A method for detecting and rectifying cracks in the horizontal lines of ceramic substrate processing

Abstract

This invention discloses a method for detecting and rectifying horizontal cracks in ceramic substrate processing, comprising the following steps: Step 100: Obtaining standard inspection ceramic pieces from the original ceramic substrate using an equidistant cutting method; Step 200: Sending the standard inspection ceramic pieces to a pre-processing step and performing standard inspections before and after the pre-processing step, comparing the inspection results, and proceeding to step 300 after passing the inspection; Step 300: Sending the standard inspection ceramic pieces to an etching and film removal step and performing standard inspections before and after the pre-processing step, comparing the inspection results, and proceeding to step 400 after passing the inspection; Step 400: Sending the standard inspection ceramic pieces to a post-processing step and performing standard inspections before and after the post-processing step, comparing the inspection results, and proceeding to step 600 after passing the inspection; Step 500: Performing targeted rectification of the process and then returning to step 300; Step 600: Performing routine quality monitoring. This invention can improve the detection rate of latent defects such as microcracks and quickly identify and resolve problems existing in the production line.

Description

Technical Field

[0001] This invention relates to the field of precision machining technology for ceramic substrates, specifically to a method for detecting and rectifying cracks in the horizontal lines of ceramic substrate machining. Background Technology

[0002] Ceramic substrates are special process boards made by directly bonding copper foil to the surface of alumina or aluminum nitride ceramic substrates at high temperatures. Due to their high thermal conductivity and high insulation, they are widely used in semiconductors and power electronic devices. However, because ceramic substrates are inherently brittle and have weak resistance to mechanical stress, defects such as cracking, fracture along the cutting line, and microcracks are easily caused during subsequent horizontal line processing due to uneven equipment stress, abnormal component precision, and transmission gap deviations, reducing product yield. Current technologies for crack detection in the horizontal line processing of ceramic substrates rely too heavily on visual observation, easily overlooking hidden defects such as microcracks. Furthermore, the detection results are disconnected from processing rectification, failing to form a logical closed loop of detection and rectification, thus making it difficult to quickly identify and resolve problems on the production line, reducing the efficiency of quality control. Therefore, developing a crack detection and rectification method for horizontal lines in ceramic substrate processing to overcome the above problems is a direction that requires further research by those skilled in the art. Summary of the Invention

[0003] The purpose of this invention is to provide a method for detecting and rectifying cracks in the horizontal lines of ceramic substrate processing, which can improve the detection rate of latent defects such as microcracks, and quickly identify and solve existing problems in the production line.

[0004] This invention provides a method for detecting and rectifying cracks in the horizontal lines of ceramic substrate processing.

[0005] It includes the following steps:

[0006] Step 100: Obtain a standard test ceramic sheet of 40mm*25mm from the original ceramic substrate using the equidistant cutting method, such that the thickness of the standard test ceramic sheet is configured to be 0.32mm and the cutting depth is configured to be 0.13mm.

[0007] Step 200: Perform a first standard test on the standard test ceramic piece, then send the standard test ceramic piece to the pre-processing process, and perform a second standard test on the standard test ceramic piece output from the pre-processing process; compare the first test and the second standard test based on the first test and the first result determination; if the first result determination is passed, proceed to step 300;

[0008] Step 300: Perform a third standard test on the standard test ceramic piece, then send the standard test ceramic piece into the etching and film removal process, and perform a fourth standard test on the standard test ceramic piece output from the etching and film removal process; perform a second test comparison and a second result determination based on the third and fourth standard tests; if the second result determination is passed, proceed to step 400, otherwise proceed to step 500;

[0009] Step 400: Perform a fifth standard test on the standard test ceramic piece, then send the standard test ceramic piece to the post-processing process, and perform a sixth standard test on the standard test ceramic piece output from the post-processing process; perform a third test comparison and a third result determination based on the fifth and sixth standard tests; if the third result determination is passed, proceed to step 600;

[0010] Step 500: Perform targeted rectification of the process and proceed to step 300 to perform retesting;

[0011] Step 600: Perform routine quality monitoring sampling inspections;

[0012] The standard testing methods include a primary test based on naked-eye observation and a secondary test based on observation with a 5x magnifying glass.

