Ball placement apparatus for chips and corresponding ball placement process method

Abstract

This invention provides a chip ball-mounting device and a corresponding ball-mounting process. The ball-mounting device includes a primary ball-mounting unit and a ball-mounting rework unit. The primary ball-mounting unit is used for automatically ball-mounting multiple chips on a board, while the ball-mounting rework unit is used for reworking defective individual chips. The primary ball-mounting unit includes a chip conveying module, a flux smoothing component, a solder ball feeding component, a flux transfer component, and a solder ball transfer component. The solder ball feeding component uses a structure combining oscillating feeding and sliding feeding to achieve full-slot arrangement of several solder ball slots, ensuring ball-mounting accuracy and feeding rate. The flux transfer component and the solder ball transfer component respectively achieve precise flux transfer and efficient solder ball adsorption and transfer. The ball-mounting rework unit includes a chip mounting base, a solder paste feeding rack, and a ball-mounting rack, which can realize the re-balling operation of defective chips. This invention has both automated batch ball-mounting of multiple chips on a board and rework and re-ball-mounting functions for defective single chips.

Description

Technical Field

[0001] This invention relates to the field of chip ball-mounting equipment, specifically to a ball-mounting device for chips and a corresponding ball-mounting process. Background Technology

[0002] Solder ball placement is a critical step in the chip packaging process, and its quality directly affects the reliability of the connection between the chip and external circuits. It mainly involves applying flux to the chip leads and placing solder balls to achieve the soldering connection between the chip and the external circuitry.

[0003] Existing chip ball-mounting equipment suffers from high empty solder ball rates and incomplete ball loading, making it difficult to guarantee ball loading rates and consequently affecting ball-mounting yield and work efficiency. Secondly, most existing equipment operates on continuous automated lines, lacking dedicated rework devices for defective chips after automated ball-mounting. Once defects such as missed placement or misalignment occur, the only option is a complete rework, requiring the removal of all solder balls from the entire board and re-placement in the ball-mounting equipment for secondary ball-mounting. This rework method, even for boards with only localized chip defects, necessitates reprocessing all chips, resulting in the unnecessary removal and remaking of solder balls from many defect-free chips. This leads to waste of solder ball materials, cleaning agents, flux, and other auxiliary materials, significantly increasing rework costs. Furthermore, the overall rework process is complex and time-consuming, severely impacting chip packaging production efficiency and product delivery cycles.

[0004] Therefore, we propose a chip ball-mounting device and a corresponding ball-mounting process to solve the above problems. Summary of the Invention

[0005] To address the aforementioned technical problems, this invention provides a chip ball-mounting device and a corresponding ball-mounting process. The present invention provides a chip ball-planting device, which includes an initial ball-planting device and a ball-planting rework device. The initial ball-planting device is used to plant balls on multiple chips on a whole board, and the ball-planting rework device is used to rework and plant balls on a single chip with defective ball-planting. The initial solder ball placement device includes a chip delivery module, a flux smoothing component, a solder ball feeding component, a flux transfer component, and a solder ball transfer component. The flux smoothing component and the solder ball feeding component are disposed on both sides of the chip delivery module. The flux transfer component is used to transfer the flux on the flux smoothing component to the chip of the chip delivery module. The solder ball transfer component is used to transfer the solder ball on the solder ball feeding component to the chip of the chip delivery module. The solder ball feeding assembly includes a base, a mounting plate, a solder ball fixture plate, and a solder ball material plate. The mounting plate is rotatably connected to the top of the base. The solder ball fixture plate is disposed at one end of the mounting plate. The upper surface of the solder ball fixture plate is provided with a plurality of solder ball grooves. The upper surface of the solder ball fixture plate is flush with the upper surface of the mounting plate. The top of the mounting plate is slidably connected to the solder ball material plate. A first Y-axis linear drive mechanism is mounted on the mounting plate. The output end of the first Y-axis linear drive mechanism is fixedly connected to the solder ball material plate. The solder ball material plate is provided with a receiving cavity. The receiving cavity extends through the upper surface of the mounting plate. The mounting plate is slidably closed at the bottom of the receiving cavity. A plurality of solder balls are disposed in the receiving cavity. By rotating and tilting the mounting plate and the solder ball fixture plate in coordination with the movement of the solder ball material plate, the solder balls in the receiving cavity are moved into the solder ball grooves. The ball rework device includes a chip mounting base, a solder paste loading rack, and a ball rework rack. The chip mounting base includes a base plate and a support plate disposed on the top of the base plate. The top of the support plate is provided with a chip mounting slot, and the top of the ball-mounting frame is provided with a receiving slot for accommodating solder balls. The solder paste feeder is provided with a feeding hole corresponding to the chip mounting slot, and the ball-mounting frame is provided with a ball-mounting hole corresponding to the chip mounting slot.

[0006] In this invention, the mounting plate includes an upper ball position, a ball supply position, and a return position on its rotation trajectory; When the mounting plate is located at the upper ball position, the end of the mounting plate near the solder ball fixture plate is lower than the end away from the solder ball fixture plate, so that as the solder ball material plate moves, the solder balls in the receiving cavity can move into the solder ball groove; When the mounting plate is in the return position, the end of the mounting plate near the solder ball fixture plate is higher than the end away from the solder ball fixture plate, so that the solder balls in the receiving cavity flow back to the end away from the solder ball fixture plate; When the mounting plate is located at the ball supply position, the upper surfaces of both the mounting plate and the solder ball fixture plate are horizontal, so that the solder ball transfer assembly can pick up the solder balls on the solder ball fixture plate. The solder ball fixture plate has a mounting cavity, and the side of the mounting cavity near the mounting plate is open. The solder ball feeding assembly also includes a movable plate, which is located in the mounting cavity and slidably disposed on the mounting plate. The movable plate is provided with a receiving groove corresponding to the solder ball groove, and the receiving groove is in communication with the solder ball groove. When the mounting plate is located at the upper ball position or the ball supply position, the receiving groove and the solder ball groove are directly opposite each other. When the mounting plate is located at the return position, the receiving groove and the solder ball groove are misaligned to a certain extent to form a clamping constraint on the solder balls located in the receiving groove and the solder ball groove.

