Electronic device and method of manufacturing the same

Abstract

This application provides an electronic device and a method for forming the same. The electronic device includes: a first substrate; a plurality of electronic components mounted on the first substrate; a plurality of conductive structures, wherein each conductive structure is formed on and electrically connected to one of the plurality of electronic components, such that the respective plurality of top surfaces of the conductive structures are flush with each other; and a second substrate having a plurality of conductive pads formed thereon, wherein each conductive pad is mounted on one of the conductive structures via a set of solder bumps, such that the second substrate is mounted on the first substrate and electrically connected to the first substrate via the plurality of electronic components, the plurality of conductive structures, and the plurality of conductive pads.

Description

Technical Field

[0001] This application generally relates to semiconductor technology, and more specifically, to an electronic device and a method of manufacturing the same. Background Technology

[0002] The semiconductor industry has always faced complex integration challenges as consumers demand smaller, faster, and higher-performing electronic devices, packing increasing functionality into single devices. For example, substrates with various electronic components can be stacked together to form multifunctional semiconductor devices. More specifically, in such devices, a substrate can be stacked on top of a base substrate to sandwich various electronic components between them, and these components are mounted to the base substrate via solder bumps. The formation of solder bumps may involve a reflow soldering process that forms solder paste between the base substrate and the electronic components, enabling effective electrical connections between them. However, after the reflow soldering process, solder bumps may exhibit defects such as non-wetting and solder short-circuiting. These defects can be caused by uneven soldering of the solder paste between the various electronic components and the base substrate, adversely affecting the quality of the electrical connections.

[0003] Therefore, there is a need for an electronic device with fewer welding defects and higher connection quality. Summary of the Invention

[0004] The objective of this application is to provide an electronic device with fewer soldering defects and higher connection quality.

[0005] According to one aspect of this application, an electronic device is provided. The electronic device includes: a first substrate; a plurality of electronic components mounted on the first substrate; a plurality of conductive structures, wherein each conductive structure is formed on and electrically connected to one of the plurality of electronic components, such that corresponding top surfaces of the plurality of conductive structures are flush with each other; and a second substrate having a plurality of conductive pads formed thereon, wherein each conductive pad is mounted on one of the conductive structures via a set of solder bumps, such that the second substrate is mounted on the first substrate and electrically connected to the first substrate via the plurality of electronic components, the plurality of conductive structures, and the plurality of conductive pads.

[0006] According to another aspect of this application, a method for manufacturing an electronic device is provided. The method includes: providing a first substrate; mounting a plurality of electronic components on the first substrate; forming a plurality of conductive structures on the plurality of electronic components respectively; grinding the plurality of conductive structures so that their plurality of top surfaces are flush with each other; and mounting each set of conductive pads onto one of the conductive structures in the plurality of conductive structures via a set of solder bumps, thereby mounting a second substrate with the plurality of conductive pads to the first substrate such that the second substrate is electrically connected to the first substrate via the plurality of electronic components, the plurality of conductive structures, and the plurality of conductive pads.

[0007] It should be understood that the above general description and the following detailed description are merely exemplary and explanatory and do not limit the invention. Furthermore, the accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. Attached Figure Description

[0008] The accompanying drawings referenced herein form part of this specification. The features shown in the drawings are only illustrative of some embodiments of this application, and not all embodiments of this application, unless the specific embodiments clearly indicate otherwise, and the reader of this specification should not draw the contrary inferences.

[0009] Figure 1 An electronic device according to a first embodiment of this application is shown.

[0010] Figure 2 An electronic device according to a second embodiment of this application is shown.

[0011] Figure 3 An electronic device according to a third embodiment of this application is shown.

[0012] Figures 4A to 4F The various steps of a method for manufacturing an electronic device according to a fourth embodiment of this application are shown.

[0013] Figures 5A to 5D The various steps of a method for manufacturing an electronic device according to a fifth embodiment of this application are shown.

[0014] Use the same icon number to refer to the same or similar parts in a continuous diagram. Detailed Implementation

[0015] The following detailed description of exemplary embodiments of this application takes into account the accompanying drawings, which form a part of the description. The drawings illustrate specific exemplary embodiments in which this application may be practiced. The detailed description, including the drawings, describes these embodiments in sufficient detail to enable those skilled in the art to practice this application. Those skilled in the art may further utilize other embodiments of this application and make logical, mechanical, and other changes without departing from the spirit or scope of this application. Therefore, the reader of the following detailed description should not interpret the description in a limiting sense, and the scope of the embodiments of this application is defined only by the appended claims.

