Connection pins in a substrate

Abstract

This disclosure relates to connection pins in a substrate. A package device includes: a conductive pillar coupled to a substrate; and a connection pin located in an opening in the conductive pillar. The device also includes a molding compound located on the substrate and the conductive pillar. This disclosure also provides a method for coupling connection pins in a substrate without using pin holders. The method includes: forming openings in the molding compound and the conductive pillar; and inserting the pin into the opening of the conductive pillar.

Description

Technical Field

[0001] This disclosure relates to a packaged device having connection pins and a method of forming it without using pin holders. Background Technology

[0002] In the automotive industry, electric and hybrid propulsion vehicles have control electronics for electric motors. The control electronics associated with such vehicles include power modules and signal processing modules. Some exemplary control electronics include power phase inverters and rectifiers, which are capable of operating at very high voltages (up to 1200 V). Special connection structures exist, typically utilizing connection pins, for electrically coupling modules to each other and to loads such as electric motors or other vehicle components. These connection pins are significantly larger than those used in electronic circuits in other fields.

[0003] Modules are typically enclosed in a package made of insulating material (such as molding compound), which encloses the components with protruding leads for electrical connections.

[0004] Molded power modules are typically mounted on a shaped metal bracket (called a leadframe), which also forms pins for power and signal connections.

[0005] This involves considerable layout complexity to avoid the presence of parasitic components (often parasitic inductance), and requires precise design to ensure safe isolation distances (“gap and creepage”), and does not allow for efficient use of available space.

[0006] To maintain complex configurations, the methods for coupling the connection pins must maintain a high level of precision, as positioning is crucial. Known methods employ a grinding step to expose the connection area, followed by additional steps such as ultrasonic welding with a pin coupling device to ensure the connection pins are securely coupled in the desired orientation.

[0007] These methods exhibit potential yield losses and are expensive due to the additional steps and materials required. A faster method for coupling the connection pins is also needed. Summary of the Invention

[0008] A method is provided for coupling connection pins to a package device without using pin holders. The package device includes: a substrate having conductive pillars coupled to the connection pins; and a molding compound located on the substrate. The method includes: forming a groove in the conductive pillar and coupling the pin in the formed groove such that the inner surface of the conductive pillar is in direct contact with the pin.

[0009] Specifically, a method is provided, comprising: forming a groove in a first surface of a conductive pillar coupled to a substrate, the conductive pillar having a second surface opposite to the first surface, the second surface of the conductive pillar being coupled to the first surface of the substrate, and a molding compound located on the first surface of the substrate; and coupling a connection pin to the substrate, the connection pin being located in the groove of the conductive pillar.

[0010] Another method is provided, comprising: forming a plurality of grooves in a plurality of conductive pillars, each of the plurality of grooves being located in a first surface of a corresponding conductive pillar in the plurality of conductive pillars, each conductive pillar having a second surface opposite to the first surface, the second surface being coupled to a first surface of a substrate having a molding compound on the substrate; and coupling a plurality of pins to the substrate, each of the plurality of pins being located in a corresponding groove of a conductive pillar.

[0011] A device is also provided, comprising: a substrate having a first surface; a conductive post coupled to the first surface of the substrate, the conductive post having a first surface and an opposing second surface, the first surface of the conductive post being coupled to the substrate; connection pins coupled to the substrate, each connection pin being located in a corresponding conductive post; and molding compound located on the first surface of the substrate, the molding compound contacting the conductive post and the connection pins. Attached Figure Description

[0012] Figure 1 This is a perspective view of a packaged device coupled to connection pins according to an embodiment.

[0013] Figures 2A to 2D It is manufacturing Figure 1 The steps of packaging equipment.

[0014] Figure 3 This is a cross-sectional view of another embodiment of the packaging device. Detailed Implementation

[0015] Figure 1 It is a package device 100 coupled to connection pin 160. The package device 160 includes a substrate covered by an external molding compound or package block 110. The connection pin 160 extends from a conductive post coupled to the substrate through the molding compound 110 in a first direction or vertical direction.

