Liquid cooling radiator and electronic device

Abstract

The present disclosure provides a liquid cooling heat sink, comprising: a cooling chamber; a plurality of fins, the plurality of fins being spaced apart in the cooling chamber; and a distributor, the distributor being in communication with the cooling chamber and distributing flow of cooling medium in different regions of the cooling chamber in a jet flow manner. The present disclosure also provides an electronic device.

Description

Technical Field

[0001] This disclosure relates to the field of cooling technology, and in particular to a liquid-cooled radiator and electronic device. Background Technology

[0002] With the application of technologies such as artificial intelligence, digital transformation, and the Internet of Things, electronic devices in data centers are gradually becoming smaller and more integrated. At the same time, the number of electronic devices and their power consumption are increasing year by year. Future data centers will face the challenge of operating at kilowatt-level heat and hundreds of watt-level heat flux densities, placing higher demands on the heat dissipation capabilities of cooling systems. However, common immersion liquid cooling systems have relatively weak heat dissipation capabilities and cannot meet the heat dissipation requirements of high heat flux density chips. Especially when the heat generated by the chip is uneven, heat will accumulate in some areas, leading to excessively high temperatures and affecting the stability of electronic device operation. Summary of the Invention

[0003] This disclosure provides a liquid-cooled heat sink and an electronic device.

[0004] In a first aspect, embodiments of this disclosure provide a liquid-cooled heat sink, comprising:

[0005] Cooling chamber;

[0006] Multiple fins are spaced apart within the cooling chamber;

[0007] The distributor is connected to the cooling chamber and distributes the flow rate of the cooling medium flowing into different areas of the cooling chamber in a jet manner.

[0008] In a second aspect, embodiments of this disclosure provide an electronic device, including:

[0009] Circuit board;

[0010] Electronic device, the electronic device being fixed to a circuit board;

[0011] A heat sink, which is stacked with the electronic device, is used to dissipate the heat generated by the electronic device. The heat sink includes any of the liquid-cooled heat sinks provided in the embodiments of this disclosure.

[0012] The liquid-cooled radiator in this embodiment of the present disclosure has multiple fins arranged in the cooling chamber, and a distributor is used to distribute the cooling medium flowing into different areas of the cooling chamber. This allows the heat dissipation to match the flow rate of the cooling medium. For example, the flow rate in hot spots can be increased to quickly eliminate heat in areas with high heat flux density. This can improve the heat dissipation efficiency of the radiator, thereby reducing energy consumption, and also improve the temperature uniformity. Attached Figure Description

[0013] In the accompanying drawings of the embodiments disclosed herein:

[0014] Figure 1 This is a schematic diagram of the structure of a liquid-cooled heat sink provided in an embodiment of the present disclosure;

[0015] Figure 2 This is a partial structural schematic diagram of the liquid-cooled heat sink in an embodiment of this disclosure;

[0016] Figure 3 This is a partial structural diagram of a fin and a heat spreader provided in an embodiment of the present disclosure;

[0017] Figure 4 A cross-sectional view of a fin and a heat spreader provided in an embodiment of this disclosure;

[0018] Figure 5 A schematic diagram of another structure of fins and heat spreader provided in an embodiment of this disclosure;

[0019] Figure 6 A cross-sectional view of another fin and heat spreader provided in an embodiment of this disclosure;

[0020] Figure 7 This is a schematic diagram of another fin structure provided in an embodiment of the present disclosure;

[0021] Figure 8 This is a schematic diagram of the structure of a cover plate and a liquid dispenser provided in an embodiment of the present disclosure;

[0022] Figure 9 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present disclosure;

[0023] Figure 10 This is a top view of a portion of the structure of an electronic device provided in an embodiment of this disclosure. Detailed Implementation

[0024] To enable those skilled in the art to better understand the technical solutions of this disclosure, the embodiments of this disclosure will be described in detail below with reference to the accompanying drawings.

[0025] The present disclosure will be described more fully below with reference to the accompanying drawings; however, the embodiments shown may be embodied in different forms, and the present disclosure should not be construed as limited to the embodiments set forth below. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will enable those skilled in the art to fully understand the scope of the disclosure.

