A fixing assembly for carrying a substrate, a fixing device and a method of operation thereof

Abstract

This invention relates to the fabrication of TFT panels or semiconductor processes, specifically to a fixing component, fixing device, and its operating method for supporting a substrate. The fixing component includes a base and a disk. The upper side of the base has a groove, and the lower side of the base has a negative pressure hole communicating with the inside of the groove. The disk is disposed within the groove, and the outer side of the disk is in contact with the inner side of the groove. The disk is made of microporous ceramic material. The fixing device includes a fixing component and a large disk. The large disk has a through hole, and the fixing component is disposed within the through hole and moves in the vertical direction of the through hole. This invention can achieve full-surface contact between the substrate and the disk. Furthermore, based on the characteristics of the microporous ceramic material, it can improve the uniformity of contact between the substrate and the disk, thereby avoiding deformation problems caused by uneven local stress on the substrate.

Description

Technical Field

[0001] This invention relates to the fabrication of TFT panels or semiconductor processes, and more specifically to a fixing component, fixing device, and method of operation for supporting a substrate. Background Technology

[0002] Currently, in the fabrication of TFT panels or semiconductors, the photoresist coating process typically employs a chuck vacuum (negative pressure) adsorption method. After fixing the substrate, photoresist is sprayed and applied by rotation. However, because existing chucks usually have an uneven surface design, the substrate and chuck are not in full contact. This structural design easily leads to uneven stress on certain areas of the substrate during negative pressure adsorption, causing deformation. This deformation further results in uneven distribution of the photoresist film thickness on the substrate surface, forming Mura defects (pattern inhomogeneities generated during photolithography), severely affecting the product's optical performance and production yield.

[0003] Furthermore, during the negative pressure adsorption process, the airflow typically flows along the Chuck surface towards the center and then exits from the support. This airflow path may further exacerbate the localized stress differences on the substrate, leading to more pronounced deformation problems. Therefore, existing technologies have significant shortcomings in substrate fixation and photoresist coating uniformity, and urgently need improvement to enhance production efficiency and product quality. Summary of the Invention

[0004] The technical problem to be solved by the present invention is that the existing fixing components cause uneven stress on the substrate during the substrate bearing process due to structural design and material selection, which leads to substrate deformation and uneven photoresist coating, and cannot effectively avoid Mura defects. The purpose is to provide a fixing component, fixing device and its working method for bearing substrate, which realizes uniform stress on the substrate during the fixing process, effectively reduces substrate deformation, improves the uniformity of photoresist coating, thereby significantly reducing Mura defects and improving product yield and optical performance.

[0005] This invention is achieved through the following technical solution:

[0006] A fixing assembly for supporting a substrate includes: a base and a disk. The upper side of the base is provided with a groove, and the lower side of the base is provided with a negative pressure hole communicating with the inside of the groove. The disk is disposed in the groove, and the outer side of the disk is in contact with the inner side of the groove. The disk is made of microporous ceramic material.

[0007] Furthermore, the fixing component also includes a support rod, the upper end of which is fixedly connected to the lower side of the base, and the support rod has a negative pressure channel communicating with the negative pressure hole inside, and the negative pressure channel is connected to the negative pressure component.

[0008] Optionally, the upper surface of the disc body is not lower than the upper surface of the base, and the porosity of the disc body is 30% to 70%.

[0009] A lifting and fixing device includes a fixing component for supporting a substrate as described above, and a large plate. The large plate has a through hole, the projection of the fixing component is disposed in the through hole, and the fixing component moves in the vertical direction of the through hole.

[0010] Specifically, the outer side of the base fits against the inner side of the through hole, and the fixing component is provided with a lower limit position. When the fixing component is at the lower limit position, the upper side of the disc body and the upper side of the large disc body are on the same horizontal plane.

[0011] Optionally, the size of the disk body is smaller than the size of the substrate, and the size of the large disk body is larger than the size of the substrate.

[0012] Optionally, the lower end of the support rod is connected to a lifting device, and the lifting device drives the support rod to move up and down.

[0013] Furthermore, the fixing device also includes a fixing block, which is disposed on the outer edge of the large disk and is used to fix the substrate located on the large disk.

[0014] A method for operating a lifting and fixing device, based on the lifting and fixing device described above, the method comprising:

[0015] The drive fixing component moves upward and receives the substrate;

[0016] After the substrate is placed and stabilized, the fixing component is moved down to the upper side of the disk body and is at the same horizontal plane as the upper side of the large disk body.