[0016] In this application, unless otherwise expressly stated, the use of the singular includes the plural form. In this application, unless otherwise stated, the use of “or” means “and / or”. Furthermore, the use of the term “comprising” is not restrictive. Additionally, unless otherwise expressly stated, terms such as “element” or “assembly” cover both elements and assemblies comprising one unit and elements and assemblies comprising more than one sub-unit. Furthermore, the section headings used herein are for organizational purposes only and should not be construed as limiting the subject matter described.

[0017] As used herein, for ease of description, spatial relative terms such as “below,” “under,” “above,” “upper,” “upper,” “lower,” “left,” “right,” “vertical,” “horizontal,” and “side” may be used to describe the relationship between an element or feature and another element (or feature) or feature (or feature), as shown in the diagrams. In addition to the orientations depicted in the diagrams, the spatial relative terms are intended to cover different orientations of the device in use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein shall be interpreted accordingly. It should be understood that when an element is referred to as “connected to” or “coupled to” another element, the element may be directly connected to or coupled to the other element, or there may be intermediate elements present.

[0018] As mentioned above, in stacked electronic devices, a substrate having multiple electronic components can be stacked on a base substrate by mounting the electronic components onto the base substrate via solder bumps. The formation of solder bumps may include a reflow soldering process using solder paste formed between the base substrate and the electronic components to establish an electrical connection between the base substrate and the electronic components. In some cases, the electronic components may have different structures, such as different heights. After the solder paste reflow soldering process, solder bumps between electronic components with smaller heights and the base substrate may have non-wetting problems or voids. In some other cases, a larger amount of solder paste may be applied to mitigate non-wetting problems. However, larger amounts of solder paste on the electronic components may cause bridging between the solder bumps formed by the solder paste, thereby causing short circuits within the electronic device. Additionally, during the reflow soldering process, electronic components with different heights may have varying degrees of displacement, which may result in uneven solder bump structures. These defects can adversely affect the quality of the electrical connections between the various electronic components and the base substrate, and the reliability of the resulting electronic device.

[0019] To address the aforementioned problems, according to some embodiments of this application, an electronic device and a method for forming the electronic device are provided. The electronic device includes a first substrate and a plurality of electronic components mounted thereon. Multiple sets of conductive structures are formed on the plurality of electronic components, and each set of conductive structures is electrically connected to one of the electronic components, such that the respective top surfaces of the multiple sets of conductive structures are flush with each other. A second substrate can then be mounted on and electrically connected to the multiple sets of conductive structures. In this manner, the multiple sets of conductive structures can compensate for dimensional differences between various electronic components, providing a flat surface for forming a more uniform electrical connection between the multiple sets of conductive structures and the second substrate, thereby reducing defects and improving the reliability of the electronic device.

[0020] Figure 1 An electronic device according to a first embodiment of this application is shown.

[0021] like Figure 1 As shown, the electronic device has a double-layer structure, wherein a plurality of electronic components 110 are mounted between a first substrate 101 and a second substrate 150, and the electronic components 110 are electrically connected to both substrates 101 and 150.

[0022] More specifically, the first substrate 101 may be included in Figure 1The first substrate 101, facing upwards in the indicated direction, can serve as a platform for mounting electronic components 110. The first substrate 101 also includes a second surface opposite the first surface. In some embodiments, the first substrate 101 may be made of silicon or other semiconductor materials, or may include a printed circuit board (PCB), carrier substrate, ceramic substrate, laminated interposer, strip interposer, lead frame, or other suitable substrate. In some examples, the first substrate 101 may include a redistribution layer or structure having one or more dielectric layers and one or more conductive layers between and through the dielectric layers. Therefore, various components and other structures on one or both surfaces of the first substrate 101 can be electrically coupled to each other to form an integrated electronic system. In some embodiments, multiple sets of conductive pads 102 may be formed on the first surface of the first substrate 101 for mounting electronic components 110. It is also understood that the first set of conductive pads 102 may be exposed portions of interconnects formed within the first substrate 101.

[0023] like Figure 1 As shown, a plurality of electronic components 110 are mounted on a first surface of a first substrate 101 via a plurality of sets of conductive pads 102, and each electronic component 110 is mounted on one of the sets of conductive pads 102 on the first substrate 101. In some embodiments, each of the plurality of electronic components 110 may have two terminals 111, each terminal 111 extending from its top surface to its bottom surface. The terminals 111 are used to establish an electrical connection or to transmit a signal from a module mounted on the top surface of the electronic component 110 to a module mounted on the bottom surface of the electronic component 110. In some embodiments, the two terminals 111 are arranged on two opposite sides of the electronic component 110. Each set of conductive pads 102 may include two conductive pads 102. The two terminals 111 are attached to the two conductive pads 102, for example, by solder bumps.

