A semiconductor package testing apparatus
By designing a semiconductor packaging testing device with automatic clamping and vibration testing, the problems of manual operation and low testing efficiency of existing equipment are solved, and efficient and accurate pin quality testing is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HEFEI KONTUO EQUIP TECH CO LTD
- Filing Date
- 2026-06-17
- Publication Date
- 2026-07-31
AI Technical Summary
Existing semiconductor packaging and testing equipment requires manual operation by workers, which increases labor intensity and affects testing efficiency. It is also difficult to effectively detect hidden quality defects in pins, such as microcracks and insufficient plating adhesion.
A semiconductor packaging testing device was designed, which automatically clamps the pins of semiconductor devices and performs vibration testing using components such as servo push cylinders and vibration motors, reducing manual operation and ensuring the efficiency and accuracy of pin quality testing.
It achieves automated testing without manual operation, improves the efficiency of pin quality inspection, and avoids the risk of failure due to mechanical vibration caused by latent defects that are difficult to detect under static conditions.
Smart Images
Figure CN122497345A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor testing, specifically to a semiconductor packaging testing device. Background Technology
[0002] Semiconductors are a class of materials whose conductivity at room temperature falls between that of conductors and insulators. Their conductivity can be precisely controlled, making them a core foundation of the modern electronics industry. In practical applications of semiconductor devices, pins are the core structural components that determine the reliability of the device. They are not only the electrical pathways that enable power conduction and signal transmission between the internal chip and the external circuitry, but also the core load-bearing structures for the assembly and fixation of the semiconductor device. After the device is mounted on the circuit board, its overall weight is almost entirely supported by the pins. The pins simultaneously bear multiple functions, including mechanical support, positioning and fixation, and stress buffering. Their structural strength and quality stability directly determine the reliability of the device throughout its entire life cycle.
[0003] If there are hidden quality defects such as internal microcracks, insufficient plating adhesion, stress concentration, and molding size deviation during the packaging manufacturing process, these defects are often difficult to detect under static conditions. However, when the whole equipment enters a long-term operating state, the continuous mechanical vibration will create repeated alternating stress impacts on the pins. The hidden defects will continue to expand and accumulate under the continuous action of vibration load, which will eventually easily lead to fatigue fracture or brittle failure of the pins, resulting in poor contact of semiconductor devices, functional shutdown, or even a chain of failures in the entire electronic device.
[0004] Because pin quality is a core aspect of semiconductor device reliability control, dedicated vibration testing equipment is commonly used throughout the semiconductor packaging and manufacturing process to conduct vibration reliability tests on finished devices. This simulates the vibration conditions of devices in actual service scenarios, allowing for the early screening of defective products with potential pin quality issues. However, existing equipment requires workers to manually remove semiconductor devices from the tray and place them on the testing station for testing. This operation, over extended periods, significantly increases the labor intensity for workers and indirectly affects the efficiency of pin quality testing. Summary of the Invention
[0005] The purpose of this invention is to address the shortcomings of the prior art by providing a semiconductor packaging testing device.
[0006] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor packaging testing device, comprising a testing platform, a support frame fixedly installed on one side of the upper end of the testing platform, a pusher provided on the other side of the upper end of the testing platform, a movable seat slidably installed on the side of the support frame, a cross bar elastically installed through both ends of the movable seat, two concave clamps symmetrically slidably installed on the vertical section of the cross bar, concave pushers fixedly installed at the upper and lower ends of the movable seat, a push clamp block rotatably installed inside the concave pusher block, the end of the push clamp block rotatably connected to the concave clamp, a vibration motor provided on the upper concave clamp, a positioning hook provided on the side of the cross bar, the side of the positioning hook fixed to the support frame, two control boards vertically distributed in the middle of the testing platform, the upper control board fixed to the testing platform, a second servo pusher cylinder fixedly installed through the middle of the testing platform, the output end of the second servo pusher cylinder fixed to the lower control board, and a positioning component provided on the upper control board.
[0007] Preferably, a push spring is wound around the outer side of the horizontal section of the cross rod, and the two ends of the push spring are fixed to the movable seat and the boss of the cross rod, respectively. A positioning cap is fixedly installed at the end of the horizontal section of the cross rod.
