A semiconductor package inspection apparatus and method

Abstract

This invention proposes a semiconductor packaging inspection device and method, relating to the field of semiconductor testing technology. The device includes a conveying unit with a protective cover, and a detection channel is provided through the protective cover. This invention utilizes the coordinated action of a positioning block and a combing block to correct slightly misaligned pins during chip transport, eliminating the need for separate pin identification and adjustment stations. This completely solves the inconvenience of traditional methods that require "identification and adjustment of slight misalignment," significantly shortening the processing cycle of a single chip and greatly improving the efficiency of batch testing. During correction, the positioning block clamps the pin bend to form a stable fulcrum, while the combing block applies directional force along the pin gap, ensuring pin alignment while avoiding damage to the connection between the pin and the chip, effectively reducing the damage rate during pin correction.

Description

Technical Field

[0001] This invention relates to the field of semiconductor testing technology, and in particular to a semiconductor packaging inspection device and inspection method. Background Technology

[0002] In the semiconductor device manufacturing process, the packaging process is a key step to ensure stable chip performance and achieve electrical connection and physical protection. The pin accuracy after packaging directly affects the assembly compatibility of the device with external structures such as circuit boards and the quality of electrical signal transmission. Therefore, pin misalignment inspection has become one of the core steps in semiconductor packaging quality control. At present, semiconductor packaging inspection equipment has been widely used in pin misalignment detection scenarios. Through image acquisition, visual recognition and other technologies, it can quantitatively detect parameters such as pin misalignment angle and position deviation.

[0003] As semiconductor devices evolve towards miniaturization and high-density packaging, the size and number of pins are constantly decreasing, placing higher demands on the precision and efficiency of pin skew adjustment. In actual production, when a small pin skew angle is detected (such as the skew angle being within the allowable deviation critical range or slightly exceeding the allowable range), only a slight adjustment to the pin is needed to meet quality requirements. However, in existing technologies, for such slightly skewed pins, it is usually necessary to first identify and record the skew parameters through inspection equipment, and then use the identification result as the basis for adjustment. Repositioning and correction are then performed through manual operation or an additional adjustment control module. The entire process involves a complete workflow of "identification, interruption detection, adjustment, and re-inspection," which is cumbersome and not only prolongs the processing time of a single device but also reduces production efficiency. Summary of the Invention

[0004] Based on the technical problems existing in the background art, the present invention proposes a semiconductor packaging inspection device and inspection method.

[0005] The present invention proposes a semiconductor packaging inspection device, including a conveying device, a protective cover installed on the conveying device, a detection channel through which the protective cover is opened, the detection channel being located directly above the conveyor belt of the conveying device, a partition block being installed on the top inner wall of the detection channel of the protective cover, and a U-shaped working channel being formed between the conveyor belt, the protective cover, and the partition block of the conveying device. Two conveying and sorting mechanisms are installed in the U-shaped working channel. The two conveying and sorting mechanisms are located on both sides of the U-shaped working channel. The conveying and sorting mechanisms drive the semiconductor chip to move in the U-shaped working channel. The conveying and sorting mechanisms can also correct the skewed pins of the semiconductor chip. A detection mechanism is installed on the separator block, which is used to detect semiconductor chips entering the U-shaped working channel.

[0006] Preferably, the conveying and combing mechanism includes a circulating motion block and a positioning block; the number of the circulating motion blocks is multiple, and an annular channel is provided inside the protective cover, with multiple circulating motion blocks slidably installed inside the annular channel; The number of positioning blocks is the same as the number of cyclic motion blocks and they are set in a one-to-one correspondence. The positioning blocks are installed on one side of the cyclic motion blocks. The positioning blocks can be inserted into the gap between two adjacent pins of the semiconductor chip. The width of the positioning blocks is the same as the size of the gap between two adjacent pins of the semiconductor chip. The width between two adjacent positioning blocks is the same as the width of the pin bend of the semiconductor chip.

[0007] Preferably, the conveying and combing mechanism further includes a combing block and an adjusting combing assembly; the circulating motion block has a vertical combing groove, the combing block is slidably installed in the combing groove, the width of the combing block is smaller than the gap between two adjacent pins of the semiconductor chip, and the combing block can be inserted into the gap between two adjacent pins of the semiconductor chip; The adjusting combing component can drive the combing block to move up and down within the combing groove.

