Non-contact testing of interposer and silicon bridge

Abstract

In various embodiments, a computer-implemented method for testing an interposer or silicon bridge includes: moving a first probe to the vicinity of a first contact of a device under test (DUT) via an automated test apparatus; moving a second probe to the vicinity of a second contact of the DUT via the automated test apparatus, wherein the first contact and the second contact are connected by a wire; driving the first probe with a first radio frequency (RF) signal via the automated test apparatus to sense a second RF signal in the wire; measuring the second RF signal via the second probe via the automated test apparatus; and generating a test result based on at least the second RF signal via the automated test apparatus.

Description

[0001] This application claims priority to U.S. Patent Application No. 63 / 751,768, filed January 30, 2025, and U.S. Patent Application No. 19 / 324,010, filed September 9, 2025, the full text of which is incorporated herein by reference. Technical Field

[0002] This invention relates to systems and methods for reliable testing tools for packaged integrated circuit (IC) devices, and more specifically, to non-contact testing of interposers and silicon bridges. Background Technology

[0003] Interposers and silicon bridges are commonly used in various electronic components to provide electrical interface wiring between connections on sockets or integrated circuits. Interposers or silicon bridges include various contacts (such as solder balls or pins) with conductive traces and / or metallization layers between them to provide interface wiring.

[0004] As with other devices, the interposer and silicon bridge require testing to determine if the conductive traces and / or metallization layers form adequate connections between their respective contacts, and to identify any short circuits, open circuits, or other defects that could prevent the interposer and silicon bridge from functioning properly. In some cases, the interposer is tested after partial assembly, such as after the assembly of a high-performance computing (HPC) device. However, this testing is performed after most of the component manufacturing and assembly is complete. Identifying faults during partial assembly is more costly and time-consuming. In other cases, various test systems perform contact testing on the interposer and silicon components before they are added to the electronic assembly. Testing such components in this way can reduce the cost and time associated with identifying faulty components. Other test systems employ non-contact methods, such as systems relying on X-rays, electron beams, or other imaging methods.

[0005] At least one drawback of such test systems is their inefficient testing of interposers and silicon bridges. For example, various test systems test a given wiring path within an interposer or silicon assembly by establishing physical contact with contacts connected via conductive traces or metallization layers and measuring signals to detect fault conditions (such as short circuits or open circuits). Test systems test each path in the interposer or silicon assembly in a sequential and parallel manner. However, contacts in a given interposer may be difficult to reach during testing. Small sizes and spacing of given contacts may prevent test equipment from making physical contact with the contact under test without touching adjacent contacts. Contacting adjacent contacts during testing degrades the measurements recorded by the test system and can lead to erroneous results. Furthermore, if test probes in the test system make physical contact with a contact, it may damage the contact. Existing non-contact inspection systems rely on imaging techniques and require bulky and expensive test equipment that is incompatible with typical semiconductor test systems or has limited accuracy in defect detection. Furthermore, traditional test systems require sequential testing and evaluation of each conductive lead or wire in the device (e.g., an interposer), resulting in excessively long testing times for each wire or conductive path in the device under test (DUT). Therefore, such test systems significantly increase the testing cost and time for complex electronic components, including interposers or silicon bridges.

[0006] In view of the above, what is needed in the art is an improved technique for interposer and silicon bridge testing. Summary of the Invention

[0007] In various embodiments, a computer-implemented method for testing an interposer or silicon bridge includes: moving a first probe to the vicinity of a first contact of a device under test (DUT) using an automated test apparatus. The method further includes moving a second probe to the vicinity of a second contact of the DUT using the automated test apparatus, wherein the first and second contacts are connected by a wire. The method also includes driving the first probe with a first radio frequency (RF) signal using the automated test apparatus to sense a second RF signal in the wire. The method further includes measuring the second RF signal using the second probe using the automated test apparatus, and generating a test result based on at least the second RF signal using the automated test apparatus.

[0008] Compared to existing technologies, at least one of the advantages of the disclosed technologies is that they enable rapid and accurate testing of interposers, silicon bridges, and other electronic devices using a non-contact method, eliminating the need for bulky and expensive imaging systems. Specifically, this non-contact method moves probes near the device under test (DUT) and performs one or more electrical tests that typically require a pair of contacts on the DUT to make contact with the test system. Thus, the non-contact test system can obtain accurate test results without damaging the DUT or introducing erroneous measurements due to contact errors. Compared to traditional non-contact test systems, the disclosed technologies can also accurately identify faults, such as open circuits, short circuits, and potential faults in adjacent conductors, at a faster speed and lower cost. Furthermore, the disclosed technologies can more accurately distinguish between functional conductors and faults. These advantages represent one or more technological advancements superior to existing technologies. Attached Figure Description

[0009] To gain a more detailed understanding of the features of the various embodiments described above, reference can be made to a more specific description of the inventive concept briefly outlined above, some of which are illustrated in the accompanying drawings. However, it should be noted that the drawings only show typical embodiments of the inventive concept and should not be considered as any limitation on the scope of the invention, and other equally effective embodiments exist.

[0010] Figure 1 shows a block diagram of a non-contact test system used to test a device under test (DUT) according to various embodiments.

[0011] Figure 2 shows a conceptual diagram of the interaction between the non-contact test system shown in Figure 1 and the device under test according to various embodiments.

[0012] Figure 3 shows an example RF probe close to the wires of the device under test in the non-contact test system shown in Figure 2 according to various embodiments.

[0013] Figure 4 shows the test setup for the complex contacts of the device under test shown in Figure 2 according to various embodiments.

[0014] Figure 5 shows a graph of complex measurement radio frequency signals received by the non-contact test system shown in Figure 2 according to various embodiments.

[0015] Figure 6 is a flowchart of the test method steps for the device under test according to various embodiments. Detailed Implementation

[0016] The following description lists many specific details to provide a more comprehensive understanding of the various embodiments. However, those skilled in the art will understand that the inventive concept can be practiced even without one or more of these specific details.

