A semiconductor device liquid cooling radiator structure

Abstract

This invention relates to the technical field of electronic heat dissipation and discloses a liquid-cooled heat sink structure for semiconductor devices, including a heat sink with an array of heat dissipation teeth on its surface, forming flow channels between the heat dissipation teeth; a cover plate with multiple protrusions on the side facing the metal heat sink; the protrusions are inserted into the flow channels between the heat dissipation teeth; the shape and spacing of the protrusions match the tooth profile and tooth pitch of the heat dissipation teeth. This invention provides a liquid-cooled heat sink structure for semiconductor devices that enables the heat sink to achieve efficient heat dissipation while maintaining a low pressure drop.

Description

Technical Field

[0001] This invention relates to the technical field of electronic heat dissipation, and in particular to a liquid-cooled heat sink structure for semiconductor devices. Background Technology

[0002] Liquid-cooled radiators, as core heat dissipation components for power modules (such as IGBTs and silicon carbide devices), are widely used in new energy vehicle power systems, energy storage converters, industrial frequency conversion equipment, and other fields. Among them, plug-in liquid-cooled radiators, with their unique structural design, can not only efficiently exchange heat between the coolant and the heat sink and quickly remove the large amount of heat generated during the operation of the power module, but also optimize the flow distribution while ensuring sufficient heat exchange area, further improving heat transfer efficiency.

[0003] Existing liquid cooling radiator designs often rely on traditional experience or single performance optimization approaches: most solutions aim to increase the heat exchange area by increasing the number of heat sink teeth and reducing the tooth spacing. However, this design can easily lead to a narrowing of the coolant flow channel, which in turn causes a surge in flow resistance. If the resulting pressure drop exceeds the delivery pressure range of the matching water pump, the overall heat dissipation efficiency will be reduced due to insufficient coolant flow. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides a liquid-cooled heat sink structure for semiconductor devices, which enables the heat sink to achieve efficient heat dissipation while maintaining a low pressure drop.

[0005] This invention provides a liquid-cooled heat sink structure for a semiconductor device, comprising: a heat sink with an array of heat dissipation teeth on its surface, forming flow channels between the heat dissipation teeth; a cover plate with a plurality of protrusions on the side facing the metal heat sink; the protrusions being inserted into the flow channels between the heat dissipation teeth; and the shape and spacing of the protrusions matching the tooth profile and tooth pitch of the heat dissipation teeth.

[0006] Optionally, the cross-sectional shape of the heat dissipation fins may include rhombus, rectangle, or irregular shape.

[0007] Optionally, the cross-sectional areas from the tooth root to the tooth tip may decrease or be equal.

[0008] Optionally, the protruding structure includes a main body portion and an edge portion surrounding the main body, the edge portion being less thick than the main body portion.

[0009] Optionally, the insertion depth of the protrusion is 2 / 5 to 1 / 2 of the channel height.

[0010] Optionally, the protruding structure has a hollow cavity inside, which is connected to the main coolant channel to form an internal flow channel.

[0011] Optionally, the cover plate is provided with an inlet and an outlet, and a flow guiding structure is provided at the inlet and outlet. The flow guiding structure is a conical diffuser section or an arc-shaped flow guide plate.

[0012] Optionally, the outlet direction of the flow guide structure forms an angle of 0° to 45° with the extension direction of the flow channel.

[0013] Optionally, the cover plate is integrally molded using a two-color injection molding process. The raised structure is made of rigid plastic, while the base part of the cover plate is made of soft plastic, which has a lower hardness than the rigid plastic.

[0014] Optionally, the heat sink substrate has a positioning groove on the side facing the cover plate, and the cover plate has a positioning boss at the corresponding position. The positioning boss and the positioning groove cooperate to achieve the pre-positioning of the heat sink and the cover plate.

[0015] The technical solution provided by this invention has the following advantages compared with the prior art: By setting multiple protruding structures on the side of the cover plate facing the heat sink and extending these protruding structures into the flow channels between the heat sink's heat dissipation teeth, this invention effectively increases the contact area between the coolant and the solid wall, ensuring sufficient heat exchange area. Simultaneously, gaps are left between the surfaces of the protruding structures and the surfaces of adjacent heat dissipation teeth to allow coolant flow. This structural layout re-divides the flow channels, guiding the coolant to flow in an orderly manner, optimizing flow distribution, avoiding local flow dead zones, and utilizing the narrow channels formed by the gaps to increase local flow velocity and enhance convective heat transfer, thereby improving overall heat dissipation efficiency. Furthermore, the shape and spacing of the protruding structures match the tooth shape and pitch of the heat dissipation teeth, ensuring smooth assembly and structural compactness. While ensuring heat dissipation performance, the structure is simple, easy to manufacture, and highly economical, making it suitable for scenarios requiring both effective heat dissipation and cost control. Attached Figure Description

[0016] Figure 1 An exploded view of a semiconductor device liquid-cooled heat sink structure provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of a heat sink and cover plate provided in an embodiment of the present invention; Figure 3 This is an overall schematic diagram of a liquid-cooled heat sink structure for a semiconductor device provided in an embodiment of the present invention.

