Cavity package structure and electronic device

Abstract

This application provides a cavity packaging structure and an electronic device. The cavity packaging structure includes an insulating ring; a substrate disposed on one side of the insulating ring; a metal cover plate disposed on the side of the insulating ring away from the substrate; the insulating ring, substrate, and metal cover plate enclose a mounting cavity; and a metal heat-conducting component disposed within the mounting cavity. The substrate has a first surface facing the mounting cavity, and the metal cover plate has a second surface facing the mounting cavity. A chip is disposed on the first surface; the two ends of the metal heat-conducting component along a first direction are respectively connected to the first surface and the second surface. Since the chip is disposed on the first surface, and the metal heat-conducting component is connected to both the first and second surfaces, when the chip generates heat, the heat can be directly conducted to the first surface on one hand, and the heat can also be quickly conducted to the second surface through the metal heat-conducting component on the other hand, achieving rapid heat dissipation on both sides of the chip and improving the efficiency of heat dissipation and cooling of the chip.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more particularly to a cavity packaging structure and an electronic device. Background Technology

[0002] In the development of high-power-density electronic products, heat dissipation has become a key bottleneck restricting performance improvement. If heat dissipation is not timely, the device temperature will rise rapidly, leading to performance degradation, shortened lifespan, or even functional failure.

[0003] Especially in cavity-type packaging structures, the heat dissipation efficiency is limited due to the closed internal space, making it difficult to meet the thermal management requirements of high-power scenarios. Summary of the Invention

[0004] This application provides a cavity packaging structure and an electronic device that can achieve double-sided heat dissipation of the chip in a first direction, thereby improving the efficiency of heat dissipation and cooling of the chip.

[0005] In a first aspect, embodiments of this application provide a cavity encapsulation structure, including,

[0006] Insulating ring;

[0007] A substrate, wherein the substrate is disposed on one side of the insulating ring along a first direction;

[0008] A metal cover plate is disposed along the first direction on the side of the insulating ring opposite to the substrate; the insulating ring, the substrate, and the metal cover plate together form a mounting cavity;

[0009] A metal heat-conducting component is disposed within the mounting cavity;

[0010] The substrate has a first surface facing the mounting cavity, and the metal cover has a second surface facing the mounting cavity. A chip is disposed on the first surface. The two ends of the metal heat-conducting component along the first direction are respectively connected to the first surface and the second surface.

[0011] In one possible implementation, the number of the metal heat-conducting elements is multiple, and the multiple metal heat-conducting elements are arranged at intervals in a direction perpendicular to the first direction.

[0012] In one possible implementation, the number of chips is multiple, and at least a portion of the metal heat-conducting elements are arranged alternately with all the chips along a second direction, which is perpendicular to the first direction.

[0013] In one possible implementation, fins are provided on the outer peripheral wall of the insulating ring, and the fins extend into the mounting cavity, and the fins are electrically connected to the chip.

[0014] In one possible implementation, gold wires are disposed within the mounting cavity, and the gold wires are respectively connected to the fins and the chip.

[0015] In one possible implementation, the metal heat conductor is spaced apart from the fins and the gold wire.

[0016] In one possible implementation, the mounting cavity is filled with thermally conductive adhesive.

[0017] In one possible implementation, the thermally conductive adhesive is used to bond the fins and the gold wires.

[0018] In one possible implementation, the thermally conductive adhesive is doped with metal blocks, which are spaced apart from the fins and the gold wires.

[0019] Secondly, embodiments of this application provide an electronic device including the cavity encapsulation structure described above.

[0020] The cavity packaging structure and electronic device provided in this application have a low heat dissipation efficiency because the mounting cavity is a sealed chamber. In this application embodiment, since the chip is disposed on the first surface of the substrate, and the metal heat-conducting components are respectively connected to the first surface of the substrate and the second surface of the metal cover, when the chip generates heat, the heat can be directly conducted to the first surface on one hand, and the heat can be quickly conducted to the second surface through the metal heat-conducting components on the other hand. This enables rapid heat dissipation of the chip on both sides along the first direction, improving the efficiency of heat dissipation and cooling of the chip. Attached Figure Description

[0021] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0022] Figure 1 This is a schematic diagram of a cavity packaging structure provided in some embodiments of this application;

[0023] Figure 2 This is a schematic diagram of the cavity encapsulation structure provided in some embodiments of this application, with the metal cover plate and thermally conductive adhesive removed;

[0024] Figure 3 This is a schematic diagram of the cavity encapsulation structure provided in some embodiments of this application, with the metal cover plate, metal thermal conductive component and thermal conductive adhesive hidden;

[0025] Figure 4 This is a schematic diagram of the cavity packaging structure provided in some embodiments of this application, with the metal cover plate, metal thermal conductive component, thermal conductive adhesive, chip and gold wire hidden.