[0013] The explicit defects include: obvious crushing, fracture along the cutting line, ceramic fragment breakage, and large-sized cracks; the implicit defects include microcracks, hairline cracks, and micro-fractures at the cutting line.

[0014] Preferably, the detection method of the standard test includes:

[0015] On a cleanroom platform with white light illumination, the inspectors maintain an observation distance of 30cm±5cm from the standard test ceramic piece and conduct a comprehensive observation from the front, back, and four sides of the ceramic piece to identify obvious defects.

[0016] A 5x magnifying glass was used to scan all the cutting lines, edges and surfaces of the standard test ceramic piece segment by segment, with the scanning speed kept at ≤5mm / s, to identify hidden defects;

[0017] Record the location and type of the explicit defect and the location and type of the implicit defect respectively.

[0018] The types of defects further include: pressure fracturing; cutting line breakage; microcracks; and ceramic fragment breakage.

[0019] Preferably, the standard test content includes:

[0020] The standard test for ceramic tiles is to check for any of the following: broken tiles, chipped corners or edges, discontinuous or uneven cutting lines, peeling or flaking cutting lines, or visible cracks / microcracks on the surface / edge of the tile.

[0021] Preferably, in the above-mentioned testing and rectification methods, step 100 includes:

[0022] Step 110: Use a special precision cutting device for ceramics to cut the original ceramic substrate. Cut several equidistant cutting lines evenly along the long axis and short axis of the original ceramic substrate to divide the original ceramic substrate into several rectangular ceramic pieces of 40mm*25mm.

[0023] Step 120: Use a 5x magnifying glass to perform an initial inspection on the rectangular ceramic pieces, and remove those with initial cracks, chipped edges, missing corners, or thickness / cutting depth that do not meet the preset standards. Keep the qualified rectangular ceramic pieces as the standard inspection pieces, and seal them for later use.

[0024] Preferably, in the above-mentioned testing and rectification method, step 200 includes:

[0025] Step 210: Perform the first standard test on the standard test ceramic piece;

[0026] Step 220: Feed several standard test ceramic tiles at intervals into the feed end of the pretreatment horizontal line and transfer them throughout the process according to the normal production process parameters of ceramic substrates.

[0027] Step 230: Perform a second standard test on the standard ceramic tile output from the discharge end of the pretreatment horizontal line; compare the result of the first standard test with the result of the second standard test; if no new defects are found in the result of the second standard test, the first result is deemed to be passed; otherwise, it is determined that the defect was caused by the pretreatment process, and the specific location of the defect is accurately recorded as the basis for subsequent rectification.

[0028] Preferably, in the above-mentioned testing and rectification method, step 300 includes:

[0029] Step 310: Perform a third standard test on the standard test ceramic piece;

[0030] Step 320: Feed several standard test ceramic pieces at intervals into the feed end of the etching and film removal horizontal line, and transfer them throughout the entire process according to the process parameters of the etching and film removal process.

[0031] Step 330: Perform a fourth standard test on the standard ceramic tile output from the discharge end of the corrosion film removal horizontal line; compare the result of the third standard test with the result of the fourth standard test; if no new defects are found in the result of the fourth standard test, the second result is deemed to be passed; otherwise, it is determined that the defect is caused by the corrosion film removal water process, the specific location of the defect is accurately recorded as the basis for subsequent rectification, and then proceed to step 500.

[0032] Preferably, in the above-mentioned testing and rectification method, step 400 includes:

[0033] Step 410: Perform the fifth standard test on the standard test ceramic piece;

[0034] Step 420: Feed several standard test ceramic pieces at intervals into the feed end of the post-processing horizontal line and transfer them throughout the process according to the process parameters of the post-processing procedure.

[0035] Step 430: Perform a fourth standard test on the standard ceramic tile output from the post-processing horizontal line's outlet; compare the result of the third standard test with the result of the fourth standard test; if no new defects are found in the fourth standard test, the second result is deemed acceptable; otherwise, the defect is determined to have occurred due to the post-processing step. Accurately record the specific location of the defect as a basis for subsequent rectification.