[0017] Apply adhesive.

[0018] Optionally, when the fixing component receives the substrate, the negative pressure component operates and fixes the substrate to the fixing component.

[0019] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0020] This invention proposes a disk body made of microporous ceramic material. The disk body has high flatness, specific micropore diameter and porosity, which can realize full-surface contact between the substrate and the disk body. At the same time, based on the characteristics of microporous ceramic material, it can improve the contact uniformity between the substrate and the disk body, thereby avoiding the deformation problem caused by uneven local stress on the substrate and achieving uniform thickness of photoresist coating. Attached Figure Description

[0021] The accompanying drawings illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the principles of the invention. These drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, but do not constitute a limitation on the embodiments of the present invention.

[0022] Figure 1 This is a schematic diagram of a fixing assembly for supporting a substrate according to the present invention.

[0023] Figure 2 This is a structural schematic diagram of the lifting and fixing device according to the present invention.

[0024] Reference numerals: 1-substrate, 2-base, 3-disc body, 4-negative pressure hole, 5-support rod, 6-large disc body, 7-fixing component, 8-through hole. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the invention.

[0026] It should also be noted that, for ease of description, only the parts relevant to the present invention are shown in the accompanying drawings.

[0027] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0028] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0029] Where there is no conflict, the embodiments and features described in the present invention can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0030] TFT (Thin Film Transistor Panel) is a display technology commonly used in liquid crystal displays (LCDs). It uses thin film transistors as pixel switching devices to control the display state. Its manufacturing process requires high-precision photolithography and coating processes.

[0031] Chuck refers to a key component used to support and fix a substrate, widely used in the photoresist coating process of TFT panel or semiconductor manufacturing. The main function of chuck is to fix the substrate on its surface through vacuum (negative pressure) adsorption, providing a stable support platform for subsequent photoresist spraying and coating processes.

[0032] Existing Chucks typically have a surface with some unevenness, designed to provide airflow channels for negative pressure adsorption. However, the uneven surface prevents complete contact between the substrate and the Chuck, with only localized areas receiving support. During negative pressure adsorption, uneven stress on the substrate surface can easily lead to deformation, resulting in uneven photoresist coating.

[0033] Mura defects are commonly formed in existing photolithography processes. Mura refers to the uneven patterning caused by uneven photoresist coating or substrate surface defects in the photolithography process, usually manifested as uneven brightness or color. Mura is a transliteration of the Japanese word "ムラ" meaning unevenness or spots.

[0034] Microporous ceramic materials are ceramic materials with high porosity and controllable pore size. Their structure contains a large number of uniformly distributed micropores, and they are often used in applications such as gas filtration, adsorption, and uniform airflow distribution. This material has excellent high-temperature resistance, corrosion resistance, and mechanical strength properties, and can be processed with high flatness.

[0035] Flatness refers to the smoothness and evenness of a material surface, usually expressed in micrometers (μm). Porosity is the proportion of the volume of pores inside a material to its total volume, usually expressed as a percentage. Materials with high porosity have better gas permeability.

[0036] Example 1

[0037] like Figure 1 and Figure 2As shown, this embodiment provides stable and high-precision support for the substrate 1, and provides a fixing component 7 for supporting the substrate 1, including: a base 2 and a disk 3. The upper side of the base 2 is provided with a groove, and the lower side of the base 2 is provided with a negative pressure hole 4 communicating with the inside of the groove. The disk 3 is disposed in the groove, and the outer side of the disk 3 is in contact with the inner side of the groove. The disk 3 is made of microporous ceramic material.

[0038] The upper side of the base 2 has a groove to provide an embedding space for the disc 3. The inner side of the groove fits against the outer side of the disc 3 to form a stable support structure. The groove is connected to the negative pressure hole 4 on the lower side of the base 2. When the negative pressure hole 4 is activated, the resulting adsorption force can fix the substrate 1 to the surface of the disc 3.

[0039] The disk body 3 is made of microporous ceramic material. This material has good flatness and a specific pore structure, which can achieve uniform airflow distribution and stable negative pressure adsorption. It can avoid deformation of the substrate 1 due to uneven local stress and ensure the accuracy of photoresist coating or other processes.