[0026] Figure 5 A cross-sectional view of the cavity encapsulation structure provided in some embodiments of this application, with the thermally conductive adhesive removed;

[0027] Figure 6 This is a second cross-sectional view of the cavity encapsulation structure provided in some embodiments of this application.

[0028] Explanation of reference numerals in the attached figures:

[0029] 100. Encapsulation structure body; 101. Mounting cavity; 101a. First surface; 101b. Second surface; 110. Substrate; 120. Insulating ring; 130. Metal cover plate;

[0030] 200. Chip;

[0031] 310. Metal block; 320. Metal thermal conductive component; 330. Thermal conductive adhesive;

[0032] 410. Fin; 411. Positioning hole; 420. Gold wire.

[0033] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0034] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0035] In the development of high-power-density electronic products, heat dissipation has become a key bottleneck restricting performance improvement. If heat dissipation is not timely, the device temperature will rise rapidly, leading to performance degradation, shortened lifespan, or even functional failure.

[0036] Especially in cavity-type packaging structures, the heat dissipation efficiency is limited due to the closed internal space, making it difficult to meet the thermal management requirements of high-power scenarios.

[0037] The cavity packaging structure and electronic device provided in this application have a low heat dissipation efficiency because the mounting cavity is a sealed chamber. In the embodiments of this application, since the chip is disposed on the first surface of the substrate, and the metal heat-conducting components are respectively connected to the first surface of the substrate and the second surface of the metal cover plate, when the chip generates heat, the heat can be directly conducted to the first surface on one hand, and the heat can be quickly conducted to the second surface through the metal heat-conducting components on the other hand. This enables rapid heat dissipation of the chip on both sides along the first direction, thereby improving the efficiency of heat dissipation and cooling of the chip.

[0038] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0039] This application provides a cavity encapsulation structure, see [link to relevant documentation]. Figures 1-6 As shown, the cavity encapsulation structure includes an encapsulation structure body 100, which includes a substrate 110, an insulating ring 120, and a metal cover plate 130. The substrate 110 and the metal cover plate 130 are located on both sides of the insulating ring 120 along the first direction X, and the substrate 110 and the metal cover plate 130 clamp the insulating ring 120 in the first direction X, so that the substrate 110, the insulating ring 120, and the metal cover plate 130 can surround and form the mounting cavity 101 of the encapsulation structure body 100.

[0040] For example, the substrate 110 and the insulating ring 120 are first stacked in the first direction X, and the substrate 110 and the insulating ring 120 are bonded and fixed to form a whole. Then, the metal cover plate 130 is bonded and fixed on the side of the insulating ring 120 away from the substrate 110, so that the substrate 110, the insulating ring 120 and the metal cover plate 130 form a whole, and the substrate 110, the insulating ring 120 and the metal cover plate 130 surround to form the mounting cavity 101.

[0041] The portion of the sidewall of the substrate 110 facing the mounting cavity 101 and corresponding to the mounting cavity 101 in the first direction X serves as the first surface 101a of the substrate 110. The chip 200 is bonded and fixed to the first surface 101a by silver paste. The portion of the sidewall of the metal cover plate 130 facing the mounting cavity 101 and corresponding to the mounting cavity 101 in the first direction X serves as the second surface 101b of the metal cover plate 130.

[0042] When the chip 200 is in operation, the chip 200 itself generates heat. Since the chip 200 is directly disposed on the first surface 101a of the substrate 110, the heat on the chip 200 can be directly conducted to the substrate 110, so that the heat can be diffused on the substrate 110 and the heat can be dissipated outward from the substrate 110, thereby achieving the effect of reducing the temperature of the chip 200.

