supporting device, characterized in that, include: The supporting body (10), the base (20), and the rotating air flotation component (30); The supporting body (10) is provided with a first mounting groove (11) and a second mounting groove (12). The first mounting groove (11) and the second mounting groove (12) are arranged along the center line direction of the supporting device (01) and are connected through a through hole (19). The base (20) is provided in the first mounting groove (11) and is used to support the tray (40). The rotating air flotation assembly (30) includes an air flotation part and a rotating part. The air flotation part is connected to the base (20). At least a portion of the air flotation part is located in the second mounting groove (12). The rotating part is located in the second mounting groove (12) and is connected to the air flotation part.

2. The load bearing device of claim 1, wherein, The air flotation part includes a support shaft (31), and the rotating part includes a fan blade (32). The support shaft (31) is rotatably inserted through the through hole (19), and the first end of the support shaft (31) is located in the first mounting groove (11) and connected to the base (20), and the second end is located in the second mounting groove (12). The fan blade (32) is disposed on the support shaft (31) and located in the second mounting groove (12).

3. The load bearing device of claim 2, wherein, The supporting body (10) is also provided with a first air intake (15) and a second air intake (16); The first air intake (15) is used to provide air pressure to the second end so as to drive the base (20) to float via the support shaft (31). The second air intake (16) is used to provide air pressure to the fan blade (32) so as to drive the base (20) to rotate via the fan blade (32) and the support shaft (31).

4. The bearing device according to claim 3, characterized in that, The bottom wall of the second mounting groove (12) opposite to the first mounting groove (11) is provided with a third mounting groove (13); The second end is disposed in the third mounting groove (13), and there is a gap between the outer peripheral wall of the second end and the side wall of the third mounting groove (13); The outlet of the first air intake (15) is located on the bottom wall of the third mounting groove (13) and is positioned opposite to the second end.

5. The bearing device according to claim 4, characterized in that, The supporting body (10) is also provided with a first exhaust channel (17), the inlet of which is located on the side wall of the third mounting groove (13) for discharging the air flotation gas acting on the second end.

6. The bearing device according to claim 3, characterized in that, The rotating air flotation assembly (30) also includes a connecting rod (33) disposed in the second mounting groove (12); One end of the connecting rod (33) is connected to the second end, and the other end of the connecting rod (33) is correspondingly provided to the outlet of the first air intake (15). The portion between the two ends of the connecting rod (33) is rotatably connected to the bottom wall of the second mounting groove (12).

7. The bearing device according to claim 6, characterized in that, The second mounting groove (12) has a fourth mounting groove (14) on its side wall. The other end of the connecting rod (33) is located in the fourth mounting groove (14). The outlet of the first air intake (15) is connected to the fourth mounting groove (14). The supporting body (10) is also provided with a second exhaust channel (18), the inlet of the second exhaust channel (18) is disposed towards the fourth mounting groove (14), and the outlet of the second exhaust channel (18) is disposed towards the second mounting groove (12).

8. The bearing device according to claim 6, characterized in that, The bottom wall of the second mounting groove (12) and the connecting rod (33) are provided with a first mounting groove (121) and a protrusion (331), which is rotatably engaged with the first mounting groove (121); And / or, one end of the connecting rod (33) is provided with a second mounting groove (332), and the second end is provided in the second mounting groove (332), or, one end of the connecting rod (33) is rotatably connected to the second end.

9. The bearing device according to claim 2, characterized in that, The bearing device (01) further includes a support member (50), the support member (50) is provided with a shaft hole (51), and the support shaft (31) is rotatably and movablely inserted through the shaft hole (51). The support member (50) is provided in the through hole (19) and is used to abut against the base (20); And / or, the support member (50) is disposed on the bottom wall of the second mounting groove (12) for abutting against the fan blade (32).

10. The bearing device according to claim 9, characterized in that, A recessed groove (122) is provided at the through hole (19) and / or the bottom wall of the second mounting groove (12), and at least a portion of the support member (50) is embedded in the recessed groove (122).

11. The bearing device according to claim 9, characterized in that, The support member (50) is a cylindrical structure with a constant outer diameter; Alternatively, the support member (50) may be a cylindrical structure comprising multiple non-uniform outer diameter cylindrical sections.

12. The bearing device according to claim 2, characterized in that, The outer wall of the support shaft (31) is sealed to the inner wall of the through hole (19); Alternatively, the bearing device (01) may further include a support member (50), the support member (50) having a shaft hole (51), the support shaft (31) being rotatably and movablely passing through the shaft hole (51), the support member (50) being disposed in the through hole (19) for abutting against the base (20), and the outer wall of the support member (50) being sealed to the inner wall of the through hole (19), and the outer wall of the support shaft (31) being sealed to the inner wall of the shaft hole (51).

13. The bearing device according to claim 1, characterized in that, The support device (01) further includes a protective component (60), which is disposed on the support body (10) and surrounds the first mounting groove (11); The surface of the protective component (60) facing away from the supporting body (10) is higher than the end face of the base (20) facing the tray (40) and the end face of the tray (40) facing the base (20), and lower than the end face of the tray (40) facing away from the base (20).

14. The bearing device according to claim 13, characterized in that, The height difference between the surface of the protective component (60) facing away from the supporting body (10) and the end face of the tray (40) facing away from the base (20) is in the range of 0.1mm to 5mm.

15. The bearing device according to claim 2, characterized in that, The fan blade (32) includes a plurality of blades (321) arranged along its circumference, each blade (321) being a straight blade or a curved blade.

16. The bearing device according to claim 2, characterized in that, The support shaft (31) is provided with a first threaded section (311), the base (20) is connected to the support shaft (31) through the first threaded section (311), and the thread direction of the first threaded section (311) is consistent with the rotation direction of the base (20); And / or, the support shaft (31) is provided with a second threaded section (312), the fan blade (32) is connected to the support shaft (31) through the second threaded section (312), and the thread direction of the second threaded section (312) is consistent with the rotation direction of the fan blade (32).

17. A semiconductor device, characterized in that, Includes the carrier device (01) as described in any one of claims 1 to 16.

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