Welding apparatus and non-transitory computer readable medium

Abstract

The welding apparatus (1) melts solder (27) using a soldering iron (24) and performs welding. The welding apparatus (1) is equipped with a processing unit (52) which predicts the temperature change of the part to be welded through contact with the soldering iron (24) and automatically sets the solder supply timing based on the temperature change prediction result.

Description

Technical Field

[0001] This invention relates to a welding apparatus. It also relates to a non-transitory computer-readable medium storing a computer program executable by a processor of a controller mounted on the welding apparatus. Background Technology

[0002] Patent document 1 discloses a welding apparatus for automatic welding. During teaching, the operator inputs welding conditions such as welding timing and welding feed rate through the operation input unit.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent No. 6764393 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] However, in the welding apparatus disclosed in Patent Document 1, although welding is performed automatically based on the input welding conditions, the setting of the welding conditions still requires manual setting by the operator, and the setting involves the results of repeated trial and error by the operator and the prescribed conditions. One object of the present invention is to provide a welding apparatus and a non-transitory computer-readable medium that can reduce the burden on the operator who inputs the welding conditions.

[0008] Technical means to solve the problem

[0009] One embodiment of the present invention is a welding apparatus that melts solder by heating a tool and performs welding. The welding apparatus includes a processing unit that predicts the temperature change of the part to be welded by contact with the heating tool and automatically sets the solder supply timing based on the result of the temperature change prediction.

[0010] One embodiment of the present invention provides a non-transitory computer-readable medium storing a computer program executable by a processing unit of a control device mounted on a welding apparatus, the welding apparatus melting solder and performing welding using a heating tool.

[0011] By executing the computer program, the control device performs the following processes:

[0012] The temperature change of the welded part caused by the contact of the heating tool is predicted, and the solder supply timing is automatically determined based on the result of the temperature change prediction.

[0013] Based on the above configurations, since the solder supply timing is automatically calculated, the operator's time and effort in determining the solder supply timing through repeated trial and error can be reduced. Furthermore, since the temperature change of the soldered area is predicted, a solder supply timing close to the one manually set by the operator can be automatically derived, taking into account factors such as the melting state of the solder supplied to that area.

[0014] In addition, in this specification, the term "solder supply timing" includes at least one of the solder supply start timing and the solder supply stop timing. Attached Figure Description

[0015] Figure 1 This is a schematic diagram illustrating the configuration of the welding apparatus of this embodiment.

[0016] Figure 2 This is a block diagram illustrating the functional structure of a welding apparatus.

[0017] Figure 3 The welding control process is executed by the processing department.

[0018] Figure 4 This is a schematic diagram illustrating the process of supplying solder to the soldering tip of a soldering iron.

[0019] Figure 5 This is a schematic diagram illustrating the process of bringing the soldering iron tip into contact with the part being soldered.

[0020] Figure 6 This is a schematic diagram illustrating the process of supplying secondary solder to the welded parts.

[0021] Figure 7 This is a schematic diagram illustrating the process of retracting the soldering iron after the secondary solder supply has been stopped.

[0022] Figure 8 This is a cross-sectional schematic diagram used to illustrate a 3D model for predicting temperature changes.

[0023] Figure 9 It means Figure 8 The curve showing the predicted temperature change at location A. Detailed Implementation

[0024] The embodiments will now be described in detail with reference to the accompanying drawings. In the drawings used in the following description, the scale has been appropriately altered to make the elements recognizable. In the drawings, arrow F indicates the forward direction of the illustrated structure. Arrow B indicates the rearward direction of the illustrated structure. Arrow U indicates the upward direction of the illustrated structure. Arrow D indicates the downward direction of the illustrated structure. Arrow R indicates the rightward direction of the illustrated structure. Arrow L indicates the leftward direction of the illustrated structure. These directions are for... Figure 1 The welding device 1 shown is configured with relative orientations. These orientations are described for ease of explanation and are not intended to limit the posture of the structure during actual use.

[0025] (Composition of the welding apparatus)

[0026] Figure 1 The configuration of the welding apparatus 1 in this embodiment is illustrated. Figure 2 The functional configuration of welding apparatus 1 is illustrated.

[0027] like Figure 1 and Figure 2 As shown, the welding apparatus 1 of this embodiment includes a support body 10, a welding unit 20, a drive unit 30, a display unit 40, and a control device 50.