[0024] In some embodiments, electronic component 110 may be a passive component, such as a resistor, capacitor, inductor, etc. It is also understood that electronic component 110 may be other types of electronic modules, such as semiconductor dies, semiconductor packages, or semiconductor chips with more complex structures. For example, electronic component 110 may include large-size semiconductor chips, multi-layered electronic package stacks, or electronic packages integrating multiple electronic modules. Electronic components 110 may be of the same type or various different types. Furthermore, depending on the specific design of the electronic device, each electronic component 110 may have different sizes and layouts. In some embodiments, such as Figure 1As shown, electronic components 110 may have different heights. It is understood that in an electronic device, at least two electronic components 110 may have different heights from each other, while the rest have the same height. Therefore, the top surfaces of electronic components 110 may have different heights relative to the top surface of the first substrate 101 and are not flush with each other.

[0025] Furthermore, the electronic device includes multiple sets of conductive structures 120, and each set of conductive structures 120 is formed on an electronic component 110 and electrically connected to the electronic component 110 via, for example, solder bumps. In some embodiments, such as Figure 1 As shown, the conductive structure 120 may be a conductive pillar 120 (e.g., a Cu pillar), and each set of conductive structures 120 may include two conductive pillars 120 formed on the top surfaces of the two terminals 111 of the respective electronic component 110. The two conductive pillars 120 formed on the same electronic component 110 have the same height. For electronic components 110 with different heights, the heights of the multiple sets of conductive pillars 120 are different. For example, a set of conductive pillars 120 on an electronic component 110 with a smaller height may have a larger height compared to another set of conductive pillars 120 on a taller electronic component 110. In this way, the multiple sets of conductive structures 120 can compensate for the height difference of the electronic components 110, making the respective top surfaces of the multiple sets of conductive structures 120 flush with each other. Therefore, the presence of the multiple sets of conductive structures 120 can help provide a flat surface for the structure forming a more uniform electrical connection between the multiple sets of conductive structures 120 and the second substrate 150, thereby reducing defects and improving the reliability of the electronic device. Preferably, the width of each of the two conductive pillars 120 may be similar to or slightly smaller than the width of each of the two terminals 111. The conductive post 120 may occupy almost the entire top surface of the corresponding terminal 111. It may also occupy only a portion of the top surface of the corresponding terminal 111.

[0026] In some other embodiments, the multiple electronic components 110 may have the same height. In these cases, multiple sets of conductive structures 120 with different heights can still be used to provide a flat surface to improve the uniformity of the electrical connection between the conductive structure 120 and the second substrate 150.

[0027] In addition, the electronic device includes an encapsulation material 140 located on the first substrate 101 to encapsulate the conductive pad 102, the electronic component 110, and the conductive structure 120. The top surface of the encapsulation material 140 is flush with the top surface of the conductive structure 120. In this way, the top surfaces of the encapsulation material 140 and the conductive structure 120 together provide a flat surface for mounting the second substrate 150.

[0028] like Figure 1As shown, a plurality of conductive pads 151 are formed on a second substrate 150. The second substrate 150 may include a first surface and a second surface opposite to the first surface. The plurality of conductive pads 151 are formed on the first surface of the second substrate 150. The second substrate 150 may include structures and materials similar to those of the first substrate 101. For example, the second substrate 150 may include a redistribution layer or structure having one or more dielectric layers and one or more conductive layers between and through the dielectric layers. Thus, various elements and other structures on one or both surfaces of the second substrate 150 can be electrically coupled to each other. It is also understood that the plurality of conductive pads 151 may be exposed portions of interconnects formed within the second substrate 150.

[0029] In this embodiment, each set of conductive pads 151 is mounted on one of the multiple sets of conductive structures 120 via a set of solder bumps 152. Thus, multiple electronic components 110 are electrically connected to the second substrate 150 via the multiple sets of conductive pads 151 and the multiple sets of conductive structures 120. In other words, the second substrate 150 is mounted together with the first substrate 101 and electrically connected to the first substrate 101 via the multiple electronic components 110, the multiple sets of conductive structures 120, and the multiple sets of conductive pads 151 to form an integrated electronic system. Since the multiple sets of conductive structures 120 are flush with each other, the electrical connections between the multiple sets of conductive pads 151 and the multiple sets of conductive structures 120 can have a uniform structure within the electronic device. Additionally, in some embodiments, the solder bumps 152 and conductive pads 151 on the second substrate 150 are encapsulated by an additional encapsulating material 141 connected to an encapsulating material 140. Therefore, the encapsulating material 140 and the additional encapsulating material 141 together form an encapsulation layer 142 between the first substrate 101 and the second substrate 150. In some embodiments, encapsulating material 140 and additional encapsulating material 141 are formed in successive processes. It may also be understood that, alternatively, encapsulating layer 142 may be an integral part formed in a single process.