[0017] Explanation of reference numerals in the attached figures: 1. Heat sink; 2. Cover plate; 11. Heat dissipation fins; 22. Raised structure; 12. Substrate; 20. Water inlet; 21. Water outlet; 13. Thermal bonding material; 14. AMB substrate. Detailed Implementation

[0018] The following detailed description of a specific embodiment of the present invention is provided in conjunction with the accompanying drawings. However, it should be understood that the scope of protection of the present invention is not limited to the specific embodiment.

[0019] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the technical solution of this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0020] The present invention will be described below through several specific embodiments. To keep the following description of the embodiments clear and concise, detailed descriptions of known functions and components may be omitted. When any component of an embodiment of the present invention appears in more than one drawing, the component may be represented by the same reference numerals in each drawing.

[0021] Figure 1 This is an exploded view of a liquid-cooled heat sink structure for a semiconductor device provided in an embodiment of the present invention. Figure 2 This is a schematic diagram of a heat sink and cover plate provided in an embodiment of the present invention. Figure 3 This is an overall schematic diagram of a liquid-cooled heat sink structure for a semiconductor device provided in an embodiment of the present invention.

[0022] like Figure 1 and Figure 2 As shown, this embodiment of the invention provides a liquid-cooled heat sink structure for a semiconductor device, including: a heat sink 1 with an array of heat dissipation teeth 11 on its surface, forming flow channels between the heat dissipation teeth 11; a cover plate 2 with a plurality of protrusions 22 on the side facing the metal heat sink 1; the protrusions 22 are inserted into the flow channels between the heat dissipation teeth 11; the shape and spacing of the protrusions 22 match the tooth shape and tooth pitch of the heat dissipation teeth 11.

[0023] The substrate 12 of the heat sink 1 is connected to the heat-generating semiconductor through a thermal connection material 13; the thermal connection material 13 can be silicone grease, solder, silver sintering, etc.; for SiC power modules, the substrate 12 of the heat sink 1 can also be directly equivalent to the lower copper layer of the AMB substrate 14.

[0024] Specifically, the cover plate 2 and the heat sink 1 are sealed together by means of sealing rings or welding, and the two together form a sealed cavity for the flow of coolant. The substrate 12 of the heat sink 1 is attached to the semiconductor device through the thermal connection material 13. The heat generated by the semiconductor device is conducted to the heat dissipation teeth 11 through the heat sink 1. The coolant enters the cavity through the inlet 20 on the cover plate 2 and flows through the gap between the heat dissipation teeth 11 and the protruding structure 22. The staggered turbulence formed by the protruding structure 22 inserted into the flow channel of the heat dissipation teeth 11 significantly increases the effective heat exchange area between the coolant and the heat sink 1, and guides the coolant to generate local turbulence in the flow channel, destroying the boundary layer, thereby greatly improving the convective heat transfer efficiency. At the same time, the matching plug-in structure between the protruding structure 22 and the heat dissipation teeth 11 forms multi-point support, which enhances the overall structural strength. The balance between flow resistance and heat transfer capacity can be adjusted by the shape and insertion depth of the protruding structure 22, so that the heat sink can achieve efficient heat dissipation while maintaining a low pressure drop.

[0025] Optional, see reference Figure 1 and Figure 2 The cross-sectional shape of the heat dissipation tooth 11 includes rhombus, rectangle or irregular shape.

[0026] Specifically, by designing the cross-section of the heat dissipation teeth 11 as rhomboid, rectangular, or irregular, the flow field distribution within the flow channel can be further optimized without significantly increasing flow resistance. Among them, the rhomboid cross-section can guide the coolant to flow smoothly along the tooth surface, reduce the flow dead zone, and form regular vortex shedding behind the tooth tip, enhancing local convective heat transfer. The rectangular cross-section is easy to process and can form a straight flow channel when it is matched with the protruding structure 22 of the cover plate 2, reducing the pressure drop along the flow path. The irregular cross-section can be customized according to the heat source distribution and flow conditions in the specific application scenario, achieving a fine match between heat transfer area, flow resistance, and structural strength, thereby improving the overall performance adaptability of the radiator.