[0017] This document discloses a non-contact test system that can test and evaluate interface wiring of interposers and / or silicon bridges without contacting any leads, contacts, solder balls, or pins of the interposer and / or silicon bridge. This non-contact test system includes a plurality of radio frequency (RF) probes configured to establish capacitive coupling with the leads of a device under test (DUT). The DUT can be a device containing an interface to be tested (IUT), such as interface wiring. For example, the DUT can be an interposer or silicon bridge containing wires or interface wiring, just like an IUT. During testing, a probe card connected to the RF probes responds to instructions to move the RF probes to a desired location and bring them close to one or more target leads on the DUT. The probe card can move the RF probes along the x, y, and / or z axes and can tilt the RF probes to adjust their orientation relative to the DUT. Alternatively, in some embodiments, the DUT moves along the x, y, and / or z axes to adjust its orientation relative to the probes. One RF probe includes a retractable cable for changing the distance between the distal end of the RF probe and the target contact. Upon reaching the target location, the source RF probe couples to the first contact (e.g., capacitive coupling), and the receiving RF probe couples to the corresponding second contact; direct contact between the two is not required. The number of source RF probes does not need to be the same as the number of receiving RF probes. For example, six source RF probes can couple to six contacts acting as transmitters, and three receiving RF probes can couple to three contacts acting as receivers. The RF tester generates a test signal at a selected frequency. The source RF probe senses the wire connected to its corresponding first contact, thereby transmitting the RF test signal. The receiving RF probe receives the corresponding measurement RF signal from the corresponding second contact. In some embodiments, the non-contact test system generates multiple RF test signals in parallel, with each receiving RF probe receiving multiple measurement RF signals. The probe transmits one or more measurement RF signals to the test module. The test module analyzes one or more measurement RF signals and identifies any performance test failures. The test module provides one or more measurement RF signals and performance test results for evaluating the device under test.

[0018] Figure 1 shows a block diagram of a non-contact test system 100 testing a device under test (DUT) 150 according to various embodiments. As shown, the non-contact test system 100 includes, but is not limited to, a computing device 110 and a test device 140. The computing device 110 includes, but is not limited to, a processor 120, memory 122, a storage unit 124, an input / output (I / O) device interface 126, and interconnects 128. The memory 122 includes, but is not limited to, a radio frequency (RF) control module 132 and a test module 134.

[0019] During operation, processor 120 executes instructions from one or more modules 132, 134 stored in memory 122 to control test equipment 140. In this case, given modules 132, 134 can receive data from test equipment 140 and can send commands to test equipment 140 to control its operation. These operations include movement of test equipment 140 (e.g., probe card, one or more probe carriers, one or more probes, etc.) and / or performing one or more electrical tests on device under test 150.

[0020] The computing device 110 is configured to implement one or more aspects of various embodiments. In some examples, the computing device 110 individually controls one or more probes, probe cards, testers, and / or other components of the non-contact test system 100. In various embodiments, the computing device 110, a controller device (not shown) included in the test device 140, and / or other components of the test device 140 (e.g., probes, cables, and connectors) may also work together to control the position and / or orientation of one or more probes and control current during electrical testing, thereby testing one or more components of the device under test. The computing device 110 is also configured to receive one or more measurement signals from the test device 140, compare the one or more measurement signals with one or more predetermined and / or configurable thresholds, and record quality control results (e.g., pass, fail, etc.) based on the comparison.

[0021] In some embodiments, computing device 110 includes a processor 120, memory 122, storage unit 124, I / O device interface 126, and interconnects 128. Computing device 110 may be a desktop computer, notebook computer, smartphone, personal digital assistant (PDA), tablet computer, or any other type of computing device configured to receive input, process data, and selectively display images, and is suitable for implementing one or more embodiments. The computing device 110 described herein is merely illustrative, and any other technically feasible configuration should fall within the scope of this disclosure.

[0022] Processor 120 includes any suitable processor, which may be implemented as a central processing unit (CPU), graphics processing unit (GPU), application-specific integrated circuit (ASIC), field-programmable gate array (FPGA), artificial intelligence (AI) accelerator, any other type of processor, or a combination of different processors, such as a CPU configured to work in conjunction with a GPU. Typically, processor 120 can be any technically feasible hardware unit capable of processing data and / or executing software applications. Furthermore, within the context of this disclosure, the computing unit shown in computing device 110 may correspond to a physical computing system (e.g., a system in a data center) or a virtual computing instance executed in a computing cloud.

[0023] I / O device interface 126 enables communication between I / O devices and processor 120. I / O device interface 126 typically contains the necessary logic for interpreting I / O device addresses generated by processor 120. I / O device interface 126 may also be configured to implement handshakes between processor 120 and I / O devices, and / or generate interrupts associated with I / O devices. I / O device interface 126 can be implemented using any technically feasible CPU, ASIC, FPGA, or any other type of processing unit or device. I / O devices include devices capable of providing input (e.g., keyboard, mouse, touchscreen, microphone, remote control, camera, etc.) and devices capable of providing output (e.g., display device). Furthermore, I / O devices may also include devices capable of simultaneously receiving input and providing output (e.g., touchscreen, Universal Serial Bus (USB) port, etc.). I / O devices may be configured to receive various types of input from end users of computing device 110 and to provide various types of output to end users of computing device 110, such as displayed digital images, digital video, or text. In some embodiments, one or more I / O devices are configured to connect computing device 110 to a network. The network includes any technically feasible communication network that allows data exchange between computing device 110 and external entities or devices, such as web servers or other networked computing devices. For example, the network may include a wide area network (WAN), a local area network (LAN), a wireless (Wi-Fi) network, and / or the internet.

[0024] Memory 122 includes random access memory (RAM) modules, flash memory cells, or any other type of storage cell or combination thereof. Processor 120, I / O device interface 126, and network interface are configured to read data from and write data to memory 122. Memory 122 contains various software programs executable by processor 120 and application data associated with these software programs, including RF control module 132 and test module 134, the latter performing individual and / or group electrical tests on device under test (DUT) 150.

[0025] In various embodiments, the radio frequency (RF) control module 132 included in the computing device controls one or more components of the test device 140 and / or the computing device 110 when performing one or more electronic tests. Discussed in detail in Figures 2-6, the RF control module 132 can control the position of one or more probes relative to the device under test (DUT) 150 and drive the generation of test RF signals. Based on one or more capacitive couplings between the test device 140 and the DUT 150, the test RF signals induce corresponding RF signals in the IUT (e.g., interface wiring) included in the DUT 150. In some embodiments, the RF control module 132 can acquire data to determine the probe position. For example, the RF control module 132 can acquire image data (e.g., via a camera) and / or sensor data (e.g., laser measurements, acoustic data, mechanical data, magnetic data) to determine the probe position along the x, y, and z axes, and to determine orientation (e.g., the plane of the test device 140 and / or the tilt of the device under test 150).

