Multi-site cube testing method and system, cube handler

Abstract

A multi-station CUBE testing method and system, and a CUBE sorting machine, relate to the field of wafer inspection. The multi-station CUBE testing method includes: for CUBE devices transported via multiple parallel tracks, a loading / unloading machine and a testing machine are configured and combined according to a first-in-first-out (FIFO) sequence mechanism, enabling completely independent testing of the CUBE devices on each track. This invention employs a multi-track asynchronous testing mode, allowing multiple tracks to be "unloaded, loaded, and tested" independently without interference. Compared to existing FT-like solutions that require all CUBEs to be loaded onto the diced wafer carrier before testing, and existing CP-like solutions that require all CUBEs to be picked up onto the optical wafer carrier before testing, this method improves testing efficiency, eliminates the need for high-cost probe cards with 64 or 128 stations, significantly reduces costs, offers high equipment reusability, and supports multiple carriers.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, specifically to a multi-station CUBE testing method and system, and a CUBE sorting machine. Background Technology

[0002] High Bandwidth Memory (HBM) is a 3D stacking technology solution based on Dynamic Random-Access Memory (DRAM), primarily used to meet the high bandwidth, low power consumption, and large capacity requirements of high-performance computing (HPC), graphics processing, and networking applications. The basic architecture of HBM consists of a bottom logic base chip and stacked core DRAM chips, interconnected via three through-silicon vias (TSVs). HBM outperforms traditional DRAM in terms of capacity, bandwidth, and energy efficiency.

[0003] The HBM manufacturing process includes: logic and memory wafer / TSV process (through silicon via process), thinning and bonding of solder balls (bump, solder balls on flip chips), stacking and molding, dicing and debonding, etc. Corresponding testing includes separate wafer testing for logic and memory, wafer testing after stacking, and testing of the final diced semi-customized ultra-high bandwidth element (CUBE), ultimately resulting in a marketable HBM product. CUBE testing is a critical step in ensuring the reliability of the complex stacked structure of HBM, avoiding cost waste and performance risks caused by post-stack failures.

[0004] like Figure 1 , 2 As shown, there are two main technical solutions for CUBE testing: (1) A dedicated test carrier, the Die Carrier, is used. This carrier consists of an Interposer, a Lid, and a Probe. The diced cube is placed on the carrier, and electrical parameters and functional tests are performed through a single contact. This method involves placing the cube in the Die Carrier and then performing testing and screening using a method similar to traditional final test (FT). After testing, the cube is removed. This method is complex, with a long overall time and high carrier cost.

[0005] (2) A certain number (e.g., 64 or 128) of diced cubes are picked up and placed onto a wafer carrier (the wafer is placed on the chuck of the probe station), and then tested using a traditional probe card. This method uses a screening method similar to traditional chip probing (CP). This method requires extremely high alignment accuracy, has a very long pick-up and placement time, and the probe card is expensive.

[0006] Therefore, it is urgent to develop a new CUBE testing device and a sorting machine for testing to address the current deficiencies and shortcomings. Summary of the Invention

[0007] In view of this, the main objective of the present invention is to provide a multi-station CUBE testing method and system, and a sorting machine for testing, so as to at least partially solve the above-mentioned technical problems.

[0008] To achieve the above objectives, as a first aspect of the present invention, a multi-station CUBE testing method is proposed, comprising the following steps: When the CUBE device to be tested is transported by the loading machine to N parallel tracks via the pick-and-place head and further tested by the test machine, the execution queues of the loading / unloading machine and the test machine are configured in a first-in-first-out order to achieve completely independent testing of the CUBE device to be tested on each track.

[0009] As a second aspect of the present invention, a CUBE sorting machine is also provided, comprising: A loading / unloading machine is used for loading / unloading CUBE devices to be tested; wherein the loading / unloading machine supports 12-inch wafer mode and waffle tray mode; The pick-and-place head and vision positioning system are supported by a gantry frame and located above the loading / unloading machine; wherein, the vision positioning system is used for position detection of the CUBE device to be tested on the loading / unloading machine and assists the control unit in positioning the CUBE device to be tested. N parallel tracks are used to independently transport the CUBE device under test to the test machine for probe card testing; The carrier shuttle mechanism, located at the beginning of each track, is used to transfer the CUBE device to be tested picked up by the pick-and-place head across workstations and transport it to an idle track. The control unit configures the execution queues of the loading / unloading machine and / or testing machine according to the first-in-first-out order.

