Staged manifold impinging jet microchannel heat sink
By designing a graded manifold impact jet microchannel heat sink, the problems of uneven flow distribution and excessive pressure drop are solved, the heat exchange performance of the jet region is enhanced, and efficient heat dissipation of high-power chips is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HANGZHOU INTERNATIONAL INNOVATION INSTITUTE OF BEIHANG UNIVERSITY
- Filing Date
- 2026-06-26
- Publication Date
- 2026-07-31
AI Technical Summary
Current technology lacks a solution that can simultaneously address the issues of uneven flow distribution, excessive pressure drop, and a sharp drop in heat transfer performance in the non-stagnant zone of the jet, resulting in low heat dissipation efficiency for high-power chips.
The staged manifold impingement jet microchannel radiator adopts the design of manifold inlet distribution cavity, jet flow hole, micro-protrusion rib and flow guide plate, combined with turbulence rib and microchannel structure to achieve uniform distribution of working fluid and enhanced heat transfer. It utilizes the advantages of manifold diversion and jet impact to enhance the heat transfer performance of impingement jet zone, and ensures stability through high thermal conductivity materials and sealed connection.
It achieves efficient heat dissipation for high-power electronic devices, reduces flow pressure drop, improves heat exchange performance, avoids hot spots, and enhances overall heat dissipation efficiency.
Smart Images
Figure CN122497368A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of heat dissipation for high-power chips, and more particularly to a hierarchical manifold-type impingement jet microchannel heat sink. Background Technology
[0002] Microchannel heat sinks, due to their ultra-high aspect ratio and heat transfer coefficient, have become one of the key technologies for heat dissipation in high-power electronic products. However, the working fluid in a flat microchannel will undergo a phase change due to heat accumulation along the flow direction, and the limited channel size can easily induce "dry burning," leading to two key problems: pressure drop and soaring wall temperature. Manifold microchannel structures can effectively solve these problems, but their uneven flow distribution also results in low local heat dissipation efficiency. In addition, jet impingement cooling can directly impact the heating surface with high-speed fluid, thereby thinning the boundary layer in the stagnation region, which brings great heat transfer potential. However, the heat dissipation performance outside the jet impingement "stagnant zone" drops sharply.
[0003] In summary, current technologies lack a high-power chip heat dissipation solution that can simultaneously address the problems of uneven flow distribution, excessive pressure drop, and a sharp drop in heat transfer performance in the non-stagnant zone of the jet. Summary of the Invention
[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a hierarchical manifold impingement jet microchannel heat sink to achieve efficient heat dissipation of high-power electronic devices.
[0005] The present invention provides a hierarchical manifold type impingement jet microchannel heat sink, comprising a substrate, a jet intermediate layer and a cover plate stacked and packaged sequentially from bottom to top; The cover plate is provided with a fluid inlet and a fluid outlet. The lower surface of the cover plate is provided with a manifold inlet distribution cavity communicating with the fluid inlet, and a plurality of manifold inlet channels communicating with the manifold inlet distribution cavity. The jet intermediate layer is provided with multiple jet flow holes, each of which is connected to one of the multiple manifold inlet channels. The lower surface of the jet intermediate layer is provided with multiple manifold outlet channels and a manifold outlet junction cavity that is connected to all of the multiple manifold outlet channels. The manifold outlet junction cavity is connected to the fluid outlet. The upper surface of the substrate is provided with an impingement jet region and a microchannel convection region. The impingement jet region is provided with a plurality of micro-protrusions, which are located directly below the plurality of jet orifices. Each micro-protrusion has a narrow top surface and a wide bottom surface. At least one flow guide is provided on the flow guiding side of the micro-protrusion. The microchannel convection region is provided with a plurality of microchannels, which are respectively connected to the plurality of manifold outlet channels.
[0006] Thus, the working fluid is evenly distributed to each channel through the manifold inlet distribution chamber via the cover plate inlet, and then vertically jetted from the jet port in the jet intermediate layer to the top surface of the micro-convex ribs, and then diverted to the impact jet zone by the guide vanes. This process makes full use of the advantages of manifold diversion and jet impact, and has extremely high heat exchange performance. Furthermore, the present invention configures turbulence ribs in the impact jet zone, which will trigger secondary flow and vortices, which helps to compensate for the lack of heat exchange performance drop in the non-stagnant zone of the jet impact technology. Finally, the working fluid enters the manifold confluence chamber through the microchannels, where the fluid is recombined and flows out of the radiator through the outlet to complete the heat exchange process.