[0030] Additionally, additional solder bumps 153 may be formed on the second surface of the first substrate 101 for mounting electronic devices onto an external electronic module. The additional solder bumps 153 may be electrically connected to conductive pads 102 and / or redistribution structures on the first substrate 101, such that they can be electrically connected to electronic components 110 and the second substrate 150.

[0031] In some other embodiments, additional electronic modules may be attached to a second surface of the second substrate 150 to increase the integration of electronic devices.

[0032] Figure 2 An electronic device according to a second embodiment of this application is shown. Figure 2 The electronic device shown has the same Figure 1The electronic devices shown have roughly the same structure and materials, the difference being that... Figure 2 The electronic devices in the device also include one or more additional electronic modules 260 formed on a second substrate 250 of the electronic devices.

[0033] like Figure 2 As shown, the second substrate 250 further includes at least one set of conductive vias 255 extending through the second substrate 250. More specifically, the top and bottom surfaces of each conductive via 255 are exposed from the first and second surfaces of the second substrate 250, respectively. Each of the at least one set of conductive vias 255 is aligned with and electrically connected to one set of conductive pads 251 formed on the first surface of the second substrate 250. Each additional electronic module 260 is mounted on the second surface of the second substrate 250 and is electrically connected to at least one set of conductive pads 251 through at least one set of corresponding conductive vias 255. Thus, the additional electronic module 260 is electrically connected to at least one electronic component 110 through a corresponding set (or sets of) conductive vias 255, a corresponding set (or sets of) conductive pads 251, and at least one set of corresponding conductive structures 120 on the electronic component 110. In this manner, the conductive via 255 provides a direct connection path from the electronic component 110 encapsulated between the second substrate 250 and the first substrate 101 to an additional electronic module 260 on the second surface of the second substrate 250. The conductive via 255 provides more potential connection points for directly mounting the additional electronic module 260, allowing the additional electronic module 260 to be placed directly above or near the electronic component 110, thereby improving the integration of the electronic device. Additionally, the conductive via 255 simplifies the wiring layout for the connection between the additional electronic module 260 and the electronic component 110.

[0034] In some preferred embodiments, the second substrate 250 includes multiple sets of conductive vias 255, each aligned with all the sets of conductive pads 251. More than one additional electronic module 260 is mounted on the second substrate 250 and electrically connected to all electronic components 110 via the multiple sets of conductive vias 255 and conductive pads 251, such as... Figure 2 As shown in the diagram. In some other embodiments, the multiple sets of conductive vias 255 are electrically connected only to a portion of the conductive pads 251 of the multiple conductive pads 251, and therefore electrically connected to a portion of the multiple electronic components 110.

[0035] Figure 3 An electronic device according to a third embodiment of this application is shown.

[0036] Figure 3 The electronic device shown has the same Figure 2 The devices shown have roughly the same structure and materials, the difference being that... Figure 3The electronic device also includes one or more interconnect structures 370 extending from the first substrate 101 to the second substrate 250 through the encapsulation layer 142. In some preferred embodiments, the top surface of the interconnect structure 370 may be flush with the top surface of a plurality of conductive structures 120, and the interconnect structure 370 is also formed between the first substrate 101 and the second substrate 250. Additionally, the bottom and top surfaces of the interconnect structure 370 may be attached to corresponding conductive pads 102, 251 of the first substrate 101 and the second substrate 250. In this way, the interconnect structure 370 establishes a direct electrical connection between the first substrate 101 and the second substrate 250, providing an additional electrical path within the electronic device. In other words, in addition to the conductive vias 255 extending through the second substrate 250, additional electronic modules 260 on the second substrate 250 may be electrically connected to the first substrate 101 via the interconnect structure 370. In some embodiments, the interconnect structure 370 may be formed within a peripheral region between the first substrate 101 and the second substrate 250 and around a plurality of electronic components 110. In some other embodiments, depending on the actual layout of the electronics, the interconnect structure 370 may also be formed between the electronic components 110.

[0037] Figures 4A to 4F The illustration shows various steps of a method for manufacturing an electronic device according to a fourth embodiment of this application. The electronic device may be similar to... Figure 1 , Figure 2 or Figure 3 The electronic device shown.

[0038] like Figure 4A As shown, the first substrate 401 has an upward-facing first surface and a downward-facing second surface opposite the first surface. In some examples, the first substrate 401 may include a redistribution layer or structure having one or more dielectric layers and one or more conductive layers between and through the dielectric layers. Furthermore, multiple sets of conductive pads 402 may be formed on the first surface of the first substrate 401 for mounting electronic components, as will be described in detail below.