[0010] As a third aspect of the present invention, a multi-station CUBE testing system is also proposed, comprising: The CUBE sorting machine described above is used to transport CUBE devices to be tested; wherein, the CUBE sorting machine includes N parallel tracks, which are used to independently transport the CUBE devices to be tested to the testing machine for testing. The testing machine, according to the test resources matching the CUBE devices to be tested transported on each track of the CUBE sorting machine, sequentially completes the testing of the CUBE devices to be tested transported on different tracks in a first-come, first-served order.

[0011] Based on the above technical solutions, it can be seen that the multi-station CUBE testing method and system, and CUBE sorting machine of the present invention have at least one of the following beneficial effects compared with the prior art: (1) The testing method of the present invention can be matched with the number of testing resources, testing time and material handling time required for different CUBE products to design the optimal operation process to improve testing efficiency. For example, depending on the different testing resource requirements, different modes such as 8 tracks for 4 CUBEs to be tested at the same time and 6 tracks for 8 CUBEs to be tested at the same time can be designed; furthermore, a single track "low-yield stop test" strategy can also be designed. For example, if 4 out of 6 tested CUBEs have failed, the track test can be stopped without waiting for all 6 CUBEs to be tested. Instead, a new set of CUBEs to be tested can be used. The priority order of the tracks can be determined according to a predetermined rule (such as first-come, first-served, and if waiting at the same time, the sequence number takes precedence) to improve testing efficiency. (2) The present invention adopts a multi-track asynchronous test mode, which can perform "unloading, loading and testing" on multiple tracks separately without interfering with each other. Compared with the existing packaged finished product test (FT) scheme, which requires loading the entire CUBE into the diced wafer carrier before testing, the test efficiency is improved; compared with the existing wafer probe test (CP) scheme, which requires picking up the entire CUBE onto the optical wafer carrier before testing, the test efficiency is improved. (3) The testing method of the present invention only requires low-parallel test probe cards with 6 to 16 workstations in the mass production testing process, which greatly reduces the cost compared with wafer cutting carriers and high-parallel test probe cards; (4) The equipment of the present invention has high reusability and supports a variety of carriers such as 12-inch wafers, waffle packs, and tape reels, reducing the cost of production line transformation. Attached Figure Description

[0012] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly described below.

[0013] Figure 1 This is a schematic diagram of the first scheme for CUBE testing in the prior art; Figure 2 This is a schematic diagram of a second approach to CUBE testing in the prior art; Figures 3A-3D The diagram illustrates the overall scheme for the device and modules of this invention to jointly complete the entire process of CUBE "loading-testing-unloading" in order to achieve the testing and verification of the CUBE; wherein, Figure 3A This is a side view. Figure 3B This is a top view. Figure 3C This is the rear view. Figure 3D This is a general appearance drawing of the equipment; Figure 4 This is a schematic diagram illustrating the connection between the testing machine and the probe card of the present invention; Figure 5 This is a mechanical structure layout diagram of the CUBE sorting machine of the present invention; Figure 6 This is a three-dimensional schematic diagram of the gantry structure and the pick-and-place head of the present invention; Figure 7 This is a schematic diagram of the signal interaction between the CUBE sorting machine and the testing machine of the present invention; Figure 8 This is a schematic diagram of the system action flow for the first scenario of the multi-station CUBE testing system of the present invention; Figure 9 This is a schematic diagram of the system action flow for the second scenario of the multi-station CUBE testing system of the present invention. Detailed Implementation

[0014] To make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0015] The terminology used in this invention is for the purpose of describing particular embodiments only and is not intended to limit the embodiments of the invention. The singular forms “a,” “the,” and “the” as used in the embodiments of the invention and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0016] Existing CUBE testing equipment requires high alignment accuracy and suffers from low testing efficiency due to long CUBE loading times. By redesigning the testing algorithm and sorter connection method, this invention achieves a faster loading speed and a more efficient parallel testing method, solving the aforementioned problems of the prior art. Therefore, as... Figure 3A-9 As shown, this invention proposes a multi-station CUBE testing method, applicable to the testing of HBM stacked chip CUBEs, specifically including the following steps: For devices under test transported via multiple parallel tracks, the loading / unloading machines and testing machines are configured and combined in a first-in-first-out order to achieve completely independent testing, loading, and / or unloading of the devices or groups of devices under test on each track.

