Method for manufacturing a semiconductor component and micromirror assembly

Abstract

This invention relates to a method for manufacturing semiconductor components, particularly semiconductor components with microstructures. First, a semiconductor chip (99) is produced having four sides (104a, 104b, 104c, 104d) arranged perpendicular to the main extending plane of the semiconductor chip (99). The semiconductor chip (99) has an outer frame structure (105) surrounding two adjacent sides of the four sides (104a, 104b, 104c, 104d). The semiconductor chip (99) is connected to the outer frame structure (105) by at least three first springs (102a, 102b, 102c). Furthermore, the semiconductor chip (99) is moved to the next process step by means of a tool acting on the outer frame structure (105). In addition, the outer frame structure (105) and the three first springs (102a, 102b, 102c) are removed from the semiconductor chip (99).

Description

Technical Field

[0001] This invention relates to a method for manufacturing semiconductor components. Furthermore, this invention also relates to a micromirror assembly. Background Technology

[0002] Document DE 102 46 053 A1 describes a method for dicing a substrate wafer into multiple substrate chips. Here, the substrate wafer is first temporarily connected to a carrier wafer, and then the substrate chips are separated. A narrow base is provided between the substrate chips and the carrier wafer. This narrow base is used to hold the chips in a defined position until their final separation, wherein no large force is required for subsequent cutting of the separated chips. Summary of the Invention

[0003] Accordingly, the objective of this invention is to develop a method for manufacturing a semiconductor component having a stable and easily detachable connection between a semiconductor chip and a processing frame.

[0004] To address this task, a method for manufacturing semiconductor components according to claim 1 is proposed. Furthermore, a micromirror assembly according to claim 15 is proposed.

[0005] In a method for manufacturing semiconductor components, particularly semiconductor components with microstructures, a semiconductor chip is first produced having four sides arranged perpendicular to the main extending plane of the semiconductor chip. The produced semiconductor chip also has an outer frame structure that surrounds two adjacent sides of the four sides of the semiconductor chip. The outer frame structure is particularly L-shaped and therefore only partially surrounds the semiconductor chip. The produced semiconductor chip is connected to the outer frame structure by at least three first springs. Furthermore, the semiconductor chip is moved to the next process step by means of a tool acting on the outer frame structure. The tool acting on the outer frame structure is particularly a vacuum clamp. The outer frame structure and the three first springs are then removed from the semiconductor chip. By connecting the semiconductor chip to the outer frame structure, which serves as the processing surface, a detachable yet stable connection is created. Preferably, the semiconductor chip is moved by means of a pick-and-place process using a tool acting on the outer frame structure.

[0006] Preferably, the at least three first springs are constructed as spiral tube springs, particularly as Spiral-Bourdon-Rohre springs. This creates a pneumatically detachable mechanical connection between the semiconductor chip and the outer frame structure.

[0007] Preferably, the semiconductor chip, together with the outer frame structure and the at least three first springs, is structured from the wafer, particularly by means of an etching process. Preferably, a MEMS manufacturing process is used for this purpose. Preferably, the wafer is a silicon wafer. Preferably, multiple semiconductor chips are produced from the wafer. Preferably, at least four additional second springs, particularly helical springs, are structured from the wafer, particularly the surrounding wafer, such that the semiconductor chip, together with the outer frame structure and the three first springs, is connected to the wafer in corresponding third positions, particularly fastening positions, of the second springs by means of the four second springs. Preferably, two of the second springs connect two, particularly free sides, of the semiconductor chip, and two additional second springs connect two sides of the outer frame structure to the wafer. That is, two of the second springs act on one, particularly free side, of the semiconductor chip, and the two additional second springs act on the outer frame structure. Subsequently, a tool, particularly a vacuum jig, acts on the outer frame structure to move the semiconductor chip to the next process step, and the semiconductor chip, together with the outer frame structure, is separated from the wafer in corresponding fourth positions, particularly separation positions, of the four second springs.