[0040] In order to effectively fix the base 2, the fixing component 7 also includes a support rod 5. The upper end of the support rod 5 is fixedly connected to the lower side of the base 2, which can bear the load of the fixing component 7 during operation, and at the same time ensure that the base 2 will not shift position during adsorption. The fixing method can be welding, threaded connection or other mechanical connection methods, and the specific implementation can be selected according to the working conditions of the device.

[0041] Furthermore, the support rod 5 has a negative pressure channel inside that communicates with the negative pressure hole 4, allowing the airflow required for negative pressure adsorption to be transmitted through the support rod 5 to the groove of the base 2, thereby providing adsorption force for the disc 3 and the substrate 1. The diameter, length and smoothness of the inner wall of the negative pressure channel can ensure that the airflow loss is minimized during transmission, thus ensuring the stability of the adsorption effect.

[0042] The negative pressure channel is connected to the negative pressure assembly, which typically includes a vacuum pump or other type of vacuum generating device to produce a negative pressure airflow.

[0043] In addition, the upper surface of the disc 3 is not lower than the upper surface of the base 2, ensuring that the upper surface of the disc 3 is always in the main support position of the processing area, and avoiding uneven force caused by contact between the substrate 1 and the base 2.

[0044] The flatness of the upper surface of the disk 3 is less than 3 μm, and the pore size of the micropores inside the disk 3 is 1 μm to 50 μm, avoiding the problem of excessively strong or weak local adsorption force when the substrate 1 is fixed. The porosity inside the disk 3 is 30% to 70%, which ensures gas flow while maintaining the structural strength of the disk 3, thereby meeting the requirements of stable adsorption and long-term use.

[0045] Example 2

[0046] like Figure 2 As shown, this embodiment combines the fixing component 7 with the large plate 6 and introduces through holes 8 and vertical movement design to reduce the problem of increased operational complexity and increased interference possibility caused by the overall movement or additional moving components in traditional fixing devices during the adhesive coating process. The substrate 1 can be directly supported by the vertical movement of the fixing component 7 without moving the entire fixing device or lowering the substrate 1 onto the large plate 6 through other additional components.

[0047] A lifting and fixing device is provided, including a fixing component 7 for supporting a substrate 1 and a large plate 6 as described above. The large plate 6 has a through hole 8. The projection of the fixing component 7 is disposed within the through hole 8, and the fixing component 7 can move vertically in the through hole 8. Through the built-in lifting function, the fixing component 7 directly realizes the loading and fixing of the substrate 1, without the need to add additional complex moving components to place the substrate 1 onto the large plate 6.

[0048] The outer side of the base 2 fits into the inner side of the through hole 8. The fixing component 7 is provided with a lower limit position. When the fixing component 7 is in the lower limit position, the upper side of the disc body 3 and the upper side of the large disc body 6 are on the same horizontal plane.

[0049] During the substrate 1 loading stage, the fixing component 7 moves up to a high position to receive the substrate 1; after the substrate 1 is stably placed, the fixing component 7 moves down to the processing position so that the upper side of the disk 3 is flush with the upper side of the large disk 6, thus completing the preparation for the adhesive coating operation.

[0050] The size of the disc body 3 is smaller than that of the base plate 1, which can reduce the size of the disc body 3 and the base 2, and reduce possible interference between the fixing component 7 and other devices.

[0051] The size of the large plate 6 is larger than that of the substrate 1, which can provide additional support at the edge of the substrate 1 to prevent the substrate 1 from tilting or deforming during the fixing process and improve processing stability.

[0052] The lower end of the support rod 5 is connected to the lifting device, and the lifting device drives the support rod 5 to move up and down. The lifting device gives the fixed component 7 flexible vertical movement capability, so that it can be adjusted to a suitable position during the loading and processing of the substrate 1. The lifting device can be a pneumatic cylinder, a hydraulic cylinder, or other devices that can move up and down.

[0053] The fixing device also includes a fixing block, which is disposed on the outer edge of the large disk 6 and fixed to the substrate 1 located on the large disk 6. The fixing block provides mechanical restraint at the edge of the substrate 1 to prevent the substrate 1 from sliding or displacing due to rotation or vibration.

[0054] Example 3

[0055] A method for operating a lifting and fixing device, based on the above-mentioned lifting and fixing device, includes the following steps:

[0056] By driving the lifting device, the fixing component 7 moves upward from the through hole 8 of the large plate 6 and extends to the placement position of the substrate 1 to receive the substrate 1.

[0057] After the substrate 1 is securely placed, the fixing component 7 moves downward until the upper side of the disk 3 and the upper side of the large disk 6 are on the same horizontal plane.