[0026] The accompanying drawings of the embodiments disclosed herein are provided to further illustrate the embodiments of this disclosure and form part of the specification. They are used together with the detailed embodiments to explain this disclosure and do not constitute a limitation thereof. The above and other features and advantages will become more apparent to those skilled in the art from the description of the detailed embodiments with reference to the accompanying drawings.

[0027] This disclosure may be described with reference to plan and / or cross-sectional views using the ideal schematic diagrams of this disclosure. Therefore, the example illustrations may be modified according to manufacturing techniques and / or tolerances.

[0028] Where there is no conflict, the various embodiments of this disclosure and the features thereof in the embodiments may be combined with each other.

[0029] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to limit the disclosure. The term "and / or" as used in this disclosure includes any and all combinations of one or more of the associated enumerated entries. The singular forms "a" and "the" as used in this disclosure are also intended to include the plural forms, unless the context clearly indicates otherwise. The terms "comprising," "made of," etc., as used in this disclosure specify the presence of the stated feature, integral, step, operation, element, and / or component, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof.

[0030] Unless otherwise specified, all terms used in this disclosure (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art. It will also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and this disclosure, and will not be interpreted as having an idealized or overly formal meaning, unless expressly so defined in this disclosure.

[0031] This disclosure is not limited to the embodiments shown in the accompanying drawings, but includes modifications to the configuration based on the manufacturing process. Therefore, the areas illustrated in the drawings are schematic, and the shapes of the areas shown illustrate specific shapes of the areas of an element, but are not intended to be limiting.

[0032] In a first aspect, embodiments of this disclosure provide a liquid-cooled heat sink.

[0033] Figure 1 This is a schematic diagram of a liquid-cooled heat sink provided in an embodiment of this disclosure. Figure 1 As shown, the liquid-cooled radiator includes:

[0034] Cooling chamber 1, the cooling medium flows in from the inlet of cooling chamber 1 and flows out from the outlet of cooling chamber 1.

[0035] Multiple fins 2 are spaced apart within the cooling chamber 1, and the fins 2 can promote heat exchange between heat and the cooling medium. The spacing between the fins 2 is not limited in this embodiment.

[0036] Distributor 3 is connected to cooling chamber 1 and distributes the flow rate of cooling medium flowing into different areas of cooling chamber 1 in a jet manner.

[0037] The liquid-cooled radiator in this embodiment has multiple fins arranged in a cooling chamber, and a distributor is used to distribute the cooling medium flowing into different areas of the cooling chamber, so that the heat dissipation and the flow rate of the cooling medium are matched. For example, the flow rate in hot spots can be increased, which can quickly eliminate the heat in areas with high heat flux density, thereby improving the heat dissipation efficiency of the radiator and improving the temperature uniformity.

[0038] Figure 2 This is a partial structural schematic diagram of the liquid-cooled heat sink in an embodiment of this disclosure. (Combined with...) Figure 1 and Figure 2 The cooling chamber 1 includes a cover plate 11, which closes the top of the cooling chamber 1; wherein, the top of the cooling chamber 1 refers to the side of the cooling chamber 1 away from the heat exchange surface.

[0039] The distributor 3 includes a dispensing chamber 31, and an inlet 32 ​​and an outlet (not shown in the figure) disposed on two opposite sides of the dispensing chamber 31. The outlet of the distributor is connected to the cooling chamber 1 through the cover plate 11 of the cooling chamber 1. The projected area of ​​the outlet of the distributor 3 on the heat conduction surface of the cooling chamber 1 is less than or equal to the area of ​​the heat conduction surface of the cooling chamber 1. In this way, the flow direction of the cooling medium after entering the cooling chamber 1 is both longitudinal (the first direction below) and transverse (the second and third directions below), which helps to improve the heat dissipation capacity of the liquid-cooled radiator. The cover plate 11 of the cooling chamber 1 is disposed on opposite sides of the heat exchange surface of the cooling chamber 1.