[0039] Next, a plurality of electronic components 410 are mounted on a first surface of a first substrate 401 via a plurality of conductive pads 402. More specifically, each electronic component 410 is mounted on one of a plurality of sets of conductive pads 402 on the first substrate 401. In some embodiments, each of the plurality of electronic components 410 may have two terminals 411, and each of the two terminals 411 extends from the top surface of the respective electronic component to the bottom surface. Each set of conductive pads 402 on the first substrate 401 may include two conductive pads 402. Thus, the two terminals 411 are attached to the two conductive pads 402 by, for example, solder bumps. In some embodiments, the electronic components 410 may have different heights. Therefore, the top surfaces of the electronic components 410 may not be flush with each other.

[0040] Next, solder paste 405 is applied to the top surface of each electronic component 410. Specifically, solder paste 405 is typically applied to the respective top surfaces of the two terminals 411 of the corresponding electronic component 410. In some embodiments, solder paste 405 may comprise a metallic solder material such as tin and a flux material. Preferably, the entire surface of the metallic solder material may be coated with flux material, which improves the efficiency of the subsequent reflow soldering process on the metallic solder material.

[0041] Next, as Figure 4B As shown, multiple sets of conductive structures 420 are formed on multiple electronic components 410, with solder paste 405 applied therebetween. More specifically, each set of conductive structures 420 is formed on one electronic component 410. In some embodiments, the conductive structure 420 may be a conductive pillar 420, and each set of conductive structures 420 may include two conductive pillars 420 formed on the top surfaces of two terminals 411 of the respective electronic component 410. The multiple sets of conductive pillars 420 on different electronic components 410 may have the same height or different heights. In addition, the minimum height of the top surfaces of the multiple sets of conductive structures 420 is at least greater than the height of the top surface of the shortest electronic component relative to the first substrate 401.

[0042] In some embodiments, each conductive post 420 is a pre-formed module. All conductive posts 420 may have the same height. Multiple sets of conductive posts 420 are placed on multiple electronic components 410, for example, by a gripper. In some embodiments, alignment marks may be formed on the first substrate 401 or on the top surface of the electronic components 410 to ensure alignment between the multiple sets of conductive posts 420 and the multiple electronic components 410, respectively. It is also understood that the multiple sets of conductive posts 420 may have different heights. For example, multiple sets of conductive posts 420 formed on taller electronic components 410 may have a smaller height, and multiple sets of conductive posts 420 formed on shorter electronic components 410 may have a larger height.

[0043] In some other embodiments, a frame with a grid pattern may be introduced to assist in placing the conductive posts 420 onto the plurality of electronic components 410. More specifically, the grid pattern may include multiple openings respectively aligned with at least a portion of the top surface of the electronic component 410 (e.g., the top surface of the terminal 411 of the electronic component 410, etc.). During the placement of the plurality of sets of conductive posts 420, the frame may be placed on the top surface of the plurality of electronic components 410 or on a first surface of the first substrate 401. Each conductive post 420 may then be inserted into an opening in the frame and placed onto the terminal 411 of a corresponding electronic component 410, thereby improving the accuracy and efficiency of alignment. In addition, the frame also avoids the risk of the conductive posts 420 tilting during the mounting process.

[0044] In some alternative embodiments, multiple sets of conductive structures 420 can be formed via a patterning process rather than a pre-forming process. More specifically, after mounting electronic components 410 on a first substrate 401, a protective layer is attached to the first substrate 401 to cover all corresponding surfaces of the electronic components 410. Next, a patterned mask with multiple openings through it and aligned with terminals 411 of the multiple electronic components 410 is formed on the protective layer. Next, a portion of the protective layer corresponding to the multiple openings of the patterned mask is etched to form multiple openings within the protective layer. Thus, each opening within the protective layer exposes at least a portion of the top surface of a terminal 411 of an electronic component 410. Next, conductive material is deposited within the multiple openings to form multiple conductive structures 420, such as multiple conductive pillars 420. Next, the protective layer can be removed from the first substrate 401, the conductive structures 420, and the electronic components 410, leaving only the multiple conductive pillars 420.

[0045] Next, a reflow soldering process can be performed to reflow solder paste between multiple electronic components 410 and multiple conductive structures 420 to form multiple solder bumps, which can electrically connect the multiple electronic components 410 and the multiple conductive structures 420 respectively.

[0046] Next, as Figure 4C As shown, an encapsulation material 440 is formed on a first substrate 401 to encapsulate multiple sets of conductive pads 402, multiple electronic components 410, and multiple sets of conductive structures 420. The encapsulation material 440 covers the top surfaces of the multiple sets of conductive structures 420. The formation of the encapsulation material 440 may include a melting process that melts a molding compound and a curing process that solidifies the molten molding compound into the encapsulation material 440. Both the melting and curing processes can be performed by heating the entire device.