[0016] The package device 100 has a substantially rectangular shape, including a top surface or side 100a opposite to a bottom surface or side 100b. A connection pin 160 extends through the top surface 100a of the device. The connection pin 160 has an end 160a on the outside of the package device 100.

[0017] The connection pins 160 are spaced apart from the outer edge of the package device 100. The pins 160 are arranged in a shape similar to the periphery of the package device 100. Each pin 160 is spaced apart from the others. The connection pins 160 are in direct contact with the molding compound 110.

[0018] Molding compound 110 is an insulating layer. Molding compound 110 is made of epoxy molding compound (EMC) or other suitable insulating material. The insulating material is a molding resin (such as molding compound, sealant, epoxy resin or other suitable insulating material).

[0019] In some embodiments, the packaging device 100 is a power module.

[0020] Figures 2A to 2D It is to manufacture with Figure 1 The steps of the package device 100 with connection pin 160.

[0021] The conductive pillar 240 is coupled to the top surface 220a of the substrate. A molding compound 210 is then formed on the conductive pillar 240 and the substrate 220. In some embodiments, the molding compound 210 is formed by depositing a molding compound layer on the substrate 220. In other embodiments, a mold is used to form the molding compound 210.

[0022] Figure 2A This is a cross-sectional view of a packaging device 200, which includes a molding compound or insulating layer 210 located on a substrate 220 and conductive pillars 240.

[0023] Substrate 220 is a semiconductor substrate or includes semiconductor material.

[0024] In this embodiment, substrate 220 is a multilayer substrate having multiple sublayers. The multilayer substrate is a direct-bonded copper (DBC) substrate, an active metal brazing (AMB) substrate, or other suitable multilayer substrate.

[0025] The substrate 220 includes an insulating layer 224 located between the first conductive layer 222 and the second conductive layer 226. The conductive layers 222 and 226 are made of a suitable conductive metal (such as copper). The insulating layer 224 is made of a suitable insulating material (such as ceramic).

[0026] The first conductive layer 222 is the bottom conductive layer of the substrate 220 and includes the bottom surface 220c of the substrate. The second conductive layer 226 is the top conductive layer and includes the top surface 220a of the substrate.

[0027] The substrate 220 extends along a first direction to the conductive pillar 240. The substrate 220 extends along a second direction transverse to the first direction or a horizontal direction.

[0028] In this embodiment, the insulating layer 224 has a first thickness or dimension in the second direction, which is larger than the first thickness or dimension of the conductive layers 222 and 226 in the second direction. In other words, the insulating layer 224 protrudes beyond the side surfaces of the conductive layers 222 and 226.

[0029] In some embodiments, the electronic component is coupled to and located on the substrate 220. The electronic component is a power component (such as a diode, transistor, thyristor, or IGBT) or a packaged discrete component.

[0030] Multiple conductive pillars 240 are coupled to the top surface 220a of the substrate. The conductive pillars 240 are spaced apart from each other. Molding material 210 surrounds or covers the pillars 240. The pillars 240 have a cylindrical shape or other suitable shape with a circular base and extending from the substrate 220.

[0031] In some embodiments, the post 240 is welded or glued to the substrate 220 by a bonding material 242 (such as a filler, conductive adhesive, glue, or other suitable bonding material). The bonding material 242 is located between the substrate 220 and the conductive post 240. The molding compound 210 is in contact with the bonding material 242.

[0032] The column 240 has dimensions that are generally associated with the dimensions of the device 200. In some embodiments, the column 240 has a height (particularly about 4.5 mm) between 2 mm and 7 mm, and a diameter (e.g. about 2 mm) between 1 mm and 5 mm.