[0040] The inlet 32 ​​of the distributor 3 can be internally or externally threaded and connected to the liquid supply device via a pipeline. The liquid supply device is used to store the cooling medium.

[0041] The cooling medium flows into the dispensing chamber 31 through the inlet 32 ​​of the distributor 3, flows out from the outlet of the distributor 3, and enters the cooling chamber. In this embodiment, the size of the inlet 32 ​​of the distributor 3 is smaller than the size of the outlet of the distributor 3. The cooling medium flows out after being buffered in the dispensing chamber 31, so that the flow rate of the cooling medium flowing out from different positions of the outlet of the distributor 3 is basically the same, thereby ensuring that the cooling medium flowing into the cooling chamber 1 has the same flow rate.

[0042] In some embodiments, the outlet shape of the dispenser 3 includes one of the following: spindle-shaped, rhomboid, elliptical, and rectangular. When the dispenser 3 has a spindle-shaped structure, the narrowest part is approximately one-third the width of the widest part.

[0043] In some embodiments, the projection shape of the liquid distribution chamber 31 on the heat conduction surface of the cooling chamber 1 is the same as the shape of the outlet of the liquid distributor 3, which helps the cooling medium to enter the cooling chamber 1 quickly.

[0044] In some embodiments, the area of ​​the inlet 32 ​​of the distributor 3 projected onto the heat conduction surface of the cooling chamber 1 is smaller than the area of ​​the distributor 31 projected onto the heat conduction surface of the cooling chamber 1. This allows the cooling medium to enter the cooling chamber 1 after being buffered by the distributor 31, which helps to improve the heat dissipation capacity of the liquid-cooled radiator.

[0045] Figure 3 This is a partial structural diagram of the fins and heat spreader in an embodiment of this disclosure. Figure 3 As shown, the cooling chamber 1 includes a central jet region and a flow heat exchange region. The central jet region is located in the middle area of ​​the cooling chamber 1, and the flow heat exchange region is located around the periphery of the central jet region. The outlet of the distributor 3 is located in the central jet region, that is, the outlet of the distributor 3 faces the central jet region directly, and the orientation of the distributor outlet is consistent with the first direction of the fins, so that the cooling medium flowing out of the distributor outlet impacts the heat exchange surface of the cooling chamber in a jet manner, which can disrupt the thermal boundary layer. The distributor directly sprays the cooling medium onto the heat exchange surface of the cooling chamber, which can disrupt the flow and temperature boundary layer of the cooling medium near the fins 2 region, thereby improving the heat exchange efficiency.

[0046] In some embodiments, the central jet region is opposite to the region with relatively high heat flux density in the electronic device, and the flow heat exchange region is opposite to the region with relatively low heat flux density in the electronic device. The outlet of the distributor 3 is located in the central jet region, and the outlet of the distributor 3 is oriented in the same direction as the first direction of the fins 2. In this way, the cooling medium can directly impact the heat exchange surface of the cooling chamber 1, thereby allowing the cooling medium to directly exchange heat with the heat exchange surface of the cooling chamber 1, thereby improving the heat exchange efficiency.

[0047] It should be noted that the first direction of fin 2 refers to the height direction of fin 2, such as... Figure 3 In the X direction, the second direction refers to the length direction of fin 2, such as... Figure 3 In the Y direction, the third direction refers to the thickness direction of fin 2, such as... Figure 3 The Z direction in the equation.

[0048] Figure 4 This is a schematic diagram of the structure of the fins and heat spreader in an embodiment of this disclosure. Figure 4As shown, the fin 2 includes a fin body 21 and multiple fin openings 22 penetrating the thickness of the fin body 21. The multiple fin openings 22 are spaced apart in the second direction of the fin 21. The fin openings 22 allow the cooling medium to flow in the third direction, increasing the flow direction of the cooling medium. That is, the cooling medium can flow not only between the fins 2 in the second direction, but also through the fin openings in the third direction. This helps to improve the heat exchange efficiency of the liquid-cooled radiator and also enables flow distribution, preventing heat from continuously accumulating in the heat source area, thereby improving the heat dissipation capacity of the liquid-cooled radiator. In addition, the fin openings 22 can also reduce the pressure drop of the radiator, thereby saving power consumption.