[0008] Preferably, in another method step, the semiconductor chip is treated such that its outer surface, in particular its surface, is mechanically sensitive. Furthermore, a coating, particularly a light-reflective coating, is applied to the mechanically sensitive outer surface of the semiconductor chip. In this context, the outer frame structure extends upwards so as not to damage the sensitive outer surface during tooling.

[0009] Preferably, the outer frame structure is connected to the semiconductor chip solely by means of the at least three first springs. Consequently, no additional means are required to secure the outer frame to the semiconductor chip.

[0010] Preferably, the at least three first springs are structured out of the wafer such that the fixed end of each of the three first springs is connected to the outer frame structure. Accordingly, the fixed ends of the first springs are disposed on the outer frame structure and require no space on the surface of the semiconductor chip in which they are sensitively constructed.

[0011] Preferably, at least in the first positions of the three first springs, especially in the fastened positions, the free ends of each of the three first springs are respectively arranged in corresponding first recesses of the semiconductor chip, the first recesses belonging to the corresponding first springs. This means that recesses for the free ends of the first springs are provided in the semiconductor chip, and the springs are fastened in these recesses in the corresponding first positions. Preferably, the recesses are arranged in different planes from the sensitively constructed surfaces of the semiconductor chip. Preferably, the free ends of the three first springs are structured from the wafer such that the first springs have a structure on their free ends that interacts with the corresponding first recesses for connection, especially coupling, with the semiconductor chip. In particular, the structure of the free ends of the first springs is a hook-shaped structure. Preferably, the first recesses for coupling with the corresponding free ends also have a hook-shaped structure at their ends. Preferably, in contrast, the outer frame structure and the three springs are separated from the semiconductor chip in the second positions of the three springs, especially in the separated positions. Here, the first springs are arranged in the second recesses of the outer frame structure belonging to the corresponding springs in the second positions. Accordingly, the first spring moves from a first position in the first groove to a second position in the second groove, and in the second position is positioned solely on the outer frame structure. Therefore, the outer frame can be separated without damaging the sensitive surfaces of the semiconductor chip. Preferably, the first spring is structured out of the wafer such that two first springs arranged on the same side of the semiconductor chip each have a helical coil wound in opposite directions. This achieves a fixed connection between the outer frame and the semiconductor chip.

[0012] Preferably, the pressure within the first and / or second springs, particularly the helical springs, is controlled via air inlets at the fixed ends of the respective first or second springs, such that in the first position of the first spring and / or the third position of the second spring, the ambient air pressure corresponds to the air pressure within the helical spring. Furthermore, the pressure is controlled such that in the second position of the first spring and / or the fourth position of the second spring, the air pressure within the helical spring is less than the ambient air pressure. This creates the possibility of pneumatic control for different positions of the springs. Preferably, the semiconductor chip and the surrounding frame are structured from the wafer such that the air inlet for the first spring is arranged on the first side of the wafer, particularly the upper side of the outer frame structure, and the air inlet for the second spring is arranged on the second side of the wafer opposite the first side, particularly the lower side of the wafer. In this context, when gripping the outer frame structure, the tool, particularly the vacuum clamp, controls the pressure within the first spring. In particular, the tool generates a negative pressure within the first spring during gripping. Thus, the tool can simultaneously perform two functions.

[0013] Preferably, the semiconductor chip is moved to the substrate and subsequently attached to the substrate using the tool. After the resulting outer frame structure and the three first springs are removed from the semiconductor chip, another semiconductor chip is placed on the substrate using the tool. In particular, the other semiconductor chip is placed directly next to the first semiconductor chip using the tool. The other semiconductor chip is, in particular, the same semiconductor chip. Accordingly, both semiconductor chips are, in particular, constructed of the same type.

[0014] Another subject of the invention is a micromirror assembly manufactured using the method described above. The assembly has a plurality of single-mirror elements that can be manipulated independently of each other. These single-mirror elements are arranged in a field, particularly an array, and are individually movable via actuators, particularly actuator electrodes. Each single-mirror element has a reflective surface. Attached Figure Description

[0015] Figure 1 The method for manufacturing semiconductor components is illustrated in the form of a flowchart.