[0033] The top surface 240a of the column is substantially flat and is used for coupling to other components. In this embodiment, the columns 240 have similar heights and dimensions to each other. In other embodiments, the columns 240 have different heights and dimensions to each other.

[0034] The pillars 240 are arranged in any suitable configuration. In some embodiments, the pillars 240 are arranged adjacent to the edge of the substrate 220. In other words, the central region of the substrate 220 does not include any pillars 240. In at least one embodiment, there are eight pillars 240, wherein two pillars 240 are spaced apart from the first edge or side of the substrate, and six pillars 140 are arranged along a second edge or side transverse to the first edge.

[0035] The column 240 is made of a conductive material (such as copper or other suitable conductive material).

[0036] In some embodiments, the pillar 240 is made of the same material as the conductive layer of the substrate 226.

[0037] In other embodiments, the pillar 240 is made of a different material than the conductive layer 226.

[0038] Molding material 210 extends on the top surface 220a of the substrate and covers the conductive pillar 240. The top surface 210a of the molding material is spaced apart from the top surface 240a of the conductive pillar. Molding material 210 is located on the top surface 240a and side surface 240b of the conductive pillar, as well as the top surface 220a and side surface 220b of the substrate. The side surface 210b of the molding material is spaced apart from the side surface 220b of the substrate and the side surface 240b of the conductive pillar. The bottom surface 210c of the molding material is adjacent to the bottom surface 220c of the substrate.

[0039] In this embodiment, the top surface 210a of the molding compound is substantially uniform and coplanar throughout. In other embodiments, the top surface 210a of the molding compound is warped or deformed and is not uniformly flat or coplanar. In other words, the thickness of the molding compound 210 varies above the pillar 240.

[0040] Next, a through-hole is formed in the molding compound 210 located on the conductive post 240. Forming the through-hole exposes the top surface of the conductive post 240.

[0041] Then, an opening or groove 250 is formed in the conductive post 240, such as Figure 2B and Figure 2C As shown.

[0042] Figure 2B This is a step of forming multiple grooves or holes 250 in the conductive post 240. As a result, a drilled post is formed, such as... Figure 2C As shown. Each conductive post 240 has a corresponding groove 250, as... Figure 2C As shown.

[0043] A groove 250 is formed on the post 240 through the top 210a of the molding compound. In the step of forming the groove 250, portions of the post 240 and the molding compound 210 are removed.

[0044] In some embodiments, a plurality of grooves 250 are formed simultaneously at the same time. In other embodiments, a plurality of grooves 250 are formed individually or sequentially.

[0045] Therefore, the inner surface 240d of the column and the inner surface 210d of the molding compound are exposed. The inner surface 240d of the column and the inner surface 210d of the molding compound are substantially coplanar. The inner surface 210d of the molding compound is transverse to the top surface 210a of the molding compound. A portion of the molding compound 210 protrudes or extends over the top surface 240a of the column.

[0046] A groove 250 is formed on the top of the pillar 240 and extends beyond the bottom surface of the pillar 240c into the substrate 220. The groove 250 is demarcated by the pillar 240 and the molding compound 210. Each groove 250 is demarcated by the inner surface 240d of the pillar. In other words, the groove 250 is not in the substrate 220.

[0047] The groove 250 is positioned at the center of the post 240. The groove 250 can be positioned within the post 240 as desired.

[0048] The groove 250 has a width or a first dimension between the side surfaces 240b of the post and a depth or a second dimension from the top surface 240a of the post.

[0049] The recess 250 is formed with a certain degree of tolerance to allow proper mounting or accommodating of the pin 260 without damage. The dimensions of the recess 250 allow for an interference fit with the pin 260.

[0050] In this embodiment, the width of the groove is less than the depth of the groove. In other embodiments, the size and shape of the groove are determined by the size and shape of the corresponding connection pin to be used.

[0051] In this embodiment, precision drilling is used to form the groove 250. A drill bit pre-drills the groove 250. In other embodiments, other suitable methods for etching the groove 250 are utilized.