[0049] In this embodiment, the fin openings 22 on each fin 2 may be the same or different in size.

[0050] When the size of the fin openings 22 on the fin 2 is different, the diameter of the fin openings 22 located in the central region of the fin body 21 is larger than the diameter of the fin openings 22 located in the edge region of the fin body 21. This can increase the flow velocity in the central region, thereby improving the heat dissipation capacity of the radiator.

[0051] In some embodiments, the size of the fin opening 22 gradually increases from the central region to the edge region, which can further improve the flow rate of the cooling medium in different regions.

[0052] If the fin openings occupy a small area, the flow rate of the cooling medium will be reduced, affecting the heat dissipation effect. Conversely, if the fin openings occupy a large area, the heat exchange area of ​​the fins will be reduced, thus decreasing the heat dissipation capacity of the fins. Therefore, in this embodiment, the area occupied by the fin openings corresponding to the flow heat exchange zone can be 20%-50% of the total area of ​​the flow heat exchange zone to achieve a better heat dissipation effect. The height of the fin openings in the flow heat exchange zone can be selected from approximately one-third to two-thirds of the fin height.

[0053] In some embodiments, the shape of the fin opening 22 includes any polygonal structure such as rectangle, circle, ellipse, triangle, trapezoid, etc. Figure 6 As shown, the fin opening 22 is circular. This embodiment does not limit the thickness, length, or width of the fins. For example, the thickness of the fin 2 can range from 0.2 to 1 mm, and the spacing between two adjacent fins 2 can be selected as 0.2 to 1 mm. This ensures that the cooling medium can effectively exchange heat within the channel under conditions where the pressure drop increase is not significant.

[0054] In some embodiments, the fin openings 22 are disposed on the side of the fin body 21 near the heat exchange surface of the cooling chamber 1, thereby allowing the cooling medium to flow close to the heat exchange surface of the cooling chamber 1 and improving the efficiency of heat exchange. The fin openings 22 can also be disposed in the middle or upper part of the fin body 21. The arrangement of the fin openings 22 is not limited in this embodiment. For example, the fin openings 22 can be arranged at intervals along the second direction, or they can be arranged crosswise or irregularly. The aperture of the fin openings 22 can vary according to the height of the fin body 21.

[0055] In some embodiments, the shape of the fin 2 includes one or more of the following: circular fins, square fins, bent fins, and wavy fins. For example... Figure 3 and Figure 5 As shown, fin 2 is a square fin. Figure 7 This is a schematic diagram of another type of fin structure provided in an embodiment of this disclosure. (See attached diagram.) Figure 7 As shown, fin 2 is a circular fin. In this embodiment of the present disclosure, fin 2 can be formed by machining with shovel teeth.

[0056] Combination Figures 2 to 4 As shown, a groove 12 is provided on the cover plate 11 of the cooling chamber 1, which is recessed downward toward the fin 2. A recess 23 is provided on the fin 2. The size of the recess 23 matches that of the groove 12, so that the top of the fin 2 abuts against the cover plate 11 of the cooling chamber 1.

[0057] The cover plate 11 is recessed towards the heat exchange surface of the cooling chamber 1, and the height of the fins 2 at the corresponding position is reduced. This makes the outlet of the distributor 3 closer to the heat exchange surface of the cooling chamber 1, thus shortening the distance the cooling medium travels to the heat exchange surface of the cooling chamber 1, reducing pressure loss, and increasing the flow velocity of the cooling medium to the heat exchange surface of the cooling chamber 1, thereby improving the heat exchange efficiency of the central jet zone. The fins 2 in the flow heat exchange zone are relatively high, and the flow direction of the cooling medium is in the second and third directions, resulting in a lower heat exchange capacity than in the central jet zone.

[0058] In this embodiment, when the cover plate 11 is provided with a groove 12, the diameter of the fin opening 22 opposite to the cover plate 11 is smaller than the diameter of the fin opening 22 in other areas.