[0028] like Figure 1 As shown, the support body 10 includes a base 11, two pillars 12, a support bridge 13, and a mounting platform 14. The two pillars 12 are erected on the base 11 at intervals. The support bridge 13 is mounted between the upper ends of the two pillars 12. The mounting platform 14 is movably disposed on the base 11. A soldering object (e.g., a printed circuit board) is placed and fixed on the mounting platform 14.

[0029] The welding unit 20 has a horizontally movable column 21, a vertically movable column 22, a support 23, a soldering iron 24, a solder container 25, and a solder feeder 26.

[0030] The horizontally movable column 21 holds the vertically movable column 22, the support 23, the soldering iron 24, the solder container 25, and the solder feeder 26, and is configured to move in the left-right direction. The vertically movable column 22 holds the support 23, the soldering iron 24, the solder container 25, and the solder feeder 26, and is configured to move in the up-down direction.

[0031] A soldering iron 24 is mounted on the support 23. The support 23 has, for example, an arc-shaped frame with a groove S1. As shown by arrow A1, the posture (mounting angle) of the soldering iron 24 can be changed by moving the soldering iron 24 along the groove S1. The mounting angle of the soldering iron 24 relative to the support 23 can be changed, for example, by the operator.

[0032] The soldering iron 24 has a soldering tip 24A and a heating element 24B. The soldering tip 24A is disposed at the top of the soldering iron 24. The heating element 24B is built into the soldering iron 24. The heating element 24B is constructed, for example, by a coil heater formed of metal wire. The heating element 24B is configured to heat the soldering tip 24A by power supply from a power supply unit (not shown). The soldering tip 24A of the soldering iron 24 is heated to a predetermined temperature by the heating element 24B. The soldering iron 24 is an example of a heating tool of the present invention, and the soldering tip 24A is an example of the top portion of the heating tool of the present invention.

[0033] A wire-shaped solder 27 is contained in the solder receiving section 25. The solder receiving section 25 is fixed to a vertical movable column 22. Inside the solder receiving section 25, the solder 27 is wound on a spool (not shown), and the solder 27 is continuously released from the spool.

[0034] Solder feeder 26 is mounted on soldering iron 24. Solder 27 is supplied to solder feeder 26 from solder receiving section 25. Solder feeder 26 is configured to feed solder 27 from its tip to soldering tip 24A. Solder feeder 26 supplies a predetermined amount of solder to soldering tip 24A of soldering iron 24, which is heated by heating section 24B. Solder feeder 26 is an example of the solder supply section of the present invention.

[0035] Drive unit 30 ( Figure 2 The device is configured to allow the soldering iron 24 to move relative to the object to be soldered, which is placed on the mounting stage 14. Specifically, the drive unit 30 includes a plurality of actuators (not shown).

[0036] For example, such as Figure 1 As shown, a groove S2 extending in the front-rear direction is formed on the upper surface of the base 11. One of the plurality of actuators, as indicated by arrow A2, moves the stage 14 along the groove S2 in the front-rear direction.

[0037] For example, a groove S3 extending in the left-right direction is formed on the upper surface of the support bridge 13. One of the plurality of actuators, as indicated by arrow A3, causes the horizontally movable column 21 to move in the left-right direction along the groove S3.

[0038] For example, one of the multiple actuators, as shown by arrow A4, moves the vertically movable column 22 in the vertical direction. Furthermore, the vertically movable column 22 has a head 22A at its top end that connects to the support portion 23. For example, one of the multiple actuators, as shown by arrow A5, rotates the head 22A about a rotation axis that is substantially aligned with the vertical central axis of the vertically movable column 22.

[0039] The display unit 40 is a general-purpose display device capable of displaying the operation screen of the welding apparatus 1. In this example, the display unit 40 is configured as an electrostatic or pressure-sensitive touch panel display. In this case, the input receiving unit 41 is implemented by a GUI displayed on the display unit 40. The operator can input information required for welding or instructions for performing welding by bringing their finger close to or touching the GUI. The input receiving unit 41 may also be configured as a keyboard or mouse separate from the display unit 40.

[0040] The information required for soldering includes, for example, information about the object to be soldered (e.g., a substrate), information about the soldering iron 24, and soldering conditions (e.g., the amount of solder 27 supplied, the supply speed, the supply start timing, the supply stop timing, etc.) used to set the operating parameters of each part of the soldering apparatus 1. This input information is stored, for example, in a storage unit not shown. The storage unit consists of storage devices such as memory, HDD (Hard Disk Drive), and SSD (Solid State Drive).