[0007] Wherein, one end of the mounting plate on which the solder ball fixture plate is mounted is the first end, and the other end of the mounting plate is the second end; The solder ball feeding assembly also includes a follower, which has a U-shaped structure and is located inside the mounting cavity and surrounds three sides of the movable plate. The mounting plate is provided with a first slide rail and two second slide rails located on both sides of the first slide rail. The extension direction of the first slide rail and the second slide rail is parallel to the sliding direction of the solder ball plate. The movable plate is slidably connected to the first slide rail. The two ends of the follower are slidably connected to the corresponding second slide rails. The middle section of the follower is slidably connected to the movable plate. The sliding direction between the follower and the movable plate is perpendicular to the upper surface of the movable plate. The end of the second slide rail closer to the second end of the mounting plate is higher. When the mounting plate is located at the upper ball position or the ball supply position, the movable plate or the follower contacts the inner wall surface of the mounting cavity near the first end of the mounting plate; When the mounting plate is located at the return position, the movable plate or the follower is a set distance away from the inner wall surface of the first end of the mounting cavity near the mounting plate.

[0008] In this invention, the flux smoothing assembly includes a mounting frame, an X-axis linear drive mechanism, a flux smoothing plate, and a flux trough. The top of the mounting frame is fixed with a flux smoothing plate, and the top of the flux smoothing plate is provided with a flux smoothing groove. The bottom of the mounting frame is fixed with an X-axis linear drive mechanism, and the output end of the X-axis linear drive mechanism is fixed with a flux trough. The outlet of the flux trough is positioned directly opposite the flux smoothing groove.

[0009] In this invention, the flux transfer assembly includes a first upright plate and a first X-axis cylinder, a first slider, a first Z-axis cylinder, and a first transfer seat fixed to one side of the first upright plate. The output end of the first X-axis cylinder is fixed with the first slider, the top of the first transfer seat is fixed with the first Z-axis cylinder, the output end of the first Z-axis cylinder is fixedly connected to the first slider, and the bottom of the first transfer seat is fixed with a plurality of flux transfer columns.

[0010] In this invention, the solder ball transfer assembly includes a second upright plate and a second X-axis cylinder, a second slider, a second Z-axis cylinder, and a second transfer seat fixed to one side of the second upright plate. The output end of the second X-axis cylinder is fixed to the second slider, and the top of the second transfer seat is fixed to the second Z-axis cylinder. The output end of the second Z-axis cylinder is fixedly connected to the second slider. The bottom of the second transfer seat is provided with a plurality of solder ball adsorption holes, and the side wall of the second transfer seat is provided with an air extraction hole communicating with the solder ball adsorption holes. The air extraction hole is externally connected to an air extraction assembly.

[0011] In this invention, a transparent plate is provided to enclose the upper surface of the receiving cavity, and a feed inlet is provided on the transparent plate.

[0012] In this invention, both the solder paste loading rack and the ball-planting rack have positioning grooves at their bottoms that cooperate with the positioning of the support plate. The depth of the positioning groove is less than the thickness of the support plate. Multiple positioning posts are provided on the base plate. The bottom of the solder paste loading rack and the ball-planting rack are both provided with positioning holes for positioning and connection with the positioning posts.

[0013] The solder paste feeding rack is detachably equipped with a solder paste feeding plate, and the feeding hole is located on the solder paste feeding plate. The solder paste feeding rack includes two stacked first plates, which are fixedly connected by screws. The solder paste feeding plate is clamped between the two first plates. The ball-planting frame is detachably equipped with a ball-planting plate, and the ball-planting hole is provided on the ball-planting plate. The ball-planting frame includes two stacked second plates, which are fixedly connected by screws. The ball-planting plate is clamped between the two second plates. When the solder paste plate or the ball-planting plate comes into contact with the carrier plate, the positioning post is at a set distance from the inner top surface of the positioning hole.

[0014] The present invention also includes a method for a chip ball-mounting process, which uses the above-mentioned ball-mounting equipment to perform a ball-mounting operation on the chip, comprising the following steps: Step S1: Control the conveying module to move the chip to be implanted to the working position; Step S2: Control the flux transfer component to transfer the flux on the flux smoothing component to the chip to be implanted in the chip delivery module; Step S3: Control the mounting plate to rotate to the upper ball position, and control the solder ball plate to move so that the solder balls in the receiving cavity move into the solder ball groove; Step S4: Control the mounting plate to rotate to the return position, so that the solder balls in the receiving cavity flow back to the end away from the solder ball fixture plate, and control the solder ball material plate to move to the initial position; Step S5: Control the mounting plate to rotate to the ball supply position, and control the solder ball transfer assembly to transfer the solder balls on the solder ball fixture plate to the chip to be implanted in the chip delivery module; Step S6: Control the conveying module to output the chip after the ball-planting is completed; Step S7: Inspect and separate the defective chips from the multiple chips on the board and scrape off the defective solder balls. Use a solder ball rework device to apply solder paste to the defective chips in sequence through the solder paste feeder and then manually re-ball them through the solder ball reworker to complete the rework.

[0015] Compared with related technologies, the present invention provides the following beneficial effects: The chip ball-mounting equipment of the present invention, by setting up an initial ball-mounting device and a ball-mounting rework device, performs ball-mounting on multiple chips on the entire board, and the ball-mounting rework device reworks individual chips with defective balls. The ball-mounting rework device, through the combination of a chip mounting base, a replaceable solder paste feeder, and a ball-mounting frame, can quickly reapply solder paste and manually re-mount individual defective chips separated after automatic ball-mounting, without the need for overall rework of all chips on the entire board, avoiding the repeated removal and fabrication of solder balls for defective chips, significantly reducing the consumption of auxiliary materials such as solder balls, flux, and cleaning agents, and significantly saving rework costs and time, resulting in low rework costs and high efficiency.

[0016] In addition, by combining the swing of the mounting plate (upper ball position, return position, and ball supply position) in the solder ball feeding assembly with the sliding feeding of the solder ball material plate, and with the misaligned clamping constraint of the solder ball fixture plate and the movable plate, it is possible to effectively achieve stable full-slot feeding of solder balls in the solder ball tank, avoid empty tanks and stacking, and significantly improve the ball loading rate and ball yield. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the automatic ball-planting device of the present invention; Figure 2 This is a schematic diagram of the solder ball feeding assembly structure of the present invention; Figure 3 This is a front view of the solder ball feeding assembly of the present invention; Figure 4 This is a schematic diagram of the solder ball trough structure of the present invention; Figure 5 This is a partially exploded structural diagram of the solder ball feeding assembly in this invention; Figure 6 This is a partial structural cross-sectional view of the solder ball feeding assembly in this invention; Figure 7 This is a schematic diagram of the solder ball plate structure of the present invention; Figure 8 This is a schematic diagram of the chip delivery module structure of the present invention; Figure 9 This is a schematic diagram of the flux smoothing component structure of the present invention; Figure 10 This is a schematic diagram of the first transfer seat structure of the present invention; Figure 11 This is a schematic diagram of the second transfer seat structure of the present invention; Figure 12 This is an exploded structural diagram of the ball-planting repair device of the present invention; Figure 13 This is a structural schematic diagram of the ball-planting repair device of the present invention from the bottom view.