[0026] For example, the RF control module 132 can process sensor data to determine the position and orientation of the probe. The RF control module 132 can then use this position and orientation to verify that the probe is located at a target distance close to one or more contacts of the device under test (DUT) 150. When the RF control module 132 determines that the probe 226 is not in a suitable position or orientation, the RF control module 132 can send one or more instructions to the test device 140 to adjust the probe's position. In this case, the RF control module 132 can iteratively process the data acquired by the test device 140, generate instructions to adjust the test device 140, and then complete the verification and generate a test RF signal.

[0027] In various embodiments, test module 134 may include one or more components for performing various types of tests on device under test (DUT) 150. For example, test module 134 may include a vector network analyzer (VNA) module, an RF electrical test module, a circuit analysis module, and so on. In this case, one of the test modules 134 may select a specific test to be performed (e.g., S-parameter test), and computing device 110 may generate one or more commands to move test device 140 relative to DUT 150 to a target location. In various embodiments, test device 140 records signals detected from DUT 150 and identifies insertion loss and return loss. For example, test module 134 may measure RF signal characteristics such as waveform, S-parameters, conductivity, resistance, signal characteristics (amplitude, phase, steepness of change, spectrum, etc.), etc. Furthermore, or in other words, test device 140 may collect electrical measurement data, enabling test module 134 to identify performance test failures (e.g., short circuit, open circuit, resonant frequency, etc.). In this case, the computing device 110 provides electrical measurement data and any performance test failure information through the I / O device interface 126 for evaluating the device under test 150.

[0028] Storage unit 124 includes non-volatile memory for applications and data, which may include fixed or removable disk drives, flash memory devices, and CD-ROMs, DVD-ROMs, Blu-ray discs, HD-DVDs, or other magnetic, optical, or solid-state storage devices. Storage unit 124 may be a disk drive storage device. Although shown as a single unit in the figure, storage unit 124 may be a combination of fixed and / or removable storage devices, such as fixed disk drives, floppy disk drives, tape drives, removable memory cards, or optical storage devices, network-attached storage (NAS), or storage area networks (SANs). Software programs (including one or more LED test applications that perform individual and / or grouped LED tests) may be stored in storage unit 124 and loaded into memory 122 during execution.

[0029] Interconnect 128 includes any technically feasible internal and / or external data buses, memory buses, system buses, expansion buses, etc. Interconnect 128 contains a series of electrical paths that allow the transfer of data, addresses, and control signals between various components of computing device 110 and / or external devices and components. For clarity, interconnect 128 is discussed herein in the singular, but interconnect 128 can refer to one or more interconnects 128, for example, those interconnects 128 that connect processor 120 to memory 122 and / or storage unit 124, and connect computing device 110 to other devices, including test device 140, I / O devices, peripheral devices, other devices, etc. In some embodiments, interconnect 128 includes PCI Express (PCIe) connections for high-speed internal connectivity and Universal Serial Bus (USB) connections for connecting external devices.

[0030] The DUT 150 can be one of many types of electronic components. For example, the DUT 150 can be an interposer, silicon bridge, silicon interposer (SIP), embedded multi-chip interconnect bridge (EMIB), local silicon bridge, silicon interposer (SIP), embedded multi-chip interconnect bridge (EMIB), local silicon interconnect (LSI), etc. In various embodiments, the DUT 150 includes one or more interfaces under test (IUTs) (not shown). In this case, the non-contact test system 100 can test one or more IUTs by positioning the test device 140 to couple with corresponding connection point pairs on the DUT 150. For example, the non-contact test system 100 can use positioning probes to couple multiple probes simultaneously with their respective contacts to test multiple IUTs in parallel. In this case, the non-contact test system 100 can generate multiple test RF signals in parallel to induce different currents in different IUTs.

[0031] Figure 2 shows a conceptual diagram of the interaction between the non-contact test system 100 shown in Figure 1 and the device under test 240 according to various embodiments. As shown, the non-contact test system 200 includes, but is not limited to, an automated test device 210, a probe card 220, and a test interface 250. The DUT 240 includes, but is not limited to, multiple contacts 242 and multiple wires 244. The automated test device 210 includes, but is not limited to, an RF control module 132, a test module 134, and one or more RF testers 212. The probe card 220 includes, but is not limited to, zero or one or more RF switches 222, zero or one or more RF probe carriers 224, zero or one or more non-contact probes 226, and zero or one or more contact probes 228. The test interface 250 includes, but is not limited to, one or more large contacts 252 and one or more connecting lines 254.

[0032] In various embodiments, the DUT 240 may be an interposer layer containing a plurality of conductors 244 to be tested. In this case, the automated test apparatus 210 is configured to use a probe card 220 to test the IUT contained in the DUT 240. Before initiating the test, the RF control module 132 sends instructions to the probe card 220. These instructions include: the RF switch 222 selecting one RF probe (e.g., RF probe carrier 224(1)) and one or more non-contact probes 226 (e.g., probes 226(1) – 226(4)) as a source, and selecting another RF probe (e.g., RF probe carrier 224(2)) and one or more non-contact probes 226 (e.g., probes 226(5) – 226(8)) as a receiver. The RF control module 132 sends instructions to move the selected RF probe carrier 224 and / or the selected non-contact probe 226 to a target position and / or target orientation relative to the target contact 242 on the device under test 240. Once moved to the target location, the source non-contact probe 226 (e.g., non-contact probe 226(2)) in the source RF probe carrier 224(1) is capacitively coupled to the target contact 242. One of the RF control module 132 or the test module 134 drives the source RF tester 212 (e.g., RF tester 212(1)) to generate a test RF signal. Due to the coupling between the source non-contact probe 226(2) and the contact 242, the source non-contact probe 226(2) induces a current in the IUT (e.g., wire 244). The receiving non-contact probe 226 (e.g., non-contact probe 226(6)) of the receiving RF probe carrier 224(2) receives the measurement RF signal corresponding to the current in the wire 244. The receiving RF probe carrier 224 transmits this measurement RF signal to the test module 134 via the receiving RF tester 212(2). Test module 134 analyzes and measures radio frequency signals to identify any faults associated with conductor 226 and to determine whether the device under test (DUT) 240 is faulty. In various embodiments, radio frequency control module 132 selects a plurality of conductors 244 for parallel testing. In this case, radio frequency control module 132 selects a plurality of contacts 242 for coupling, and radio frequency switch 222 selects a plurality of non-contact probes 226(1)-226(8) from a plurality of radio frequency probe carriers 224 to couple with the selected plurality of contacts 242. In some embodiments, radio frequency switch 222(1) is included in probe card 220. Alternatively, in some embodiments, radio frequency switch 222(1) is included in automated test equipment (ATE) 210.