[0041] Gerber data and CAD information of the substrate, as well as CAD information of the soldering iron 24, can also be obtained from the external device 60. The obtained data and information are stored in a storage unit not shown.

[0042] The control device 50 is configured to control the operation of each component constituting the welding apparatus 1. For example... Figure 2 As shown, the control device 50 includes an input interface 51, a processing unit 52, and an output interface 53.

[0043] The input interface 51 is configured as a hardware interface to receive an input signal IS1 corresponding to information or instructions input through the input receiving unit 41 and an input signal IS2 containing data and information from the external device 60. The input signal IS1 or input signal IS2 can be an analog signal or a digital signal. When the input signal IS1 or input signal IS2 is an analog signal, the input interface 51 includes appropriate conversion circuitry including an A / D converter.

[0044] The processing unit 52 is configured to output control signals CS1 to CS4 from the output interface 53. These control signals CS1 to CS4 control the operation of each component constituting the welding apparatus 1. The output interface 53 is a hardware interface. The control signals CS1 to CS4 can be analog signals or digital signals. When the control signals CS1 to CS4 are analog signals, the output interface 53 includes a suitable conversion circuit containing a D / A converter.

[0045] (Automatic welding using welding equipment)

[0046] Next, use Figures 3 to 6 The automatic welding performed by welding device 1 will be described. Figure 3 The welding control process is executed by the processing unit 52 of the control device 50. Figures 4 to 7 This is a schematic diagram illustrating the various steps in automated welding. Additionally, in Figures 4 to 7 In the diagram, only the soldering tip 24A is shown of the soldering iron 24. Additionally, the solder pads 81 formed on the substrate 80 and the leads 82 soldered to the solder pads 81 are shown as the soldering points.

[0047] When the processing unit 52 of the control device 50 receives the input signal IS1 for performing soldering via the input interface 51, it performs soldering. In addition, the coordinates of the position of the soldering tip 24A of the soldering iron 24 or the angle representing the posture, the amount of solder supplied and the supply speed required for performing soldering are, for example, input by the operator via the input receiving unit 41, or preset manually or automatically by the processing unit 52, and stored in the storage unit.

[0048] Specifically, such as Figure 3 As shown, firstly, the processing unit 52 outputs a control signal CS1 to the heating unit 24B for heating the soldering tip 24A of the soldering iron 24 (step 1). The heating unit 24B heats the soldering tip 24A to a predetermined temperature capable of melting the solder 27 according to the control signal CS1.

[0049] Next, the processing unit 52 outputs a control signal CS2 to the driving unit 30 (step 2). This control signal CS2 is used to move the soldering tip 24A of the soldering iron 24 to... Figure 4 The position (hereinafter referred to as the starting point) and posture are shown. The drive unit 30, based on the control signal CS2, uses multiple actuators to move the stage 14, the horizontal movable column 21, and the vertical movable column 22. As a result, the soldering iron tip 24A moves to... Figure 4 The starting point is shown. Additionally, the drive unit 30, based on the control signal CS2, uses one of a plurality of actuators to rotate the head 22A around the rotation axis. As a result, the soldering iron tip 24A moves to... Figure 4 The posture shown.

[0050] Here, the starting point, as described below, is a predetermined position set away from the contact point with the part to be soldered when the solder 27 (hereinafter referred to as primary solder) is first supplied to the soldering tip 24A.

[0051] Next, the processing unit 52 outputs a control signal CS3 to the solder feeder 26 for supplying solder to the soldering tip 24A (step 3). The solder feeder 26 delivers solder 27 to the soldering tip 24A based on the control signal CS3. The solder 27 supplied to the soldering tip 24A is melted by the heated soldering tip 24A.

[0052] Furthermore, the amount of solder supplied at one time is calculated, for example, based on substrate information such as Gerber data. The amount of solder supplied at one time corresponds to the first amount of the present invention. For example, the processing unit 52 obtains substrate information from the storage unit (not shown) and automatically sets the amount of solder supplied at one time based on the obtained substrate information. For example, the first amount is the amount of solder that can fill the through-hole portion of the pad 81.

[0053] Next, the processing unit 52 outputs a control signal CS2 to the drive unit 30 (step 4). This control signal CS2 is used to move the soldering iron tip 24A of the soldering iron 24, which has been molten with solder in one pass, to... Figure 5 The position shown is (hereinafter referred to as the endpoint). The drive unit 30, based on the control signal CS2, uses multiple actuators to move the horizontally movable column 21 and the vertically movable column 22. As a result, the soldering iron tip 24A moves to... Figure 5 The endpoint shown.