[0018] Labels in the diagram: 1. Chip delivery module; 2. Flux smoothing assembly; 3. Solder ball feeding assembly; 4. Flux transfer assembly; 5. Solder ball transfer assembly; 6. Base; 7. Mounting plate; 71. First slide rail; 72. Second slide rail; 8. Gear motor; 9. Solder ball fixture plate; 10. Connecting seat; 11. Solder ball trough; 12. Solder ball material plate; 13. Receiving cavity; 14. Movable plate; 141. Receiving slot; 15. Transparent plate; 151. Feed port; 16. First Y-axis linear drive mechanism; 17. Follower; 18. Second Y-axis linear drive mechanism; 19. Chip fixture; 20. Mounting bracket; 21. X-axis linear drive mechanism; 22. Flux smoothing plate; 23. Flux material trough; 24. Flux smoothing trough; 25. Discharge port; 26. First upright plate; 2 7. First X-axis cylinder; 28. First slider; 29. ​​First Z-axis cylinder; 30. First transfer seat; 31. Flux transfer post; 32. Second vertical plate; 33. Second X-axis cylinder; 34. Second slider; 35. Second Z-axis cylinder; 36. Second transfer seat; 37. Solder ball adsorption hole; 38. Air extraction hole; 39. Guide rail; 40. Lead screw handwheel; 41. Ball rework device; 42. Chip mounting base; 43. Solder paste feeder; 431. Solder paste board; 4311. Feeding hole; 44. Ball mounting frame; 441. Ball mounting board; 4411. Ball mounting hole; 442. Receiving groove; 443. Guide groove; 45. Support plate; 451. Chip mounting slot; 452. Clearance groove; 46. Base plate; 461. Positioning post; 47. Positioning groove; 48. Positioning hole. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] The directional terms mentioned in this invention, such as "up", "down", "front", "back", "left", "right", "inner", "outer", "side", "top" and "bottom", are only for reference to the orientation of the accompanying drawings. The directional terms used are for the purpose of explaining and understanding this invention, and are not intended to limit this invention.

[0021] The terms "first" and "second" used in the terminology of this invention are for descriptive purposes only and should not be construed as indicating or implying relative importance, nor as limiting the order of events.

[0022] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, a connection can be a detachable connection or a connection of an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components or an interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0023] Existing chip ball-mounting equipment suffers from problems such as high empty solder ball rates and incomplete ball loading, making it difficult to guarantee the ball loading rate, which in turn affects the ball-mounting yield and work efficiency. The rework process is also complex, time-consuming, and results in low production efficiency.

[0024] The following is a preferred embodiment of a chip ball-planting device provided by the present invention, which can solve the above-mentioned technical problems.

[0025] Please refer to the following: Figure 1 This embodiment provides a ball-mounting device for chips, comprising a primary ball-mounting device and a ball-mounting rework device 41. The primary ball-mounting device is used to ball-mount multiple chips on a board, and the ball-mounting rework device 41 reworks defective individual chips. It should be noted that the ball-mounting rework device 41 can also rework multiple separated individual chips at once. The primary ball-mounting device provides sufficient solder balls and high ball-mounting accuracy, while the ball-mounting rework device can quickly process defective products. It integrates automatic ball-mounting of multiple chips on a board and rework of defective individual chips, making it suitable for large-scale chip production. Overall, it boasts high efficiency and low cost.

[0026] The initial solder ball feeding device includes a chip delivery module 1, a flux smoothing component 2, a solder ball feeding component 3, a flux transfer component 4, and a solder ball transfer component 5.

[0027] Flux smearing assembly 2 and solder ball feeding assembly 3 are located on both sides of chip delivery module 1, which serves as the chip carrier delivery module. Flux transfer assembly 4 is used to transfer the flux on flux smearing assembly 2 onto the chip in chip delivery module 1, and solder ball transfer assembly 5 is used to transfer the solder balls on solder ball feeding assembly 3 onto the chip in chip delivery module 1.

[0028] Please refer to Figures 2-7 The solder ball feeding assembly 3 is used to sort and feed solder balls into the solder ball tank 11. It includes a base 6, a mounting plate 7, a solder ball fixture plate 9, and a solder ball material plate 12.

[0029] The base 6 is fixed to the frame, and the mounting plate 7 is rotatably connected to the top of the base 6. A solder ball fixture plate 9 is provided at one end of the mounting plate 7. The upper surface of the solder ball fixture plate 9 is provided with several solder ball grooves 11, which are arranged according to the chip pin array. The upper surface of the solder ball fixture plate 9 is flush with the upper surface of the mounting plate 7. A solder ball material plate 12 is slidably connected to the top of the mounting plate 7. A first Y-axis linear drive mechanism 16 is mounted on the mounting plate 7. The output end of the first Y-axis linear drive mechanism 16 is fixedly connected to the solder ball material plate 12. The solder ball material plate 12 is provided with a receiving cavity 13, which extends through to the upper surface of the mounting plate 7. The mounting plate 7 is slidably closed at the bottom of the receiving cavity 13. Several solder balls are provided in the receiving cavity 13. By rotating and tilting the mounting plate 7 and the solder ball fixture plate 9 in coordination with the movement of the solder ball material plate 12, the solder balls in the receiving cavity 13 are moved into the solder ball grooves 11.

[0030] Specifically, a connecting seat 10 can be installed at the bottom of the mounting plate 7. The connecting seat 10 is rotatably connected to the base 6. A geared motor 8 is installed on the base 6. The connecting seat 10 is connected to the output end of the geared motor 8. The geared motor 8 drives the mounting plate 7 and the solder ball fixture plate 9 to reciprocate around the X-axis at a small angle. Of course, it is conceivable that a swing arm can also be rotatably installed on the base 6. The mounting plate 7 is connected to the swing arm, and a linear drive mechanism drives the swing arm to rotate, thereby driving the mounting plate 7 to swing.

[0031] In this embodiment, a transparent plate 15 is provided to enclose the upper surface of the receiving cavity 13, and a feed port 151 is provided on the transparent plate 15. The transparent plate 15 seals and covers the top of the receiving cavity 13, and the feed port 151 is used to replenish solder balls. The first Y-axis linear drive mechanism 16 drives the solder ball plate 12 to slide along the mounting plate 7, and cooperates with the X-axis swing of the reduction motor 8. The solder balls in the receiving cavity 13 are evenly filled into the solder ball groove 11 as they slide, and the solder balls fall completely into the solder ball groove 11, with no empty grooves and no stacked materials, thus completing the precise sorting of solder balls.