[0008] Preferably, the adjusting combing assembly includes a lifting slider, a semi-threaded rod, an upward drive component, and a downward drive component; the circulating motion block has a lifting groove communicating with the combing groove, the lifting slider is slidably installed in the lifting groove, the semi-threaded rod is rotatably installed in the lifting groove, and the semi-threaded rod is threaded through the lifting slider, and the movement of the combing block is fixedly connected to the lifting slider; The lifting drive is used to drive the semi-threaded rod to rotate and cause the lifting slider to move upward within the lifting groove. The descent drive is used to drive the semi-threaded rod to rotate and cause the lifting slider to descend within the lifting groove.

[0009] Preferably, the lifting drive includes a gear and a first rack; the end of the semi-threaded rod passes through the circulating motion block and extends to the outside of the circulating motion block to connect with the gear; the first rack is fixedly installed inside the protective cover; and the gear can mesh with the first rack.

[0010] Preferably, the descent drive component includes a second rack; the second rack is fixedly installed inside the protective cover, and the gear can mesh with the second rack.

[0011] Preferably, the detection mechanism includes multiple movable detection ends and ejector components; both sides of the partition block are provided with rotating storage slots capable of accommodating the movable detection ends, and the movable detection ends are rotatably installed in the rotating storage slots via a rotating shaft; The ejector component allows the active detection end to tend to move out of the rotating storage slot.

[0012] Preferably, the ejector includes a torsion spring; the torsion spring is mounted on the rotating shaft of the movable detection end.

[0013] A semiconductor package inspection method, comprising the following steps: Step 1: Place the semiconductor chip with its pins facing upwards on the conveyor belt of the conveyor device; Step 2: The two conveying and combing mechanisms work in conjunction with the conveyor belt of the conveying device to stably transport semiconductor chips within the U-shaped working channel. During the transport process, the combing block moves upward to straighten any skewed pins. Step 3: The straightened stitches are then tested by a testing agency.

[0014] Preferably, in step 2, the conveying speed of the conveying combing mechanism is the same as the conveying speed of the conveyor belt of the conveying device.

[0015] The semiconductor packaging inspection equipment and method proposed in this invention have the following beneficial effects: By setting up a conveying device, protective cover, separator, conveying and sorting mechanism and detection mechanism, chip conveying and pin sorting and correction are integrated synchronously. By utilizing the coordinated action of positioning block and sorting block, the correction of slightly skewed pins can be completed during chip conveying. There is no need to set up a separate pin identification and adjustment station, which completely solves the inconvenience of "slight deviation needs to be identified and then adjusted" in traditional methods. It significantly shortens the processing cycle of a single chip and significantly improves the work efficiency of batch inspection. During the correction process, the positioning block clamps the pin bend to form a stable fulcrum, and the sorting block applies force in a directional manner along the pin gap. This not only ensures the pin alignment effect, but also avoids damage to the connection between the pin and the chip by the sorting force, effectively reducing the damage rate during the pin correction process. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of a semiconductor packaging inspection device proposed in this invention; Figure 2 This is a top cross-sectional view of the position of the cyclic moving block inside the protective cover in a semiconductor packaging inspection device proposed in this invention; Figure 3 This is a top cross-sectional view of the position of the gear inside the protective cover in a semiconductor packaging inspection device proposed in this invention; Figure 4 This is a schematic diagram of the structure of a circulating motion block in a semiconductor packaging inspection device proposed in this invention; Figure 5 This is a cross-sectional view of a semiconductor chip in a U-shaped working channel in a semiconductor packaging inspection device proposed in this invention; Figure 6This is a schematic diagram showing the positional coordination of the semiconductor chip and positioning block in a semiconductor packaging inspection device proposed in this invention; Figure 7 This invention provides a semiconductor packaging inspection device. Figure 3 Enlarged view of point A in the middle; Figure 8 This invention provides a semiconductor packaging inspection device. Figure 3 Enlarged view at point B in the middle; Figure 9 This is a schematic diagram of the structure of a semiconductor chip in a semiconductor packaging inspection device proposed in this invention.