[0059] In some embodiments, one end of the fin 2 is fixed to the heat exchange surface of the cooling chamber 1, and the other end is a free end.

[0060] The groove 12 of the cover plate 11 extends along the first direction of the fins 2. Each fin 2 has a recess 23 in the area corresponding to the cover plate 11. The jet distance of the cooling medium in the first direction is different. Moreover, it can flow in the second and third directions, which enhances the heat transfer effect and avoids the continuous accumulation of heat in the heat source area, thereby increasing the heat dissipation capacity of the liquid cooler.

[0061] In this embodiment, the top of the fin 2 abuts against the cover plate 11. After the cooling medium enters the cooling chamber 1 from the inlet 32 ​​of the distributor 3, it first impacts the heat exchange surface in the first direction and directly exchanges heat on the heat exchange surface. Then, it flows along the gap between the fins 2 in the second direction and flows in the third direction through the fin opening 22 to carry away the heat in the fin 2. Finally, it flows out from the outlet of the cooling chamber 1.

[0062] In some embodiments, the outlets of the cooling chamber 1 are located at both ends of the fins 2 in the second direction. The cooling medium enters from the middle position of the fins 2, absorbs heat, and then flows out from both ends.

[0063] In this embodiment, the cover plate 11 can also be a flat cover plate. Figure 5 This is a schematic diagram of another structure of fins and a heat spreader provided in an embodiment of this disclosure. (See attached diagram.) Figure 5 The cover plate 11 of the cooling chamber 1 is a flat cover plate, the fins 2 are of the same height, and the top of the fins 2 abuts against the cover plate 11 of the cooling chamber 1.

[0064] In some embodiments, the liquid-cooled radiator further includes a heat spreader 4, the condensation surface of the heat spreader 4 being in contact with the heat exchange surface of the cooling chamber 1, and heat can be conducted from the condensation surface of the heat spreader 4 to the heat exchange surface of the cooling chamber 1. Since the fins 2 are fixed to the heat exchange surface, heat can be conducted from the heat exchange surface to the fins 2.

[0065] In this embodiment of the disclosure, the heat spreader 4 includes a condensation surface 41 and an evaporation surface 42, wherein the evaporation surface 42 is the surface close to the heat-generating electronic device, and the condensation surface 41 is the surface away from the heat-generating electronic device.

[0066] In some embodiments, the heat spreader 4 includes a heat spreader body 43 and a steam chamber 44 disposed within the heat spreader body 43. A phase change medium is disposed within the steam chamber 44, and the phase change medium within the steam chamber 44 achieves heat conduction through phase change.

[0067] The heat spreader 4 absorbs the heat generated by the electronic device through the evaporation surface 42. This heat causes the phase change material to change from a liquid state to a gaseous state, that is, to become steam. The steam rises and exchanges heat with the condensation surface 41. The steam undergoes another phase change, changing back to a liquid state, and returns to the bottom of the steam chamber 44.

[0068] In some embodiments, the material of the heat spreader body 43 includes, but is not limited to, copper, and the cooling medium includes, but is not limited to, electronic fluorinated liquid and mineral oil. The electronic fluorinated liquid can be Noah 3000A, and the mineral oil can be Mobil EMDC 3220. Electronic fluorinated liquid and mineral oil have good electrical insulation, stable physical and chemical properties, and are environmentally friendly, enabling single-phase immersion heat dissipation.

[0069] In some embodiments, the liquid-cooled radiator further includes a fixing component for securing the radiator to the circuit board. The fixing component includes, but is not limited to, bolts 51 and nuts 52. Fixing holes 53 are provided on the cover plate 11 and the heat spreader 4. The bolts 51 pass through the fixing holes 53 and are screwed onto the nuts 52. Tightening the nuts 52 secures the liquid-cooled radiator to the circuit board. Simultaneously, the bolts 51, nuts 52, and fixing holes 53 ensure the airtightness of the cooling chamber 1, preventing the cooling medium from flowing out of the cooling chamber 1 from any point other than its outlet.