[0032] Solder ball transfer assembly 5 performs solder ball adsorption and automatic ball placement. Solder ball transfer assembly 5 includes a second vertical plate 32 and a second X-axis cylinder 33, a second slider 34, a second Z-axis cylinder 35, and a second transfer seat 36 fixed to one side of the second vertical plate 32.

[0033] The second upright plate 32 is symmetrically arranged with the first upright plate 26. The second X-axis cylinder 33 drives the second slider 34 to slide along the guide rail 39, and the second Z-axis cylinder 35 drives the second transfer seat 36 to rise and fall. The solder ball adsorption holes 37 at the bottom of the second transfer seat 36 correspond one-to-one with the solder ball grooves 11. It should be noted that the bottom of the second transfer seat 36 can be provided with multiple hollow protrusions for setting the solder ball adsorption holes 37. The air extraction hole 38 is connected to an external vacuum extraction component. When the vacuum extraction component is activated, the solder ball adsorption holes 37 form a negative pressure, accurately adsorbing the solder balls on the solder ball fixture plate 9. The second X-axis cylinder 33 and the second Z-axis cylinder 35 work together to drive the second transfer seat 36 to move above the chip delivery module 1. The vacuum is then turned off to release the negative pressure, and the solder balls fall accurately into the chip flux position, completing the automatic ball placement.

[0034] Please refer to Figure 2 , Figure 5 and Figure 6 In this embodiment, the mounting plate 7 includes an upper ball position, a ball supply position, and a return position on its rotation trajectory.

[0035] When mounting plate 7 is in the upper ball position, that is, when mounting plate 7 is pressed... Figure 6 The state after rotating counterclockwise by a certain angle. At this time, the end of the mounting plate 7 near the solder ball fixture plate 9 is lower than the end away from the solder ball fixture plate 9, so that as the solder ball material plate 12 moves, the solder balls in the receiving cavity 13 can move into the solder ball groove 11.

[0036] It should be noted that when the solder ball plate 12 is in the initial position, it is misaligned with the solder ball fixture plate 9. When the mounting plate 7 is in the upper ball position, the solder balls in the receiving cavity 13 automatically roll to the end of the receiving cavity 13 near the solder ball fixture plate 9 and form a certain accumulation. Then, as the solder ball plate 12 moves from the initial position to the direction near the solder ball fixture plate 9, the accumulated solder balls can gradually move and fill all the solder ball slots 11 in sequence, resulting in a high filling rate and a high slot fullness rate.

[0037] When mounting plate 7 is in the return position, that is, when mounting plate 7 is pressed... Figure 6 The state after rotating clockwise by a certain angle. The end of the mounting plate 7 near the solder ball fixture plate 9 is higher than the end away from the solder ball fixture plate 9, so that the solder balls in the receiving cavity 13 flow back to the end away from the solder ball fixture plate 9.

[0038] When the mounting plate 7 is in the ball supply position, that is, when it is in the ball supply position... Figure 6 In this state, the upper surfaces of the mounting plate 7 and the solder ball fixture plate 9 are both horizontal, so that the solder ball transfer assembly 5 can pick up the solder balls on the solder ball fixture plate 9.

[0039] The solder ball fixture plate 9 has a mounting cavity, and the side of the mounting cavity near the mounting plate 7 is open. The solder ball feeding assembly 3 also includes a movable plate 14, which is located in the mounting cavity and slidably disposed on the mounting plate 7. The movable plate 14 is provided with a receiving groove 141 corresponding to the solder ball groove 11, and the receiving groove 141 is connected to the solder ball groove 11.

[0040] When the mounting plate 7 is in the upper ball position or the ball supply position, the receiving groove 141 and the solder ball groove 11 are directly opposite each other. When the mounting plate 7 is in the return position, the receiving groove 141 and the solder ball groove 11 are misaligned to a certain extent, so as to form a clamping constraint on the solder balls located in the receiving groove 141 and the solder ball groove 11. This can largely prevent the solder balls in the receiving cavity 13 from being carried out of the solder ball groove 11 during the return movement, which would cause some solder ball grooves 11 to become empty grooves.

[0041] Preferably, the inner diameter of the receiving groove 141 is equal to the inner diameter of the solder ball groove 11.

[0042] More specifically, one end of the mounting plate 7 that holds the solder ball fixture plate 9 is designated as the first end, and the other end of the mounting plate 7 is designated as the second end.

[0043] The solder ball feeding assembly 3 also includes a follower 17, which has a U-shaped structure and is located within the mounting cavity, surrounding three sides of the movable plate 14. It can be understood that the follower 17 can be located at one end of the movable plate 14 near the first end of the mounting plate 7, or it can be... Figure 5 Figure 6 As shown, the follower 17 is located at one end of the movable plate 14 near the second end of the mounting plate 7.

[0044] The mounting plate 7 is provided with a first slide rail 71 and two second slide rails 72 located on both sides of the first slide rail 71. The extension directions of the first slide rail 71 and the second slide rail 72 are parallel to the sliding direction of the solder ball plate 12. The movable plate 14 is slidably connected to the first slide rail 71. The two ends of the follower 17 are slidably connected to the corresponding second slide rails 72, and the middle section of the follower 17 is slidably connected to the movable plate 14. The sliding direction between the follower 17 and the movable plate 14 is perpendicular to the upper surface of the movable plate 14. The end of the second slide rail 72 closer to the second end of the mounting plate 7 is higher.

[0045] When the mounting plate 7 is in the upper ball position or the ball supply position, the movable plate 14 or the follower 17 contacts the inner wall surface of the mounting cavity near the first end of the mounting plate 7. Since the end of the second slide rail 72 near the second end of the mounting plate 7 is higher, the follower 17 will have the force to slide towards the lower end, so that the receiving groove 141 can be directly aligned with the solder ball groove 11. This facilitates the filling of solder balls into the solder ball groove 11 and the receiving groove 141, and also facilitates the solder ball transfer assembly 5 to pick up the solder balls on the solder ball fixture plate 9.

[0046] When the mounting plate 7 is in the return position, the movable plate 14 or the follower 17 is a set distance away from the inner wall surface of the mounting cavity near the first end of the mounting plate 7. At this time, the mounting plate 7 rotates at a large angle, making the first end of the mounting plate 7 higher than the second end. This makes the end of the second slide rail 72 near the second end of the mounting plate 7 lower (relative to the horizontal plane). At this time, the follower 17 will have the force to slide towards the second end of the mounting plate 7, so that the receiving groove 141 can be misaligned with the solder ball groove 11 to a set degree, so as to form a clamping constraint on the solder balls located in the receiving groove 141 and the solder ball groove 11, ensuring that the solder balls stay more stably in the solder ball groove 11 and the receiving groove 141.