[0033] In various embodiments, the RF control module 132 verifies whether the probe distance 230 ("D") between a given non-contact probe 226 and the target contact 242 is within a threshold range (e.g., 1 to 10 µm) to achieve capacitive coupling and reduce distance-based signal loss. In this case, the RF control module 132 may acquire and process image data (e.g., via a camera) and / or other types of sensor data (e.g., laser measurement data, acoustic data, mechanical data, magnetic data, etc.) to determine the position of the non-contact probe 226 and generate instructions to move the non-contact probe 226 within the threshold range. In some embodiments, the probe card 220 may include one or more distance sensors to assist the RF control module 132 in determining the probe distance 230 and / or the tilt of the non-contact probe 226 relative to the plane of the DUT 240.

[0034] In various embodiments, the RF probe carrier 224 can direct a test RF signal beam to the target contact 242. Furthermore, the RF control module 132 can control the RF probe carrier 224 to couple the parallel probe 226 to the parallel contact 242 using various beamforming methods. In this case, the RF control module 132 can parallelize the coupling of the RF probe carrier 224 to multiple contacts 242 and drive the RF tester 212 to generate multiple test RF signals (e.g., different test RF signals for each contact 242 coupled to the RF probe carrier 224). In this way, the non-contact test system 200 can test multiple wires 244 in parallel by receiving multiple measurement RF signals in parallel and identifying any faults.

[0035] In some embodiments, the device under test (DUT) 240 is connected to a test interface 250. For example, a connection cable 254(1) on the test mount of the test interface 250 can connect one of its contacts 242 to a large contact 252(1) (e.g., a test contact). In this case, when the contact probe 228(1) makes physical contact with the large contact 252(1), the probe card 220 can be electrically coupled to the contact 242 in the DUT 240. In this way, the test interface 250 can help test certain failure modes of the DUT 240 (e.g., short circuit to ground) and / or improve signal integrity.

[0036] In various embodiments, test module 134 receives one or more measured radio frequency signals from receive radio frequency probe carrier 224(2) and analyzes these measured radio frequency signals to identify potential fault conditions. These fault conditions include complete defects, such as open circuit states (e.g., connection loss due to non-conductivity) and / or short circuit states (e.g., additional connections due to accidental conduction to a second line). Fault conditions may also include partial defects, such as resistor open circuit states (e.g., partial loss) and / or resistor short circuit states (e.g., partial additional connections). These conditions may also be related to connections to specific lines, such as short circuits to ground or open circuits to power lines. In various embodiments, test module 134 identifies DUT 240 as faulty when it identifies at least one fault condition in any IUT included in DUT 240. Alternatively, test module 134 may identify potential fault conditions for a given IUT (e.g., wire 244) and flag the analysis results for further review. Alternatively, the test module 134 may infer the cause of the failure, such as identifying which wires 244 are faulty by spatial pattern recognition, determining the number of complete defects versus resistance defects by intensity indication, and / or any discrepancies in the symmetry of the results.

[0037] Figure 3 shows an example RF probe 226 near the wire 244 of the non-contact test system 200 shown in Figure 2 according to various embodiments. As shown, configuration 300 includes an RF probe portion 310 and a DUT 240. The RF probe portion 310 includes, but is not limited to, an outer isolation layer 312, an inner isolation layer 314, and an inner probe 316.

[0038] In various embodiments, the RF probe portion 310 includes a portion of the RF probe carrier 224 that includes the non-contact probe 226 and one or more isolation layers (e.g., isolation layers 312, 314). Isolation layers 312, 314 are configured to provide shielding and / or protection between the non-contact probe 226 and the DUT 240. For example, one or more of isolation layers 312, 314 may contain a non-conductive and / or RF shielding material (e.g., silicon nitride) to improve capacitive coupling between the non-contact probe 226 and the DUT 240. Isolation layers 312, 314 may also contain one or more shielding layers to minimize crosstalk between the probe 226 and / or the contact 242.

[0039] In various embodiments, the inner probe 316 is part of probe 226, which includes a retractable wire or cable (e.g., a coaxial cable) that extends a length 320 relative to the end of the inner insulating layer 314. In some embodiments, the RF probe carrier 224 extends probe 226 beyond the inner probe 316. This extension of the inner probe 316 increases the sensitivity of the non-contact probe 226 and enhances the signal strength of the test RF signal. In this case, the enhanced signal strength of the test RF signal increases the likelihood of inducing a current in the wire 244 and / or enhances the signal strength of the measured RF signal measured from the wire 244.

[0040] Furthermore, or in some embodiments, the RF probe portion 310 may be moved to contact the DUT 240 when a capacitive coupling is established with the contact 242 of the DUT 240. In this case, the RF probe portion 310 contacts the DUT 240 with a small force (e.g., a "touch"), thereby avoiding physical connection damage to the DUT 240. This physical contact contrasts with the physical contact required for a direct electrical connection, as a greater force is required to form a reliable circuit between the RF probe portion 310 and the DUT 240. In some embodiments, the RF probe 266 and / or the non-contact test system 200 include components for establishing a physical connection, such as a spring layer, one or more buckling mechanisms (e.g., a needle-like structure), a sensing unit and / or a physical connection to the sensing unit, and / or other components for detecting physical properties (e.g., force detection, capacitance detection, conductivity detection, etc.) to detect when the RF probe portion 310 makes physical contact with the DUT 240. In this configuration, the RF probe carrier 224 can move the RF probe 226 away from the DUT 240, thereby creating a probe distance 230 between the end of the RF probe portion 310 and the surface of the DUT 240. This reduces the probe distance 230, thereby enhancing the signal strength between the RF probe 226 and the conductor under test.

[0041] In various embodiments, the inner probe 316 is coupled to the conductor 244 in the DUT 240 to form a signal path. When the RF tester 212 generates a test RF signal, this test RF signal can have a high frequency (e.g., 5-20 GHz), causing the signal characteristics of the test RF signal to vary depending on the length of the signal path. To adjust the operating state of the signal path, the inner probe 316 can extend from the inner isolation layer 314, thereby adjusting the length of the signal path and / or adjusting the probe distance 230 between the distal end of the inner probe 316 and the target contact 242 at the end of the conductor 244. For example, the test RF signal can contain one or more resonant frequencies that depend at least on the length of the signal path. In this case, the RF control module 132 can determine the target length of the signal path and adjust the length 320 of the inner probe 316 to adjust the length of the signal path to approximately match the target length.