[0017] The testing is achieved, for example, using probe cards, which can simultaneously test, for example, 6, 8, or more devices suitable for a single measurement by the testing equipment. Each track simultaneously transports one group of these devices under test, allowing each track to independently complete a set of tests per transport. In a preferred embodiment, 4-16 station probe cards are used to reduce consumable costs, avoiding the use of expensive test cards with extremely high bit depths, such as those for 64-bit or 128-bit devices. The tester establishes an electrical connection with the cube under test via a test interface board, probe cards, connectors, and cables.

[0018] The loading and unloading machines can support various modes, such as a 12-inch wafer conveyor and a waffle pack. The ability to simultaneously support different modes of device-under-test (DUT) testing is due to the presence of a waffle shuttle mechanism and a pick / place head; among which, such as... Figure 5 , 6 As shown, the pick-and-place head is located on a transversely arranged gantry structure perpendicular to the longitudinal tracks. It can move back and forth on the gantry structure and, as an execution unit, precisely completes the "pick-up" and "placement" actions of cubes on the loading / unloading machine with the visual assistance of a head camera. The carrier shuttle mechanism is located at the beginning of each track, used to transfer the cubes picked up by the pick-and-place head across workstations to idle tracks. The conveying of cubes on each track is powered by linear drive systems configured on the left and right sides of the equipment, thus ensuring precise and controllable displacement. The positional relationship between the gantry structure and the pick-and-place head is as follows: Figure 5 As shown, the gantry structure is equipped with a linear motor driver and a linear encoder, which enables the pick-and-place head to move precisely and quickly and reliably position itself to the desired location for picking up the cube.

[0019] Furthermore, for example, the loading and unloading machines are placed side by side, and then a 12-inch wafer conveyor, a waffle pack, etc. are docked with them. A pick-and-place head supported by a gantry structure is set above the loading and unloading machines to transfer the cubes to be tested to the carrier shuttle mechanism, which shuttles between the N parallel tracks to transport the cubes picked up by the pick-and-place head to the idle tracks. Therefore, in the inspection stage, a table camera located near the pick-and-place head performs visual inspection of the appearance of the cube, while a probe camera located on the parallel track uses a vision system to accurately align the cube to be inspected on the parallel track. A clean pad is responsible for cleaning the probe to ensure test accuracy. In the material flow stage, the wafer magazine input receives the raw wafers to be sorted (the diced cubes are located on the blue film). After processing by the equipment, the wafer magazine output and wafflepack output respectively complete the sorted cube output.

[0020] The "first-in, first-out" sequence mechanism, also known as the "first-out, first-finish" sequence mechanism, refers to a system where the tester and cube handler each have their own control queue. Each queue determines the completion status of its assigned task based on its own control signals, placing the completed task into its control queue first. When a task needs to be called later, the first task placed in the queue is called first, and the first task removed from the queue. Therefore, when the cube handler handles multiple parallel tracks carrying devices for testing, the track containing the device that has completed testing first enters the control queue first. Subsequent loading / unloading machines, when executing a new task, select the earliest placed task from the control queue for execution, thus achieving the "first-in, first-out" sequence mechanism. Similarly, when the test machine is responsible for transporting devices under test on multiple parallel tracks, the track containing the device under test that is first aligned and ready enters the control queue. When the test machine in the subsequent process executes a new progress, it selects the progress that was put in first from the control queue for execution, thus achieving a sequential mechanism of first alignment completed and first test exited.

[0021] The connection method between the test machine and the probe card of the present invention is as follows: Figure 4 As shown. The specific docking steps are as follows: ① Position the docking tester and CUBE sorter, and use the sorter guide pin to position it against the top plate of the tester; ② Lock the top plate of the tester with the sorter (head lock); ③ The cylinder pushes the ZIF component to connect with the probe card.