[0036] Preferably, in the above-mentioned testing and rectification method, step 500 includes:

[0037] Based on the location and type of the explicit defect and the location and type of the implicit defect, investigate at least one of the following:

[0038] Inspect the installation flatness, rotation flexibility, and surface wear of the transmission rollers for the corrosion film removal horizontal line;

[0039] Inspect the installation gap, surface flatness, and fixing firmness of the base strips used for corrosion film removal horizontal lines;

[0040] Investigate the positional deviation of the limiting components at the corrosion film removal level.

[0041] After rectification is completed, proceed to step 300 for retesting based on the corrosion film removal process, and repeat the above process until the retest is passed.

[0042] Furthermore, based on the investigation results, the following equipment adjustments were performed:

[0043] Replace deformed or loose base strips, adjust the contact gap between the base strip and the ceramic tile to eliminate local stress concentration; replace deformed, stuck, or excessively worn rollers, adjust the roller level to ensure uniform contact between the roller and the ceramic tile.

[0044] Preferably, in the above-mentioned testing and rectification method, step 600 includes:

[0045] Step 610: Before each shift of production, select 3 standard test ceramic pieces and conduct standardized testing on the entire process of pretreatment, etching and film removal, and posttreatment.

[0046] Step 620: Record the test data in the ceramic substrate horizontal crack detection log for traceability;

[0047] Step 630: If a non-compliance occurs during the execution of step 610, stop the machine immediately and jump to step 100 until the third result judgment is passed.

[0048] Compared with the prior art, the beneficial effects of the present invention are:

[0049] First, the implementation of this invention is simple and easy for ordinary production line technicians to quickly master and implement with simple training.

[0050] Secondly, this invention can achieve accurate identification and quantitative judgment of crack defects through standardized testing methods, and form a logical closed loop of process-specific testing and targeted rectification, which greatly improves the efficiency of crack problem solving.

[0051] Finally, in practice, this invention can be widely applied to various ceramic substrate processing production lines, exhibiting high adaptability to different scenarios and stable practicality. Detailed Implementation

[0052] The present invention will be further described below with reference to Embodiment 1.

[0053] Example 1:

[0054] A method for detecting and rectifying cracks in the horizontal lines of a ceramic substrate, comprising the following steps:

[0055] Step 110: Select a 138mm×190mm ceramic substrate sheet and cut it using a precision ceramic cutting device. Cut four equidistant lines along the long axis and eight equidistant lines along the short axis to divide the ceramic substrate sheet into several 40mm*25mm rectangular ceramic pieces. Adjust the precision of the cutting device to ensure that the thickness of the standard test ceramic piece is set to 0.32mm (tolerance ±0.01mm) and the cutting depth is set to 0.13mm (tolerance ±0.01mm).

[0056] Step 120: Use a 5x magnifying glass to perform an initial inspection on the rectangular ceramic pieces, and remove any rectangular ceramic pieces that have initial cracks, chipped edges, missing corners, or whose thickness / cutting depth does not match the thickness / cutting depth data range described in Step 110. Retain the qualified rectangular ceramic pieces as the standard inspection pieces, and seal and store them for later use.

[0057] Step 210: Randomly select 3 standard test ceramic pieces, numbered S1, S2, and S3; perform the first standard test on the 3 standard test ceramic pieces, record the test results, and confirm that there are no initial defects;

[0058] Step 220: Feed the three standard test ceramic pieces at intervals into the feed end of the pretreatment horizontal line, and carry out the entire process transmission according to the normal production process parameters of ceramic substrate (such as transmission speed, chemical concentration, processing temperature, roller pressure) to ensure that the transmission status of the standard test ceramic pieces S1, S2, and S3 is consistent with that of the mass production substrate.

[0059] Step 230: Perform a second standard test on the standard ceramic tile output from the discharge end of the pretreatment horizontal line; compare the result of the first standard test with the result of the second standard test; if no new defects are found in the result of the second standard test, the first result is deemed to be passed; otherwise, it is determined that the defect was caused by the pretreatment process, and the specific location of the defect is accurately recorded as the basis for subsequent rectification.

[0060] In this example: the appearance, position and type of the ceramic tile tested by the standard all meet the qualified standards, the test of the pretreatment process is determined to be passed, the equipment and process status of the pretreatment process are normal, the existing parameters are kept unchanged, and the test data is recorded in the process test log.