[0017] In the diagram: 1. Conveying device; 2. Protective cover; 3. Separator block; 4. Circulating motion block; 5. Positioning block; 6. Combing block; 7. Lifting slider; 8. Semi-threaded rod; 9. Gear; 10. Rack No. 1; 11. Rack No. 2; 12. Movable detection end; 13. Torsion spring. Detailed Implementation

[0018] Reference Figures 1-9This invention proposes a semiconductor packaging inspection device, including a conveying device 1, a protective cover 2 mounted on the conveying device 1, and a detection channel extending through the protective cover 2. The detection channel is located directly above the conveyor belt of the conveying device 1. A separator block 3 is installed on the inner top wall of the detection channel of the protective cover 2, and there is a gap between the bottom surface of the separator block 3 and the conveyor belt of the conveying device 1 to facilitate the passage of the main body of the semiconductor chip. A U-shaped working channel is formed between the conveyor belt of the conveying device 1, the protective cover 2, and the separator block 3. The pins on both sides of the semiconductor chip move through the vertical channels on both sides of the U-shaped working channel. A high-definition camera is also installed in the U-shaped working channel to perform multi-dimensional image acquisition of the pin area (including front view, side view, and oblique view). During the acquisition process, all pins are traversed according to a preset path, and the acquired image data is transmitted to the image processing unit in real time. Two conveying and sorting mechanisms are installed in the U-shaped working channel, and the two conveying and sorting mechanisms are located at the top of the U-shaped working channel. On both sides of the channel, the conveying and sorting mechanism drives the semiconductor chip to move within the U-shaped working channel. The conveying and sorting mechanism can also correct the skewed pins of the semiconductor chip. When the semiconductor chip is being inspected for pins, the two conveying and sorting mechanisms and the conveyor belt of the conveying device 1 work together to stably transport the semiconductor chip within the U-shaped working channel. During the transport process, the pins can also be sorted to adjust slightly skewed pins, reduce the impact on pin inspection, and improve inspection efficiency. The separator block 3 is equipped with an inspection mechanism, which is used to inspect the semiconductor chip entering the U-shaped working channel. After the pins of the semiconductor chip are corrected, the inspection mechanism contacts and inspects the corrected pins to check the pin length, surface cleanliness, etc. It can also test the performance of the semiconductor chip by energizing the corrected pins.

[0019] like Figure 4 and Figure 5 As shown, the conveying and sorting mechanism includes a circulating motion block 4 and a positioning block 5. There are multiple circulating motion blocks 4. An annular channel is provided inside the protective cover 2, and the multiple circulating motion blocks 4 are slidably installed within the annular channel. The multiple circulating motion blocks 4 achieve annular cyclic movement through existing technologies such as chains or conveyor belts, which will not be described redundantly. The positional states of the multiple positioning blocks 5 and the semiconductor chips are as follows... Figure 6As shown, the positioning block 5 holds the pin and pushes the semiconductor chip to move within the U-shaped working channel, which can ensure the stability of the semiconductor chip during the transport process. The number of positioning blocks 5 is the same as the number of circulating motion blocks 4 and they are set one-to-one. The positioning block 5 is installed on one side of the circulating motion block 4. The positioning block 5 can be inserted into the gap between two adjacent pins of the semiconductor chip. The width of the positioning block 5 is the same as the size of the gap between two adjacent pins of the semiconductor chip. The width between two adjacent positioning blocks 5 is the same as the width of the pin bend of the semiconductor chip.

[0020] like Figure 4 and Figure 5 As shown, the conveying and combing mechanism also includes a combing block 6 and an adjusting combing assembly; a vertical combing groove is provided on the circulating motion block 4, and the combing block 6 is slidably installed in the combing groove. The width of the combing block 6 is smaller than the gap between two adjacent pins of the semiconductor chip, and the combing block 6 can be inserted into the gap between two adjacent pins of the semiconductor chip. The adjusting combing assembly can drive the combing block 6 to move up and down in the combing groove. In actual operation, in the initial state, the combing block 6 is against the top surface of the positioning block 5, and the tip of the positioning block 5 and the tip of the combing block 6 are inserted into the gap at the bend of the semiconductor chip pin. When combing the pins of the semiconductor chip, the adjusting combing assembly works. The combing block 6 is driven to move upward within the combing groove. Since the combing block 6 moves laterally in sync with the circulating motion block 4, the only change between the combing block 6 and the positioning block 5 is the increase in the vertical distance. When the combing block 6 moves upward, it combs the skewed pins, straightening their positions. In addition, during the combing process, since the pins need a fulcrum to ensure they are straightened, the two positioning blocks 5 clamp the bends of the pins. When the pins are about to skew, they are held in place by the positioning blocks 5, ensuring that the pins are straightened. This reduces the force exerted by the combing and straightening action on the connection between the semiconductor chip and the pins, thus ensuring the pin alignment effect.