[0027] Optional, see reference Figure 2 The cross-sectional area from the tooth root to the tooth tip decreases or remains the same.

[0028] Specifically, the heat dissipation teeth 11 of the heat sink 1 are needle-shaped or elongated, with the cross-sectional area of ​​the needle teeth decreasing from the root to the tip, and the cross-sectional area of ​​the tip being 85%–100% of the root cross-sectional area. By designing the heat dissipation teeth 11 with a structure where the cross-sectional area decreases or remains equal from the root to the tip, sufficient structural strength at the root can be ensured while optimizing the flow characteristics of the coolant along the tooth height. When the cross-sectional area decreases, the cross-section at the tip decreases, which can guide the coolant to increase its flow velocity when flowing through the tip region, forming a local acceleration effect, enhancing the disturbance to the thermal boundary layer near the tip, and improving the heat exchange efficiency in this region. At the same time, the decreasing structure helps to reduce the overall mass of the heat dissipation teeth 11, reduce material costs, and reduce stress concentration during injection molding or machining. When the cross-sectional area is equal, a uniform cross-section tooth shape is formed, which has a regular structure, is easy to process and manufacture, and has a uniform fit clearance with the protruding structure 22 of the cover plate 2, making it easy to control the ratio of flow resistance to heat exchange area, and suitable for applications with high requirements for heat dissipation uniformity.

[0029] Optional, see reference Figure 2 The protruding structure 22 includes a main body and an edge portion surrounding the main body, the edge portion being less thick than the main body.

[0030] Specifically, by designing the protruding structure 22 as a thick main body and a thin edge surrounding the main body, the overall rigidity of the protruding structure 22 can be ensured while the flexibility of the thin edge allows for elastic contact with the sidewall of the heat dissipation fins 11. When the cover plate 2 is assembled with the heat sink 1, the edge can undergo slight deformation, adaptively compensating for uneven gaps caused by machining tolerances or thermal deformation, ensuring a tight fit between the protruding structure 22 and the heat dissipation fins 11, reducing bypass leakage of coolant at the contact surface, and thus forcing the coolant to flow along the preset flow path. At the same time, the micro-gap between the thin edge and the heat dissipation fins 11 can create a local throttling effect, further increasing fluid turbulence and improving heat exchange efficiency. In addition, the flexible buffering effect of the edge can absorb impact loads during assembly and thermal stress generated by thermal cycling, reducing the risk of structural damage and extending the service life of the radiator.

[0031] Optional, see reference Figure 2 The insertion depth of the protrusion structure 22 is 2 / 5 to 1 / 2 of the flow channel height.

[0032] Specifically, by controlling the insertion depth of the protruding structure 22 within the range of 2 / 5 to 1 / 2 of the flow channel height, an optimized balance can be achieved between heat transfer efficiency and flow resistance. When the insertion depth is less than 2 / 5, the turbulence effect of the protruding structure 22 on the coolant is limited, making it difficult to fully disrupt the thermal boundary layer on the surface of the heat dissipation teeth 11, resulting in a minimal improvement in heat transfer efficiency. When the insertion depth exceeds 1 / 2, although it can further enhance turbulence and increase the effective heat transfer area, it will significantly narrow the effective flow cross-section of the coolant, leading to excessively high local flow velocity and a sharp increase in flow resistance, which may exceed the pressure supply capacity of the water pump, thus reducing the overall flow rate and weakening the heat dissipation performance. Limiting the insertion depth within this range allows the coolant to generate sufficient turbulent disturbance when flowing through the gap between the heat dissipation teeth 11 and the protruding structure 22, effectively enhancing convective heat transfer, while also controlling the flow resistance within a reasonable range, ensuring stable operation of the cooling system at lower power consumption, and achieving comprehensive optimization of heat dissipation efficiency and energy consumption.

[0033] Optional, see reference Figure 2 The protruding structure 22 has a hollow cavity inside, which is connected to the main coolant channel to form an inner flow channel.