[0058] After the substrate 1 is stably fixed and its position is adjusted, the device enters the adhesive coating process stage. The flat processing platform and stable support of the substrate 1 ensure the uniformity of adhesive coating, thereby reducing defects (such as Mura) caused by deformation or positional displacement of the substrate 1.

[0059] In the above method, the negative pressure adsorption function of the fixing component 7 can be omitted, and the base can be fixed by the fixing block. Therefore, the entire device can directly set the disc body 3 to a common material without unevenness.

[0060] However, in order to prevent the substrate 1 from sliding or shifting during movement or processing, and to further enhance the stability of the processing, when the fixing component 7 receives the substrate 1, the negative pressure component works and fixes the substrate 1 to the fixing component 7, and the substrate 1 and the disk body 3 are firmly fixed by negative pressure adsorption.

[0061] This working method combines the design features of the lifting and fixing device, and through the synergistic effect of the lifting and adjusting of the fixing component 7 and the negative pressure adsorption, it achieves efficient loading, precise positioning and stable processing of the substrate 1.

[0062] In the description of this specification, the references to terms such as "one embodiment / mode," "some embodiments / modes," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment / mode or example is included in at least one embodiment / mode or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment / mode or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments / modes or examples. Furthermore, without contradiction, those skilled in the art can combine and integrate the different embodiments / modes or examples described in this specification, as well as the features of different embodiments / modes or examples.

[0063] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0064] Those skilled in the art should understand that the above embodiments are merely for illustrating the present invention and are not intended to limit the scope of the invention. Those skilled in the art can make other changes or modifications based on the above invention, and these changes or modifications still fall within the scope of the present invention.

Claims

1. A holding assembly for carrying a substrate, characterized by, include: The base (2) and the disc (3) are provided. The upper side of the base (2) is provided with a groove, and the lower side of the base (2) is provided with a negative pressure hole (4) communicating with the inside of the groove. The disc (3) is disposed in the groove, and the outer side of the disc (3) is in contact with the inner side of the groove. The disc (3) is made of microporous ceramic material.

2. The holding assembly for carrying a substrate according to claim 1, wherein, It also includes a support rod (5), the upper end of which is fixedly connected to the lower side of the base (2), and the inside of the support rod (5) is provided with a negative pressure channel communicating with the negative pressure hole (4), and the negative pressure channel is connected to the negative pressure component.

3. The holding assembly for carrying a substrate according to claim 2, wherein, The upper surface of the disc (3) is not lower than the upper surface of the base (2), and the porosity of the disc (3) is 30% to 70%.

4. A lifting and fixing device, characterized in that, Includes a fixing component (7) for supporting a substrate as described in any one of claims 2 or 3, and a large disk (6), wherein the large disk (6) is provided with a through hole (8), the projection of the fixing component (7) is disposed in the through hole (8), and the fixing component (7) moves in the vertical direction of the through hole (8).

5. A lifting and fixing device according to claim 4, characterized in that, The outer side of the base (2) is in contact with the inner side of the through hole (8). The fixing component (7) is provided with a lower limit position. When the fixing component (7) is in the lower limit position, the upper side of the disc body (3) and the upper side of the large disc body (6) are on the same horizontal plane.

6. A lifting and fixing device according to claim 4, characterized in that, The size of the disk body (3) is smaller than the size of the substrate (1), and the size of the large disk body (6) is larger than the size of the substrate (1).

7. A lifting and fixing device according to claim 4, characterized in that, The lower end of the support rod (5) is connected to the lifting device, and the lifting device drives the support rod (5) to move up and down.

8. A lifting and fixing device according to claim 4, characterized in that, It also includes a fixing block, which is disposed on the outer edge of the large disk body (6) and is used to fix the substrate (1) located on the large disk body (6).

9. A method for operating a lifting and fixing device, characterized in that, Based on the lifting and fixing device as described in any one of claims 5-8, the working method includes: Drive the fixing component (7) to move upward and receive the substrate (1); After the substrate (1) is placed and stabilized, the fixing component (7) moves down to the upper side of the disk body (3) and is on the same horizontal plane as the upper side of the large disk body (6); Apply adhesive.

10. The working method of the lifting and fixing device according to claim 9, characterized in that, When the fixing component (7) receives the substrate (1), the negative pressure component works and fixes the substrate (1) to the fixing component (7).

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