[0022] As a preferred embodiment, the multi-station CUBE testing method includes: ① Equipment startup and wafer preprocessing: Equipment startup -> probe card calibration -> chuck movement to input position -> wafer loading from feed cassette -> wafer alignment -> wafer surface chip positioning and inspection; ② CUBE pickup and transfer: Picking up the diced CUBE from the wafer blue film -> chip visual inspection -> chuck center positioning -> placing the chip on the chuck -> chuck movement to the test position -> probe alignment -> chuck movement to bring the CUBE under test into contact with the probe; ③ Testing and CUBE placement: Performing CUBE testing -> picking up the tested CUBE from the chuck -> chip bottom surface re-inspection -> moving the chuck to the unloader position, removing and placing it on the blue film -> process end. Each track is allocated different testing resources, and the above actions can be performed asynchronously without synchronization during the entire testing process.

[0023] This invention also proposes a CUBE sorting machine (CUBE Handler), comprising: A loading / unloading machine is used for loading / unloading devices under test; wherein, the loading / unloading machine supports multiple modes such as 12-inch wafer conveyor and waffle pack; The pick-and-place head and vision positioning system are supported by a gantry frame and located above the loading / unloading machine; wherein, the vision positioning system is used for position detection of the device to be tested on the loading / unloading machine and assists the control unit in positioning the device to be tested; N parallel tracks are used to independently transport the device under test to the test machine for testing; The carrier shuttle mechanism, located at the beginning of each track, is used to transfer the CUBE picked up by the pick-and-place head across workstations to an idle track. The control unit configures the loading / unloading machine and / or testing machine according to a first-come, first-served (FROM) sequence mechanism.

[0024] Therefore, throughout the process, the asynchronous scheduling logic operates independently on a track-by-track basis, running an "unload-load-test" cycle, with efficiency optimized through a time window scheduling algorithm. Specifically, after each track's m cubes are tested, they are unloaded, and then a new set of m cubes to be tested is loaded. After loading, the testing of the m cubes on that track is performed, and the unloading, loading, and testing of the next set of m cubes on the next track is executed synchronously, and so on, in a cyclical manner. Here, m is, for example, a natural number between 4 and 16, which can be determined based on the number and cost of the probe card. The specific execution steps are as follows: After the first set of tracks completes the loading action, it sends a signal to the testing machine to start the first set of testing resources to test the m cubes of the first set of tracks. After the first set of tracks completes the test, it sends a signal to the cube sorting machine to indicate that the track has been tested and is ready to be unloaded. After the first set of tracks is loaded, the CUBE sorter continues to perform the unloading and loading of the second set of tracks. After loading is completed, a signal is sent to the testing machine to start the second set of testing resources to test the m CUBEs on the second set of tracks. After the second set of tracks is tested, a signal is sent to the CUBE sorter to indicate that the track has been tested and is ready to be unloaded. And so on, repeating the test cyclically.

[0025] The aforementioned control unit can also be configured to optimize the testing process based on the required number of testing resources, testing time, and material handling time for different cube products, thereby improving testing efficiency. For example, depending on the testing resource requirements, different modes such as 8 tracks for simultaneous testing of 4 cubes and 6 tracks for simultaneous testing of 8 cubes can be designed. Furthermore, a single-track "low-yield stop testing" strategy can be designed. For instance, if 4 out of 6 cubes under test have failed, the testing of that track can be stopped without waiting for all 6 cubes to be tested. Instead, a new set of cubes can be used for testing. The priority order of the tracks can be determined according to predetermined rules (such as first-come, first-served, or priority based on sequence number if waiting simultaneously) to improve testing efficiency.

[0026] This invention also proposes a multi-station CUBE testing system, comprising: The sorting machine described above is used to transport devices to be tested; wherein, the sorting machine includes N parallel tracks, which are used to independently transport the devices to be tested to the testing machine for testing; The testing machine, according to the test resources that match the devices under test transported on each track of the sorting machine, sequentially completes the testing of the devices under test transported on different tracks in a first-come, first-served manner.

[0027] The sorting machine is, for example, the CUBE sorting machine described above.