[0047] Next, as Figure 4DAs shown, a polishing process is performed on encapsulation material 440 and multiple sets of conductive structures 420. More specifically, during the polishing process, the encapsulation material 440 may first be polished at its top surface to expose at least one set of conductive structures 420. The polishing process then continues to polish the encapsulation material 440 and conductive structures 420 together to expose more sets of conductive structures 420. The polishing process may end after all sets of conductive structures 420 have been exposed from the encapsulation material 440. In some embodiments, a monitor or sensor may be used to detect when all sets of conductive structures 420 have been exposed. After the polishing process, the top surfaces of the multiple sets of conductive structures 420 are flush with each other with the top surface of the encapsulation material 440. The multiple sets of conductive structures 420 can compensate for height differences between multiple electronic components. The multiple sets of conductive structures 420 and the encapsulation material 440 provide a flat surface for mounting additional modules, thereby reducing defects and improving the reliability of the electronic device.

[0048] Next, as Figure 4E As shown, a second substrate 450 is provided on which a plurality of sets of conductive pads 451 are formed. The second substrate 450 may include a first surface on which the plurality of sets of conductive pads 451 are formed and a second surface opposite to the first surface. Additional solder paste 452 is applied to each set of conductive pads 451. Next, as... Figure 4F As shown, the first surface of the second substrate 450 may face the top surface of the encapsulation material 440 and the top surface of the conductive structure 420 to allow multiple sets of conductive pads 451 to be attached to the multiple sets of conductive structures 420 respectively. More specifically, each set of conductive pads 451 is attached to one set of conductive structures 420 using solder paste 452 applied therebetween. Next, a reflow soldering process may be performed to reflow the solder paste 452 to form multiple sets of solder bumps 453, which electrically connect the multiple sets of conductive structures 420 and the multiple sets of conductive pads 451 respectively. A cleaning process may then be performed to remove any flux residue after the reflow soldering process.

[0049] Next, an additional encapsulating material 441 is formed between the encapsulating material 440 and the second substrate 450 to encapsulate the solder bumps 453 and the conductive pads 451. The encapsulating material 440 and the additional encapsulating material 441 together form a monolithic encapsulation layer 442 between the first substrate 401 and the second substrate 450. In this manner, an electronic device is formed. In some embodiments, additional solder bumps may be formed on a second surface of the first substrate 401 for mounting the electronic device onto an external electronic module. Details of the structure and materials of the electronic device may be provided in [contact information]. Figure 1 The electronic devices shown are similar, and for simplicity, they will not be described in detail here.

[0050] exist Figures 4D to 4FIn the illustrated embodiment, encapsulation material 440 and additional encapsulation material 441 are formed in a process following the formation of conductive structure 420. In some other embodiments, multiple sets of conductive structures 420 are milled to make their top surfaces flush with each other before the encapsulation material 440 is formed on the first substrate 401. After the second substrate 450 is mounted together with and electrically connected to the first substrate 401, an encapsulation layer 442 is formed in a single process between the first substrate 401 and the second substrate 450 as a monolithic component to encapsulate multiple electronic components 410, multiple sets of conductive structures 420, and multiple sets of conductive pads 402, 451 between the first substrate 401 and the second substrate 450.

[0051] In some other embodiments, additional electronic modules may be attached to a second surface of the second substrate 450 to increase the integration of the electronic devices. Details of the structure and materials of the electronic devices may be provided in conjunction with... Figure 2 The electronic devices shown are similar, and for simplicity, they will not be described in detail here.

[0052] In some other embodiments, at least one interconnect structure is formed on the first substrate 401 prior to the formation of the encapsulation material 440. The top surface of each of the at least one interconnect structure may be ground together with a plurality of conductive structures 420 so that their top surfaces are flush with each other. During the step of mounting the second substrate to the conductive structures 420, at least one interconnect structure may also be mounted on the second substrate and connected to the second substrate via at least one set of conductive pads on the second substrate. Details of the structure and materials of the electronic device may be provided in [contact details]. Figure 3 The electronic devices shown are similar, and for simplicity, they will not be described in detail here.

[0053] In some embodiments, Figures 4A to 4F The method shown can be used to form an array of electronic devices comprising multiple electronic devices that are similar or identical to each other. The array of electronic devices can then be divided into more than one electronic device by a single-cutting process. Each electronic device includes more than one electronic element 410.

[0054] Furthermore, in some alternative embodiments, the conductive structure may take other forms, such as e-bars or solder bumps. Examples of such alternative conductive structures are provided below.