[0070] In some embodiments, the cover plate 11 includes a top 111 and sidewalls, the sidewalls including a first sidewall 112A and a second sidewall 112B, wherein the first sidewall 112A is disposed in a first direction and connected to the top 111. The second sidewall 112B is disposed in a second direction and can be connected to or separated from the top 111. For example, a fin without openings can be used as the second sidewall 112B.

[0071] In some embodiments, the shape of the dispensing chamber 31 includes one of spindle shape, rhombus shape, ellipse shape, and rectangle. Figure 8 This is a schematic diagram of a cover plate and a liquid dispenser provided in an embodiment of this disclosure. Figure 8 As shown, the shape of the dispensing chamber 31 is rhomboid. The shape of the outlet of the dispenser 3 can be consistent with the shape of the dispensing chamber 31.

[0072] The liquid cooling radiator provided in this disclosure can be a single-phase immersion liquid cooler or a two-phase immersion liquid cooler. When using a two-phase immersion liquid cooler, the cooling medium can be a low-boiling-point medium. The liquid cooling radiator can cool GPUs, CPUs, or other high-power electronic devices in data center servers, such as high-power electronic devices with low operating temperatures and high heat flux densities.

[0073] Secondly, embodiments of this disclosure provide an electronic device.

[0074] Figure 9 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present disclosure. Figure 10 This is a top view of a portion of the structure of an electronic device provided in an embodiment of this disclosure. (In conjunction with...) Figure 9 and Figure 10 As shown, the electronic device provided in this embodiment includes:

[0075] Circuit board 91, on which conductive lines are provided.

[0076] Electronic device 92 is fixed to circuit board 91 and electrically connected to other electronic devices through conductive lines on circuit board 91. Electronic device 92 can be a chip.

[0077] Heat sink 93 is stacked with electronic components to dissipate the heat generated by the electronic components. The heat sink includes the liquid-cooled heat sink provided in the embodiments of this disclosure. The specific structure of the liquid-cooled heat sink will not be described in detail here.

[0078] In some embodiments, a heat-conducting element 94 is provided between the electronic device 92 and the heat sink 93 to conduct the heat generated by the electronic device 92 to the evaporation surface of the heat sink 93.

[0079] In some embodiments, the material of the thermal conductive element 94 includes, but is not limited to, silicone grease and liquid gold.

[0080] In some embodiments, the electronic device further includes a memory device 95 for use in a simulated test or real-world environment, the memory device 95 influencing the distribution of the flow field. The memory device 95 is disposed on both sides of the electronic device 92.

[0081] A mounting hole 53 is provided on the circuit board 91, and the heat sink 93 is fixed to the circuit board 91 by bolts and nuts.

[0082] In this embodiment, the heat generated by the electronic device 92 is conducted to the evaporation surface of the heat spreader via the heat conductor 94. The phase change medium in the vapor chamber absorbs heat and undergoes a phase change, transforming into steam. The steam reaches the condensation surface of the heat spreader, undergoes another phase change, and transforms into liquid. Simultaneously, heat is absorbed by the condensation surface of the heat spreader, which transfers heat to the heat exchange surface and fins of the cooling chamber. The cooling medium ejected from the distributor first flows (in the first direction) to the heat exchange surface area of ​​the cooling chamber opposite the central jet area, where it exchanges heat with the heat exchange surface. Then, it flows through the fin openings (in the third direction) and the channels between the fins (in the second direction). During the flow, the cooling medium exchanges heat with the heat in the fins. Finally, the cooling medium is discharged from the outlet of the cooling chamber. The coolant flows in multiple directions, increasing the temperature uniformity of the liquid-cooled radiator and also increasing the heat exchange efficiency.

[0083] The electronic device provided in this embodiment has multiple fins arranged in the cooling chamber of the liquid-cooled heat sink, and the cooling medium flowing into different areas of the cooling chamber is distributed by the liquid distributor. This allows the heat dissipation to match the flow rate of the cooling medium. For example, the flow rate in the hot spot area can be increased to quickly eliminate the heat in the high heat flux density area. This can improve the heat dissipation efficiency of the heat sink and improve the temperature uniformity.