[0052] During this groove-forming step, clamps or other suitable securing mechanisms are used to prevent displacement or movement of the packaging device 200. This helps ensure that the groove is positioned and sized as intended.

[0053] After the groove 250 is formed, in some embodiments the groove 250 is cleaned to remove debris and prepare for the next step of attaching the connection pin 260.

[0054] Next, the connection pin 260 is coupled to the substrate 220 via the conductive post 240, as follows: Figure 2D As shown. Figure 2D From Figure 1 The cross section starting from line A-A'.

[0055] Pin 260 is a solid cylindrical, tubular, or other suitable shape for attachment to other components. Pin 260 has a height that is greater than or equal to the height of pin 240.

[0056] In this embodiment, pin 260 is a press-fit pin. In other embodiments, pin 260 is a solder pin or other suitable connection pin.

[0057] In other embodiments, compatible pins or other suitable pins are used.

[0058] Pin 260 has a first free end 260a opposite to the second end 260b. The second end 260b is located in a recess 250 of post 240. The bottom surface 260c of the pin of the second end 260b is spaced apart from the bottom surface 240c of post 240. The side surface 260d of pin 260 is coupled to the inner surface of post 240d.

[0059] Pin 260 extends from post 240 through molding compound 210. First end 260a of pin is exposed from molding compound 210 and post 240. First end 260a of pin is configured to couple with other components.

[0060] The side surface 260d of the pin contacts the inner surface 210d of the molding compound. In some embodiments, the surfaces are coplanar.

[0061] Pin 260 allows current to flow and is made of copper or other suitable conductive material. In some embodiments, pin 260 is plated with copper-nickel.

[0062] In some embodiments, pin 260 includes a base portion that differs in shape or size from the main electrode portion of pin 260. In at least one embodiment, the base portion is substantially square or rectangular.

[0063] In some embodiments, pin 260 has one or more enlarged press-fit pin contact areas.

[0064] In some embodiments, pin 260 has a stop region or blocking element.

[0065] In other embodiments, pin 260 is a rod-shaped element. In these embodiments, some pins 260 have a base that is wider than the rod-shaped portion.

[0066] Pin 260 is inserted into recess 250 and coupled to conductive post 240. In some embodiments, pin 260 is attached via press-fit insertion, wherein force is applied to utilize press-fit technology. In some embodiments, a press-fit pin member is used to insert pin 260 into post 240.

[0067] In other embodiments, other solderless coupling methods were used to attach pin 260.

[0068] In this embodiment, an air gap or bubble 270 is formed below the pin 260 and in the post 240. The air gap 270 is located between the pin 260 and the bottom surface 240c of the post. The air gap 270 is located between the side surfaces 240b of the post.

[0069] In some embodiments, pin 260 is soldered or glued to post 240. A bonding material is provided between pin 260 and post 240. The bonding material is solder filler, conductive adhesive, or other suitable adhesive.

[0070] In other embodiments, pin 260 is soldered without filler by ultrasonic welding or other suitable methods.

[0071] In other embodiments, there is no air gap 270. In some embodiments, pin 260, adhesive material, or a combination thereof completely fills groove 250.

[0072] Figure 3 This is another embodiment of a packaged device 300 coupled to pin 360. In this embodiment, a packaged device 300 is used with... Figures 2A to 2D The same steps are used to form the encapsulation device 300, except that the top surface 310a of the molding compound is recessed below the top surface 340a of the pillar.

[0073] and Figure 2A Similarly, a packaging apparatus 300 is provided as a first step. The packaging apparatus 300 includes a molding compound 310 situated on a substrate having pillars 340.

[0074] In this embodiment, the molding compound 310 is not entirely on top of the pillar 340. Instead, the top surface 340a of the pillar is exposed above the molding compound 310. Only the side surfaces 340 of the pillar are in contact with the molding compound 310.