[0043] In the embodiments of this application, see Figure 2 and Figure 5 As shown, a metal heat-conducting component 320 is also provided in the mounting cavity 101. The metal heat-conducting component 320 extends along the first direction X and has a first end and a second end that are positioned opposite each other in the first direction X. The first end of the metal heat-conducting component 320 is connected to the second surface 101b of the metal cover plate 130, and the second end of the metal heat-conducting component 320 is connected to the first surface 101a of the substrate 110.

[0044] When the chip 200 is in operation, the chip 200 generates heat. Some of the heat on the chip 200 is directly conducted to the first surface 101a, and some of the heat on the chip 200 diffuses to the mounting cavity 101. During this process, since the chip 200 is directly disposed on the first surface 101a, the heat directly conducted to the first surface 101a by the chip 200 is relatively concentrated, resulting in low efficiency of heat diffusion on the substrate 110 on the first surface 101a and low efficiency of heat dissipation outward from the first surface 101a.

[0045] In this embodiment, by setting a metal heat-conducting component 320 to connect the first surface 101a and the second surface 101b respectively, the heat directly conducted from the chip 200 to the first surface 101a can be partially and quickly conducted to the second surface 101b through the metal heat-conducting component 320, thereby achieving rapid heat dissipation on both sides of the chip 200 along the first direction X, improving the heat diffusion rate on the substrate 110 and the metal cover plate 130, and thus improving the heat dissipation efficiency of the chip 200.

[0046] Similarly, when the chip 200 is in operation, some of the heat on the chip 200 will diffuse to the entire mounting cavity 101, causing the overall temperature of the mounting cavity 101 to rise. Since the metal heat conductor 320 has good thermal conductivity, the metal heat conductor 320 in the mounting cavity 101 can conduct the heat in the mounting cavity 101 to the metal cover plate 130, so that the heat can diffuse on the metal cover plate 130 and the heat can dissipate outward from the metal cover plate 130, thereby achieving the effect of reducing the temperature of the chip 200.

[0047] For example, the material of the metal heat conductor 320 includes, but is not limited to, silver, copper, gold, aluminum or tungsten, so that the metal heat conductor 320 has good thermal conductivity, thereby enabling the metal heat conductor 320 to quickly transfer heat to the second surface 101b and improve the double-sided heat dissipation effect of the chip 200 in the first direction X.

[0048] It is worth mentioning that, since the mounting cavity 101 is a sealed chamber, the heat dissipation efficiency is low after the chip 200 generates heat. In this embodiment, since the chip 200 is disposed on the first surface 101a of the substrate 110, and the metal heat conductor 320 is respectively connected to the first surface 101a of the substrate 110 and the second surface 101b of the metal cover plate 130, when the chip 200 generates heat, the heat can be directly conducted to the first surface 101a on the one hand, and the heat can be quickly conducted to the second surface 101b through the metal heat conductor 320 on the other hand. This enables rapid heat dissipation of the chip 200 on both sides along the first direction X, improving the efficiency of heat dissipation and cooling of the chip 200.

[0049] In some embodiments of this application, see Figure 2 , Figure 3 , Figure 5 and Figure 6 As shown, the chip 200 is provided with pads, and a conductive element is provided in the mounting cavity 101. The conductive element is connected to the pads of the chip 200, so that the conductive element can achieve electrical connection with the chip 200.

[0050] In the embodiments of this application, see Figures 1-6 As shown, the conductive element is disposed on the outer wall of the insulating ring 120, and extends into the mounting cavity 101 through the insulating ring 120 and is electrically connected to the chip 200. Since the conductive element is electrically connected to the chip 200, it can be electrically connected to devices or equipment outside the package structure body 100, enabling external applications of the chip 200.

[0051] It is worth mentioning that when the chip 200 generates heat, the heat on the chip 200 can also be conducted to the conductive components, and the heat in the mounting cavity 101 can also be conducted to the conductive components. In this way, the heat diffuses on the conductive components, allowing the heat to dissipate to the external environment of the package structure body 100 through the conductive components. This improves the heat dissipation efficiency of the mounting cavity 101 of the package structure body 100 and the heat dissipation efficiency of the chip 200.

[0052] Furthermore, in the embodiments of this application, see... Figures 1-4As shown, a positioning hole 411 is also provided on the conductive component, and the positioning hole 411 is located outside the package structure body 100. When the chip 200 of this embodiment is assembled and used with external devices or equipment, the positioning hole 411 can assist in the installation and positioning of the cavity package structure, thereby improving the assembly convenience and assembly accuracy.