[0008] Preferably, a bridge is fixedly installed at the lower end of the vibration motor, and the end of the bridge is fixed to the concave clamp above. A servo cylinder is fixedly installed through the middle of the side of the support frame. The output end of the servo cylinder is fixed to the moving seat. Guide rods are provided at both the front and rear of the servo cylinder. The support frame is slidably installed on the outer surface of the guide rods, and the end of the guide rods is fixed to the moving seat.
[0009] Preferably, a core plate is slidably mounted through the opposite surfaces of the two control plates, and a return spring is fixedly mounted on the opposite surfaces of the two core plate plates. The end of the return spring is fixed to the inner wall of the control plate, and guide wheels are mounted at the middle of the front and rear ends of the core plate plates.
[0010] Preferably, the propulsion component includes a servo slide fixedly installed on the other side of the upper end of the test bench, and a positioning frame is fixedly installed on the upper end of the servo slide.
[0011] Preferably, the positioning component includes two guide frames fixedly installed on both sides of the control panel above. Threaded sleeves are slidably installed on the outer surfaces of both guide frames. Positioning seats are elastically installed on the opposite surfaces of the two threaded sleeves. The positioning seats are slidably installed on the outer surfaces of the guide frames. Guide ears are fixedly installed at the upper edges of the front and rear ends of one of the positioning seats. Seat bends are slidably installed at the ends of both guide ears. The two seat bends are staggered. Positioning tooth seats are fixedly installed at the opposite ends of both seat bends. Push seats are rotatably installed at the upper edges of the front and rear ends of one of the threaded sleeves. One push seat is higher than the other push seat. The ends of the two push seats are rotatably connected to the two seat bends, respectively.
[0012] Preferably, a threaded rod is provided below the guide frame, and the threaded rod is rotatably mounted on the control plate above. The threads at both ends of the threaded rod are arranged in opposite directions. Two threaded sleeves are respectively screwed onto the two ends of the threaded rod. The threaded rod passes through the upper end of the positioning seat. A second push spring is fixedly installed between the threaded sleeve and the opposite surface of the positioning seat. The threaded rod passes through the inside of the second push spring.
[0013] Preferably, a motor frame is fixedly mounted on the side of the control board above, and a servo motor is fixedly mounted on the end of the motor frame. The output end of the servo motor is fixed to the threaded rod.
[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. This invention, as a dedicated device for semiconductor devices, tests the quality of semiconductor pins by using a second servo pusher to move the lower control plate upwards, passing through the bottom of the tray and ejecting the semiconductor device from the tray's groove. Then, a sliding moving seat moves two concave clamps laterally, positioning the semiconductor device's pin between the upper and lower concave clamps. At this point, the crossbar rests on the positioning hook, preventing further lateral movement of the concave clamps. The moving seat continues to slide, causing the pusher block on the concave pusher to move, pushing the two concave clamps towards each other to clamp the pin at the horizontal end, thus fixing the semiconductor device. A vibration motor then generates vibration, which is transmitted through the concave clamps to the semiconductor device's pin for testing. This process eliminates the need for workers to manually remove the semiconductor device from the tray and place it on the testing station, effectively reducing worker workload and improving the efficiency of pin quality testing. At the same time, this test also avoids the risk of failure in mechanical vibration environments caused by hidden quality defects such as internal micro-cracks in the pins, insufficient plating adhesion, stress concentration, and molding size deviation, which are difficult to detect under static conditions.
[0015] 2. The rotating threaded rod drives two threaded sleeves to move towards each other, which in turn pushes two positioning seats towards each other via the second push spring. This pushes and clamps the semiconductor device from both sides, limiting its left and right positions. After being limited, the positioning seats rest against the control plate above, preventing them from moving further towards each other. The threaded sleeves then continue to move towards each other, driving the pusher frame to move. This pushes the two positioning teeth on the two seat bends towards each other. At this time, multiple protrusions on the positioning teeth pass between multiple pins of the semiconductor device and contact the semiconductor device body to push and clamp it, limiting the front and rear positions of the semiconductor device. This adjusts the position of the semiconductor device so that the pin ends can be aligned with the concave clamping plate. This ensures that when the concave clamping plate moves towards each other, it can smoothly clamp the pin ends at the horizontal section for testing, thus ensuring the smooth conduct of the semiconductor device pin vibration resistance test and the accuracy of the pin quality test results. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the support frame of the present invention; Figure 3 This is a connection view of the concave clamp and the concave pusher of the present invention; Figure 4 For the present invention Figure 1 Enlarged view of A in the middle; Figure 5 This is an internal view of the control panel of the present invention; Figure 6 This is an exploded view of the positioning frame of the present invention; Figure 7 This is a schematic diagram of the positioning tooth seat of the present invention; Figure 8 This is a schematic diagram of the positioning tooth seat from another perspective of the present invention; Figure 9 This is a schematic diagram of the semiconductor device of the present invention.