[0055] Figures 5A to 5D The various steps of a method for manufacturing an electronic device according to a fifth embodiment of this application are shown. The electronic device thus formed is compatible with... Figures 4A to 4F The electronic devices formed by the methods shown are the same, except that, in Figures 5A to 5D In electronic devices, the conductive structures are solder bumps rather than... Figure 4F The conductive post 420 shown.

[0056] like Figure 5A As shown, a first substrate 501 has an upward-facing first surface and a downward-facing second surface opposite the first surface. Multiple sets of conductive pads 502 may be formed on the first surface of the first substrate 501. Next, multiple electronic components 510 are mounted on the first surface of the first substrate 501 via the multiple sets of conductive pads 502. In some embodiments, the multiple electronic components 510 may have different heights. Therefore, the top surfaces of the multiple electronic components 510 may not be flush with each other. Next, solder paste (not shown) is applied to the top surface of each electronic component 510. In some embodiments, the solder paste may include a metallic solder material and a flux material.

[0057] Next, additional solder paste is formed on each of the plurality of electronic components 510. Preferably, the additional solder paste may have a larger amount than the previously applied solder paste. The additional solder paste may include the same materials as the solder paste, i.e., metallic solder material and flux material.

[0058] Next, a reflow soldering process can be performed to reflow the additional solder paste and said solder paste, which is then merged together to form solder bumps 520. Multiple sets of solder bumps 520 can thus be formed and respectively mounted on multiple electronic components 510. In some embodiments, each of the multiple electronic components 510 may have two terminals 511. Each set of solder bumps 520 includes two solder bumps 520 formed on the respective top surfaces of the two terminals 511 of the electronic component 510. In some embodiments, the solder bumps 520 may have a relatively large diameter, which may be the same as or slightly smaller than the width of the terminals 511. The diameters (or heights) of the multiple sets of solder bumps 520 on different electronic components 510 may be the same or different. Furthermore, adjacent solder bumps 520 formed on adjacent electronic components 510 are not connected to each other to avoid short-circuit problems.

[0059] Next, as Figure 5B As shown, an encapsulation material 540 is formed on a first substrate 501 to encapsulate multiple sets of conductive pads 502, multiple sets of electronic components 510, and multiple sets of solder bumps 520. The encapsulation material 540 covers the top surface of the multiple sets of solder bumps 520.

[0060] Next, as Figure 5C As shown, a grinding process is performed to grind the encapsulating material 540 and multiple sets of solder bumps 520 on their top surfaces. After the grinding process, the top surfaces of the solder bumps 520 are flush with the top surface of the encapsulating material 540. More specifically, all solder bumps 520 are exposed from the top surface of the encapsulating material 540.

[0061] Next, as Figure 5DAs shown, a second substrate 550 is provided on which multiple sets of conductive pads 551 are formed. The second substrate 550 may include a first surface on which multiple sets of conductive pads 551 are formed and a second surface opposite to the first surface. Additional solder paste is applied to each set of conductive pads 551. Next, the first surface of the second substrate 550 may face the top surface of the encapsulation material 540 and the top surface of the solder bumps 520 to attach the multiple sets of conductive pads 551 to the multiple sets of solder bumps 520 respectively. More specifically, each set of conductive pads 551 is attached to one set of solder bumps 520 encapsulated by the encapsulation material 540 using additional solder paste applied therebetween. Next, a reflow soldering process may be performed to reflow additional solder paste to form multiple additional sets of solder bumps 553 to electrically connect the multiple sets of solder bumps 520 and the multiple sets of conductive pads 551 respectively.

[0062] Next, an additional encapsulating material 541 is formed between the encapsulating material 540 and the second substrate 550 to encapsulate additional solder bumps 553 and conductive pads 551 on the second substrate 550. The encapsulating material 540 and the additional encapsulating material 541 together form an encapsulation layer 542 between the first substrate 501 and the second substrate 550.

[0063] Other details regarding the structure and materials of the electronic device can be found in... Figure 1 , Figure 2 or Figure 3 The electronic devices shown have similar structures and materials, and for simplicity, they will not be described in detail here.

[0064] Although exemplary electronic devices and methods for manufacturing said electronic devices have been described in conjunction with the accompanying drawings, those skilled in the art will understand that modifications and adaptations can be made to the apparatus and methods without departing from the scope of the invention.

[0065] Various embodiments have been described herein with reference to the accompanying drawings. However, it will be apparent that various modifications and alterations can be made to the embodiments, and additional embodiments can be implemented, without departing from the broader scope of the invention as set forth in the appended claims. Furthermore, other embodiments will be apparent to those skilled in the art upon consideration of the description and practice of one or more embodiments of the invention disclosed herein. Therefore, it is intended that this application and the examples herein be considered exemplary only, wherein the true scope and spirit of the invention are indicated by the list of exemplary claims appended.