[0053] In some embodiments of this application, see Figures 1-6 As shown, the conductive component includes a fin 410 and a gold wire 420, which are interconnected to achieve an electrical connection. The fin 410 passes through the insulating ring 120, with a portion of the fin extending outside the package structure body 100 and a portion extending into the mounting cavity 101 of the package structure body 100. A positioning hole 411 is provided on the fin 410. The gold wire 420 is entirely located within the mounting cavity 101, with one end of the gold wire connected to the pad of the chip 200 and the other end connected to the fin 410, thus achieving an electrical connection between the gold wire 420 and the chip 200, and consequently, an electrical connection between the fin 410 and the chip 200. The fins 410 and gold wires 420 enable the chip 200 to be electrically connected to devices or equipment outside the package structure body 100, thus enabling the chip 200 to be used in external applications.

[0054] For example, see Figures 1-6 As shown, the fin 410 can be a plate-like structure. Since the fin 410 passes through the insulating ring 120 and partially extends out of the encapsulation structure body 100, the plate-like fin 410 can have good structural strength and is not easily bent or damaged.

[0055] Another example is seen in [reference 1]. Figures 2-3 and Figures 5-6 As shown, the gold wire 420 is a linear structure. Since the gold wire 420 is located inside the mounting cavity 101 and is completely wrapped by the encapsulation structure body 100, the encapsulation structure body 100 can provide good protection for the gold wire 420. Therefore, the gold wire 420 can maintain the connection stability with the fin 410 and the chip 200.

[0056] In some embodiments of this application, since metal heat-conducting components 320 made of different materials may have certain electrical conductivity, for example, silver, copper, gold, aluminum, and tungsten all have good electrical conductivity. When the metal heat-conducting component 320 comes into contact with a conductive component, it can easily affect the transmission of electrical signals by the conductive component and can easily cause a short circuit. Therefore, in the embodiments of this application, see Figure 2 and Figure 5As shown, the position of the metal heat-conducting component 320 is spaced apart from the position of the conductive component, thereby reducing the probability of the metal heat-conducting component 320 contacting the conductive component, and thus improving the stability and safety of the cavity packaging structure of this application embodiment.

[0057] For example, see Figure 2 and Figure 5 As shown, the conductive component includes fins 410 and gold wires 420 connected to each other. The positions of the fins 410 and the metal heat-conducting component 320 are spaced apart, and the positions of the gold wires 420 and the metal heat-conducting component 320 are also spaced apart, thereby reducing the probability of the metal heat-conducting component 320 contacting the fins 410 and the gold wires 420.

[0058] Another example is seen in [reference 1]. Figure 2 As shown, the metal heat-conducting component 320 is located on one side of the chip 200 along the second direction Y, and the conductive component is located on one side of the chip 200 along the third direction Z and connected to the pads of the chip 200. Here, the second direction Y and the third direction Z are perpendicular to each other, and the second direction Y and the third direction Z are perpendicular to the first direction X respectively. This enables the positional spacing between the metal heat-conducting component 320 and the conductive component, reduces the contact risk between the metal heat-conducting component 320 and the conductive component, and improves the stability and safety of the cavity packaging structure of this application embodiment.

[0059] In some embodiments of this application, see Figure 2 As shown, there are multiple metal heat-conducting elements 320 disposed in the mounting cavity 101, and the multiple metal heat-conducting elements 320 are arranged at intervals in a direction perpendicular to the first direction X.

[0060] For example, see Figure 2 As shown, a plurality of metal heat-conducting elements 320 are arranged at intervals along a second direction Y and / or a third direction Z, wherein the second direction Y and the third direction Z are both perpendicular to the first direction X, and the second direction Y intersects the third direction Z.

[0061] Furthermore, the angle between the second direction Y and the third direction Z can be an acute angle, a right angle, or an obtuse angle, and there is no particular limitation thereto. See the embodiments in this application. Figure 2 As shown, the angle between the second direction Y and the third direction Z is a right angle.

[0062] It is understandable that by providing a plurality of metal heat-conducting elements 320 in the mounting cavity 101, the efficiency of heat conduction to the second surface 101b of the metal cover plate 130 can be improved, thereby accelerating the diffusion of heat on the metal cover plate 130 and improving the double-sided heat dissipation efficiency of the chip 200 along the first direction X.