[0047] As the mounting plate 7 rotates, the follower 17 automatically slides obliquely, thereby controlling the movement of the movable plate 14 and thus controlling the accommodating groove 141 and the solder ball groove 11 to either be aligned or misaligned to clamp and constrain the solder balls. The top surface of the movable plate 14 can maintain a good relative positional relationship with the solder ball fixture plate 9, resulting in structural stability.

[0048] Please refer to Figure 8 In this embodiment, the second Y-axis linear drive mechanism 18 is fixedly mounted on the equipment frame, and the chip fixture 19 is fixedly connected to the output end of the second Y-axis linear drive mechanism 18. The chip fixture 19 is provided with a positioning groove that matches the shape of the chip to ensure that the chip is fixed firmly without displacement. The second Y-axis linear drive mechanism 18 drives the chip fixture 19 to move directionally along the Y-axis to complete chip feeding, flux application, automatic ball placement, and unloading.

[0049] Please refer to Figure 9 The flux smoothing component 2 is located on one side of the chip delivery module 1. The flux smoothing plate 22 is horizontally fixed to the top of the mounting frame 20. The flux smoothing groove 24 is a precision groove structure used to carry flux of uniform thickness. The X-axis linear drive mechanism 21 is fixed to the bottom of the mounting frame 20. The flux tank 23 is connected to the output end of the X-axis linear drive mechanism 21. The discharge port 25 is perpendicular to the flux smoothing groove 24. The X-axis linear drive mechanism 21 drives the flux tank 23 to move back and forth at a uniform speed along the X-axis. The flux flows out evenly from the discharge port 25 and fills the flux smoothing groove 24, forming a flux layer of uniform thickness, ensuring that the flux transfer column 31 is evenly coated.

[0050] Please refer to Figure 1 and Figure 10The flux transfer assembly 4 performs flux transfer operations. The first upright plate 26 is vertically fixed to the frame. The first X-axis cylinder 27 drives the first slider 28 to slide along the guide rail 39 horizontally. The first Z-axis cylinder 29 drives the first transfer seat 30 to rise and fall vertically. The number and spacing of the flux transfer columns 31 at the bottom of the first transfer seat 30 correspond perfectly to the chip pins. The first transfer seat 30 moves above the flux leveling assembly 2. The first Z-axis cylinder 29 drives the flux transfer columns 31 to descend and pick up the flux. Then it moves above the chip delivery module 1 to accurately apply the flux to each chip pin without any missed application or overflow.

[0051] In this embodiment, the ball rework device 41 includes a chip mounting base 42, a solder paste loading rack 43, and a ball rework rack 44.

[0052] Please refer to Figure 12 and Figure 13 The chip mounting base 42 includes a base plate 46 and a support plate 45 disposed on top of the base plate 46. The top of the support plate 45 has a chip mounting slot 451. The bottom of both the solder paste feeder 43 and the ball-mounting frame 44 has positioning slots 47 that mate with the support plate 45 to ensure precise alignment of components during operation. The top of the ball-mounting frame 44 has a receiving slot 442 for accommodating solder balls. The solder paste feeder 43 has feeding holes 4311 corresponding to the chip mounting slot 451 for accurately printing solder paste onto the ball-mounting area of ​​the chip. The solder paste is a paste-like mixture of solder powder, flux, and other additives. The ball-mounting frame 44 has ball-mounting holes 4411 corresponding to the chip mounting slot 451 for guiding the solder balls onto the solder paste-coated chip pads.

[0053] In this embodiment, the depth of the positioning groove 47 is less than the thickness of the support plate 45 to prevent interference between the solder paste feeder 43 or the ball-mounting frame 44 and the base plate 46, ensuring stable positioning. The base plate 46 is provided with multiple positioning posts 461, and the bottom of both the solder paste feeder 43 and the ball-mounting frame 44 is provided with positioning holes 48 for positioning and connecting with the positioning posts 461, thereby achieving fast, repeatable, and precise installation.

[0054] In this embodiment, a solder paste loading plate 431 is detachably provided inside the solder paste loading rack 43, and a loading hole 4311 is provided on the solder paste loading plate 431.

[0055] Specifically, the solder paste loading rack 43 includes two stacked first boards, which are fixedly connected by screws, and the solder paste loading plate 431 is clamped between the two first boards. This facilitates the replacement of different solder paste loading plates 431 according to different chip specifications, improving versatility.

[0056] In this embodiment, a planting plate 441 is detachably provided inside the planting frame 44, and planting holes 4411 are provided in the planting plate 441.

[0057] Specifically, the ball-mounting frame 44 includes two stacked second plates, which are fixedly connected by screws, with the ball-mounting plate 441 clamped between the two second plates. This allows for the replacement of the ball-mounting plate 441 according to different chip specifications, accommodating the repair of chips of different models and specifications, and improving versatility.

[0058] In this embodiment, the carrier plate 45 is detachably fixed to the base plate 46 by connecting screws. The carrier plate 45 has notches at its four corners, and the connecting screws are located within these notches. This prevents the screw heads from protruding and affecting the positioning of the solder paste feeder 43 or the ball-mounting rack 44.

[0059] In this embodiment, a guide channel 443 is provided on one side of the ball-planting rack 44. One end of the guide channel 443 is connected to the receiving tank 442 and is flush with the inner bottom surface of the receiving tank 442. This facilitates the smooth discharge of solder balls from the receiving tank 442 through the guide channel 443 for recycling or cleaning.

[0060] In this embodiment, clearance grooves 452 are provided on both sides of the chip mounting slot 451 to facilitate the placement and removal of the chip within the chip mounting slot 451.

[0061] Optionally, the top of the carrier board 45 is provided with multiple chip mounting slots 451, the solder paste feeder 43 is provided with multiple feed holes 4311, and the ball-mounting frame 44 is provided with multiple ball-mounting holes 4411. This allows for simultaneous ball-mounting of multiple single chips to be reworked, further improving rework efficiency.

[0062] Before rework, defective solder balls that are misaligned, poorly soldered, or missing must be removed from the chip. The solder paste applicator 43 is positioned and installed on the chip mounting base 42. Solder paste is then applied to the pins using the solder paste applicator 431. The ball placement frame 44 is then replaced, and the balls are manually re-placed using the ball placement board 441, completing the rework of the defective product. This process reduces rework costs, improves rework efficiency, and features a simple overall structure and convenient operation.