[0016] Figures 2a to 2d The various method steps for manufacturing semiconductor components are illustrated schematically.

[0017] Figure 3a The first spring is shown in the first position, especially the fastened position.

[0018] Figure 3b The first spring is shown in the second position, especially the separated position.

[0019] Figure 4 Two first springs are shown in the first position and are spirally wound in opposite directions. Detailed Implementation

[0020] Figure 1 A method for manufacturing semiconductor components, particularly semiconductor components with microstructures, is illustrated in flowchart form. In step 30, a semiconductor chip is produced having four sides arranged perpendicular to the main extending plane of the semiconductor chip. The produced semiconductor chip also has an outer frame structure that surrounds two adjacent sides of the four sides. The outer frame structure is particularly L-shaped and thus only partially surrounds the semiconductor chip. The produced semiconductor chip is connected to the outer frame structure by at least three first springs. In step 40, the semiconductor chip is moved to the next process step by means of a tool, particularly a vacuum jig, acting on the outer frame structure. In subsequent step 70, the outer frame structure and the three first springs are removed from the semiconductor chip.

[0021] Optionally, in method step 10, the semiconductor chip, together with the outer frame structure and at least three first springs, is structured from the wafer, particularly by means of an etching process.

[0022] In optional step 20, at least four additional second springs, particularly helical springs, are structured from the wafer, particularly the surrounding wafer, such that the semiconductor chip, together with the outer frame structure and the three first springs, is connected to the wafer in corresponding third positions, particularly fastening positions, of the second springs by means of the four second springs. Two of the second springs connect two sides of the semiconductor chip to the wafer, and the two additional second springs connect two sides of the outer frame structure to the wafer. In subsequent step 50, the tool, particularly a vacuum fixture, acts on the outer frame structure to move the semiconductor chip to the next process step. The semiconductor chip, together with the outer frame structure, is separated from the wafer in corresponding fourth positions, particularly separation positions, of the four second springs.

[0023] Optionally, in method step 60, the outer frame structure and the three springs are separated from the semiconductor chip in the second position of the three springs, particularly the separated position. The three first springs are arranged in the second grooves of the outer frame structure corresponding to their respective springs in the second position.

[0024] Figure 2a The resulting semiconductor chip 99 is schematically shown in a cross-section along the main extending plane of the semiconductor chip 99, which has four sides 104a to 104d arranged perpendicular to the main extending plane. Additionally, the resulting semiconductor chip 99 has an outer frame structure 105 that surrounds two adjacent sides 104a and 104d of the four sides of the semiconductor chip 99. In this embodiment, the outer frame structure 105 is L-shaped and therefore only partially surrounds the semiconductor chip 99. The resulting semiconductor chip 99 is connected to the outer frame structure 105 by means of three first springs 102a to 102c. Here, the three first springs 102a to 102c are constructed as helical tube springs, particularly helical Button tubes. In this embodiment of the semiconductor component, the semiconductor chip 99 is divided into rectangular, adjacent sub-surfaces 103a and 103b. Figure 2a In the first position, particularly the fastened position, of the three first springs 102a to 102c, the free end 107a of each of the three first springs 102a to 102c is respectively arranged in a corresponding first groove 108a of the semiconductor chip 99, the first groove corresponding to the corresponding first spring 102a to 102c. The outer frame structure is connected to the semiconductor chip 99 only by means of the three first springs 102a to 102c.

[0025] Furthermore, eight additional second springs 100a to 100h are structured from the surrounding wafer 101 such that the semiconductor chip 99, together with the outer frame structure 105 and the three first springs 102a to 102c, is connected to the wafer 101 in corresponding third positions, particularly fastening positions, of the second springs 100a to 100h via the eight second springs 100a to 100h. In this case, the second springs 100a to 100h are also constructed as helical springs. The wafer 101 is constructed as a silicon wafer.