[0007] The micro-convex rib is a truncated quadrangular structure, and the guide vane extends along the slope direction of the micro-convex rib.
[0008] Therefore, the micro-ribs and guide vanes can enhance the heat transfer performance of the impinging jet stagnation point and guide the flow, making the flow distribution in the impinging jet region more uniform and avoiding hot spots on the surface of electronic devices.
[0009] The thickness of the guide vane is 0.1-5mm, the spacing between adjacent guide vanes is 0.2-10mm, and the number of guide vanes on each micro-protrusion rib is 2-5.
[0010] Therefore, the micro-convex ribs and guide vanes play a guiding role in planning the flow trajectory and also enhance the heat exchange capacity of the core heat source area.
[0011] The impact jet zone is also equipped with multiple turbulence ribs.
[0012] Therefore, the addition of the turbulence ribs increases the turbulence of the fluid in the impingement jet zone, inducing secondary flow and vortices, thereby further enhancing the heat transfer performance.
[0013] The turbulence rib is at least one of trapezoidal rib, triangular rib, needle-shaped rib, and teardrop rib.
[0014] Therefore, ribs with different structures can all increase the turbulence effect of the working fluid in the impinging jet region, and generate secondary flow, vortices and inhibit the growth of the boundary layer, which will further enhance the heat transfer capacity in the impinging jet region.
[0015] The microchannel is a rectangular channel with a width of 0.1-2 mm. The ratio of the wall thickness of the microchannel to the width of the channel is 0.5-1, and the depth-to-width ratio of the channel is 1-10.
[0016] Therefore, the microchannel convection zone, in conjunction with the manifold outlet channel, shortens the flow path, which helps to reduce the flow pressure drop.
[0017] The substrate is further provided with a thermal expansion region, which is arranged around the impact jet region.
[0018] Therefore, the thermal conductivity of high thermal conductivity materials can be fully utilized to achieve thermal expansion of the core heat source, which helps to reduce heat dissipation pressure.
[0019] The jet orifice has a rhomboid, circular, or square structure.
[0020] Therefore, a suitable jet orifice structure can be selected according to different heat exchange requirements to optimize the jet impact effect.
[0021] The substrate, jet intermediate layer, and cover plate are all made of high thermal conductivity materials, including at least one of diamond, silver, copper, and aluminum.
[0022] Therefore, high thermal conductivity materials can quickly transfer heat and improve the overall heat dissipation efficiency of the radiator.
[0023] The substrate, jet intermediate layer, and cover plate are sealed together by welding, riveting, bonding, or adhesive processes.
[0024] This ensures the sealing performance of the radiator, prevents leakage of the working fluid, and ensures the stable operation of the heat exchange process. Attached Figure Description
[0025] Figure 1 This diagram shows an assembly schematic of a hierarchical manifold impingement jet microchannel heat sink according to an embodiment of the present invention. Figure 2 A schematic diagram of the substrate of the hierarchical manifold impingement jet microchannel heat sink according to an embodiment of the present invention is shown. Figure 3 A schematic diagram of the jet intermediate layer of the hierarchical manifold impingement jet microchannel heat sink according to an embodiment of the present invention is shown. Figure 4 A schematic diagram of the cover plate of the hierarchical manifold impingement jet microchannel heat sink according to an embodiment of the present invention is shown. Figure 5 A partial schematic diagram of the substrate of the hierarchical manifold impingement jet microchannel heat sink according to an embodiment of the present invention is shown. Figure 6 A comparison diagram of wall temperatures in an embodiment of the present invention and in a straight-line channel is shown; Figure 7 A comparison diagram of the heat transfer coefficients of the embodiments of the present invention and those of the straight-line channel is shown; Figure 8 A comparison diagram of voltage drop between embodiments of the present invention and the DC channel is shown; Figure 9 A comparison chart of the comprehensive evaluation factor TPF in embodiments of the present invention is shown. Detailed Implementation
[0026] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, the same reference numerals are used for the same parts, and repeated descriptions are omitted. Furthermore, the drawings are merely schematic diagrams, and the proportions of the parts or the shapes of the parts may differ from the actual figures.