[0042] The radio frequency (RF) probe 226 (including probe portion 310) is one example of a probe that may be included in the non-contact test system 100. In various embodiments, the non-contact test system 100 may include other topologies that, in addition to the RF probe 226 including probe portion 310, may include other types of probes, or replace the RF probe 226 with other types of probes. For example, the non-contact test system 100 may include probes comprising various types of conductors, such as coaxial conductors, transverse electromagnetic (TEM) conductors, and / or quasi-TEM conductors. Furthermore, or in various embodiments, the ends of the conductors may be cut off, exposing the open surfaces of the conductors to the DUT 240. In this case, the probe does not contact the DUT 240, thereby achieving coupling with the DUT 240.

[0043] Figure 4 illustrates a test setup for a plurality of contacts 242 of the DUT 240 shown in Figure 2 according to various embodiments. As shown, the test setup 400 includes, but is not limited to, a first interface 410, a second interface 420, a plurality of wires 244, and a wire under test (WUT) 444. The first interface 410 includes, but is not limited to, a plurality of contacts 242. The plurality of contacts 242 includes, but is not limited to, a source contact 412. The second interface 420 includes, but is not limited to, a plurality of contacts 242. The plurality of contacts 242 includes, but is not limited to, a receive contact 422 and a plurality of adjacent contacts 432.

[0044] In various embodiments, interfaces 410 and 420 are components of the same interposer or bridge. The non-contact test system 200 can test each of the plurality of wires 244 by identifying the contact pairs 242 at both ends of the IUT (e.g., WUT 444) and performing electrical tests. For example, the WUT 444 has a source contact 412 at one end and a receiver contact 422 at the other end.

[0045] In operation, the non-contact test system 200 can couple to multiple contacts 242 when performing tests related to WUT 444. For example, multiple non-contact probes 226(5)–226(8) of the receiving RF probe carrier 224(2) can be coupled to the receiving contact 422 and adjacent contacts 432 (e.g., 432(1)–432(4)), respectively. Due to the coupling between the source contact 412 and the probes 226 on the source RF probe carrier 224(1), the source RF probe carrier 224(1) will induce a current in WUT 444. The receiving RF probe carrier 224(2) can measure one or more measurement RF signals corresponding to any current emitted by WUT 444 and / or one or more adjacent wires 244. In this case, a measured RF signal on WUT 444 below the threshold indicates a fault condition of open circuit or open resistance, while a measured RF signal on the adjacent conductor 244 above the threshold indicates a fault condition of short circuit or short resistance.

[0046] In various embodiments, the non-contact test system 200 can perform a test scan on multiple contacts 242 by sequentially selecting source contacts 412 and receiver contacts 422. For each receiver contact 422, a receiver RF probe carrier 224(2) is coupled to one or more adjacent contacts 432 and a fault condition is tested. In this way, the non-contact test system 200 can test a variety of fault conditions and accurately identify faults and their conditions in any of the multiple conductors 244. For example, the test module 134 can identify one or more complete short circuits and / or resistive short circuits based on analysis of the spectral energy contained in a given measured RF signal.

[0047] Figure 5 shows a graph 500 of complex measurement radio frequency signals received by the non-contact test system 200 shown in Figure 2 according to various embodiments. As shown, graph 500 includes complex fault-free signals 510 and complex fault signals 520.

[0048] During operation, test module 134 collects one or more measurement radio frequency (RF) signals received by the receiving RF probe carrier 224(2). For example, test module 134 evaluates the conductivity of a complex number of signal lines (parts of conductors 244) contained in DUT 240. The measurement RF signals correspond to the complex number of signal conductors 244 tested during the test. The test module compares these measurement RF signals to identify any failure mode behavior. In some embodiments, non-contact test system 200 improves evaluation accuracy by using frequency sweep repetitive measurements. For example, graph 500 may be a complex number of measurement RF signals corresponding to tests on multiple conductors 244, or it may be a complex number of measurement RF signals corresponding to multiple tests on the same conductor 244.

[0049] As shown in the figure, graph 500 clearly displays the signal strength difference between complex signal 510 and complex signal 520. In this case, test module 134 identifies complex signal 520 as a fault signal based on the difference in signal strength between it and the complex fault-free signal 510. In some embodiments, test module 134 can compare the signal strength of complex fault signal 520 with historical data to classify the fault condition as a complete short circuit or a resistive short circuit. Test module 134 can also perform other evaluations. For example, when the signal strength is higher than a expected threshold, test module 140 can classify the wire associated with the measured RF signal above the threshold as an open circuit or a resistive open circuit.

[0050] Figure 6 is a flowchart of the test method steps for a device under test according to various embodiments. Although these method steps are described in conjunction with the embodiments of Figures 1-5, those skilled in the art will understand that any system configured to perform these method steps in any order is within the scope of this invention.

[0051] As shown in the figure, method 600 begins at step 602, where the non-contact test system moves an RF probe to a target location. In various embodiments, an RF control module 132 included in the non-contact test system 200 generates one or more instructions to move one or more RF probe carriers 224 included in the non-contact test system 200 to one or more target locations and / or target orientations. The positioning of the one or more RF probe carriers 224 allows a plurality of non-contact probes 226 to approach contacts 242 on the DUT 240 for capacitive coupling. The one or more contacts 242 correspond to one or more WUTs 444 under test.

[0052] In step 604, the non-contact test system verifies whether one or more RF probe carriers 224 are located at a target position and / or target orientation. In various embodiments, the RF control module 132 acquires sensor data (e.g., image data, laser measurements, acoustic data, mechanical data, magnetic data, etc.) to determine the position of one or more non-contact probes 226 along the x, y, and z axes, and to determine the orientation of one or more non-contact probes 226 (e.g., tilt angle relative to the plane of the test device 140 and / or DUT 150). The RF control module 132 can then use the position and orientation to verify whether a given non-contact probe 226 is located at a probe distance 230 close to the target contact 242. When the RF control module 132 determines that one or more non-contact probes 226 are located at the target position and / or target orientation, the non-contact test system 200 executes step 606. Otherwise, when the RF control module 132 determines that one or more non-contact probes 226 are not located at the target position and / or target orientation, the RF control module 132 will return to step 602. At this time, the RF control module 132 can send one or more instructions to the RF switch 222 and / or the RF probe carrier 224 to adjust the position of the RF probe carrier 224, the non-contact probes 226, and / or the DUT 150. In this case, the RF control module 132 can iteratively execute steps 602-604 and generate instructions to adjust the RF probe carrier 224 and / or the non-contact probes 226 by processing the data captured by the probe card 220 until verification is completed.