[0063] When using the chip ball-mounting equipment of the present invention, the chip to be processed is first placed on the chip fixture 19, and the second Y-axis linear drive mechanism 18 drives the chip fixture 19 to move to the flux application station. The flux smoothing component 2 evenly applies flux to the flux smoothing groove 24 to form a flux layer of uniform thickness.

[0064] Subsequently, the first X-axis cylinder 27 drives the first transfer seat 30 to move above the flux leveling component 2, and the first Z-axis cylinder 29 drives the flux transfer column 31 to descend and pick up the flux, and then moves it above the chip delivery module 1 to accurately transfer the flux to the pin position of each chip, ensuring no missed coating and no overflow.

[0065] After flux application is completed, the chip fixture 19 continues to move to the automatic ball placement station (the flux application station and the automatic ball placement station can be the same location). At this time, the solder ball feeding assembly 3 performs a sorting and feeding operation.

[0066] First, the geared motor 8 drives the mounting plate 7 to rotate to the upper ball position (the end near the solder ball fixture plate 9 is lower than the other end), and at the same time, the first Y-axis linear drive mechanism 16 drives the solder ball material plate 12 to slide from the initial position toward the solder ball fixture plate 9. The solder balls in the receiving cavity 13 automatically accumulate at the front end under the action of gravity, and as the solder ball material plate 12 moves, they sequentially and evenly fill all the solder ball slots 11 and the corresponding receiving slots 141, achieving full-slot sorting.

[0067] Then, the geared motor 8 drives the mounting plate 7 to rotate to the return position (the end near the solder ball fixture plate 9 is higher than the other end). During this process, the follower 17 slides along the second slide rail 72 towards the second end (lower end) of the mounting plate 7, driving the movable plate 14 to move, causing the receiving groove 141 and the solder ball groove 11 to be misaligned to a certain degree, thereby forming a clamping constraint on the filled solder balls and effectively preventing them from being carried out in subsequent actions. At the same time, the excess solder balls in the receiving cavity 13 flow back to the end away from the solder ball fixture plate 9 under the action of gravity. After that, the first Y-axis linear drive mechanism 16 drives the solder ball material plate 12 to reset to the initial position.

[0068] Finally, the geared motor 8 drives the mounting plate 7 to rotate to the ball supply position (the upper surface is horizontal), the misalignment between the receiving groove 141 and the solder ball groove 11 is released, and the receiving groove 141 and the solder ball groove 11 are aligned again, which facilitates the solder ball transfer assembly 5 to pick up the solder balls on the solder ball fixture plate 9.

[0069] Specifically, the suction component creates negative pressure in the solder ball adsorption hole 37 through the suction hole 38. The second X-axis cylinder 33 and the second Z-axis cylinder 35 work together to drive the second transfer seat 36 to move above the solder ball fixture plate 9 and descend, accurately adsorbing all the solder balls in the solder ball groove 11.

[0070] Next, the second transfer seat 36 moves above the chip to be ball-planted in the chip delivery module 1, the vacuum is turned off to release the negative pressure, and the solder balls fall precisely onto the chip pins that have been coated with flux, completing the automatic ball-planting. After the ball-planting is completed, the chip fixture 19 moves to the unloading station.

[0071] Then, the qualified chips in the whole board can be detected and separated from the individual chips with poor ball placement.

[0072] For chips with defective solder balls that have been separated, a solder ball rework device 41 is used for rework. During operation, the defective chip is first fixed in the chip mounting slot 451 of the chip mounting base 42, and the defective solder balls are removed. Then, the solder paste feeder 43 is precisely installed on the carrier board 45 via the positioning slot 47 and positioning post 461, and solder paste is applied to the chip pin area using the feed hole 4311. After removing the solder paste feeder 43, the solder ball rework device 44 is replaced and precisely positioned and installed. The solder balls are placed in the receiving slot 442, and guided to the solder paste-coated pads through the solder ball rework hole 4411, completing the manual rework. After the reworked chip passes inspection, it can be reintroduced into the subsequent process.

[0073] This completes the entire process of automated batch ball-mounting of multiple chips on a whole board and rapid, low-cost rework ball-mounting of defective single chips.

[0074] The present invention also includes a method for a chip ball-mounting process, which uses the above-mentioned ball-mounting equipment to perform a ball-mounting operation on the chip, comprising the following steps: Step S1: Control the conveyor module 1 to move the chip to be implanted to the working position.

[0075] Step S2: Control the flux transfer component 4 to transfer the flux on the flux smoothing component 2 to the chip to be implanted in the chip delivery module 1.

[0076] Step S3: Control the mounting plate 7 to rotate to the upper ball position, and control the solder ball plate 12 to move so that the solder balls in the receiving cavity 13 move into the solder ball groove 11.

[0077] More specifically, when the mounting plate 7 rotates to the upper ball position, the end of the mounting plate 7 near the solder ball fixture plate 9 is lower than the end away from the solder ball fixture plate 9. The solder balls in the receiving cavity 13 automatically roll to the end of the receiving cavity 13 near the solder ball fixture plate 9 and form a certain accumulation. Then, the solder ball material plate 12 is controlled to move from the initial position towards the solder ball fixture plate 9, so that the solder balls accumulated in the receiving cavity 13 can enter the solder ball groove 11 and the corresponding receiving groove 141 in sequence, achieving full-groove sorting.

[0078] Step S4: Control the mounting plate 7 to rotate to the return position clamping constraint, so that the solder balls in the receiving cavity 13 flow back to the end away from the solder ball fixture plate 9, and control the solder ball material plate 12 to move to the initial position.

[0079] More specifically, when the mounting plate 7 is rotated to the return position, as the end of the mounting plate 7 closest to the solder ball fixture plate 9 is raised to a high position, the excess solder balls in the receiving cavity 13 that are not captured by the solder ball groove 11 automatically roll back towards the second end of the mounting plate 7 under the action of gravity, thereby separating from the area of ​​the solder ball fixture plate 9.

[0080] During the rotation of the mounting plate 7 to the return position, the follower 17 slides along the second slide rail 72 toward the second end of the mounting plate 7. Since the second slide rail 72 is positioned higher at the end closer to the second end, the follower 17 tends to slide downwards under the influence of gravity, thereby causing the movable plate 14 to undergo a horizontal relative displacement with respect to the solder ball fixture plate 9. This results in a horizontal misalignment between the receiving groove 141 on the movable plate 14 and the solder ball groove 11 on the solder ball fixture plate 9. At this point, the receiving groove 141 and the solder ball groove 11 no longer maintain a direct alignment but instead form a misaligned, intersecting structure, providing a mechanical clamping constraint for the solder balls already filled between them.