[0027] like Figure 1 As shown, this invention provides a hierarchical manifold-type impingement jet microchannel heat sink for efficient heat dissipation of high-power electronic devices. The heat sink consists of a substrate 10, a jet intermediate layer 20, and a cover plate 30, stacked and packaged sequentially from bottom to top. All three components are flat rectangular plates with grooves, sealed together by welding, riveting, bonding, or adhesive processes. The working fluid can be high-heat-capacity fluids such as deionized water or ammonia. The heating method at the bottom of the substrate can be a platinum metal heating film or a copper heating block, and the heat flux is calculated from the temperature difference at the measuring points based on Fourier's law.
[0028] In this embodiment, the hierarchical manifold impinging jet microchannel heat sink is rectangular in shape, with dimensions of 20-100mm in length, 20-100mm in width, and 3-10mm in height. Specifically, in this embodiment, the heat sink dimensions are 24mm in length, 20mm in width, and 3.4mm in height. The cover plate 30, the jet intermediate layer 20, and the substrate 10 are made of the same material and should be high thermal conductivity materials such as diamond, silver, copper, and aluminum.
[0029] In this embodiment, such as Figure 4 As shown, the cover plate 30 is provided with a fluid inlet 31 and a fluid outlet 32. The lower surface of the cover plate 30 is provided with a manifold inlet distribution cavity 33 communicating with the fluid inlet 31, and a plurality of manifold inlet channels 34 communicating with the manifold inlet distribution cavity 33. In this embodiment, the upper surface of the cover plate 30 is machined with through holes of 2 mm in diameter as fluid inlet 31 and fluid outlet 32, respectively, and the distance between the inlet through hole and the center of the nearest side is 2.3 mm, and the distance between the outlet through hole and the center of the nearest side is 24 mm; the lower surface of the cover plate 30 is machined with an "arched" manifold inlet distribution cavity 33 with a depth of 0.6 mm and four rectangular manifold inlet channels 34.
[0030] In this embodiment, such as Figure 3As shown, the jet intermediate layer 20 is provided with multiple jet flow holes 25, which are respectively connected to multiple manifold inlet channels 34. The lower surface of the jet intermediate layer 20 is provided with multiple manifold outlet channels 23 and 24 and a manifold outlet junction cavity 22 that is connected to all multiple manifold outlet channels 23 and 24. The manifold outlet junction cavity 22 is connected to the fluid outlet 32. In this embodiment, a through hole with a depth of 0.3 mm is machined on the upper surface of the jet intermediate layer 20 at the same position as the cover plate inlet 31. Four rows of rhomboid through holes with a depth of 0.9 mm and a side length of 0.28 mm are machined directly below the manifold inlet channel 34 as jet flow holes 25. Six rectangular manifold outlet channels 23 and 24 with a width of 0.4 mm and a depth of 0.6 mm are machined on the lower surface of the jet intermediate layer 20. On the outlet side, a manifold outlet junction cavity 22 with a length of 4 mm, a width of 10.2 mm and a depth of 0.6 mm is machined.
[0031] In this embodiment, such as Figure 2 and Figure 5 As shown, the upper surface of the substrate 10 is provided with an impingement jet region 11 and microchannel convection regions 12 and 13. The impingement jet region 11 contains multiple micro-ribs 15, each located directly below a plurality of jet orifices 25. Each micro-rib 15 has a narrow top surface and a wide bottom surface, and at least one guide vane 17 is provided on the flow-guiding side of the micro-rib 15. The microchannel convection regions 12 and 13 contain multiple microchannels 18, which are respectively connected to multiple manifold outlet channels 23 and 24. In this embodiment, the micro-rib 15 is a truncated pyramid with a height of 0.35 mm, and guide vanes 17 with a thickness of 0.05 mm and a spacing of 0.2 mm are machined on its slope surface. The microchannel convection region is a parallel rectangular microchannel with a width of 0.4 mm and a depth of 0.6 mm.
[0032] The three-layer structure works in synergy: the working fluid enters the manifold inlet distribution cavity 33 through inlet 31, uniformly distributing it to the rectangular manifold inlet channel 34, and then enters the jet flow hole 25 of the jet intermediate layer 20, impacting the upper surface of the micro-protrusion rib 15 on the substrate 10 perpendicularly; after the working fluid jets onto the upper surface of the micro-protrusion rib 15, it is uniformly distributed to the impact jet region 11 by the guide plate 17, and then flows through the turbulence rib 16 and is diverted to the microchannel convection regions 12 and 13; the working fluid enters the manifold outlet channels 23 and 24 through the microchannel 18 and then merges into the manifold outlet confluence cavity 22, finally flowing out of the radiator through outlet 32 to complete the heat transfer process. The graded manifold structure improves the uniformity of flow distribution, and the manifold configuration formed by the jet intermediate layer and the microchannel convection region shortens the flow path, which helps to reduce the overall pressure drop of the radiator.