[0063] Another example is seen in [reference 1]. Figure 2As shown, there are multiple metal heat-conducting components 320 and multiple chips 200. At least a portion of the metal heat-conducting components 320 and all the chips 200 are arranged alternately along the second direction Y, which is perpendicular to the first direction X. On the one hand, this arrangement allows the metal heat-conducting components 320 to be disposed on one side of the chip 200 along the second direction Y, while the conductive components are disposed on one side of the chip 200 along the third direction Z. This arrangement allows for positional spacing between the metal heat-conducting components 320 and the conductive components, improving the stability and safety of the cavity packaging structure in this embodiment. On the other hand, the alternating arrangement of multiple metal heat-conducting components 320 and multiple chips 200 along the second direction Y avoids excessive heat concentration when multiple chips 200 conduct heat to the packaging structure body 100. It also allows for a more even distribution of heat to different locations within the packaging structure body 100, thereby improving the heat dissipation efficiency of the chips 200.

[0064] Another example is seen in [reference 1]. Figure 2 As shown, there are multiple metal heat-conducting elements 320 located on one side of the chip 200 along the second direction Y, and these multiple metal heat-conducting elements 320 are arranged at intervals along the third direction Z. See [link / reference] Figure 2 and Figure 3 As shown, one or more chips 200 are disposed within the mounting cavity 101, and a plurality of metal heat-conducting elements 320 are all located on one side of the chip 200 along the second direction Y, and the plurality of metal heat-conducting elements 320 are spaced apart along the third direction Z. On the one hand, it is possible to achieve the placement of the metal heat-conducting elements 320 on one side of the chip 200 along the second direction Y, while the conductive elements are placed on the side of the chip 200 along the third direction Z, thereby achieving the positional spacing between the metal heat-conducting elements 320 and the conductive elements, improving the stability and safety of the cavity packaging structure of this embodiment; on the other hand, the placement of a plurality of metal heat-conducting elements 320 can avoid excessive heat concentration when the chip 200 conducts heat to the packaging structure body 100, and can distribute the heat more evenly to different positions of the packaging structure body 100, thereby improving the heat dissipation efficiency of the chip 200.

[0065] In some embodiments of this application, see Figure 6 As shown, the mounting cavity 101 is filled with thermally conductive adhesive 330, which, exemplarily, includes, but is not limited to, resin.

[0066] In the assembly process of the cavity packaging structure of this application embodiment, the chip 200 is first mounted on the first surface 101a of the substrate 110, and then the thermally conductive adhesive 330 is filled into the mounting cavity 101. Since the thermally conductive adhesive 330 is in a fluid state before solidification, it can fully fill the mounting cavity 101. After the thermally conductive adhesive 330 solidifies, it can fully contact the inner wall of the mounting cavity 101 and the outer wall of the chip 200.

[0067] When chip 200 is in operation, it generates heat. Since the fluid thermally conductive adhesive 330 solidifies and encapsulates chip 200, the contact area between chip 200 and thermally conductive adhesive 330 is large, improving the heat exchange efficiency between them. This allows heat from chip 200 to be quickly conducted to thermally conductive adhesive 330. Furthermore, because the fluid thermally conductive adhesive 330 completely fills the mounting cavity 101, the contact area between the solidified fluid thermally conductive adhesive 330 and the inner wall of the mounting cavity 101 is large, improving the heat exchange efficiency between thermally conductive adhesive 330 and the packaging structure body 100. This allows heat from thermally conductive adhesive 330 to be quickly conducted to the packaging structure body 100, thereby improving the heat dissipation efficiency of chip 200.

[0068] It is worth mentioning that, in this embodiment of the application, the chip 200 can directly conduct heat to the first surface 101a, and the chip 200 can conduct heat to the second surface 101b through the thermally conductive adhesive 330, thereby achieving double-sided heat dissipation of the chip 200 along the first direction X, which can improve the heat dissipation efficiency of the chip 200.

[0069] Furthermore, by filling the mounting cavity 101 with thermally conductive adhesive 330, the thermally conductive adhesive 330 solidifies from a fluid state and can have a certain hardness, thereby enabling the thermally conductive adhesive 330 to firmly press the chip 200 onto the first surface 101a of the substrate 110, thereby improving the stability of the chip 200 mounted on the first surface 101a.