[0026] Figure 2b Eight second springs 100a to 100h are shown in a corresponding fourth position, particularly a separated position. In this fourth position, the free ends 98a of the second springs 100a to 100h are arranged in a third recess 99a of the wafer 101, which corresponds to the respective second springs 100a to 100h. Thus, in method step 110, the semiconductor chip 99, which is connected to the outer frame structure 105 by means of three first springs 102a to 102c, can be removed from the wafer 101, particularly vertically, and moved to the substrate 109 by means of a tool not shown here for simplicity.

[0027] Figure 2c A semiconductor chip 99 connected to a substrate 109 is shown. In this embodiment, the free ends 107a of the three first springs 102a to 102c are arranged in a second position, particularly a separated position, of the three springs. In this second position, the free ends 107a are arranged in a second recess 112a of the outer frame structure 105, which corresponds to the respective first springs 102a to 102c, such that the outer frame structure can be separated from the semiconductor chip 99 in step 111 of the illustrated method using a tool not shown. Figure 2d In another method step 115, another semiconductor chip 114, identical to the semiconductor chip 99, is arranged and secured on the substrate 109 directly next to the semiconductor chip 99 using tools and an additional outer frame structure 116 for tooling operation. Thus, in this case, a micromirror assembly 117 is produced, having a plurality of single-mirror elements that can be manipulated independently of each other, the single-mirror elements arranged in an array. These single-mirror elements are individually movable via actuators, particularly actuator electrodes (not shown), and each has a reflective surface.

[0028] Figure 3aAn exemplary top view shows a helical spring 121 in a first position, particularly a fastened position, where the free end 125 of the first spring 121 is arranged in a first recess 123 of the semiconductor chip 122 associated with the first spring 121. Here, the first spring 121 is structured from the wafer such that its fixed end 124 is connected to the outer frame structure 120. The free end 125 of the first spring 121 is structured from the wafer such that it has a hook-shaped structure that cooperates with the associated first recess 123 for connection, particularly coupling, with the semiconductor chip 122. For this purpose, the first recess 123 also has a hook-shaped structure at its end 126. Here, the pressure within the first spring 121 is controlled via an air inlet (not shown) on the fixed end 124 of the first spring 121, such that in the first position of the first spring 121, the ambient air pressure corresponds to the air pressure within the helical spring 121.

[0029] In contrast, Figure 3b The first spring is shown in a second position, particularly a separated position, in which the free end 125 is arranged in a second recess 128 of the outer frame structure 120. In this second position, the outer frame structure 120 is separated from the semiconductor chip 122. Here, the pressure within the first spring 121 is controlled via an air inlet on the fixed end 124 of the first spring 121, such that in the shown second position, the air pressure within the helical spring of the first spring 121 is less than the ambient air pressure. Accordingly, the first spring 121 is pneumatically moved from the first position to the second position, and vice versa. For this purpose, the semiconductor chip 122 and the surrounding frame 120 are structured, in particular, from the wafer such that the air inlet for the first spring 124 is arranged on the first side of the wafer, particularly on the upper side of the outer frame structure, and the air inlet for the second spring (not shown) is arranged on the second side of the wafer opposite to the first side, particularly on the lower side of the wafer. Especially when gripping the outer frame structure 120, a tool not shown here, especially a vacuum clamp, controls the pressure inside the first spring 121, or generates negative pressure inside the first spring 121 when in action.

[0030] Figure 4Two first springs 132 and 133 are shown in a first position for connecting the outer frame structure 130 to the semiconductor chip 131. Here, the two first springs 132 and 133 are arranged on the same side of the semiconductor chip 131. In the first position, the free ends 138 and 139 of the first springs 132 and 133 are arranged in first grooves 136 and 137 of the semiconductor chip 131 corresponding to the respective first springs 132 and 133. In the illustrated embodiment, the first springs 132 and 133 are structured from the wafer such that they have opposing turns as helical springs. Therefore, a fixed connection between the outer frame 130 and the semiconductor chip 131 is achieved.