[0081] The clamping constraint effectively prevents the following situations from occurring: during the retraction of the solder ball plate 12 to the initial position, the solder balls flowing back into the receiving cavity 13 come into contact, collide, or rub against the already sorted solder balls in the solder ball groove 11, thereby carrying out or disturbing the solder balls in the solder ball groove 11. Through the staggered clamping of the receiving groove 141 and the solder ball groove 11, the solder balls are firmly confined within the space formed by the two, maintaining a fixed position and ensuring that the full groove state is not disrupted.

[0082] Step S5: Control the mounting plate 7 to rotate to the ball supply position, so that the upper surfaces of the mounting plate 7 and the solder ball fixture plate 9 are both horizontal. Then control the solder ball transfer assembly 5 to transfer the solder balls on the solder ball fixture plate 9 to the chip to be implanted in the chip delivery module 1.

[0083] Specifically, during the rotation to the ball supply position, the follower 17 drives the movable plate 14 to move, causing the receiving groove 141 and the solder ball groove 11 to return to their original alignment, releasing the clamping constraint, and allowing the solder ball to be in a free state within the solder ball groove 11, facilitating pickup by the solder ball transfer assembly 5. Subsequently, the solder ball transfer assembly 5 is controlled to remove the solder ball from the solder ball fixture plate 9 using negative pressure adsorption and transfer it to the corresponding pin of the chip to be implanted in the chip delivery module 1. Step S6: Control the conveyor module 1 to output the chip after the ball-planting is completed.

[0084] Step S7: Detect and separate the defective chips from the multiple chips on the board and scrape off the defective solder balls. Use the solder ball rework device 41 to apply solder paste to the defective chips in sequence through the solder paste feeder 43 and re-ball them manually through the solder ball reworker 44 to complete the rework.

[0085] The chip ball-mounting equipment in this embodiment includes an initial ball-mounting device and a ball-mounting rework device. The initial ball-mounting device mounts multiple chips on the entire board, while the ball-mounting rework device reworks individual chips with defective mounting. The ball-mounting rework device, through a combination of a chip mounting base, a replaceable solder paste feeder, and a ball-mounting frame, can quickly reapply solder paste and manually remount individual defective chips separated after automatic ball-mounting, eliminating the need for overall rework of all chips on the board. This avoids the repeated removal and fabrication of solder balls for defective chips, significantly reducing the consumption of auxiliary materials such as solder balls, flux, and cleaning agents, and substantially saving rework costs and time. It boasts low rework costs and high efficiency.

[0086] In addition, by combining the swing of the mounting plate (upper ball position, return position, and ball supply position) in the solder ball feeding assembly with the sliding feeding of the solder ball material plate, and with the misaligned clamping constraint of the solder ball fixture plate and the movable plate, it is possible to effectively achieve stable full-slot feeding of solder balls in the solder ball tank, avoid empty tanks and stacking, and significantly improve the ball loading rate and ball yield.

[0087] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A chip ball-mounting device, characterized in that, It includes an initial ball-planting device and a ball-planting rework device (41). The initial ball-planting device is used to plant balls on multiple chips of the whole board, and the ball-planting rework device (41) reworks and plants balls on a single chip with poor ball-planting. The initial solder ball feeding device includes a chip delivery module (1), a flux smoothing component (2), a solder ball feeding component (3), a flux transfer component (4), and a solder ball transfer component (5). The flux smoothing assembly (2) and the solder ball feeding assembly (3) are disposed on both sides of the chip delivery module (1). The flux transfer assembly (4) is used to transfer the flux on the flux smoothing assembly (2) to the chip of the chip delivery module (1). The solder ball transfer assembly (5) is used to transfer the solder ball on the solder ball feeding assembly (3) to the chip of the chip delivery module (1). The solder ball feeding assembly (3) includes a base (6), a mounting plate (7), a solder ball fixture plate (9), and a solder ball material plate (12). The mounting plate (7) is rotatably connected to the top of the base (6). The solder ball fixture plate (9) is provided at one end of the mounting plate (7). The upper surface of the solder ball fixture plate (9) is provided with a plurality of solder ball grooves (11). The upper surface of the solder ball fixture plate (9) is flush with the upper surface of the mounting plate (7). The solder ball material plate (12) is slidably connected to the top of the mounting plate (7). A first Y-axis linear drive mechanism (12) is installed on the mounting plate (7). 6) The output end of the first Y-axis linear drive mechanism (16) is fixedly connected to the solder ball plate (12). The solder ball plate (12) is provided with a receiving cavity (13). The receiving cavity (13) extends through to the upper surface of the mounting plate (7). The mounting plate (7) is slidably closed at the bottom of the receiving cavity (13). A number of solder balls are provided in the receiving cavity (13). The solder balls in the receiving cavity (13) are moved into the solder ball groove (11) by rotating and tilting the mounting plate (7) and the solder ball fixture plate (9) in coordination with the movement of the solder ball plate (12). The ball rework device (41) includes a chip mounting base (42), a solder paste loading rack (43), and a ball rework rack (44). The chip mounting base (42) includes a base plate (46) and a support plate (45) disposed on the top of the base plate (46). The top of the support plate (45) is provided with a chip mounting slot (451). The top of the ball-planting rack (44) is provided with a receiving slot (442) for accommodating solder balls. The solder paste loading rack (43) is provided with a loading hole (4311) corresponding to the chip mounting slot (451). The ball-planting rack (44) is provided with a ball-planting hole (4411) corresponding to the chip mounting slot (451).

2. The ball placement apparatus for a chip according to claim 1, wherein The mounting plate (7) includes an upper ball position, a ball supply position, and a return position on the rotation trajectory; When the mounting plate (7) is located at the upper ball position, the end of the mounting plate (7) near the solder ball fixture plate (9) is lower than the end away from the solder ball fixture plate (9), so that as the solder ball material plate (12) moves, the solder ball in the receiving cavity (13) can move into the solder ball groove (11); When the mounting plate (7) is in the return position, the end of the mounting plate (7) near the solder ball fixture plate (9) is higher than the end away from the solder ball fixture plate (9), so that the solder balls in the receiving cavity (13) flow back to the end away from the solder ball fixture plate (9); When the mounting plate (7) is located at the ball supply position, the upper surfaces of the mounting plate (7) and the solder ball fixture plate (9) are both horizontal, so that the solder ball transfer assembly (5) can pick up the solder balls on the solder ball fixture plate (9); The solder ball fixture plate (9) has a mounting cavity, and the side of the mounting cavity near the mounting plate (7) is open. The solder ball feeding assembly (3) also includes a movable plate (14), which is located in the mounting cavity and is slidably disposed on the mounting plate (7). The movable plate (14) is provided with a receiving groove (141) corresponding to the solder ball groove (11), and the receiving groove (141) is connected to the solder ball groove (11). When the mounting plate (7) is located at the upper ball position or the ball supply position, the receiving groove (141) is directly opposite the solder ball groove (11). When the mounting plate (7) is located at the return position, the receiving groove (141) and the solder ball groove (11) are misaligned to a certain extent to form a clamping constraint on the solder balls located in the receiving groove (141) and the solder ball groove (11).