[0033] In this embodiment, the micro-rib 15 has a truncated pyramid structure, and the guide vane 17 extends along the slope direction of the micro-rib 15. The narrow top and wide bottom structure of the truncated pyramid allows the jet to diffuse evenly in all directions after impact. The guide vane 17 extends along the slope to further guide the fluid to be evenly distributed to each area of the impact jet zone 11, while increasing the heat exchange area and enhancing the heat exchange performance of the impact jet stagnation point, thus avoiding hot spots on the surface of electronic devices due to uneven flow distribution.
[0034] In this embodiment, the thickness of the guide vane 17 is 0.1-5 mm, the spacing between adjacent guide vanes 17 is 0.2-10 mm, and the number of guide vanes 17 provided on each micro-rib 15 is 2-5. The above parameter range is optimized to ensure good flow guidance effect without excessively increasing flow resistance, thus achieving a balance between flow guidance effect and flow resistance.
[0035] In this embodiment, multiple turbulence ribs 16 are also provided within the impinging jet region 11. In this embodiment, the turbulence ribs 16 are mainly triangular or pentagonal prisms with a height of 0.6 mm. The turbulence ribs 16 not only enhance the turbulence effect of the working fluid within the impinging jet region 11, but also induce secondary flow and vortices and suppress boundary layer growth, thereby improving the disadvantage of a sharp drop in heat transfer capacity in the non-stagnant area of jet impingement cooling technology. This also avoids the occurrence of hot spots in electronic devices due to uneven surface temperature.
[0036] In this embodiment, the turbulence rib 16 is at least one of trapezoidal rib, triangular rib, needle rib, and teardrop rib. Different structures of turbulence ribs have different turbulence effects and flow resistance characteristics. The appropriate turbulence rib structure can be selected according to specific heat dissipation requirements and operating conditions to improve the versatility and adaptability of the radiator.
[0037] In this embodiment, the microchannel 18 is a rectangular channel with a width of 0.1-2 mm. The ratio of the wall thickness to the channel width is 0.5-1, and the channel depth-to-width ratio is 1-10. These dimensional parameters can control the flow resistance within the microchannel while ensuring sufficient heat exchange area, enabling the microchannel convection region to possess both high heat exchange performance and low pressure drop characteristics.
[0038] In this embodiment, the substrate 10 is further provided with a thermal expansion region 14, which surrounds the impinging jet region 11. The thermal expansion region 14 utilizes the excellent thermal conductivity of the high thermal conductivity material to rapidly diffuse the heat generated by the core heat source to a larger area, reducing the heat flux density per unit area, alleviating the heat dissipation pressure on the impinging jet region 11, and further improving the overall heat dissipation capacity of the heat sink.
[0039] In this embodiment, the jet orifice 25 is a rhomboid, circular, or square structure. Different shapes of jet orifices will produce different jet patterns and impact effects. For example, the jet produced by a rhomboid jet orifice has better diffusion, while the jet produced by a circular jet orifice is more concentrated. The appropriate shape of the jet orifice can be selected according to the specific heat source distribution and heat dissipation requirements.
[0040] In this embodiment, the substrate 10, the jet intermediate layer 20, and the cover plate 30 are all made of a high thermal conductivity material, including at least one of diamond, silver, copper, and aluminum. High thermal conductivity materials can quickly transfer heat, reduce heat accumulation inside the heat sink, ensure that heat can be transferred from the heat source to the working fluid in a timely manner, and improve the overall heat dissipation efficiency of the heat sink.
[0041] In this embodiment, the substrate 10, the jet intermediate layer 20, and the cover plate 30 are sealed together by welding, riveting, bonding, or adhesive bonding processes. These connection processes ensure the sealing performance of the heat sink, prevent leakage of the working fluid under high pressure, and ensure the stable operation of the heat exchange process. Different connection processes are suitable for different materials and operating conditions; a suitable connection method can be selected according to actual needs.
[0042] To verify the technical effect of the present invention, a comparative experiment was conducted with a flat DC channel heat sink. The experimental results are as follows: Figures 6 to 9 As shown.