[0017] The components represented by each number in the attached diagram are listed below: 1. Test bench; 2. Support frame; 3. Control board; 4. Servo slide; 5. Positioning frame; 6. Guide rod; 7. Servo push cylinder No. 1; 8. Moving seat; 9. Push spring No. 1; 10. Cross rod; 11. Positioning hook; 12. Concave clamp plate; 13. Concave push frame; 14. Vibration motor; 15. Push clamp block; 16. Plate core; 17. Guide wheel; 18. Return spring; 19. Servo push cylinder No. 2; 20. Positioning gear seat; 21. Seat bending frame; 22. Servo motor; 23. Threaded rod; 24. Guide frame; 25. Threaded sleeve; 26. Push spring No. 2; 27. Positioning seat; 28. Motor frame; 29. Push seat frame; 30. Guide ear; 31. Positioning cap; 32. Bridge; 33. Material tray; 34. Semiconductor device. Detailed Implementation
[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0019] This invention provides a technical solution: such as Figures 1-9The semiconductor packaging testing apparatus shown includes a test stage 1. A support frame 2 is fixedly installed on one side of the upper end of the test stage 1, serving as a support. A pusher is provided on the other side of the upper end of the test stage 1. A movable seat 8 is slidably installed on the side of the support frame 2. A cross bar 10 is elastically installed through both ends of the movable seat 8. Two concave clamps 12 are symmetrically slidably installed on the vertical section of the cross bar 10, serving as a guide for the concave clamps 12. Concave pushers 13 are fixedly installed at both the upper and lower ends of the movable seat 8. A pusher block 15 is rotatably installed inside the concave pusher block 13, and the end of the pusher block 15 is connected to the concave clamp 12. The rotating connection allows the concave pusher 13 to drive the pusher block 15 to move, thereby pushing the two concave clamps 12 to move towards each other and clamp the semiconductor device 34 from the horizontal section of the pin end. A vibration motor 14 is installed on the upper concave clamp 12 to generate vibration. A positioning hook 11 is provided on the side of the cross bar 10 to position the lateral movement of the concave clamp 12. The side of the positioning hook 11 is fixed to the support frame 2. Two control plates 3 are vertically distributed in the middle of the test platform 1. The upper control plate 3 is fixed to the test platform 1. The middle of the test platform 1 is fixedly installed. There is a second servo pusher cylinder 19, the output end of which is fixed to the lower control board 3. The second servo pusher cylinder 19 drives the lower control board 3 to move slowly. The upper control board 3 is equipped with a positioning component. As a special equipment for semiconductor devices, this invention can drive the lower control board 3 to move upward during testing by the second servo pusher cylinder 19, so as to pass through the bottom of the material tray 33 and push the semiconductor device 34 out of the material slot of the material tray 33. Then, the sliding moving seat 8 drives the two concave clamping plates 12 to move laterally, so that the pins of the semiconductor device 34 are located between the two concave clamping plates 12. At this time, the cross bar The 10 is positioned on the positioning hook 11, preventing the concave clamp 12 from moving laterally. Then, the moving seat 8 continues to slide, thereby driving the push clamp block 15 on the concave push frame 13 to move, pushing the two concave clamps 12 to move towards each other, clamping them from the horizontal section at the pin end, thus fixing the semiconductor device 34. Then, the vibration motor 14 generates vibration, which is transmitted through the concave clamps 12 to the pin of the semiconductor device 34 for testing. This process eliminates the need for workers to manually remove the semiconductor device 34 from the tray 33 and place it on the testing station for testing, effectively reducing the labor intensity of workers and improving the testing efficiency of pin quality.