[0028] The test machine, for example, is an automated test equipment (ATE), controlled by a control unit. It performs independent tests on each device under test transported along a first-in-first-out queue, such as functional tests for execution logic, storage, and high-speed signals. The test machine also includes a wafer probe station for positioning and aligning extremely small HBM chips. It typically features 2.5D SiP probe sockets and probe cards for connecting the chip's micro-bumps to the ATE equipment, requiring precise matching of the chip's pin array (e.g., a 4K pin array).

[0029] The present invention also discloses an executable program that, when executed, can perform the first-in-first-out control queue management method as described above.

[0030] The program code for executing the operations of this invention can be written in PLC languages, ladder diagrams, etc., and executed on programmable logic controllers such as PLCs and FPGAs. Alternatively, the program code for executing the operations of this invention can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Python, C++, macro assembly, etc., and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code can be executed entirely on the user's microcontroller or desktop computer, server, partially on the user's computer device, as a standalone software package, partially on the user's computer device and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including local area networks (LANs) or wide area networks (WANs), or it can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0031] The program product of the present invention includes a program carried on a readable medium, the program containing program code for performing the methods shown in the flowchart. In some embodiments, the program can be downloaded and installed from a network via a communication device, or installed from a storage device, or installed from a ROM. When the program is executed by a processing device, it performs the functions defined in the method of the present invention.

[0032] The present invention also discloses a storage medium, such as a computer-readable medium, for storing the executable program as described above.

[0033] It should be noted that the computer-readable medium described in this invention can be a computer-readable signal medium or a computer-readable storage medium, or any combination thereof. A computer-readable storage medium can be, for example,—but not limited to—an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of a computer-readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof.

[0034] In some embodiments of the present invention, the computer-readable storage medium may be any tangible medium containing or storing a program that may be used by or in conjunction with an instruction execution system, apparatus, or device. In some embodiments of the present invention, the computer-readable signal medium may include a data signal propagated in baseband or as part of a carrier wave, carrying computer-readable program code. Such propagated data signals may take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof.

[0035] A computer-readable signal medium can be any computer-readable medium other than a computer-readable storage medium, which can send, propagate, or transmit a program for use by or in connection with an instruction execution system, apparatus, or device. The program code contained on the computer-readable medium can be transmitted using any suitable medium, including but not limited to: wires, optical fibers, RF (radio frequency), etc., or any suitable combination thereof.

[0036] In some implementations, clients and servers can communicate using any currently known or future-developed network protocol such as HTTP (Hypertext Transfer Protocol) and can interconnect with digital data communication (e.g., communication networks) of any form or medium. Examples of communication networks include local area networks (“LANs”), wide area networks (“WANs”), the Internet (e.g., the Internet of Things), and peer-to-peer networks (e.g., ad hoc peer-to-peer networks), as well as any currently known or future-developed networks.

[0037] The present invention will be further illustrated below through specific embodiments. It should be noted that the following embodiments are merely illustrative and not intended to limit the present invention.

[0038] Example 1

[0039] This embodiment provides a multi-station CUBE testing device and method, which is suitable for testing HBM stacked chip CUBEs, especially for mass production testing scenarios, and supports three-temperature testing from -10 to 125℃, thereby improving CUBE testing efficiency and reducing testing costs.

[0040] This embodiment integrates the material handling capacity of the sorting machine with the precise pressing test technology of the probe station to construct a multi-track asynchronous testing system. The side view, top view, rear view, and perspective view of the overall scheme are shown below. Figures 3A-3D As shown, the equipment and modules include a testing machine, a multi-track sorting machine, and probe cards. Key functions are as follows: Test unit: This system uses the test unit as the core test unit, which is responsible for performing CUBE tests (such as DC parameters, functional verification, etc.). The underlying driver of the test unit is configured to enable the test unit to independently control a group of 6 CUBEs on a track for each group of test resources (power board *1 + digital board *1). Multi-track sorting machine: Designed with 6 independent tracks, each track includes a loading machine, a testing station, and an unloading machine; the sorting machine is responsible for mechanical operation and visual positioning, automatically loading the cut cubes from the loading machine into the testing station, and unloading the tested cubes into the unloading machine, while ensuring the accuracy of alignment during testing; the loading / unloading machine supports multiple modes such as 12-inch wafers / belt conveyors / waffle trays; Probe Card and Connection System: A 6-station probe card is used to reduce consumable costs. The electrical connection between the tester and the CUBE under test is achieved through the probe card, connectors, cables, etc. The above devices and modules work together to complete the entire process of CUBE "loading-testing-unloading", realizing the testing and verification of CUBE.