[0034] Specifically, by setting a hollow cavity inside the protruding structure 22 and connecting it to the main coolant channel, the contact area between the coolant and the solid wall can be further expanded without increasing the external size of the radiator. This allows the coolant to not only flow through the external gap between the protruding structure 22 and the heat dissipation teeth 11, but also enter the interior of the protruding structure 22 for heat exchange, forming a three-dimensional flow channel structure with internal and external coordination. This design effectively increases the heat exchange area per unit volume, which is especially suitable for compact applications with strict limitations on radiator thickness. At the same time, the hollow cavity structure can reduce the overall weight of the cover plate 2, reduce material consumption, and form local vortices inside the cavity, further enhancing the intensity of convective heat transfer. In addition, the flow of coolant in the inner channel can directly remove the heat accumulated in the protruding structure 22 itself, avoid the formation of local hot spots, and improve the uniformity of the overall temperature distribution, thereby achieving a synergistic optimization of lightweight and high efficiency while ensuring heat dissipation performance.

[0035] Optionally, the cover plate 2 is provided with an inlet 20 and an outlet 21, and a flow guiding structure is provided at the inlet 20 and the outlet 21. The flow guiding structure is a conical diffuser section or an arc-shaped flow guide plate.

[0036] Specifically, by setting conical diffuser sections or arc-shaped guide vanes at the inlet 20 and outlet 21, the flow uniformity of the coolant during entry and exit from the cavity can be effectively improved. The conical diffuser section allows the incoming coolant to gradually expand from a small cross-section inlet to a large cross-section cavity, achieving a smooth decrease in flow velocity and a gradual recovery of pressure, avoiding eddies and local pressure drop losses caused by abrupt changes in cross-section. At the same time, it ensures that the coolant is evenly distributed to the inlets of each flow channel, preventing localized excessive flow velocity or flow dead zones. The arc-shaped guide vanes can guide the flow direction of the coolant according to the flow channel layout, allowing the fluid to enter the heat dissipation tooth 11 area at the optimal angle, reducing flow separation and impact losses. At the outlet 21, the guide structure can collect the coolant flowing out of each flow channel and guide it to discharge smoothly, reducing flow resistance at the outlet. Through the combined effect of the above guide structures, the distribution uniformity of the coolant in the entire radiator can be significantly improved, the total system pressure drop can be reduced, the heat exchange efficiency can be improved, and the risk of localized overheating caused by uneven flow can be reduced.

[0037] Optionally, the outlet direction of the flow guide structure forms an angle of 0° to 45° with the extension direction of the flow channel.

[0038] Specifically, by controlling the angle between the outlet direction of the guide structure and the extension direction of the flow channel within the range of 0° to 45°, the coolant can be effectively guided into the flow channel area of ​​the heat dissipation tooth 11 with a smaller impact angle, reducing eddies and energy losses caused by abrupt changes in flow direction. When the angle is close to 0°, the coolant flows smoothly along the extension direction of the flow channel with minimal flow resistance, making it suitable for applications sensitive to pressure drop. When the angle increases to 45°, the coolant enters the flow channel at a certain angle, which can create a slight lateral scouring effect at the inlet, enhancing the turbulence intensity on the first row of heat dissipation teeth 11 and improving the local heat exchange efficiency in the inlet area. By flexibly adjusting within this angle range, the flow resistance and heat exchange intensity can be optimized and matched according to specific heat dissipation requirements, ensuring that the coolant can be evenly distributed to each flow channel and enter the core heat exchange area with a suitable flow rate and direction, avoiding flow dead zones or local overheating caused by improper flow direction, thereby maximizing heat dissipation efficiency while ensuring overall flow resistance is controllable.

[0039] Optional, see reference Figure 3 The cover plate 2 is integrally molded using a two-color injection molding process. The raised structure 22 is made of hard plastic, while the base part of the cover plate 2 is made of soft plastic. The hardness of the soft plastic is lower than that of the hard plastic.

[0040] By using a two-color injection molding process, the cover plate 2 is integrally molded into a structure combining a rigid raised structure 22 and a soft substrate. This allows for functional zoning optimization while maintaining both heat exchange performance and assembly reliability. The rigid plastic raised structure 22 has excellent shape retention and dimensional stability, maintaining a precise fit gap after being inserted into the heat dissipation tooth 11 flow channel. This ensures long-term stability of the turbulence effect and flow channel morphology, and is less prone to deformation due to fluid erosion or temperature changes during long-term operation. The soft plastic substrate has good flexibility and elasticity. When sealing with the heat sink 1, it can effectively compensate for the flatness error and thermal expansion difference between the cover plate 2 and the heat sink 1 through its own deformation, achieving a uniform contact pressure distribution, improving sealing reliability, and buffering vibration and thermal cycling impact, reducing the risk of interface stress concentration. In addition, the two-color injection molding process enables seamless bonding of dissimilar materials, eliminating the secondary assembly process in traditional assembly processes, simplifying the manufacturing process, reducing production costs, and ensuring the connection strength between the raised structure 22 and the substrate, avoiding the risk of detachment during use. Overall, this achieves synergistic optimization of heat dissipation performance, assembly reliability, and economy.