[0020] A push spring 9 is wound around the outer side of the horizontal section of the cross rod 10. The two ends of the push spring 9 are fixed to the movable seat 8 and the boss of the cross rod 10, respectively. When the movable seat 8 moves to the side, it can push the cross rod 10 to move to the side synchronously through the push spring 9. A positioning cap 31 is fixedly installed at the end of the horizontal section of the cross rod 10. The positioning cap 31 serves to prevent the cross rod 10 and the movable seat 8 from separating.
[0021] A bridge frame 32 is fixedly installed at the lower end of the vibration motor 14. The end of the bridge frame 32 is fixed to the concave clamp 12 above. The bridge frame 32 serves to support the vibration motor 14. A servo cylinder 7 is fixedly installed through the middle of the side of the support frame 2. The output end of the servo cylinder 7 is fixed to the moving seat 8. The servo cylinder 7 drives the moving seat 8 to move. Guide rods 6 are provided at the front and rear of the servo cylinder 7. The support frame 2 is slidably installed on the outer surface of the guide rods 6. The guide rods 6 serve to guide the moving seat 8. The end of the guide rods 6 is fixed to the moving seat 8.
[0022] Both control boards 3 have core plates 16 slidably mounted on their opposite sides. When the semiconductor device 34 is ejected, it will fit between the core plates 16 on the two control boards 3, preventing the semiconductor device 34 from falling off during subsequent clamping and positioning. Both core plates 16 have reset springs 18 fixedly mounted on their opposite sides. The reset springs 18 reset the core plates 16. The ends of the reset springs 18 are fixed to the inner wall of the control boards 3. Guide wheels 17 are installed in the middle of the front and rear ends of the core plates 16. During the clamping process of the semiconductor device 34's pins, the inclined end of the concave pusher 13 will contact the guide wheel 17 and push it, allowing the core plate 16 to move slightly and retract into the control board 3, leaving a gap between the core plate 16 and the semiconductor device 34 to avoid affecting the test results due to the semiconductor device 34 being subjected to additional support.
[0023] The propulsion component includes a servo slide 4 fixedly installed on the other side of the upper end of the test bench 1. A positioning frame 5 is fixedly installed on the upper end of the servo slide 4. The positioning frame 5 plays the role of supporting and positioning the material tray 33. When one of the semiconductor devices 34 on the material tray 33 is tested and reset, the servo slide 4 will drive the material tray 33 to move laterally, so that the next semiconductor device 34 on the material tray 33 is located at the test station for testing.
[0024] The positioning component includes two guide brackets 24 fixedly mounted on both sides of the upper control plate 3. Threaded sleeves 25 are slidably mounted on the outer surfaces of both guide brackets 24. Positioning seats 27 are elastically mounted on the opposite surfaces of the two threaded sleeves 25. The guide brackets 24 guide the threaded sleeves 25 and positioning seats 27. The positioning seats 27 are slidably mounted on the outer surfaces of the guide brackets 24. Guide ears 30 are fixedly mounted on the upper edges of the front and rear ends of one of the positioning seats 27. Bent brackets 21 are slidably mounted on the ends of both guide ears 30, guiding the bent brackets 21. The two bent brackets 21 are staggered. Positioning tooth seats 20 are fixedly mounted on the opposite ends of the two bent brackets 21, supporting the positioning tooth seats 20. Push brackets 29 are rotatably mounted on the upper edges of the front and rear ends of one of the threaded sleeves 25, with one push bracket 29 higher than the other. The ends of the two push brackets 29 are rotatably connected to the two bent brackets 21 respectively. The two threaded sleeves 25 are... The semiconductor device 34 is moved towards the control plate 3 above, and the two positioning seats 27 are pushed towards each other by the second push spring 26 to clamp the semiconductor device 34 from both sides, thus limiting the left and right position of the semiconductor device 34. After being limited, the positioning seats 27 just abut against the control plate 3 above, preventing them from moving towards each other. Then the threaded sleeve 25 continues to move towards each other. At this time, the moving threaded sleeve 25 will drive the push seat frame 29 to move, thereby pushing the two positioning tooth seats 20 on the two seat bending frames 21 to move towards each other. At this time, the multiple protrusions on the positioning tooth seats 20 will pass through the multiple pins of the semiconductor device 34 and contact the body of the semiconductor device 34 to clamp it, thus limiting the front and rear position of the semiconductor device 34. This adjusts the position of the semiconductor device 34 so that the pin ends of the semiconductor device 34 can be aligned with the concave clamp plate 12, so that when the concave clamp plate 12 moves towards each other, it can be successfully clamped from the horizontal section of the pin end for testing, thus ensuring the smooth testing of the semiconductor device 34.