[0041] Example 2

[0042] This embodiment discloses a CUBE sorting machine, which adopts a multi-track asynchronous testing mode and is designed with 6 tracks, each track supporting 6 stations for simultaneous testing. A detailed machine layout diagram is shown below. Figure 5As shown, the equipment achieves fully automated CUBE processing from input to sorting output through the coordinated operation of multiple functional modules. Linear driver systems on both sides provide power support; a waffle shuttle handles the cross-station transfer of CUBEs; a pick / place head, as the execution unit, accurately completes the "pick-up" and "placement" actions of CUBEs with the visual assistance of a head camera; in the inspection stage, a table camera visually inspects the appearance of the CUBEs, a probe camera uses a vision system to achieve precise alignment, and a clean pad cleans the probes to ensure testing accuracy; in the material flow dimension, the wafer magazine input receives the raw wafers for sorting (the diced CUBEs are located on the blue film), and after processing, the wafer magazine output and waffle pack output respectively complete the sorted CUBE output. The gantry structure and pick / place head are shown below. Figure 6 As shown, the platform is equipped with a linear motor driver and a linear encoder, which enables precise movement and allows the pick-and-place head to quickly and reliably position itself at the coordinates of the desired pick-up cube.

[0043] The main steps of the multi-station CUBE testing method in this embodiment include: ① Equipment startup and wafer preprocessing: Equipment startup -> probe card calibration -> chuck movement to input position -> wafer loading from feed hopper -> wafer alignment -> wafer surface chip positioning and inspection; ② CUBE pickup and transfer: Pick up the diced CUBE from the wafer blue film -> chip visual inspection -> chuck center positioning -> place the chip on the chuck -> chuck movement to test position -> probe alignment -> chuck movement to bring the CUBE under test into contact with the probe; ③ Testing and CUBE placement: Perform CUBE testing -> pick up the tested CUBE from the chuck -> chip bottom surface re-inspection -> move the chuck to the unloading area, remove and place on the blue film -> process end. Each track is allocated different testing resources, and the above actions can be performed asynchronously without synchronization during the entire testing process.

[0044] Throughout the process, the asynchronous scheduling logic operates independently on a track-by-track basis, performing an "unload-load-test" cycle and optimizing efficiency through a time-window scheduling algorithm. Specifically, after each set of 6 cubes is tested, it is unloaded, and then a new set of 6 cubes to be tested is loaded. After loading, the testing of the 6 cubes on that track is executed, and the unloading, loading, and testing of the next set of 6 cubes on the next track are performed synchronously, and so on, in a cyclical manner. The specific execution steps are as follows: After the first set of tracks completes the loading action, a signal is sent to the testing machine to start the first set of testing resources to test the 6 cubes of the first set of tracks. After the first set of tracks completes the test, a signal is sent to the cube sorting machine to indicate that the track has been tested and is ready to be unloaded. After the first set of tracks is loaded, the CUBE sorter continues to perform the unloading and loading of the second set of tracks. After loading is completed, a signal is sent to the testing machine to start the second set of testing resources to test the 6 CUBEs of the second set of tracks. After the second set of tracks is tested, a signal is sent to the CUBE sorter to indicate that the track has been tested and is ready to be unloaded. And so on, repeating the test cyclically, with the signal interaction diagram as follows: Figure 7 As shown in the diagram, the action flow is as follows: Figure 8 , 9 As shown.

[0045] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A multi-site CUBE test method, characterized in that, Includes the following steps: When the CUBE device to be tested is transported by the loading machine to N parallel tracks via the pick-and-place head and further tested by the test machine, the execution queues of the loading / unloading machine and the test machine are configured in a first-in-first-out order to achieve completely independent testing of the CUBE device to be tested on each track.

2. The multi-site CUBE test method of claim 1, wherein, The test is performed using a probe card, which can simultaneously test 4 to 16 CUBE devices at one time.