[0053] In step 606, the non-contact test system drives the source probe to induce a test RF signal into the wire under test (WUT). In various embodiments, the RF control module 132 drives the RF tester 212 to generate a test RF signal. This test RF signal is transmitted along a signal path, sequentially passing through the probe card 220, the source RF probe carrier 224(1), and the source non-contact probe 226(1). Due to the coupling between the source non-contact probe 226(1) and the source contact 412, the source non-contact probe 226(1) induces a current in the WUT 444 connected to the source contact 412. In some embodiments, the RF control module 132 can generate multiple test RF signals by driving the RF tester 212 (e.g., each contact 242 connected to the RF probe carrier 224 corresponds to a different test RF signal), thereby performing parallel testing on multiple WUTs 444. In this configuration, the complex test RF signals include a first set of test RF signals for WUT 444, and one or more test RF signals for adjacent conductors 244. Adjacent conductors 244 can be measured to identify potential short circuits caused by interference.

[0054] In step 608, the non-contact test system detects one or more measurement radio frequency (RF) signals. In various embodiments, the receiving RF probe carrier 224(2) receives one or more measurement RF signals via coupling to one or more receiving contacts 242 through one or more non-contact receiving probes 226(5)-226(8). A given measurement RF signal corresponds to a current in a given WUT 444. For example, when performing parallel testing on a complex number of WUTs 444, the receiving probe carrier 224(2) includes a complex number of receiving probes 226(5)-226(8) coupled to a complex number of receiving contacts 242 (e.g., 422, 432(1)-432(4)). When the complex source non-contact probes 226(1)-226(3) induce complex currents in WUT 444 and adjacent wires 244, the receiving probe carrier 224(2) can measure complex measurement radio frequency signals corresponding to the corresponding currents transmitted in WUT 444 and / or any adjacent wires 244.

[0055] In step 610, the non-contact testing system transmits one or more measurement RF signals to the test module. In various embodiments, one or more measurement RF signals detected by the receiving RF probe carrier 224(2) are transmitted to the test module 134 via probe card 220 and / or RF tester 212. In some embodiments, the receiving RF probe carrier 224(2) receives multiple measurement RF signals in parallel. In this case, the receiving RF probe carrier 224(2) may transmit each measurement RF signal in parallel. Alternatively, in some embodiments, the RF probe carrier 224(2) aggregates multiple measurement RF signals and transmits the aggregated measurement RF signal group to the test module 134.

[0056] In step 612, the non-contact test system generates test results for the WUT based on one or more measured radio frequency signals. In various embodiments, test module 134 analyzes one or more received measured radio frequency signals to identify any faults associated with WUT 444 and determine whether DUT 240 is faulty. For example, when a fault condition associated with WUT 444 is identified, test module 134 identifies DUT 240 as faulty. Alternatively, in some embodiments, test module 134 may identify potential fault conditions for WUT 444 and mark the analysis results as requiring further review. Furthermore, test module 134 may infer the cause of the fault, such as identifying which wires 244 are faulty through spatial patterns, determining the number of complete defects versus resistive defects through intensity indications, and / or any discrepancies in the symmetry of the analysis results. After generating test results for WUT 444, the non-contact test system may return to step 602, moving non-contact probe 226 to test one or more different WUTs 444. In some embodiments, steps 602-612 are performed sequentially. In this case, test module 134 can receive and analyze measurement data while the non-contact probe 226 is moving. Alternatively, one or more steps in 602-612 can be performed sequentially. For example, the non-contact testing system can complete step 612 before returning to step 602 to move the non-contact probe 226.

[0057] In summary, the non-contact test system disclosed herein can test and evaluate interface paths of interposers and silicon bridges without contact with any leads, contacts, solder balls, or pins. This non-contact test system includes a plurality of RF probes configured to establish capacitive coupling with contact leads of a device under test (DUT), such as an interposer. During testing, a probe card connected to the RF probes responds to commands, moving the RF probes to the desired location and bringing them close to a target contact lead on the DUT. The probe card can move the RF probes along the x, y, and / or z axes, and / or tilt the RF probes to adjust their orientation relative to the DUT and / or any of its components. In other embodiments, the probe carrier or the probes themselves can also move relative to each other. A given RF probe includes a flexible connection to the test system for changing the distance between the distal end of the RF probe and the contact. Upon reaching the target location, the source RF probe couples to a first contact, and the receiving RF probe couples to a second contact, neither of which makes contact. The RF tester generates a test signal at a selected frequency. The source RF probe senses the wire connected to the first contact, causing it to emit the test signal. The receiving RF probe receives the measurement RF signal from the second contact. In some embodiments, the non-contact test system generates multiple RF test signals in parallel and receives multiple measurement RF signals. The probe transmits the measurement RF signals to the test module. The test module analyzes one or more measurement RF signals and identifies any performance test failures. The test module provides one or more measurement RF signals and performance test results for evaluating the device under test.

[0058] Compared to existing technologies, the disclosed technology offers at least one technological advantage: it enables rapid and accurate non-contact testing of interposers, silicon bridges, and other electronic devices without the need for bulky and expensive imaging systems. Specifically, this non-contact method moves a probe near the device under test (DUT) and performs one or more electrical tests that typically require a pair of contacts on the DUT to make contact with the test system. Thus, the non-contact test system can obtain accurate test results without damaging the DUT or introducing erroneous measurements due to contact errors. Compared to traditional non-contact test systems, the disclosed technology can also accurately identify faults, such as open circuits, short circuits, and potential faults in adjacent conductors, at a faster speed and lower cost. Furthermore, the disclosed technology can more accurately distinguish between functional conductors and faults. These technological advantages represent one or more technological advancements compared to existing technologies.

[0059] 1. In various embodiments, a test system includes: an automated test apparatus; and a probe card coupled to the automated test apparatus, the probe card including a first probe; wherein the automated test apparatus is configured to: move a first probe to the vicinity of a first contact of a device under test (DUT), wherein the first contact is connected to a conductor; move a second probe to the vicinity of a second contact of the DUT; drive the first probe with a first radio frequency signal to sense a second radio frequency signal in the conductor; measure the second radio frequency signal through the second probe; and generate a test result based on at least the second radio frequency signal.