[0075] As a result, in this embodiment, such as Figure 2B and Figure 2C The step of forming the groove does not include removing a portion of the molding compound 310.

[0076] In this embodiment, the molding compound 310 does not contact the pin 360. The pin 360 only directly contacts the post 340. The top surface 310a of the molding compound is recessed from the first end of the pin 360 and the top surface of the post 340a.

[0077] In other embodiments, the top surface of the molding compound is coplanar with the top surface of the pillar.

[0078] Packaging devices 100, 200, and 300 are used in components for electric and hybrid vehicles, such as traction inverters, DC-DC converters, on-board chargers, and other suitable semiconductor components.

[0079] Packaging devices 100, 200, and 300 are compatible with both silicon carbide (SiC) and gallium nitride (GaN).

[0080] The various embodiments described above can be combined to provide other embodiments. If necessary, aspects of the embodiments can be modified to provide other embodiments using concepts from various patents, applications, and publications.

[0081] These and other changes can be made to the embodiments based on the detailed description above. Generally, the terminology used in the following claims should not be construed as limiting the claims to the specific embodiments disclosed in this specification and claims, but should be construed as including all possible embodiments and the full scope of equivalents enjoyed by such claims. Therefore, the claims are not limited to this disclosure.

Claims

1. A method comprising: A molding compound is formed on a conductive pillar and a substrate, the conductive pillar having a first surface opposite to a second surface, the first surface being coupled to a first surface of the substrate; A groove is formed in the second surface of the conductive post; as well as The connection pin is coupled to the substrate by inserting the connection pin into the groove of the conductive post.

2. The method of claim 1, wherein forming the groove is performed via drilling.

3. The method of claim 2, wherein the drilling includes drilling through the molding compound.

4. The method of claim 1, wherein coupling of the connection pin is performed via press-fit insertion.

5. The method of claim 1, wherein the connection pin extends through the molding compound.

6. The method of claim 1, wherein the molding compound completely covers the first surface of the substrate and the first surface of the conductive pillar.

7. The method of claim 1, wherein the groove in the conductive post has a bottom surface.

8. A method comprising: A through-hole is formed in the molding compound of a conductive post, the conductive post having a first surface coupled to a first surface of a substrate, the molding compound being located on the first surface of the substrate; An opening is formed on the second surface of the conductive post, the second surface being opposite to the corresponding first surface of the conductive post; as well as The pin is coupled to the substrate by inserting it into the opening of the conductive post.

9. The method of claim 8, wherein the substrate comprises ceramic and copper.

10. The method of claim 9, wherein the substrate is an active metal brazed AMB substrate.

11. The method of claim 8, wherein the molding compound completely covers the first surface of the plurality of conductive pillars.

12. The method of claim 8, wherein the molding compound portion covers the conductive post, and the first surface of the conductive post is exposed from the molding compound.

13. The method of claim 8, wherein the molding compound completely covers the first surface of the substrate.

14. An apparatus comprising: Substrate, having a first surface; A conductive pillar having a first surface, the first surface being coupled to the first surface of the substrate; Molding material, located on the first surface of the substrate and the first surface of the conductive pillar; An opening is located in the molding compound and the conductive post; as well as Connection pins are coupled to the substrate, with each connection pin located in a corresponding opening.

15. The device of claim 14, wherein the connection pin has a side surface that contacts the inner surface of the conductive post.

16. The device of claim 14, wherein a portion of the connection pin is recessed from the first surface of the conductive post.

17. The device of claim 14, comprising gaps in the conductive pillars, each gap being located between the substrate and a corresponding connection pin.

18. The device of claim 14, wherein the molding compound covers the first surface of the conductive post.

19. The device of claim 18, wherein the molding compound is in contact with the connection pin and the conductive post.

20. The device of claim 14, wherein the conductive post extends from the substrate in a first direction, and wherein the connection pin extends from the conductive post through the molding compound in the first direction.

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