[0021] like Figure 4 and Figure 5As shown, the adjusting combing assembly includes a lifting slider 7, a semi-threaded rod 8, an upward drive, and a downward drive. The circulating motion block 4 has a lifting groove communicating with the combing groove. The lifting slider 7 is slidably installed in the lifting groove, and the semi-threaded rod 8 is rotatably installed in the lifting groove, with the semi-threaded rod 8 threaded through the lifting slider 7. The movement of the combing block 6 is fixedly connected to the lifting slider 7. The upward drive is used to drive the semi-threaded rod 8 to rotate and cause the lifting slider 7 to move upward within the lifting groove. The downward drive is used to drive the semi-threaded rod 8 to rotate and cause the lifting slider 7 to move downward within the lifting groove. In actual operation, when the circulating motion block 4 is circulating, the upward drive drives the semi-threaded rod 8 to rotate. Since the lifting slider 7 can no longer rotate within the lifting groove, the lifting slider 7 will move upward along the semi-threaded rod 8, thereby driving the combing block 6 to move upward to comb and align the pins of the semiconductor chip. Then, the downward drive drives the combing block 6 to descend and reset, thereby combing and aligning the subsequent semiconductor chip pins.

[0022] like Figure 3 and Figure 7 As shown, the lifting drive includes a gear 9 and a rack 10; the end of the semi-threaded rod 8 passes through the circulating motion block 4 and extends to the outside of the circulating motion block 4 to connect with the gear 9. The rack 10 is fixedly installed inside the protective cover 2. The gear 9 can mesh with the rack 10. In actual operation, the circulating motion block 4 will drive the semi-threaded rod 8 and the gear 9 to move synchronously. When the gear 9 and the rack 10 mesh, the gear 9 will be driven to rotate. The gear 9 drives the semi-threaded rod 8 to rotate, thereby causing the lifting slider 7 to drive the combing block 6 to move upward synchronously. Its structure is simple and the manufacturing cost is low.

[0023] like Figure 3 As shown, the descent drive includes a second rack 11; the second rack 11 is fixedly installed inside the protective cover 2, and the gear 9 can mesh with the second rack 11. After the lifting slider 7 and the combing block 6 rise to the appropriate position, in order to comb the subsequent semiconductor chip pins, the combing block 6 needs to descend and reset, so that the combing block 6 can be inserted into the gap between the pins and the pins can be combed and aligned.

[0024] like Figure 3 and Figure 8As shown, the testing mechanism includes multiple movable testing ends 12 and an ejector. The movable testing ends 12 are positioned at a certain height within the U-shaped working channel (at the shortest position of the qualified pins). Rotary storage slots for accommodating the movable testing ends 12 are provided on both sides of the partition block 3. The movable testing ends 12 are rotatably mounted within the rotary storage slots via a rotating shaft. The ejector allows the movable testing ends 12 to tend to move out of the rotary storage slots. The ejector includes a torsion spring 13. The torsion spring 13 is mounted on the rotating shaft of the movable testing ends 12. The torsion spring 13 drives the movable testing ends 12 to rotate and protrude out of the rotary storage slots. When the pins of the semiconductor chip move to this position, the pins are clamped and restricted by the positioning block 5 and the combing block 6, resulting in a relatively vertical state. Therefore, the pins of the semiconductor chip at this time... When the end of the pin cannot touch the active detection terminal 12, the length of the pin at that point is unqualified. When each pin contacts each active detection terminal 12, the semiconductor chip is powered on to verify the connection status between each pin and the internal circuit of the chip, and to determine whether there is an open circuit (such as the pin being disconnected from the internal circuit) or a short circuit (such as the internal conduction of adjacent pins). The key electrical parameters of the chip in the static working state are measured, such as the static current of the power supply pin, the threshold voltage of the input / output pin, leakage current, etc., to determine whether they meet the design specifications. A preset test vector (simulating the actual working signal) is input to the chip, and the output signal is collected through the contact to verify whether the core functions of the chip, such as logic operation, signal processing, and timing control, are normal (such as the CPU's instruction execution and the read / write function of the memory chip).