[0060] 2. The test system as described in Clause 1, wherein the device under test includes an interposer or a silicon bridge.

[0061] 3. The test system as described in clause 1 or 2, wherein the second contact includes a receiving contact connected to the first contact via the wire.

[0062] 4. The test system as described in any one of 1-3, wherein the automated test equipment is further configured to measure an additional radio frequency signal associated with an adjacent contact near the second contact, wherein the adjacent contact is not connected to the first contact.

[0063] 5. The test system as described in any one of 1-4 further includes a plurality of probes coupled to the probe card, wherein none of the plurality of probes is in contact with the device under test; and the first probe of the plurality of probes includes a retractable cable that adjusts a probe distance between a distal end of the first probe and the first contact.

[0064] 6. The test system as described in any one of 1-5, wherein the automated test equipment is configured to adjust the probe distance to change a signal path from a first signal path length to a second signal path length; and when recorded at the second signal path length, the second radio frequency signal includes a resonant frequency.

[0065] 7. The test system as described in any one of clauses 1-6 further includes a test interface comprising one or more test contacts, wherein a first test contact of the one or more test contacts is configured to be electrically coupled to one of the first contact or the second contact, wherein the probe card includes at least one contact probe that is in physical contact with the first test contact.

[0066] 8. The test system as described in any one of 1-7, wherein the probe card includes a probe tilted relative to a plane of the device under test.

[0067] 9. The test system as described in any one of 1-8, wherein the automated test equipment is further configured to measure in parallel one or more additional radio frequency signals associated with one or more adjacent contacts adjacent to the second contact, wherein the test result is based on at least the second radio frequency signal and the one or more additional radio frequency signals, and the test result is one of an open circuit state, a short circuit state, a resistor open circuit state, a resistor short circuit state, or a resonant frequency.

[0068] 10. The test system as described in any one of clauses 1-9, wherein the test results include an intensity indication relating to a first number of complete defects and a second number of resistive defects.

[0069] 11. In various embodiments, a computer-implemented method for testing an interposer or silicon bridge, the method comprising: moving a first probe to the vicinity of a first contact of a device under test (DUT) via an automated test apparatus; moving a second probe to the vicinity of a second contact of the DUT via the automated test apparatus, wherein the first contact and the second contact are connected by a wire; driving the first probe with a first radio frequency signal via the automated test apparatus to sense a second radio frequency signal in the wire; measuring the second radio frequency signal via the second probe via the automated test apparatus; and generating a test result based on at least the second radio frequency signal via the automated test apparatus.

[0070] 12. The computer implementation method as described in Clause 11, wherein the test result is one of an open circuit state, a short circuit state, a resistor open circuit state, a resistor short circuit state, or a resonant frequency.

[0071] 13. The computer implementation method as described in Clause 11 or 12 further includes parallel measurement of one or more additional radio frequency signals associated with one or more adjacent contacts adjacent to the second contact.

[0072] 14. The computer-implemented method as described in any one of 11-13 further comprises: generating the test result based on at least the second radio frequency signal and the one or more additional radio frequency signals using the automated test equipment, wherein the test result is one of an open circuit state, a short circuit state, a resistor open circuit state, a resistor short circuit state, or a resonant frequency.

[0073] 15. A computer-based method of implementation as described in any one of 11-14, wherein the test results include identifying spatial patterns of one or more failed wires.

[0074] 16. A computer implementation method as described in any one of 11-15, wherein the second contact includes a receiving contact connected to the first contact via a first wire.

[0075] 17. A computer-implemented method as described in any one of 11-16, wherein a plurality of probes are coupled to a probe card, the probe card being coupled to the automated test equipment; none of the plurality of probes are in contact with the device under test; and the first probe of the plurality of probes includes a retractable cable that adjusts a probe distance between a distal end of the first probe and a first contact point.

[0076] 18. The computer implementation method as described in any one of 11-17 further includes: adjusting the probe distance to change a signal path from a first signal path length to a second signal path length; and when recording at the second signal path length, the second radio frequency signal includes a resonant frequency.

[0077] 19. A computer implementation method as described in any one of 11-16, wherein at least one of the first probe or the second probe is configured to be tilted relative to a plane of the device under test.

[0078] 20. In various embodiments, one or more non-transitory computer-readable media storing program instructions, when executed by one or more processors, to cause the one or more processors to perform the following methods: moving a first probe to the vicinity of a first contact of a device under test (DUT) via an automated test apparatus; moving a second probe to the vicinity of a second contact of the DUT via the automated test apparatus, wherein the first contact and the second contact are connected by a wire; driving the first probe with a first radio frequency signal via the automated test apparatus to sense a second radio frequency signal in the wire; measuring the second radio frequency signal via the second probe via the automated test apparatus; and generating a test result based on at least the second radio frequency signal via the automated test apparatus.

[0079] Any claim element and / or any combination of any elements described in the claims of this application, in whatever manner, is within the scope of this invention and its intended protection.

[0080] For ease of explanation, the description of various embodiments herein is not intended to be exhaustive, nor is it limited to the disclosed embodiments. Many modifications and variations can be made to the invention by those skilled in the art without departing from the scope and spirit of the described embodiments.

[0081] Various aspects of this embodiment can be embodied as a system, method, or computer program product. Therefore, various aspects of this disclosure can take the form of a completely hardware embodiment, a completely software embodiment (including firmware, resident software, microcode, etc.), or a combination of hardware and software embodiments, all of which are generally referred to herein as a "module," a "system," or a "computer." Furthermore, any hardware and / or software technology, process, function, component, engine, module, or system described in this disclosure can be implemented as a circuit or set of circuits. Moreover, various aspects of this disclosure can take the form of a computer program product embodied in one or more computer-readable media having computer-readable program code embodied thereon.

[0082] Any combination of one or more computer-readable media may be used. Computer-readable media can be computer-readable signal media or computer-readable storage media. Computer-readable storage media can be electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices, or apparatuses, such as, but not limited to, any one or more of the foregoing. More specific examples of computer-readable storage media (a non-exhaustive list) include: electrical connections having one or more wires, portable computer floppy disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or USB flash drive), optical fiber, USB flash drive read-only memory (CD-ROM), any of the above-mentioned memory or any of these devices. In this document, computer-readable storage media can be any tangible medium capable of containing or storing a program for use by or associated with an instruction execution system, device, or apparatus.