[0025] A threaded rod 23 is provided below the guide frame 24. The threaded rod 23 is rotatably mounted on the control plate 3 above. The threads at both ends of the threaded rod 23 are arranged in opposite directions, which can drive two threaded sleeves 25 to move towards each other. The two threaded sleeves 25 are respectively screwed to the two ends of the threaded rod 23. The threaded rod 23 passes through the upper end of the positioning seat 27. A second push spring 26 is fixedly installed between the opposite surfaces of the threaded sleeves 25 and the positioning seat 27. The threaded rod 23 passes through the inside of the second push spring 26. The threaded sleeves 25 can push the positioning seat 27 to move through the second push spring 26.
[0026] A motor bracket 28 is fixedly installed on the side of the upper control panel 3. A servo motor 22 is fixedly installed at the end of the motor bracket 28. The motor bracket 28 serves to fix the servo motor 22. The output end of the servo motor 22 is fixed to the threaded rod 23. The servo motor 22 drives the threaded rod 23 to rotate.
[0027] This invention, as a dedicated device for semiconductor devices, tests the quality of pins by using a second servo pusher cylinder 19 to move the lower control board 3 upwards, passing through the bottom of the material tray 33 and ejecting the semiconductor device 34 from the material slot of the tray 33. The ejected semiconductor device 34 then adheres to the core 16 on the two control boards 3. Subsequently, the servo motor 22 drives the threaded rod 23 to rotate, causing the two threaded sleeves 25 to move towards each other. This, in turn, pushes the two positioning seats 27 towards each other via the second push spring 26, thus aligning the semiconductor device from both sides. Device 34 is pushed and clamped, limiting its left and right positions. After being limited, positioning seat 27 rests against the control plate 3 above, preventing it from moving further towards each other. Then, threaded sleeve 25 continues to move towards each other. At this time, the moving threaded sleeve 25 will drive the push seat frame 29 to move, thereby pushing the two positioning tooth seats 20 on the two seat bending frames 21 to move towards each other. At this time, multiple protrusions on the positioning tooth seats 20 will pass through the multiple pins of semiconductor device 34 and contact the body of semiconductor device 34 to push and clamp, thus limiting the front and rear positions of semiconductor device 34. This adjusts the position of the semiconductor device 34 so that the pins of the semiconductor device 34 are aligned with the concave clamp 12. Then, the servo motor 22 reverses, resetting the positioning tooth seat 20 and the positioning seat 27. Subsequently, the first servo push cylinder 7 drives the moving seat 8 to slide laterally, thereby causing the two concave clamps 12 to slide laterally, so that the pins of the semiconductor device 34 are positioned between the upper and lower concave clamps 12. At this time, the cross rod 10 is just against the positioning hook 11, preventing the concave clamps 12 from moving laterally any further. Then, the moving seat 8 continues to slide, thereby driving the push clamp block 1 on the concave push frame 13. 5. Movement is used to push the two concave clamps 12 to move towards each other, clamping them from the horizontal section at the pin end, thereby fixing the semiconductor device 34. During the clamping process, the inclined end of the concave pusher 13 will contact the guide wheel 17 and push it, allowing the core board 16 to move slightly and retract into the control board 3, leaving a gap between the core board 16 and the semiconductor device 34 to avoid affecting the test results due to the additional support of the semiconductor device 34. Then, the vibration motor 14 generates vibration, which is transmitted through the concave clamps 12 to the pins of the semiconductor device 34 for testing.
[0028] It should be noted that this test also avoids the risk of failure in mechanical vibration environments caused by hidden quality defects such as internal micro-cracks in the pins, insufficient plating adhesion, stress concentration, and molding size deviation, which are difficult to detect under static conditions.