[0054] Here, the endpoint is the position where soldering is performed by supplying a second solder 27 (hereinafter referred to as secondary solder), as described later, i.e., the position where the soldering tip 24A of the soldering iron 24 contacts the part to be soldered.

[0055] In this way, the soldering tip 24A of the soldering iron 24, with the solder molten in the first pass, comes into contact with the part to be soldered, and the first pass solder wets the part to be soldered, thereby forming a cross-link (thermal bridge) with the part to be soldered. That is to say, the first pass solder is provided to form a thermal bridge.

[0056] Next, at the predetermined supply start time, the processing unit 52 outputs a control signal CS3 (step 5) to the solder feeder 26 to begin supplying secondary solder to the soldering iron tip 24A. Figure 6 As shown, the solder feeder 26 delivers solder 27 to the soldering tip 24A of the soldering iron 24, which is in contact with the part to be soldered, based on the control signal CS3. The secondary solder supplied to the soldering tip 24A is melted by the heated soldering tip 24A and supplied to the part to be soldered. The secondary solder supplied to the part to be soldered wets and spreads, thereby soldering the part.

[0057] Furthermore, the amount of secondary solder supplied is automatically set by the processing unit 52, for example. For instance, the total solder supply amount, including the primary solder supply amount and the secondary solder supply amount, is calculated based on the substrate information. Then, the secondary solder supply amount is calculated based on the calculated primary solder supply amount and the total solder supply amount. The secondary solder supply amount corresponds to the second amount of the present invention.

[0058] Next, at a predetermined supply stop time, the processing unit 52 outputs a control signal CS3 to the solder feeder 26 to stop supplying secondary solder to the soldering iron tip 24A (step 6).

[0059] Next, the processing unit 52 outputs a control signal CS2 to the drive unit 30 (step 7). This control signal CS2 is used to move the soldering iron 24 to a retraction position away from the soldering part at a predetermined retraction timing. Figure 7 As shown, the drive unit 30 uses multiple actuators to move the soldering iron 24 to a retraction position away from the soldering area according to the control signal CS2. Furthermore, the retraction position can be, for example, the starting point, or a position different from the starting point.

[0060] If the backoff time is set to the same time as the supply stop time, the processing in step 6 and the processing in step 7 can also be performed simultaneously.

[0061] Here, both the soldering tip 24A of the soldering iron 24 and the part to be soldered are rigid bodies, resulting in high thermal resistance during point or line contact. Therefore, as described above, primary solder is supplied in a manner that brings molten solder into contact with the part to be soldered before supplying secondary solder. The primary solder creates a thermal bridge at the part to be soldered, increasing the contact area between the soldering tip 24A of the soldering iron 24 and the part to be soldered. This reduces the thermal resistance between the soldering tip 24A and the part to be soldered, enabling efficient and rapid heat transfer from the soldering tip 24A to the part to be soldered.

[0062] When the timing for starting the secondary solder supply, stopping the secondary solder supply, and retracting the soldering iron 24 are manually set by the operator, the process is subject to the operator's skill level due to repeated trial and error, and thus places a heavy burden on the operator.

[0063] In contrast, in the welding apparatus 1 of the present invention, the processing unit 52 of the control device 50 is configured to automatically set at least one of the secondary solder supply start timing and the secondary solder supply stop timing.

[0064] (Automatic setting of the start and stop timing for secondary solder supply)

[0065] The following uses Figure 8 and Figure 9 The automatic setting of the secondary solder supply start timing and secondary solder supply stop timing performed by the processing unit 52 of the control device 50 will be explained.

[0066] The processing unit 52 predicts the temperature change of the soldering part due to contact with the soldering tip 24A of the soldering iron 24.

[0067] Temperature change prediction can be performed, for example, by finite element method (FEM) analysis. In FEM analysis, the processing unit 52 constructs a 3D model that reproduces the structure of the object to be soldered (e.g., a printed wiring board), the part to be soldered, and the soldering tip 24A of the soldering iron 24.

[0068] Figure 8 This is a cross-sectional schematic diagram used to illustrate a 3D model for predicting temperature changes. For example... Figure 8 As shown, the 3D model reproduces the situation where the soldering tip 24A of the soldering iron 24 contacts the solder pad 81, and the solder (solder 27) is wetted. The 3D model is constructed based on information about the substrate (e.g., Gerber data or CAD information of the substrate) input by the input receiving unit 41 or external device 60, information about the soldering tip 24A of the soldering iron 24 (e.g., CAD information), and information about the leads (e.g., CAD information).