3. The multi-site CUBE test method of claim 1, wherein, The CUBE device under test can be unloaded via a 12-inch wafer conveyor, a waffle tray, and / or a reel conveyor.

4. The multi-site CUBE test method of claim 1, wherein, The multi-station CUBE testing method specifically includes: The pick-and-place head, located on the horizontally arranged gantry structure, transfers the CUBE device to be tested from the loading machine to the carrier shuttle mechanism; The carrier shuttle mechanism transports the CUBE device to be tested picked up by the pick-and-place head to one of the N parallel tracks, which is an empty track. The CUBE devices under test on each track are tested by the test machine using probe cards according to the first-in-first-out (FIFO) mechanism.

5. The multi-station CUBE testing method according to claim 4, characterized in that, The loading machine and unloading machine are arranged side by side; A horizontally arranged gantry structure is set above the loading machine and unloading machine. A pick-and-place head that can be precisely moved and positioned is supported on the gantry structure for transferring the CUBE device to be tested to the carrier shuttle mechanism. The carrier shuttle mechanism transports the CUBE device to be tested picked up by the pick-and-place head to an idle track; The probe camera, located on the parallel track, uses a vision system to accurately align the CUBE device under test on the parallel track. The test machine uses a probe card to test the CUBE device under test on the track. After the test is completed, the CUBE devices are output after sorting by the unloading machine.

6. The multi-station CUBE testing method according to claim 1, characterized in that, The multi-station CUBE testing method specifically includes: ① Equipment startup, probe card calibration, chuck movement to the input position, wafer loading from the feed hopper, wafer alignment, and chip positioning and inspection on the wafer surface; ② Picking up the diced CUBE from the blue film on the wafer, chip visual inspection, chuck center positioning, placing the chip on the chuck, moving the chuck to the test position, aligning the probes, and moving the chuck to bring the CUBE under test into contact with the probes; ③ Performing CUBE testing, picking up the tested CUBE from the chuck, inspecting the bottom surface of the chip again, moving the chuck to the unloading area, removing the chip and placing it on the blue film, and ending the process.

7. A CUBE sorting machine, characterized in that, include: A loading / unloading machine is used for loading / unloading CUBE devices to be tested; wherein the loading / unloading machine supports 12-inch wafer mode and waffle tray mode; The pick-and-place head and vision positioning system are supported by a gantry frame and located above the loading / unloading machine; wherein, the vision positioning system is used for position detection of the CUBE device to be tested on the loading / unloading machine and assists the control unit in positioning the CUBE device to be tested. N parallel tracks are used to independently transport the CUBE device under test to the test machine for probe card testing; The carrier shuttle mechanism, located at the beginning of each track, is used to transfer the CUBE device to be tested picked up by the pick-and-place head across workstations and transport it to an idle track. The control unit configures the execution queues of the loading / unloading machine and / or testing machine according to the first-in-first-out order.

8. The CUBE sorting machine according to claim 7, characterized in that, Each track simultaneously transports m CUBE devices to be tested for testing. After the test is completed, the devices are unloaded, and then a new set of m CUBE devices to be tested is loaded. After loading, the test of the m CUBE devices to be tested on the track is performed. Simultaneously, the unloading, loading, and testing of the m CUBE devices to be tested on the next set of tracks are performed, and so on, in a cyclical manner. Where m is a natural number between 4 and 16.

9. A multi-station CUBE testing system, characterized in that, include: The CUBE sorting machine as described in claim 7 or 8 is used to transport CUBE devices to be tested; wherein the CUBE sorting machine includes N parallel tracks for independently transporting the CUBE devices to be tested to the testing machine for testing. The testing machine, according to the test resources matching the CUBE devices to be tested transported on each track of the CUBE sorting machine, sequentially completes the testing of the CUBE devices to be tested transported on different tracks in a first-come, first-served order.

10. The multi-station CUBE testing system according to claim 9, characterized in that, The test machine is an automatic test device controlled by a control unit. It performs independent tests on each CUBE device transported on each track in a first-come, first-served queue order. The testing machine also includes a wafer probe station for positioning and aligning the CUBE device under test, and a probe card for connecting the microbumps on the CUBE device under test to the automated testing equipment.

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