[0061] Step 310: Randomly select 3 standard test ceramic pieces, numbered F1, F2, and F3, and perform a third standard test on the 3 standard test ceramic pieces. Record the test results and confirm that there are no initial defects.

[0062] Step 320: Feed the three standard test ceramic pieces at intervals into the feed end of the etching and film removal horizontal line, and transfer them throughout the entire process according to the process parameters of the etching and film removal process.

[0063] Step 330: Perform a fourth standard test on the standard test ceramic pieces output from the discharge end of the etching and film removal horizontal line; compare the results of the third standard test with the results of the fourth standard test; if no new defects are found in the results of the fourth standard test, the second result is deemed acceptable; otherwise, it is determined that the defect was caused by the etching and film removal process, the specific location of the defect is accurately recorded as the basis for subsequent rectification, and the process jumps to step 500; In this example: it was found that all three standard test ceramic pieces showed left-side crushing, and ceramic pieces F1 and F2 had fracture defects along the cutting line. The defect locations were concentrated on the left side of the ceramic pieces, and the defect type was mechanical crushing + fracture along the cutting line, all of which were generated during the transmission process of the etching and film removal process; therefore, in this example, the process jumps directly to step 500.

[0064] In this example, since multiple defects were detected in step 330, the process jumps directly to step 500.

[0065] Step 500 includes: based on the location and type of the explicit defects described in step 330 and the latent defects, the following investigation and rectification are carried out:

[0066] Step 510: Check the left-side transmission rollers: Check the rollers' installation flatness, rotation flexibility, and surface wear. Replace any deformed, jammed, or excessively worn rollers. Adjust the rollers' levelness to ensure uniform contact between the rollers and the ceramic tiles.

[0067] Step 520: Check the left base strip: Check the installation gap, surface flatness, and fixing firmness of the base strip; replace deformed or loose base strips; adjust the contact gap between the base strip and the standard test ceramic piece; and eliminate local stress concentration.

[0068] Step 530: Check the left limiting component: Check the positional deviation of the limiting component, adjust the limiting distance to ensure that the ceramic tile is centered during transmission and avoid excessive force on the left side;

[0069] Step 540: Equipment debugging after rectification: Run the equipment for 5 minutes without load and check the operation status of the rollers, base bar, and limit components to ensure that there are no problems such as jamming, offset, or uneven force.

[0070] Repeat steps 310-330 for a second test:

[0071] Sample selection: Three standard test ceramic pieces were randomly selected and numbered F4, F5 and F6. After the standard test confirmed that there were no initial defects, they were used as retest samples.

[0072] The standard test ceramic pieces of F4, F5, and F6 are sent to the rectified etching and film removal level line according to the normal process parameters, and the entire process is carried out according to the process parameters of the etching and film removal process; after F4, F5, and F6 are discharged, they are tested again according to the standard test results and compared with the benchmark test results.

[0073] Retest result determination: If none of the three retest samples F4, F5, and F6 have any cracks or defects, the crack test is deemed OK after the corrosion film removal process is rectified, and the defect rectification is completed; if defects still exist, the above retest process is repeated until the retest is qualified. All retest data are recorded in the inspection log and the process is skipped to step 410.

[0074] Step 410: Randomly select 3 standard test ceramic pieces, numbered H1, H2, and H3, and perform the fifth standard test on the standard test ceramic pieces;

[0075] Step 420: The three standard test ceramic pieces numbered H1, H2, and H3 are fed at intervals into the feed end of the post-processing horizontal line and transferred throughout the process according to the process parameters of the post-processing procedure.

[0076] Step 430: Perform a sixth standard test on the standard ceramic tile output from the discharge end of the post-processing horizontal line; compare the result of the fifth standard test with the result of the sixth standard test; if no new defects are found in the result of the sixth standard test, the third result is deemed to be passed; otherwise, it is determined that the defect was caused by the post-processing process, and the specific location of the defect is accurately recorded as the basis for subsequent rectification.