[0069] The processing unit 52 uses FEM analysis of the 3D model to predict temperature changes at a specified location of the soldering area. Then, based on the temperature change prediction results, the processing unit 52 sets a stop time for the supply of secondary solder.

[0070] For example, such as Figure 8 As shown, the processing unit 52 is located on the surface of the soldering tip 24A that contacts the solder pad 81. Figure 8 On the upper surface of the middle solder pad 81, perform the operation at the position furthest from the soldering tip 24A (e.g., Figure 8 Temperature change prediction at location A). Location A is an example of the first location of the present invention.

[0071] Figure 9 Indicates based on Figure 8 The 3D model shown is the predicted temperature change at location A calculated using FEM analysis. Figure 9 In the diagram, the vertical axis represents the temperature at position A, and the horizontal axis represents the time from when the soldering tip 24A contacts the pad 81. Furthermore, in the FEM analysis, the temperature change is predicted based on the assumption that the solder 27 is instantaneously wetted and forms a thermal bridge when the soldering tip 24A contacts the pad 81.

[0072] Processing Unit 52 according to Figure 9 The temperature change prediction results shown use the moment t1 when the temperature at position A within pad 81 reaches a specified temperature T1 as the timing for stopping the supply of secondary solder. The specified temperature T1 is, for example, 220°C, the melting point of the solder.

[0073] Next, the processing unit 52 performs a reverse calculation from the secondary solder supply stop timing to calculate the secondary solder supply start timing. Specifically, the processing unit 52 calculates the secondary solder supply time (period) based on the solder supply speed, the secondary solder supply amount, and the wire diameter of the solder 27.

[0074] Here, the amount of secondary solder supplied is calculated based on the substrate information as described above. The wire diameter of solder 27 and the solder supply speed are input by the operator using the input receiving unit 41. Therefore, the processing unit 52 can calculate the secondary solder supply time based on these calculated or input values.

[0075] Then, the processing unit 52 calculates the start time of secondary solder supply based on the calculated supply time and stop time of secondary solder supply.

[0076] According to the welding apparatus 1 of this embodiment, since the supply timing of the secondary solder (supply start timing and supply stop timing) is automatically calculated, the operator's effort and time in determining the supply timing of the secondary solder through repeated trial and error can be reduced. In addition, since the temperature change of the part to be welded is predicted, a secondary solder supply timing that is close to the secondary solder supply timing actually set by the operator manually can be automatically derived. This manual setting takes into account the melting state of the secondary solder supplied to that part.

[0077] In particular, by automatically determining the timing of secondary solder supply that requires trial and error by the operator through temperature change prediction, the operator's workload can be reduced more effectively.

[0078] Furthermore, by using finite element method analysis to predict temperature changes, the timing of secondary solder supply at ideal temperatures can be derived even without repeated trial and error by the operator.

[0079] Furthermore, by using the moment when the temperature at position A within the welded area reaches the specified temperature T1 as the time to stop the supply of secondary solder, it is possible to prevent the solder 27 from being insufficiently heated or overheated, thereby achieving stable welding quality.

[0080] Furthermore, the supply start time of the secondary solder is calculated based on the supply rate of the solder, the supply amount of the secondary solder, and the wire diameter of solder 27, as well as the supply stop time of the secondary solder. Thus, the supply start time of the secondary solder can be easily calculated without having to predict the temperature change.

[0081] (Modified Example)

[0082] The following describes a modified example of the automatic setting of the secondary solder supply start timing and the secondary solder supply stop timing of the processing unit 52.

[0083] In this variation, the timing of the secondary solder supply start is not dependent on the timing of the secondary solder supply stop, but is calculated based on temperature change prediction.

[0084] Specifically, the processing unit 52 predicts the temperature change of the soldered part due to the contact of the soldering tip 24A of the soldering iron 24. Then, based on the temperature change prediction results, the processing unit 52 sets the start timing and stop timing of the secondary solder supply.

[0085] For example, the processing unit 52 uses... Figure 8 The 3D model shown is subjected to FEM analysis to predict temperature changes at predetermined locations. First, the processing unit 52 processes the surface of the solder pad 81 that contacts the soldering tip 24A. Figure 8 The upper surface of the middle solder pad 81), at the position furthest from the soldering tip 24A (e.g., the upper surface of the middle solder pad 81). Figure 8 Temperature change prediction at position A). Position A in this variation is an example of the second position of the present invention.