[0083] Various aspects of this disclosure have been described above with reference to flowchart illustrations and / or block diagrams illustrating methods, apparatus (systems), and computer program products according to embodiments of this disclosure. It should be understood that each module and combination of modules in the flowchart illustrations and / or block diagrams can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing apparatus to produce a machine. When these instructions are executed by the processor of the computer or other programmable data processing apparatus, the functions / operations specified in the flowchart illustration and / or block diagram modules are implemented. Such processors may be, but are not limited to, general-purpose processors, special-purpose processors, dedicated processors, or field-programmable gate arrays.

[0084] The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this disclosure. In this regard, each block in a flowchart or block diagram may represent a module, program code segment, or portion of program code, containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions shown in the blocks may differ from the order shown in the figures. For example, two blocks shown consecutively in a figure may actually execute substantially simultaneously, or, depending on the functions involved, these blocks may sometimes execute in reverse order. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of each block in the block diagrams and / or flowcharts, can be implemented via a dedicated hardware system that performs the specified function or operation, or a combination of dedicated hardware and computer instructions.

[0085] While the foregoing description pertains to embodiments of this disclosure, other and further embodiments of this disclosure may be devised without departing from the basic scope of this disclosure, the scope of which is defined by the following claims.

Claims

1. A testing system, characterized in that, include: Automated testing equipment; as well as A probe card coupled to the automated testing equipment, the probe card including a first probe; The automated testing equipment is configured as follows: Move a first probe to the vicinity of a first contact of a device under test (DUT), wherein the first contact is connected to a wire; Move a second probe to the vicinity of a second contact of the device under test; The first probe is driven by a first radio frequency signal to induce a second radio frequency signal in the wire; The second radio frequency signal is measured using the second probe; and A test result is generated based on at least the second radio frequency signal.

2. The testing system as described in claim 1, characterized in that, The device under test includes an interposer or a silicon bridge.

3. The testing system as described in claim 1, characterized in that, The second contact includes a receiving contact, which is connected to the first contact via the wire.

4. The testing system as described in claim 1, characterized in that, The automated test equipment is further configured to measure an additional radio frequency signal associated with an adjacent contact near the second contact, wherein the adjacent contact is not connected to the first contact.

5. The testing system as described in claim 1, characterized in that, It further includes a plurality of probes coupled to the probe card, wherein: None of the multiple probes make contact with the device under test; and The first probe in the complex probes includes a retractable cable that adjusts a probe distance between a distal end of the first probe and the first contact point.

6. The testing system as described in claim 5, characterized in that, The automated testing equipment is configured to adjust the probe distance to change a signal path from a first signal path length to a second signal path length; and When recorded over the second signal path length, the second radio frequency signal includes a resonant frequency.

7. The testing system as described in claim 1, characterized in that, Including: A test interface includes one or more test contacts, wherein a first test contact of the one or more test contacts is configured to be electrically coupled to one of the first contact or the second contact. The probe card includes at least one contact probe that is in physical contact with the first test contact.

8. The testing system as described in claim 1, characterized in that, The probe card includes a probe that is tilted relative to a plane of the device under test.

9. The testing system as described in claim 1, characterized in that, The automated test equipment is further configured to perform parallel measurements of one or more additional radio frequency signals related to one or more adjacent contacts near the second contact, wherein: The test results are based on at least the second radio frequency signal and the one or more additional radio frequency signals, and The test result is one of the following: an open circuit state, a short circuit state, a resistor open circuit state, a resistor short circuit state, or a resonant frequency.

10. The testing system as described in claim 1, characterized in that, The test results include an intensity indication related to a first number of complete defects and a second number of resistive defects.

11. A computer-implemented method for testing interposers or silicon bridges, characterized in that, The method includes: The automated test equipment moves a first probe to the vicinity of a first contact of a device under test (DUT); The automated testing equipment moves a second probe to the vicinity of a second contact of the device under test, wherein the first contact and the second contact are connected by a wire; The first probe is driven by a first radio frequency signal using the automated testing equipment to induce a second radio frequency signal in the wire. The automated testing equipment is used to measure the second radio frequency signal using the second probe; and A test result is generated based on at least the second radio frequency signal using the automated testing equipment.

12. The computer implementation method as described in claim 11, characterized in that, The test result is one of the following: an open circuit state, a short circuit state, a resistor open circuit state, a resistor short circuit state, or a resonant frequency.

13. The computer implementation method as described in claim 11, characterized in that, It also includes parallel measurements of one or more additional radio frequency signals associated with one or more adjacent contacts near the second contact.

14. The computer implementation method as described in claim 13, characterized in that, Including: The test results are generated using the automated testing equipment based on at least the second radio frequency signal and the one or more additional radio frequency signals. The test result is one of the following: an open circuit state, a short circuit state, a resistor open circuit state, a resistor short circuit state, or a resonant frequency.

15. The computer implementation method as described in claim 11, characterized in that, The test results include identifying spatial patterns of one or more failed conductors.

16. The computer implementation method as described in claim 11, characterized in that, The second contact includes a receiving contact, which is connected to the first contact via a first wire.

17. The computer implementation method as described in claim 11, characterized in that, A plurality of probes are coupled to a probe card, and the probe card is coupled to the automated testing equipment; None of the multiple probes make contact with the device under test; and The first probe in the complex probes includes a retractable cable that adjusts a probe distance between a distal end of the first probe and the first contact point.

18. The computer implementation method as described in claim 17, characterized in that, Including: Adjusting the probe distance changes a signal path from a first signal path length to a second signal path length; and When recorded over the second signal path length, the second radio frequency signal contains a resonant frequency.

19. The computer implementation method as described in claim 11, characterized in that, At least one of the first probe or the second probe is configured to be tilted relative to a plane of the device under test.

20. One or more non-transitory computer-readable media, characterized in that, Its stored program instructions, when executed by one or more processors, cause the one or more processors to perform the following methods: The automated test equipment moves a first probe to the vicinity of a first contact of a device under test (DUT); The automated testing equipment moves a second probe to the vicinity of a second contact of the device under test, wherein the first contact and the second contact are connected by a wire; The first probe is driven by a first radio frequency signal using the automated testing equipment to induce a second radio frequency signal in the wire. The automated testing equipment is used to measure the second radio frequency signal using the second probe. as well as A test result is generated based on at least the second radio frequency signal using the automated testing equipment.

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