[0025] The semiconductor packaging inspection steps are as follows: Step 1: Place the semiconductor chip to be tested on the conveyor belt of the conveyor device 1 with the pins facing upwards, ensuring that the chip body is in contact with the surface of the conveyor belt, and that the pins on both sides are naturally extended without being tangled or severely bent; start the conveyor device 1, and the conveyor belt will move the chip toward the detection channel of the protective cover 2 until the chip enters the initial position of the U-shaped working channel. Step 2: Synchronous delivery and stitch straightening 2.1 Conveying Drive: The conveying and sorting mechanisms on both sides of the U-shaped working channel start synchronously. The circulating motion block 4 slides in a circular channel inside the protective cover 2. The positioning block 5 is inserted into the gap between the bends of adjacent pins of the semiconductor chip (the width of the positioning block 5 is adapted to the gap size, and the distance between adjacent positioning blocks 5 is consistent with the width of the pin bend). Through the lateral thrust of the positioning block 5 and the friction of the conveyor belt of the conveying device 1, the chip is driven to be conveyed smoothly along the U-shaped working channel. The conveying speed of the conveying and sorting mechanism is consistent with the speed of the conveyor belt to ensure that the chip is not deviated. 2.2 Pin Combing and Correction: When the chip moves to the preset combing area with the positioning block 5, the circulating motion block 4 drives the gear 9 at the end of the semi-threaded rod 8 to mesh with the first rack 10. The rotation of the gear 9 drives the semi-threaded rod 8 to rotate, which in turn drives the lifting slider 7 to rise along the lifting slide. The combing block 6, which is fixedly connected to the lifting slider 7, moves upward along the combing slide in sync. The combing block 6 is inserted into the gap between adjacent pins. During the upward movement, it applies combing force to the slightly skewed pins. At the same time, the positioning block 5 clamps the bent part of the pin to form a fulcrum, avoiding damage to the connection between the pin and the chip by the combing force, and finally makes the pin tend to be vertical and upright. 2.3 Combing and Reset: After the chip leaves the combing area, gear 9 meshes with rack 11 and drives the semi-threaded rod 8 to rotate in the opposite direction. The lifting slider 7 drives the combing block 6 to descend and reset, abutting against the top surface of the positioning block 5, in preparation for combing the next chip.

[0026] Step 3, Integrated Detection 3.1 Test preparation: After the chip has been sorted and corrected, it continues to move along the U-shaped working channel. The movable detection ends 12 on both sides of the separator block 3 rotate out of the rotating storage slot and protrude out of the inner wall of the U-shaped working channel under the action of the torsion spring 13. The height of the movable detection end 12 is set to the minimum length threshold of the qualified pin. 3.2 Physical Parameter Detection: The chip pins move with the chip to the position of the active detection end 12. If all pins can contact the corresponding active detection end 12, the pin length is determined to meet the standard. At the same time, the contact status of the active detection end 12 is used to detect whether there are contaminants, oxide layers or burrs on the pin surface that affect contact (poor contact indicates that the surface cleanliness is unqualified). Combined with the previous combing and correction effect, the pin skew angle and the position of the pin are simultaneously confirmed to meet the standards. 3.3 Electrical Performance Testing: After the pins are in stable contact with the active detection terminal 12, the testing mechanism inputs a preset electrical signal to the chip through the active detection terminal 12 to complete three core tests: Continuity test: verifying the open and short circuit states of the pins and the internal circuitry of the chip; Static parameter test: measuring parameters such as the static current of the power supply pins and the threshold voltage of the input / output pins; Dynamic function test: inputting test vectors and collecting output signals to verify the chip's logic operations, signal processing, and other functions.

[0027] Step 4: Detection Result Determination and Triage 4.1 Qualification judgment: Chips whose pin physical parameters (length, cleanliness, alignment) meet the standards and whose electrical performance tests show no abnormalities are judged as qualified products and are conveyed to the next process by conveyor device 1; 4.2 Non-conformance judgment: If any of the following conditions exist, such as the pin length is not up to standard, the surface cleanliness is not up to standard, or the electrical performance is abnormal, the product is judged as non-conforming. The equipment triggers a marking signal, and the subsequent diversion mechanism transfers it to the rework or scrap process. 4.3 Re-inspection mechanism: For products suspected of being unqualified, they can be reversed through conveyor device 1 and the sorting and testing process in steps 2-3 can be repeated to ensure the accuracy of the test results.

[0028] In step 2, the conveying speed of the conveying combing mechanism is the same as the conveying speed of the conveyor belt of the conveying device 1.