[0043] like Figure 6 As shown, the wall temperature of the graded manifold channel of the present invention is significantly lower than that of the flat DC channel. As the power increases, the wall temperature difference gradually increases, indicating that the present invention has better heat dissipation performance under high power conditions.
[0044] like Figure 7 As shown, the heat transfer coefficient of the graded manifold channel of the present invention is much higher than that of the straight channel. When the applied power is 85.07W, the heat transfer coefficient is increased by 73.08%, indicating that the present invention can significantly enhance the heat transfer process.
[0045] like Figure 8 As shown, the pressure drop in a staged manifold channel increases compared to a straight channel, due to the presence of jet impact and turbulence ribs.
[0046] Furthermore, to compare the overall benefits of the enhanced heat transfer efficiency of this invention with the increased pressure loss, a comprehensive evaluation factor (TPF) is used for evaluation and analysis. The calculation formula is as follows:
[0047] The results are as follows Figure 9 As shown. Figure 9This indicates that the comprehensive evaluation factors of the graded manifold impact jet microchannel of the present invention are all greater than 2, which means that under the same pump power conditions, the increase in heat exchange capacity of the present invention is much greater than the increase in resistance, and the comprehensive heat exchange performance is significantly better than that of the flat DC channel radiator.
[0048] The embodiments described above do not constitute a limitation on the scope of protection of this technical solution. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the above embodiments should be included within the scope of protection of this technical solution.
Claims
1. A graded manifold type impingement jet microchannel heat sink, characterized in that, It includes a substrate, a jet intermediate layer, and a cover plate that are stacked and packaged from bottom to top; The cover plate is provided with a fluid inlet and a fluid outlet. The lower surface of the cover plate is provided with a manifold inlet distribution cavity communicating with the fluid inlet, and a plurality of manifold inlet channels communicating with the manifold inlet distribution cavity. The jet intermediate layer is provided with multiple jet flow holes, each of which is connected to one of the multiple manifold inlet channels. The lower surface of the jet intermediate layer is provided with multiple manifold outlet channels and a manifold outlet junction cavity that is connected to all of the multiple manifold outlet channels. The manifold outlet junction cavity is connected to the fluid outlet. The upper surface of the substrate is provided with an impingement jet region and a microchannel convection region. The impingement jet region is provided with a plurality of micro-protrusions, which are located directly below the plurality of jet orifices. Each micro-protrusion has a narrow top surface and a wide bottom surface. At least one flow guide is provided on the flow guiding side of the micro-protrusion. The microchannel convection region is provided with a plurality of microchannels, which are respectively connected to the plurality of manifold outlet channels.
2. The graded manifold type impingement jet microchannel heat sink according to claim 1, characterized in that, The micro-convex rib has a truncated quadrangular structure, and the guide vane extends along the slope direction of the micro-convex rib.
3. The graded manifold type impingement jet microchannel heat sink according to claim 1, characterized in that, The thickness of the guide vane is 0.1-5mm, the spacing between adjacent guide vanes is 0.2-10mm, and the number of guide vanes provided on each micro-protrusion rib is 2-5.
4. The graded manifold type impingement jet microchannel heat sink according to claim 1, characterized in that, The impact jet zone is also equipped with multiple turbulence ribs.
5. The graded manifold type impingement jet microchannel heat sink according to claim 4, characterized in that, The turbulence rib is at least one of trapezoidal rib, triangular rib, needle-shaped rib, and teardrop rib.
6. The graded manifold type impingement jet microchannel heat sink according to claim 1, characterized in that, The microchannel is a rectangular channel with a width of 0.1-2 mm. The ratio of the wall thickness of the microchannel to the width of the channel is 0.5-1, and the depth-to-width ratio of the channel is 1-10.
7. The graded manifold type impingement jet microchannel heat sink according to claim 1, characterized in that, The substrate is further provided with a thermal expansion region, which is arranged around the impact jet region.
8. The graded manifold type impingement jet microchannel heat sink according to claim 1, characterized in that, The jet orifice has a rhomboid, circular, or square structure.
9. The graded manifold type impingement jet microchannel heat sink according to claim 1, characterized in that, The substrate, jet intermediate layer, and cover plate are all made of a high thermal conductivity material, which includes at least one of diamond, silver, copper, and aluminum.
10. The graded manifold type impingement jet microchannel heat sink according to claim 1, characterized in that, The substrate, jet intermediate layer, and cover plate are sealed together by welding, riveting, bonding, or adhesive processes.