[0077] In this example: all three standard ceramic tiles tested showed no visible or hidden cracks, indicating that the post-processing test was passed. The equipment and process status of this process were normal. The existing parameters were kept unchanged, the test data was recorded in the process test log, and the process was moved to step 600.

[0078] Step 600: Perform routine quality monitoring sampling inspections. Step 600 specifically includes the following:

[0079] Step 610: Before each shift of production, select 3 standard test ceramic pieces and conduct standardized testing on the entire process of pretreatment, etching and film removal, and posttreatment.

[0080] Step 620: Record the test data in the ceramic substrate horizontal crack detection log for traceability;

[0081] Step 630: If a non-compliance occurs during the execution of step 610, stop the machine immediately and jump to step 100 until the third result judgment is passed.

[0082] In this example, the standard test specifically includes the following test contents:

[0083] As a primary observation method, naked-eye inspection is conducted on a clean, white-light-illuminated platform. The inspector maintains an observation distance of 30cm ± 5cm from the standard test ceramic piece and observes it from all angles, including the front, back, and four sides, to identify obvious defects such as obvious crushing, breakage along the cutting line, ceramic piece breakage, and large-sized cracks.

[0084] As a secondary observation, a 5x magnifying glass inspection is used: for ceramic pieces that show no obvious defects when viewed with the naked eye, a 5x magnifying glass is used to scan all cutting lines, edges and surfaces of the ceramic piece segment by segment, with a scanning speed of ≤5mm / s, to identify latent defects such as microcracks, hairline cracks and micro-chipping at the cutting lines.

[0085] In this example, the standard test specifically includes the following test indicators:

[0086] The standard test ceramic tile is required to be intact without breaks, chips, or chipped edges; the cut lines of the standard test ceramic tile are continuous and flat, without warping or peeling; and the surface / edges of the standard test ceramic tile are free of visible cracks or micro-cracks. If the above test indicators are met, it is considered qualified; otherwise, it is unqualified.

[0087] In this example, the detected defects are specifically classified as follows:

[0088] Mechanical cracking: Irregular breakage of ceramic shards, accompanied by localized dents, is caused by excessive mechanical pressure;

[0089] Fracture along the cutting line: The crack extends along the cutting line, penetrating part or the whole of the ceramic piece, caused by stress concentration at the cutting line;

[0090] Microcracks: Hairline-like fine cracks, ≤0.05mm in width, are latent stress damage;

[0091] Porcelain shard breakage: The porcelain shard completely separates along a certain direction, which is caused by severe abnormal stress.

[0092] The above are merely preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A method for detecting and rectifying cracks in the horizontal lines of a ceramic substrate, characterized in that, Includes the following steps: Step 100: Obtain a standard test ceramic sheet of 40mm*25mm from the original ceramic substrate using the equidistant cutting method, such that the thickness of the standard test ceramic sheet is configured to be 0.32mm and the cutting depth is configured to be 0.13mm. Step 200: Perform a first standard test on the standard test ceramic piece, then send the standard test ceramic piece to the pre-processing process, and perform a second standard test on the standard test ceramic piece output from the pre-processing process; perform a first test comparison and a first result determination based on the first standard test and the second standard test; If the first result is deemed satisfactory, proceed to step 300; Step 300: Perform a third standard test on the standard test ceramic piece, then send the standard test ceramic piece into the etching and film removal process, and perform a fourth standard test on the standard test ceramic piece output from the etching and film removal process; perform a second test comparison and a second result determination based on the third and fourth standard tests; If the second result is passed, proceed to step 400; otherwise, proceed to step 500. Step 400: Perform a fifth standard test on the standard test ceramic piece, then send the standard test ceramic piece to the post-processing process, and perform a sixth standard test on the standard test ceramic piece output from the post-processing process; perform a third test comparison and a third result determination based on the fifth and sixth standard tests; If the third result is satisfactory, proceed to step 600; Step 500: Perform targeted rectification of the process and proceed to step 300 to perform retesting; Step 600: Perform routine quality monitoring sampling inspections; The standard testing methods include a primary test based on naked-eye observation and a secondary test based on observation with a 5x magnifying glass.