[0029] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A semiconductor packaging inspection device, characterized in that, Includes a conveying device (1), on which a protective cover (2) is installed, and a detection channel is opened through the protective cover (2). The detection channel is located directly above the conveyor belt of the conveying device (1). A partition block (3) is installed on the inner wall of the top of the detection channel of the protective cover (2). A U-shaped working channel is formed between the conveyor belt of the conveying device (1), the protective cover (2), and the partition block (3). Two conveying and sorting mechanisms are installed in the U-shaped working channel. The two conveying and sorting mechanisms are located on both sides of the U-shaped working channel. The conveying and sorting mechanisms drive the semiconductor chip to move in the U-shaped working channel. The conveying and sorting mechanisms can also correct the skewed pins of the semiconductor chip. A detection mechanism is installed on the separator (3), which is used to detect semiconductor chips entering the U-shaped working channel.

2. The semiconductor packaging inspection equipment according to claim 1, characterized in that, The conveying and combing mechanism includes a circulating motion block (4) and a positioning block (5); there are multiple circulating motion blocks (4), and an annular channel is provided inside the protective cover (2), and multiple circulating motion blocks (4) are slidably installed in the annular channel; The number of positioning blocks (5) is the same as the number of circulating motion blocks (4) and they are set one-to-one. The positioning blocks (5) are installed on one side of the circulating motion blocks (4). The positioning blocks (5) can be inserted into the gap between two adjacent pins of the semiconductor chip. The width of the positioning blocks (5) is the same as the size of the gap between two adjacent pins of the semiconductor chip. The width between two adjacent positioning blocks (5) is the same as the width of the pin bend of the semiconductor chip.

3. The semiconductor packaging inspection equipment according to claim 2, characterized in that, The conveying and combing mechanism also includes a combing block (6) and an adjusting combing component; the circulating motion block (4) has a vertical combing groove, the combing block (6) is slidably installed in the combing groove, the width of the combing block (6) is smaller than the gap between two adjacent pins of the semiconductor chip, and the combing block (6) can be inserted into the gap between two adjacent pins of the semiconductor chip; The adjusting combing component can drive the combing block (6) to move up and down within the combing groove.

4. A semiconductor packaging inspection device according to claim 3, characterized in that, The adjustment and combing assembly includes a lifting slider (7), a semi-threaded rod (8), an upward drive component, and a downward drive component; the circulating motion block (4) has a lifting groove that communicates with the combing groove, the lifting slider (7) is slidably installed in the lifting groove, the semi-threaded rod (8) is rotatably installed in the lifting groove, and the semi-threaded rod (8) is threaded through the lifting slider (7), and the movement of the combing block (6) is fixedly connected to the lifting slider (7); The lifting drive is used to drive the semi-threaded rod (8) to rotate and cause the lifting slider (7) to move upward in the lifting groove; The descent drive is used to drive the semi-threaded rod (8) to rotate and cause the lifting slider (7) to descend within the lifting groove.

5. A semiconductor packaging inspection device according to claim 4, characterized in that, The lifting drive includes a gear (9) and a rack (10); the end of the semi-threaded rod (8) passes through the circulating motion block (4) and extends to the outside of the circulating motion block (4) and connects with the gear (9); the rack (10) is fixedly installed inside the protective cover (2); the gear (9) can mesh with the rack (10).

6. A semiconductor packaging inspection device according to claim 5, characterized in that, The descent drive includes a second rack (11); the second rack (11) is fixedly installed inside the protective cover (2), and the gear (9) can mesh with the second rack (11).

7. A semiconductor packaging inspection device according to claim 1, characterized in that, The detection mechanism includes multiple movable detection ends (12) and ejector components; both sides of the partition block (3) are provided with rotating storage slots that can accommodate the movable detection ends (12), and the movable detection ends (12) are rotatably installed in the rotating storage slots via a rotating shaft; The ejector can make the active detection end (12) tend to move out of the rotating storage slot.

8. A semiconductor packaging inspection device according to claim 7, characterized in that, The ejector includes a torsion spring (13); the torsion spring (13) is mounted on the rotating shaft of the movable detection end (12).

9. A semiconductor packaging inspection method, employing the semiconductor packaging inspection equipment according to any one of claims 1-8, characterized in that, The inspection steps are as follows: Step 1: Place the semiconductor chip with its pins facing upwards on the conveyor belt of the conveyor device (1); Step 2: The two conveying and combing mechanisms work together with the conveyor belt of the conveying device (1) to stably transport the semiconductor chip in the U-shaped working channel. During the transport process, the combing block (6) moves upward to straighten the skewed needles. Step 3: The straightened stitches are then tested by a testing agency.

10. A semiconductor packaging inspection method according to claim 9, characterized in that, In step 2, the conveying speed of the conveying combing mechanism is the same as the conveying speed of the conveyor belt of the conveying device (1).

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