Claims

1. Method for manufacturing a semiconductor component, in particular with a microstructure, wherein, The method includes the following steps: - Produce (30) semiconductor chips (99, 114, 122, 131), said semiconductor chips having four sides (104a, 104b, 104c, 104d) of said semiconductor chips (99, 114, 122, 131) and having an outer frame structure (105, 116, 120, 130), particularly an L-shaped outer frame structure, said four sides being arranged perpendicular to the main extending plane of said semiconductor chips (99, 114, 122, 131), said outer frame structure surrounding two adjacent sides of said four sides (104a, 104b, 104c, 104d), said outer frame structure being connected to said semiconductor chips (99, 114, 122, 131) by means of at least three first springs (102a, 102b, 102c, 121, 132, 133), and - Using tools, especially vacuum jigs, acting on the outer frame structures (105, 116, 120, 130) of the semiconductor chips (99, 114, 122, 131), the semiconductor chips (99, 114, 122, 131) are moved (40) to the next process step, and - Remove the outer frame structure (105, 116, 120, 130) and the three first springs (102a, 102b, 102c, 121, 132, 133) from the semiconductor chip (99, 114, 122, 131) (70, 111).

2. The method according to claim 1, characterized in that, The at least three first springs (102a, 102b, 102c, 121, 132, 133) are constructed as helical tube springs, and in particular as helical Button tubes.

3. The method according to claim 1 or 2, characterized in that, The semiconductor chips (99, 114, 122, 131), together with the outer frame structure (105, 116, 120, 130) and the at least three first springs (102a, 102b, 102c, 121, 132, 133), are structured from the wafer (101), especially by means of an etching process.

4. The method according to claim 3, characterized in that, The wafer (101) is constructed as a silicon wafer.

5. The method according to claim 3 or 4, characterized in that, At least four additional second springs (100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h), especially helical springs, are structured out of the wafer (101), especially the surrounding wafer, such that the semiconductor chip (99, 114, 122, 131), together with the outer frame structure (105, 116, 120, 130) and the three first springs (102) a, 102b, 102c, 121, 132, 133) together with the wafer (101) are connected by means of the four second springs (100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h) in the corresponding third positions, especially the fastening positions, of the second springs (100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h).

6. The method according to claim 5, characterized in that, Two of the second springs (100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h) connect the two sides (104a, 104b, 104c, 104d) of the semiconductor chips (99, 114, 122, 131) to the wafer (101), and two additional second springs (100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h) connect the two sides (104a, 104b, 104c, 104d) of the outer frame structure (105, 116, 120, 130) to the wafer. (101) Connection, wherein the tool, in particular the vacuum fixture, then acts on the outer frame structure (105, 116, 120, 130) to move the semiconductor chip (99, 114, 122, 131) to the next process step, and the semiconductor chip (99, 114, 122, 131) together with the outer frame structure (105, 116, 120, 130) is separated from the wafer (101) in the corresponding fourth position, in particular the separation position, of the four second springs (100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h).

7. The method according to any one of claims 1 to 6, characterized in that, The outer frame structure (105, 116, 120, 130) is connected to the semiconductor chip (99, 114, 122, 131) only by means of the at least three first springs (102a, 102b, 102c, 121, 132, 133).

8. The method according to any one of claims 1 to 7, characterized in that, The at least three first springs (102a, 102b, 102c, 121, 132, 133) are structured out of the wafer (101) such that the fixed end (124) of each of the three first springs (102a, 102b, 102c, 121, 132, 133) is connected to the outer frame structure (105, 116, 120, 130).

9. The method according to any one of claims 1 to 8, characterized in that, At least in the first position, particularly the fastened position, of the three first springs (102a, 102b, 102c, 121, 132, 133), the free ends (107a, 125, 138, 139) of each of the three first springs (102a, 102b, 102c, 121, 132, 133) are respectively arranged in the first grooves (108a, 126, 136, 137) of the semiconductor chip (99, 114, 122, 131), the first grooves being associated with the corresponding first spring (102a, 102b, 102c, 121, 132, 133).