[0086] Next, processing unit 52 according to Figure 9 The temperature change prediction results shown use the moment t1 when the temperature at position A within pad 81 reaches a specified temperature T1 as the start time for the secondary solder supply. The specified temperature T1 is, for example, 220 °C, the melting point of the solder.

[0087] Additionally, the processing unit 52 is located on the opposite side of the solder pad 81 that contacts the soldering tip 24A. Figure 8 On the lower surface of the middle pad 81, perform the operation at the position furthest from the soldering tip 24A (e.g., the position on the lower surface of the middle pad 81). Figure 8 Temperature change prediction at position B). Position B in this variation is an example of the first position of the present invention.

[0088] Next, based on the temperature change prediction results (not shown), the processing unit 52 sets the time when the temperature at position B within the pad 81 reaches a predetermined temperature as the time to stop the supply of secondary solder. The predetermined temperature is, for example, 220°C, the melting point of the solder.

[0089] According to the welding apparatus 1 of this modified example, the time when the temperature at position A within the area to be welded reaches a predetermined temperature (in this example, the melting point of the solder) is used as the start time for supplying secondary solder. This prevents secondary solder from being delivered to the soldering tip 24A of the soldering iron 24 when the surface temperature of the area to be welded is at a temperature where the solder 27 has not melted. Therefore, it prevents the solder 27 supplied to the area to be welded from being insufficiently melted, resulting in stable welding quality.

[0090] Furthermore, the moment when the temperature at position B within the soldering area reaches a predetermined temperature (in this example, the solder melting point) is used as the time to stop the supply of secondary solder. Here, by contacting the soldering iron tip 24A with the soldering area, if the temperature at the part of the soldering area where heat is most difficult to transfer rises sufficiently, it can be assumed that the temperature at other parts of the soldering area also rises sufficiently. Therefore, for example, by setting position B on the opposite side of the surface of the soldering iron tip 24A within the soldering area, it is possible to prevent the solder 27 supplied to the soldering area from not melting, thus achieving stable soldering quality.

[0091] (Automatic setting of soldering iron retraction timer)

[0092] The processing unit 52 can also be configured to set the retraction timing of the soldering iron 24 based on the result of temperature change prediction. For example, the retraction timing of the soldering iron 24 can also be set to the same timing as the timing of stopping the supply of secondary solder.

[0093] For example, in the above embodiment, the processing unit 52 will process position A (refer to) within the welding area. Figure 8 The moment when the temperature of the solder reaches a specified temperature (e.g., the melting point of the solder) is used as the retraction timing of the soldering iron 24. Specifically, in Figure 9 In the temperature change prediction results shown, the time t1 when the specified temperature T1 is reached is taken as the retraction time of the soldering iron 24.

[0094] Alternatively, for example, in the above-described variation, the processing unit 52 will process position B (within the welding area) Figure 8 The moment when the temperature of the solder reaches a specified temperature (e.g., the melting point of the solder) is used as the retraction time of the soldering iron 24.

[0095] In this way, by automatically determining the retraction timing of the soldering iron 24, it is possible to prevent insufficient or excessive heating of the soldered part, thus achieving stable soldering quality.

[0096] In addition, by setting position B on the opposite side of the soldering tip 24A in the soldering part, it is possible to prevent insufficient or excessive heating of the soldering part and obtain stable soldering quality.

[0097] Additionally, the retraction timing of soldering iron 24 can also be set after the secondary solder supply stops. For example, in Figure 9 In the temperature change prediction results, when the supply of secondary solder is stopped when the temperature at position A of pad 81 reaches 220 ℃, the retraction timing of soldering iron 24 can be set to 1 second after the temperature at position A of pad 81 reaches 230 ℃ or the temperature at position A of pad 81 reaches 220 ℃. This prevents insufficient heating of the soldering area and ensures that the secondary solder does not melt sufficiently.

[0098] (Automatic setting of solder supply speed)

[0099] The processing unit 52 can also calculate the speed at which secondary solder is supplied to the soldering tip 24A of the soldering iron 24 based on the timing of the stop of secondary solder supply, the timing of the start of secondary solder supply, the amount of secondary solder supplied, and the wire diameter of the solder 27.

[0100] Here, the timing for stopping and starting the supply of secondary solder is calculated using temperature change prediction, as described above. The amount of secondary solder supplied is calculated based on the substrate information, as described above. The wire diameter of the solder 27 is input by the operator, for example, using the input receiving unit 41. Therefore, the processing unit 52 can calculate the solder supply speed based on these calculated or input values.