2. The detection and rectification method according to claim 1, characterized in that: The standard testing methods include: On a cleanroom platform with white light illumination, the inspectors maintain an observation distance of 30cm±5cm from the standard test ceramic piece and conduct a comprehensive observation from the front, back, and four sides of the ceramic piece to identify obvious defects. A 5x magnifying glass was used to scan all the cutting lines, edges and surfaces of the standard test ceramic piece segment by segment, with the scanning speed kept at ≤5mm / s, to identify hidden defects; Record the location and type of the explicit defect and the location and type of the implicit defect respectively.

3. The detection and rectification method according to claim 2, characterized in that: The standard test includes the following: The standard test for ceramic tiles is to check for any of the following: broken tiles, chipped corners or edges, discontinuous or uneven cutting lines, peeling or flaking cutting lines, or visible cracks / microcracks on the surface / edge of the tile.

4. The detection and rectification method according to claim 3, characterized in that, Step 100 includes: Step 110: Use a special precision cutting device for ceramics to cut the original ceramic substrate. Cut several equidistant cutting lines evenly along the long axis and short axis of the original ceramic substrate to divide the original ceramic substrate into several rectangular ceramic pieces of 40mm*25mm. Step 120: Use a 5x magnifying glass to perform an initial inspection on the rectangular ceramic pieces, and remove those with initial cracks, chipped edges, missing corners, or thickness / cutting depth that do not meet the preset standards. Keep the qualified rectangular ceramic pieces as the standard inspection pieces, and seal them for later use.

5. The detection and rectification method according to claim 1, characterized in that, Step 200 includes: Step 210: Perform the first standard test on the standard test ceramic piece; Step 220: Feed several standard test ceramic tiles at intervals into the feed end of the pretreatment horizontal line and transfer them throughout the process according to the normal production process parameters of ceramic substrates. Step 230: Perform a second standard test on the standard ceramic tile output from the discharge end of the pretreatment horizontal line; compare the result of the first standard test with the result of the second standard test; if no new defects are found in the result of the second standard test, the first result is deemed to be passed; otherwise, it is determined that the defect was caused by the pretreatment process.

6. The detection and rectification method according to claim 5, characterized in that, Step 300 includes: Step 310: Perform a third standard test on the standard test ceramic piece; Step 320: Feed several standard test ceramic pieces at intervals into the feed end of the etching and film removal horizontal line, and transfer them throughout the entire process according to the process parameters of the etching and film removal process. Step 330: Perform a fourth standard test on the standard ceramic tile output from the discharge end of the corrosion film removal horizontal line; compare the result of the third standard test with the result of the fourth standard test; if no new defects are found in the result of the fourth standard test, the second result is deemed to be passed; otherwise, it is determined that the corrosion film removal water process caused the defect, and jump to step 500.

7. The detection and rectification method according to claim 6, characterized in that, Step 400 includes: Step 410: Perform the fifth standard test on the standard test ceramic piece; Step 420: Feed several standard test ceramic pieces at intervals into the feed end of the post-processing horizontal line and transfer them throughout the process according to the process parameters of the post-processing procedure. Step 430: Perform a sixth standard test on the standard ceramic tile output from the discharge end of the post-processing horizontal line; compare the result of the fifth standard test with the result of the sixth standard test; if no new defects are found in the result of the sixth standard test, the third result is deemed to be passed; otherwise, it is determined that the defect was caused by the post-processing process.

8. The detection and rectification method according to claim 7, characterized in that, Step 500 includes: Based on the location and type of the explicit defect and the location and type of the implicit defect, investigate at least one of the following: Inspect the installation flatness, rotation flexibility, and surface wear of the transmission rollers for the corrosion film removal horizontal line; Inspect the installation gap, surface flatness, and fixing firmness of the base strips used for corrosion film removal horizontal lines; Investigate the positional deviation of the limiting components at the corrosion film removal level.

9. The detection and rectification method according to claim 8, characterized in that, Step 600 includes: Step 610: Before each shift of production, select 3 standard test ceramic pieces and conduct standardized testing on the entire process of pretreatment, etching and film removal, and posttreatment. Step 620: Record the test data in the ceramic substrate horizontal crack detection log for traceability; Step 630: If a non-compliance occurs during the execution of step 610, stop the machine immediately and jump to step 100 until the third result judgment is passed.