[0070] In some embodiments of this application, see Figure 6 As shown, thermally conductive adhesive 330 is filled into the mounting cavity 101. After solidification, the thermally conductive adhesive 330 can wrap and adhere to the conductive component, which can improve the positional stability of the conductive component, thereby improving the stability of the connection between the conductive component and the chip 200, and improving the stability and safety of the cavity packaging structure of this application embodiment.

[0071] For example, see Figure 6As shown, the conductive component includes fins 410 and gold wires 420. The solidified thermally conductive adhesive 330 can wrap and adhere to the fins 410 and gold wires 420, thereby improving the positional stability of the fins 410 and gold wires 420 and enhancing the stability and safety of the cavity encapsulation structure in this application embodiment.

[0072] In some embodiments of this application, see Figure 6 As shown, the mounting cavity 101 is filled with thermally conductive adhesive 330, and a metal block 310 is doped inside the thermally conductive adhesive 330. The metal block 310 has good thermal conductivity, which can improve the thermal conductivity of the thermally conductive adhesive 330. Under the premise of realizing double-sided heat dissipation of chip 200 along the first direction X, the heat dissipation efficiency of chip 200 is further improved.

[0073] Furthermore, in this embodiment, the chip 200 is mounted on the first surface 101a of the substrate 110, and then thermally conductive adhesive 330 is filled into the mounting cavity 101. After the thermally conductive adhesive 330 solidifies, the position of the metal block 310 inside the thermally conductive adhesive 330 is spaced apart from the position of the conductive component.

[0074] For example, the metal block 310 includes, but is not limited to, silver, copper, gold, aluminum, and tungsten. Since some metal blocks 310 possess certain electrical conductivity, when the metal block 310 comes into contact with a conductive component, it can easily affect the transmission of electrical signals by the conductive component and can easily cause a short circuit. Therefore, in the embodiments of this application, see... Figure 6 As shown, the position of the metal block 310 is spaced apart from the position of the conductive component, which reduces the probability of the metal block 310 contacting the conductive component, thereby improving the stability and safety of the cavity packaging structure in this embodiment.

[0075] Another example is seen in [reference 1]. Figure 6 As shown, the conductive component includes fins 410 and gold wires 420 that are connected to each other. The positions of the fins 410 and the metal block 310 are spaced apart, and the positions of the gold wires 420 and the metal block 310 are also spaced apart, thereby reducing the probability of the metal block 310 contacting the fins 410 and the gold wires 420.

[0076] In some embodiments of this application, see Figures 1-6 As shown, the encapsulation structure body 100 includes a substrate 110, an insulating ring 120, and a metal cover plate 130. The substrate 110 and the metal cover plate 130 are respectively located on both sides of the insulating ring 120 along the first direction X, and the substrate 110 and the metal cover plate 130 clamp the insulating ring 120 in the first direction X, so that the substrate 110, the insulating ring 120, and the metal cover plate 130 can surround and form the mounting cavity 101 of the encapsulation structure body 100.

[0077] For example, the substrate 110 and the insulating ring 120 are first stacked in the first direction X, and the substrate 110 and the insulating ring 120 are bonded and fixed to form a whole. The part of the sidewall of the substrate 110 facing the mounting cavity 101 and corresponding to the mounting cavity 101 in the first direction X is the first surface 101a of the substrate 110. Then, the chip 200 is bonded to the first surface 101a with silver paste, and the pads and fins 410 of the chip 200 are connected by gold wires 420 respectively. Then, a metal heat-conducting element 32 is provided in the mounting cavity 101. 0. Then fill the mounting cavity 101 with thermally conductive adhesive 330; finally, bond and fix the metal cover plate 130 to the side of the insulating ring 120 away from the substrate 110, so that the substrate 110, the insulating ring 120 and the metal cover plate 130 form a whole, and the substrate 110, the insulating ring 120 and the metal cover plate 130 surround to form the mounting cavity 101, wherein the part of the sidewall of the metal cover plate 130 facing the mounting cavity 101 and corresponding to the mounting cavity 101 in the first direction X is the second surface 101b of the metal cover plate 130.