[0029] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0030] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A semiconductor package testing apparatus comprising a test bench (1), characterized in that: A support frame (2) is fixedly installed on one side of the upper end of the test bench (1), and a pusher is provided on the other side of the upper end of the test bench (1). A movable seat (8) is slidably installed on the side of the support frame (2). A cross rod (10) is elastically installed through both ends of the movable seat (8). Two concave clamps (12) are symmetrically slidably installed on the vertical section of the cross rod (10). A concave pusher (13) is fixedly installed on both the upper and lower ends of the movable seat (8). A pusher block (15) is rotatably installed inside the concave pusher (13). The end of the pusher block (15) rotates with the concave clamp (12). The connection is provided with a vibration motor (14) on the upper concave clamp plate (12), and a positioning hook (11) is provided on the side of the cross rod (10). The side of the positioning hook (11) is fixed to the support frame (2). Two control plates (3) are vertically distributed in the middle of the test platform (1). The upper control plate (3) is fixed to the test platform (1). A second servo push cylinder (19) is fixedly installed through the middle of the test platform (1). The output end of the second servo push cylinder (19) is fixed to the lower control plate (3). A positioning component is provided on the upper control plate (3).
2. The semiconductor packaging testing apparatus according to claim 1, characterized in that: A push spring (9) is wound around the outer side of the horizontal section of the cross rod (10). The two ends of the push spring (9) are fixed to the moving seat (8) and the boss of the cross rod (10), respectively. A positioning cap (31) is fixedly installed at the end of the horizontal section of the cross rod (10).
3. The semiconductor packaging testing apparatus according to claim 1, characterized in that: A bridge frame (32) is fixedly installed at the lower end of the vibration motor (14). The end of the bridge frame (32) is fixed to the concave clamp plate (12) above. A servo cylinder (7) is fixedly installed through the middle of the side of the support frame (2). The output end of the servo cylinder (7) is fixed to the moving seat (8). Guide rods (6) are provided at the front and rear of the servo cylinder (7). The support frame (2) is slidably installed on the outer surface of the guide rods (6). The end of the guide rods (6) is fixed to the moving seat (8).
4. The semiconductor packaging testing apparatus according to claim 1, characterized in that: Both control plates (3) have a core plate (16) slidably mounted on their opposite sides. Both core plates (16) have a return spring (18) fixedly mounted on their opposite sides. The end of the return spring (18) is fixed to the inner wall of the control plate (3). Guide wheels (17) are installed in the middle of the front and rear ends of the core plate (16).
5. A semiconductor packaging testing apparatus according to claim 1, characterized in that: The propulsion component includes a servo slide (4) fixedly installed on the other side of the upper end of the test bench (1), and a positioning frame (5) is fixedly installed on the upper end of the servo slide (4).
6. The semiconductor packaging testing apparatus according to claim 1, characterized in that: The positioning component includes two guides (24) fixedly installed on both sides of the control plate (3) above. Threaded sleeves (25) are slidably installed on the outer surfaces of the two guides (24). Positioning seats (27) are elastically installed on the opposite surfaces of the two threaded sleeves (25). The positioning seats (27) are slidably installed on the outer surfaces of the guides (24). Guide ears (30) are fixedly installed at the front and rear upper edges of one of the positioning seats (27). Seat bends (21) are slidably installed at the ends of the two guide ears (30). The two seat bends (21) are staggered. Positioning tooth seats (20) are fixedly installed at the opposite ends of the two seat bends (21). Push seats (29) are rotatably installed at the front and rear upper edges of one of the threaded sleeves (25). One push seat (29) is higher than the other push seat (29). The ends of the two push seats (29) are rotatably connected to the two seat bends (21) respectively.
7. A semiconductor packaging testing apparatus according to claim 6, characterized in that: A threaded rod (23) is provided below the guide frame (24). The threaded rod (23) is rotatably mounted on the control plate (3) above. The threads at both ends of the threaded rod (23) are arranged in opposite directions. Two threaded sleeves (25) are respectively screwed onto the two ends of the threaded rod (23). The threaded rod (23) passes through the upper end of the positioning seat (27). A second push spring (26) is fixedly installed between the threaded sleeve (25) and the opposite surface of the positioning seat (27). The threaded rod (23) passes through the inside of the second push spring (26).
8. A semiconductor packaging testing apparatus according to claim 6, characterized in that: A motor frame (28) is fixedly installed on the side of the control board (3) above, and a servo motor (22) is fixedly installed at the end of the motor frame (28). The output end of the servo motor (22) is fixed to the threaded rod (23).