[0101] With this configuration, the solder supply rate is automatically calculated, thus reducing the time and effort required by operators to determine the solder supply rate through repeated trial and error.

[0102] Alternatively, the processing unit 52 may be configured to not automatically calculate the solder supply speed, but to automatically correct the solder supply speed preset by the operator.

[0103] Specifically, the processing unit 52 calculates the time (period) required for soldering the secondary solder based on the solder supply speed preset by the operator, the amount of secondary solder supplied based on the substrate information, and the wire diameter of the solder 27.

[0104] Next, the processing unit 52 determines whether the calculated time required for soldering the secondary solder exceeds the time (period) calculated based on temperature change prediction, as in the modified example described above, from the start time of secondary solder supply to the stop time of secondary solder supply.

[0105] Furthermore, if the processing unit 52 determines that the calculated time required for soldering the secondary solder exceeds the time from the start time of secondary solder supply to the stop time of secondary solder supply calculated based on temperature change prediction as described in the modified example, it automatically adjusts the solder supply speed. That is, the processing unit 52 adjusts the solder supply speed so that the calculated time required for soldering the secondary solder is less than or equal to the time from the start time of secondary solder supply to the stop time of secondary solder supply calculated based on temperature change prediction as described in the modified example.

[0106] Here, if the solder supply speed set by the operator is too slow, the solder 27 may not be completely delivered within the soldering time calculated by the processing unit 52 from the start time of the secondary solder supply to the stop time of the secondary solder supply. In contrast, since the solder supply speed preset by the operator is automatically corrected so that the solder 27 is delivered before the stop time of the secondary solder supply, soldering defects can be prevented.

[0107] (Automatic setting of solder wire diameter)

[0108] It can also automatically calculate the wire diameter of solder 27 to replace the solder supply speed.

[0109] For example, the processing unit 52 can automatically calculate the wire diameter of the solder 27 supplied to the soldering iron 24 based on the timing of the stop of the secondary solder supply, the timing of the start of the secondary solder supply, the amount of secondary solder supplied, and the solder supply speed.

[0110] Here, the timing for stopping and starting the supply of secondary solder is calculated based on temperature change prediction, as in the modified example described above. The amount of secondary solder supplied is calculated based on the substrate information as described above. The solder supply speed is input by the operator, for example, using the input receiving unit 41. Therefore, the processing unit 52 can calculate the wire diameter of the solder 27 based on these calculated or input values.

[0111] Processing unit 52 will use control signal CS4 to display the calculated wire diameter of solder 27. Figure 2 The solder 27 is output to the display unit 40. The operator confirms the wire diameter of the solder 27 displayed on the display unit 40. If the wire diameter of the solder 27 installed on the solder feeder 26 is different from the wire diameter of the solder 27 displayed, the solder 27 is replaced. Specifically, the spool housed in the solder feeder 26 is replaced.

[0112] With this configuration, the wire diameter of solder 27 is automatically calculated, thus reducing the time and effort required by the operator to determine the wire diameter of solder 27 through repeated trial and error.

[0113] Alternatively, the processing unit 52 may be configured not to automatically calculate the wire diameter of the solder 27, but to automatically correct the wire diameter of the solder 27 preset by the operator.

[0114] Specifically, the processing unit 52 calculates the time (period) required for soldering the secondary solder based on the wire diameter of the solder 27 preset by the operator, the supply amount of secondary solder calculated based on the substrate information, and the supply speed of the solder preset by the operator.

[0115] Next, the processing unit 52 determines whether the calculated time (period) required for soldering the secondary solder exceeds the time (period) calculated based on temperature change prediction as described in the above-mentioned modified example, from the start time of secondary solder supply to the stop time of secondary solder supply.

[0116] Furthermore, if the processing unit 52 determines that the calculated time required for soldering the secondary solder exceeds the time calculated based on temperature change prediction from the start timing of secondary solder supply to the stop timing of secondary solder supply as described in the modified example, it automatically corrects the wire diameter of the solder 27. That is, the processing unit 52 automatically corrects the wire diameter of the solder 27 so that the calculated time required for soldering the secondary solder is less than or equal to the time calculated based on temperature change prediction from the start timing of secondary solder supply to the stop timing of secondary solder supply as described in the modified example. Then, the processing unit outputs a control signal CS4 to the display unit 40 for displaying the automatically corrected wire diameter of the solder 27.

[0117] In this way, by automatically correcting the wire diameter of the solder 27 set by the operator, the solder 27 can be completely fed before the solder 27 supply stops at the designated time, thus preventing soldering defects.