[0078] In another exemplary manner, after the metal heat-conducting component 320 is bonded and fixed to the first surface 101a, solder is provided on the end of the metal heat-conducting component 320 away from the first surface 101a. After the metal cover plate 130 is placed on the insulating ring 120, the solder on the end of the metal heat-conducting component 320 away from the first surface 101a is melted and resolidified by using a reflow soldering process, thereby achieving the bonding and fixing between the metal heat-conducting component 320 and the metal cover plate 130, and realizing the connection between the metal heat-conducting component 320 and the second surface 101b.

[0079] Of course, the metal heat-conducting component 320 can also be directly bonded and fixed to the metal cover plate 130, and then the metal cover plate 130 can be bonded and fixed to the insulating ring 120, so that the metal heat-conducting component 320 is connected to the first surface 101a, which can also achieve the fixation of the metal heat-conducting component 320 in the mounting cavity 101.

[0080] In some embodiments of this application, the substrate 110 and the metal cover 130 are made of copper, which enables the substrate 110 and the metal cover 130 to have certain thermal conductivity, thereby improving the heat dissipation efficiency of the chip 200.

[0081] Since the insulating ring 120 is in direct contact with the conductive component, the insulating ring 120 is made of an insulating material to avoid affecting the transmission of electrical signals by the conductive component and to easily avoid short circuits, thereby improving the stability and safety of the cavity packaging structure in this application embodiment.

[0082] For example, the conductive element includes fins 410 and gold wire 420, wherein the fins 410 are made of copper.

[0083] As another example, the metal heat conductor 320 is made of copper, and the metal block 310 is made of copper.

[0084] In some embodiments of this application, a liquid cooling device or a heat spreader may also be provided on at least one of the substrate 110 and the metal cover plate 130, thereby further improving the heat dissipation efficiency of the chip 200.

[0085] Secondly, this application provides an electronic device that includes the cavity encapsulation structure described above, thereby possessing the corresponding technical effects and advantages.

[0086] Finally, it should be noted that other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A cavity package structure, characterized by: include, Insulating ring (120); A substrate (110) is disposed on one side of the insulating ring (120) along a first direction; A metal cover plate (130) is disposed along the first direction on the side of the insulating ring (120) away from the substrate (110); the insulating ring (120), the substrate (110) and the metal cover plate (130) together form a mounting cavity (101). A metal heat-conducting component (320) is disposed within the mounting cavity (101); The substrate (110) has a first surface (101a) facing the mounting cavity (101), and the metal cover plate (130) has a second surface (101b) facing the mounting cavity (101). A chip (200) is disposed on the first surface (101a). The metal heat-conducting component (320) is connected to the first surface (101a) and the second surface (101b) at both ends along the first direction.

2. The cavity package structure of claim 1, wherein: The number of the metal heat-conducting elements (320) is multiple, and the multiple metal heat-conducting elements (320) are arranged at intervals in a direction perpendicular to the first direction.

3. The cavity package structure of claim 2, wherein: The number of chips (200) is multiple, and at least a portion of the metal heat-conducting elements (320) and all the chips (200) are arranged alternately along a second direction, which is perpendicular to the first direction.

4. The cavity package structure of claim 1, wherein: The outer peripheral wall of the insulating ring (120) is provided with fins (410), and the fins (410) extend into the mounting cavity (101), and the fins (410) are electrically connected to the chip (200).

5. The cavity encapsulation structure according to claim 4, characterized in that: A gold wire (420) is provided inside the mounting cavity (101), and the gold wire (420) is connected to the fin (410) and the chip (200) respectively.

6. The cavity encapsulation structure according to claim 5, characterized in that: The metal heat-conducting element (320) is spaced apart from the fins (410) and the gold wire (420).

7. The cavity encapsulation structure according to claim 5 or 6, characterized in that: The mounting cavity (101) is filled with thermally conductive adhesive (330).

8. The cavity encapsulation structure according to claim 7, characterized in that: The thermally conductive adhesive (330) is used to bond the fins (410) and the gold wires (420).

9. The cavity encapsulation structure according to claim 8, characterized in that: The thermally conductive adhesive (330) contains a metal block (310), which is spaced apart from the fins (410) and the gold wire (420).

10. An electronic device, characterized in that: Includes the cavity encapsulation structure as described in any one of claims 1-9.

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