[0084] This disclosure has disclosed exemplary embodiments, and although specific terminology has been used, it is for general illustrative purposes only and should not be construed as limiting. In some instances, it will be apparent to those skilled in the art that features, characteristics, and / or elements described in conjunction with particular embodiments may be used alone, or in combination with features, characteristics, and / or elements described in conjunction with other embodiments, unless otherwise expressly indicated. Therefore, those skilled in the art will understand that various changes in form and detail may be made without departing from the scope of this disclosure as set forth by the appended claims.

Claims

1. A liquid-cooled heat sink, comprising: Cooling chamber; Multiple fins are spaced apart within the cooling chamber; The distributor is connected to the cooling chamber and distributes the flow rate of the cooling medium flowing into different areas of the cooling chamber in a jet manner.

2. The liquid-cooled heat spreader of claim 1, wherein, The liquid separator includes a liquid separation chamber, and an inlet and an outlet of the liquid separator disposed on two opposite sides of the liquid separation chamber. The outlet of the liquid separator is connected to the cooling chamber through a cover plate of the cooling chamber, wherein the cover plate of the cooling chamber is disposed on the opposite side of the heat exchange surface of the cooling chamber.

3. The liquid-cooled heat spreader of claim 2, wherein, The outlet shape of the separator includes one of the following: spindle-shaped, rhomboid, elliptical, and rectangular.

4. The liquid-cooled heat spreader of claim 2, wherein, The projection shape of the liquid distribution chamber on the heat conduction surface of the cooling chamber is the same as the shape of the outlet of the liquid distributor.

5. The liquid-cooled heat spreader of claim 1, wherein, The cooling chamber includes a central jet region and a flow heat exchange region. The central jet region is located in the middle area of ​​the cooling chamber, and the flow heat exchange region is located around the periphery of the central jet region. The outlet of the distributor is located in the central jet zone, and the orientation of the outlet of the distributor is consistent with the first direction of the fins, so that the cooling medium flowing out of the outlet of the distributor impacts the heat exchange surface of the cooling chamber.

6. The liquid-cooled heat spreader of claim 1, wherein, The fin includes a fin body and a plurality of fin openings extending through the thickness of the fin body, the plurality of fin openings being spaced apart in a second direction of the fin.

7. The liquid-cooled heat spreader of claim 6, wherein, The diameter of the fin opening located in the central region of the fin body is larger than the diameter of the fin opening located in the edge region of the fin body.

8. The liquid-cooled heat spreader of claim 1, wherein, The cover plate of the cooling chamber is a flat cover plate, the fins are of the same height, and the top of the fins abuts against the cover plate of the cooling chamber.

9. The liquid-cooled heat spreader of claim 1, wherein, The cover plate of the cooling chamber is provided with a groove that is recessed downward toward the fins, and the fins are provided with recesses that match the size of the grooves so that the top of the fins abuts against the cover plate of the cooling chamber.

10. The liquid-cooled heat spreader of claim 1, wherein, The shape of the fins includes one or more of the following: circular fins, square fins, bent fins, and wavy fins.

11. The liquid-cooled heat spreader of claim 1, wherein, It also includes a heat spreader, wherein the condensation surface of the heat spreader is in contact with the heat exchange surface of the cooling chamber.

12. The liquid-cooled radiator according to claim 11, wherein, The heat spreader includes a heat spreader body and a steam chamber disposed within the heat spreader body; the phase change medium in the steam chamber achieves heat conduction through phase change.

13. An electronic device, comprising: Circuit board; Electronic device, the electronic device being fixed to a circuit board; A heat sink, which is stacked with the electronic device, is used to dissipate the heat generated by the electronic device, and the heat sink includes the liquid-cooled heat sink according to any one of claims 1 to 12.

14. The electronic device according to claim 13, wherein, A heat-conducting component is also provided between the electronic device and the heat sink to conduct the heat generated by the electronic device to the evaporation surface of the heat sink.

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