Claims

1. An electronic device, characterized in that, include: First substrate; Multiple electronic components mounted on the first substrate; Multiple sets of conductive structures, wherein each set of conductive structures is formed on one of the multiple electronic components and electrically connected to the one electronic component, such that the corresponding multiple top surfaces of the multiple sets of conductive structures are flush with each other; as well as The second substrate has multiple sets of conductive pads formed thereon, wherein each set of conductive pads is mounted on one set of conductive structures in the multiple sets of conductive structures via a set of solder bumps, such that the second substrate is mounted on the first substrate and electrically connected to the first substrate via the multiple electronic components, the multiple sets of conductive structures and the multiple sets of conductive pads.

2. The electronic device according to claim 1, characterized in that, The plurality of electronic components includes at least two electronic components with different heights.

3. The electronic device according to claim 2, characterized in that, The multiple sets of conductive structures on the at least two electronic components at different heights have different heights.

4. The electronic device according to claim 1, characterized in that, The plurality of conductive structures include a plurality of conductive pillars.

5. The electronic device according to claim 1, characterized in that, The plurality of conductive structures include a plurality of solder bumps.

6. The electronic device according to claim 1, characterized in that, Each of the plurality of electronic components has two terminals, each terminal extending from the top surface of the respective electronic component to the bottom surface, and each of the plurality of conductive structures includes two conductive structures formed on the two terminals of one of the plurality of electronic components.

7. The electronic device according to claim 1, characterized in that, The second substrate includes a first surface on which the plurality of conductive pads are formed, and a second surface opposite to the first surface, wherein the electronic device further includes an additional electronic module formed on the second surface of the second substrate.

8. The electronic device according to claim 7, characterized in that, The second substrate includes at least one set of conductive vias extending therethrough, and each set of conductive vias is aligned with one set of conductive pads among the plurality of conductive pads to electrically connect the additional electronic module to at least one of the plurality of electronic components.

9. The electronic device according to claim 1, characterized in that, The electronic device further includes an encapsulation layer formed between the first substrate and the second substrate, the encapsulation layer encapsulating the plurality of electronic components, the plurality of conductive structures and the plurality of conductive pads.

10. The electronic device according to claim 1, characterized in that, The electronic device further includes an interconnect structure extending from the first substrate to the second substrate to establish a direct electrical connection between the first substrate and the second substrate.

11. A method for manufacturing electronic devices, characterized in that, include: Provide a first substrate; Multiple electronic components are mounted on the first substrate; Multiple sets of conductive structures are formed on the multiple electronic components respectively; The multiple sets of conductive structures are ground so that their multiple top surfaces are flush with each other; as well as Each set of conductive pads is mounted on one of the multiple sets of conductive structures via a set of solder bumps, thereby mounting a second substrate with multiple sets of conductive pads together with the first substrate, such that the second substrate is electrically connected to the first substrate via the multiple electronic components, the multiple sets of conductive structures and the multiple sets of conductive pads.

12. The method according to claim 11, characterized in that, After mounting multiple electronic components on the first substrate and before forming multiple sets of conductive structures on the multiple electronic components, the method further includes applying solder paste to the multiple electronic components.

13. The method according to claim 11, characterized in that, After forming multiple sets of conductive structures on the plurality of electronic components, and before mounting the second substrate together with the first substrate, the method further includes: An encapsulation material is formed on the first substrate to encapsulate the plurality of electronic components and the plurality of conductive structures; Furthermore, the step of grinding the multiple sets of conductive structures also includes: The multiple sets of conductive structures and the encapsulating material are ground to make their multiple top surfaces flush with each other.

14. The method according to claim 11, characterized in that, The plurality of electronic components includes at least two electronic components with different heights.

15. The method according to claim 14, characterized in that, The multiple sets of conductive structures on the at least two electronic components at different heights have different heights.

16. The method according to claim 11, characterized in that, The plurality of conductive structures include a plurality of conductive pillars.

17. The method according to claim 11, characterized in that, The plurality of conductive structures include a plurality of solder bumps.

18. The method according to claim 11, characterized in that, The second substrate includes a first surface on which the plurality of conductive pads are formed, and a second surface opposite to the first surface, and the method further includes forming an additional electronic module on the second surface of the second substrate.

19. The method according to claim 18, characterized in that, The second substrate includes at least one set of conductive vias extending therethrough, and each set of conductive vias is aligned with one set of conductive pads among the plurality of conductive pads; and after the second substrate is mounted together with the first substrate, the additional electronic module is electrically connected to at least one of the plurality of electronic components.

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