[0041] Optional, see reference Figure 1 The substrate 12 of the heat sink 1 is provided with a positioning groove on the side facing the cover plate 2, and the cover plate 2 is provided with a positioning boss at the corresponding position. The positioning boss and the positioning groove cooperate to realize the pre-positioning of the heat sink 1 and the cover plate 2.

[0042] Specifically, by setting a positioning groove on the substrate 12 of the heat sink 1 and a positioning boss at the corresponding position of the cover plate 2, the two form a positioning structure with a concave-convex fit during assembly, which can achieve precise pre-positioning before the cover plate 2 and the heat sink 1 are finally sealed together. This positioning structure can ensure the relative positional accuracy between the protruding structure 22 and the heat dissipation teeth 11, so that the protruding structure 22 is accurately inserted into the preset flow channel gap, avoiding assembly difficulties or structural damage caused by the protruding structure 22 colliding with the heat dissipation teeth 11 or the fit being too tight due to assembly misalignment. At the same time, the fit between the positioning groove and the positioning boss can provide stable support and guidance during the assembly process, simplifying the assembly operation, improving production efficiency, and reducing the reliance on additional assembly fixtures. In addition, this pre-positioning structure can also serve as an auxiliary connection point to keep the relative position of the cover plate 2 and the heat sink 1 fixed during subsequent welding or sealing processes, preventing displacement due to the curing of the sealant or thermal deformation during the welding process, thereby ensuring the assembly accuracy and consistency of the final product and improving the overall quality and reliability of the heat sink.

[0043] The above inventions are merely a few specific embodiments of the present invention. However, the embodiments of the present invention are not limited thereto, and any variations that can be conceived by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. A liquid-cooled heat sink structure for a semiconductor device, characterized in that, include: A heat sink with an array of heat dissipation teeth on its surface, with flow channels formed between the heat dissipation teeth; The cover plate has multiple protruding structures on the side facing the metal heat sink; The protruding structure extends into the flow channel between the heat dissipation teeth, and a gap is left between the surface of the protruding structure and the surface of the adjacent heat dissipation teeth for the flow of coolant. The shape and spacing of the protrusions match the tooth profile and pitch of the heat dissipation teeth.

2. The semiconductor device liquid-cooled heat sink structure as described in claim 1, characterized in that, The cross-sectional shape of the heat dissipation teeth includes rhombus, rectangle, or irregular shape.

3. The semiconductor device liquid-cooled heat sink structure as described in claim 1, characterized in that, The cross-sectional areas from the tooth root to the tooth tip decrease or remain equal.

4. The semiconductor device liquid-cooled heat sink structure as described in claim 1, characterized in that, The protruding structure includes a main body and an edge portion surrounding the main body, the edge portion being less thick than the main body.

5. The semiconductor device liquid-cooled heat sink structure as described in claim 3, characterized in that, The insertion depth of the protrusion structure is 2 / 5 to 1 / 2 of the channel height.

6. The semiconductor device liquid-cooled heat sink structure as described in claim 1, characterized in that, The protruding structure has a hollow cavity inside, which is connected to the main coolant channel to form an inner flow channel.

7. The semiconductor device liquid-cooled heat sink structure as described in claim 1, characterized in that, The cover plate is provided with an inlet and an outlet, and a flow guiding structure is provided at the inlet and outlet. The flow guiding structure is a conical diffuser section or an arc-shaped flow guide plate.

8. The semiconductor device liquid-cooled heat sink structure as described in claim 1, characterized in that, The outlet direction of the flow guiding structure forms an angle of 0° to 45° with the extension direction of the flow channel.

9. The semiconductor device liquid-cooled heat sink structure as described in claim 1, characterized in that, The cover plate is integrally molded using a two-color injection molding process. The raised structure is made of rigid plastic, while the base part of the cover plate is made of soft plastic, and the hardness of the soft plastic is lower than that of the rigid plastic.

10. The semiconductor device liquid-cooled heat sink structure as described in claim 1, characterized in that, The heat sink substrate has a positioning groove on the side facing the cover plate, and the cover plate has a positioning boss at the corresponding position. The positioning boss and the positioning groove cooperate to achieve the pre-positioning of the heat sink and the cover plate.

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