3. The ball placement apparatus for a chip according to claim 2, wherein The mounting plate (7) is used to set one end of the solder ball fixture plate (9) as the first end, and the other end of the mounting plate (7) is used as the second end; The solder ball feeding assembly (3) also includes a follower (17), which is a U-shaped structure and is located in the mounting cavity and surrounds three sides of the movable plate (14). The mounting plate (7) is provided with a first slide rail (71) and two second slide rails (72) located on both sides of the first slide rail (71). The extension direction of the first slide rail (71) and the second slide rail (72) is parallel to the sliding direction of the solder ball plate (12). The movable plate (14) is slidably connected to the first slide rail (71). The two ends of the follower (17) are slidably connected to the corresponding second slide rail (72). The middle section of the follower (17) is slidably connected to the movable plate (14). The sliding direction between the follower (17) and the movable plate (14) is perpendicular to the upper surface of the movable plate (14). The end of the second slide rail (72) closer to the second end of the mounting plate (7) is higher. When the mounting plate (7) is located at the upper ball position or the ball supply position, the movable plate (14) or the follower (17) contacts the inner wall surface of the mounting cavity near the first end of the mounting plate (7); When the mounting plate (7) is located in the return position, the movable plate (14) or the follower (17) is a set distance away from the inner wall surface of the first end of the mounting cavity near the mounting plate (7).

4. The ball mounter for chips according to claim 1, wherein The flux smoothing assembly (2) includes a mounting frame (20), an X-axis linear drive mechanism (21), a flux smoothing plate (22), and a flux trough (23). The top of the mounting frame (20) is fixed with the flux smoothing plate (22), and the top of the flux smoothing plate (22) is provided with a flux smoothing groove (24). The bottom of the mounting frame (20) is fixed with the X-axis linear drive mechanism (21), and the output end of the X-axis linear drive mechanism (21) is fixed with the flux trough (23). The outlet (25) of the flux trough (23) is set directly opposite the flux smoothing groove (24).

5. The ball mounter for chips according to claim 1, wherein The flux transfer assembly (4) includes a first vertical plate (26) and a first X-axis cylinder (27), a first slider (28), a first Z-axis cylinder (29) and a first transfer seat (30) fixed on one side of the first vertical plate (26). The output end of the first X-axis cylinder (27) is fixed with the first slider (28). The top of the first transfer seat (30) is fixed with the first Z-axis cylinder (29). The output end of the first Z-axis cylinder (29) is fixedly connected to the first slider (28). The bottom of the first transfer seat (30) is fixed with a plurality of flux transfer columns (31).

6. The ball mounter for chips according to claim 1, wherein The solder ball transfer assembly (5) includes a second vertical plate (32) and a second X-axis cylinder (33), a second slider (34), a second Z-axis cylinder (35), and a second transfer seat (36) fixed on one side of the second vertical plate (32). The output end of the second X-axis cylinder (33) is fixed with the second slider (34). The top of the second transfer seat (36) is fixed with the second Z-axis cylinder (35). The output end of the second Z-axis cylinder (35) is fixedly connected to the second slider (34). The bottom of the second transfer seat (36) is provided with a plurality of solder ball adsorption holes (37). The side wall of the second transfer seat (36) is provided with an air extraction hole (38) communicating with the solder ball adsorption holes (37). The air extraction hole (38) is externally connected to an air extraction assembly.

7. The ball mounter for chips according to claim 1, wherein The upper surface of the receiving cavity (13) is enclosed by a transparent plate (15), and the transparent plate (15) is provided with a feed inlet (151).

8. The ball mounter for chips according to claim 1, wherein The bottom of both the solder paste loading rack (43) and the ball-planting rack (44) is provided with positioning grooves (47) that are positioned and matched with the bearing plate (45). The depth of the positioning groove (47) is less than the thickness of the bearing plate (45). A plurality of positioning posts (461) are provided on the base plate (46). The bottom of the solder paste loading rack (43) and the ball loading rack (44) are provided with positioning holes (48) for positioning and connecting with the positioning posts (461).

9. The ball mounter for chips according to claim 8, wherein Solder paste loading rack (43) is detachably provided with solder paste loading plate (431), loading hole (4311) is provided on solder paste loading plate (431), solder paste loading rack (43) includes two stacked first plates, the two first plates are fixedly connected by screws, and solder paste loading plate (431) is clamped between the two first plates; The ball-planting frame (44) is detachably provided with a ball-planting plate (441), and the ball-planting hole (4411) is provided on the ball-planting plate (441). The ball-planting frame (44) includes two stacked second plates, which are fixedly connected by screws. The ball-planting plate (441) is clamped between the two second plates. When the solder paste plate (431) or the ball-planting plate (441) comes into contact with the carrier plate (45), the positioning post (461) is at a set distance from the inner top surface of the positioning hole (48).

10. A ball-planting process method for a chip, characterized by, Using any one of the ball-planting devices described in claims 1-9 to perform a ball-planting operation on the chip includes the following steps: Step S1: Control the conveying module (1) to move the chip to be implanted to the working position; Step S2: Control the flux transfer component (4) to transfer the flux on the flux smoothing component (2) to the chip to be implanted in the chip delivery module (1); Step S3: Control the mounting plate (7) to rotate to the upper ball position, control the solder ball plate (12) to move, so that the solder balls in the receiving cavity (13) move into the solder ball groove (11); Step S4: Control the mounting plate (7) to rotate to the return position, so that the solder balls in the receiving cavity (13) flow back to the end away from the solder ball fixture plate (9), and control the solder ball material plate (12) to move to the initial position; Step S5: Control the mounting plate (7) to rotate to the ball supply position, and control the solder ball transfer assembly (5) to transfer the solder balls on the solder ball fixture plate (9) to the chip to be implanted in the chip delivery module (1); Step S6: Control the conveying module (1) to output the chip after the ball-planting is completed; Step S7: Detect and separate the defective chips from the multiple chips on the board and scrape off the defective solder balls. Use the solder ball rework device (41) to apply solder paste to the defective chips in sequence through the solder paste feeder (43) and re-ball them manually through the ball reworker (44) to complete the rework.

Images