10. The method according to claim 9, characterized in that, The free ends (102a, 102b, 102c, 121, 132, 133) of the three first springs (102a, 102b, 102c, 121, 132, 133) are structured from the wafer (101) such that the first springs have structures, in particular hook-shaped structures, on the free ends (107a, 125, 138, 139), which cooperate with corresponding associated first grooves (108a, 126, 136, 137) for connection, in particular coupling, with the semiconductor chips (99, 114, 122, 131).

11. The method according to any one of claims 1 to 10, characterized in that, The outer frame structure (105, 116, 120, 130) and the three first springs (102a, 102b, 102c, 121, 132, 133) are separated from the semiconductor chip (99, 114, 122, 131) in the second position, especially the separated position, of the three first springs (102a, 102b, 102c, 121, 132, 133). In the second position, the three first springs (102a, 102b, 102c, 121, 132, 133) are arranged in the second groove (112a, 128) of the outer frame structure (105, 116, 120, 130), and the second groove is matched with the corresponding first spring (102a, 102b, 102c, 121, 132, 133).

12. The method according to any one of claims 1 to 11, characterized in that, Thus, by controlling the air inlet at the fixed end (124) of the respective first spring (102a, 102b, 102c, 121, 132, 133) and / or second spring (100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h), especially the helical tube spring, the pressure within the first spring (102a, 102b, 102c, 121, 132, 133) and / or second spring (100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h) is controlled, so that the pressure within the first spring (102a, 102b, 102c, 121, 132, 133) and / or second spring (100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h) is controlled, such that the pressure within the first spring (102a, 102b, 102c, 121, 132, 13 ... In the first position of the first spring (102a, 102b, 102c, 121, 132, 133) and / or in the third position of the second spring (100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h), the ambient air pressure corresponds to the air pressure inside the spiral spring, and in the second position of the first spring (102a, 102b, 102c, 121, 132, 133) and / or in the fourth position of the second spring (100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h), the air pressure inside the spiral spring is less than the ambient air pressure.

13. The method according to claim 12, characterized in that, The semiconductor chips (99, 114, 122, 131) and the outer frame structures (105, 116, 120, 130) are structured out of the wafer (101) such that the air inlets for the first springs (102a, 102b, 102c, 121, 132, 133) are arranged on the first side of the wafer (101), particularly on the upper side of the outer frame structures (105, 116, 120, 130), and the air inlets for the second springs (100a, 100b, 100c, 100d, 100e, 100c) are arranged on the upper side of the outer frame structures (105, 116, 120, 130), respectively. The air inlets of 0f, 100g, 100h are arranged on the second side of the wafer (101) opposite to the first side of the wafer (101), especially on the lower side of the wafer (101), and when gripping the outer frame structure (105, 116, 120, 130), the tool, especially the vacuum clamp, controls the pressure in the first spring (102a, 102b, 102c, 121, 132, 133), especially generating negative pressure in the first spring (102a, 102b, 102c, 121, 132, 133).

14. The method according to any one of claims 1 to 13, characterized in that, Using the aforementioned tool, the semiconductor chips (99, 114, 122, 131) are moved to the substrate (109) and subsequently connected to the substrate (109). After the resulting outer frame structure (105, 116, 120, 130) and the three first springs (102a, 102b, 102c, 121, 132, 133) are removed from the semiconductor chips (99, 114, 122, 131) (70, 111), another semiconductor chip (99, 114, 122, 131) is arranged on the substrate (109), especially directly next to the semiconductor chips (99, 122, 131), using the aforementioned tool. This other semiconductor chip is particularly identical to the semiconductor chips (99, 114, 122, 131).

15. A micromirror assembly (117) manufactured by means of any one of claims 1 to 14, the micromirror assembly having a plurality of single mirror elements that can be manipulated independently of each other, the single mirror elements being arranged in a field, in particular an array, and being movable respectively via an actuating device, in particular an actuator electrode, and each single mirror element having a reflective surface.

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