[0118] The processing unit 52 of the control device 50, which has the various functions described above, can be implemented by a microcontroller, ASIC, FPGA, or other application-specific integrated circuit that has a storage element pre-loaded with a computer program for implementing the function. In this case, the storage element is an example of a non-temporary computer-readable medium storing a computer program.

[0119] Alternatively, the processing unit 52 can be implemented by a general-purpose microprocessor that operates in conjunction with general-purpose memory. Examples of general-purpose microprocessors include CPUs, MPUs, and GPUs. Examples of general-purpose memory include ROMs and RAMs. In this case, the ROM can store a computer program for implementing the function. The general-purpose microprocessor specifies at least a portion of the program stored in the ROM and loads it into the RAM, cooperating with the RAM to perform the aforementioned processing. In this case, the general-purpose memory is an example of a non-transitory computer-readable medium storing a computer program.

[0120] The processing unit 52 can also be implemented by a combination of a general-purpose microprocessor and an application-specific integrated circuit.

[0121] Each configuration described so far is merely an example for illustrative purposes to facilitate understanding of the invention. Appropriate modifications or combinations with other configurations may be made to each configuration without departing from the spirit of the invention.

[0122] In the above embodiment, primary solder is supplied to the soldering iron tip 24A to form a thermal bridge before the secondary solder is supplied. However, it is also possible to supply solder without first supplying the primary solder, and to supply solder 27 only after the soldering iron tip 24A has come into contact with the part to be soldered. In this case, the same effect as the above embodiment can be obtained by automatically setting the supply timing of solder 27 based on the temperature change of the part to be soldered.

[0123] In the above embodiment, after the secondary solder supply is completed, a small amount of solder (hereinafter referred to as tertiary solder) may be supplied again for the purpose of producing a gloss, for example. In this soldering, the retraction timing of the soldering iron 24 is changed (updated) to be simultaneous with or after the tertiary solder supply stop timing.

Claims

1. A welding apparatus that melts solder and performs welding by heating a tool, characterized in that, It has a processing unit that predicts the temperature change of the part to be welded and automatically sets the solder supply timing based on the temperature change prediction result. The temperature change of the part to be welded is caused by contact with the heating tool.

2. The welding apparatus according to claim 1, characterized in that, The solder supply timing includes the solder supply stop timing. The processing unit uses the moment when the temperature at the first position within the welded area reaches a predetermined temperature as the time to stop supplying the solder.

3. The welding apparatus according to claim 2, characterized in that, The solder supply timing also includes a solder supply start timing. The processing unit calculates the solder supply time based on the solder supply speed, the solder supply amount, and the solder wire diameter, and calculates the solder supply start time based on the calculated solder supply time and the solder supply stop time.

4. The welding apparatus according to claim 1, characterized in that, Based on the predicted temperature change, the processing unit automatically determines the timing for moving the heating tool to a retraction position away from the welded area.

5. The welding apparatus according to claim 2, characterized in that, The solder supply timing also includes a solder supply start timing. The processing unit uses the moment when the temperature at a second position, which is different from the first position within the welded area, reaches a predetermined temperature as the start time for solder supply.

6. The welding apparatus according to claim 5, characterized in that, The processing unit calculates the rate at which solder is supplied to the heating tool based on the solder supply stop timing, the solder supply start timing, the solder supply amount, and the solder wire diameter.

7. The welding apparatus according to claim 1, characterized in that, The temperature change prediction was performed using the finite element method (FEM).

8. The welding apparatus according to any one of claims 1 to 7, characterized in that It also has: The solder supply unit supplies solder to the heating tool; and The drive unit moves the heating tool. The processing unit is configured to weld the part to be welded by supplying solder to the tip of the heating tool that is in contact with the part to be welded by the solder supply unit, and the solder is supplied at a timed interval.

9. The welding apparatus according to claim 5, characterized in that, The processing unit calculates the wire diameter of the solder supplied to the heating tool based on the solder supply stop timing, the solder supply start timing, the solder supply amount, and the solder supply speed.

10. A non-transitory computer-readable medium storing a computer program executable by a processing unit of a control device mounted on a welding apparatus, the welding apparatus melting solder and performing welding using a heating tool, characterized in that... By executing the computer program, the control device performs the following processes: The temperature change of the welded area is predicted, and the temperature change of the welded area is caused by the contact of the heating tool. Based on the predicted temperature changes, the solder supply timing is automatically determined.

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